M249377 四、創作說明（l) 【新型所屬之技術領域】 本創作係有關於一種攝影模組’特別係有關於一種具 覆晶封裝影像感測器之攝影模組。 【先前技術】 目前攝影模組之運用領域相當廣泛，如數位相機、數 位攝影機、影像電話及視訊會議等等，其係將一影像感測 半導體晶片〔其中一種常見的晶片係為互補式金屬氧化半 導體，CMOS〕封裝於光學裝置内，以感測擷取光學影像訊 號，並將光學影像訊號轉換成電子訊號傳遞至電路基板， 使光學影像訊號可加以辨識、處理或儲存。 中華民國專利公報公告第49259 3號「CCD及CMOS影像 操取模組追加一」係揭示有一種習知之影像攝影模組，如 第1圖所示，該影像攝影模組係包含有一電路基板丨〇，於 該電路基板10 於該影像感測 座30具有一取 體上方，該取 據該取景筒3 1 鏡頭座30係貼 圍，使該鏡頭 耦合晶體上方 元件20上，影 量，極易影響 之穩固性。 上結合一 元件20之 景筒31以 景筒31係 之接合部 附及封閉 座30之取 ’然而， 像感測元 該影像感 影像感測 封裝體緣 對應於該 用以旋鎖 而罩設於 於影像感 景筒31能 因該鏡頭 件2 0必須 測元件20 兀忏π〔 CMOS、CCD〕， 設有一鏡頭座30，該鏡頭 影像感測元件20之耦合晶 一鏡頭32 ’該鏡頭座3〇依 該影像感測元件2 〇，且該 測元件20之封裝體頂緣周 對應於該影像感測元件之 座3 0係結合於該影像感測 承載整個鏡頭座3〇之重 與電路基板1 〇間電性結合M249377 IV. Creation Instructions (l) [Technical Field to which the New Type belongs] This creation relates to a photographic module ', particularly to a photographic module with a flip-chip packaged image sensor. [Previous technology] At present, the application fields of photographic modules are quite extensive, such as digital cameras, digital cameras, video phones, video conferences, etc. It is an image sensing semiconductor chip [one of the common chips is complementary metal oxidation [Semiconductor, CMOS] is packaged in an optical device to detect and capture optical image signals, convert the optical image signals into electronic signals, and pass them to the circuit substrate, so that the optical image signals can be identified, processed, or stored. The Republic of China Patent Gazette Bulletin No. 49259 3 "CCD and CMOS image manipulation module add one" is a known image photography module, as shown in Figure 1, the image photography module includes a circuit board 丨〇, the circuit board 10 has a body above the image sensing base 30, which is based on the viewfinder tube 3 1 the lens base 30 is surrounded, so that the lens is coupled to the element 20 above the crystal, the amount of shadow is extremely easy Impact stability. The spectacle tube 31 combined with a component 20 is attached to the joint of the spectacle tube 31 and the closed seat 30 is taken. However, the image sensing element corresponds to the edge of the image sensing package which is used to rotate the lock. Since the image sensing tube 31 can measure the element 20 due to the lens element 20 [CMOS, CCD], a lens holder 30 is provided, and the coupling lens of the lens image sensing element 20 is a lens 32 'The lens holder 30. According to the image sensing element 20, and the top edge of the package of the sensing element 20 corresponds to the seat 30 of the image sensing element, which is combined with the weight and circuit of the image sensing bearing the entire lens holder 30. Electrical connection between substrates
第6頁 M249377 四、創作說明（2) 【新型内容】 本創作之主要目的係一 測器之攝影模組，利二、二種具覆晶封裝影像 座體與-承載板密Π空像感測器設心 測晶片覆晶接合於一透 ^ $曰曰封裝影像感測器之感 以符合現今電子元件輕薄短小之趨勢：：模厚度更薄， 依本創作之具覆晶封裝影 承載板、一覆晶封裝景^ 金汚刨哭a盗之攝衫模組包含一 載板係具有-組裝頭座體，其中讀承 該承載板之組裝表面，，：曰：裝：像感測器係結合於 ί ;;ΐ:感測晶片，該透明基板係具有-覆晶接：一 ^ ^合面係形成有一容晶穴及複數個線路，每 線路！具有一第-端及-第二端，該些線路之第-端：： 於，合晶穴’該些線路之第二端係延伸出該容晶穴，該^ 測晶片係具有一光感測面，該光感測面之周邊形成有複數 個凸，’該感測晶片係以該些凸塊覆晶接合於該透明基板· 之f晶接合面’該鏡頭座體係設於該承載板之組裝表面， 以密封該覆晶封裝影像感測器，其中該鏡頭座體係具有一 透光通道’其係對應該感測晶片之光感測面，用以擷取光 學影像訊號。 【實施方式】 參閱所附圖式，本創作將列舉以下之實施例說明^ 依本創作之一具體實施例，請參閱第2圖，一種具覆 晶封裝影像感測器之攝影模組，其係包含有一承載板 ❿ Ιϋ _ 第7頁 M249377 四、創作說明（3) 100、一覆晶封裝影像感測器200及一鏡頭座體3 00，其中 該承載板1 0 0係具有一組裝表面1 1 〇，該組裝表面11 0係形 成有一電路層111，於該電路層Π1設有複數個被動元件 120，在本實施例中，該承載板1〇〇係具有一硬質部130及 一可撓部140，該些被動元件12〇係設於該硬質部130，該 可撓部140係結合有一電連接器150，用以連接電性，該鏡 頭座體300係設於該承載板1()()之組裝表面no，較佳地， 該鏡頭座體3 00係設於該承載板1〇〇之硬質部130，以密封 該覆晶封裝影像感測器2 0 0，該鏡頭座體300係具有一透光 通道31 0 ’以供光線等光學影像訊號通過而投射至該覆晶 封裝影像感測器20 0，該鏡頭座體30 0係用以結合一鏡頭 320 ’該覆晶封裝影像感測器200係結合於該承載板1〇〇之 組裝表面110，並容置於該鏡頭座體3〇〇與該承載板1〇〇所 形成之密閉空間，即該覆晶封裝影像感測器200亦設於該 承載板100之硬質部130，在該鏡頭座體300與該承載板1〇〇 所形成之密閉空間内係可抽成真空狀態或是填充低溼度之 鈍態氣體，如氮氣或氬氣，以防止水氣之侵入而影響該覆 晶封裝影像感測器2 0 0擷取光學影像訊號，該覆晶封裝影 像感測器2 0 0係包含有一透明基板2 1 〇及一感測晶片2 2 0， 該透明基板2 1 0係為一透光玻璃，係具有一覆晶接合面2 11 及一迎光面212，該覆晶接合面211係形成有一容晶穴213 及複數個線路214，該些線路214係為一金屬層，例如氧化 銦錫〔Indium T in Oxide，ITO〕，每一線路21 4 係具有一 第一端214a及一第二端214b，該些線路214之第一端214aPage 6 M249377 IV. Creation Instructions (2) [New Content] The main purpose of this creation is a camera module of a measuring device, two or two kinds of chip mounts with flip-chip packaged image mounts and -carrying plate dense Π empty image sense. The tester is set to attach the chip to the chip. The sensor of the packaged image sensor is in line with the current trend of thin and light electronic components .: The mold thickness is thinner. 1. A flip chip package ^ The camera module of the gold stain planer includes a carrier board with an assembly head base, which reads the assembly surface of the carrier board, and says: install: like a sensor结合: ΐ: the sensing chip, the transparent substrate has-flip-chip connection: a ^ ^ joint surface system is formed with a crystal cavity and a plurality of lines, each line! There is a first end and a second end, and the first end of the lines::, Hejing cave 'The second end of the lines extends out of the accommodating cavity, and the test chip has a light sense Measuring surface, a plurality of protrusions are formed on the periphery of the light sensing surface, 'the sensing chip is bonded to the transparent substrate with the bumps and the f-crystal bonding surface'; the lens holder system is provided on the carrier plate The assembly surface is used to seal the flip-chip packaged image sensor, wherein the lens holder system has a light-transmitting channel, which is a light-sensing surface corresponding to the sensing chip for capturing optical image signals. [Embodiment] Referring to the attached drawings, the following description of the embodiment will be listed in this creation ^ According to a specific embodiment of this creation, please refer to FIG. 2, a photographic module with a flip-chip packaged image sensor, which The system includes a carrier board ❿ Ιϋ _ page 7 M249377 4. Creation instructions (3) 100, a flip-chip packaged image sensor 200 and a lens mount 3 00, wherein the carrier board 100 has an assembly surface 1 10, the assembly surface 110 is formed with a circuit layer 111, and a plurality of passive components 120 are provided on the circuit layer Π1. In this embodiment, the carrier board 100 has a hard part 130 and a The flexible part 140 is disposed on the hard part 130. The flexible part 140 is combined with an electrical connector 150 for electrical connection. The lens mount 300 is disposed on the carrier plate 1 ( ) () The assembly surface no, preferably, the lens mount 300 is provided in the hard part 130 of the carrier board 100 to seal the flip-chip packaged image sensor 2000, and the lens mount The 300 series has a light-transmitting channel 3 10 'for light and other optical image signals to pass through and project onto the The chip package image sensor 200 is used to combine with a lens 320 ′ The flip chip package image sensor 200 is combined with the assembly surface 110 of the carrier board 100 and placed in the The enclosed space formed by the lens mount 300 and the carrier plate 100, that is, the flip-chip packaged image sensor 200 is also disposed on the hard portion 130 of the carrier plate 100. The enclosed space formed by the carrier plate 100 can be evacuated or filled with a low-humidity passive gas, such as nitrogen or argon, to prevent the intrusion of moisture and affect the flip-chip packaged image sensor 2 0 0 captures optical image signals. The flip-chip packaged image sensor 2 0 0 includes a transparent substrate 2 1 0 and a sensing chip 2 2 0. The transparent substrate 2 1 0 is a transparent glass. It has a flip-chip bonding surface 2 11 and a light-facing surface 212. The flip-chip bonding surface 211 is formed with a crystal cavity 213 and a plurality of lines 214. The lines 214 are a metal layer, such as indium tin oxide (Indium T in Oxide, ITO], each line 21 4 has a first end 214a and a second end 21 4b, the first end 214a of the lines 214
第8頁 M249377 四、創作說明（4) 係設於該容晶穴2 1 3，該些線路2 1 4之第二端21 4 b係延伸出 該容晶穴213，該透明基板210之迎光面212之平面度係在5 "m以下，該感測晶片220係為一電荷耦合器件〔Charged Couple Device，CCD〕或為一互補金屬氧化半導體 C Cοιηρ 1 6in6ntary Metal Oxide Semiconductor ? CMOS〕，該感測晶片220係具有一光感測面221，該光感測 面2 21之周邊形成有複數個凸塊2 2 2，在製造該覆晶封裝影 像感測器2 0 0時，如第3圖所示，該感測晶片2 2 0係先以該 些凸塊222覆晶接合於該透明基板21 〇之覆晶接合面211，Page 8 M249377 Fourth, the creation instructions (4) are located in the Rongjing hole 2 1 3, the second end 21 4 b of these lines 2 1 4 extend out of the Rongjing hole 213, the welcome of the transparent substrate 210 The flatness of the light surface 212 is below 5 m. The sensing chip 220 is a Charged Couple Device (CCD) or a complementary metal oxide semiconductor C Cοιηρ 1 6in6ntary Metal Oxide Semiconductor? CMOS]. The sensing chip 220 has a light-sensing surface 221, and a plurality of bumps 2 2 2 are formed around the light-sensing surface 2 21. When the flip-chip packaged image sensor 2 0 0 is manufactured, as in the first As shown in FIG. 3, the sensing wafer 2 2 0 is first bonded to the flip-chip bonding surface 211 of the transparent substrate 21 0 with the bumps 222.
再於該透明基板21 0之容晶穴213周邊形成一保護膠層 2 30，以包覆該感測晶片220之凸塊2 22，該保護膠層23 0係 為UV黏膠、熱固填充劑或覆晶底部填充材〔un(jerfilling material〕等由液態塗佈形成之熱固性膠體，再於該些線 路214之第二端214b植接複數個銲球240，於完成該覆晶封 裝影像感測器20 0之後，以該些銲球240結合至該承載板 100之組裝表面1 10，該些銲球24 0之高度係大於該感測晶 片220之厚度，該感測晶片220之光感測面221與該透明基 板210之迎光面212係對應該透光通道310，用以擷取光學 影像訊號。Then, a protective adhesive layer 2 30 is formed around the crystalline cavity 213 of the transparent substrate 21 0 to cover the bumps 2 22 of the sensing chip 220. The protective adhesive layer 23 0 is filled with UV adhesive and thermosetting. Agent or uncovered underfill material (un (jerfilling material)) and other thermosetting colloids formed by liquid coating, and then a plurality of solder balls 240 are implanted at the second end 214b of the lines 214 to complete the image-forming of the flip-chip package. After the sensor 200, the solder balls 240 are bonded to the assembly surface 110 of the carrier board 100. The height of the solder balls 240 is greater than the thickness of the sensing chip 220, and the light sense of the sensing chip 220 The measurement surface 221 and the light-facing surface 212 of the transparent substrate 210 correspond to the light-transmitting channel 310 and are used for capturing optical image signals.
由於該覆晶封裝影像感測器2 0 0係設於該鏡頭座體3 0 0 與該承載板1 00所形成之密封空間，該覆晶封裝影像感測 器200之感測晶片2 20係直接覆晶接合於該透明基板210， 可使該攝影模組厚度更薄，以符合現今電子元件輕薄短小 之趨勢需求，而該些銲球240係結合於該透明基板210之容Since the flip chip packaged image sensor 2 0 0 is located in a sealed space formed by the lens mount 3 0 0 and the carrier board 100, the flip chip packaged image sensor 200 has a sensing chip 2 20 series. Direct flip-chip bonding to the transparent substrate 210 can make the camera module thinner to meet the current trend of lighter, thinner and shorter electronic components. The solder balls 240 are combined with the capacity of the transparent substrate 210.
第9頁 M249377 四、創作說明（5) 晶穴21 3外之該些線路21 4之第二端2 14b，該些銲球240之 直徑可再縮小，只要該些銲球240之直徑與該容晶穴21 3之 深度之和〔即該些銲球240之高度〕大於該感測晶片22 0之 厚度，即不會在組裝該覆晶封裝影像感測器200時，損傷 該感測晶片2 2 0，而隨著縮小該些銲球2 4 〇之直徑，該些銲 球2 4 0之間距亦可再縮小，以減少該透明基板2丨〇之尺寸， 此外’由於該覆晶封裝影像感測器2 〇 〇之銲球2 4 〇結合至該 承載板100時’該些銲球24〇於迴銲〔Ref 1〇w〕過程中係具 有自動=正〔Self-A1 ignment〕之作用，使該覆晶封裝影 像感測器200準確對應至該鏡頭座體3〇〇之透光通道“ο。 & f本乍之保護範圍當視後附之申請專利範圍所界定者 闇内所作:if此項技藝者，在不脫離本創作之精神和範 圍内所作之任何變化與修改’均屬於本創作之保護範圍。Page 9 M249377 IV. Creation instructions (5) The second ends 2 14b of the lines 21 4 outside the crystal cavity 21 3, the diameter of the solder balls 240 can be further reduced, as long as the diameter of the solder balls 240 and the The sum of the depth of the Rongjing cavity 21 3 (that is, the height of the solder balls 240) is greater than the thickness of the sensing chip 22 0, that is, the sensing chip will not be damaged when the flip-chip packaged image sensor 200 is assembled. 2 2 0, and as the diameter of the solder balls 2 4 0 is reduced, the distance between the solder balls 2 4 0 can be further reduced to reduce the size of the transparent substrate 2 丨 In addition, 'because the flip-chip package When the solder ball 2 4 of the image sensor 2 00 is bonded to the carrier plate 100, the solder balls 2 40 have automatic = positive [Self-A1 ignment] Function, so that the flip-chip packaged image sensor 200 accurately corresponds to the light transmitting channel of the lens holder 300. & f The scope of protection of this lens is defined in the dark by the scope of the attached patent Made by: If this artist does not deviate from the spirit and scope of this creation, any changes and modifications are deemed to be the guarantee of this creation. Range.
M249377 圖式簡單說明 【圖式簡單說明】 第1圖：中華民國專利公報公告第4 92593號「CCD及CMOS 影像擷取模組追加一」之截面示意圖； 第2圖：依本創作之一具體實施例，一具覆晶封裝影像感 測器之攝影模組之截面示意圖；及 第3圖：依本創作之一具體實施例，裝設於該攝影模組内 之覆晶封裝影像感測器之截面示意圖。 元件符號簡單說明： 10 電路基板 • 20 影像感測元件 30 鏡頭座 31 取景筒 32 鏡頭 100 承載板 110 組裝表面 111 電路層 120 被動元件 130 硬質部 140 可撓部 150 電連接器 200 覆晶封裝影像感測器 210 透明基板 211 覆晶接合面 212 迎光面 213 容晶穴 214 線路 214a 第一端 214b 第二端 • 220 感測晶片 221 光感測面 222 凸塊 230 保護膠層 240 銲球 300 鏡頭座體M249377 Schematic description [Schematic description] Figure 1: Cross-sectional schematic diagram of "Patent Addition of CCD and CMOS Image Acquisition Module" No. 4 92593 of the Republic of China Patent Gazette; Figure 2: Specifics based on one of the creations Example, a schematic cross-sectional view of a photographic module with a flip-chip packaged image sensor; and Figure 3: a flip-chip-packaged image sensor installed in the photographic module according to a specific embodiment of the present invention Schematic cross-section. Simple explanation of component symbols: 10 circuit board • 20 image sensing element 30 lens holder 31 viewfinder 32 lens 100 carrying plate 110 assembly surface 111 circuit layer 120 passive element 130 hard part 140 flexible part 150 electrical connector 200 flip chip package image Sensor 210 Transparent substrate 211 Flip-chip bonding surface 212 Facing light surface 213 Rongjing hole 214 Circuit 214a First end 214b Second end 220 Sensor chip 221 Light sensing surface 222 Bump 230 Protective layer 240 Solder ball 300 Lens mount
第11頁 M249377 圖式簡單說明 鏡頭 310 透光通道 320Page 11 M249377 Schematic description Lens 310 Light transmission channel 320