JP4520948B2 - Fixing mechanism - Google Patents

Description

  The present invention relates to a fixing mechanism that fixes a substrate on which electronic components or the like are mounted to a housing of an electronic device or the like.

  Units such as power supply units and logic units mounted on electronic devices or packages such as I / O cards can be attached or removed even when the device is in operation. ing. As a technique for realizing this, when general screw fixing is adopted, a tool is required and there is a risk of short-circuiting in the energized portion due to screw dropping. In addition, fixing with a jig requires attachment or management of the jig to the apparatus. Therefore, a fixing mechanism for units or packages that does not require any screws, tools, and jigs is desired.

  In Patent Document 1, as a lock mechanism for fixing a substrate such as a PCI card to a housing of a personal computer without using a tool, a base plate that is directly joined to the housing, and a metal fitting for attaching the substrate to the housing There is described a lock mechanism comprising a stopper plate that presses with a coil spring so as not to float up, and a lock plate that holds the stopper plate in a pressing position.

JP 2003-318575 A

  The lock mechanism described in Patent Document 1 is a mechanism that can fix a board to a housing without using a tool, but the number of parts used is large, such as a base plate, a stopper plate, a coil spring, and a lock plate. Become high. In addition, the operation until fixing is required twice or more, and the operation is complicated.

  An object of the present invention is to provide a board fixing mechanism with a small number of parts and easy operation.

In order to achieve the above object, in the fixing mechanism for fixing the board on which the electronic component of the present invention is mounted to the fixing part of the casing of the electronic device through the metal fitting attached to the board,
Provide at least two cylindrical struts in the fixed part of the housing,
It is made of a resin material having toughness and elasticity, and has a central portion having a thin portion, a fixing portion on both sides of the central portion, a circular hole on one side of the fixing portion, and a long hole having a constricted portion on the other side. A fixing mechanism component having a cylindrical strut by fitting the circular hole and the elongated hole and the cylindrical strut,
Refracting the thin-walled portion in a direction in which the fixing portion deviates from a position where the metal fitting of the substrate of the fixing portion of the housing is placed;
In a state where the metal fitting of the substrate is placed on the fixing portion of the casing, the thin portion is refracted toward the substrate and the fixing portion is moved onto the metal fitting to fix the substrate to the casing. It is characterized by doing.

  The fixing mechanism component is made of polypropylene.

  The long hole of the other fixed part is a connection between a circular hole provided on the end side and an elliptical hole provided on the center part side, and the boundary part is larger than the diameter of the cylindrical column. It is narrower.

  In the fixing mechanism component, the fixing portion having the circular hole and the fixing portion having the elongated hole are configured to have different height positions with respect to the central portion, and a plurality of the substrates are mounted on the casing. In this case, the fixing portion having the long hole of one fixing mechanism component and the fixing portion having the circular hole of the adjacent fixing mechanism component are overlapped and attached to one support column.

  According to the present invention, it is possible to provide a board fixing mechanism with a small number of parts and easy operation.

  Hereinafter, a fixing mechanism for fixing substrates such as units or packages mounted on an electronic device or the like to a housing of the electronic device or the like according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a partial perspective view showing a state in which a substrate 10 such as an I / O package is inserted into a slot (not shown) provided in a housing 20 such as an electronic device and fixed. A metal plate 11 is attached to the substrate 10, and the metal plate 11 is placed on a fixing part 22 of the housing 20 and fixed to a cylindrical column 2 erected on the fixing part 22. It is fixed with the mechanical component 1. An internal thread is cut inside the cylindrical support 2, and the fixing mechanism component 1 is prevented from being detached from the cylindrical support 2 by screwing the screw 3. FIG. 2 is a top view of a state in which the substrate 10 is fixed using one fixing mechanism component 1. FIG. 3 is a top view of the fixing mechanism component 1 in a state where the fixing of the metal fitting 11 is removed. FIG. 4 is a top view showing a state in which the fixing mechanism component 1 completely releases the fixing of the metal fitting 11 and the substrate 10 can be removed. FIG. 5 is an exploded perspective view of the fixing mechanism.

  The structure of the fixing mechanism component 1 and the mounting method to the cylindrical column 2 will be described with reference to FIGS. 1, 4 and 5. The fixing mechanism component 1 is a single component formed of a resin material such as polypropylene having toughness and elasticity, and includes a central portion 1c, fixing portions 1a and 1b at both ends thereof, and a knob 8 protruding from the vicinity of the central portion 1c. Have A thin portion 9 is formed in the central portion 1c, the fixed portion 1a is located above the central portion 1c, and the opposite fixed portion 1b is located below the central portion 1c. A circular hole 4 having a diameter larger than the diameter of the cylindrical column 2 is provided at the end of the fixed portion 1a. The fixed portion 1b is provided with a circular hole 5 having a diameter larger than the diameter of the cylindrical column 2 and an oblong hole 7 connected to the circular hole 5 and extending in the central portion direction. A constricted portion 6 having a width smaller than the diameter of the cylindrical column 2 is provided at the boundary of the circular hole 7. The short diameter of the oval hole 7 is larger than the diameter of the cylindrical support 2. For example, as shown in FIG. 4, the fixing mechanism component 1 is attached to the cylindrical column 2 by fitting the circular hole 4 of the fixing unit 1a and the circular hole 5 of the fixing unit 1b with the cylindrical column 2 and screwing them. 3 is screwed into the cylindrical support 2. Note that the mounting of the fixing mechanism component 1 to the cylindrical column 2 can be performed in the state of FIG. 2 or the state of FIG.

  Next, the operation during the operation of the fixing mechanism component 1 will be described with reference to FIG. 2, FIG. 3, and FIG. FIG. 4 shows a state in which the fixing mechanism component 1 is mounted on the cylindrical column 2 and the metal fitting 11 is not fixed. The cylindrical column 2 is contained in the circular hole 4 and the circular hole 5. In this state, when the substrate 10 is inserted into the slot of the housing 20, the metal fitting 11 is placed on the fixed portion 22, and the knob 8 is pulled toward the substrate 10, the thin portion 9 starts to bend in the direction of the substrate 10, The constricted portion 6 gets over the cylindrical support 2 and the cylindrical support 2 in the circular hole 5 enters the oblong hole 7 as shown in FIG. When the knob 8 is further pulled, the thin-walled portion 9 is refracted toward the substrate 10, the constricted portion 6 gets over the cylindrical column 2 again, and the cylindrical column 2 in the oval hole 7 is accommodated in the circular hole 5. It becomes the state of 2. This state is a state in which the fixing portions 1 a and 1 b of the fixing mechanism component 1 are moved onto the metal fitting 11 to fix the metal fitting 11.

  In order to release the fixed state of FIG. 2, an operation opposite to the above operation is performed. That is, in the state of FIG. 2, when the knob 8 is pushed to the opposite side of the substrate 10, the thin portion 9 starts to refract to the opposite side of the substrate 10, and the constricted portion 6 gets over the cylindrical column 2, The cylindrical support 2 placed in 5 enters the oval hole 7 as shown in FIG. In this state, the metal fitting 11 is unfixed, but since the knob 8 is on the upper part of the metal fitting 11, when the knob 8 is further pushed to make the board 10 removable, the thin portion 9 is opposite to the board 10. 4, the constricted portion 6 gets over the cylindrical support 2 again, and the cylindrical support 2 in the oval hole 7 is in the state shown in FIG. As a result, the metal fitting 11 can be completely fixed, and the substrate 10 can be pulled out of the slot.

  In the above embodiment, the fixed portion 1 b is provided with the circular hole 5 and the oblong hole 7 that is connected to the circular hole 5 and extends in the central portion direction, and the boundary between the circular hole 5 and the oblong hole 7 is larger than the diameter of the column 2. Although the constricted portion 6 having a small width is provided, the present invention is not limited to this, and a single long hole having a constricted portion may be provided.

  As described above, according to the above embodiment, since the fixing mechanism part is formed by a single part made of a resin material, the number of parts can be minimized, and the cost of the fixing mechanism can be reduced. . In addition, since the toughness and elasticity of the resin material can be used to fix or remove by one operation, the substrate can be easily fixed or removed.

  Next, a case where a plurality of substrates 10 are mounted on a housing 20 such as an electronic device will be described with reference to FIG. The fixing mechanism component 1A on the right side of the drawing is mounted on the cylindrical columns 2a and 2b in the same manner as in the above embodiment. That is, the circular hole 4a of the fixing mechanism component 1A and the cylindrical column 2a are fitted, the circular hole 5a and the cylindrical column 2b are fitted, and the screw 3 for preventing the removal is screwed into the cylindrical column 2a. Next, the circular hole 4b and the cylindrical column 2b are fitted so that the fixing part 1a of the second fixing mechanism part 1B adjacent to the fixing part 1b of the first fixing mechanism part 1A overlaps. The circular hole 5b of the fixing portion 1b of the second fixing mechanism component 1B is fitted into the cylindrical column 2c, and a screw 3 for preventing removal is screwed into the cylindrical columns 2b and 2c. In this way, the two fixing mechanism components 1A and 1B can be mounted adjacent to the cylindrical columns 2a, 2b, and 2c provided on the electronic device side. Further, when three or more fixing mechanism parts are to be mounted, it can be performed in the same manner as described above. The fixing of the substrate 10 by the fixing mechanism parts 1A and 1B is the same as in the above embodiment.

  Thus, even when a plurality of substrates are mounted in parallel, the fixing function can be realized without causing mutual interference between the fixing mechanism components and increasing the mounting area.

It is a fragmentary perspective view of the fixing mechanism by one Example of this invention. It is a top view which shows the state which the fixing mechanism components of FIG. 1 are fixing the metal fitting. It is a top view which shows the state which the fixing mechanism components of FIG. 1 removed the fixation of the metal fitting. It is a top view which shows the state which the fixing mechanism components of FIG. It is a disassembled perspective view of the fixing mechanism of FIG.

Explanation of symbols

1, 1A, 1B ... fixing mechanism parts,
1a, 1b ... fixed part,
1c: central part,
2, 2a, 2b, 2c ... cylindrical support,
3 ... Screw,
4, 4a, 4b ... round holes,
5, 5a, 5b ... round holes,
6 ... Constriction,
7 ... Oval hole,
8 ... Knob,
9 ... thin part,
10 ... substrate,
11 ... metal fittings,
20 ... Case,
22: Fixed part.

Claims (4)

A fixing mechanism for fixing a substrate on which an electronic component is mounted to a fixing portion of a housing of an electronic device via a metal fitting attached to the substrate,
Provide at least two cylindrical struts in the fixed part of the housing,
A long hole made of a resin material having toughness and elasticity, having a central portion having a thin wall portion, fixing portions on both sides of the central portion, a circular hole on one side of the fixing portion, and a constricted portion on the other side. A fixing mechanism component having a cylindrical hole is fitted to the circular column and the elongated hole by fitting the cylindrical column.
Refracting the thin-walled portion in a direction in which the fixing portion deviates from a position where the metal fitting of the substrate of the fixing portion of the housing is placed;
The substrate is fixed to the casing by refracting the thin portion toward the substrate and moving the fixing portion onto the bracket in a state where the bracket of the substrate is placed on the fixing portion of the casing. The fixing mechanism characterized by doing. The fixing mechanism according to claim 1, wherein the fixing mechanism component is polypropylene. The long hole of the other fixed part is a connection between a circular hole provided on the end side and an elliptical hole provided on the center part side, and the boundary part is larger than the diameter of the cylindrical column. The fixing mechanism according to claim 1, wherein the fixing mechanism is narrow. In the fixing mechanism component, the fixing portion having the circular hole and the fixing portion having the elongated hole are configured to have different height positions with respect to the central portion, and a plurality of the substrates are mounted on the casing. 2. The fixing mechanism according to claim 1, wherein a fixing portion having a long hole of one fixing mechanism component and a fixing portion having a circular hole of an adjacent fixing mechanism component are overlapped and attached to one support column.

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