TWI747717B - Welding device - Google Patents

Abstract

The invention provides a welding device suitable for an electronic component. The above-mentioned soldering device includes a base, an injection unit and a heating unit. The injection unit is disposed on the base and includes a paste storage part and an injection part. The paste storage part is suitable for accommodating solder paste, and the solder paste penetrates the injection part The self-storing paste is ejected; the heating unit is movably connected to the base and includes two heating elements. When these heating elements abut against each other, a row of paste openings are formed together, and the ejection openings are located on the injection element and the electronic components.

Description

Welding device

The present invention provides a soldering device, and particularly relates to a soldering device that can control the dosage of solder paste and avoid the adhesion of solder paste.

Soldering is one of the fairly common processes in the high-precision electronics industry. Generally speaking, when soldering, the operator will align two different objects to be soldered, put the flux (such as solder) close to the position and at the same time contact and heat the flux through a heating element (such as a welding gun). After being heated and melted, the flux will quickly cool down and adhere to the objects to be welded, thereby joining the objects to be welded to each other. Although this method can introduce automated operating procedures, since the flux is easy to adhere to the heating element, it is necessary to clean the heating element after a period of operation to maintain the quality of the welding, which increases the operating time.

For this reason, some manufacturers switch to using solder paste with lasers for soldering. Operators want to apply solder paste to the parts to be soldered, and adjust the power and focal length of the laser light, so that the laser spot quickly provides a large amount of The energy melts the solder paste to join the objects to be soldered to each other. Although this method can prevent the flux from adhering to the heating element, the dosage of the solder paste is difficult to accurately control, and the energy consumed by the laser heating is considerable, and the problem of energy reflection is likely to occur when the surface of the object to be soldered is smooth.

The inventor then exhausted his mind and intensive research to develop a soldering device that can control the amount of solder paste and avoid solder paste adhesion, in order to achieve the effect of improving soldering quality and reducing soldering man-hours.

The invention provides a welding device suitable for an electronic component. The above-mentioned soldering device includes a base, an injection unit and a heating unit. The injection unit is disposed on the base and includes a paste storage part and an injection part. The paste storage part is suitable for accommodating solder paste, and the solder paste penetrates the injection part The self-storing paste is ejected; the heating unit is movably connected to the base and includes two heating elements. When these heating elements abut against each other, a row of paste openings are formed together, and the ejection openings are located on the injection element and the electronic components.

In one embodiment, each of the above heating elements includes a paste-receiving surface and a paste-collecting portion. The paste-receiving surfaces are opposite to each other, and the distance between the paste-receiving surfaces gradually decreases along the direction from the injection unit to the electronic component. Each paste collecting part is formed at one end of each heating element close to the electronic component, and when the heating elements abut against each other, the paste collecting parts jointly form a paste discharge port.

In an embodiment, each of the above heating elements further includes a guide part, each paste collecting part is formed with a through hole, and each guide part is recessed relative to each paste bearing surface and communicates with each through hole. When these heating elements are in contact with each other, the ends of the heating elements are closely attached to each other except for the guide portion and the through hole.

In one embodiment, the material of the heating element is ceramic.

In one embodiment, the above-mentioned injection unit further includes a valve body and a solder paste heating element, the valve body is connected between the paste storage element and the injection element, and the solder paste heating element is disposed on the injection element.

In one embodiment, one end of the above-mentioned paste storage member is formed with an outer tube portion and an inner tube portion, the outer tube portion is disposed on the outside of the inner tube portion, and the valve body is sleeved on the inner tube portion and is disposed on the outer tube portion and Between the inner tube.

In one embodiment, the welding device further includes a lifting platform and a lifting mechanism. The injection unit is disposed on the lifting platform, and the lifting platform is slidably installed on the base through the lifting mechanism.

In an embodiment, the welding device further includes two sliding platforms and an opening and closing mechanism. Each heating element is respectively disposed on each sliding platform, and the sliding platforms are slidably disposed on the base through the opening and closing mechanism to approach or move away from each other.

In one embodiment, the above-mentioned heating unit further includes a temperature sensor and a heat-insulating element, the temperature sensor is connected to at least one of the heating elements, and the heat-insulating element covers a part of the heating elements .

Thereby, the soldering device of the present invention can control the dosage of solder paste through the discharge port, thereby improving the quality of soldering. On the other hand, since the heating element can move relative to the base and abut each other, the solder paste is not easy to adhere to the heating element, so the time for cleaning the heating element can be saved and the welding man-hours can be reduced.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

The foregoing and other technical content, features, and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiment with reference to the drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., only refer to the directions of the attached drawings. Therefore, the directional terms used are for illustration, not for limiting the present invention. In addition, in the following embodiments, the same or similar elements will use the same or similar reference numerals.

Please refer to FIGS. 1 to 3, in which FIG. 1 is a three-dimensional schematic diagram of an embodiment of the welding device of the present invention, FIG. 2 is a schematic front view of the soldering device of FIG. 1 applied to an electronic component, and FIG. 3 is a diagram of FIG. 2 Schematic view on the left. The soldering device 1 of this embodiment is suitable for an electronic component 2 for performing a soldering process on the electronic component 2, and includes a base 100, an injection unit 200, and a heating unit 300, wherein the injection unit 200 is disposed on the base 100 , And the heating unit 300 is movably connected to the base 100.

In detail, the soldering device 1 uses the solder paste to connect the different parts of the electronic component 2 to each other by disposing the heated solder paste on the electronic component 2, wherein the injection unit 200 is used to accommodate the solder paste 3 (refer to Figure 5, Figure 6, Figure 11 and Figure 12) and the solder paste 3 is preliminarily heated and ejected. The material of the solder paste 3 is tin, for example, and the heating unit 300 heats the ejected solder paste 3 to a high temperature to melt and Flow to the surface of the electronic component 2. As shown in FIG. 2, the injection unit 200 includes a paste storage part 210 and an injection part 230, wherein the paste storage part 210 is adapted to contain the solder paste 3, and the solder paste 3 is injected from the paste storage part 210 through the injection part 230. On the other hand, the heating unit 300 includes two heating elements 310. The material of the heating element 310 is, for example, ceramic, and the heating elements 310 are symmetrically arranged with respect to the base 100. Since the solder paste 3 made of tin has a very low adhesion effect to the ceramic surface, when the solder paste 3 is ejected from the injection part 230 and contacts the surface of the heating element 310, the solder paste 3 is not easy to remain on the heating element 310, which can save cleaning The time for heating the part 310 reduces the welding man-hours and improves the welding automation procedure. In addition, when these heating elements 310 abut each other, they will form a row of paste openings O (refer to FIG. 12), and the paste discharge opening O is located on the injection element 230 and the electronic component 2, which can accurately control the solder paste 3 The dose and range of the flow to the electronic component 2, so as to achieve the effect of improving the welding quality.

On the other hand, the welding device 1 further includes a lifting platform 400 and a lifting mechanism 410, wherein the injection unit 200 is disposed on the lifting platform 400, and the lifting mechanism 410 includes a sliding rail 412, a sliding block 414, and a guide post 416, and the lifting pedestal 400 is slidably installed on the base 100 through the lifting mechanism 410. Thereby, the welding device 1 can control the lifting platform 400 to slide close to or away from the electronic component 2 through a control unit (not shown), so as to be in the standby state as shown in FIG. 3 and the welding state as shown in FIG. Switch or fine-tune the injection height of solder paste 3 during soldering operations for different electronic components 2. On the other hand, the welding device 1 also includes two sliding platforms 500 and an opening and closing mechanism 510 (only the sliding platform 500 on the left can be seen in FIG. 3), wherein each heating element 310 is respectively disposed on each sliding platform 500, and the opening and closing mechanism The closing mechanism 510 includes two sliding rails 512 and two sliding blocks 514, and the sliding platforms 500 are slidably disposed on the base 100 through the opening and closing mechanism 510 to approach or move away from each other.

Please refer to FIGS. 4 to 6, in which FIG. 4 is a schematic front view of the injection unit in FIG. 2, FIG. 5 is a schematic cross-sectional view of FIG. 4 along the X-X section, and FIG. As shown in FIG. 4, in addition to the paste storage part 210 and the injection part 230, the injection unit 200 also includes a valve body 220 and a solder paste heating part 240, wherein the valve body 220 is connected between the paste storage part 210 and the injection part 230 , And the solder paste heating element 240 is disposed on the injection element 230.

Specifically, as shown in FIG. 5, the paste storage member 210 has a tube shape and is used to contain the solder paste 3. One end of the paste storage member 210 is formed with an outer tube portion 212 and an inner tube portion 214, wherein the outer tube portion 212 is disposed in the inner tube The outer side of the part 214, and the valve body 220 is sleeved on the end of the inner tube part 214 and arranged between the outer tube part 212 and the inner tube part 214 to control the flow of the solder paste 3 from the paste storage part 210 to the injection part 230 traffic. Through this configuration, the joint portion of the valve body 220 and the paste storage member 210 can be covered by the outer tube portion 212 to avoid being exposed to the outside and colliding with other components and thus being damaged. On the other hand, a flow channel 232 is formed in the injection part 230, and the flow channel 232 has a flow channel inner diameter _DP , and the solder paste heating element 240 is sleeved on the injection part 230 and fixed relative to the injection part 230, and can be butt welded The paste 3 is initially heated to ensure the fluidity of the solder paste 3 and prevent the solder paste 3 from remaining on the inner wall of the flow channel 232.

Please refer to FIGS. 7-9, where FIG. 7 is a schematic top view of the heating unit in FIG. 2, FIG. 8 is a perspective schematic view with some elements omitted in FIG. 7, and FIG. 9 is a partial enlarged schematic view of the heating element in FIG. As shown in FIG. 7, in addition to the heating element 310, the heating unit 300 further includes two supporting seats 320, at least one temperature sensor 330 and at least one heat insulating element 340. The bearing seats 320 are respectively fixed on the sliding platforms 500 on the left and right sides, and include a cover portion 322 and a groove portion 324 formed thereon. The size of the groove portion 324 corresponds to the heating element 310, and each heating element 310 is respectively disposed on each In the groove portion 324, after the heating element 310 is disposed, the cover portion 322 is then arranged on the heating element 310, thereby fixing the heating element 310 on the sliding platform 500.

On the other hand, the temperature sensor 330 is, for example, a K-type thermocouple and has a Y-shaped crimping terminal and a circular movable part terminal. In this embodiment, the number is, for example, two, and it is connected to these heating elements. At least one heating element 310 in 310. Specifically, a through hole is formed in the central part of the heating element 310, and the temperature sensor 330 can be positioned in the through hole of the heating element 310 through the above-mentioned circular movable part terminal, and the cover part 322, The circular movable part terminal and the heating element 310 are locked together on the bottom surface of the groove 324, and the signal wire is connected to the Y-shaped crimping terminal to measure the temperature of the heating element 310. In addition, the thermal insulation member 340 is, for example, a thermal insulation paper or a thermal insulation board made of alkaline earth silicate wool (AES wool), which covers a part of these heating members 310 and can isolate the high temperature below 1300°C. Through this configuration, not only can the heat of the heating element 310 be reduced to escape into the air, but it can also prevent the operator from accidentally contacting the surface of the heating element 310 to cause personal burns.

Since the heating elements 310 on the left and right sides have the same structure, only one of the heating elements 310 will be described in the following. As shown in FIG. 9, the heating elements 310 each include a paste receiving surface 312 and a paste collecting portion 314. The paste receiving surfaces 312 are opposite to each other, and the distance between the paste receiving surfaces 312 is along the direction from the injection unit 200 to the electronic component 2. Decrease. In this embodiment, the paste-receiving surface 312 is, for example, a flat surface, but it can also be designed as a curved surface or a surface with a specific shape according to actual requirements, which is not limited by the present invention. On the other hand, each paste collecting portion 314 is formed at an end of each heating element 310 close to the electronic component 2, in this embodiment, for example, a cylindrical structure protruding from the foregoing end. When the heating elements 310 abut against each other, the paste collecting parts 314 jointly surround and form a paste discharge port O, so that the molten solder paste 3 can flow from the heating element 310 to the surface of the electronic component 2.

In order to make the solder paste 3 ejected from the injection member 230 flow smoothly to the paste collecting part 314 and flow out from the paste discharge port O, preferably, the heating element 310 further includes a guiding part 316, and each paste collecting part 314 is formed There is a through hole 314a, in which the through hole 314a has a through hole inner diameter D _H , and each guide portion 316 is recessed relative to each paste bearing surface 312 and communicates with each through hole 314a. In this embodiment, the orthographic projection of each guide portion 316 on the paste-bearing surface 312 is slightly elliptical, the major axis of each ellipse is parallel to the extension direction of the injection member 230, and each ellipse is in the minor axis direction. is greater than the maximum width of the flow channel 232 of the flow channel inside diameter D _P and the via through holes 314a of the inner diameter D _H. When the heating elements 310 abut against each other, the lower ends of the heating elements 310 are in close contact with each other except for the guide portion 316 and the through hole 314a. In other words, the paste discharge port O is formed by the combination of the through holes 314a of the heating elements 310, so the inner diameter of the paste discharge port O is equal to the through hole inner diameter D _{H of the} through hole 314a. Further, since the maximum width of the guide portion 316 in the minor axis direction is larger than the inner diameter of the flow channel of the D _P 232 and via the through holes 314a of the flow path inner diameter D _H, and the lower end of each heating element 310 in addition to the guide portion 316 and the parts other than the through hole 314a are closely attached to each other. Therefore, when the solder paste 3 is injected from the lower end of the injection part 230, the solder paste 3 will directly fall into the guide part 316. After being heated and melted by the heating part 310, The solder paste 3 will flow out in the direction of the through hole 314a, which is the discharge port O, and flow to the surface of the electronic component 2 to be soldered.

It is worth mentioning that in this embodiment, the lower edge of the paste bearing surface 312 is perpendicular to the axial direction of the through hole 314a, but in other embodiments, the lower edge of the paste bearing surface 312 can also be designed to gradually face from both sides. The direction of the through hole 314a is inclined. Through this configuration, the solder paste 3 falling outside the guide portion 316 can flow toward the through hole 314a by gravity, and the residue of the solder paste 3 on the heating element 310 can be reduced.

Please refer to FIGS. 10 to 12, where FIG. 10 is a left side schematic view of the welding device of FIG. Magnified schematic diagram of. The following will describe how the soldering device 1 of this embodiment performs soldering operations on the electronic component 2. As shown in Figure 10, when the soldering device 1 is to solder the electronic component 2, the soldering device 1 will control the lifting platform through the control unit The seat 400 slides down relative to the base 100 until the lower end of the ejection piece 230 is located below the upper edge of the guide portion 316, and the sliding platform 500 is controlled to move in a direction opposite to the opening direction R in FIG. 12, so that the two The two heating elements 310 abut each other and form a discharge port O. After that, the valve body 220 will be opened to allow the solder paste 3 in the paste storage part 210 to flow down along the flow channel 232 of the injection part 230, and at the same time, the solder paste heating part 240 will initially heat the injection part 230 to prevent the solder paste 3 from being deposited. The flow channel 232 is solidified. When the droplets of the solder paste 3 are ejected from the lower end of the injection part 230, they will fall inside the guide part 316 and flow along the guide part 316 to the discharge port O. During this flow, the solder paste 3 can be fully absorbed. The heating then reaches the optimal temperature during soldering, and the inner diameter _{DH of the} discharge port O is also set to the size of the part to be soldered, thereby controlling the dosage and range of the solder paste 3 flowing to the electronic component 2. After the solder paste 3 flows into the discharge port O, the welding device 1 will control the sliding platform 500 through the control unit to move along the opening direction R in FIG. 12, so that the two heating elements 310 are separated from each other, so that a fixed amount of solder paste 3 It evenly falls on the surface of the electronic component 2, and because of the special structure of the lower end of the heating element 310 and the selection of materials, the solder paste 3 is not easy to remain on the heating element 310, thereby eliminating the time to clean the heating element 310 and greatly reducing the scale Man-hours required for welding.

The present invention has been disclosed in preferred embodiments above, but those skilled in the art should understand that the above-mentioned embodiments are only used to describe the present invention and should not be construed as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to the above-mentioned embodiments should be included in the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.

1: Welding device 100: Base 200: Injection unit 210: Paste storage part 212: Outer tube part 214: Inner tube part 220: Valve body 230: Injection part 232: Runner 240: Solder paste heating part 300: Heating unit 310 : Heating element 312: Paste-bearing surface 314: Paste collection part 314a: Through hole 316: Guide part 320: Carrier 322: Cover part 324: Groove part 330: Temperature sensor 332: Locking member 340: Insulation part 400: Lifting stand 410: Lifting mechanism 412: Slide rail 414: Slider 416: Guide column 500: Slide platform 510: Opening and closing mechanism 512: Slide rail 514: Slider 2: Electronic component 3: Solder paste A, B: Area D _P : The inner diameter of the runner D _H : The inner diameter of the through hole O: The discharge port R: Opening direction XX, YY: Section

FIG. 1 is a three-dimensional schematic diagram of an embodiment of the welding device of the present invention. Fig. 2 is a schematic front view of the soldering device of Fig. 1 applied to an electronic component. Fig. 3 is a schematic left side view of Fig. 2. Fig. 4 is a schematic front view of the injection unit in Fig. 2. Fig. 5 is a schematic cross-sectional view of Fig. 4 along the X-X section. Fig. 6 is an enlarged schematic diagram of area A in Fig. 5. Fig. 7 is a schematic top view of the heating unit in Fig. 2. FIG. 8 is a three-dimensional schematic diagram of FIG. 7 omitting some components. Fig. 9 is a partial enlarged schematic view of the heating element in Fig. 8. Fig. 10 is a schematic left side view of the welding device of Fig. 1 when performing a welding operation. Fig. 11 is a schematic partial cross-sectional view of Fig. 10 along the Y-Y section. Fig. 12 is an enlarged schematic diagram of area B in Fig. 11.

1: Welding device

100: Pedestal

200: Injection unit

210: Paste storage parts

230: Injection

300: heating unit

310: heating element

2: Electronic components

Claims (10)

A welding device suitable for an electronic component. The welding device includes: A pedestal An injection unit disposed on the base, the injection unit including a paste storage part and an injection part, the paste storage part is suitable for accommodating solder paste, and the solder paste is injected from the paste storage part through the injection part; as well as A heating unit is movably connected to the base. The heating unit includes two heating elements. When the two heating elements abut against each other, they form a row of paste openings, and the paste discharge opening is located opposite the injection element and the electronic component . The welding device according to claim 1, wherein each of the two heating elements includes a paste-receiving surface and a paste-collecting portion, the paste-receiving surfaces are opposite to each other, and the distance between the paste-receiving surfaces is along the injection unit to The direction of the electronic component gradually decreases, and each of the paste collecting parts is formed at one end of each heating element close to the electronic element. When the two heating elements abut against each other, the paste collecting parts jointly form the paste discharge port. The welding device according to claim 2, wherein each of the two heating elements further includes a guiding part, each of the paste collecting parts is formed with a through hole, and each of the guiding parts is recessed relative to each of the paste-bearing surfaces and communicates with each The through hole, when the two heating elements abut against each other, the part of the end of each heating element except for the guiding part and the through hole is closely attached to each other. The welding device according to claim 3, wherein a flow channel is formed in the injection part, the orthographic projection of each guide portion on each paste-bearing surface is an ellipse, and the major axis direction of each ellipse is parallel to the The extension direction of the injection piece, and the maximum width of each ellipse in the minor axis direction is greater than the inner diameter of the flow channel and the inner diameter of each through hole. The welding device according to claim 1, wherein the material of the two heating elements is ceramic. The welding device according to claim 1, wherein the injection unit further includes a valve body and a solder paste heating element, the valve body is connected between the paste storage element and the injection element, and the solder paste heating element is disposed at The injection piece. The welding device according to claim 6, wherein an outer tube portion and an inner tube portion are formed at one end of the paste storage member, the outer tube portion is disposed outside the inner tube portion, and the valve body is sleeved on the inner tube On the part and arranged between the outer tube part and the inner tube part. The welding device according to claim 1, further comprising a lifting pedestal and a lifting mechanism, the injection unit is disposed on the lifting pedestal, and the lifting pedestal is slidably disposed on the base through the lifting mechanism. The welding device according to claim 1, further comprising two sliding platforms and an opening and closing mechanism, each of the heating elements is respectively arranged on each of the sliding platforms, and the two sliding platforms are slidably installed on the base through the opening and closing mechanism To get closer or away from each other. The welding device according to claim 1, wherein the heating unit further includes a temperature sensor and a heat insulating element, the temperature sensor is connected to at least one of the two heating elements, and the heat insulating element covers Part of the two heating elements.

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