TWM258417U - Package structure of chip - Google Patents

Description

M258417

4. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is about a chip packaging structure. The packaging structure of a Bau Grid Array (BGA) can be the packaging structure and shorten the signal transmission distance. [Previous technology] Generally, semiconductor chips need to be packaged to protect the chip and also provide pins that provide electrical connections. The conventional packaging process refers to a BGA package structure, as shown in the fourth figure. After the main semiconductor wafer (10) is electrically connected to a base board (20), it is packaged with a vinegar to form a package ( 30), in which several electrical input / output electrodes (101) of the chip are wired through a gold wire (202) to the base board (20) adhered to the bottom of the crystal (10), corresponding to each signal Electricity = channel. ㈣In the base board (2.), the electrical connection channels of its signals will form a ball pin (302) at the bottom of the base board (20), which can be soldered to the circuit of the circuit board to form a connection Signal path of the circuit board.

In addition, in the conventional packaging process, there is also a packaging structure that uses a small small outline package (TS0p), which uses a lead frame to connect the signal source of the chip. The frame extends out of the package body and is soldered to the circuit board, so the chip is fixed and electrically connected to the corresponding circuit in the circuit board. V [New content] "Technical problem to be solved" Page 5 M258417 IV. Creation instructions (2) Those who used the conventional chip package structure and structure to extend the channel through the lead frame have a simple structure and are too long. It is not conducive to the problem of the large area occupied by high-frequency data transmission. Furthermore, the problem caused by the formation of the signal channel through the ball foot, however, in order to form the crystal surface layer, a base layer must be formed at the bottom of the manufacturing cost or the complexity of the process area is high, which will make its cost or complex conventional chip packaging The lack of structure is the "technical means to solve the problem." About this creation is a kind of chip that is limited to several of the aforementioned related technologies and in order to achieve the above purpose, this creation is mainly in the ball foot grid array (β a 1 1 structure, The electrical connection interface layer between the ball and the ball is formed through the lead frame, and the object corresponding to the ball and the foot is formed in the package of the connection structure. ^ "It uses the conventional TSOP package to seal the outside of the agricultural package to directly form its electrical connection ^ However, because of the formation of the signal path path wheel and the distribution of its pins, the conventional BGA package structure can be used to improve the electrical connection board between the TSOP package structure and the ball pin. Compared with the lead frame, the base layer Board, and if you want to reduce the distribution of the ball foot increase. Therefore, this creation is based on the creation. The installation structure to actually solve one or the missing. Provide a A kind of chip packaging structure, the bearing surface of Grid Array (BGA) chip package is used as the perforation of the chip and by encapsulating the chip and the electrical bearing surface to achieve the setting of "Effect on the Prior Technology" Create a chip package structure, which can reach the following

Page 6 M258417, creation description (3) Function and effect: • Shorten the signal transmission path 2 due to the crystal of this creation • The packaged chip can be reduced by the crystal of this creation • The chip of this creation is sealed and passed through the package Therefore, those who are accustomed to grassroots processes are omitted. 4 · Through the crystal of this creation The purpose and function of this creation are clear at the surface of the package. The chip package structure is more suitable for the chip package structure. In the chip occupying circuit & package structure, a six-day Japanese ball-shaped foot is connected to the circuit board to simplify the chip package structure. Therefore, the chip package structure can be improved. It can pass the BGA structure through the chip shown below, which can transmit high-frequency signals. The chip passes the BGA structure, because of the area. The chip is directly carried on the perforated structure of the lead frame. Due to the package structure and the chip-made lead frame, the heat dissipation efficiency of the bare chip is exposed. It will be further described after the description. [Embodiment] The chip package structure provided by the s 丨 彳 ^ 本 ^ 彳 work is mainly in a ball-foot grid ρ row (Ball Gr 1 (i Array, BGA) chip package structure, The package body with the fixed chip and the electrical connection structure is provided with a ball foot.

Referring to the first figure, a schematic cross-sectional view of a comparative embodiment of the wafer sealing structure is shown, which is mainly a semiconductor wafer (丨) electrically connected to a lead frame (2), and then epoxy resin. The tree vinegar is packaged to form a package (3). The characteristics of each component are: The wafer (1) has a semiconductor integrated circuit, and the bottom surface has several electrodes (11), and each electrode (11) To electrically connect the leadframe

M258417 Fourth, creation instructions (4) (2). Referring to the second figure, the lead frame (2) has a plurality of pins (2 1) to match the electrodes (丨 丨) at the bottom of the chip (丨), and each pin (21) is a ## channel (Signai channel), and electrically connect the corresponding electrodes (丨 丨) through the gold wires (2 2) made of metal wires respectively, so that the electrodes (ii) in the chip (1) are output as signals. Signal transmission can be provided by being electrically connected to corresponding pins (2 1) 'in the lead frame through gold wires (22), respectively. In addition, each pin (21) of the lead frame (2) has at least one bearing surface (21a), and the bearing surface (21) forms a corresponding area. The aforementioned conductive electrode (11), and chip , LOC) The foregoing guide is exposed in the package reference first material, such as a ring structure, and its mating surface penetrates the load (31) in the formation number (21), and the solder is a solder ball and the circuit is formed according to the foregoing

The pins (21) of the wire frame (2) are matched with the gold wire (22) and formed with the pins (21) directly connected to the chip (lead 0 form. Each pin in the wire frame (2) ( 〇 One end faces the side of the lateral extension body (3), which can improve heat dissipation.

As shown in the third figure, the package body (3) is made of high molecular oxygen vinegar, etc., and covers the entire chip (丨) and each pin (21) of the lead frame (2) of the lead frame (2) signal path The bottom hole (31) corresponds to the lead surface (2 1 a) 'of each lead frame (2), so that a plurality of ball pins (3 2) can pass through the hole to each corresponding bearing surface (2 1 a) Each ball foot (3 2) has the characteristics of guiding electrical, which can be connected to the signal path of the circuit board by soldering to the circuit board. In a chip packaging structure, the chip (1) passes through its wires

Page 8 M258417 IV. Creation instructions (5) Several bearing surfaces (21a) formed in the pins (21) of the frame (2), and the corresponding bearing surfaces (2 1 a) in the seal body (3) The plurality of perforations (3 丨) are formed, so that a plurality of ball feet (32) can be implanted in each of the perforations (31), and then to the corresponding bearing surface (21a). Therefore, a shorter signal path distance is achieved, and the electrical connection structure formed between the chip (1) and each ball foot (32) is simplified. The above are only for explaining the preferred embodiment of this creation, and are not intended to be used in any form to limit the creation of this creation in the spirit of the same / the same new spirit, all those who make It should be included in the scope of protection of this creative intention. Decorate or change, still

Page M258417 Brief description of the drawings [Simplified illustration of the drawings] The drawings show specific embodiments for presenting each component described in this specification, and explain the main purpose of the creation to improve the understanding of the creation . The first figure is a schematic cross-sectional view showing an embodiment of a chip packaging structure of the present invention. The second figure is a schematic plan view showing the lead frame of the original chip package structure. The third figure is a schematic plan view showing the package structure of the original chip package. The fourth figure is a schematic cross-sectional view showing a conventional chip package structure. [Element symbol description] Chip (1) Electrode (11) Lead frame (2) Pin (21) Bearing surface (21a) Gold wire (2 2) Package (3) Perforation (3 1) Ball foot (3 2)

Page 10 M258417 Brief description of the diagram Wafer (1 〇) Electrode (101) Base board (20) Gold wire (2 0 2) Package (3 0) Ball foot (3 0 2) 11 ·!

Claims (1)

M258417 5. Scope of patent application1. A chip packaging structure, which is mainly a semiconductor chip electrically connected to a lead frame, and then packaged to form a package, and is characterized in that: the chip has a semiconductor integrated circuit and forms a number Electrodes are used to electrically connect the lead frame; the lead frame has several pins, each pin forms at least a bearing surface with a considerable area, and each pin is electrically connected to a corresponding one through a gold wire formed by a metal wire Electrodes, respectively, forming a signal channel to provide signal transmission; and the packaging system is composed of a South molecular material covering the entire chip and the lead frame, and cooperates with each lead of the lead frame to form a corresponding lead The plurality of perforations on the bearing surface of the frame pin allows a number of ball pins with guiding electrical characteristics to pass through the perforations and be soldered to each corresponding bearing surface to form a signal path that can be connected to the circuit board. 2 · If the chip package structure of the first patent application scope, wherein the lead of the lead frame is matched with the gold wire and the electrode to form a lead on chip (LOC) that is directly connected to the X pin )form. 3. The chip package structure according to item 1 of the patent application scope, wherein one end of each pin in the lead frame extends sideways and is exposed on the side of the package body, thereby improving heat dissipation. Page 12