TWI897744B - 半導體奈米粒子複合體分散液、半導體奈米粒子複合體、半導體奈米粒子複合體組成物及半導體奈米粒子複合體硬化膜 - Google Patents

半導體奈米粒子複合體分散液、半導體奈米粒子複合體、半導體奈米粒子複合體組成物及半導體奈米粒子複合體硬化膜

Info

Publication number
TWI897744B
TWI897744B TW113146729A TW113146729A TWI897744B TW I897744 B TWI897744 B TW I897744B TW 113146729 A TW113146729 A TW 113146729A TW 113146729 A TW113146729 A TW 113146729A TW I897744 B TWI897744 B TW I897744B
Authority
TW
Taiwan
Prior art keywords
semiconductor nanoparticle
ligand
nanoparticle composite
semiconductor
ligands
Prior art date
Application number
TW113146729A
Other languages
English (en)
Chinese (zh)
Other versions
TW202513462A (zh
Inventor
城戶信人
佐佐木洋和
森山喬史
三津家由子
Original Assignee
日商昭榮化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭榮化學工業股份有限公司 filed Critical 日商昭榮化學工業股份有限公司
Publication of TW202513462A publication Critical patent/TW202513462A/zh
Application granted granted Critical
Publication of TWI897744B publication Critical patent/TWI897744B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/02Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B19/00Selenium; Tellurium; Compounds thereof
    • C01B19/04Binary compounds including binary selenium-tellurium compounds
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B25/00Phosphorus; Compounds thereof
    • C01B25/08Other phosphides
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G9/00Compounds of zinc
    • C01G9/08Sulfides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • C09D11/32Inkjet printing inks characterised by colouring agents
    • C09D11/322Pigment inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/50Sympathetic, colour changing or similar inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/22Luminous paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • C09D7/62Additives non-macromolecular inorganic modified by treatment with other compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/0883Arsenides; Nitrides; Phosphides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/70Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing phosphorus
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/88Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
    • C09K11/881Chalcogenides
    • C09K11/883Chalcogenides with zinc or cadmium
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/10Metal compounds
    • C08K3/105Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/32Phosphorus-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/08Ingredients agglomerated by treatment with a binding agent
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/10Encapsulated ingredients

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Biophysics (AREA)
  • Composite Materials (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW113146729A 2019-05-31 2020-05-29 半導體奈米粒子複合體分散液、半導體奈米粒子複合體、半導體奈米粒子複合體組成物及半導體奈米粒子複合體硬化膜 TWI897744B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-103239 2019-05-31
JP2019-103240 2019-05-31
JP2019103240 2019-05-31
JP2019103239 2019-05-31

Publications (2)

Publication Number Publication Date
TW202513462A TW202513462A (zh) 2025-04-01
TWI897744B true TWI897744B (zh) 2025-09-11

Family

ID=73551919

Family Applications (2)

Application Number Title Priority Date Filing Date
TW113146729A TWI897744B (zh) 2019-05-31 2020-05-29 半導體奈米粒子複合體分散液、半導體奈米粒子複合體、半導體奈米粒子複合體組成物及半導體奈米粒子複合體硬化膜
TW109118000A TWI865536B (zh) 2019-05-31 2020-05-29 半導體奈米粒子複合體分散液

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109118000A TWI865536B (zh) 2019-05-31 2020-05-29 半導體奈米粒子複合體分散液

Country Status (6)

Country Link
US (1) US12415948B2 (cg-RX-API-DMAC7.html)
JP (2) JP7602206B2 (cg-RX-API-DMAC7.html)
KR (2) KR20250096886A (cg-RX-API-DMAC7.html)
CN (1) CN113906116A (cg-RX-API-DMAC7.html)
TW (2) TWI897744B (cg-RX-API-DMAC7.html)
WO (1) WO2020241872A1 (cg-RX-API-DMAC7.html)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201716543A (zh) * 2015-07-17 2017-05-16 馬克專利公司 發光粒子、墨水調配物、聚合物組合物、光學裝置、其製造及發光粒子之用途
TW201825648A (zh) * 2016-11-15 2018-07-16 南韓商東友精細化工有限公司 量子點分散液、自發光型感光性樹脂組成物、使用其製備的彩色濾光件與影像顯示裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7361516B2 (en) * 2004-09-24 2008-04-22 The United States Of America As Represented By The Secretary Of The Navy Field of modular multifunctional ligands
JP5881045B2 (ja) 2011-10-11 2016-03-09 国立研究開発法人産業技術総合研究所 量子ドット含有チタン化合物及びその製造方法、並びに該量子ドット含有チタン化合物を用いた光電変換素子
JP2015086284A (ja) * 2013-10-30 2015-05-07 シャープ株式会社 蛍光体、波長変換部材及び発光装置
WO2017038487A1 (ja) 2015-08-31 2017-03-09 富士フイルム株式会社 半導体ナノ粒子、分散液、フィルムおよび半導体ナノ粒子の製造方法
CN109790452A (zh) * 2016-05-20 2019-05-21 3M创新有限公司 具有混合的胺和硫醇配体的量子点
EP3327813B1 (en) * 2016-11-25 2021-06-30 Samsung Electronics Co., Ltd. Light emitting device and display device including quantum dot
US10961448B2 (en) 2017-06-05 2021-03-30 Nanosys, Inc. Acid stabilization of quantum dot-resin concentrates and premixes
CN111373015B (zh) * 2017-06-07 2024-06-04 昭荣化学工业株式会社 用于改进量子点在树脂膜中的可靠性的硫醇化亲水性配体
EP3635069B1 (en) 2017-06-08 2023-06-07 Merck Patent GmbH A composition comprising semiconducting light-emitting nanoparticles having thiol functional surface ligands
US10768485B2 (en) 2017-07-05 2020-09-08 Nanoco Technologies Ltd. Quantum dot architectures for color filter applications
KR102712599B1 (ko) 2017-10-17 2024-10-02 엘지디스플레이 주식회사 발광체, 이를 포함하는 발광 필름, 발광다이오드 및 발광장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201716543A (zh) * 2015-07-17 2017-05-16 馬克專利公司 發光粒子、墨水調配物、聚合物組合物、光學裝置、其製造及發光粒子之用途
TW201825648A (zh) * 2016-11-15 2018-07-16 南韓商東友精細化工有限公司 量子點分散液、自發光型感光性樹脂組成物、使用其製備的彩色濾光件與影像顯示裝置

Also Published As

Publication number Publication date
KR20220015399A (ko) 2022-02-08
JP7602206B2 (ja) 2024-12-18
WO2020241872A1 (ja) 2020-12-03
TW202112651A (zh) 2021-04-01
US20220315834A1 (en) 2022-10-06
TWI865536B (zh) 2024-12-11
TW202513462A (zh) 2025-04-01
KR20250096886A (ko) 2025-06-27
JP7824584B2 (ja) 2026-03-05
US12415948B2 (en) 2025-09-16
JP2025032144A (ja) 2025-03-11
JPWO2020241872A1 (cg-RX-API-DMAC7.html) 2020-12-03
KR102825651B1 (ko) 2025-06-26
CN113906116A (zh) 2022-01-07

Similar Documents

Publication Publication Date Title
US12365836B2 (en) Semiconductor nanoparticle complex, semiconductor nanoparticle complex dispersion liquid, semiconductor nanoparticle complex composition, and semiconductor nanoparticle complex cured film
JP7468525B2 (ja) 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜
JP7807729B2 (ja) 半導体ナノ粒子複合体、半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体組成物、半導体ナノ粒子複合体硬化膜、および半導体ナノ粒子複合体パターニング膜
TWI864008B (zh) 半導體奈米粒子複合體、半導體奈米粒子複合體組成物、及半導體奈米粒子複合體硬化膜
KR20240152402A (ko) 반도체 나노 입자 복합체, 반도체 나노 입자 복합체 분산액, 반도체 나노 입자 복합체 조성물, 반도체 나노 입자 복합체 경화막 및 반도체 나노 입자 복합체의 정제 방법
TWI897744B (zh) 半導體奈米粒子複合體分散液、半導體奈米粒子複合體、半導體奈米粒子複合體組成物及半導體奈米粒子複合體硬化膜
TWI864009B (zh) 半導體奈米粒子複合體