M240646 五、創作說明u) . 【所屬之技術領域】 本創作係關於一種「記憶卡多層組裝結構」，尤指一 種適用於數位照相機、通訊手機、掌上型電腦等各式電子 產品上，且可有效降低I C材料成本及塑膠外殼製造成本， 提高製程彈性，同時達到良好組裝品質與效能之記憶卡組 裝結構。 【先前技術】 按，目前市面上常見許多型式之記憶卡（如數位相機 記憶卡、多媒體卡、加密卡等），以供各種電子產品（如通 訊手機、掌上型電腦、數位相機等）安裝使用。 緣，傳統記憶卡1’ 0之組裝結構，主要係在基板1 1 依序佈設被動元件與各式採S Μ T方式組裝之I C (通常包含快 閃記憶體、控制晶片· ·）等元件1 2後，再於基板1 1 上透過壓模、點膠或印膠之密封作業，以構成所需之電路 板，最後再於電路板外部組裝封罩一外殼1 3 (如第一圖 所示之最後組裝作業），以組裝構成一記憶卡1 0結構。 【内容】 (所欲解決之技術問題） 惟，本創作者發現傳統記憶卡之組裝結構，確具有下 列若干缺點： (1 )、結構軟弱：由於現有記憶卡之厚度均採標準規格 設計，因此若以傳統記憶卡之組裝結構，外皮以塑膠射出M240646 V. Creation Instructions u). [Technical Field] This creation is about a "multilayer assembly structure of memory cards", especially one suitable for various electronic products such as digital cameras, communication phones, palmtop computers, etc. Memory card assembly structure that effectively reduces the cost of IC materials and the manufacturing cost of plastic casings, improves the flexibility of the process, and achieves good assembly quality and performance. [Previous technology] According to the current, many types of memory cards (such as digital camera memory cards, multimedia cards, encryption cards, etc.) are commonly available on the market for installation and use of various electronic products (such as communication mobile phones, handheld computers, digital cameras, etc.) . The assembly structure of the traditional memory card 1 ′ 0 is mainly based on the sequential arrangement of passive components and various types of ICs (usually including flash memory and control chips) assembled on the substrate 1 1. 1 After the second step, the substrate 11 is sealed by stamping, dispensing or printing to form the required circuit board. Finally, a cover 1 3 is assembled outside the circuit board (as shown in the first figure). The final assembly operation) to form a memory card 10 structure. [Content] (Technical problem to be solved) However, the creator found that the assembly structure of traditional memory cards does have the following disadvantages: (1), weak structure: because the thickness of existing memory cards are designed with standard specifications, so If the assembly structure of the traditional memory card is used, the outer skin is injected with plastic
M240646 五、創作說明（2) 之殼體包覆電路基板’ 一般為上下兩片結合包覆’因為電 路基板已有基本厚度，加上基板上的1C，讓包覆在基板兩 邊之塑膠外殼就無法很厚，因為基板薄，基板加上薄的外 殼，使整體記憶卡之強度不高，容易損壞。 (2 )、結構剛性不足：由於傳統記憶卡兩邊之塑膠外 殼，由框架加上片體結合而成，因為受限於厚度及材質， 其基本之剛性就不足，自然就會影響組裝後之剛性。 (3 )、塑膠外殼成本高：由於記憶卡整體厚度受限於固 定尺寸，塑膠外殼整體厚度約1.4mm，分成兩半為0.7mm， 等於外框之厚度，除去外框後之平面板厚度更小，只剩0. 2到0 . 3mm之厚度可運用，要製造該厚度之塑膠外殼，以及 塑膠製作外框，其成本可能不高，但是要讓塑膠平面與框 體一體射出，其成本相當高，而且要和外框一體射出，難 度也高，是造成記憶卡成本被提高的原因之一。 C解決問題之技術手段） 緣此，本創作主要將包覆電路基板之外殼以多層之結 構設計，該多層之部份主要在於將塑膠外殼之框體，以多 層次之結構設計，可以以塑膠射出成型先單獨射出製作， 整體框架外緣因為有基本1. 4mm之厚度，其製作成本就比 較低，框架内緣設有一整圈的凸緣，利用框架其特殊之橫 凸形斷面形狀，加強框體之結構強度：並將基板容置於塑 膠框體中之後，利用基板之周圍平面貼合塑膠外框凸緣之 一邊，再以一覆蓋片貼合於塑膠外框凸緣之另一邊，完成M240646 V. Creative Instructions (2) The case covers the circuit board 'usually the upper and lower two pieces are combined and covered' because the circuit board already has a basic thickness, plus 1C on the substrate, so that the plastic shells wrapped on both sides of the substrate are It cannot be very thick, because the substrate is thin, and the substrate plus the thin shell makes the overall memory card not strong enough and easily damaged. (2) Insufficient structural rigidity: Because the plastic casings on both sides of the traditional memory card are combined by the frame and the sheet body, because of its thickness and material, its basic rigidity is insufficient, and it will naturally affect the rigidity after assembly. . (3) High cost of plastic casing: As the overall thickness of the memory card is limited by the fixed size, the overall thickness of the plastic casing is about 1.4mm, divided into two halves of 0.7mm, which is equal to the thickness of the outer frame. The thickness of the flat plate after removing the outer frame is more Small, only 0.2 to 0.3mm thickness can be used. The cost of manufacturing a plastic shell and plastic frame of this thickness may not be high, but it is quite costly to make the plastic plane and the frame integrally project. It is high, and it is difficult to shoot together with the frame, which is one of the reasons that the cost of the memory card is increased. C. Technical means to solve the problem) For this reason, the main design of this creative design is to cover the circuit board with a multilayer structure. The part of the multilayer is mainly a plastic shell frame with a multi-level structure design. The injection molding is first made by injection. Because the outer edge of the overall frame has a thickness of 1.4 mm, its production cost is relatively low. The inner edge of the frame is provided with a full circle of flanges, and the special cross-convex shape of the frame is used. Strengthen the structural strength of the frame: After accommodating the substrate in the plastic frame, use the plane around the substrate to fit one side of the flange of the plastic frame, and then use a cover sheet to fit the other side of the flange of the plastic frame. ,carry out
M240646 五、創作說明（3) . 記憶卡之組裝，該多層之結構，可以利用覆蓋片之較高剛 性，配合框體之結構，讓組裝後之記憶卡整體強度提高； 電路基板連結於比較厚的外殼框體之一邊，該多層結構強 度也因為框體另一邊有連結一覆蓋片體而不會太弱，整體 外殼之製造成本也可有效降低製作成本，提昇產品品質與 效能，使該記憶卡組裝結構確具極佳實用性者。 另外本創作之覆蓋片也可以運用高強度剛性之塑膠片 體或金屬片體，配合比較厚的塑膠外殼框體，整體強度仍 優於傳統之組裝結構；同時塑膠外框也可以利用金屬材料 成型取代。 (對照先前技術之功效） 本創作相較先前技術，確可獲得下列若干優點： (1 )、降低成本：由於本創作可以因為利用塑膠外殼框 體來包覆基板，框體之厚度厚，製作成本低，覆蓋片不需 開模製作，外殼成本就可降低，故可藉以有效降低整體記 憶卡之材料成本。 (2 )、具確切密封效果與組裝品質：本創作外殼採多層 設計，即可將内部各I C予以完全密封，同時達到絕緣效 果，相較習用密封結構毫不遜色，且整體厚度亦能控制在 標準規定範圍中者。 【實施方式】 請參閱第二、三圖所示，係分別為本創作記憶卡之立M240646 V. Creation instructions (3). The assembly of the memory card. The multilayer structure can use the higher rigidity of the cover sheet and the structure of the frame to increase the overall strength of the assembled memory card. The circuit board is connected to a thicker layer. The strength of the multilayer structure is not too weak because one side of the casing frame is connected to the other side of the casing. The manufacturing cost of the overall casing can also effectively reduce the production cost, improve product quality and efficiency, and make the memory The card assembly structure is indeed very practical. In addition, the cover sheet of this creation can also use a high-strength rigid plastic sheet or metal sheet, with a thicker plastic casing frame, the overall strength is still better than the traditional assembly structure; at the same time, the plastic outer frame can also be formed from metal materials. To replace. (Compared with the effect of the previous technology) Compared with the prior art, this creation can indeed obtain the following advantages: (1), reduce costs: As this creation can be used to cover the substrate with a plastic casing frame, the thickness of the frame is thick, making The cost is low, and the cover does not need to be mold-made, and the shell cost can be reduced, so the material cost of the overall memory card can be effectively reduced. (2) With precise sealing effect and assembly quality: The multi-layer design of the creative shell can completely seal the internal ICs and achieve the insulation effect. Compared with the conventional sealing structure, it is not inferior, and the overall thickness can be controlled. The standard specifies the range. [Embodiment] Please refer to the second and third pictures, which are the status of the creative memory card.
M240646 五、創作說明（4) 體組合與分解示意圖，由圖式得知，本創作之記憶卡2 0 大致與習用相同，具有一基板2 1 、若干安裝接著於基板 2 1上之被動元件2 2與各式1C元件2 3 {其中該1C通常 包含有快閃記憶體（FLASH) 2 3 1及控制晶片（CONTRLLER) 2 3 2}，以形成所需之電路板，且電路板罩設有一外殼 2 4 ，以供密封電路板，並藉以構成一記憶卡2 0結構 者。 本創作之主要改良在於：該外殼2 4為一框體，除了 外緣平整，内緣中有一凸緣2 4 1結構，當基板置入框體 外殼2 4之凸緣2 4 1下緣，凸緣2 4 1上緣貼附覆蓋片 2 4 2 ，完成記憶卡2 0整體組裝結構。 由於框體之厚度不用分上下兩邊，也沒有習知平板與 框體一體射出成型，框體可以相對採記憶卡之最高厚度， 覆蓋片242與外殼24之凸緣24 1貼觸密合，利用高 剛性之覆蓋片2 4 2使該組合後之外殼2 4強度；另一邊 則貼合電路基板2 1 ，而覆蓋片2 4 2不需開模，取得成 本低，塑膠外殼24也因為厚度夠，製造成本不高，而覆 蓋片2 4 2與外殼2 4之貼合也得以到密封與達到絕緣效 果者，措由以上組裝結構設計’俾使記憶卡2 0組裝結構 成本降低且強度提高者。 其次，若依照目前市售之iMMC記憶卡之標準規格設 計，其總厚度為1. 4 m m ± 0 . 1 m m ;需說明的是，本創作記憶 卡2 0之基板2 1厚度為0. 3 m m，加上基板2 1上之I C總 厚約1. Omm，覆蓋片2 4 2之厚度係小於0. 4mm，其整體組M240646 V. Creation instructions (4) Body composition and disassembly schematic diagrams, from the figure, the memory card 20 of this creation is roughly the same as the conventional one, with a base plate 2 1 and several passive components 2 mounted on the base plate 2 1 2 and various types of 1C components 2 3 {wherein the 1C usually includes a flash memory 2 3 1 and a control chip 2 3 2} to form a required circuit board, and the circuit board cover is provided with a The housing 2 4 is used to seal the circuit board and form a memory card 20 structure. The main improvement of this creation is that the shell 24 is a frame, except that the outer edge is flat, there is a flange 2 4 1 structure in the inner edge. When the substrate is placed in the lower edge of the flange 2 4 1 of the frame shell 24, A cover 2 2 2 is attached to the upper edge of the flange 2 4 1 to complete the overall assembly structure of the memory card 20. Since the thickness of the frame body does not need to be divided into upper and lower sides, and there is no conventional plate and frame body injection molding, the frame body can relatively adopt the highest thickness of the memory card. The cover sheet 242 and the flange 24 of the casing 24 are in close contact and used. The cover plate 2 4 2 with high rigidity makes the combined housing 2 4 strong; the other side is attached to the circuit board 2 1, and the cover plate 2 4 2 does not need to be opened, and the acquisition cost is low. The plastic housing 24 is also thick enough. The manufacturing cost is not high, and the bonding of the cover sheet 2 4 2 and the casing 24 can also be sealed and achieve the insulation effect. By the above assembly structure design, the cost of the assembly structure of the memory card 20 is reduced and the strength is improved. . Secondly, if designed in accordance with the current standard specifications of iMMC memory cards currently on the market, the total thickness is 1.4 mm ± 0.1 mm; it should be noted that the thickness of the substrate 21 of the creative memory card 20 is 0.3. 4mm ， its overall group, the total thickness of the IC on the substrate 2 1 is about 1. Omm, the thickness of the cover sheet 2 4 2 is less than 0.4 mm
M240646 五、創作說明（5) 配之厚度即可達1 . 4 m m之標準範圍。 綜上所述，本創作「記憶卡多層組裝結構」，係提供 一種適用於數位照相機、通訊手機、掌上型電腦等各式電 子產品上，且可有效強化結構、降低生產與組裝成本，同 時得確保封裝品質與效能發揮之結構，俾使整體確具產業 實用性及成本效益，且其構成結構又未曾見於諸書刊或公 開使用，誠符合新型專利申請要件，懇請 鈞局明鑑，早 曰准予專利，至為感禱。 需陳明者，以上所述乃是本創作之具體實施例及所運 用之技術原理，若依本創作之構想所作之改變，其所產生 之功能作用仍未超出說明書及圖式所涵蓋之精神時，均應 在本創作之範圍内，合予陳明。M240646 V. Creative Instructions (5) The thickness can be up to the standard range of 1.4 mm. In summary, the "Multilayer Assembly Structure of Memory Cards" in this creation is to provide a variety of electronic products suitable for digital cameras, communication phones, palmtop computers, etc., and can effectively strengthen the structure and reduce production and assembly costs. The structure to ensure the quality and efficiency of the package, so that the whole is indeed industrially practical and cost-effective, and its structure has not been seen in books or publications, and is in line with the requirements for new patent applications. , I really pray. Those who need to know, the above are the specific examples of the creation and the technical principles used. If the changes made according to the concept of the creation, the functional effects still do not exceed the spirit covered by the description and drawings. At the time, they should all be merged with Chen Ming within the scope of this creation.
第10頁 M240646 圖式簡單說明 . 【圖式簡單說明】 第一圖係為習用記憶卡之側視剖面示意圖。 第二圖係為本創作記憶卡之立體分解示意圖。 第三圖係為本創作記憶卡之側視剖面示意圖。 明 說· 號ο 1S11 1π 3 2〇 2 1 2 3 · 2 3 2 A · · 2 4 1 卡 憶板殼 記基外 2 件 元 記憶卡 基板 I C元件 控制晶片 接腳 凸緣 2 2· 2 3 1 2 4· 2 4 2 被動元件 快閃記憶體 外殼 覆蓋片Page 10 M240646 Simple illustration of the drawing. [Simplified illustration of the drawing] The first drawing is a schematic side sectional view of a conventional memory card. The second picture is a three-dimensional exploded view of the creative memory card. The third picture is a schematic side sectional view of the creative memory card. Explanation · No. 1S11 1π 3 2〇2 1 2 3 2 4 · 2 4 2 Passive component flash memory cover
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