TWM262950U - Automatically solder-melting replacement apparatus for the chip-die module and chips on mainboard - Google Patents

Description

M262950 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is about a kind of multiple particle wafers which are welded and assembled on a board to form a wafer module. Or, especially, the defective product tin tin: [, the chip wafer holding insert group or surface sticking or solder ball wailing operation is automatically controlled by the device in order by the operator. [Previous technology] At the time of refining the composition, the isothermal source that detected that many pins of the defective wafers had melted was aligned with the circuit of the defective wafer pins. ^ Manually lost the good quality wafers. The solder was continuously recorded. The heat source, such as the hot air welding, is facing the disengagement heat source, cooling and replacing it, and continuing to hold the particle wafer manually: industry = tin to fix the returned particle wafer; however, if it is manually removed and soldered = = Not good, and must be performed by skilled technicians; furthermore, m: to maintain the quality 'relatively improve the artificially thin pin implantation of the heat and odor of the solder' and the eyesight focus on the chip micro Yes, people working in the county can easily cause operator fatigue and human negligence; what's more, it needs to be disassembled or assembled ... 30% of the defective products must be reworked, and special work (after manual replacement) The defect rate of this case is still missing in the creation of this case. It was finally revealed that f I was here, and research and improvement were still carried out in detail. After several trials, the automatic solder disassembly & B created a chip pellet module and a motherboard. Go to Chip Township and get a new device. M262950 IV. Creation Instructions (2) [New Content] The main purpose of this creation is to provide automatic solder removal and replacement of chips on the i-board and replacement of multiple chips / chip modules and multiple chips of the main particle chip. The module is placed in the same-i series. It will detect the defect and perform the operation of removing the tin wafer. Compared with the / Q tool tray, the tool can be operated one-by-one at the same time to perform the tin operation, which can improve the hot air. S and operating efficiency The second purpose of this creation is to provide automatic solder removal and replacement of a chip on a board. The chip chip and the chip chip pins to be removed from the main module are taught;镕 = when the temperature of several wafers tin and the fixed spraying distance angle, = 2 at a preset predetermined spraying tin speed to provide more accurate tin tin work]: heating and stabilization of another The purpose is to provide an automatic tin-melting removal and renewal device for the chip on the board: after: = J is finished, the tin is automatically removed at a set angle: or it is easier to align the circuit board contacts Insertion of solder ^ Liangshi particle wafer The invention is to provide an automatic tin melting and removal of a wafer chip die 4 chip on the board and a new installation 4, while holding a number of sigma wafers numerically automatic operation butt-hole placement of the circuit board joints can improve the replacement The speed and effect of good quality chip wafers = stacking or machine boards is to provide an automatic tin melting and removal and replacement device for chip teaching modules and as-chips on the motherboard, inserting or laminating particles in the crystal board holes. Hot air blowing is also performed before the chip pins: Page 6 Fourth, creation instructions (3) Tin operation, so that each particle chip pin is sure to be soldered to the circuit board to fuse the solder joints. The technical solution is: those who automatically remove and assemble and remove the components from the chip; those who have a linear guide rail structure set on the rack and the number of jigs and discs; those who have the chip module circuit across the slide rail pins of the rack group ; The heat source device that is placed on the door of the rack should be replaced, and the two pairs of holding and holding a wafer particle module and a new device on the motherboard, including: a door-type three-bracket set on the group to glide Coordinates for each hot-air spray If you want to remove the coordinate rail group, set a suction pump device bracket to accommodate each axis of the coordinate group; On the coordinate guide machine, a good product grain crystal fixture disc is placed, so that the guide mechanisms on both sides of the vertical axis-shaped wafer are set. On the traveling platform, the holding sleeve is located in an operable rack, and a standard guide mechanism is erected on the base, which is arranged on the base of the rack and a gate-type fixture set, and the base plate is fixed on the base. The coordinate axis-shaped guide rails have multiple chip module circuit boards and a pre-heat source device. Two rows of pedestals above the coordinate guide mechanism are arranged above the coordinate guide mechanism corresponding to the chip particle position of the plate. A standard axis-shaped guide module circuit board particle wafer is arranged on the type bracket, and a hot air nozzle is connected with a particle wafer to be replaced by a vacuum. The source device can be adjusted to set various values to implement a control device that is feasible for this creation. Connect the moving parts and the heat and hand automatically switch the sequence of actors. The accompanying drawings are clarified with the following description and examples for further explanation. M262950

4. Creative Instructions (4) ‘This creative department includes a frame (1), a standard guide (2), a fixture group (3), a pardon, j ,,

Two coordinate axis-shaped guide rail groups (23) are also cross-connected on the sliding table (221) of the second coordinate axis-shaped guide rail group (22), and the projection is perpendicular to the first coordinate axis-shaped guide rail group (2 1), so that the overall appearance is Three coordinate axis motion patterns were established. The base plate (3 1) of the jig set (3) is fixed on the sliding table (2 1 1) of the first coordinate axis-shaped guide rail group (2 1) of the coordinate guide mechanism (2), and a plurality of recesses ( 32) A large number of ventilation holes (33) are penetrated on the bottom surface, and the recesses (32) between the ventilation holes (33) are not provided with many convex points (34) on the bottom surface, so that the shape of a fixture plate (35) is aligned. The cavity (32) forms an air chamber (36) between the jig tray (35) and the cavity (32). A plurality of clamping grooves (3 11) are dug at predetermined positions of the edge walls of the base plate (31) and the concave wall (32) of the fixture plate (35). δHai fixture plate (3 5) digs several stepped grooves (3 5 1) corresponding to the chip module circuit board (p) to be processed (as shown in the fourth, fifth, and sixth figures), and stands A plurality of through holes (352) are penetrated on the bottom surface of each stepped groove (351), and a plurality of ventilation slots (353) are dug on the edge thereof to communicate with the space (3 7) on the bottom surface of each chip module circuit board (P), and Many temperature sensing points are embedded in the edge plate of the fixture plate (3 5). [Embodiment] Refer to the first to third pictures, M262950 IV. Creation instructions (5) (3 54), and several fixing slots ( 35 5) Hold the pre-replaced good-quality granule wafer (C); the setting groove (3 5 5) on both sides of the bottom surface corresponding to the grain wafer (c) pin (C1) is placed through a foot groove (3 5 6) A flux circulation groove (3 5 7) is dug out between each fixed groove (3 5 5), so that the flux receiving cavity (3 5 8) dug at both sides is connected, and an appropriate amount of liquid flux is injected into the flux. The flow channel (3 5 7) is attached to the bottom of the pin (C1) of each particle wafer (C) (as shown in Figures 6 and 7). The stepped grooves (3 5 1) of the jig plate (3 5) and the predetermined edge positions of the chip module circuit board (P) are dug with a plurality of extraction grooves (3 5 9). The pin (c 1) of the chip (C) in this article can be inserted and welded, and it can also be a welded specification (as shown in Figure 7). The heat source device (4) is provided with two rows of the same number of hot air nozzles (41) corresponding to the number of the chip module circuit boards (P) placed on the fixture plate (3 5), and each is connected at a predetermined angle to each other. Each of the rods (42) can be adjusted and fixed on the bracket group (43), so that the vertical span is placed above the sliding track of the first coordinate axis-shaped guide rail group (21), and the particles are positioned in the opposite direction to the wafers to be removed. (C) Pins on both sides (as shown in Figure 4). The hot air nozzles (41) are single or double parallel or multiple merged sockets connected to an outlet of a heat generator (44), and a mixed flow baffle (4 4 1) is arranged adjacent to the outlet to divide and distribute hot air. Make the connection according to a heat source controller (45) to lead the heat source or control the supply of the heat source. The holding mechanism (5) is provided with the same number of holding sleeves (5 1) corresponding to the number and position of the particle wafers (C) where the wafer module circuit board (P) is placed on the fixture plate (35). The removed wafer (C) is placed between two rows of hot air nozzles (41) of the heat source device (4). The top of the holding sleeve (5 丨) communicates with a pipe rod (5 2) and swims through a rod fixed on the sliding table (2 3 1) of the third coordinate axis-shaped guide rail group (2 3).

M262950

ίΪ! ί 3, 'Front springs ("I) and-one" sleeved on both ends of the pipe rod (52) — the top contact is stopped at a preset position in the sleeve pipe (5 3): Ring (53 1), so that the pipe rod (52) has a two-way buffering elasticity to keep it)), & each pipe rod (52) is connected via a -on-off valve (54) true Z [" (picture not allowed) And a gripping rod (55) tool is provided for manual holding of the pellet wafer (C) during operation. 4 The bottom of the gripping sleeve (5 1) corresponds to the wafer (c) to be removed or replaced. A recess (511) is dug in the shape, and the corners of the peripheral wall of the recess (511) are cut away from the material avoidance distance (5 1 2) and the inner edge of the peripheral wall is cut by a chamfer (5 丨 3) and corresponding to the chip wafer. The positioning concave hole (C2) convex setting block (514) provided on (c) can precisely fit the top of the particle wafer (c) with a small gap, and is symmetrical in elasticity on the inner surface of the cavity (511). The high-temperature sucker (515) grasps the particle wafer (C) with a holding force and an accurately fitted fine fork (as shown in Figs. 9, 10, and 11). The control device (6) connects each moving component and Heat source device (4) can be set with various values and hands Automatically switch the sequence to operate the actor. When using this creation, place the wafer module (P) on which the defective wafer (c) is detected to be defective, and place it on the same tray with the tight pressing of the defective one at the same position. (3 5), and placing the good-quality particle wafer (c) to be replaced in the fixture groove (35) setting groove (355), the fixture plates (35) can be aligned and the substrate (31) as a whole. In the alcove (32), input the bit value of the chip to be replaced in the control device (6) and set the heat source controller (4 5) to control the tin temperature of the heat generator (4 4), and adjust the After the preset height of the hot air nozzle (41) (can be adjusted manually or automatically based on the pre-measurement of the temperature sensing point (354) of the edge plate of the fixture plate (35)), the coordinate guide mechanism (2 First block

、 Creation description (7) ί :: the guide rail group (21) and the second coordinate axis-shaped guide rail group (22), so that the ΐ 钺 Ϊ (41) is directly facing each particle wafer (c) pin (C1) 镕: And (23) after the set time has elapsed, the third coordinate axis-shaped guide rail is actuated. • and (2 = ^ the holding mechanism (5) holding sleeve (5 丨) fits the chip wafer (5m% i When the micro-gap of the peripheral wall of the cavity (511) of the holding sleeve (51) and its primer chamfer 5 are accurately aligned, the material avoidance interval f U of the peripheral wall corner of the cavity (511) is fine when the particle wafer is placed. The bias offset, and the elastic setting and the front and rear springs (521), (522) of the tube rod (52), ▲ can be used to pre-set tension and a more gentle punch when the temperature rises and melts. In order to avoid damage to the chip module circuit board (P) '· After the particle wafer is indeed clamped and clamped, the Π :? standard axis-shaped guide rail group (23) is micro-lifted, and the pipe rod (52) is borrowed in both directions With the Λ and -force action ', the grain crystal shaft cymbal module circuit board (ρ) is pulled with a smooth and elastic continuous force, and the third seat can be lifted off by the linear guide group (2 3). This piece = circuit board (P ), Move the -coordinate axis soul to open two disengagement: the chip module breaks the vacuum suction and discards the defective wafer linear guide group (21) to the positioning cut (35) the defective particle wafer, and then moves and places it on the fixture plate and drops 0 ^ The good product chip wafer (C) is facing the holding sleeve (51) and the generator (44), and the% Japanese sheet hibiscus is activated by the heat source controller (45) and the heat generator stops blowing hot air to cool down. The particle wafer (C) stops operating the third seatpost axis to rise by 2f and melts. At a preset time, the glaze green-shaped guide rail group (23) is lowered. The set of holding wafers M262950 is not prepared. (8 ) '$ 吸 ^ 套 (51)' Make the good product chip wafer (c) pin (C1) corresponding to the corresponding solder joint of the crystal module circuit board (p), and align it with the elastic relaxation force in place j 'cut off The heat source causes the tin solder to cool and fix the chip pins (C1), and then cuts off the vacuum suction force to withdraw and hold it up. 'Remove each fixture plate (35) and each wafer module thereon. If you want to change another set of fixture wafers (C), perform another refit operation. This creation can be based on the position of the different wafer module particle wafers: Rule 1 Change the fixture set (3) fixtures The thermal spray (_4) of the disc (35) and the heat source device (4) and the gripping sleeve (5 1) of the grasping mechanism (5) match the position and shape of the wafer to be removed and inserted. μ Another embodiment of the holding mechanism (5a) (as shown in the twelfth figure) of this creation =, the suction holding sleeve (51a) can be adjusted and fixedly screwed to the bottom two lines of the pipe rod (52a) (52 la) (the holding sleeve (5 la) can be round, square, rectangular shape), the suction cup (515a) is directly connected to the bottom end of the pipe rod (52a). A recess (5Ua) is dug in the bottom surface of the sleeve (51a) to contain the periphery of the suction (say 51 5a) and a space (512a) is spaced; when holding the piece (c), the The sucker (515a) directly presses the granular wafer (c) in a fixed orientation and is squeezed into the shrink space (512a). The vacuum wafer is pulled to make the top surface of the granular wafer (C) fit the holding sleeve (51a). Horizontal bottom surface (as shown in Figure 13). π Zhiben created the particle wafers on the fixture plate (35), (c) the setting grooves (355), and the unlimited position and number of settings were set up in A Congkanji, and the holding mechanism (5) Hold the new particle wafer (c) at a preset position on the circuit board of the chip module; the holding set of the grasping mechanism (5) can also be printed into a printed stone eve rubber 'with a print attached to the preset position Dyes

Page 12 M262950 IV. Creative Instructions (9) --------- Chip (C) or chip module circuit extension (p. Set fixture discs (35) before and after the device. Since :: hibiscus, The creation can be installed in the hand, etc., with a fully automatic lowering mechanism (such as the mechanical king Wang Jinjin operation system). In summary, compared with the i creation, this creation can detect the same = = has the following advantages: A group of multiple wafers placed on the same substrate and the wafers are removed from the wafer; at first, compared to soldering, the subsequent soldering operation is replaced by the manual operation of the holding fan. And efficiency. /, Π 彳 彳, this k-direction production quantity 2. This creation is simultaneously performing a heat-graft operation on several wafers to make tin tin two; the control of the unplugged particle wafer pins, r begins The positions are all preset fixed = two b = uniform heating and stable blowing distance angle to provide more accurate tin soldering operators. ΠAnti-catch t 、 More 3. = Created in the scheduled recording tin for #time after complete gallium melting _Automatic 5 particle wafer action 'makes it easier for the pin of the particle wafer to be separated from the solder of the chip module circuit board. Japanese and Japanese film 4. i-Creation: At the same time, holding a number of particle wafers automatically align the chip module circuit board rate = i or stack, which can improve the speed and efficiency of changing good-quality particle wafers. The module circuit board socket is inserted before the chip chip pins, and the hot air is also blown into the tin to make sure that each chip chip pin is mated to the internal solder of the solder. None of the above is just one of the desirable embodiments of this creation. This creation can be made without prejudice to the features described in the scope of the above-mentioned patent applications and below.

M262950 IV. Creative Instructions (10) Decoration, designer with same shape, position and quantity. This creation has been made into functional samples, and it is effective. Compared with the traditional artificial ancient temple test operation, on-site review is arranged. That is to say, if you have any doubts, 'please call or send a letter to improve the effectiveness immediately. "Understand the composition of this creation It is novel, practical, and simple. Foreign publications or open publications have the same features as previous cases or articles. They are found in domestic use and have only met the requirements for new patents under the Patent Law.

Page 14 ---- M262950 Brief Description of the Drawings The first picture is the whole outside of the creation. The first picture is a front sectional view of the creation. The second picture is a side cross-sectional view of this creation. The fourth picture shows the exterior of the fixture plate. The fifth picture shows the heat source dissolution of tin in the creation === °. The sixth picture shows the granule chip replacement at first glance: 箆 七 H 系 士 4 丨 Α β η Unthinking of the Xiazhi homework. The seventh figure is another particle diagram of this creative composition \ m 乂 么 i h 6 specification sketch 0 The eighth figure is a combined sectional view of the original particle wafer. The picture is the grain crystal 创作 + 阊 after the 丄 丄 门 门 portal fantasy and pan front view is not shown in Fig. 0, and the ten picture is the side view of the nine pictures. The eleventh figure is a top sectional view of the ninth figure. The eleventh picture is a piece of this creative grasping particle. The twelfth picture is a sectional view of another embodiment of the sun-dial sucker in the Zanzi bay. The first picture is the twelfth picture. Illustration. ⑴ · (2) · (21) (22) (23) (3) · (32) (35) (35 3) (3 5 6) Frame (11) ... base coordinate guide mechanism bracket ^ axis Linear guide rail group, two coordinate axis guide rail group Second coordinate axis guide rail group (12) ... Gantry bracket fixture set alcove> combining plate •• ventilation groove "foot groove (31) · (33) · (351) ( 3 54) (357) Substrate ventilation holes • Stepped grooves (211) (221) (231) (311) (34)-(3 52) •• Temperature sensing point (3 55) •• Flow channel (3 58) • gliding table • gliding table • gliding table • gripping groove bumps • through hole L • fixed groove • receiving hole

M262950 Brief description of the drawings (3 5 9) ... Removal slot (36) ... Air chamber (37) ... Space (4) ... Heat source device (41) ... Hot air nozzle (4 2) ... Support rod (4 3) ... Bracket group (44) ... Heat generator (441) ... Mixed flow baffle (45) ... Heat source controller (5) ... Holding mechanism (51) ... Holding sleeve (511) ... Cavity (512) ... Avoidance distance (513) )-* · Chamfering of the material (5 1 4) ... Positioning block (5 1 5) ... Suction cup (52) ... Pipe rod (521) ... Front spring (522) ... Rear spring (53) ... Holding tube (531) … Spacer ring (54)… switch valve (55)… holding rod (6)… control device

Claims (1)

M262950 5. Scope of patent application-1 · A chip particle module and a motherboard i_ new device, including: Automatic tin disassembling and removal of a chip on the panel and a rack, and its base A door-type bracket is erected to accommodate each component;-Coordinate guide, its three linear guides are arranged on the base of the rack and the door-type bracket in motion: wide glaze:? Ί X ί 板 固It is set on the coordinate guide; it is set on a sliding platform of a private axis-shaped guide rail set on the base of the rack, and several alcoves are dug = one fixture plate is placed, and each fixture plate corresponds to the one to be processed: : And the circuit board excavates several stepped recesses that are aligned with each other, and several fixed grooves for pre-exchanging good quality wafers; the device, corresponding to each fixture plate of the fixture group, places the chip module and the second module. The same number of hot air nozzles are arranged so that the vertical span is placed on the fixed machine: the coordinate axis of the coordinate guide mechanism of the coordinate guide mechanism of the rabbit. The feet of the rabbit can only be adjusted. The two sides of the mechanism are connected to the coordinate guide mechanism, which is set to the rack door = ^ vertical to the rack On the sliding table of the coordinate axis-shaped guide rail set of the seat, the fixture plate of the Xuan fixture set places the particles of the chip module circuit board at 2 positions, and the same number of holding sleeve positions are set at the heat source. The 'make the holding sleeve has two-way buffering elastic retention = the vacuum system device, the operating pairing holding and release the ^ to be replaced ^ each = f set, connecting each moving component and the heat source device operable tuning machine Each value and the sequence of actions can be automatically switched by hand. ^- Page 17 M262950 V. Application for patent scope 2. The chip soldering module and the automatic melting and removal device of the chip on the motherboard as described in the first patent application scope item 1, where the substrate of the fixture group is dug A plurality of ventilation holes are respectively formed on the bottom surface of the number of recesses, and a plurality of bumps are provided on the bottom surface of the recesses between the ventilation holes. The operator who thought the jig trays were unloaded. 3. The automatic chip dissolving and retrieving and renewing device for the chip particle module and the chip on the motherboard as described in the patent application scope item 1 or 2; wherein the number of step recesses dug on each jig plate of the jig group Slot, a plurality of through holes are dug on the bottom surface, and several ventilation slots are dug on the edge of the chip module circuit board to communicate with the bottom space of the chip module circuit board and the take-out slot to speed up the heating of the chip module circuit board Rate and unload actor. 4 · The chip pellet module of the patent application scope and the automatic tin melting removal and renewing device of the chip on the motherboard as described in item 1 or 2 of the invention, wherein the edge of each jig plate of the jig set is provided with a plurality of temperature senses. The measurement point is for the person who adjusts the actual heat of the pellet chip pins to be replaced by the heat source device. 5 · The automatic dissolution and removal of tin particles of the wafer particle module and the chip on the motherboard as described in item 1 of the patent application scope, wherein the two rows of hot air nozzles of the heat source device are connected to each other at a preset angle. It is placed on a pole, each of which can be adjusted and fixed, is located on both sides of the linear guide group of the coordinate guide mechanism located on the base of the rack, and the operatively adjustable interposition is directly facing the particle chip to be replaced. Pins on both sides. 6 · The automatic chip melting removal and renewal device of the wafer particle module and the chip on the motherboard as described in the patent application scope item 1 or 5, wherein the heat source device is M262950 Each hot air nozzle is connected to a heat generator, and a mixed air stretcher is installed between the nozzles to divide the average heat. The hot air nozzle can be a single, double, and supplier controlled by a controller. 'The heat is generated' and the heat can be connected to a heat source by the plurality of combined heat generators and each hot air generator, such as the chip pellet module of the patent application scope and the automatic chip removal and replacement of the main chip. Device, wherein the gripping upper suction sleeve is connected on the top of the sliding platform of a linear guide rail group fixed to each of the brackets and connected to a pipe rod to swim through the brackets perpendicular to the base of the rack; and A front elastic I and a rear elastic top are sleeved at the two ends of the pipe rod, and a spacer ring connected at a predetermined position in the sleeve tube is pushed to stop the two-way buffering elastic retaining force. x & dry has the chip pellet module as described in item 1 or 7 of the patent application scope, and an automatic tin fusing and renewing device for the main wafer. The bottom part of each holding sleeve of the holding mechanism board is Dig 2—cavities corresponding to the shape of the wafer to be exchanged directly, so that each corner of the wall of the cavity is cut off by a material avoidance distance and ▲ ^ = a cutting edge chamfer is set on the edge, and the corresponding second chip is set on the chip wafer. The concave and convex setting block can precisely fit the top of the chip wafer with a fine gap, and the elastic sliding number of the high temperature resistant chuck is symmetrical on the inner surface of the concave cavity. The holding force and the precise clamping of the chip . '' If f, please refer to the chip particle module described in the patent scope item 1 or 7 and the automatic tin melting removal and renewing device of the chip on the motherboard, wherein each holding sleeve of the holding mechanism is provided with f 〆The on-off valve communicates with the vacuum pump device for operation, and the on-off valve communicates with a suction rod tool for the operator to move the pellet wafer during operation. M262950 V. Application for patent scope 10 · As stated in the application, please apply for the automatic melting tin removal and renewal device of the crystal moon particle module and the chip on the main board as described in item 1 or 7 of the patent scope. The suction sleeve is made into a symmetrical shape and can be adjusted and fixedly screwed to the spiral part of the part, and the suction cup is directly connected to the bottom port of the pipe rod .: xi mj edge: a recess is included to contain the periphery of the suction cup and When the interval is two === the particle wafer, the vacuum suction pulls the bow I into the particle, and is placed on the shrinking space of the recess at the bottom edge of the holding sleeve.