M255652 沒、創作說明（1) 【新型所屬之技 本創作係關 一種用以防止電 蔽結構。 【先前技術】 近年來，隨 其内部電子元件 設備及電子儀器 體產生危害，因 子設備與環境相 所追求的新目標 電磁波干擾 電、發射器、暫 -個以微處理器 寬頻帶雜訊的最 於整個頻譜的雜 率的增加，這些 然而，這些高頻 玉常的運作。 對電子元件 些雜訊，但只有 問題’這些雜訊 接地、屏避與濾 好的電路設計， 者各種 之電磁 所造成 此，如 調和、 之一 0 主要來 態電源 為基礎 大產生 訊，隨 電路可 諧波應 術領域】 ::3防電磁干擾之遮蔽結構，特別係為 件党到電磁波干擾之防電磁干擾之遮 電氣電子設備的數位化、高頻化， 波干擾所產生的問題，除了對電氣 的干擾外，其電磁波亦可能對於人 何防止電磁波干擾，以使得電氣電 共存的電磁相容，目前已成為國際 自於微處理器、開關電路、靜電放 元件及電源供應器···等元件。而在 的電路板内，數位時序電路通常是 者’這裡所謂的寬頻帶即是指分佈 著快速半導體以及更快的邊緣變化 能產生高達300 MHz的諧波干擾， 予以遮蔽或濾除，以使電路板能夠 的製造而言，所有電子元件都或多或少有 當雜訊影響到系統的正常執行時才會發生 是不可能完全被去除的，但是經由適當的 波’則可將其干擾儘量降低；對於一個良 預防勝於發生問題後的電路修改，在電路 四、創作說明（2) 板的佈局即開始做好雜訊 低雜訊電子系統的首要工^的工作，是建構高可靠度、 目岫產業上雖有許多不 磁波干擾，但主要可歸納°的衣置以防止電子元件之電 磁干擾的散佈與⑺提高增電兩種不同的型 < :⑴降低電 當工程師在設計電路佈 H 干擾的免疫、能力。 以抑制電磁干擾的散佈；心寸：經由適虽的系統設計 持續發生時，就得研究不’同Π::干擾的問題仍然 體。 方式的遮蔽去包住電磁波發射 之的電磁遮』構s，」/包7知用以防止電磁干擾 而遮蔽盍20再固定於框苹1〇 电于衣置31 3卜使其免受電磁波之遮蔽住電子裝置 而此電磁遮蔽結構之梦 趣㈣定位於機板30:電夕由心或是機械手 面黏著加工技術將此框加〜 地並利用表 遮蔽蓋2〇蓋=Ϊ 之後，再將 效果。 木1〇上以達到完全遮蔽電子裝置31之 可阻=之J點在於其體積小而不佔空間，且 設計件之電磁波干擾;然而，因其框架10之 體使取料時：施力=，ΐ進行褒設時，會因其細小的主 移，甚曼阳」 易一不小心很可能會使其定位偏 至α掉件而刮傷機板，造成機板上電路之損壞。 M255652 四、創作說明（3) 【新型内容】 处以上白知技術的問題，本創作的主要目的即為提 共：種應用於電路板上以防止電子元件受到電磁波干擾的 :荖：：擾之遮蔽結構，此遮蔽結構係為-盒體的形狀， =^ $板之電子兀件上，而在此盒體對應於電子元件 使Ϊ =設2 一可供使用者掀起及閉合之上蓋板，當 以維灯！ 之維修時，可直接將上蓋板掀起， 、夕 兀而當此電子元件處於正常運作的狀況 :太則將此上蓋板關閉，以防止此電子元件受到外界元件 生之電磁波的影響，此外，，亦可防止其本身所產生之 電石、波景々響到周圍其它的電子元件。 ^由於本創作之防電磁干擾之遮蔽結構係為一件式的遮 敝=構，因此，相較於習知之電磁遮蔽結構而言，將可有 放間化電路板上電磁屏蔽所需之元件數目；且在將其組裝 於機板上時，可藉由機械手臂吸附於遮蔽結構之上蓋板的 位置’接著’將此遮蔽結構設置於電子元件之外圍處，並 利用表面黏著技術進行組裝，以將其固定於機板上。如此 來’即可增加遮蔽結構組裝於機板上的便利性。 士此外’當維修人員要進行其内部之電子元件的維修 日寸胃亦可直接將上蓋板的部份打開進行電子元件之維修， 以提升使用上的便利性。 為使對本創作的目的、構造特徵及其功能有進一步的 了解’茲配合圖示詳細說明如下： 【實施方式】M255652 No, creation instructions (1) [new technology belongs to this creation is related to a structure to prevent electrical shielding. [Previous technology] In recent years, with the damage of its internal electronic components and electronic instrument bodies, new targets that the equipment and the environment have pursued are electromagnetic waves that interfere with electricity, transmitters, and transient noise. Due to the increase in the clutter rate of the entire spectrum, these high-frequency jades often operate. There are some noises on the electronic components, but there is only a problem. These noises are grounded, shielded, and filtered. The circuit design is caused by various electromagnetics, such as reconciliation. Field of Harmonic Application of Circuits] :: 3 Anti-electromagnetic interference shielding structure, especially for the digitization and high-frequency of electrical and electronic equipment for shielding electromagnetic interference and shielding of electromagnetic interference, problems caused by wave interference, In addition to electrical interference, its electromagnetic waves may also prevent electromagnetic interference for people, so that the electromagnetic compatibility of the coexistence of electricity and electricity has become an international self-processor, switch circuit, electrostatic discharge component and power supply. · And other components. In the circuit board, the digital sequential circuit is usually the 'wide band' here refers to the distribution of fast semiconductors and faster edge changes that can generate harmonic interference up to 300 MHz, so that it can be shielded or filtered so that In terms of the ability of the circuit board to be manufactured, all electronic components are more or less only when the noise affects the normal operation of the system. It is impossible to completely remove it, but the interference can be minimized by proper waves. Reduce; For a better prevention than a circuit modification after a problem occurs, the circuit layout begins with the creation of the circuit board. (2) The layout of the board is the first job of a low-noise electronic system. It is to build a high reliability. 2. Although there are many non-magnetic interferences in the industry, they can be summarized in degrees to prevent the spread of electromagnetic interference from electronic components and ⑺ increase the power of two different types lt: ⑴ reduce electricity when engineers are designing circuits Cloth H interference immunity, ability. In order to suppress the spread of electromagnetic interference; Mindset: When appropriate system design continues to occur, it is necessary to study the problem of different ′ :: interference. The method of shielding is to cover the electromagnetic shielding of the electromagnetic wave emission. It is known to prevent electromagnetic interference and shield 盍 20, and then fix it to the frame. 10. The electricity is placed on the clothing 31. 3 to protect it from electromagnetic waves. The electronic device and the electromagnetic shielding structure of the dream fun ㈣ is located on the machine board 30: Electricity from the heart or the mechanical hand surface adhesion processing technology to add this frame to the ground and use a table cover cover 20 cover = ，, and then Will effect. The point J on the wood 10 to completely shield the electronic device 31 is that it is small in size without occupying space, and the electromagnetic wave of the design part interferes; however, when the material is taken out by the frame 10: force = When you set it up, it will be very small due to its small main movement. ”If you are not careful, it will likely cause its positioning to be off to the α drop and scratch the board, causing damage to the circuit on the board. M255652 IV. Creation Instructions (3) [New Content] This article deals with the technical problems mentioned above. The main purpose of this creation is to propose a total: a kind of circuit board to prevent electronic components from electromagnetic interference: 荖 :: disturb Shading structure, this shielding structure is the shape of a box, = ^ $ on the board's electronic elements, and the box corresponds to the electronic components so that Ϊ = set 2 for the user to lift and close the upper cover , When the dimension lamp! During maintenance, the upper cover can be lifted directly. When the electronic component is in a normal operating condition: Close the upper cover to prevent the electronic component from being affected by electromagnetic waves generated by external components. , It can also prevent the calcium carbide and wavescape generated by itself from ringing to other electronic components around. ^ Since the shielding structure for preventing electromagnetic interference in this creation is a one-piece shielding structure, compared with the conventional electromagnetic shielding structure, there will be components required for electromagnetic shielding on intervening circuit boards. Number; and when it is assembled on the board, the cover can be attached to the cover structure of the shielding structure by a robot arm, and then the shielding structure is set at the periphery of the electronic component, and assembled by surface adhesion technology To fix it on the board. In this way, the convenience of assembling the shielding structure on the board can be increased. In addition, when the maintenance personnel want to perform maintenance of the internal electronic components, the Ricci stomach can also directly open the part of the upper cover for the maintenance of the electronic components to improve the convenience of use. In order to have a better understanding of the purpose, structural features and functions of this creation ’, the detailed description with the illustration is as follows: [Embodiment]
第7頁 M255652 、創作說明（4) 請參考「第2A圖」及「 之防電磁干擾之遮蔽結構4 〇 之電子元件51受到其它電子 之電磁波影響到周圍之電子 此防電磁干擾之遮蔽結 蓋於電子元件51之外圍，藉 子元件運作時所產生之電磁 亦可壓抑住此電子元件5丨本 部’以免影響到其它電子元 尺寸需配合電子元件之大小 而在此盒體上對應於電 掀起及閉合之上蓋板41，當 行維修時，維修人員可直接 内部電子元件5 1之維修。而 4 1關起即可，以防止電子元 而此上蓋板41之製作方 可利用沖壓的製程於盒體上 折線，而當初次要掀起上蓋 一段破裂折線處，並沿著整 圍之盒體部份分離，而由於 出破裂折線而仍是連接於盒 之側邊為轉軸而將上蓋板f 而當在工廠的生產線上 40組裝於電路板50上時，可 第2 B圖」戶;t示’分別為本創作 應用於電路板5 0上以防止其上 :件之電磁波干擾或是其本身 %件的立體分解圖及組合圖。 構4 0係為一矩形之盒體形狀覆 由此金體之保護以防止其它電 波直接影響到此電子元件5 1， 身所產生的電磁波於盒體内 件之運作。而此盒體之形狀及 而設計。 子元件51之上表面處具有一可 電子元件5 1發生故障而需要進 將上蓋板4 1挑起並掀開而進行 不需使用時，只需將此上蓋板 件5 1受到電磁波之干擾。 式’睛麥考「第3圖」所示， 製作出Π字形的不連續之破裂 板4 1時，可稍微施力於其中任 個破裂折線將上蓋板4 1與其外 此上蓋板4 1之一側邊並未製作 體，因此，即可以連接於盒體 掀起或是閉合。 要將此防電磁干擾之遮蔽結構 以人工取料或是機械手臂吸取Page 7 M255652, creation instructions (4) Please refer to "Figure 2A" and "shielding structure to prevent electromagnetic interference 4" The electronic component 51 of 0 is affected by the electromagnetic waves of other electrons and affects the surrounding electrons. This shielding cover against electromagnetic interference On the periphery of the electronic component 51, the electromagnetic generated by the operation of the sub-component can also suppress this electronic component 5 丨 the headquarter ', so as not to affect the size of other electronic elements, the size of the electronic component must be matched with the size of the electronic component. And close the upper cover 41, when repairing, the maintenance personnel can directly repair the internal electronic components 51, and 41 can be closed to prevent electronic elements and the production of this upper cover 41 can be made by stamping. The process is to fold the line on the box body, and when the upper cover is broken for a period of time, and it is separated along the entire part of the box body, it is still connected to the side of the box as the shaft due to the broken fold line. Board f, and when assembled on the circuit board 50 on the production line 40 of the factory, it can be shown in Figure 2B. "T" shows that this is applied to the circuit board 50 to prevent it: electromagnetic interference or Yes % Member itself perspective exploded view, and combinations FIG. Structure 40 is a rectangular box shape covered by the gold body to prevent other radio waves from directly affecting this electronic component 51. The electromagnetic waves generated by the body operate on the inner parts of the box. And the shape and design of this box. An electronic component 51 is located on the upper surface of the sub-component 51. When the electronic component 51 fails, and the upper cover 41 needs to be lifted up and opened for use, it is only necessary to subject the upper cover 51 to electromagnetic waves. interference. As shown in the "Figure 3" of Macao's eye test, when making a Π-shaped discontinuous rupture plate 41, you can apply a slight force to one of the rupture fold lines to place the upper cover plate 4 1 and the upper cover plate 4 outside. One side of 1 has no body, so it can be connected to the box to lift or close. This shielding structure to prevent electromagnetic interference should be picked by manual or mechanical arm
M255652 創作說明（5) 盒體之上蓋板41的 處，接著，再以表 40將其固定於電路 於此防電磁干擾之 處，因此，較習知 時之方便性。 部份，並將其定位於 面黏著技術將此防電 板50上，即可完成其 遮蔽結構40可使取料 之框架10更容易取用 電子元件5 1外圍 磁干擾之遮蔽結構 組裝之過程。而由 時有較大的施力 ，而可增加其組裝 請多考「第4圖」所示，係為上蓋板41之另一實施能 樣的示意圖，此上蓋板41上額外設置有一凸出的施力部 411，以供使用者施力於此而掀起上蓋板4丨，以增加 時的方便性。 尺用M255652 Creative Instructions (5) The place above the cover plate 41 of the box body, and then it is fixed to the circuit with electromagnetic interference prevention table 40, so it is more convenient than usual. Part, and positioning it on the anti-electrostatic plate 50 by the surface-adhesion technology, the shielding structure 40 can be completed to make the frame 10 of the material easier to access the electronic components 51 1 the process of assembling the shielding structure of the magnetic interference on the periphery . Since there is a large force from time to time, and its assembly can be increased, please refer to "Figure 4". It is a schematic diagram of another embodiment of the upper cover 41. An additional one is provided on the upper cover 41 The protruding force applying portion 411 is provided for the user to apply force to lift the upper cover 4 丨 to increase convenience. Ruler
本創作之防電磁干擾之遮蔽結構40其構成的材料 熱塑性複合材料（如碳纖維、不銹鋼纖維，和塗佈鎳*為 纖維於熱，性基材等）、金屬箔片，導電編織物、金屬= 的内部遮蔽，和塗上導電塗裝的塑膠，係依據質 圍而選用。 〜用的範 以上=述者，僅為本創作其中的較佳實施例而已，、 非用來限定本創作的實施範圍；即凡依本創作申請專f 圍所作的均等變化與修飾，皆為本創作專利範圍所涵^ %The shielding structure 40 for preventing electromagnetic interference in this creation. The materials of which it is composed are thermoplastic composite materials (such as carbon fiber, stainless steel fiber, and coated with nickel * as fibers and heat, sexual substrate, etc.), metal foil, conductive braid, metal = The internal shielding of the plastic, and the plastic coated with conductive paint, are selected according to the quality. The above-mentioned range is only the preferred embodiment of this creation, and is not intended to limit the scope of implementation of this creation; that is, all equal changes and modifications made in accordance with this application application are Covered by the scope of this creation patent ^%
第9頁 M255652 圖式簡單說明 第1圖係為習知用以防止電磁干擾之的電磁遮蔽結構； 第2A圖及第2B圖係為本創作之防電磁干擾之遮蔽結構應用 於電路板之立體分解圖及組合圖； 第3圖係為上蓋板之製作方式示意圖；及 第4圖係為上蓋板之另一實施態樣的示意圖。 【圖式符號說明】 10 框架 20 遮蔽蓋 30 機板 31 電子裝置 40 防止電磁干擾之的電磁遮蔽結構 41 上蓋板 411 施力部 50 電路板 51 電子元件The M255652 diagram on page 9 is a simple illustration. The first diagram is a conventional electromagnetic shielding structure to prevent electromagnetic interference. The diagrams 2A and 2B are the three-dimensional shielding structures used to prevent the electromagnetic interference. Exploded view and combination diagram; Figure 3 is a schematic diagram of the manufacturing method of the upper cover; and Figure 4 is a schematic diagram of another embodiment of the upper cover. [Explanation of Symbols] 10 Frame 20 Cover 30 Cover 31 Electronic Device 40 Electromagnetic Shielding Structure to Prevent Electromagnetic Interference 41 Upper Cover 411 Force Part 50 Circuit Board 51 Electronic Component
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