TWM243681U - Fastening tool of heat sink member with uniform pressing pressure - Google Patents

Description

M243681 Amendment SS-_912〇8〇9t ^ V. Creation instructions (1) 1. [Technical field to which the new type belongs] This creation is about a kind of ▲ Integral circuit device surface, I The fastener is to fix the heat dissipation component . Component, this creation is a buckle that produces a cooling effect on the road device. ^ Day——A kind of heat dissipation structure to make the buckling pressure more even; 1. [Previous technology] At present, the integrated circuit device has been caused by the vibration frequency of the integrated circuit device, which will cause high temperature phenomenon, such as the damage of the film, so The general solution "diffuses the heat generated by the wafer" to the outside, so as to be placed on the wafer in a decentralized manner. It is known that a buckle socket is preset on the printed circuit board, and the shadow is distributed on the wafer. Around the chip, the clip is placed on the heat dissipation member and used for telecommunication products such as computers. It is extremely high. When it is used continuously for a period of time without proper temperature reduction, the crystal will be placed on the chip. The heat dissipation structure 'can quickly transfer heat to the heat dissipation member, and the way to stabilize the heat dissipation member' is to print on the wafer of the device. The buckle socket contains a large number of buckle holes. 'Formed' and the two ends of the fastener are hooked separately

In the two opposite buckle holes of the buckle seat, the heat dissipating member is tightly bundled on the wafer. As shown in Fig. 9, the two conventional fasteners (A) and (A) are respectively pressed on both sides of the heat dissipation member (B), and the two fasteners (a) and (a) are also pressed on each side. The two sides outside the area of the integrated circuit device (C), because both sides of the heat dissipation member (β) are depressed, it is easy to form a state where the central portion is arched upward, so that the central portion of the heat dissipation member (B) is arched upward. Integrated circuit

The gap (D) formed between the surfaces of (C) causes the heat-dissipating member (β) and the surface of the integrated circuit device (C) to be unable to be intimately connected to each other, causing a poor heat transfer effect.

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Case No. 91208 7 V. Creation Note (2), greatly reducing the effect of heat dissipation. 3. [New Content] In view of the foregoing problems, this creation aims to provide a kind of heat dissipation member buckle that makes the force more even. It can achieve the following innovations: 1. The heat dissipation member buckle that makes the buckling pressure more evenly provided by this creation And | can cooperate with the traditional buckle buckle on both sides of the heat dissipation member, and then use two buckles provided by this creation to apply pressure to the center of the heat dissipation member ^: The central part of ϊϊϊίΪΪ is also properly pressed by the heat dissipation member and Make all parts of the body circuit device more evenly pressed = Wen Tiyu ’s heat dissipation efficiency can be more reduced == For the purpose of making the buckling pressure more even, it can be buckled by using the original knife as a two or two original buckle frame It's very convenient to use. For fasteners, the hibiscus 4 provides a heat-dissipating heat-constructing member that makes the pressing pressure more even and the two-two pieces are pressed against the surface of the integrated circuit device. One of the two between the pressing portions of the two opposite sides of the sheet portion;: two first heat-dissipating member buckles 1 provided on the heat-dissipating member, including: the person portion. The above makes the clamping pressure more uniform. There are two sets of first-fasteners ... one second buckle is provided around the heat-dissipating member. The buckles 3 are provided respectively. They are respectively hooked on the hooks; they are each pressed against the loose structure. The first-buckle the two-crimping parts. Two n = two opposite sides of the two first crimped parts are hooked to the two corners of the four corners of the buckle frame-a total of four fourth-buckle hooks are respectively crimped to the loose part :: buttonhole, Make the first-pressed parts of the two opposite sides of the two-buckles, ...

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Creative instructions (3) will be via the heat dissipation structure half # _ ,, two buckles, which have the following: The base is pressed on both sides of the integrated circuit device. The above second buckle. Among them, the second and second parts of the day, two slingshots, and two are pressed against the central part of the heat sink, which is located on the base rod, to cry in the integrated circuit:- In the middle so that the corresponding end systems respectively extend from the two ends of the base pole section: Ϊ extend to each other from the second end of the slingshot to the buckle frame. Two buttonholes of each buttonhole, so as to exert pressure on the central joints s:, 邛, and 肉 of a pair of diagonal body circuit devices that are connected to each other from > * a * and Y Applying pressure on the integrated circuit to the integrated circuit. The first heat sink member applies more force to each part of the device to make the cooling member to the integrated circuit. 4. [Embodiment] Flatter: ί Ξ Ϊ iif 'The surface of the crimping pressure circuit device ⑵) provided in this creation, the heat dissipation member (21) has a body (2 11), which is respectively provided in the fin part (2 J;,, 箬 ο 。. 丨 11) Two first pressed portions σ) on two opposite sides, and a second pressed portion (213) provided between the two first pressed portions (2 1 2) and 21 2) The second pressed (21 3) is a notch. And the heat dissipating member (21) is projected into the buckle frame (2 4). As for the heat-dissipating member buckle that makes the buckling pressure more even in this creation, it includes: two sets of the first buckle (22), and one second buckle (23). Each of the buckles (22) is provided with: each hook is hooked around the heat dissipating member (21).

M243681 __Case No. 91208097__ Year, month, and day five. Creation instructions (4) The two first clasps (2 2 1) of the clasp holes (2 4 1) at the four corners of the clasp frame (2 4) and (222), each of the two first pressed portions (2 12) and (21 2) of the two first pressed portions (223) pressed on opposite sides of the heat dissipation member (21). Two sets of first buckles (22) — a total of four first buckles (221), (221), (222) and (2 2 2) are respectively hooked at four corners of the four corners of the buckle frame (2 4) Two button holes (2 4 1), so that the first pressing portions (223) and (223) of the two sets of first fasteners (22) are respectively pressed against the first pressed sides of the two opposite sides of the heat dissipation member (2 1) The contact portions (2 1 2) and (2 1 2) are pressed correspondingly on both sides of the integrated circuit device (2 5) via the heat dissipation member (2 1). The second buckle (23) includes a base rod portion (231), a second crimping portion (232), two slingshot portions (233) and (233), and two second buckles (234) and (234). ). The second crimping portion (232) is located in the center of the base rod portion (231).

The portion ′ is to be pressed in the middle of the second pressed portion (2 丨 3) of the heat dissipation member (2 丨) so as to correspondingly press the central portion of the integrated circuit device (25). The two slingshot portions (233) and (233) have a first end and a second end, and the first ends of the slingshot portions (233) and (233) extend integrally at both ends of the base cup portion (2 3 1) and are perpendicular to the base rod portion (2 30. The two second buckle hooks (234) and (234) each extend integrally from the second end of the slingshot ^ "] so as to hook each of the four buckle holes (241) of the buckle frame (24). Two buckle holes (241) opposite to each other, so as to apply pressure to the central part of the rhyme component (2 1), and then to the central connection of the integrated circuit device (2 5), a buckle (22) The heat dissipation member (21) passes through the two sides of the device (25) correspondingly, so that the heat dissipation member (21) applies a more even pressure to each part of the integrated circuit device (25). Effects and Features of Creation] This creation provides the following effects and features:

Page 8 M243681: Case No. 912080Q7, V. Creation Instructions (5) 1. The dispersiveness provided by this creation to make the buckling pressure more even to match the traditional buckle buckles on both sides of the heat dissipation member. Only the buckle provided by this creation puts pressure on the heat-dissipating member, so that the central part of the integrated circuit device is also subject to the appropriateness of the heat-dissipating member: Second: The various parts of the integrated circuit device are subject to more even pressure = This can effectively improve its heat dissipation efficiency and reduce the temperature of the integrated circuit device. 2 · The heat-dissipating member fastener provided by this creation to make the buckling pressure more even. It can make full use of the original buckle frame, which is very convenient to use.

M243681 Case No. 91208097 Λ_η Modification Simple description of the drawing (Figure 1 of the drawing 2 of the drawing 3 of the drawing 4

5th, 6th, 7th, 8th, 9th [Fig. 21 212 22 222 23 232 234 24 25 A C Fig. Fig. Fig. Fig. Winning heat dissipation first first first simple explanation] This is a three-dimensional exploded view of this creation. A perspective view of the second buckle created for this creation. Front view of the second clip for this creation. This is a perspective view of the partial combination of this creation [the first fastener has been fastened to the buttonhole of the buckle frame, but the second fastener has not yet been fastened]. This is a three-dimensional view of the complete composition of this creation. It is a sectional view taken along the line 6-6 in Figure 5. It is the 7-7 sectional view in Figure 5. This is a top view of the complete composition of this creation. This is a sectional view of a conventional radiator. No. index] Component pressed part buckle hook buckle pressed part buckle second second second buckle frame integrated circuit device buckle integrated circuit device 2 11 heat sink fin part 2 1 3 second pressed 2 2 1 First hook 223 First pressing portion 2 3 1 Base rod portion 233 Slingshot portion 2 4 1 Buckle hole B Radiating member D Clearance% t

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Claims (1)

M243681 Μ No. 912_97 6. Scope of patent application 1 · A kind of heat-dissipating member that makes the buckling pressure more, one of which is placed in the buckle frame to dissipate heat. The system includes: a surface, and a fin part; two, and a second group of first crimped portions, a first pair of crimped portions, and a curved geothermal component portion of the second crimped rod portion. , It is set on a buckle, each, and each group of one buckle has two sides of the thermal member on the first pressed part, and contains a part, so that the two ends of the pressing are respectively extended to have a second second pressed average. The surface pressure member is provided in the first two sets of the first group, the first group, the first group, the first group, the first group, the first group, the first group, the first group, and the first group. For slingshot slingshot fishing, the buckle is applied on the part to make the sling uniform. The political and thermal members are attached to the body. There are protruding hot scales. One side of the tool is pressed by a fastener. The two sides of the fastener are the first buckle pressed sections. The middle part of the buckle to be buckled as a heat dissipation member and the heat dissipation side of the circuit board of the buckle 5 are respectively pressed against the buckle and applied to the buckle, and the second is used by the two slingshots on the buckle frame. The two sides of the integrated body are electrically defined to form a first buckle; the middle pressure of the buckle holes of the buckle frame on both sides of the heat dissipation member; Surfaces of the above two groups of equalizers in the central part Page 11