M261007 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種扣合裝置，特別係一種用於將散熱器固定在發熱電 子元件上之散熱器扣合裝置。 【先前技術】 中央處理器係電腦處理資訊之神經中樞，電腦之整體性能能否提升， 很大程度上取決於中央處理器之性能，所以，高頻高速中央處理器之推出 便成爲必然之趨勢。高頻高速將導致中央處理器産生之熱量越來越多，進 步使電細内部溫度越來越高，嚴重威脅中央處理器之運行穩定性，爲確 保中央處理器能正常工作，必須及時排出其産生之熱量，爲此，業界常在 中央處理器之表面加裝一散熱裝置組合，以及時排出其産生之熱量。 通常在電路板下方設-背板，該f板具有—本體及向上延伸之凸柱， 該凸柱内具魏孔，職在電路板上設有穿孔，該背板凸柱向上穿過電路 板穿孔反扣於電路板上，相應在散熱器上設有通孔，螺釘等固定件穿過散 熱器通孔並與凸柱螺合，從而將散熱器固定於電路板上。上述散熱器之固 定方式在組裝時螺釘與凸柱不易對準，組裝極爲不便。 【新型内容】 本創作之目的在於提供一種組裝方便之散熱器扣合裝置。 本創作一種散熱器扣合裝置，將散熱器固定在位於電路板上之電子元 件上’該電路板在電子元件周圍設有複數通孔，該散熱器設有複數對應電 路板通孔之固定孔’該扣合裝置包括—背板及複數固定件，該背板包括一 主體^其上對應散熱器之固定孔向上凸伸複數個凸柱，每一凸柱頂部設 M261007 有一螺孔，每一固定件包括一與該凸柱螺孔配合之螺釘，該固定件進一步 包括-套筒，該套筒包括-收容背板凸柱之下端及―固接于散熱器固定孔 内之上端，該上端内具有與螺釘配合從而將螺釘保持於散熱器上之螺紋。 由於本創作散熱器扣合裝置具有套筒結構，可將固定件與背板凸柱準 確定位，結構簡單，組裝方便。 【實施方式】 下面結合附圖對本創作作進一步描述。 如第一圖所示，本創作散熱器扣合裝置固定散熱器10於電路板5〇上 以協助晶片60散熱，該電路板50在晶片6〇周圍四角落處各設有一通孔52。 该散熱器10包括-基座12和自該基座12向上延伸之散熱鰭丨14，該基座 12四角適當位置處對應電路板5〇之通孔52分別設有一固定孔16。 該扣合裝置包括一背板30及複數固定件。該背板3〇包括一呈十字狀 之主體部32，該主體部32四角處均向上凸伸—凸柱％，可對應穿過電路 板50之通孔52，該凸柱36頂部設有與固定件相配合之螺孔邓，凸柱％ 下端具有卡槽34，每-卡槽34均對應設置—卡環奶，從而防止背板3〇從 電路板50上脫落。另外，該背板3〇上表面疊置有緩衝墊39，用來防止該 背板30與該電路板50結合時損壞電路板5〇。 該固定件包括螺釘42、螺旋彈簧44及套筒46，該螺釘42上端直徑略 小於其末端直徑，便於螺釘42穿過散熱器1〇之固定孔16，螺釘42末端具 有與凸柱36配合之歡，該驗彈簣44也可爲其他具有雜之彈性體， 例如彈片等。 如第二圖所示，該套筒46大致呈筒狀，具有缺口 462，便於該套筒牝 M261007 插入該散熱器1〇之固定孔16内，該套筒46上端働之内表面具有與螺釘 42配合之職，該套筒46之下端直徑大於其上端之餘，可容置該背 板30之凸柱36。 如第三圖及第四圖所示，組裝時，套筒46之上端通過干涉配合之 方式自下向上插人並ϋ接於散熱H 1G之固定孔：㈣，可以理解之，該套 筒46上端460也可通過焊接等方式固接于固定孔16 0。而螺釘42穿過螺 旋彈黃44後螺鎖在該套筒* β ’從而使上述固定件初步固定在該散熱器 1〇上。背板30之凸柱36對應穿過電路板5〇之通孔52，再將錄熱器ι〇 和固定件之組合體放置在該電路板50之晶片6〇上，並使該背板3〇之凸柱 36容置於該套筒46 了端内’從而將上述固定件與背板％準確定位，最後， 借助於固定件之螺釘42 _在鱗板3G凸柱36之螺孔％内，從而使該 散熱器10 H定在該電路板5〇上，並通過螺娜菁44之彈性伽使該散熱 器10緊貼在晶片60之表面。 【圖式簡單說明】 第一圖係本創作散熱器扣合裝置及相關元件立體分解圖。 第二圖係本創作散熱器扣合裝置套筒之立體圖。 第三圖係本創作散熱器扣合裝置及相關元件立體組合圖。 第四圖係沿第三圖中IV-IV線之剖視圖。 【主要元件符號說明】 散熱器 10 基座 12 散熱鰭片 14 固定孔 16 背板 30 主體部 32 M261007 卡槽 34 凸柱 36 螺孔 38 緩衝塾 39 卡環 40 螺釘 42 螺旋彈簧 44 套筒 46 上端 460 缺口 462 電路板 50 通孔 52 電子元件 60M261007 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to a fastening device, particularly a heat sink fastening device for fixing a heat sink to a heating electronic component. [Previous technology] The central processing unit is the nerve center of the computer for processing information. Whether the overall performance of the computer can be improved depends largely on the performance of the central processing unit. Therefore, the introduction of high-frequency and high-speed central processing units has become an inevitable trend. . High frequency and high speed will lead to more and more heat generated by the central processing unit, and the progress will make the internal temperature of the finer and higher, which seriously threatens the stability of the central processing unit. In order to ensure that the central processing unit can work normally, it must be discharged in time. For this reason, the industry often installs a heat sink combination on the surface of the central processing unit to expel the generated heat in a timely manner. A back board is usually provided under the circuit board. The f board has a main body and an upwardly extending stud. The stud has a Wei hole in it. A perforation is provided on the circuit board. The back plate stud passes through the circuit board upwards. The perforation is buckled on the circuit board, and a corresponding through hole is provided on the heat sink. Fixing members such as screws pass through the through hole of the heat sink and are screwed with the protruding posts to fix the heat sink on the circuit board. The above-mentioned fixing method of the heat sink is difficult to align the screws and the posts during assembly, which is extremely inconvenient to assemble. [New content] The purpose of this creation is to provide a heat sink fastening device that is easy to assemble. This invention creates a heat sink fastening device that fixes a heat sink on an electronic component located on a circuit board. The circuit board is provided with a plurality of through holes around the electronic components, and the heat sink is provided with a plurality of fixing holes corresponding to the through holes of the circuit board. 'The fastening device includes a back plate and a plurality of fixing members. The back plate includes a main body ^ a plurality of protruding posts protruding upward from the fixing holes corresponding to the heat sink, each of which is provided with a screw hole at the top of M261007, each The fixing member includes a screw that cooperates with the screw hole of the convex column. The fixing member further includes a sleeve. The sleeve includes a lower end of the convex column of the receiving plate and an upper end fixed to the inside of the fixing hole of the radiator. Inside, there is a thread that cooperates with the screw to keep the screw on the radiator. Since the creative heat sink fastening device has a sleeve structure, the fixing member can be accurately positioned with the back plate convex post, the structure is simple, and the assembly is convenient. [Embodiment] The following further describes this creation with reference to the accompanying drawings. As shown in the first figure, the heat sink fastening device of the present invention fixes the heat sink 10 on the circuit board 50 to assist the heat dissipation of the chip 60. The circuit board 50 is provided with through holes 52 at four corners around the chip 60. The heat sink 10 includes a base 12 and heat dissipation fins 14 extending upwardly from the base 12. A fixing hole 16 is provided at each of the four corners of the base 12 at appropriate positions corresponding to the through holes 52 of the circuit board 50. The fastening device includes a back plate 30 and a plurality of fixing members. The back plate 30 includes a cross-shaped main body portion 32, and the four corners of the main body portion 32 project upwardly—the pillars can correspond to the through holes 52 passing through the circuit board 50. The tops of the pillars 36 are provided with The screw hole Deng of the fixing member is matched with a snap slot 34 at the lower end of the convex column, and each snap slot 34 is correspondingly provided with a snap ring milk, thereby preventing the back plate 30 from falling off the circuit board 50. In addition, a buffer pad 39 is stacked on the upper surface of the back plate 30 to prevent the circuit board 50 from being damaged when the back plate 30 is combined with the circuit board 50. The fixing member includes a screw 42, a coil spring 44, and a sleeve 46. The diameter of the upper end of the screw 42 is slightly smaller than the diameter of the end of the screw 42 so that the screw 42 can pass through the fixing hole 16 of the heat sink 10. Huan, the bomb tester 44 may also be other elastomers, such as shrapnel. As shown in the second figure, the sleeve 46 is substantially cylindrical and has a notch 462, so that the sleeve 261M261007 can be inserted into the fixing hole 16 of the heat sink 10, and the inner surface of the upper end 働 of the sleeve 46 is provided with a screw. The diameter of the lower end of the sleeve 46 is larger than that of the upper end of the sleeve 46, and the protrusion 36 of the back plate 30 can be accommodated. As shown in the third and fourth figures, when assembling, the upper end of the sleeve 46 is inserted from the bottom up by means of interference fit and is connected to the fixing hole of the heat dissipation H 1G: ㈣, it can be understood that the sleeve 46 The upper end 460 may also be fixed to the fixing hole 160 by welding or the like. The screw 42 passes through the screw spring yellow 44 and is screwed to the sleeve * β ′, so that the above-mentioned fixing member is initially fixed on the heat sink 10. The post 36 of the back plate 30 corresponds to the through hole 52 passing through the circuit board 50, and then the combination of the heat recorder ι0 and the fixing member is placed on the wafer 60 of the circuit board 50, and the back plate 3 The boss 36 of 〇 is housed in the end of the sleeve 46, so as to accurately position the fixing member and the back plate%. Finally, with the screw 42 of the fixing member _ within the screw hole% of the scale plate 3G boss 36 Therefore, the heat sink 10 H is fixed on the circuit board 50, and the heat sink 10 is closely adhered to the surface of the wafer 60 by the elastic gamma of the Spiral Na 44. [Schematic description] The first picture is a three-dimensional exploded view of the radiator fastening device and related components of the original creation. The second figure is a perspective view of the sleeve of the radiator fastening device of the original creation. The third picture is a three-dimensional combined view of the original heat sink fastening device and related components. The fourth figure is a sectional view taken along the line IV-IV in the third figure. [Description of main component symbols] Radiator 10 Base 12 Radiating fins 14 Fixing holes 16 Back plate 30 Body portion 32 M261007 Card slot 34 Boss 36 Screw hole 38 Cushion 塾 39 Retaining ring 40 Screw 42 Coil spring 44 Sleeve 46 Upper end 460 Notch 462 Circuit board 50 Through hole 52 Electronic component 60
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