TWM247592U - Structure of electric conductive system for electroplating facility - Google Patents

Description

M247592 4. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to an electroplating equipment, especially an electro-mining equipment that can uniformly plate and reduce pollution regardless of the size and size of the object to be plated. The conductive system is related to the structure. [Previous technology] According to the press, "electroplating" is a widely used processing program in the industry today. It mainly uses the principle of electrolysis to coat gold, brass, chromium, nickel, beryllium, tin and other shiny metals. On the surface of metal processed parts or finished products, the color of these processed parts or finished products is changed due to different coatings to obtain beauty, rust prevention, abrasion resistance, electrical conductivity and other effects, so as to provide the used quality of processed parts or finished products.

In the electrolytic reaction, metal ions in the solution will be deposited by accepting electrons at the negative electrode. Electroplating is based on this principle. The article to be plated is connected to the negative electrode, the metal to be plated is used as the positive electrode, and the solution containing the metal ions to be plated is used as the electric clock liquid. After the current is applied, the positive electrode is dissolved into metal ions, and the metal ions in the solution are deposited on the surface of the object to be plated to form a metal film. This is electroplating. In terms of the circuit board manufacturing process, there is a step of electroplating copper. When electroplating (see the first and second pictures, respectively, the side sectional view and the front view of the conventional electroplating equipment 1), the circuit must be The board 14 is set up in each of the clamps 13 and the clamp 13 is hung on a hanger 11. The upper end of the hanger 11 is provided with a hook 1 1 1 which can be buckled on a hanger 1 2 on the basis of conducting current, immerse the fixture 1 3 with the circuit board 1 4 immersed in the electroplating bath 2 1 of the plating tank 2 and use the electrode plates 2 2 and 2 3

Page 5 M247592 ^, creation instructions (2) Connect the positive electrode and the hanging rack 1 1 Complete the electric buckle hanging on a hanging job. This design has the following disadvantages: 1 · The hanging and hanging piece is produced when moving 1 1 and hanging plate plating tank 2 2 · It is easy to cause gaps in the hanging hook 3 · It is easy to cause electricity due to the relationship between the clips, causing 4 · The service life is lower than the equipment 1, easy 5 · Not applicable. It is not suitable because the raw copper scrap frame 1 1 is 2 for contact 1 2 because of the plating solution hook and the hanging piece 1 1 1 and the electroplating of the circuit board. Fixture 1 will result in short circuit of the circuit board with 13 clips: All copper made of patina in the electroplating process makes the large-sized racks 1 1 2 connected to the negative electrode and powered by the same power supply, and uses the action of hanging plating. In addition, the hook 1 1 1 1 2 on the upper end of the hanger 11 can move the circuit board 14. Although the subsequent execution can provide electroplating and facilitate the subsequent operations, it will cause pollution: copper, which is the same as The copper hook 1 1 1 is a conductive path. When moving, the copper scraps caused by the friction of the hook 1 1 will fall directly into 2 1, causing the plating solution 2 1 to be contaminated. The conductivity decreases ... The susceptibility of the hanging sheet 12 to contact friction for a long time decreases. Non-uniformity: The order of the 3 arrangement and the independent clips are different. The amount of electricity conducted by each cooler 13 is not the same. The amount of electricity obtained by holding the circuit board is not uniform. It is carried out in a polar acid environment. The electroplated components are directly exposed to the environment without being shielded. The overall conductivity decreases, which reduces the service life. Circuit board: The size of 11 is fixed, so the clamp of 13

Page 6 M247592 4. Creation instructions (3) The holding range is also fixed. If a larger size circuit board 14 is to be plated, the edge of the circuit board will be conductive because there is no clamp 1 3 to make it conductive. The effect is poor, so it is not suitable for larger size circuit boards. In view of the shortcomings of the conventional electroplating equipment, the creator felt that it was not perfect, so he tried his best to study and overcome it. Based on the experience accumulated in the industry for many years, he developed a conductive system structure for electroplating equipment. The simple design can achieve the effect of uniformly plating, reducing pollution and increasing service life regardless of the size of the object to be plated. [New content]

That is, the main purpose of this creation is to provide a conductive system structure for electroplating equipment, which can achieve the effect of uniform electroplating regardless of the size and size of the object to be plated. Another purpose of this creation is to provide a conductive system structure for electroplating equipment, which can achieve the effect of reducing pollution. Another purpose of this creation is to provide a conductive system structure for electroplating equipment that can increase the useful life. In order to achieve the above purpose, according to a conductive system structure of the electroplating equipment created by the present invention, at least: a plurality of conductive frame plates; a plurality of clamps, which are arranged at the lower end of the conductive frame plate, can clamp the object to be plated thereunder; It is arranged on the upper end of the conductive frame plate; a conductive plate is provided with a plurality of conductive bodies below it and can be placed on the conductive carrier. This can achieve the effect of uniformly plating and reducing pollution regardless of the size of the object to be plated.

Page 7 M247592 Creative Instructions (4) Shizi repeatedly asked for a picture of the electric frame, which can conduct electricity and an object other than the one, and the one of the copper seventy-first is to use the method to explain in detail the following Please refer to the part and part of this creative board 3 1 The board to be plated 3 3 5, The power cord is provided with a conductive rack on the side and the conductor box 6 is rolled, and please read the drawing, this is the creative lead 3] Expensive Examination details, the third and fourth picture element plating • 'If the object 1 can be placed 7 with a shield 3 moving, the follow-up 3 5 should be the sixth embodiment of the implementation of the plating 6 mutual inspection committee as shown in the figure, the fifth and fifth The top view of the equipment guide dry clamp 6 clamps the upper end; Put it on the guide, and make the work on the side of the guide 4 and 1 to assist the guide. It can be a plated object diagram. The created equipment guide is connected in series to understand this example, and then: Create a picture, the system, as shown in Figure 3, below; a conductive electric platform is electric, and the shield surface is equipped with a system. Among them, the copper block or 6 can be the original partial discharge system of this invention, and the purpose, characteristics and effects of this creation, with the accompanying drawings, the parts of this creation are shown separately: 3 The structure is provided on several guide plates 3 The source of 4 3 3 is driven by the roller 3, the conductive brush, a circuit outside the top view 3 structure of the conductive plate sub-component appearance diagram, a side view of this creation, to the conductive electric load, on which . The other part is 3 7 for the electric board and the guide board. Viewing the diagram, the system 3 4 is provided below the pallet 3 and is guided, and the electroplating tank 3 4 is intended to borrow each system as shown below: 3 1 3, with conductive tracks 4 placed on Inside 5 can be the platform 3, some lower ends are set on several guide plates 3 4 system 3 1; and a copper bar 3 of the guide rail 4 to be plated can be, please refer to the illustration again: The conductive frame plate 3 consists of several wires

Page 8 M247592 IV. Creative Instructions (5) 3 8 is connected to each conductive body 3 5 to form a conductive circuit. Each conductive body 3 5 is placed on the conductive stage 3 3 ′ and each conductive stage 3 3 series. It is provided above each conductive frame plate 31, and a jig 3 2 is arranged below each conductive frame plate 31, and the object 6 to be plated can be clamped thereunder, so that each conductive plate 3 4, the conductive body 35, and the conductive stage 33. The conductive rack plate 31, the fixture 32 and the object 6 to be plated form a conductive system circuit. Then, the object 6 to be plated is placed in a plating tank < as shown in Figure 4 > Homework. With the above design, the conductive system 3 of the electroplating equipment of the present invention can have the following advantages: 1. Reduce pollution: As the conductive system 3 moves, each conductive stage 3 3 and each conductive body 3 5 will contact and friction, but its It is non-integrative load friction, which produces slight metal debris, and most of the debris will be carried by the conductive stage 3 3 without falling into the electroplating tank 5 to reduce pollution. 2 · Long service life: A shield 4 is provided on the outer side of the conductive system 3, so that it is isolated from the external extremely acidic environment by the shield 4, which is less likely to produce patina, which reduces the conductivity and increases the service life. 3 · Applicable to various sizes of objects to be plated: With a number of conductive rack plates 3 1 combined with the entire row of fixtures 3 2 design, regardless of the size of the objects to be plated 6, the clamping range can be adjusted by increasing or decreasing the fixtures 3 2. It does not occur that the conductive effect is poor due to the lack of clamps 3 2, so it is suitable for objects 6 to be plated in various sizes.

M247592 Creative Instructions (6) 4 · The mine to be mined can be evenly electric-mined. · Since each of the conductive frame plates 31 is connected in series with wires 36, the conductive amounts of the conductive frame plates 31 are the same, so The object to be plated 6 is evenly plated. In summary, the design of the conductive system structure of an electrical and mining equipment created by the author is indeed feasible, and it improves the various shortcomings of conventional technology. It is a highly creative creation that meets the needs of the industry, and is novel and progressive. The statutory requirements of a new type of patent are based on the application for a new type of patent. The above is only a preferred embodiment of this creation, and is not intended to limit the scope of the patent application for this creation; all others do not depart from the spirit disclosed in this creation. Equivalent changes or modifications completed shall be included in the scope of patent application described below.

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M247592 Brief Description of Drawings The first drawing is a side sectional view of a conventional plating equipment. The second figure is a front view of the conventional plating equipment. The third picture is a schematic diagram of the appearance of some components of this creation. The fourth picture is a side sectional view of the original creation of this creation. The fifth picture is a top view of some elements of this creation. The sixth picture is the appearance of this creation. The seventh picture is a partially enlarged top view of the creation. Description] • •• Electroplating equipment ..... Hook ..... & · •• Conductive plate ..... Wire ..... # 线 ..... 4 Hold • • • Object to be plated IX 0A- ^ 4 IX 00 1 ± 0〇VI · · · 111223333457 • Hang Shelf •• Hanging piece • Circuit board • Plating solution • • Electroplate conductive shelf plateConductive stage • Conductor • • Roller • • Shield • Plating tank • Power cord

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Claims (1)

M247592 5. Scope of patent application1. A conductive system structure of electroplating equipment, including at least: 'Several conductive rack boards; several clamps, which are set at the lower end of the conductive rack board, can clamp the object to be plated thereunder; several conductive carriers It is arranged on the upper end of the conductive frame plate; a conductive plate is provided with a plurality of conductive bodies below it and can be placed on the conductive carrier. 2 · The conductive system structure of electroplating equipment according to item 1 of the scope of patent application, wherein a shield is provided on the outer side of the conductive system. 3 · The conductive system structure of electroplating equipment as described in item 2 of the scope of patent application, wherein a guide is provided inside the shield. 4 · The conductive system structure of the electric clock device as described in item 1 of the scope of patent application, wherein the side of the conductive frame plate is provided with rollers. 5 · The conductive system structure of electroplating equipment as described in item 1 of the scope of patent application, wherein the conductive plate may be a copper bar. 6 · The conductive system structure of electroplating equipment as described in the first item of the patent application scope, wherein the conductor may be a copper block or a brush. 7 · Conductive system structure of electric forging equipment as described in item 1 of the scope of patent application Page 12 M247592 5. Scope of patent application, where the conductive stage can be a copper box. 8 · The conductive system structure of electroplating equipment as described in item 1 of the scope of patent application, wherein the object to be plated may be a circuit board. 9 · The structure of the conductive system of the electroplating equipment as described in item 1 of the scope of the patent application, wherein the conductive frames are connected in series with each other by wires. 1 0 · Conductive system structure of electroplating equipment as described in item 1 of the scope of patent application Wherein, the conductive plate is connected to each conductive body through a plurality of wires to form a conductive circuit. Page 13