TWM246801U - Carrying box for circuit chip or similar objects - Google Patents

Description

M246801 V. Creation Instructions (l) [Technical Field to which the New Type belongs] This creation relates to a carrying case with a protective device, in particular 3, a circuit chip or the like which is in the process of being protected.先前 [Previous technology] The semiconductor material of a single wafer usually contains multiple or insulator material layers. It is formed in semi-sub-components by deposition technology. These electronic components are usually used in one or more layers: they are connected to the outside world through the terminal contacts of the protective layer. In terms of use, such chips containing circuits or the like = In the circuit, for example, by placing or using Li & Fung's technology to extend to the terminal device contacts (such as Jin Zha) under the chip, it is connected to the circuit of the external device through contact. :: s J Cellular mobile phones usually have circuits that can be replaced ^, military ^ 4 mobile phones can only be fitted with these circuit chips s 丨 M card, such as some circuit chips are used to identify phone users The body is I, such as 〇i Μ 卞), and Gan LL ^ ^ Lei Jin today, S # Shimou two circuit chip system adopts a time-based system to limit the action of the electric power σ tongue through 5 tongues. (Such as the telephone stored-value card with time-based payment). For users who often travel in different regions f ^ ^ different regions, based on economic considerations and the situation of different wireless communication service providers (or systems), User skill, > * ^ to easily Not more than one crystal circuit [This, f j country (or area) with the use of a mobile phone, the fork to enjoy different services. In class Ί H, circuit chip generally have substantial stiffness or strength

M246801 V. Creation Instructions (2) degrees, but there are still many reasons that can cause injury or damage to it. The most common cause of damage is static electricity. Therefore, such circuit chips are usually packaged in an antistatic packaging bag when sold, and it is recommended to store in this kind of antistatic packaging bag, but the body of this antistatic packaging bag is very light It is soft and only has the function of anti-static, but it has no protective effect against the damage of external force.

More importantly, for a person who travels frequently, such a small circuit chip is easily lost or forgotten somewhere. If someone owns several circuit chips, only one of them can be used at a time. You must bear the risk of losing those unused circuit chips. [Content] The purpose of this creation is to provide a device that can safely carry circuit chips. As for the content of this creation and other purposes, it can be achieved by the device described, this device includes: a base element made of a deformable antistatic film;

A body layer component, which is a thin component attached to a surface of a bottom layer component. The body layer component has one or more cavities for receiving circuit chips or the like; and an antistatic upper layer. Component, which is attached to the surface of the corpus callosum component and on the other side relative to the underlying component, the upper component is slightly deformable relative to the underlying component. The wafer or the like passes through this opening and enters the host layer element.

Page 6 M246801 V. Creation Instructions (3) The cavity of the piece is held in the upper part. The technical characteristics of this creation and its preferred embodiments can be understood through the following description and the contents of the drawings, which are described below. [Embodiment] As shown in "Figure 1", it is a structural diagram of an embodiment of the carrying box 10 proposed by this creation; according to the design of this creation, this carrying box 10 is used for security Ground carries a circuit chip or the like. The carrying case 10 shown in "Figure 1" is basically a rectangular structure 11 with a multilayer structure, which includes: an upper layer element 12, which has at least, an opening 13 and 15, The openings 13 and 15 are designed to be inserted into a cavity 18 (see FIG. 2) in the body layer element 17 of the carrying case 10 and are retained in the carrying case 10 . "Figure 2" shows an exploded view of the structure of the carrying box 10 shown in "Figure 1". From the figure, the three-layer structure 1 2, 17 and 1 constituting the carrying box 10 can be clearly seen. 9; the openings 13 and 15 provided in the upper element 12 can be clearly seen in the structure, and at least one of the openings 13 must have a width sufficient for the insertion of the circuit chip 14 (see "Figure 4b") ), So that the circuit chip 14 can be inserted into a cavity 18 of the main body component 17 of the carrying case 10 (see "Figure 2") and retained in the carrying case 10. The body layer element 17 has appropriate strength to protect the circuit chip 14 from external forces. It has a suitable thickness at least equivalent to the thickness of the circuit chip 14 so that the cavity 18 formed therein can accommodate the circuit chip 14. The cavity portion 18 has a general size and shape, and the so-called general size and

Page 7 M246801 V. Creation instructions (4) Shape refers to the shape or size of a common circuit chip 14 such as a SIM card or a memory card (Fiash Card) of a mobile phone, of course, depending on the circuit you want to carry The type of the wafer, the cavity portion 18 may have a variety of different shapes, and the shape of the cavity portion 18 disclosed in the drawings of the present invention is just one example. The bottom element 丨 a located below the main body element 丨 7 is made of a thin material, which constitutes the bottom of the carrying box 10, and is used to carry the circuit chip 14 inserted into the carrying box 10, and the bottom layer The element 19 can be made of many kinds of materials ^, but it must basically be made of a deformable and antistatic film material. It also has considerable elasticity and flexibility, as shown in the "fourth dagger", When the user inserts the circuit chip 14 into the cavity L.8, the bottom element 丨 9 bulges and deforms along the direction of the pushing or applying force of the circuit chip 14 until the circuit chip} 4 is pushed into the cavity by Yuan Quan 18, and after lying flat on the upper side surface of the bottom element 19, the bottom element 19 will return to its original shape. This three-layer structured carrying case 10 is a combination of two-layered structures 1 2, 17 and 19 by known manufacturing techniques. For example, it can be completed by flip wave welding or thermal welding. As disclosed in "Figures 2 and 4" ^ In the first embodiment, the shape of the opening 13 for the circuit chip to be inserted in the upper element 12 is designed to have a plurality of protruding finger elements 21, These finger-like elements 21 are deformed when the circuit chip 14 is inserted into the cavity 18 (as shown in the "Figure 4b"). As shown in the figure, 'the circuit chip 1 4 is inserted at an angle and carried at an angle. The cavity portion 18 of the row box 10, and the bottom element 19 will bulge along the pushing or applying direction of the circuit chip 14 until the circuit chip 14 is completely pushed into the cavity portion 18, or even After abutting the cavity wall 22 at one end, the bottom element 19 will return to its original shape, and the aforementioned finger element 21 will also return to its original shape.

Page 8 M246801 V. Creation instructions (5) The other end of the upper part / hole part 18 of the hole wall 22 dives further below the edge of the other opening 15. From the cross-sectional structure of "Figures 4a and 4b", the opening The edge of the hole 15 will form a protruding edge 24 above the cavity wall 22, and after the circuit chip 14 is completely said into the cavity portion 18, the finger element 21, the protruding edge 24, and two openings The bridge portion 26 between the holes 13 and 15 can hold the circuit chip 14 within the cavity portion 18 of the carrying case 10 without falling out. Of course, if the user considers it necessary, he can also put his finger into the opening 5 and push the upper surface of the circuit chip 14 to push one end of the circuit chip 14 toward the cavity wall 22, and one end of the circuit chip 14 against the cavity. Up to wall 22. To achieve the above characteristics! According to an implementation of this creation (see "Figure 4"), the above-mentioned upper element 12 is made of an antistatic material, and it is provided with a thickness and elasticity equivalent to that of a playing card; the main layer element 7 is made of It is better to use a flat plate material (Shikou plastic sheet) with a card-like hardness of 11: Foot: Protect the circuit chip 14 contained in it from being damaged by external forces. And only = traveling in the bottom element 19, must have antistatic and ductility. In a specific embodiment of the present invention, the thickness of the upper layer element 12 is: 1 The thickness of the main body element 17 is about 6; 79 follows, and the underlying component 19 is used for example. Of course, one of the two is also not used to limit the scope of this creation. To remove the circuit chip 14 in the carrying case 10 downwards, it is only necessary to push the right end of the circuit chip U upward by the 19 pieces of the circuit chip 14 so that the finger-shaped elements of the opening 13 are pushed out by the fingers. Above 21, and then push the circuit chip 2 15 and push the circuit chip 14 to the right ', you can easily push out the carrying box 10, and then pinch the circuit chip i 4 and hold it.

M246801 V. Creation Instructions (6) Take out and use. Finally, please refer to "Figure 3" and "Figures 5a, 5b", which are the structure of another embodiment of this creation. The cross-sectional structure of this embodiment can be produced, which is the same as the first embodiment (see "Figure 2" and "Figures 4a, 4b") The biggest difference is that there is an inclined surface 39 at the right edge of the cavity 38. Under the guidance of this inclined surface 39, even if there is no first implementation In the example of the finger element 21, when the circuit chip 1 4 is inserted into the cavity portion 3 8 along the inclined surface 3 9 until it reaches the cavity wall 40 at one end of the cavity portion 3 8, the circuit chip 14 can still be held. It is difficult to fall out of the hole portion 38. The method of taking out the circuit chip 11 is the same as that described above and will not be repeated. : Based on the technology of this creation, the multi-layer structure constituting the carrying box 10 can easily pass through several sheets of material, and then use known bonding techniques to combine these different layers of components with each other, so it has low cost With the advantages of fast manufacturing. To sum up, the scope of implementation of this work is only a more definite version of this creation, that is, all equivalent changes and modifications based on what they have done, such as the changes of six Genna circuits, or the components attached to the main layer, etc. The preferred embodiments of the patent application scope are not intended to limit the content of the patent application scope of this creation. One or more of them can be set as required. The use of removable antistatic layer stickers should be the technical scope of the creation. limit.

Page 10 M246801 Brief Description of Drawings Figure 1 shows the appearance and structure of the first embodiment of the creation. Fig. 2 is a structural exploded view of the first embodiment of the creation. FIG. 3 is a structural exploded view of the second embodiment of the creation. Figures 4a and 4b are structural sectional views of the first embodiment of the creation. Figures 5a and 5b are structural sectional views of the second embodiment of this creation. . [Illustration of component symbols in the figure] 10 ........... carrying case 11 ........... rectangular body 12; .......... Layer element 13 ........... opening. 14 ........... circuit chip 15 ......... opening 17 ... ....... Main layer element 18 ........... Cavity 19 ..... • •• Lower layer element 21 ........... Finger element 22 ........... Cavity wall 24 .............. Bulge 2 6 ..... Bridge 39 ... ...: > · · · · Bevel 40 ...........

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Claims (1)

M246801 6. Scope of patent application 1. A carrying case of a circuit chip or the like is a device for carrying and protecting a circuit chip or the like, and includes: a bottom element made of a deformable film A main body element, which is a thin element, with a bottom element attached to one side of the surface, the main body element having a cavity for receiving a circuit chip or the like; and an upper element attached to the element The surface of the body layer element and on the other side opposite to the bottom layer element, this upper layer element has a slight deformability with respect to the bottom layer element, and it has at least one opening for the circuit chip or the like to pass through Through the opening, and! It enters the cavity I of the body layer element and is held therein by the upper layer element. 2. A carrying case for a circuit chip or the like as described in item 1 of the scope of the patent application, wherein the underlying component has the ability to deform and sufficient flexibility and elasticity when the circuit chip is inserted and pushed by the circuit chip. 3. A carrying case for a circuit chip or the like as described in item 1 or 2 of the scope of patent application, wherein the bottom element is made of an antistatic film. 4. A carrying case for a circuit chip or the like as described in item 1 of the scope of the patent application, wherein the main layer components are made of plastic. 5. The carrying case of the circuit chip or the like described in the first patent application scope, wherein one end edge of the cavity portion of the main body component has an inclined surface, and the circuit chip is inserted into the cavity guide circuit along the inclined surface # Said ~ piece until the hole wall against the other end of the hole. 6. The carrying case of the circuit chip or the like described in the first item of the patent application scope, wherein the thickness of the body layer element is equivalent to the thickness of the circuit chip. Page 12 M246801 VI. Scope of Patent Application 7. The carrying case of the circuit chip or the like described in item 1 of the scope of patent application, wherein the body layer element has thickness and elasticity equivalent to that of a playing card. 8. A carrying case for a circuit chip or the like as described in item 1 of the scope of patent application, wherein the upper element is made of an antistatic material. The carrying case of a circuit chip or the like described in the scope of claims 1 or 8 of the patent application, wherein the opening in the upper layer element through which the circuit chip can be inserted has several protruding finger elements, and the finger elements are The circuit chip is deformed when it is inserted into the cavity, until the circuit chip is completely pushed into the cavity, the finger-like elements will be restored to the original shape to hold the circuit wafer in the cavity. 10. The carrying case for the circuit chip or its J-like object as described in item 1 or 8 of the scope of the patent application, wherein the opening has two holes, one of which is wide enough for the circuit chip to be inserted The other part of the hole part dives into the hole below the edge of the other hole, so that the upper element forms a flange above the edge green of the hole part, which is between the two holes With a bridge. Page 13