TWM262970U - Heat-dissipation assembly - Google Patents

Heat-dissipation assembly Download PDF

Info

Publication number
TWM262970U
TWM262970U TW93213351U TW93213351U TWM262970U TW M262970 U TWM262970 U TW M262970U TW 93213351 U TW93213351 U TW 93213351U TW 93213351 U TW93213351 U TW 93213351U TW M262970 U TWM262970 U TW M262970U
Authority
TW
Taiwan
Prior art keywords
fixing
heat sink
hole
circuit board
screw
Prior art date
Application number
TW93213351U
Other languages
Chinese (zh)
Inventor
Jie Jang
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Priority to TW93213351U priority Critical patent/TWM262970U/en
Publication of TWM262970U publication Critical patent/TWM262970U/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

M262970 八、新型說明: 【新型所屬之技術領域】 本創作是關於一種散熱裝置組合,特別是指一種能將 散熱器牢固地裝設到電路板,無需破壞散熱器的散熱鰭片 且通用性較好的散熱裝置組合。 【先前技術】 隨著積體電路朝密集化、複雜化方向發展,其電子元 件產生的熱量也隨之劇增,為此通常會在電子元件頂面裝 設一散熱裝置來協助散熱。 常用的散熱裝置組合中散熱器的鎖固方法如美國專利 第6,538,889號及第6,374,906號所示,這兩種散熱器都 是在散熱器基座的四角各開設一裝配孔,並在該裝配孔内 裝設一鎖固裝置,再利用該鎖固裝置將該散熱器鎖固到一 電路板的鎖固孔。然而採用這種方法要在散熱器基座上開 設通孔,需要破壞散熱器通孔周圍的散熱鰭片,並會擾亂 散熱氣流的流動而導致散熱效率下降。另一方面,採用這 種鎖固方法在鎖固散熱器時也會遇到基座上方安裝的散熱 風扇干擾對鎖固裝置進行鎖固操作及散熱器的基座形狀無 法對應電路板的鎖固孔開設裝配孔等諸多困擾。 由此可見,現有的散熱裝置組合在實際使用中仍存在 缺陷,有待於改進。 緣是,本創作人有感上述缺失之可改善,乃特潛心研 究並配合學理之運用,終於提出一種設計合理且有效改善 上述缺失之本創作。 M262970 【新型内容】 因此,本㈣的主要目的在於提供—種散熱裝置組合 存ίϊΓ散熱器牢固地裝設到電路板,無需破壞散熱器的 散熱鰭片且通用性較好。 為達到上述目的,本創作採用如下的技術方案:一種 裝設在-電路板並與一電子元件貼接的散熱裝置組合,包 括-散熱器及兩固定裝置,該散熱器包括一基座及由該基 座延伸而㈣若干散熱鰭片,該散熱絲座底面兩側各二 有-固定部,每一固定部上設有至少一螺孔;每一固定參 置包括-固定底板及兩鎖固裝置,該固定底板包括一本體 及由該本體兩端彎折延伸而出的兩_臂,該本體上對應 於散熱器固定部的螺孔設有兩固定孔,並借助兩螺絲穿過 ,固定孔並螺鎖在該散熱器的螺孔内從而將該固定底板固 定到散熱ϋ基座底面,該兩㈣f末端均設有—裝配孔,· 該鎖固裝置包括-穿設在該固定底板裝配孔内的螺检、一 彈性件及-擔止環,該螺栓包括位於固定底板一側的一擰 固邛以及位於固定底板另一侧的一凹槽及一鎖固部,該彈 性件套設在螺栓上並限位在擰固部與固定底板之間,該擋 止環裝設到螺栓的凹槽内從而防止螺栓脫出該裝配孔,其 中邊鎖固部的外表面設有外螺紋,該鎖固部的外螺紋可以 與一電路板上的螺孔相配合從而將該散熱器鎖固到該電路 板,並使散熱器的基座底面與電子元件頂面彈性貼接。 本創作的優點在於:只需在散熱器基座底面鑽設四螺 孔’再將兩固定底板及鎖固裝置用螺絲固定到散熱器基座 M262970 底面的螺孔’再用該鎖«置將散熱n鎖關電路板上 這種鎖固方式不僅固持牢固,無需破壞散熱器的散熱韓片 ,並且能夠廣泛應用於各種形式的散熱器,通用性較好。 為使旎更進一步瞭解本創作之特徵及技術内容,請來 閱町有關本創作之詳細說明與附圖,然而所附圖式^提 i、參考與說明用,並非用來對本創作加以限制者。 【實施方式】 芩閱第一圖至第四圖,本創作散熱裝置組合可以裝設 到一電路板8並與一電子元件9的頂面相貼接,為該電子元 件9提供散熱從而保證其能穩定工作,其主要包括一散熱器 1、兩固定裝置2、一風扇固定框3及一散熱風扇4。 該散熱器1包括一基座n及由該基座u延伸而出的若 干散熱鰭片12,該散熱器1的基座η底面兩側各設有一固定 部111,每一固定部U1上設有兩螺孔lm。該散熱器丨約呈 方形,其四角各設有一缺口 13。該散熱器1兩側的散熱鰭片 12的上部還各設有兩螺孔121。 母固疋I置2包括一固定底板21及兩鎖固裝置22。該 固定底板21約呈C字形,其包括一本體211及由該本體211 兩端彎折延伸而出的兩固持臂212。其中該本體211上對應 散熱器1基座11底部的螺孔lln設有兩固定孔2111,借助於 一螺絲5穿過該固定孔2111並螺鎖在該散熱器1底部的螺孔 U11從而將該固定底板21固定到散熱器1基座丨丨的底面;該 兩固持臂212末端均設有一裝配孔2121。 每一鎖固裝置22包括一穿設在該固定底板21裝配孔 M262970 2121内的螺栓221、一彈性件222及一擋止環223。該螺栓μ】 包括位於固定底板21 —侧的一擰固部2211以及位於固定底 板21另一側的一凹槽2212及一鎖固部2213。該彈性件222 疋一螺旋彈黃,其可以經由該螺栓221的鎖固部2213穿入套 設到該螺栓221。該擋止環223是一環形薄片,其外徑比該 固定底板21的裝配孔2121的内徑略大,該擋止環223中央設 有一容置孔2231,而其周沿則設有一缺口 2232。該彈性件 222套設在螺栓221上並限位在擰固部22Π與固定底板21之 間,從而使該固定底板21及散熱器丨與該螺栓221成一彈性 連接關係;該擋止環223是卡設到該螺栓221的凹槽2212内 從而防止該螺栓221從該固定底板21的裝配孔2121内脫 出。該螺栓221鎖固部2213的外表面設有與電路板8的螺孔 81相配合的外螺紋,從而可以將該固定裝置2及該散熱器工 一體裝設到電路板8,並使該散熱器丨的基座u的底面彈性 貼接到電子元件9頂面。 该風扇固定框3固定在該散熱器1頂部,其在偏離四角 的適當位置處各設有一螺孔31。該風扇固定框3的兩侧還各 向下彎折形成一折邊32,每一折邊32上設有兩通孔321,借 助於螺絲6穿過該通孔321並螺鎖在散熱器1兩側的螺孔121 中即可將該風扇固定框3固定到該散熱器1。 該散熱風扇4是一軸流風扇,它可以加強氣流流動來提 高散熱器1的散熱效率。該散熱風扇4的四角各設有一鎖固 孔43,借助於螺絲7穿過該鎖固孔43並螺鎖在風扇固定框3 上的螺孔31内從而將散熱風扇4鎖固到風扇固定框3。 M262970 本貝施方式是在該電路板8上開設四螺孔81,並與該螺 栓2 21鎖固部2 213的外螺紋螺合從而將散熱器^裝設到電路 板8’亚使该散熱器〗的基座的底面彈性雜到電子元件9 頂面,當然,由於現在的散熱器質量不斷增大,一般電路 板的強度無法承受其較大的質量,所以也可以進一步在节 電路板8背面裝設—背板(圖未示出),而在該背板上設四〆 螺孔(圖未示出)’並在電路板8上對應開設四通孔(圖未 示出),使螺栓22!的鎖固部2213可以穿過該電路板δ上的通 孔並螺^在背板的螺孔内從而將散熱器1固定到電路板δ。 另外’运可以在螺栓221的鎖固部如的底端鑽設内螺紋 圖未不出)’在該電路板8上對應開設四通孔(圖未示 出)’並採用四具有外螺紋的固定螺检(圖未示出)從該電 =的另一侧由電路板8的通孔穿入,並與該螺細的内 螺合從而將散熱器1鎖固到電路板8。 =只需在散熱器1基座η底面鑽設四螺孔ηη,再將: 二,崎置22用螺絲5固定到散 = 面的螺孔1111,再用爷德囡壯里00 低 ο , 、,、衣置22將散熱器1鎖固到電路板1 8 这種鎖固方式不僅固接宝151 . 籍片12,並錢_泛則於破壞散熱111的散熱 較好。 乏應用於各種形式的散熱H,通用性 综上所述,本創作實為一不 極具產業上利用性、新藉性于’彳乍產品, 申,要件,麦依專利法提出申請 二】 利,以保障創作者之權益。 -W本案專 9 M262970 惟以上所述僅為本創作之較佳可行實施例,非因此即 拘限本創作之專利範圍,故舉凡運用本創作說明書及圖式 内容所為之等效結構變化,均同理皆包含於本創作之範圍 内,合予陳明。 【圖式簡單說明】 第一圖是本創作的散熱裝置組合的立體分解圖; 第二圖是本創作的散熱裝置組合的另一立體分解圖; 第三圖是本創作的散熱裝置組合的固定裝置的立體分解 圖; 第四圖是本創作的散熱裝置組合的立體組合圖。 【主要元件符號說明】 散熱器 11基座 111固定部 1111螺孔 12散熱鰭片 121螺孔 13缺口 固定裝置 21固定底板 211本體 2111固定孔 212固持臂 2121裝配孔 22鎖固裝置 221螺拴 2211擰固部 2212凹槽 2213鎖固部 222彈性件 2 2 3播止環 10 M262970 2232 缺口 32折邊 2231容置孔 3風扇固定框 31螺孔 321通孔 4散熱風扇 43鎖固孔 5螺絲 6螺絲 7螺絲 8電路板 81螺孔 9電子元件 11M262970 8. Description of the new type: [Technical field to which the new type belongs] This creation is about a heat sink assembly, especially a heat sink that can be firmly mounted to a circuit board without destroying the heat sink fins and is more versatile. Good heat sink combination. [Previous Technology] As integrated circuits develop toward denser and more complex circuits, the heat generated by their electronic components also increases dramatically. For this reason, a heat sink is usually installed on the top surface of the electronic components to assist heat dissipation. The locking method of the radiator in the commonly used heat sink combination is shown in US Patent Nos. 6,538,889 and 6,374,906. These two types of radiators each have a mounting hole at each of the four corners of the radiator base, and the mounting hole A locking device is built in, and the locking device is used to lock the heat sink to a locking hole of a circuit board. However, if this method is used to provide a through hole in the base of the radiator, the heat dissipation fins around the through hole of the radiator need to be destroyed, and the flow of the heat dissipation airflow will be disturbed, resulting in a decrease in heat dissipation efficiency. On the other hand, when this kind of locking method is used, the heat sink fan installed above the base will interfere with the locking operation of the locking device and the shape of the base of the heat sink cannot be used to lock the circuit board. There are many problems such as opening assembly holes. It can be seen that the existing heat sink assembly still has defects in practical use, and needs to be improved. The reason is that the author feels that the above-mentioned shortcomings can be improved. He has devoted himself to research and cooperated with the application of theories to finally propose a rational design and effectively improve the above-mentioned original creations. M262970 [New content] Therefore, the main purpose of this book is to provide a combination of heat sinks. The heat sink is firmly mounted to the circuit board without destroying the heat sink's fins and has good versatility. In order to achieve the above purpose, the present invention adopts the following technical solution: a heat sink combination mounted on a circuit board and attached to an electronic component, including a heat sink and two fixing devices, the heat sink includes a base and a The base is extended with a plurality of heat dissipation fins, and two sides of the bottom surface of the heat sink base are each provided with a fixing part, and each fixing part is provided with at least one screw hole; each fixing parameter includes a fixing base plate and two locking parts. Device, the fixed base plate includes a body and two arms extending from both ends of the body by bending and extending. The body is provided with two fixing holes corresponding to the screw holes of the heat sink fixing portion, and is passed through and fixed by two screws. Holes are screwed into the screw holes of the heat sink to fix the fixed base plate to the bottom surface of the heat sink base. Both ends of the two f-holes are provided with-assembly holes. · The locking device includes-pass through the fixed base plate assembly The screw inspection in the hole, an elastic member and a retaining ring. The bolt includes a screwing bolt on one side of the fixed base plate, and a groove and a locking portion on the other side of the fixed base plate. The elastic member is sleeved. On the bolt and limited to the screw The retaining ring is installed in the groove of the bolt to prevent the bolt from coming out of the mounting hole. The outer surface of the side locking portion is provided with an external thread. The screw holes on the circuit board cooperate to lock the heat sink to the circuit board, and the bottom surface of the base of the heat sink is elastically attached to the top surface of the electronic component. The advantage of this creation is that you only need to drill four screw holes on the bottom surface of the radiator base, and then fix the two fixing base plates and the locking device with screws to the screw holes on the bottom surface of the radiator base M262970. Then use the lock. This locking method on the heat-dissipating n-lock circuit board not only holds firmly, but does not need to destroy the heat-dissipating Korean sheet of the heat sink, and can be widely used in various forms of heat sinks, and has good versatility. In order to further understand the characteristics and technical contents of this creation, please read the detailed description and drawings of this creation, but the drawings are for reference, reference and explanation, and are not intended to limit this creation. . [Embodiment] Looking at the first to fourth figures, the creative heat sink assembly can be mounted on a circuit board 8 and attached to the top surface of an electronic component 9 to provide heat dissipation for the electronic component 9 to ensure its performance. Stable operation, which mainly includes a radiator 1, two fixing devices 2, a fan fixing frame 3, and a cooling fan 4. The heat sink 1 includes a base n and a plurality of heat dissipation fins 12 extending from the base u. The base n of the heat sink 1 is provided with a fixing portion 111 on both sides of the bottom surface, and each fixing portion U1 is provided with There are two screw holes lm. The heat sink is approximately square with a notch 13 at each of its four corners. Upper portions of the radiating fins 12 on both sides of the heat sink 1 are also provided with two screw holes 121. The female fixing device 2 includes a fixed bottom plate 21 and two locking devices 22. The fixed bottom plate 21 is approximately C-shaped, and includes a main body 211 and two holding arms 212 bent and extended from two ends of the main body 211. The body 211 is provided with two fixing holes 2111 corresponding to the screw holes 11n at the bottom of the base 11 of the radiator 1. The screws 5 pass through the fixing holes 2111 and are screw-locked to the screw holes U11 at the bottom of the radiator 1. The fixing bottom plate 21 is fixed to the bottom surface of the base of the radiator 1; the ends of the two holding arms 212 are provided with a mounting hole 2121. Each locking device 22 includes a bolt 221 passing through the mounting hole M262970 2121 of the fixed bottom plate 21, an elastic member 222, and a stop ring 223. The bolt μ] includes a screwing portion 2211 on one side of the fixed base plate 21, a groove 2212 and a locking portion 2213 on the other side of the fixed base plate 21. The elastic member 222 is a spiral elastic yellow, which can be threaded into the bolt 221 through the locking portion 2213 of the bolt 221. The stop ring 223 is a ring-shaped sheet with an outer diameter slightly larger than the inner diameter of the mounting hole 2121 of the fixed bottom plate 21. The stop ring 223 is provided with a receiving hole 2231 at the center and a notch 2232 at the periphery. . The elastic member 222 is sleeved on the bolt 221 and is limited between the screwing portion 22Π and the fixed base plate 21, so that the fixed base plate 21 and the radiator 丨 form an elastic connection relationship with the bolt 221; the stop ring 223 is It is snapped into the groove 2212 of the bolt 221 to prevent the bolt 221 from coming out of the mounting hole 2121 of the fixing base plate 21. The outer surface of the bolt 221 locking portion 2213 is provided with an external thread matching the screw hole 81 of the circuit board 8, so that the fixing device 2 and the heat sink can be integrally mounted to the circuit board 8 and the heat can be dissipated. The bottom surface of the base u of the device 丨 is elastically attached to the top surface of the electronic component 9. The fan fixing frame 3 is fixed on the top of the heat sink 1, and each of the fan fixing frames 3 is provided with a screw hole 31 at an appropriate position deviating from the four corners. Two sides of the fan fixing frame 3 are also bent downward to form a fold 32. Each fold 32 is provided with two through holes 321, and the screws 6 pass through the through holes 321 and are screw-locked to the radiator 1. The fan fixing frame 3 can be fixed to the heat sink 1 in the screw holes 121 on both sides. The heat dissipation fan 4 is an axial flow fan, which can enhance the flow of airflow to improve the heat dissipation efficiency of the heat sink 1. Each of the four corners of the cooling fan 4 is provided with a locking hole 43. The screws 7 pass through the locking hole 43 and are screwed into the screw holes 31 on the fan fixing frame 3 to lock the cooling fan 4 to the fan fixing frame. 3. M262970 The Benbeck method is to open four screw holes 81 in the circuit board 8 and screw them with the external threads of the bolt 2 21 locking portion 2 213 to install the heat sink ^ to the circuit board 8 'to enable the heat dissipation. The bottom surface of the base of the device is elastically mixed with the top surface of the electronic component 9. Of course, due to the increasing quality of current radiators, the strength of general circuit boards cannot withstand its larger mass, so it can also be further reduced in section 8 Back installation—back plate (not shown), and four back screw holes (not shown) are provided on the back plate, and four through holes (not shown) are correspondingly provided on the circuit board 8 so that The locking portion 2213 of the bolt 22! Can pass through the through hole on the circuit board δ and be screwed into the screw hole of the back plate to fix the heat sink 1 to the circuit board δ. In addition, 'you can drill an internal thread on the bottom of the locking part of the bolt 221, as shown in the figure.' 'Four through holes (not shown in the figure) are correspondingly provided on the circuit board 8' and four external threads are used. A fixed screw inspection (not shown in the figure) is penetrated from the other side of the electric wire through the through hole of the circuit board 8 and is screwed with the thin inner screw to lock the heat sink 1 to the circuit board 8. = Only need to drill four screw holes ηη on the bottom surface of the base η of the radiator 1, and then fix: Second, the kiln 22 is fixed to the loose with screws 5 = The screw holes 1111 on the surface, and then the low and high 00 are used. The lock 22 is used to lock the radiator 1 to the circuit board 18. This locking method is not only fixed to the treasure 151. The film 12 is also good for destroying the heat dissipation of the heat dissipation 111. Lack of application in various forms of heat dissipation H, universality. In summary, this creation is really not very industrially usable and new borrowed in the 'Jiazha products, applications, requirements, Mai Yi filed application 2] To protect the rights and interests of creators. -W This case is only 9 M262970, but the above is only a good and feasible embodiment of this creation, which does not limit the scope of the patent for this creation. Therefore, any equivalent structural changes made by using this creation manual and the contents of the drawings are equivalent. The same reason is included in the scope of this creation and shared with Chen Ming. [Brief description of the drawings] The first picture is an exploded perspective view of the heat sink assembly of the present creation; the second picture is another perspective exploded view of the heat sink assembly of the present work; the third picture is a fixed view of the heat sink assembly of the present work A three-dimensional exploded view of the device; the fourth figure is a three-dimensional combined view of the heat sink assembly of this creation. [Description of main component symbols] Radiator 11 base 111 fixing part 1111 screw hole 12 heat sink fin 121 screw hole 13 notch fixing device 21 fixing base plate 211 body 2111 fixing hole 212 holding arm 2121 mounting hole 22 locking device 221 screw 2211 Screwing part 2212 Groove 2213 Locking part 222 Elastic piece 2 2 3 Stop ring 10 M262970 2232 Notch 32 Flanging 2231 Receiving hole 3 Fan fixing frame 31 Screw hole 321 Through hole 4 Cooling fan 43 Locking hole 5 Screw 6 Screw 7 Screw 8 Circuit board 81 Screw hole 9 Electronic component 11

Claims (1)

M262970 九、申請專利範圍: 1、一種散熱裝置組合,係裝設在一電路板上並與一電 子兀件貼接,包括一散熱器及兩固定裝置,該散熱器包括 一基座及由該基座延伸而出的若干散熱鰭片,該散熱器基 座底面兩側各設有一固定部,每一固定部上設有至少一螺 孔,每一固定裝置包括一固定底板及兩鎖固裝置,該固定 底板u括本體及由该本體兩端彎、折延伸而出的兩固持 臂,该本體上對應於散熱器固定部的螺孔設有至少一固定 孔並 <曰助一螺絲穿過該固定孔並螺鎖在該散熱器的螺孔 内從而將該固定底板固定到散熱器基座底面,該兩固持臂 末端均設有-裝配孔;該鎖固裝置包括一穿設在該固定底 板裝㈣内的螺栓、一彈性件及一擋止環,該螺检包括位 於固定底板-侧的-擰固部以及位於固定底板另一侧的一 凹槽及-鎖固部,該彈性件套設在螺栓上並限位在摔固部 f固定底板之間,該擋止環裝設_栓的凹槽内從而防止 脫ί該裝配孔,該螺检的鎖固部與另一相應的鎖固結 而將該散熱器鎖固到該電路板,並使散熱器的 土座底面與電子元件頂面彈性貼接。 兮彈件如9申晴專利範圍第1項所述之散熱裝置組合,其中 "亥弹性件疋一螺旋彈簧。 4專利範圍第1項所述之散熱裝置組合,其中 該螺栓翻部的外表面上时外觀。 兮鎖1、=/請專鄉圍第3項所述之散熱裝置組合,其中 …扣、、、口構是開設在電路板上與螺栓的外螺紋相螺合的四 12 M262970 螺孔。 %申凊專利範圍第3項所述之散熱裝置組合,其中 =電路板θ面遇裝設有—背板,該鎖固結構是開設在背板 栓的外螺紋螺合的四螺孔,而在電路板上也 5又有與该螺孔對應的四通孔。 』6、如申料利範㈣㈣所述之散熱裝置組合, 該螺拴鎖固部的底端鑽設有内螺紋。 八 7、如申料利範㈣6項所述之散熱裝置組合, 該鎖固結構是四具有外敎的固定螺栓,該電路板上對應 開設有四通孔,使該固定螺栓可以從該電路板的另一侧: 電路板的通孔穿人’並與該螺栓的内職 熱器鎖固到電路板。 攸而將月丈 8、如申請專利範圍第i項所述之散熱裝置組合, 該固定底板呈C字形。 A r 9、如申請專利範圍第丨項所述之散熱裝置組合, 該擔止環是-環形薄片,其外徑比該固定底板的裳配㈣ 内徑略大’該擔止環中央設有一容置孔,而其周沿·有 -一-jfelL Γ7 η 八 ΛΙ 10、如申請專利範圍第丨項所述之散熱裝置組合,並 該散熱裝置組合進-步包括—風扇固定框及—散^風无、, 該風扇固定框是固定到該散熱器頂部的,其適當:$羽丄 有四螺孔,該散熱風扇的四角也各設有_鎖固孔,北处又 一螺絲穿過該鎖固孔並螺鎖在風扇固定框上的螺孔於 將散熱風扇鎖固到風扇固定框。 攸而 13M262970 9. Scope of patent application: 1. A heat sink assembly, which is installed on a circuit board and is attached to an electronic element. The heat sink includes a heat sink and two fixing devices. The heat sink includes a base and a heat sink. A plurality of heat dissipation fins extending from the base. Each side of the bottom surface of the heat sink base is provided with a fixing portion, and each fixing portion is provided with at least one screw hole. Each fixing device includes a fixing base plate and two locking devices. The fixing base plate includes a main body and two holding arms which are extended and bent from both ends of the main body. The main body is provided with at least one fixing hole corresponding to the screw hole of the heat sink fixing portion and < Passing through the fixing hole and screwing into the screw hole of the radiator to fix the fixing bottom plate to the bottom surface of the radiator base, both ends of the two holding arms are provided with an assembly hole; the locking device includes a penetrating hole in the The bolt, an elastic member and a stop ring in the fixed base plate assembly, the screw inspection includes a screwing portion located on the side of the fixed base plate and a groove and a locking portion on the other side of the fixed base plate. The elasticity Pieces set on bolts and The stop is located between the fixing base of the breaking part f. The stop ring is installed in the groove of the bolt to prevent the assembly hole from being lifted off. The locking part of the screw inspection is connected with another corresponding lock to fix the The radiator is locked to the circuit board, and the bottom surface of the soil seat of the radiator is elastically attached to the top surface of the electronic component. The elastic component is the heat dissipation device combination as described in item 1 of the 9 Shenqing patent scope, in which the " hai elastic component is a coil spring. 4 The heat dissipation device combination according to item 1 of the patent scope, wherein the outer surface of the bolt turning portion is external. Xi lock 1, = / Please Zhuanxiangwei, the heat dissipation device combination described in item 3, in which ... the buckle ,, and mouth structure are four 12 M262970 screw holes opened on the circuit board and screwed with the external threads of the bolt. % The heat sink combination described in the third item of the patent scope, where = the circuit board θ face is installed with a-back plate, the locking structure is four screw holes opened in the external thread of the back plate bolt, and The circuit board also has four through holes corresponding to the screw holes. 『6. According to the heat dissipation device combination described by Shenli Lifan, the bottom end of the screw locking part is drilled with internal threads. 8. According to the heat dissipation device combination described in item 6 of the application, the locking structure is four fixing bolts with an outer shell, and four through holes are correspondingly opened on the circuit board, so that the fixing bolts can be removed from the circuit board. On the other side: the through hole of the circuit board penetrates the person and is locked to the circuit board with the internal heater of the bolt. In combination with the heat-dissipating device described in item i of the patent application scope, the fixed base plate is C-shaped. A r 9. According to the heat-dissipating device combination described in item 丨 of the scope of the patent application, the retaining ring is a ring-shaped sheet with an outer diameter slightly larger than the inner diameter of the skirt of the fixed base plate. The hole is received, and the periphery of the hole has -a-jfelL Γ7 η eight ΛΙ 10, the heat sink assembly described in item 丨 of the patent application scope, and the heat sink assembly further includes-a fan fixing frame and- ^ Windless, the fan fixing frame is fixed to the top of the radiator, which is appropriate: $ 羽 丄 has four screw holes, and the four corners of the cooling fan are also provided with _ lock holes, and another screw passes through the north The locking hole and the screw hole on the fan fixing frame are used to lock the cooling fan to the fan fixing frame. Yau 13
TW93213351U 2004-08-20 2004-08-20 Heat-dissipation assembly TWM262970U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93213351U TWM262970U (en) 2004-08-20 2004-08-20 Heat-dissipation assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93213351U TWM262970U (en) 2004-08-20 2004-08-20 Heat-dissipation assembly

Publications (1)

Publication Number Publication Date
TWM262970U true TWM262970U (en) 2005-04-21

Family

ID=36122997

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93213351U TWM262970U (en) 2004-08-20 2004-08-20 Heat-dissipation assembly

Country Status (1)

Country Link
TW (1) TWM262970U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10398022B1 (en) 2018-11-23 2019-08-27 Wiwynn Corporation Adjustable fixing device for a heat dissipating component and related electronic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10398022B1 (en) 2018-11-23 2019-08-27 Wiwynn Corporation Adjustable fixing device for a heat dissipating component and related electronic apparatus

Similar Documents

Publication Publication Date Title
TWM246683U (en) Heat sink assembly
TW201024982A (en) Heat dissipation device
TWM279164U (en) Electronic device with heat-dissipating casing
TWM262970U (en) Heat-dissipation assembly
TWI599308B (en) Heat dispersing device
TWM291035U (en) Heat-dissipating device
TWM337966U (en) Flat plate heat sink
CN2649826Y (en) Radiating device
TW201010584A (en) Heat dissipation structure of expanded and laminated architecture
TWI384351B (en) Heat dissipation device
TW200526109A (en) Elastic fastening device of heat sink module
TW201005491A (en) Heat sink device and heat sinker
TWI297821B (en) Heat dissipation device
JP3098236U (en) Heat sink mounting structure for electronic circuit elements
TWM263551U (en) Heat sink device
TW202215196A (en) Heat dissipating device
TWI294074B (en) Heat dissipation device and electronic device using the same
TWM410252U (en) Combination structure of heat-dissipation device
TWM561982U (en) Heat dissipation apparatus
TW201205027A (en) Array type porous media thermal dissipation design
TW201113497A (en) Contraction shield shaped assembly rack for heat dissipation device
TWM310578U (en) Heat dissipation device with positioning device
TW200913863A (en) Heat dissipation device
TWM323639U (en) Fixing mechanism of heat dissipating device with no fan
TWM261749U (en) Heat dissipation device

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees