TWI891908B - Double-sided adhesive tape - Google Patents
Double-sided adhesive tapeInfo
- Publication number
- TWI891908B TWI891908B TW110135353A TW110135353A TWI891908B TW I891908 B TWI891908 B TW I891908B TW 110135353 A TW110135353 A TW 110135353A TW 110135353 A TW110135353 A TW 110135353A TW I891908 B TWI891908 B TW I891908B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin layer
- double
- foamed resin
- adhesive tape
- sided adhesive
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
- C09J2400/243—Presence of a foam in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本發明之目的在於提供一種雙面黏著帶,其兩個黏著面之階差追隨性高,且可對剪切負載及傾斜負載表現出高保持力,至少一個黏著面之重工性優異,進而,於貼附時操作性亦優異。本發明之雙面黏著帶具有發泡體基材、及積層於上述發泡體基材之兩面之黏著劑層,上述發泡體基材具有第1發泡樹脂層、及積層於上述第1發泡樹脂層之至少一面且發泡倍率低於上述第1發泡樹脂層的第2發泡樹脂層,上述黏著劑層中之至少一者於180℃之儲存模數為11000 Pa以上。The present invention aims to provide a double-sided adhesive tape having high gradient tracking properties on both adhesive surfaces, high holding power against shear and tilt loads, and excellent workability on at least one adhesive surface. Furthermore, the double-sided adhesive tape comprises a foam substrate and adhesive layers laminated on both surfaces of the foam substrate. The foam substrate comprises a first foamed resin layer and a second foamed resin layer laminated on at least one surface of the first foamed resin layer and having a lower expansion ratio than the first foamed resin layer. At least one of the adhesive layers has a storage modulus of 11,000 Pa or greater at 180°C.
Description
本發明係關於一種雙面黏著帶,其兩個黏著面之階差追隨性高,且可對剪切負載及傾斜負載表現出高保持力,至少一個黏著面之重工性優異,進而,於貼附時操作性亦優異。The present invention relates to a double-sided adhesive tape having high step-following properties on both adhesive surfaces and exhibiting high holding force against shear and tilt loads. At least one adhesive surface has excellent workability, and further, excellent operability during attachment.
黏著帶廣泛用於固定電子零件。具體而言,例如,於電視、螢幕等顯示裝置中,使用黏著帶將表面之蓋板(cover panel)固定於殼體。此種黏著帶以例如邊框狀等形狀配置於顯示畫面之周邊而使用。Adhesive tape is widely used to secure electronic components. Specifically, in display devices like televisions and monitors, adhesive tape is used to secure the cover panel to the housing. This adhesive tape is placed around the display screen in a shape such as a frame.
近年來,由於追求設計或功能性,電視、螢幕等顯示裝置發展窄邊框化,對無邊框顯示裝置之期望亦越來越高。於先前之顯示裝置之製造中,有時亦藉由嵌入或螺固將蓋板固定於殼體,但於發展窄邊框化之顯示裝置中難以進行嵌入或螺固,因此,利用黏著帶進行固定之需求逐漸提高,黏著帶亦日漸薄型化及窄化。In recent years, the pursuit of design and functionality has led to a trend toward narrower bezels on display devices such as televisions and monitors, and expectations for borderless displays have also grown. In previous display manufacturing processes, covers were sometimes secured to the housing by inserting or screwing. However, these methods are becoming increasingly difficult with narrower bezels. Consequently, the demand for adhesive tape for securing these features has grown, and these tapes are becoming increasingly thinner and narrower.
作為可用於此種顯示裝置之黏著帶,例如,專利文獻1及2揭示一種衝擊吸收帶,其中,丙烯酸系黏著劑層一體化積層於基材層之至少一個面,且該基材層為具有特定之交聯度及氣泡長寬比之交聯聚烯烴系樹脂發泡片。 由於發泡體基材具有適當之柔軟性,且可緩和應力,因此,藉由使用發泡體基材作為黏著帶之基材,具有可提高階差追隨性、可提高耐衝擊性、可減少顯示裝置中發生之顯示不均等優點。 先前技術文獻 專利文獻 As adhesive tapes that can be used in such display devices, for example, Patent Documents 1 and 2 disclose shock-absorbing tapes in which an acrylic adhesive layer is integrally laminated on at least one surface of a base layer, and the base layer is a cross-linked polyolefin resin foam sheet with a specific degree of crosslinking and cell aspect ratio. Because the foam base material has appropriate flexibility and can mitigate stress, using a foam base material as the base material for the adhesive tape offers advantages such as improved step tracking, enhanced shock resistance, and reduced display unevenness in the display device. Prior Art Patent Document
專利文獻1:日本特開2009-242541號公報 專利文獻2:日本特開2009-258274號公報 Patent Document 1: Japanese Patent Application Publication No. 2009-242541 Patent Document 2: Japanese Patent Application Publication No. 2009-258274
[發明所欲解決之課題][The problem that the invention aims to solve]
然而,隨著電視、螢幕等顯示裝置日漸大型化,蓋板、殼體等被固定構件之重量亦增加。因此,黏著帶、尤其是發展薄型化及窄化之黏著帶,會承受超出先前之非常大之負載。尤其,於剪切方向會受到非常大之負載,故要求黏著帶對剪切負載具有高保持力。又,於壁掛式電視等之應用中,亦正在增加「以相對於垂直方向向前傾斜例如20~45°左右之狀態來設置顯示裝置」等情況,故亦要求黏著帶對傾斜負載具有高保持力。However, as display devices such as televisions and monitors become larger, the weight of the fixed components, such as covers and housings, has also increased. Consequently, adhesive tapes, especially those that have become thinner and narrower, are subject to significantly greater loads than before. In particular, they are subject to very large loads in the shear direction, requiring the tape to have a high holding force against shear loads. Furthermore, applications such as wall-mounted televisions are increasingly seeing displays tilted forward, for example, by 20 to 45 degrees relative to the vertical, requiring the tape to have a high holding force against tilted loads.
又,近年來,電子零件趨於昂貴,因此,於例如固定零件時產生不良之情形時等,要求零件可重工。作為零件重工之方法之一,例如可採用下述方法:利用切刀刃撕裂黏著帶之發泡體基材,破壞層間結構以拆下零件,將零件上殘留之部分黏著帶剝離除去。於此種情形時,要求黏著帶具有「能在不會使殘渣(例如,因斷裂而殘留之部分發泡體基材)殘留於零件上之狀況下進行剝離除去」的優異重工性。Furthermore, electronic components have become increasingly expensive in recent years, leading to a need for reworkability in situations such as when fixing a component. One method for rework involves using a cutting blade to tear the foam backing of the adhesive tape, breaking the interlayer structure to remove the component, and then peeling off any remaining adhesive tape. In this case, the adhesive tape must exhibit excellent reworkability, allowing it to be peeled off without leaving residue (e.g., residual foam backing from a fracture) on the component.
本發明之目的在於提供一種雙面黏著帶,其兩個黏著面之階差追隨性高,且可對剪切負載及傾斜負載表現出高保持力,至少一個黏著面之重工性優異,進而,於貼附時操作性亦優異。 [解決課題之技術手段] The present invention aims to provide a double-sided adhesive tape having high gradient tracking properties on both adhesive surfaces, exhibiting high holding power against shear and tilt loads, and having excellent workability on at least one adhesive surface. Furthermore, the tape also exhibits excellent operability during application. [Technical Solution]
本發明之雙面黏著帶具有發泡體基材、及積層於上述發泡體基材之兩面之黏著劑層,上述發泡體基材具有第1發泡樹脂層、及積層於上述第1發泡樹脂層之至少一面且發泡倍率低於上述第1發泡樹脂層的第2發泡樹脂層,上述黏著劑層中之至少一者於180℃之儲存模數為11000 Pa以上。 以下詳細說明本發明。 The double-sided adhesive tape of the present invention comprises a foam substrate and adhesive layers laminated on both sides of the foam substrate. The foam substrate comprises a first foamed resin layer and a second foamed resin layer laminated on at least one side of the first foamed resin layer and having a lower expansion ratio than the first foamed resin layer. At least one of the adhesive layers has a storage modulus of 11,000 Pa or greater at 180°C. The present invention is described in detail below.
關於具有發泡體基材、及積層於該發泡體基材之兩面之黏著劑層之雙面黏著帶,為了提高其對剪切負載及傾斜負載之保持力,且提高至少一個黏著面之重工性,本發明人等研究出使用一種於發泡樹脂層之至少一面積層樹脂層進行補強而成的多層基材作為發泡體基材。 然而,例如當單面或雙面之樹脂層過硬時,積層有該樹脂層一側之階差追隨性降低,易發生剝離。近年來正增加下述情況:黏著帶與顯示裝置內之偏光板部分重疊,或與為了顯示黏著帶之貼附部位而形成於殼體之導件部分重疊,即使使用薄型且窄幅之黏著帶,亦要求其充分追隨此種偏光板、導件等之階差。另一方面,當為了提高階差追隨性而使樹脂層之兩面均過於柔軟時(例如,於雙面之樹脂層使用苯乙烯-丙烯酸系嵌段共聚物時),亦會產生無法充分獲得對剪切負載及傾斜負載之保持力,貼附時黏著帶伸長導致操作性差之問題。 To improve the holding power against shear and tilt loads and enhance the workability of at least one adhesive surface, the inventors of this invention have developed a double-sided adhesive tape comprising a foam substrate and adhesive layers laminated on both sides of the foam substrate. The invention utilizes a multilayer substrate reinforced with a laminated resin layer on at least one side of the foam resin layer as the foam substrate. However, if the resin layer on one or both sides is too hard, the gradient tracking ability of the laminated side with the resin layer is reduced, making it prone to delamination. In recent years, there have been increasing cases where the adhesive tape partially overlaps with the polarizing plate in the display device, or partially overlaps with the guide formed on the casing to display the attachment point of the adhesive tape. Even if a thin and narrow adhesive tape is used, it is required to fully follow the steps of such polarizing plates, guides, etc. On the other hand, when both sides of the resin layer are made too soft to improve step followability (for example, when a styrene-acrylic block copolymer is used for the resin layer on both sides), the problem of insufficient holding power against shear load and tilt load may arise, and the adhesive tape may stretch during application, resulting in poor operability.
針對該等問題,本發明人等研究出積層於發泡樹脂層(中心發泡樹脂層)之樹脂層亦使用發泡樹脂層(最外層),並將最外層之發泡倍率調整為低於中心發泡樹脂層之發泡倍率。本發明人等發現,藉由使用此種多層基材作為發泡體基材,可兼顧兩個黏著面之階差追隨性、與對剪切負載及傾斜負載之保持力及至少一個黏著面之重工性,亦可獲得優異之操作性。本發明人等進而發現,藉由將黏著劑層中之至少一者於180℃之儲存模數調整至特定範圍,可進一步提高對剪切負載及傾斜負載之保持力,從而完成了本發明。To address these issues, the inventors have developed a method in which the resin layer stacked on the foamed resin layer (the central foamed resin layer) also uses a foamed resin layer (the outermost layer), and the foaming ratio of the outermost layer is adjusted to be lower than that of the central foamed resin layer. The inventors have discovered that by using this multi-layer substrate as the foam substrate, it is possible to achieve both adhesive surfaces' step-following properties, as well as shear and tilt load retention, and reworkability on at least one adhesive surface, while also achieving excellent workability. The inventors further discovered that by adjusting the storage modulus of at least one adhesive layer at 180°C to a specific range, the holding force against shear loads and tilt loads can be further improved, thereby completing the present invention.
本發明之雙面黏著帶具有發泡體基材、及積層於上述發泡體基材之兩面之黏著劑層。藉由具有上述發泡體基材,本發明之雙面黏著帶之階差追隨性提高,又,可表現出優異之應力緩和性。The double-sided adhesive tape of the present invention comprises a foam substrate and adhesive layers laminated on both sides of the foam substrate. The foam substrate improves the tape's gradient tracking properties and exhibits excellent stress-relieving properties.
上述發泡體基材具有第1發泡樹脂層、及積層於上述第1發泡樹脂層之至少一面且發泡倍率低於上述第1發泡樹脂層的第2發泡樹脂層。 藉由於上述第1發泡樹脂層積層上述第2發泡樹脂層,可緩和因受到剪切負載或傾斜負載而產生之上述第1發泡樹脂層之變形應力,使其難以傳遞至上述黏著劑層,可抑制上述黏著劑層剝離。又,藉由於上述第1發泡樹脂層積層上述第2發泡樹脂層,可於重工時以不使殘渣(例如,因斷裂而殘留之部分上述第1發泡樹脂層)殘留於積層有上述第2發泡樹脂層一側之被黏著體上之方式剝離除去本發明之雙面黏著帶,可表現出優異之重工性。 進而,當於上述第1發泡樹脂層積層過硬之樹脂層時,積層有該樹脂層一側之階差追隨性降低,相對於此,本發明之雙面黏著帶中,藉由於上述第1發泡樹脂層積層上述第2發泡樹脂層,可抑制兩個黏著面之階差追隨性降低。另一方面,當為了提高階差追隨性而於上述第1發泡樹脂層之兩面積層過於柔軟之樹脂層時(例如,於雙面之樹脂層使用苯乙烯-丙烯酸系嵌段共聚物時),亦會產生無法充分獲得對剪切負載及傾斜負載之保持力,貼附時之操作性較差之問題。相對於此,本發明之雙面黏著帶中,藉由於上述第1發泡樹脂層積層上述第2發泡樹脂層,可對剪切負載及傾斜負載表現出高保持力,貼附時操作性亦優異。 The foam substrate comprises a first foamed resin layer and a second foamed resin layer laminated on at least one surface of the first foamed resin layer and having a lower expansion ratio than the first foamed resin layer. By laminating the second foamed resin layer on the first foamed resin layer, deformation stress in the first foamed resin layer caused by shear loads or oblique loads is mitigated, making it less likely to be transmitted to the adhesive layer, thereby suppressing delamination of the adhesive layer. Furthermore, by laminating the second foamed resin layer onto the first foamed resin layer, the double-sided adhesive tape of the present invention can be peeled and removed during rework without leaving residue (e.g., a portion of the first foamed resin layer remaining due to a break) on the adherend on the side laminated with the second foamed resin layer, thereby exhibiting excellent reworkability. Furthermore, when an excessively hard resin layer is laminated on the first foamed resin layer, the step-adjustability of the side with the resin layer laminated thereon is reduced. In contrast, in the double-sided adhesive tape of the present invention, the step-adjustability of both adhesive surfaces can be suppressed by laminating the second foamed resin layer on the first foamed resin layer. On the other hand, when excessively soft resin layers are laminated on both sides of the first foamed resin layer to improve gradient tracking (for example, when a styrene-acrylic block copolymer is used as the resin layer on both sides), sufficient holding power against shear and tilt loads may be insufficient, resulting in poor workability during application. In contrast, the double-sided adhesive tape of the present invention, by laminating the second foamed resin layer on the first foamed resin layer, exhibits high holding power against shear and tilt loads, resulting in excellent workability during application.
上述發泡體基材可僅於上述第1發泡樹脂層之一面具有上述第2發泡樹脂層,亦可於上述第1發泡樹脂層之兩面具有上述第2發泡樹脂層。其中,就可進一步提高雙面黏著帶對剪切負載及傾斜負載之保持力,且兩個黏著面可表現出優異之重工性之方面而言,較佳為於上述第1發泡樹脂層之兩面具有上述第2發泡樹脂層。再者,於此情形時,雙面之第2發泡樹脂層之樹脂構成、物性、厚度等可分別相同,亦可互不相同。 又,黏著帶一般以捲取成卷狀體之狀態提供,從該卷狀體拉出而使用。並且,當於上述第1發泡樹脂層之兩面積層過硬之樹脂層時,若芯之直徑大到一定尺寸以上,則捲取時會產生褶皺或彎折。相對於此,本發明之雙面黏著帶中,藉由於上述第1發泡樹脂層積層上述第2發泡樹脂層,即使於上述第2發泡樹脂層積層於兩面之情形時,亦可確保整個雙面黏著帶之柔軟性。藉此,易將雙面黏著帶捲取成卷狀,使用性明顯提高,且可抑制捲取時產生褶皺或彎折。 The foam substrate may have the second foam resin layer on only one side of the first foam resin layer, or may have the second foam resin layer on both sides of the first foam resin layer. In particular, having the second foam resin layer on both sides of the first foam resin layer is preferred, as it further improves the double-sided adhesive tape's holding power against shear and tilt loads and provides excellent workability on both adhesive surfaces. In this case, the resin composition, physical properties, and thickness of the second foam resin layers on both sides may be the same or different. Adhesive tapes are typically provided in a rolled form and are drawn from the roll for use. Furthermore, if an overly hard resin layer is laminated on both sides of the first foamed resin layer, wrinkles or bends may occur when the core diameter exceeds a certain size. In contrast, the double-sided adhesive tape of the present invention, by laminating the second foamed resin layer on the first foamed resin layer, maintains the overall flexibility of the tape even when the second foamed resin layer is laminated on both sides. This makes it easier to roll the tape, significantly improving its usability and preventing wrinkles or bends during rolling.
除上述第1發泡樹脂層及上述第2發泡樹脂層以外,上述發泡體基材可具有例如黏著劑層等其他層,但從防止製造步驟複雜化之觀點出發,較佳為上述第1發泡樹脂層與上述第2發泡樹脂層之間不具其他層。In addition to the first foaming resin layer and the second foaming resin layer, the foam substrate may have other layers such as an adhesive layer. However, from the perspective of preventing the complication of the manufacturing process, it is preferred that there is no other layer between the first foaming resin layer and the second foaming resin layer.
圖3係示意地表示本發明之雙面黏著帶之一例之剖視圖。圖3所示雙面黏著帶7具有發泡體基材8、及積層於發泡體基材8之兩面之黏著劑層91、92。發泡體基材8具有第1發泡樹脂層10、及積層於第1發泡樹脂層10之兩面之第2發泡樹脂層11、12。再者,圖3所示雙面黏著帶中,第2發泡樹脂層積層於第1發泡樹脂層之兩面,但本發明並不限於此種態樣。Figure 3 is a cross-sectional view schematically illustrating an example of a double-sided adhesive tape according to the present invention. The double-sided adhesive tape 7 shown in Figure 3 comprises a foam substrate 8 and adhesive layers 91 and 92 laminated on both sides of the foam substrate 8. The foam substrate 8 comprises a first foam resin layer 10 and second foam resin layers 11 and 12 laminated on both sides of the first foam resin layer 10. Furthermore, in the double-sided adhesive tape shown in Figure 3, the second foam resin layers are laminated on both sides of the first foam resin layer, but the present invention is not limited to this embodiment.
上述第1發泡樹脂層可具有連續氣泡結構,亦可具有獨立氣泡結構,但較佳為具有獨立氣泡結構。藉由具有獨立氣泡結構,上述第1發泡樹脂層之強度增加,因此,可抑制上述第1發泡樹脂層受到剪切負載及傾斜負載時發生變形及層間破壞,進一步提高雙面黏著帶對剪切負載及傾斜負載之保持力。The first foamed resin layer may have either a continuous or independent cell structure, but preferably has an independent cell structure. Having an independent cell structure increases the strength of the first foamed resin layer, thereby suppressing deformation and interlayer damage when subjected to shear and tilt loads, further enhancing the double-sided adhesive tape's ability to retain shear and tilt loads.
上述第1發泡樹脂層可為單層結構,亦可為多層結構。 上述第1發泡樹脂層並無特別限定,例如可列舉:聚胺酯(polyurethane)發泡樹脂層、聚烯烴發泡樹脂層、橡膠系發泡樹脂層、丙烯酸發泡樹脂層等。其中,就可表現出優異之應力緩和性及強度之方面而言,較佳為聚胺酯發泡樹脂層或聚烯烴發泡樹脂層,更佳為聚烯烴發泡樹脂層。 The first foamed resin layer may have a single-layer structure or a multi-layer structure. The first foamed resin layer is not particularly limited and may include, for example, a polyurethane foamed resin layer, a polyolefin foamed resin layer, a rubber foamed resin layer, or an acrylic foamed resin layer. Of these, polyurethane foamed resin layers or polyolefin foamed resin layers are preferred, with polyolefin foamed resin layers being more preferred, due to their excellent stress-relieving properties and strength.
上述聚胺酯發泡樹脂層並無特別限定,例如可列舉由含有聚異氰酸酯及多元醇之胺酯樹脂組成物所構成之聚胺酯發泡樹脂層。此種聚胺酯發泡樹脂層可藉由加熱上述胺酯樹脂組成物使其硬化而製造。The polyurethane foam resin layer is not particularly limited. For example, a polyurethane foam resin layer composed of an urethane resin composition containing polyisocyanate and polyol can be exemplified. Such a polyurethane foam resin layer can be produced by heating the urethane resin composition to harden it.
上述聚烯烴發泡樹脂層並無特別限定,例如可列舉由聚乙烯系樹脂、聚丙烯系樹脂、聚丁二烯系樹脂等樹脂所構成之發泡樹脂層。其中,就易獲得柔軟之聚烯烴發泡樹脂層之方面而言,較佳為由聚乙烯系樹脂所構成之發泡樹脂層。 上述聚乙烯系樹脂並無特別限定,例如可列舉用齊格勒-納塔(Ziegler-Natta)化合物、茂金屬化合物、氧化鉻化合物等聚合觸媒聚合而成之聚乙烯樹脂。又,就可增加上述第1發泡樹脂層之柔軟性之方面而言,上述聚乙烯樹脂較佳為直鏈狀低密度聚乙烯。上述直鏈狀低密度聚乙烯較佳為由乙烯及視需要之少量α-烯烴共聚而成之直鏈狀低密度聚乙烯,作為上述α-烯烴,例如可列舉:丙烯、1-丁烯、1-戊烯、4-甲基-1-戊烯、1-己烯、1-庚烯、1-辛烯等。其中,碳數4~10之α-烯烴較佳。 The polyolefin foamed resin layer is not particularly limited. Examples include those composed of resins such as polyethylene resins, polypropylene resins, and polybutadiene resins. Polyolefin foamed resins are particularly preferred, as they provide a soft and flexible polyolefin foamed resin layer. The polyethylene resin is not particularly limited. Examples include those polymerized using polymerization catalysts such as Ziegler-Natta compounds, metallocene compounds, and chromium oxide compounds. Furthermore, to enhance the softness of the first foamed resin layer, the polyethylene resin is preferably linear low-density polyethylene. The linear low-density polyethylene is preferably a linear low-density polyethylene copolymerized with ethylene and, if necessary, a small amount of an α-olefin. Examples of the α-olefin include propylene, 1-butene, 1-pentene, 4-methyl-1-pentene, 1-hexene, 1-heptene, and 1-octene. α-olefins having 4 to 10 carbon atoms are preferred.
上述第1發泡樹脂層之發泡倍率高於上述第2發泡樹脂層之發泡倍率即可,並無特別限定。 當上述第1發泡樹脂層為聚烯烴發泡樹脂層時,上述第1發泡樹脂層之發泡倍率之下限較佳為5 cm 3/g,上限較佳為30 cm 3/g。若上述發泡倍率為5 cm 3/g以上,則上述第1發泡樹脂層可具有適當之柔軟性,雙面黏著帶之兩個黏著面之階差追隨性及應力緩和性進一步提高。若上述發泡倍率為30 cm 3/g以下,則上述第1發泡樹脂層之強度充分增加,雙面黏著帶對剪切負載及傾斜負載之保持力進一步提高。上述發泡倍率之下限更佳為8 cm 3/g,上限更佳為25 cm 3/g,下限進而較佳為10 cm 3/g,上限進而較佳為20 cm 3/g,上限進而更佳為18 cm 3/g。 再者,可根據JIS K 7222(使用聚乙烯之情形)求出發泡倍率。又,發泡倍率能以視密度之倒數之形式求出。 The expansion ratio of the first foamed resin layer is not particularly limited, as long as it is higher than that of the second foamed resin layer. When the first foamed resin layer is a polyolefin foamed resin layer, the expansion ratio of the first foamed resin layer preferably has a lower limit of 5 cm³ /g and an upper limit of 30 cm³ /g. A foaming ratio of 5 cm³ /g or greater provides the first foamed resin layer with adequate flexibility, further improving the gradient conformability and stress relaxation properties of the two adhesive surfaces of the double-sided adhesive tape. If the expansion ratio is 30 cm³ /g or less, the strength of the first foamed resin layer is sufficiently increased, further enhancing the double-sided adhesive tape's ability to hold shear and tilt loads. The lower limit of the expansion ratio is preferably 8 cm³ /g, the upper limit is more preferably 25 cm³ /g, the lower limit is more preferably 10 cm³ /g, the upper limit is more preferably 20 cm³ /g, and the upper limit is more preferably 18 cm³ /g. Furthermore, the expansion ratio can be calculated according to JIS K 7222 (when polyethylene is used). Furthermore, the expansion ratio can be calculated as the inverse of the apparent density.
上述第1發泡樹脂層之厚度並無特別限定,下限較佳為100 μm,上限較佳為2000 μm。若上述厚度為100 μm以上,則上述第1發泡樹脂層可具有適當之柔軟性,雙面黏著帶之兩個黏著面之階差追隨性及應力緩和性進一步提高。若上述厚度為2000 μm以下,則可抑制上述第1發泡樹脂層受到剪切負載及傾斜負載時發生變形,進一步提高雙面黏著帶對剪切負載及傾斜負載之保持力。上述厚度之下限更佳為300 μm,上限更佳為1500 μm,下限進而較佳為500 μm,上限進而較佳為1000 μm。 再者,可使用針盤測厚儀(例如,日本三豐公司製造,「ABS Digimatic Indicator」)測定發泡樹脂層之厚度。 The thickness of the first foamed resin layer is not particularly limited, with a preferred lower limit of 100 μm and an upper limit of 2000 μm. A thickness of 100 μm or greater provides the first foamed resin layer with adequate flexibility, further improving the gradient-following and stress-relieving properties of the double-sided adhesive tape's two adhesive surfaces. A thickness of 2000 μm or less suppresses deformation of the first foamed resin layer under shear and tilt loads, further enhancing the tape's ability to withstand these loads. The lower limit of the aforementioned thickness is more preferably 300 μm, the upper limit is more preferably 1500 μm, the lower limit is even more preferably 500 μm, and the upper limit is even more preferably 1000 μm. Alternatively, the thickness of the foamed resin layer can be measured using a needle-disc thickness gauge (e.g., the "ABS Digimatic Indicator" manufactured by Mitutoyo Corporation of Japan).
上述第2發泡樹脂層只要為發泡倍率低於上述第1發泡樹脂層之發泡樹脂層即可,並無特別限定,可為具有與上述第1發泡樹脂層相同之氣泡結構、層結構、樹脂構成、物性等之發泡樹脂層,亦可為具有與上述第1發泡樹脂層不同之氣泡結構、層結構、樹脂構成、物性等之發泡樹脂層。 上述第2發泡樹脂層可具有連續氣泡結構,亦可具有獨立氣泡結構,但較佳為具有獨立氣泡結構。藉由具有獨立氣泡結構,上述第2發泡樹脂層之強度增加,因此,可於重工時以更加不使殘渣(例如,因斷裂而殘留之部分上述第1發泡樹脂層)殘留於積層有上述第2發泡樹脂層一側之被黏著體上之方式剝離除去雙面黏著帶,可表現出更加優異之重工性。 The second foamed resin layer is not particularly limited as long as it has a lower expansion ratio than the first foamed resin layer. It may have the same cell structure, layer structure, resin composition, and physical properties as the first foamed resin layer, or it may have a different cell structure, layer structure, resin composition, and physical properties from the first foamed resin layer. The second foamed resin layer may have either a continuous cell structure or an independent cell structure, but preferably has an independent cell structure. The independent cell structure increases the strength of the second foamed resin layer. Therefore, during rework, the double-sided adhesive tape can be peeled off with less residue (e.g., portions of the first foamed resin layer remaining due to fracture) on the adherend layered with the second foamed resin layer, resulting in superior reworkability.
上述第2發泡樹脂層可為單層結構,亦可為多層結構。 上述第2發泡樹脂層並無特別限定,例如可列舉:聚胺酯發泡樹脂層、聚烯烴發泡樹脂層、橡膠系發泡樹脂層、丙烯酸發泡樹脂層等。其中,就可表現出優異之應力緩和性及強度之方面而言,較佳為聚胺酯發泡樹脂層或聚烯烴發泡樹脂層,更佳為聚烯烴發泡樹脂層。 上述聚胺酯發泡樹脂層並無特別限定,可為與上述第1發泡樹脂層中之聚胺酯發泡樹脂層相同者。上述聚烯烴發泡樹脂層亦並無特別限定,可為與上述第1發泡樹脂層中之聚烯烴發泡樹脂層相同者。 The second foamed resin layer may have a single-layer structure or a multi-layer structure. The second foamed resin layer is not particularly limited and may include, for example, a polyurethane foamed resin layer, a polyolefin foamed resin layer, a rubber foamed resin layer, or an acrylic foamed resin layer. Of these, polyurethane foamed resin layers or polyolefin foamed resin layers are preferred, with polyolefin foamed resin layers being more preferred, due to their excellent stress-relieving properties and strength. The polyurethane foamed resin layer is not particularly limited and may be the same as the polyurethane foamed resin layer in the first foamed resin layer. The polyolefin foamed resin layer is not particularly limited and may be the same as the polyolefin foamed resin layer in the first foamed resin layer.
上述第2發泡樹脂層之發泡倍率低於上述第1發泡樹脂層之發泡倍率即可,並無特別限定,下限較佳為1.1 cm 3/g,上限較佳為7 cm 3/g。若上述發泡倍率為1.1 cm 3/g以上,則上述第2發泡樹脂層可具有適當之柔軟性,雙面黏著帶之兩個黏著面之階差追隨性及應力緩和性進一步提高。若上述發泡倍率為7 cm 3/g以下,則上述第2發泡樹脂層之強度充分增加,雙面黏著帶對剪切負載及傾斜負載之保持力進一步提高,貼附時之操作性亦進一步提高。上述發泡倍率之下限更佳為1.3 cm 3/g,上限更佳為5 cm 3/g,下限進而較佳為1.4 cm 3/g,上限進而較佳為2 cm 3/g,下限進而更佳為1.5 cm 3/g,上限進而更佳為1.9 cm 3/g。 The expansion ratio of the second foamed resin layer is not particularly limited, provided it is lower than that of the first foamed resin layer. A preferred lower limit is 1.1 cm³ /g, and a preferred upper limit is 7 cm³ /g. If the expansion ratio is 1.1 cm³ /g or higher, the second foamed resin layer will possess suitable flexibility, further improving the gradient conformability and stress relief properties of the double-sided adhesive tape's two adhesive surfaces. If the expansion ratio is 7 cm³ /g or lower, the second foamed resin layer will have sufficient strength, further enhancing the tape's ability to hold shear and tilt loads, and further improving ease of application. The lower limit of the expansion ratio is more preferably 1.3 cm 3 /g, the upper limit is more preferably 5 cm 3 /g, the lower limit is further preferably 1.4 cm 3 /g, the upper limit is further preferably 2 cm 3 /g, the lower limit is further preferably 1.5 cm 3 /g, and the upper limit is further preferably 1.9 cm 3 /g.
上述第2發泡樹脂層之厚度並無特別限定,下限較佳為5 μm,上限較佳為100 μm。若上述厚度為5 μm以上,則雙面黏著帶對剪切負載及傾斜負載之保持力進一步提高。若上述厚度為100 μm以下,則雙面黏著帶之兩個黏著面之階差追隨性及應力緩和性進一步提高。上述厚度之下限更佳為10 μm,上限更佳為80 μm,下限進而較佳為30 μm,上限進而較佳為60 μm。The thickness of the second foamed resin layer is not particularly limited, but the lower limit is preferably 5 μm and the upper limit is preferably 100 μm. A thickness of 5 μm or greater further enhances the double-sided adhesive tape's holding power against shear and tilt loads. A thickness of 100 μm or less further enhances the tape's gradient tracking and stress relief properties on both adhesive surfaces. The lower limit of the thickness is more preferably 10 μm, the upper limit is more preferably 80 μm, the lower limit is further preferably 30 μm, and the upper limit is further preferably 60 μm.
上述發泡體基材(發泡體基材整體)之25%壓縮強度並無特別限定,下限較佳為1 kPa,上限較佳為200 kPa。若上述25%壓縮強度為1 kPa以上,則上述發泡體基材之強度充分增加,雙面黏著帶對剪切負載及傾斜負載之保持力進一步提高。若上述25%壓縮強度為200 kPa以下,則上述發泡體基材可具有適當之柔軟性,雙面黏著帶之兩個黏著面之階差追隨性及應力緩和性進一步提高。上述25%壓縮強度之下限更佳為10 kPa,上限更佳為100 kPa,下限進而較佳為20 kPa,上限進而較佳為40 kPa。 可藉由例如調整上述第1發泡樹脂層之發泡倍率等,將上述發泡體基材(發泡體基材整體)之25%壓縮強度調整至上述範圍內。 再者,可根據JIS K 6254:2016,使用例如島津製作所製造之「自動立體測圖儀AGS-X」等,按以下方式進行測定,從而求出25%壓縮強度。 將發泡體基材切割為20 mm×20 mm,並將其堆疊,製成厚度約為5 mm×20 mm×20 mm之樣品。將上述樣品以10 mm/min之速度沿壓縮方向壓扁,確認壓縮25%時之壓力(N)。利用下述式(2)從所得壓力算出25%壓縮強度。再者,當將上述樣品之厚度設為100時壓縮了25%(上述樣品之厚度變為75)時,定義為25%壓縮。 壓縮強度(kPa)=壓力(N)/0.4 (2) The 25% compressive strength of the foam substrate (the entire foam substrate) is not particularly limited, but the lower limit is preferably 1 kPa and the upper limit is preferably 200 kPa. If the 25% compressive strength is 1 kPa or greater, the strength of the foam substrate is sufficiently increased, further improving the double-sided adhesive tape's ability to hold shear and tilt loads. If the 25% compressive strength is 200 kPa or less, the foam substrate has appropriate flexibility, further improving the gradient tracking and stress relaxation properties of the two adhesive surfaces of the double-sided adhesive tape. The lower limit of the 25% compressive strength is more preferably 10 kPa, the upper limit is more preferably 100 kPa, the lower limit is further preferably 20 kPa, and the upper limit is further preferably 40 kPa. The 25% compressive strength of the foam substrate (the entire foam substrate) can be adjusted to fall within the above range by, for example, adjusting the expansion ratio of the first foamed resin layer. Also, the 25% compressive strength can be determined by measuring in accordance with JIS K 6254:2016 using, for example, the "Automatic Stereograph AGS-X" manufactured by Shimadzu Corporation, using the following method. The foam substrate is cut into 20 mm x 20 mm pieces and stacked to form a sample approximately 5 mm x 20 mm x 20 mm thick. The sample was compressed at a speed of 10 mm/min in the compression direction, and the pressure (N) at 25% compression was determined. The 25% compression strength was calculated from the obtained pressure using the following formula (2). Furthermore, when the thickness of the sample was set to 100 and the sample was compressed by 25% (the thickness of the sample became 75), it was defined as 25% compression. Compression strength (kPa) = Pressure (N) / 0.4 (2)
上述發泡體基材(發泡體基材整體)之厚度並無特別限定,下限較佳為105 μm,上限較佳為2100 μm。若上述厚度為上述範圍內,則雙面黏著帶對剪切負載及傾斜負載之保持力進一步提高,且兩個黏著面之階差追隨性及應力緩和性亦進一步提高。上述厚度之下限更佳為310 μm,上限更佳為1580 μm,下限進而較佳為530 μm,上限進而較佳為1060 μm。The thickness of the foam substrate (the entire foam substrate) is not particularly limited, but the lower limit is preferably 105 μm and the upper limit is preferably 2100 μm. Within this range, the double-sided adhesive tape further improves its holding power against shear and oblique loads, and further enhances the gradient tracking and stress relief properties of the two adhesive surfaces. The lower limit of the thickness is more preferably 310 μm, the upper limit is more preferably 1580 μm, the lower limit is further preferably 530 μm, and the upper limit is further preferably 1060 μm.
上述發泡體基材中,上述第1發泡樹脂層之厚度與上述第2發泡樹脂層之厚度之比(上述第1發泡樹脂層之厚度/上述第2發泡樹脂層之厚度之值)並無特別限定,下限較佳為1.0,上限較佳為400。若上述厚度之比為上述範圍內,則雙面黏著帶對剪切負載及傾斜負載之保持力進一步提高,且兩個黏著面之階差追隨性及應力緩和性亦進一步提高。上述厚度之比之下限更佳為3,上限更佳為150,下限進而較佳為5,上限進而較佳為40。In the foam substrate, the ratio of the thickness of the first foamed resin layer to the thickness of the second foamed resin layer (the value of the thickness of the first foamed resin layer / the thickness of the second foamed resin layer) is not particularly limited, but the lower limit is preferably 1.0 and the upper limit is preferably 400. When the thickness ratio is within the above range, the double-sided adhesive tape further improves its holding power against shear loads and oblique loads, and the step-adjusting properties and stress relief properties of the two adhesive surfaces are also further improved. The lower limit of the thickness ratio is more preferably 3, the upper limit is more preferably 150, the lower limit is further preferably 5, and the upper limit is further preferably 40.
上述發泡體基材中,上述第1發泡樹脂層之發泡倍率與上述第2發泡樹脂層之發泡倍率之比(上述第1發泡樹脂層之發泡倍率/上述第2發泡樹脂層之發泡倍率之值)並無特別限定,下限較佳為1.3,上限較佳為100。若上述發泡倍率之比為上述範圍內,則雙面黏著帶對剪切負載及傾斜負載之保持力進一步提高,且兩個黏著面之階差追隨性及應力緩和性亦進一步提高。上述發泡倍率之比之下限更佳為3,上限更佳為50,下限進而較佳為8,上限進而較佳為20。In the foam substrate, the ratio of the expansion ratio of the first foamed resin layer to the expansion ratio of the second foamed resin layer (expansion ratio of the first foamed resin layer/expansion ratio of the second foamed resin layer) is not particularly limited, but the lower limit is preferably 1.3, and the upper limit is preferably 100. When the expansion ratio ratio is within this range, the double-sided adhesive tape further improves its holding power against shear loads and oblique loads, and the step-adjusting properties and stress relief properties of the two adhesive surfaces are also further improved. The lower limit of the expansion ratio ratio is more preferably 3, the upper limit is more preferably 50, the lower limit is further preferably 8, and the upper limit is further preferably 20.
製造上述發泡體基材之方法並無特別限定,可採用分別製作上述第1發泡樹脂層及上述第2發泡樹脂層,其後將該等壓接或經由黏著劑層等貼合之方法,但較佳方法為使用形成上述第1發泡樹脂層之發泡性組成物及形成上述第2發泡樹脂層之發泡性組成物進行多層擠出。若使用上述進行多層擠出之方法,則可不經由黏著劑層等而使上述第1發泡樹脂層及上述第2發泡樹脂層積層,從防止製造步驟複雜化之觀點考慮較佳。The method for producing the foam substrate is not particularly limited. The first and second foam resin layers may be produced separately and then pressed together or bonded together via an adhesive layer. However, a preferred method is to extrude the foam composition forming the first and second foam resin layers in multiple layers. This multi-layer extrusion method allows the first and second foam resin layers to be stacked without the use of an adhesive layer, which is preferred from the perspective of reducing the complexity of the production process.
上述進行多層擠出之方法並無特別限定,例如,首先,分別擠出形成上述第1發泡樹脂層之發泡性組成物與形成上述第2發泡樹脂層之發泡性組成物,然後使分別擠出之發泡性組成物以熔融狀態於模具內呈層狀合流,從而獲得由多個發泡性組成物所構成之層積層而成之積層片。形成上述第1發泡樹脂層之發泡性組成物及形成上述第2發泡樹脂層之發泡性組成物係例如如上所述之含有聚乙烯系樹脂及熱分解型發泡劑之組成物。藉由改變上述熱分解型發泡劑之種類及用量,可調整所得發泡樹脂層之發泡倍率。 其次,對所得積層片之至少一個表面照射游離輻射,使上述聚乙烯系樹脂交聯。藉由改變上述聚乙烯系樹脂之交聯度,可調整所得發泡樹脂層之發泡倍率。 進而,藉由加熱等使交聯後之積層片發泡,藉此,可獲得具有上述第1發泡樹脂層及上述第2發泡樹脂層之發泡體基材。藉由加熱等使交聯後之積層片發泡時及/或發泡後,可進行延伸。 The method for performing the multi-layer extrusion is not particularly limited. For example, the foamable composition forming the first foamable resin layer and the foamable composition forming the second foamable resin layer are first extruded separately, and then the separately extruded foamable compositions are combined in a molten state in layers within a mold to obtain a laminated sheet composed of multiple foamable compositions. The foamable composition forming the first foamable resin layer and the foamable composition forming the second foamable resin layer are, for example, compositions containing a polyethylene resin and a thermally decomposable foaming agent as described above. The expansion ratio of the resulting foamed resin layer can be adjusted by varying the type and amount of the thermally decomposable foaming agent. Next, at least one surface of the resulting laminate sheet is irradiated with ionizing radiation to crosslink the polyethylene resin. By varying the degree of crosslinking of the polyethylene resin, the expansion ratio of the resulting foamed resin layer can be adjusted. Furthermore, the crosslinked laminate sheet is foamed by heating, etc., thereby obtaining a foam substrate having the first foamed resin layer and the second foamed resin layer. The crosslinked laminate sheet, which is foamed by heating, etc., can be stretched during and/or after foaming.
上述黏著劑層積層於上述發泡體基材之兩個面上。再者,雙面之黏著劑層之樹脂構成、物性、厚度等可分別相同,亦可互不相同。The adhesive layer is deposited on both sides of the foam substrate. Furthermore, the resin composition, physical properties, thickness, etc. of the adhesive layers on both sides may be the same or different.
上述黏著劑層中之至少一者於180℃之儲存模數之下限為11000 Pa。再者,於此情形時,可使上述黏著劑層之兩面於180℃之儲存模數為此範圍內,亦可僅使一面於180℃之儲存模數為此範圍內。若上述於180℃之儲存模數為11000 Pa以上,則上述黏著劑層之體強度增加,可抑制上述黏著劑層受到剪切負載或傾斜負載時剝離。上述於180℃之儲存模數之下限較佳為13000 Pa,下限更佳為15000 Pa,下限進而較佳為20000 Pa。 上述於180℃之儲存模數之上限並無特別限定,上限較佳為50000 Pa。若上述於180℃之儲存模數為50000 Pa以下,則可抑制因上述黏著劑層之界面缺乏潤濕性而於受到剪切負載或傾斜負載時發生界面剝離。上述於180℃之儲存模數之上限更佳為40000 Pa,上限進而較佳為32000 Pa。 可藉由例如調整上述黏著劑層中所含丙烯酸共聚物之組成、重量平均分子量、分子量分佈(重量平均分子量/數量平均分子量)等,調整上述黏著劑層中所含交聯劑及黏著賦予樹脂之種類及數量,調整上述黏著劑層之凝膠分率等,將上述黏著劑層於180℃之儲存模數調整至上述範圍內。 再者,可使用黏彈性測定裝置(例如,Rheometrics公司製造之「Rheometrics Dynamic Analyze RDA-700」),於測定溫度-40~200℃、升溫速度3℃/分鐘、頻率10 Hz之條件下,求出於180℃之儲存模數。 The lower limit of the storage modulus at 180°C of at least one of the adhesive layers is 11,000 Pa. Furthermore, in this case, the storage modulus at 180°C of both sides of the adhesive layer may be within this range, or only one side may be within this range. If the storage modulus at 180°C is 11,000 Pa or greater, the bulk strength of the adhesive layer is increased, which can prevent the adhesive layer from peeling when subjected to shear or oblique loads. The lower limit of the storage modulus at 180°C is preferably 13,000 Pa, more preferably 15,000 Pa, and even more preferably 20,000 Pa. The upper limit of the storage modulus at 180°C is not particularly limited, but is preferably 50,000 Pa. If the storage modulus at 180°C is 50,000 Pa or less, interfacial delamination due to a lack of wettability at the interface of the adhesive layer under shear or oblique loads can be suppressed. The upper limit of the storage modulus at 180°C is more preferably 40,000 Pa, and even more preferably 32,000 Pa. The storage modulus of the adhesive layer at 180°C can be adjusted to within the above range by, for example, adjusting the composition, weight-average molecular weight, molecular weight distribution (weight-average molecular weight/number-average molecular weight) of the acrylic copolymer contained in the adhesive layer, adjusting the type and amount of the crosslinker and adhesion-imparting resin contained in the adhesive layer, and adjusting the gel fraction of the adhesive layer. Furthermore, the storage modulus at 180°C can be determined using a viscoelasticity measuring instrument (e.g., the "Rheometrics Dynamic Analyzer RDA-700" manufactured by Rheometrics) under the conditions of a measurement temperature of -40°C to 200°C, a heating rate of 3°C/minute, and a frequency of 10 Hz.
上述黏著劑層並無特別限定,例如可列舉:丙烯酸黏著劑層、橡膠系黏著劑層、胺酯黏著劑層、聚矽氧系黏著劑層等。其中,就對光、熱、水分等相對穩定,且可與各種被黏著體接著(被黏著體選擇性低)之方面而言,較佳為上述黏著劑層中之至少一者為丙烯酸黏著劑層。即,上述黏著劑層中之至少一者含有丙烯酸共聚物較佳。再者,於此情形時,上述黏著劑層可於雙面含有丙烯酸共聚物,亦可僅於單面含有丙烯酸共聚物。The adhesive layer is not particularly limited, and examples thereof include acrylic adhesives, rubber adhesives, urethane adhesives, and silicone adhesives. However, at least one of the adhesive layers is preferably an acrylic adhesive, given its relative stability to light, heat, and moisture, and its ability to adhere to a variety of adherends (with low adherend selectivity). Specifically, at least one of the adhesive layers preferably contains an acrylic copolymer. In this case, the adhesive layer may contain the acrylic copolymer on both sides or only on one side.
從提高初期黏性以改善低溫時之易貼附性之觀點出發,上述丙烯酸共聚物較佳為由包含丙烯酸丁酯及/或丙烯酸2-乙基己酯之單體混合物共聚而得。上述丙烯酸共聚物更佳為由包含丙烯酸丁酯及丙烯酸2-乙基己酯之單體混合物共聚而得。 所有單體混合物中所占之上述丙烯酸丁酯之含量下限較佳為30重量%,上限較佳為80重量%。藉由使上述丙烯酸丁酯之含量為此範圍內,可兼顧高黏著力及黏性。 所有單體混合物中所占之上述丙烯酸2-乙基己酯之含量下限較佳為10重量%,上限較佳為100重量%,下限更佳為30重量%,上限更佳為80重量%,下限進而較佳為50重量%,上限進而較佳為60重量%。藉由使上述丙烯酸2-乙基己酯之含量為此範圍內,可表現出高黏著力。 To enhance initial tack and improve low-temperature adhesion, the acrylic copolymer is preferably obtained by copolymerizing a monomer mixture containing butyl acrylate and/or 2-ethylhexyl acrylate. More preferably, the acrylic copolymer is obtained by copolymerizing a monomer mixture containing butyl acrylate and 2-ethylhexyl acrylate. The butyl acrylate content in the total monomer mixture is preferably 30% by weight at the lower limit and 80% by weight at the upper limit. By maintaining the butyl acrylate content within this range, both high adhesion and tack can be achieved. The 2-ethylhexyl acrylate content in the total monomer mixture is preferably 10% by weight at the lower limit and 100% by weight at the upper limit, more preferably 30% by weight at the lower limit, more preferably 80% by weight at the upper limit, further preferably 50% by weight at the lower limit, and further preferably 60% by weight at the upper limit. By keeping the 2-ethylhexyl acrylate content within this range, high adhesion can be achieved.
上述單體混合物視需要可含有除丙烯酸丁酯及丙烯酸2-乙基己酯以外之可共聚之其他聚合性單體。作為上述可共聚之其他聚合性單體,例如可列舉:烷基之碳數為1~3之(甲基)丙烯酸烷基酯、烷基之碳數為13~18之(甲基)丙烯酸烷基酯、官能性單體等。 作為上述烷基之碳數為1~3之(甲基)丙烯酸烷基酯,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯等。作為上述烷基之碳數為13~18之(甲基)丙烯酸烷基酯,例如可列舉:甲基丙烯酸十三烷基酯、(甲基)丙烯酸硬脂酯等。作為上述官能性單體,例如可列舉:(甲基)丙烯酸羥烷基酯、甘油二甲基丙烯酸酯、(甲基)丙烯酸縮水甘油酯、2-甲基丙烯醯氧基乙基異氰酸酯、(甲基)丙烯酸、伊康酸、順丁烯二酸酐、巴豆酸、順丁烯二酸、反丁烯二酸等。 其中,從提高上述黏著劑層於180℃之儲存模數及體強度之觀點出發,較佳為(甲基)丙烯酸羥烷基酯、甘油二甲基丙烯酸酯等含羥基單體。即,上述丙烯酸共聚物較佳為具有來自含羥基單體之結構單元。上述(甲基)丙烯酸羥烷基酯並無特別限定,更具體而言,例如可列舉(甲基)丙烯酸2-羥基乙酯等。 The monomer mixture may optionally contain other copolymerizable monomers in addition to butyl acrylate and 2-ethylhexyl acrylate. Examples of such other copolymerizable monomers include alkyl (meth)acrylates having an alkyl group with 1-3 carbon atoms, alkyl (meth)acrylates having an alkyl group with 13-18 carbon atoms, and functional monomers. Examples of such alkyl (meth)acrylates having an alkyl group with 1-3 carbon atoms include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, and isopropyl (meth)acrylate. Examples of such alkyl (meth)acrylates having an alkyl group with 13-18 carbon atoms include tridecyl methacrylate and stearyl (meth)acrylate. Examples of the functional monomers include hydroxyalkyl (meth)acrylates, glycerol dimethacrylate, glycidyl (meth)acrylate, 2-methacryloyloxyethyl isocyanate, (meth)acrylic acid, itaconic acid, maleic anhydride, crotonic acid, maleic acid, and fumaric acid. Among these, hydroxyalkyl (meth)acrylates and glycerol dimethacrylate are preferred from the perspective of improving the storage modulus and bulk strength of the adhesive layer at 180°C. In other words, the acrylic copolymer preferably contains structural units derived from hydroxyl-containing monomers. The hydroxyalkyl (meth)acrylate is not particularly limited; more specifically, examples include 2-hydroxyethyl (meth)acrylate.
為使上述單體混合物共聚以獲得上述丙烯酸共聚物,可於聚合起始劑之存在下使上述單體混合物發生自由基反應。作為使上述單體混合物發生自由基反應之方法,即聚合方法,可採用先前公知之方法,例如可列舉:溶液聚合(沸點聚合或恆溫聚合)、乳化聚合、懸浮聚合、塊狀聚合等。To copolymerize the monomer mixture to obtain the acrylic copolymer, the monomer mixture may be subjected to a free radical reaction in the presence of a polymerization initiator. The free radical reaction of the monomer mixture, i.e., the polymerization method, may be a conventionally known method, such as solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, or bulk polymerization.
上述丙烯酸共聚物之重量平均分子量(Mw)之下限較佳為50萬。若上述丙烯酸共聚物之重量平均分子量為50萬以上,則上述黏著劑層於180℃之儲存模數及體強度增加,可抑制上述黏著劑層受到剪切負載或傾斜負載時剝離。上述重量平均分子量之下限更佳為60萬,下限進而較佳為80萬,下限進而更佳為100萬。 上述丙烯酸共聚物之重量平均分子量之上限並無特別限定,上限較佳為200萬。若上述丙烯酸共聚物之重量平均分子量為200萬以下,則可抑制因上述黏著劑層之界面缺乏潤濕性而於受到剪切負載或傾斜負載時發生界面剝離。上述丙烯酸共聚物之重量平均分子量之上限更佳為190萬,上限進而較佳為180萬,上限進而更佳為175萬。 再者,所謂重量平均分子量(Mw),係指藉由GPC(Gel Permeation Chromatography,凝膠滲透層析法)測得之標準聚苯乙烯換算之重量平均分子量。 The lower limit of the weight-average molecular weight (Mw) of the acrylic copolymer is preferably 500,000. When the weight-average molecular weight of the acrylic copolymer is 500,000 or greater, the storage modulus and bulk strength of the adhesive layer at 180°C are increased, thereby suppressing delamination of the adhesive layer under shear or oblique loads. The lower limit of the weight-average molecular weight is more preferably 600,000, more preferably 800,000, and even more preferably 1,000,000. The upper limit of the weight-average molecular weight of the acrylic copolymer is not particularly limited, but is preferably 2,000,000. When the weight-average molecular weight of the acrylic copolymer is 2,000,000 or less, delamination of the adhesive layer under shear or oblique loads due to a lack of wettability at the interface can be suppressed. The upper limit of the weight-average molecular weight of the acrylic copolymer is more preferably 1.9 million, further preferably 1.8 million, and even more preferably 1.75 million. The weight-average molecular weight (Mw) refers to the weight-average molecular weight in terms of standard polystyrene as measured by GPC (Gel Permeation Chromatography).
上述丙烯酸共聚物之重量平均分子量(Mw)相對於數量平均分子量(Mn)之比(Mw/Mn)的下限較佳為1.05,上限較佳為5.0。若Mw/Mn為5.0以下,則低分子成分之比率受到抑制,上述黏著劑層於180℃之儲存模數及體強度增加,可抑制上述黏著劑層受到剪切負載或傾斜負載時剝離。Mw/Mn之上限更佳為4.5,上限進而較佳為4,上限進而更佳為3.5。The ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of the acrylic copolymer (Mw/Mn) preferably has a lower limit of 1.05 and an upper limit of 5.0. When Mw/Mn is 5.0 or less, the proportion of low-molecular-weight components is suppressed, increasing the storage modulus and bulk strength of the adhesive layer at 180°C, thereby suppressing delamination of the adhesive layer under shear or oblique loads. The upper limit of Mw/Mn is more preferably 4.5, more preferably 4, and even more preferably 3.5.
從上述黏著劑層中之至少一者表現出高黏著力之觀點出發,較佳為含有黏著賦予樹脂。再者,於此情形時,上述黏著劑層可於雙面含有黏著賦予樹脂,亦可僅於單面含有黏著賦予樹脂。 作為上述黏著賦予樹脂,例如可列舉:松香系樹脂、松香酯系樹脂、氫化松香系樹脂、萜烯系樹脂、萜烯酚系樹脂、苯并呋喃-茚系樹脂、脂環族飽和烴系樹脂、C5系石油樹脂、C9系石油樹脂、C5-C9共聚系石油樹脂等。該等黏著賦予樹脂可單獨使用,亦可併用2種以上。其中,較佳為松香系樹脂或萜烯系樹脂,更佳為含羥基之松香系樹脂或萜烯系樹脂。 From the perspective of ensuring that at least one of the adhesive layers exhibits high adhesion, it is preferred that the adhesive layer contain a tackifying resin. Furthermore, in this case, the adhesive layer may contain the tackifying resin on both sides or only on one side. Examples of the tackifying resins include rosin resins, rosin ester resins, hydrogenated rosin resins, terpene resins, terpene phenol resins, benzofuran-indene resins, alicyclic saturated hydrocarbon resins, C5 petroleum resins, C9 petroleum resins, and C5-C9 copolymer petroleum resins. These tackifying resins may be used alone or in combination. Among them, rosin-based resins or terpene-based resins are preferred, and hydroxyl-containing rosin-based resins or terpene-based resins are more preferred.
上述黏著賦予樹脂之軟化溫度之下限較佳為70℃,上限較佳為170℃。若上述軟化溫度為70℃以上,則可抑制上述黏著劑層變得過於柔軟而對剪切負載及傾斜負載之保持力降低。若上述軟化溫度為170℃以下,則可抑制因上述黏著劑層之界面缺乏潤濕性而於受到剪切負載或傾斜負載時發生界面剝離。上述軟化溫度之下限更佳為120℃。 再者,所謂軟化溫度,係指藉由JIS K2207環球法測得之軟化溫度。 The softening temperature of the adhesion-imparting resin is preferably 70°C (lower limit) and 170°C (upper limit). A softening temperature of 70°C or higher prevents the adhesive layer from becoming excessively soft and reducing its holding power against shear and tilt loads. A softening temperature of 170°C or lower prevents interfacial delamination under shear or tilt loads due to a lack of wettability at the adhesive layer interface. The lower limit of the softening temperature is more preferably 120°C. The softening temperature is the softening temperature measured by the JIS K2207 global method.
上述黏著賦予樹脂之羥值之下限較佳為25。藉由使上述羥值為上述值以上,可抑制上述黏著劑層之界面因相互作用不良而於受到剪切負載或傾斜負載時發生界面剝離。上述羥值之下限更佳為30。上述羥值之上限並無特別限定。 再者,羥值可藉由JIS K1557(鄰苯二甲酸酐法)測定。 The lower limit of the hydroxyl value of the adhesion-imparting resin is preferably 25. By setting the hydroxyl value above this value, interfacial delamination of the adhesive layer due to poor interaction under shear or oblique loads can be suppressed. The lower limit of the hydroxyl value is more preferably 30. The upper limit of the hydroxyl value is not particularly limited. The hydroxyl value can be measured according to JIS K1557 (phthalic anhydride method).
上述黏著賦予樹脂之含量並無特別限定,相對於上述丙烯酸共聚物100重量份,下限較佳為10重量份,上限較佳為40重量份。若上述黏著賦予樹脂之含量為10重量份以上,則上述黏著劑層之黏著力提高。若上述黏著賦予樹脂之含量為40重量份以下,則可抑制上述黏著劑層變得過硬而黏著力降低之情況。The content of the tackifier resin is not particularly limited, but the lower limit is preferably 10 parts by weight and the upper limit is preferably 40 parts by weight relative to 100 parts by weight of the acrylic copolymer. If the content of the tackifier resin is 10 parts by weight or greater, the adhesive strength of the adhesive layer is enhanced. If the content of the tackifier resin is 40 parts by weight or less, the adhesive layer can be prevented from becoming too hard and thus reducing its adhesive strength.
上述黏著劑層中之至少一者較佳為藉由添加交聯劑,而於構成上述黏著劑層之樹脂(例如,上述丙烯酸共聚物、上述黏著賦予樹脂等)之主鏈間形成交聯結構。再者,於此情形時,可於上述黏著劑層之雙面添加交聯劑,亦可僅於單面添加交聯劑。藉由調整上述交聯劑之種類及用量,而容易調整上述黏著劑層於180℃之儲存模數及凝膠分率。 上述交聯劑並無特別限定,例如可列舉:異氰酸酯系交聯劑、氮丙啶系交聯劑、環氧系交聯劑、金屬螯合型交聯劑等。其中,異氰酸酯系交聯劑較佳。 相對於上述丙烯酸共聚物100重量份,上述交聯劑之添加量之下限較佳為0.01重量份,上限較佳為10重量份,下限更佳為0.1重量份,上限更佳為3重量份。 At least one of the adhesive layers preferably includes a crosslinking agent, forming a crosslinked structure between the main chains of the resin comprising the adhesive layer (e.g., the acrylic copolymer, the adhesion-imparting resin, etc.). Furthermore, in this case, the crosslinking agent may be added to both sides of the adhesive layer, or only to one side. By adjusting the type and amount of the crosslinking agent, the storage modulus and gel fraction of the adhesive layer at 180°C can be easily adjusted. The crosslinking agent is not particularly limited, and examples thereof include isocyanate crosslinkers, aziridine crosslinkers, epoxy crosslinkers, and metal chelate crosslinkers. Isocyanate-based crosslinking agents are preferred. The lower limit of the amount of the crosslinking agent added relative to 100 parts by weight of the acrylic copolymer is preferably 0.01 parts by weight, and the upper limit is preferably 10 parts by weight. The lower limit is more preferably 0.1 parts by weight, and the upper limit is more preferably 3 parts by weight.
出於提高黏著力之目的,上述黏著劑層可含有矽烷偶合劑。上述矽烷偶合劑並無特別限定,例如可列舉:環氧矽烷類、丙烯酸矽烷類、甲基丙烯酸矽烷類、胺基矽烷類、異氰酸酯矽烷類等。To improve adhesion, the adhesive layer may contain a silane coupling agent. The silane coupling agent is not particularly limited, and examples thereof include epoxy silanes, acrylic silanes, methacrylic silanes, amino silanes, and isocyanate silanes.
出於賦予遮光性之目的,上述黏著劑層可含有著色材料。上述著色材料並無特別限定,例如可列舉:碳黑、苯胺黑、氧化鈦等。其中,就相對價廉且化學性質穩定而言,較佳為碳黑。To impart light-shielding properties, the adhesive layer may contain a coloring material. The coloring material is not particularly limited, and examples thereof include carbon black, aniline black, and titanium oxide. Carbon black is particularly preferred due to its relative low cost and chemical stability.
上述黏著劑層可視需要含有無機微粒子、導電微粒子、抗氧化劑、發泡劑、有機填充劑、無機填充劑等先前公知之微粒子及添加劑。The adhesive layer may contain inorganic particles, conductive particles, antioxidants, foaming agents, organic fillers, inorganic fillers and other previously known particles and additives as needed.
上述黏著劑層中之至少一者之凝膠分率之下限較佳為15重量%。再者,於此情形時,可使上述黏著劑層之兩面之凝膠分率為此範圍內,亦可僅使一面之凝膠分率為此範圍內。若上述凝膠分率為15重量%以上,則上述黏著劑層於180℃之儲存模數及體強度增加,可抑制上述黏著劑層因受到剪切負載或傾斜負載而剝離。上述凝膠分率之下限更佳為30重量%,下限進而較佳為40重量%。 上述凝膠分率之上限並無特別限定,上限較佳為80重量%。若上述凝膠分率為80重量%以下,則可抑制因上述黏著劑層之界面缺乏潤濕性而於受到剪切負載或傾斜負載時剝離。上述凝膠分率之上限更佳為75重量%,上限進而較佳為70重量%,上限進而更佳為65重量%。 再者,黏著劑層之凝膠分率可藉由以下方法測定。 將雙面黏著帶裁剪成50 mm×100 mm之平面矩形狀,製作試驗片。將試驗片於乙酸乙酯中於23℃浸漬24小時後,從乙酸乙酯中取出,於110℃之條件下乾燥1小時。測定乾燥後之試驗片之重量,利用下述式(1)算出凝膠分率。再者,試驗片使用未積層有用於保護黏著劑層之脫模膜者。 凝膠分率(重量%)=100×(W 2-W 0)/(W 1-W 0) (1) (W 0:發泡體基材之重量;W 1:浸漬前之試驗片之重量;W 2:浸漬、乾燥後之試驗片之重量) The lower limit of the gel fraction of at least one of the adhesive layers is preferably 15% by weight. Furthermore, in this case, the gel fraction of both sides of the adhesive layer may be within this range, or only one side may be within this range. If the gel fraction is 15% by weight or greater, the storage modulus and bulk strength of the adhesive layer at 180°C increase, thereby suppressing peeling of the adhesive layer due to shear or oblique loads. The lower limit of the gel fraction is more preferably 30% by weight, and the lower limit is further preferably 40% by weight. There is no particular upper limit to the gel fraction, but the upper limit is preferably 80% by weight. If the gel fraction is 80% by weight or less, it is possible to suppress peeling of the adhesive layer when subjected to a shear load or an oblique load due to the lack of wettability at the interface of the adhesive layer. The upper limit of the gel fraction is preferably 75% by weight, the upper limit is further preferably 70% by weight, and the upper limit is further preferably 65% by weight. Furthermore, the gel fraction of the adhesive layer can be measured by the following method. A double-sided adhesive tape is cut into a flat rectangular shape of 50 mm × 100 mm to prepare a test piece. After the test piece is immersed in ethyl acetate at 23°C for 24 hours, it is taken out of ethyl acetate and dried at 110°C for 1 hour. The weight of the dried test piece is measured, and the gel fraction is calculated using the following formula (1). Furthermore, the test piece used was not coated with a release film for protecting the adhesive layer. Gel fraction (weight %) = 100 × (W 2 - W 0 ) / (W 1 - W 0 ) (1) (W 0 : weight of the foam substrate; W 1 : weight of the test piece before immersion; W 2 : weight of the test piece after immersion and drying)
上述黏著劑層之厚度並無特別限定,一側黏著劑層之厚度之下限較佳為20 μm,上限較佳為100 μm。若上述黏著劑層之厚度為20 μm以上,則上述黏著劑層具有充足之黏著力。若上述黏著劑層之厚度為100 μm以下,則上述發泡體基材之應力緩和性亦可對雙面黏著帶整體之應力緩和性有充分貢獻。上述黏著劑層之厚度之下限更佳為25 μm,上限更佳為80 μm,下限進而較佳為30 μm,上限進而較佳為70 μm,下限進而更佳為35 μm,上限進而更佳為65 μm。 再者,可使用針盤測厚儀(例如,日本三豐公司製造,「ABS Digimatic Indicator」)測定黏著劑層之厚度。 The thickness of the adhesive layer is not particularly limited. The lower limit of the thickness of the adhesive layer on one side is preferably 20 μm, and the upper limit is preferably 100 μm. If the thickness of the adhesive layer is 20 μm or greater, the adhesive layer will have sufficient adhesion. If the thickness of the adhesive layer is 100 μm or less, the stress-relieving properties of the foam substrate will fully contribute to the stress-relieving properties of the double-sided adhesive tape as a whole. The lower limit of the thickness of the adhesive layer is more preferably 25 μm, the upper limit is more preferably 80 μm, the lower limit is further preferably 30 μm, the upper limit is further preferably 70 μm, the lower limit is further preferably 35 μm, and the upper limit is further preferably 65 μm. Alternatively, you can use a needle-plate thickness gauge (e.g., the "ABS Digimatic Indicator" manufactured by Mitutoyo Corporation of Japan) to measure the thickness of the adhesive layer.
本發明之雙面黏著帶可視需要含有除上述發泡體基材及上述黏著劑層以外之其他層。The double-sided adhesive tape of the present invention may contain other layers in addition to the foam substrate and the adhesive layer as needed.
本發明之雙面黏著帶於拉伸試驗中從初始之抓持夾具間距離伸長5 mm時,其強度之下限較佳為1.5 N。若上述強度為1.5 N以上,則雙面黏著帶對剪切負載及傾斜負載之保持力進一步提高,且貼附時之操作性亦進一步提高。上述強度之下限更佳為1.7 N,下限進而較佳為2.2 N。 可藉由例如將上述第2發泡樹脂層之發泡倍率調整至合適範圍以提高上述第2發泡樹脂層之強度等,而將上述強度調整至上述範圍內。 再者,於拉伸試驗中從初始之抓持夾具間距離伸長5 mm時之強度可按照JIS K 7161之方法進行測定。具體而言,例如,使用高分子計器公司製造之沖裁刀片「拉伸3號型啞鈴狀」等,將雙面黏著帶沖裁成啞鈴狀,以製作試驗片。使用例如島津製作所製造之「Autograph AGS-X」等,於25℃及相對濕度50%,以拉伸速度50 mm/min拉伸所得試驗片。此時,初始之抓持夾具間距離設為60 mm,讀取由此伸長5 mm時(抓持夾具間距離為65 mm)之強度。 The double-sided adhesive tape of the present invention preferably has a lower limit of strength of 1.5 N when stretched 5 mm from the initial gripping distance during a tensile test. A strength of 1.5 N or greater further enhances the tape's ability to hold shear and tilt loads, and also improves ease of application. The lower limit of this strength is more preferably 1.7 N, and even more preferably 2.2 N. The strength can be adjusted to within this range by, for example, adjusting the expansion ratio of the second foamed resin layer to an appropriate range to increase the strength of the second foamed resin layer. Furthermore, the strength when stretched 5 mm from the initial gripping distance during a tensile test can be measured according to JIS K 7161. Specifically, a double-sided adhesive tape is punched into a matte-bell shape using a punching blade such as the "Stretching Type 3 Dumbbell" manufactured by Kobunsu Keiki Co., Ltd. to produce a test piece. The resulting test piece is then stretched at a rate of 50 mm/min at 25°C and a relative humidity of 50% using a gauge such as the "Autograph AGS-X" manufactured by Shimadzu Corporation. The initial gripper distance is set to 60 mm, and the strength is measured at a 5 mm elongation (at a gripper distance of 65 mm).
本發明之雙面黏著帶之25%壓縮強度並無特別限定,下限較佳為20 kPa,上限較佳為70 kPa。若上述25%壓縮強度為20 kPa以上,則雙面黏著帶對剪切負載及傾斜負載之保持力進一步提高。若上述25%壓縮強度為70 kPa以下,則雙面黏著帶之兩個黏著面之階差追隨性及應力緩和性進一步提高。上述25%壓縮強度之下限更佳為25 kPa,下限進而較佳為27 kPa,下限尤佳為30 kPa。上述25%壓縮強度之上限更佳為65 kPa,上限進而較佳為60 kPa,上限尤佳為40 kPa。 本發明之雙面黏著帶之25%壓縮強度可與發泡體基材之25%壓縮強度同樣地根據JIS K 6254:2016來測定。 The 25% compressive strength of the double-sided adhesive tape of the present invention is not particularly limited, but the lower limit is preferably 20 kPa, and the upper limit is preferably 70 kPa. If the 25% compressive strength is 20 kPa or greater, the double-sided adhesive tape's holding power against shear loads and tilt loads is further improved. If the 25% compressive strength is 70 kPa or less, the tape's gradient tracking and stress relaxation properties are further improved between the two adhesive surfaces. The lower limit of the 25% compressive strength is more preferably 25 kPa, further preferably 27 kPa, and even more preferably 30 kPa. The upper limit of the 25% compressive strength is more preferably 65 kPa, further preferably 60 kPa, and even more preferably 40 kPa. The 25% compressive strength of the double-sided adhesive tape of the present invention can be measured in accordance with JIS K 6254:2016, similar to the 25% compressive strength of the foam substrate.
本發明之雙面黏著帶中,對將上述第1發泡樹脂層切片而成之樣品進行23℃拉伸試驗時之拉伸斷裂強度較佳為2 N以上。若上述拉伸斷裂強度為2 N以上,則常溫下雙面黏著帶可表現出更加優異之重工性。上述拉伸斷裂強度更佳為3 N以上,進而較佳為4 N以上。 上述拉伸斷裂強度之上限並無特別限定,從階差追隨性及應力緩和性之觀點出發,上限較佳為20 N,上限進而較佳為15 N。 In the double-sided adhesive tape of the present invention, a sample sliced from the first foamed resin layer preferably has a tensile strength at break of 2 N or greater in a 23°C tensile test. A tensile strength of 2 N or greater allows the double-sided adhesive tape to exhibit superior workability at room temperature. The tensile strength at break is more preferably 3 N or greater, and even more preferably 4 N or greater. The upper limit of the tensile strength at break is not particularly limited; however, from the perspectives of gradient tracking and stress relaxation, the upper limit is preferably 20 N, and even more preferably 15 N.
本發明之雙面黏著帶中,對將上述第1發泡樹脂層切片而成之樣品進行23℃拉伸試驗時之拉伸斷裂伸長較佳為30 mm以上。若上述拉伸斷裂伸長為30 mm以上,則常溫時雙面黏著帶可表現出更加優異之重工性。上述拉伸斷裂伸長更佳為50 mm以上,進而較佳為70 mm以上。 上述拉伸斷裂伸長之上限並無特別限定,從表現出對剪切負載及傾斜負載之保持力之觀點出發,上限較佳為200 mm。 In the double-sided adhesive tape of the present invention, the tensile elongation at break of a sample sliced from the first foamed resin layer in a 23°C tensile test is preferably 30 mm or greater. A tensile elongation at break of 30 mm or greater allows the double-sided adhesive tape to exhibit superior workability at room temperature. The tensile elongation at break is more preferably 50 mm or greater, and even more preferably 70 mm or greater. The upper limit of the tensile elongation at break is not particularly limited; however, from the perspective of demonstrating holding power against shear loads and tilt loads, the upper limit is preferably 200 mm.
對將上述第1發泡樹脂層切片而成之樣品進行23℃拉伸試驗之方法如下所述。 將雙面黏著帶切成啞鈴3號(中心寬度5 mm)之大小,用羽毛刀片將第1發泡樹脂層(中心部分)切片。藉此,獲得「黏著劑層/第2發泡樹脂層/第1發泡樹脂層(大約一半厚度)」之樣品。 使用島津製作所製造之「Autograph AGS-X」,於溫度23℃、抓持夾具間距離45 mm,以拉伸速度100 mm/min對各樣品進行拉伸試驗。以樣品斷裂時之強度作為拉伸斷裂強度,以樣品斷裂時之伸長作為拉伸斷裂伸長。 The following method was used to perform a 23°C tensile test on samples obtained by slicing the first foamed resin layer. Double-sided adhesive tape was cut into matte #3 slices (5 mm center width). The first foamed resin layer (center portion) was sliced using a feather blade. This yielded a sample consisting of "adhesive layer/second foamed resin layer/first foamed resin layer (approximately half the thickness)." Tensile testing was performed on each sample using a Shimadzu Autograph AGS-X at a temperature of 23°C, a gripper distance of 45 mm, and a tensile speed of 100 mm/min. The tensile strength at break was determined as the strength at break, and the elongation at break was determined as the elongation at break.
本發明之雙面黏著帶中,對將上述第1發泡樹脂層切片而成之樣品進行80℃拉伸試驗時之拉伸斷裂強度較佳為1 N以上。若上述拉伸斷裂強度為1 N以上,則高溫下雙面黏著帶可表現出更加優異之重工性。上述拉伸斷裂強度更佳為1.5 N以上。 上述拉伸斷裂強度之上限並無特別限定,從階差追隨性及應力緩和性之觀點出發,上限較佳為10 N。 In the double-sided adhesive tape of the present invention, a sample sliced from the first foamed resin layer preferably exhibits a tensile strength at break of 1 N or greater in a tensile test at 80°C. A tensile strength of 1 N or greater allows the double-sided adhesive tape to exhibit superior workability at high temperatures. The tensile strength at break is more preferably 1.5 N or greater. The upper limit of the tensile strength at break is not particularly limited; however, from the perspectives of gradient tracking and stress relaxation, the upper limit is preferably 10 N.
本發明之雙面黏著帶中,對將上述第1發泡樹脂層切片而成之樣品進行80℃拉伸試驗時之拉伸斷裂強度降低率較佳為70%以下。若上述拉伸斷裂強度降低率為70%以下,則高溫下雙面黏著帶可表現出更加優異之重工性。上述拉伸斷裂強度降低率更佳為60%以下。 上述拉伸斷裂強度降低率之下限並無特別限定,以較低為佳,實質下限為10%左右。 In the double-sided adhesive tape of the present invention, the reduction in tensile strength at break of a sample sliced from the first foamed resin layer in an 80°C tensile test is preferably 70% or less. A reduction in tensile strength at break of 70% or less allows the double-sided adhesive tape to exhibit superior workability at high temperatures. The reduction in tensile strength at break is more preferably 60% or less. The lower limit of the reduction in tensile strength at break is not particularly limited; a lower value is preferred, with a practical lower limit being approximately 10%.
對將上述第1發泡樹脂層切片而成之樣品進行80℃拉伸試驗之方法如下所述。 將雙面黏著帶切成5 mm大小之短條狀,用羽毛刀片將第1發泡樹脂層(中心部分)切片。藉此,獲得「黏著劑層/第2發泡樹脂層/第1發泡樹脂層(大約一半厚度)」之樣品。 使用島津製作所製造之「Autograph AGS-X」,於溫度80℃、抓持夾具間距離10 mm,以拉伸速度100 mm/min對各樣品進行拉伸試驗。再者,以10 mm之抓持夾具間距離設置樣品後,於80℃之環境下放置5分鐘後開始測定。以樣品斷裂時之強度作為拉伸斷裂強度。又,算出1-(於80℃之拉伸斷裂強度/於23℃之拉伸斷裂強度)之值作為拉伸斷裂強度降低率。 The 80°C tensile test method for samples sliced from the first foamed resin layer is as follows. The double-sided adhesive tape was cut into 5 mm strips, and the first foamed resin layer (center portion) was sliced with a feather blade. This yielded a sample consisting of "adhesive layer/second foamed resin layer/first foamed resin layer (approximately half the thickness)." Tensile tests were conducted on each sample using a Shimadzu Autograph AGS-X at 80°C, a gripper gap of 10 mm, and a tensile speed of 100 mm/min. After the sample was set at a gripper gap of 10 mm, it was placed in an 80°C environment for 5 minutes before the measurement began. The strength at which the sample breaks is taken as the tensile fracture strength. Furthermore, the tensile fracture strength reduction rate is calculated as 1 - (tensile fracture strength at 80°C / tensile fracture strength at 23°C).
本發明之雙面黏著帶之厚度並無特別限定,下限較佳為100 μm,上限較佳為3000 μm。若上述厚度為100 μm以上,則雙面黏著帶具有充足之黏著力,又,亦具有充足之應力緩和性。若上述厚度為3000 μm以下,則可利用雙面黏著帶充分實現接著及固定,又,其兩個黏著面亦具有充足之階差追隨性。上述厚度之下限更佳為250 μm,上限更佳為1600 μm,下限進而較佳為350 μm,上限進而較佳為1500 μm,下限進而更佳為500 μm,上限進而更佳為1300 μm。The thickness of the double-sided adhesive tape of the present invention is not particularly limited, and the lower limit is preferably 100 μm, and the upper limit is preferably 3000 μm. If the thickness is 100 μm or more, the double-sided adhesive tape has sufficient adhesion and also has sufficient stress relief. If the thickness is 3000 μm or less, the double-sided adhesive tape can be fully used for connection and fixation, and its two adhesive surfaces also have sufficient step tracking properties. The lower limit of the thickness is more preferably 250 μm, the upper limit is more preferably 1600 μm, the lower limit is further preferably 350 μm, the upper limit is further preferably 1500 μm, the lower limit is further preferably 500 μm, and the upper limit is further preferably 1300 μm.
作為本發明之雙面黏著帶之製造方法,例如可列舉以下方法。 首先,將溶劑添加至丙烯酸共聚物、黏著賦予劑、交聯劑等中,製作黏著劑A之溶液。將該黏著劑A之溶液塗佈於脫模膜之脫模處理面,並乾燥除去溶液中之溶劑,藉此形成黏著劑層。利用橡膠輥等進行加壓,將該黏著劑層貼合於發泡體基材之表面。以相同方式,將黏著劑層亦貼合於發泡體基材之另一面,可獲得發泡體基材之兩面具有黏著劑層、且黏著劑層之表面覆蓋有脫模膜之雙面黏著帶。 The following method can be used to produce the double-sided adhesive tape of the present invention. First, a solvent is added to an acrylic copolymer, an adhesive imparting agent, a crosslinking agent, etc. to prepare an adhesive A solution. This adhesive A solution is applied to the release-treated surface of a release film and dried to remove the solvent, thereby forming an adhesive layer. The adhesive layer is then applied to the surface of a foam substrate using pressure using a rubber roller or the like. Similarly, the adhesive layer is applied to the other side of the foam substrate, resulting in a double-sided adhesive tape having adhesive layers on both sides of the foam substrate and a release film covering the adhesive layer surface.
本發明之雙面黏著帶之應用並無特別限定,例如,用於固定電子機器中之零件。上述電子機器並無特別限定,例如可列舉:電視、螢幕、可攜式電子機器、車載電子機器等。 其中,本發明之雙面黏著帶適用於固定電視、螢幕等顯示裝置中之零件,尤其是相對大型之顯示裝置中之零件,具體而言,例如,用於將上述顯示裝置中之表面蓋板固定於殼體。由於本發明之雙面黏著帶可對剪切負載及傾斜負載表現出高保持力,因此亦可適用於在相對大型之顯示裝置中利用寬度窄之雙面黏著帶固定零件之情形。本發明之雙面黏著帶可具有窄寬度,且其寬度並無特別限定,下限較佳為0.5 mm,上限較佳為20 mm,下限更佳為1 mm,上限更佳為5 mm。於該等應用中,本發明之雙面黏著帶之形狀並無特別限定,可列舉矩形、邊框狀、圓形、橢圓形、圓環狀等。 又,本發明之雙面黏著帶亦可用於車輛用內裝構件、家電(例如,電視、螢幕、空調、冰箱等)之內外裝構件等。 [發明之效果] The double-sided adhesive tape of the present invention has no particular application limitations. For example, it can be used to secure components in electronic devices. Examples of such electronic devices include televisions, monitors, portable electronic devices, and in-vehicle electronic devices. The double-sided adhesive tape of the present invention is particularly suitable for securing components in display devices such as televisions and monitors, particularly those in relatively large display devices. Specifically, it can be used to secure the surface cover of such display devices to the housing. Because the double-sided adhesive tape of the present invention exhibits high holding force against shear and tilt loads, it is also suitable for securing components in relatively large display devices using a narrow double-sided adhesive tape. The double-sided adhesive tape of the present invention can have a narrow width, and its width is not particularly limited. The lower limit is preferably 0.5 mm, the upper limit is preferably 20 mm, the lower limit is more preferably 1 mm, and the upper limit is more preferably 5 mm. In these applications, the shape of the double-sided adhesive tape of the present invention is not particularly limited, and can be rectangular, frame-shaped, circular, elliptical, or ring-shaped. Furthermore, the double-sided adhesive tape of the present invention can also be used for vehicle interior components and interior and exterior components of home appliances (e.g., televisions, monitors, air conditioners, refrigerators, etc.). [Effects of the Invention]
根據本發明,可提供一種雙面黏著帶,其兩個黏著面均具有高階差追隨性,可對剪切負載及傾斜負載表現出高保持力,至少一個黏著面具有優異之重工性,進而,於貼附時亦具有優異之操作性。According to the present invention, a double-sided adhesive tape can be provided, wherein both adhesive surfaces have high step tracking properties, can exhibit high holding force against shear loads and tilt loads, at least one adhesive surface has excellent workability, and further, also has excellent operability during attachment.
以下,將列舉實施例進一步詳細說明本發明之態樣,但本發明並非僅限於該等實施例。The following examples will be given to further illustrate the aspects of the present invention, but the present invention is not limited to these examples.
(製備丙烯酸共聚物A) 於具備溫度計、攪拌器、冷卻管之反應器中,添加乙酸乙酯159重量份、丙烯酸丁酯(BA)75重量份、丙烯酸2-乙基己酯(2EHA)25重量份、丙烯酸2-羥乙酯(HEA)0.1重量份及丙烯酸(AAc)5重量份作為溶劑。氮氣置換後,將反應器置於設定為60℃之水浴中,加熱反應器,開始回流。回流開始30分鐘後,於反應器中加入偶氮二異丁腈0.050重量份作為聚合起始劑,使其反應6小時。然後,於反應器內添加乙酸乙酯,進行稀釋並同時冷卻,藉此獲得丙烯酸共聚物A之溶液。 用四氫呋喃(THF)將所得丙烯酸共聚物A之溶液稀釋50倍,用過濾器(材質:聚四氟乙烯;孔徑:0.2 μm)過濾所得稀釋溶液。將所得濾液供給至凝膠滲透層析儀(Waters公司製造,2690 Separations Model),於樣品流量1毫升/分鐘、管柱溫度40℃之條件進行GPC測定,測定丙烯酸共聚物A之聚苯乙烯換算分子量,求出重量平均分子量(Mw)。重量平均分子量(Mw)為140萬。使用GPC KF-806L(昭和電工公司製造)作為管柱,使用示差折射計作為檢測器。 (Preparation of Acrylic Copolymer A) In a reactor equipped with a thermometer, stirrer, and cooling tube, 159 parts by weight of ethyl acetate, 75 parts by weight of butyl acrylate (BA), 25 parts by weight of 2-ethylhexyl acrylate (2EHA), 0.1 parts by weight of 2-hydroxyethyl acrylate (HEA), and 5 parts by weight of acrylic acid (AAc) were added as solvents. After nitrogen purge, the reactor was placed in a water bath set at 60°C, heated, and refluxed. 30 minutes after the start of reflux, 0.050 parts by weight of azobisisobutyronitrile was added as a polymerization initiator and the reaction was allowed to proceed for 6 hours. Ethyl acetate was then added to the reactor for dilution while cooling the reaction to obtain a solution of Acrylic Copolymer A. The resulting solution of acrylic copolymer A was diluted 50-fold with tetrahydrofuran (THF) and filtered through a filter (material: polytetrafluoroethylene; pore size: 0.2 μm). The filtrate was fed to a gel permeation chromatography (GPC) instrument (Waters, 2690 Separations Model) for GPC analysis at a sample flow rate of 1 ml/min and a column temperature of 40°C. The polystyrene-equivalent molecular weight of acrylic copolymer A was measured to determine the weight-average molecular weight (Mw). The weight-average molecular weight (Mw) was 1.4 million. A GPC KF-806L (Showa Denko K.K.) column was used, and a differential refractometer was used as the detector.
(製備丙烯酸共聚物B) 將溶劑改為乙酸乙酯100重量份及甲苯50重量份,將聚合起始劑改為偶氮二異丁腈0.14重量份,除此之外,以與製備丙烯酸共聚物A相同之方式,獲得丙烯酸共聚物B之溶液。所得丙烯酸共聚物B之重量平均分子量為80萬。 (Preparation of Acrylic Copolymer B) A solution of Acrylic Copolymer B was obtained in the same manner as for Preparation of Acrylic Copolymer A, except that the solvent was changed to 100 parts by weight of ethyl acetate and 50 parts by weight of toluene, and the polymerization initiator was changed to 0.14 parts by weight of azobisisobutyronitrile. The weight-average molecular weight of the resulting Acrylic Copolymer B was 800,000.
(製備丙烯酸共聚物C) 將聚合起始劑改為偶氮二異丁腈0.04重量份,除此之外,以與製備丙烯酸共聚物A相同之方式,獲得丙烯酸共聚物C之溶液。所得丙烯酸共聚物C之重量平均分子量為160萬。 (Preparation of Acrylic Copolymer C) A solution of Acrylic Copolymer C was obtained in the same manner as for Preparation of Acrylic Copolymer A, except that the polymerization initiator was replaced with 0.04 parts by weight of azobisisobutyronitrile. The weight-average molecular weight of the resulting Acrylic Copolymer C was 1.6 million.
(製備丙烯酸共聚物D) 將丙烯酸之摻合量改為3重量份,除此之外,以與製備丙烯酸共聚物A相同之方式,獲得丙烯酸共聚物D之溶液。所得丙烯酸共聚物D之重量平均分子量為140萬。 (Preparation of Acrylic Copolymer D) A solution of Acrylic Copolymer D was obtained in the same manner as for Acrylic Copolymer A, except that the amount of acrylic acid added was changed to 3 parts by weight. The weight-average molecular weight of the resulting Acrylic Copolymer D was 1.4 million.
(製備丙烯酸共聚物E) 於具備溫度計、攪拌器、冷卻管之反應器中,添加乙酸乙酯50重量份作為溶劑,氮氣置換後,加熱反應器,開始回流。乙酸乙酯沸騰30分鐘後,加入偶氮二異丁腈0.20重量份作為聚合起始劑。歷時1小時30分鐘,向其中均勻且緩慢地滴加由丙烯酸丁酯75重量份、丙烯酸2-乙基己酯25重量份、丙烯酸2-羥乙酯0.1重量份及丙烯酸3重量份所構成之單體混合物,使其產生反應。滴加完畢30分鐘後,添加偶氮二異丁腈0.15重量份,進而進行5小時聚合反應。於反應器內加入乙酸乙酯,進行稀釋並同時冷卻,藉此獲得丙烯酸共聚物E之溶液。所得丙烯酸共聚物E之重量平均分子量為40萬。 (Preparation of Acrylic Copolymer E) In a reactor equipped with a thermometer, stirrer, and cooling tube, 50 parts by weight of ethyl acetate was added as a solvent. After nitrogen substitution, the reactor was heated and refluxed. After boiling the ethyl acetate for 30 minutes, 0.20 parts by weight of azobisisobutyronitrile was added as a polymerization initiator. A monomer mixture consisting of 75 parts by weight of butyl acrylate, 25 parts by weight of 2-ethylhexyl acrylate, 0.1 parts by weight of 2-hydroxyethyl acrylate, and 3 parts by weight of acrylic acid was uniformly and slowly added dropwise over 1 hour and 30 minutes to allow the reaction to proceed. 30 minutes after the addition was complete, 0.15 parts by weight of azobisisobutyronitrile was added, and the polymerization reaction was allowed to proceed for another 5 hours. Ethyl acetate was added to the reactor for dilution and cooling to obtain a solution of acrylic copolymer E. The weight-average molecular weight of the obtained acrylic copolymer E was 400,000.
(苯乙烯-丙烯酸系嵌段共聚物A) 準備具有表1所示物性及組成之苯乙烯-丙烯酸系嵌段共聚物A。 (Styrene-Acrylic Block Copolymer A) Styrene-acrylic block copolymer A having the properties and composition shown in Table 1 was prepared.
[表1]
(實施例1) (1)製作發泡體基材 使用由聚乙烯系樹脂(UBE聚乙烯F420)100重量份、作為熱分解型發泡劑之偶氮二甲醯胺8.5重量份、作為分解溫度調整劑之氧化鋅1重量份及作為抗氧化劑之2,6-二-第三丁基對甲酚0.5重量份所構成之組成物,作為形成第1發泡樹脂層(中心發泡樹脂層)之發泡性組成物。 使用由聚乙烯系樹脂(UBE聚乙烯F420)100重量份、作為熱分解型發泡劑之偶氮二甲醯胺1.1重量份、作為分解溫度調整劑之氧化鋅1重量份及作為抗氧化劑之2,6-二-第三丁基對甲酚0.5重量份所構成之組成物,作為形成第2發泡樹脂層(最外層)之發泡性組成物。 再者,所謂UBE聚乙烯F420,係指宇部丸善聚乙烯公司製造之「UBE聚乙烯F420」(密度:0.920 g/cm 3)。 將形成第1發泡樹脂層(中心發泡樹脂層)之發泡性組成物及形成第2發泡樹脂層(最外層)之發泡性組成物供給至用於多層擠出成形之擠出機,於130℃進行熔融混練。熔融混練後,擠出厚度約為1.0 mm之長條片狀發泡體原料片材,其於由形成第1發泡樹脂層(中心發泡樹脂層)之發泡性組成物所構成之層的兩面積層有由形成第2發泡樹脂層(最外層)之發泡性組成物所構成之層。 其次,於上述長條片狀發泡體原料片材之兩面以4.0 Mrad照射加速電壓500 kV之電子束,使上述長條片狀發泡體原料片材交聯。將交聯後之發泡體原料片材連續送入藉由熱風及紅外線加熱器維持於250℃之發泡爐內,進行加熱,使其發泡,並以MD之延伸倍率為3.5倍、以TD之延伸倍率為3.5倍進行延伸。藉此,獲得一種發泡體基材,其於第1發泡樹脂層(中心發泡樹脂層)之兩面分別積層有第2發泡樹脂層(最外層)-1及第2發泡樹脂層(最外層)-2。測定各個發泡樹脂層之厚度及基於JIS K 7222之發泡倍率、以及發泡體基材之厚度及基於JIS K 6254:2016之25%壓縮強度。測定結果示於表2。 (Example 1) (1) A foam substrate is prepared by using a composition consisting of 100 parts by weight of a polyethylene resin (UBE polyethylene F420), 8.5 parts by weight of azodicarbonamide as a thermal decomposition type foaming agent, 1 part by weight of zinc oxide as a decomposition temperature regulator, and 0.5 parts by weight of 2,6-di-tert-butyl-p-cresol as an antioxidant as a foaming composition for forming the first foaming resin layer (center foaming resin layer). The second foaming resin layer (outermost layer) was formed using a foaming composition consisting of 100 parts by weight of a polyethylene resin (UBE Polyethylene F420), 1.1 parts by weight of azodicarbonamide as a thermally decomposable foaming agent, 1 part by weight of zinc oxide as a decomposition temperature regulator, and 0.5 parts by weight of 2,6-di-tert-butyl-p-cresol as an antioxidant. UBE Polyethylene F420 refers to "UBE Polyethylene F420" manufactured by Ube Maruzen Polyethylene Co., Ltd. (density: 0.920 g/ cm³ ). The foamable composition forming the first foaming resin layer (center foaming resin layer) and the foamable composition forming the second foaming resin layer (outermost layer) are fed to an extruder for multi-layer extrusion molding and melt-kneaded at 130°C. After melt-kneading, a long sheet of foam raw material with a thickness of approximately 1.0 mm is extruded. The sheet has layers of the foamable composition forming the second foaming resin layer (outermost layer) on both sides of the layer of the foamable composition forming the first foaming resin layer (center foaming resin layer). Next, both sides of the long foam sheet were irradiated with an electron beam at an accelerating voltage of 500 kV at a 4.0 Mrad to crosslink the long foam sheet. The crosslinked foam sheet was then continuously fed into a foaming furnace maintained at 250°C using hot air and infrared heaters, where it was heated and foamed. The foam was then stretched at a stretch ratio of 3.5 times in the MD and 3.5 times in the TD. This produced a foam substrate comprising a first foam resin layer (center foam resin layer) with second foam resin layers (outermost layer)-1 and (outermost layer)-2 laminated on either side. The thickness of each foaming resin layer and its expansion ratio according to JIS K 7222, as well as the thickness of the foam substrate and its 25% compressive strength according to JIS K 6254:2016, were measured. The results are shown in Table 2.
(2)製造雙面黏著帶 相對於丙烯酸共聚物A之固形物成分100重量份,添加聚合松香酯樹脂(荒川化學工業公司製造,PENSEL D-135,軟化點135℃,羥值45)15重量份、及萜烯酚樹脂(YASUHARA Chemicals公司製造,YS POLYSTER G150,軟化點150℃,羥值135)15重量份。進而,添加乙酸乙酯(不二化學藥品公司製造)30重量份、異氰酸酯系交聯劑(日本聚胺酯公司製造,商品名「Coronate L45」)固形物成分1.3重量份,加以攪拌,獲得黏著劑溶液。 準備厚度為75 μm之脫模膜,於該脫模膜之脫模處理面上塗佈黏著劑溶液,於110℃乾燥5分鐘,藉此形成厚度為50 μm之黏著劑層。將該黏著劑層貼合於上述所得發泡體基材之表面。其次,以相同方式,於剝離PET隔片後之發泡體基材之另一表面亦貼合與上述相同之黏著劑層。然後,於40℃加熱48小時,使其固化。藉此,獲得覆蓋有脫模膜之雙面黏著帶。 (2) Preparation of double-sided adhesive tape To 100 parts by weight of the solid content of acrylic copolymer A, 15 parts by weight of polymerized rosin ester resin (PENSEL D-135 manufactured by Arakawa Chemical Industries, Ltd., softening point 135°C, hydroxyl value 45) and 15 parts by weight of terpene phenol resin (YS POLYSTER G150 manufactured by Yasuhara Chemicals, softening point 150°C, hydroxyl value 135) were added. Furthermore, 30 parts by weight of ethyl acetate (manufactured by Fuji Chemical Co., Ltd.) and 1.3 parts by weight of an isocyanate crosslinking agent (manufactured by Japan Polyurethane Co., Ltd., trade name "Coronate L45") were added as solid content, and the mixture was stirred to obtain an adhesive solution. Prepare a 75 μm thick release film. Apply an adhesive solution to the release-treated surface of the film and dry at 110°C for 5 minutes to form a 50 μm thick adhesive layer. This adhesive layer is then applied to the surface of the foam substrate obtained above. Next, apply the same adhesive layer to the other surface of the foam substrate after removing the PET separator. Then, heat at 40°C for 48 hours to cure. This results in a double-sided adhesive tape covered with a release film.
(3)測定凝膠分率 將雙面黏著帶裁剪成50 mm×100 mm之平面矩形狀,製作試驗片。將試驗片於乙酸乙酯中在23℃浸漬24小時後,從乙酸乙酯中取出,於110℃之條件下乾燥1小時。測定乾燥後之試驗片之重量,利用下述式(1)算出凝膠分率。再者,試驗片中未積層有用於保護黏著劑層之脫模膜。 凝膠分率(重量%)=100×(W 2-W 0)/(W 1-W 0) (1) (W 0:發泡體基材之重量;W 1:浸漬前之試驗片之重量;W 2:浸漬、乾燥後之試驗片之重量) (3) Determination of gel fraction: Cut the double-sided adhesive tape into a flat rectangular shape of 50 mm × 100 mm to prepare a test piece. After soaking the test piece in ethyl acetate at 23°C for 24 hours, remove it from ethyl acetate and dry it at 110°C for 1 hour. Measure the weight of the dried test piece and calculate the gel fraction using the following formula (1). In addition, the test piece does not contain a release film for protecting the adhesive layer. Gel fraction (weight %) = 100 × (W 2 - W 0 ) / (W 1 - W 0 ) (1) (W 0 : weight of the foam substrate; W 1 : weight of the test piece before soaking; W 2 : weight of the test piece after soaking and drying)
(4)測定於180℃之儲存模數 使用黏彈性測定裝置(Rheometrics公司製造,「Rheometrics Dynamic Analyze RDA-700」),於測定溫度-40~200℃、升溫速度3℃/分鐘、頻率10 Hz之條件下求出黏著劑層於180℃之儲存模數。 (4) Determination of the storage modulus at 180°C Using a viscoelasticity tester (Rheometrics Dynamic Analyzer RDA-700, manufactured by Rheometrics), the storage modulus of the adhesive layer at 180°C was determined under the following conditions: a temperature range of -40°C to 200°C, a heating rate of 3°C/min, and a frequency of 10 Hz.
(5)測定從初始之抓持夾具間距離伸長5 mm時之強度(拉伸試驗) 根據JIS K 7161,如下所述,測定從初始之抓持夾具間距離伸長5 mm時之強度。 使用高分子計器公司製造之沖裁刀片「拉伸3號型啞鈴狀」,將雙面黏著帶沖裁成啞鈴狀,以製作試驗片。使用島津製作所製造之「Autograph AGS-X」,於25℃及相對濕度50%,以拉伸速度50 mm/min拉伸所得試驗片。此時,初始之抓持夾具間距離設為60 mm,讀取由此伸長5 mm時(抓持夾具間距離為65 mm)之強度。 (5) Determination of the strength at 5 mm elongation from the initial gripping distance (tensile test) According to JIS K 7161, the strength at 5 mm elongation from the initial gripping distance was measured as follows. Using a punching blade "Stretching No. 3 Dumbbell" manufactured by Kobunsu Keiki Co., Ltd., the double-sided adhesive tape was punched into a dumbbell shape to prepare a test piece. Using "Autograph AGS-X" manufactured by Shimadzu Corporation, the obtained test piece was stretched at a tensile speed of 50 mm/min at 25°C and a relative humidity of 50%. At this time, the initial gripping distance was set to 60 mm, and the strength at 5 mm elongation (gripping distance of 65 mm) was read.
(6)測定25%壓縮強度 以與測定發泡體基材之25%壓縮強度相同之方式,根據JIS K 6254:2016,亦測定雙面黏著帶之25%壓縮強度。 (6) Determination of 25% compressive strength The 25% compressive strength of the double-sided adhesive tape was also determined in accordance with JIS K 6254:2016 in the same manner as for the determination of the 25% compressive strength of the foam substrate.
(7)23℃拉伸試驗 將雙面黏著帶切成啞鈴3號(中心寬度5 mm)之大小,用羽毛刀片將第1發泡樹脂層(中心部分)切片。藉此,分成黏著劑層/第2發泡樹脂層(最外層)-1/第1發泡樹脂層(大約一半厚度)之樣品(設為「第2發泡樹脂層(最外層)-1側之樣品」)、及第1發泡樹脂層(大約一半厚度)/第2發泡樹脂層(最外層)-2/黏著劑層之樣品(設為「第2發泡樹脂層(最外層)-2側之樣品」)。 使用島津製作所製造之「Autograph AGS-X」,於溫度23℃、抓持夾具間距離45 mm,以拉伸速度100 mm/min對各樣品進行拉伸試驗。以樣品斷裂時之強度作為拉伸斷裂強度、以樣品斷裂時之伸長作為拉伸斷裂伸長。 (7) 23℃ tensile test The double-sided adhesive tape was cut into the size of Dumbbell No. 3 (center width 5 mm), and the first foam resin layer (center part) was sliced with a feather blade. In this way, the samples were divided into adhesive layer/second foam resin layer (outermost layer)-1/first foam resin layer (about half the thickness) (referred to as "second foam resin layer (outermost layer)-1 side sample") and first foam resin layer (about half the thickness)/second foam resin layer (outermost layer)-2/adhesive layer sample (referred to as "second foam resin layer (outermost layer)-2 side sample"). Tensile tests were conducted on each sample using a Shimadzu Autograph AGS-X at a temperature of 23°C, a gripper distance of 45 mm, and a tensile speed of 100 mm/min. The tensile strength at fracture was determined as the strength, and the elongation at fracture was determined as the elongation.
(8)80℃拉伸試驗 將雙面黏著帶切成5 mm大小之短條狀,用羽毛刀片將第1發泡樹脂層(中心部分)切片。藉此,分成黏著劑層/第2發泡樹脂層(最外層)-1/第1發泡樹脂層(大約一半厚度)之樣品(設為「第2發泡樹脂層(最外層)-1側之樣品」)、及第1發泡樹脂層(大約一半厚度)/第2發泡樹脂層(最外層)-2/黏著劑層之樣品(設為「第2發泡樹脂層(最外層)-2側之樣品」)。 使用島津製作所製造之「Autograph AGS-X」,於溫度80℃、抓持夾具間距離10 mm,以拉伸速度100 mm/min對各樣品進行拉伸試驗。再者,以10 mm之抓持夾具間距離設置樣品後,於80℃之環境下放置5分鐘後開始測定。以樣品斷裂時之強度作為拉伸斷裂強度。又,算出1-(於80℃之拉伸斷裂強度/於23℃之拉伸斷裂強度)之值作為拉伸斷裂強度降低率。 (8) 80℃ tensile test The double-sided adhesive tape was cut into 5 mm strips and the first foamed resin layer (center part) was sliced with a feather blade. In this way, the samples were divided into adhesive layer/second foamed resin layer (outermost layer)-1/first foamed resin layer (about half the thickness) (referred to as "second foamed resin layer (outermost layer)-1 side sample") and first foamed resin layer (about half the thickness)/second foamed resin layer (outermost layer)-2/adhesive layer sample (referred to as "second foamed resin layer (outermost layer)-2 side sample"). Tensile tests were conducted on each sample using a Shimadzu Autograph AGS-X at 80°C, a gripper distance of 10 mm, and a tensile speed of 100 mm/min. The sample was placed at a gripper distance of 10 mm and then placed in an 80°C environment for 5 minutes before measurement. The tensile strength at break was determined as the strength at break. Furthermore, the tensile strength reduction rate was calculated as 1 - (tensile strength at break at 80°C / tensile strength at break at 23°C).
(實施例2~6、11~14) 將發泡體基材如表2所示變更,除此之外,以與實施例1相同之方式,獲得雙面黏著帶。再者,藉由調整多層擠出時之厚度及MD、TD之延伸倍率來調整發泡樹脂層之厚度,藉由調整熱分解型發泡劑之用量來調整發泡樹脂層之發泡倍率。 (Examples 2-6, 11-14) Double-sided adhesive tapes were obtained in the same manner as in Example 1, except that the foam substrate was modified as shown in Table 2. Furthermore, the thickness of the foamed resin layer was adjusted by adjusting the thickness during multi-layer extrusion and the stretch ratio in the MD and TD directions. The expansion ratio of the foamed resin layer was adjusted by adjusting the amount of the thermally decomposable foaming agent used.
(實施例7~10) 將黏著劑層如表2所示變更,除此之外,以與實施例1相同之方式,獲得雙面黏著帶。再者,實施例6中,使用丙烯酸共聚物B,交聯劑之用量為固形物成分1.9重量份。實施例7中,使用丙烯酸共聚物C,交聯劑之用量為固形物成分1.1重量份。實施例8及9中,均使用丙烯酸共聚物D,但實施例8中交聯劑之用量為固形物成分1.4重量份,實施例9中交聯劑之用量為固形物成分1.1重量份,藉此使凝膠分率發生變化。 (Examples 7-10) Double-sided adhesive tapes were obtained in the same manner as in Example 1, except that the adhesive layer was modified as shown in Table 2. Furthermore, in Example 6, acrylic copolymer B was used, and the crosslinking agent was used at a level of 1.9 parts by weight based on the solid content. In Example 7, acrylic copolymer C was used, and the crosslinking agent was used at a level of 1.1 parts by weight based on the solid content. In Examples 8 and 9, acrylic copolymer D was used, but the crosslinking agent was used at a level of 1.4 parts by weight based on the solid content in Example 8 and 1.1 parts by weight based on the solid content in Example 9, thereby varying the gel fraction.
(比較例1) 「(1)製作發泡體基材」中,不使用形成第2發泡樹脂層(最外層)之發泡性組成物,僅使用形成第1發泡樹脂層(中心發泡樹脂層)之發泡性組成物。於所得第1發泡樹脂層(中心發泡樹脂層)之兩面,分別積層聚對苯二甲酸乙二酯(PET)片材及苯乙烯-丙烯酸共聚物片材,除此之外,以與實施例1相同之方式,獲得雙面黏著帶。 (Comparative Example 1) In "(1) Preparation of Foam Base Material", the foaming composition for forming the second foaming resin layer (outermost layer) was not used, and only the foaming composition for forming the first foaming resin layer (center foaming resin layer) was used. A polyethylene terephthalate (PET) sheet and a styrene-acrylic acid copolymer sheet were laminated on both sides of the obtained first foaming resin layer (center foaming resin layer), respectively. A double-sided adhesive tape was obtained in the same manner as in Example 1 except that
具體而言,「(1)製作發泡體基材」中,首先,僅形成第1發泡樹脂層(中心發泡樹脂層)。其次,於厚度為50 μm之聚對苯二甲酸乙二酯(PET)片材(東麗公司製造,X30)之表面,塗佈含有丙烯酸共聚物A之黏著劑溶液,於110℃乾燥5分鐘,藉此,形成厚度為20 μm之黏著劑層。於該黏著劑層上積層所得第1發泡樹脂層(中心發泡樹脂層),獲得由聚對苯二甲酸乙二酯(PET)片材/黏著劑層/第1發泡樹脂層(中心發泡樹脂層)所構成之積層體。 進而,於苯乙烯-丙烯酸系嵌段共聚物A之乙酸乙酯溶液中,相對於苯乙烯-丙烯酸系嵌段共聚物A 100重量份,摻合5重量份之交聯劑,塗佈於表面經脫模處理之厚度為50 μm之聚對苯二甲酸乙二酯(PET)片材上,使其乾燥,獲得厚度為40 μm之未交聯樹脂膜。作為交聯劑,使用日本聚胺酯公司製造之商品名「Coronate L45」。於由聚對苯二甲酸乙二酯(PET)片材/黏著劑層/第1發泡樹脂層(中心發泡樹脂層)所構成之積層體之第1發泡樹脂層(中心發泡樹脂層)側積層未交聯樹脂膜,獲得由聚對苯二甲酸乙二酯(PET)片材/黏著劑層/第1發泡樹脂層(中心發泡樹脂層)/未交聯樹脂膜所構成之積層體。其次,於40℃加熱48小時,使未交聯樹脂膜熱交聯,藉此獲得由聚對苯二甲酸乙二酯(PET)片材/黏著劑層/第1發泡樹脂層(中心發泡樹脂層)/苯乙烯-丙烯酸共聚物片材所構成之發泡體基材。 Specifically, in "(1) Preparation of the foam substrate", first, only the first foaming resin layer (center foaming resin layer) is formed. Then, an adhesive solution containing acrylic copolymer A is applied to the surface of a polyethylene terephthalate (PET) sheet (manufactured by Toray Industries, Ltd., X30) having a thickness of 50 μm, and dried at 110°C for 5 minutes to form an adhesive layer having a thickness of 20 μm. The first foaming resin layer (center foaming resin layer) obtained is laminated on the adhesive layer to obtain a laminate consisting of polyethylene terephthalate (PET) sheet/adhesive layer/first foaming resin layer (center foaming resin layer). Furthermore, a crosslinking agent (5 parts by weight per 100 parts by weight) was added to an ethyl acetate solution of styrene-acrylic block copolymer A. The solution was then coated onto a 50 μm thick polyethylene terephthalate (PET) sheet that had been subjected to a release treatment. The resulting film was dried to obtain a 40 μm thick uncrosslinked resin film. The crosslinking agent used was "Coronate L45," manufactured by Japan Polyurethane Co., Ltd. A non-crosslinked resin film was laminated on the first foamed resin layer (center foamed resin layer) side of a laminate composed of a polyethylene terephthalate (PET) sheet/adhesive layer/first foamed resin layer (center foamed resin layer), thereby obtaining a laminate composed of a polyethylene terephthalate (PET) sheet/adhesive layer/first foamed resin layer (center foamed resin layer)/non-crosslinked resin film. Next, the uncrosslinked resin film was heated at 40°C for 48 hours to thermally crosslink it, thereby obtaining a foam substrate composed of a polyethylene terephthalate (PET) sheet/adhesive layer/first foaming resin layer (center foaming resin layer)/styrene-acrylic copolymer sheet.
(比較例2) 「(1)製作發泡體基材」中,不使用形成第2發泡樹脂層(最外層)之發泡性組成物,僅使用形成第1發泡樹脂層(中心發泡樹脂層)之發泡性組成物,於所得第1發泡樹脂層(中心發泡樹脂層)之兩面積層苯乙烯-丙烯酸共聚物片材,除此之外,以與實施例1相同之方式,獲得雙面黏著帶。 (Comparative Example 2) In "(1) Preparation of Foam Base Material", a double-sided adhesive tape was obtained in the same manner as in Example 1 except that the foaming composition for forming the second foaming resin layer (outermost layer) was not used, and only the foaming composition for forming the first foaming resin layer (center foaming resin layer) was used. Styrene-acrylic copolymer sheets were laminated on both sides of the obtained first foaming resin layer (center foaming resin layer).
具體而言,「(1)製作發泡體基材」中,首先,僅形成第1發泡樹脂層(中心發泡樹脂層)。其次,於苯乙烯-丙烯酸系嵌段共聚物A之乙酸乙酯溶液中,相對於苯乙烯-丙烯酸系嵌段共聚物A 100重量份,摻合5重量份之交聯劑,塗佈於表面經脫模處理之厚度為50 μm之聚對苯二甲酸乙二酯(PET)片材上,使其乾燥,獲得厚度為40 μm之未交聯樹脂膜。作為交聯劑,使用日本聚胺酯公司製造之商品名「Coronate L45」。 於第1發泡樹脂層(中心發泡樹脂層)積層未交聯樹脂膜,獲得由未交聯樹脂膜/第1發泡樹脂層(中心發泡樹脂層)所構成之積層體。其次,於40℃加熱48小時,使未交聯樹脂膜熱交聯,藉此獲得由苯乙烯-丙烯酸共聚物片材/第1發泡樹脂層(中心發泡樹脂層)所構成之積層體。 進而,將以相同方式製作之未交聯樹脂膜積層於由苯乙烯-丙烯酸共聚物片材/第1發泡樹脂層(中心發泡樹脂層)所構成之積層體之第1發泡樹脂層(中心發泡樹脂層)側,獲得由苯乙烯-丙烯酸共聚物片材/第1發泡樹脂層(中心發泡樹脂層)/未交聯樹脂膜所構成之積層體。其次,於40℃加熱48小時,使未交聯樹脂膜熱交聯,藉此獲得由苯乙烯-丙烯酸共聚物片材/第1發泡樹脂層(中心發泡樹脂層)/苯乙烯-丙烯酸共聚物片材所構成之發泡體基材。 Specifically, in "(1) Preparation of the foam substrate", first, only the first foaming resin layer (center foaming resin layer) is formed. Then, 5 parts by weight of a crosslinking agent is mixed with 100 parts by weight of the styrene-acrylic acid block copolymer A in an ethyl acetate solution, and the mixture is coated on a 50 μm thick polyethylene terephthalate (PET) sheet with a surface release treatment, and dried to obtain a 40 μm thick uncrosslinked resin film. As a crosslinking agent, "Coronate L45" manufactured by Japan Polyurethane Co., Ltd. is used. An uncrosslinked resin film is laminated onto the first foamed resin layer (center foamed resin layer) to obtain a laminate consisting of uncrosslinked resin film/first foamed resin layer (center foamed resin layer). Next, the uncrosslinked resin film is thermally crosslinked by heating at 40°C for 48 hours, thereby obtaining a laminate consisting of styrene-acrylic copolymer sheet/first foamed resin layer (center foamed resin layer). Furthermore, an uncrosslinked resin film prepared in the same manner was laminated onto the first foamed resin layer (center foamed resin layer) side of a laminate consisting of a styrene-acrylic copolymer sheet/first foamed resin layer (center foamed resin layer), resulting in a laminate consisting of a styrene-acrylic copolymer sheet/first foamed resin layer (center foamed resin layer)/uncrosslinked resin film. Next, the uncrosslinked resin film was thermally crosslinked by heating at 40°C for 48 hours, resulting in a foam substrate consisting of a styrene-acrylic copolymer sheet/first foamed resin layer (center foamed resin layer)/styrene-acrylic copolymer sheet.
(比較例3) 「(1)製作發泡體基材」中,不使用形成第2發泡樹脂層(最外層)之發泡性組成物,僅使用形成第1發泡樹脂層(中心發泡樹脂層)之發泡性組成物,於所得第1發泡樹脂層(中心發泡樹脂層)之兩面積層聚乙烯(PE)片材,除此之外,以與實施例1相同之方式,獲得雙面黏著帶。 (Comparative Example 3) In "(1) Preparation of Foam Base Material", a double-sided adhesive tape was obtained in the same manner as in Example 1 except that the foaming composition for forming the second foaming resin layer (outermost layer) was not used, and only the foaming composition for forming the first foaming resin layer (center foaming resin layer) was used. Polyethylene (PE) sheets were laminated on both sides of the obtained first foaming resin layer (center foaming resin layer).
具體而言,「(1)製作發泡體基材」中,首先,僅形成第1發泡樹脂層(中心發泡樹脂層)。準備厚度為75 μm之脫模膜,於該脫模膜之脫模處理面塗佈含有丙烯酸共聚物A之黏著劑溶液,於110℃乾燥5分鐘,藉此形成厚度為6 μm之黏著劑層。其次,將該黏著劑層貼合於厚度為40 μm之低密度聚乙烯(PE)片材之表面,獲得由黏著劑層/低密度聚乙烯(PE)片材所構成之積層體。將由黏著劑層/低密度聚乙烯(PE)片材所構成之積層體中黏著劑層之脫模膜剝離,與第1發泡樹脂層(中心發泡樹脂層)貼合。其次,以相同方式,於第1發泡樹脂層(中心發泡樹脂層)之另一表面,亦貼合黏著劑層/低密度聚乙烯(PE)片材。然後,於40℃加熱48小時,使其固化。獲得由聚乙烯(PE)片材/黏著劑層/第1發泡樹脂層(中心發泡樹脂層)/黏著劑層/聚乙烯(PE)片材所構成之發泡體基材。Specifically, in "(1) Preparation of the Foam Base Material," first, only the first foaming resin layer (center foaming resin layer) is formed. A release film having a thickness of 75 μm is prepared, and an adhesive solution containing acrylic copolymer A is applied to the release-treated surface of the release film, followed by drying at 110°C for 5 minutes to form an adhesive layer having a thickness of 6 μm. Next, the adhesive layer is bonded to the surface of a low-density polyethylene (PE) sheet having a thickness of 40 μm, thereby obtaining a laminate consisting of an adhesive layer/low-density polyethylene (PE) sheet. The adhesive layer release film is peeled off from the laminate consisting of an adhesive layer/low-density polyethylene (PE) sheet, and the laminate is then laminated to the first foamed resin layer (center foamed resin layer). Next, the adhesive layer/low-density polyethylene (PE) sheet is laminated to the other surface of the first foamed resin layer (center foamed resin layer) in the same manner. The laminate is then heated at 40°C for 48 hours to cure. This results in a foam substrate consisting of polyethylene (PE) sheet/adhesive layer/first foamed resin layer (center foamed resin layer)/adhesive layer/polyethylene (PE) sheet.
(比較例4) 「(1)製作發泡體基材」中,不使用形成第2發泡樹脂層(最外層)之發泡性組成物,僅使用形成第1發泡樹脂層(中心發泡樹脂層)之發泡性組成物,於所得第1發泡樹脂層(中心發泡樹脂層)之一面積層聚對苯二甲酸乙二酯(PET)片材,除此之外,以與實施例2相同之方式,獲得雙面黏著帶。 (Comparative Example 4) In "(1) Preparation of Foam Base Material", a double-sided adhesive tape was obtained in the same manner as in Example 2 except that the foaming composition for forming the second foaming resin layer (outermost layer) was not used, and only the foaming composition for forming the first foaming resin layer (center foaming resin layer) was used. A polyethylene terephthalate (PET) sheet was layered on one area of the obtained first foaming resin layer (center foaming resin layer).
具體而言,「(1)製作發泡體基材」中,首先,僅形成第1發泡樹脂層(中心發泡樹脂層)。其次,於厚度為50 μm之聚對苯二甲酸乙二酯(PET)片材(東麗公司製造,X30)之表面塗佈含有丙烯酸共聚物A之黏著劑溶液,於110℃乾燥5分鐘,藉此形成厚度為20 μm之黏著劑層。於該黏著劑層上積層所得第1發泡樹脂層(中心發泡樹脂層),獲得由聚對苯二甲酸乙二酯(PET)片材/黏著劑層/第1發泡樹脂層(中心發泡樹脂層)所構成之發泡體基材。Specifically, in "(1) Preparation of a foam substrate", first, only the first foaming resin layer (center foaming resin layer) is formed. Then, an adhesive solution containing acrylic copolymer A is applied to the surface of a polyethylene terephthalate (PET) sheet (manufactured by Toray Industries, Ltd., X30) having a thickness of 50 μm, and dried at 110°C for 5 minutes to form an adhesive layer having a thickness of 20 μm. The first foaming resin layer (center foaming resin layer) obtained is laminated on the adhesive layer to obtain a foam substrate consisting of polyethylene terephthalate (PET) sheet/adhesive layer/first foaming resin layer (center foaming resin layer).
(比較例5) 「(1)製作發泡體基材」中,不使用形成第2發泡樹脂層(最外層)之發泡性組成物,僅使用形成第1發泡樹脂層(中心發泡樹脂層)之發泡性組成物,除此之外,以與實施例2相同之方式,獲得雙面黏著帶。 (Comparative Example 5) In "(1) Preparation of Foam Base Material", a double-sided adhesive tape was obtained in the same manner as in Example 2 except that the foaming composition for forming the second foaming resin layer (outermost layer) was not used and only the foaming composition for forming the first foaming resin layer (center foaming resin layer) was used.
(比較例6~8) 將黏著劑層如表3所示變更,除此之外,以與實施例1相同之方式,獲得雙面黏著帶。再者,比較例6中使用丙烯酸共聚物E,但交聯劑之用量為固形物成分2.5重量份,藉此使凝膠分率發生變化。與實施例8及9相同,比較例7中使用丙烯酸共聚物D,但交聯劑之用量為固形物成分0.7重量份,藉此使凝膠分率發生變化。 (Comparative Examples 6-8) Double-sided adhesive tapes were obtained in the same manner as in Example 1, except that the adhesive layer was modified as shown in Table 3. Furthermore, in Comparative Example 6, acrylic copolymer E was used, but the amount of crosslinking agent was adjusted to 2.5 parts by weight based on the solid content, thereby varying the gel fraction. Similar to Examples 8 and 9, in Comparative Example 7, acrylic copolymer D was used, but the amount of crosslinking agent was adjusted to 0.7 parts by weight based on the solid content, thereby varying the gel fraction.
(比較例9) 「(1)製作發泡體基材」中,不使用形成第2發泡樹脂層(最外層)之發泡性組成物,僅使用形成第1發泡樹脂層(中心發泡樹脂層)之發泡性組成物。於所得第1發泡樹脂層(中心發泡樹脂層)之兩面,分別積層丙烯酸共聚物片材,除此之外,以與實施例1相同之方式,獲得雙面黏著帶。 (Comparative Example 9) In "(1) Preparation of Foam Base Material", the foaming composition for forming the second foaming resin layer (outermost layer) was not used, and only the foaming composition for forming the first foaming resin layer (center foaming resin layer) was used. Acrylic copolymer sheets were laminated on both sides of the obtained first foaming resin layer (center foaming resin layer), and a double-sided adhesive tape was obtained in the same manner as in Example 1 except that the acrylic copolymer sheets were laminated on both sides of the obtained first foaming resin layer (center foaming resin layer).
具體而言,「(1)製作發泡體基材」中,首先,僅形成第1發泡樹脂層(中心發泡樹脂層)。其次,相對於45重量份可樂麗公司製造之LA2270,添加乙酸乙酯100重量份,加以攪拌,獲得溶液。將所得溶液塗佈於表面經脫模處理之厚度為50 μm之聚對苯二甲酸乙二酯(PET)片材上,於110℃乾燥5分鐘,獲得厚度為40 μm之樹脂膜。將樹脂膜所露出之面貼合於第1發泡樹脂層(中心發泡樹脂層)之一面。以與上述相同之操作,再次製作厚度為40 μm之樹脂膜,將樹脂膜所露出之面貼合於第1發泡樹脂層(中心發泡樹脂層)之另一面,獲得發泡體基材。Specifically, in "(1) Preparation of the foam substrate", first, only the first foaming resin layer (center foaming resin layer) is formed. Next, 100 parts by weight of ethyl acetate is added to 45 parts by weight of LA2270 manufactured by Kuraray Co., Ltd. and stirred to obtain a solution. The obtained solution is applied to a 50 μm thick polyethylene terephthalate (PET) sheet with a release treatment on the surface, and dried at 110°C for 5 minutes to obtain a resin film with a thickness of 40 μm. The exposed surface of the resin film is bonded to one side of the first foaming resin layer (center foaming resin layer). A 40 μm thick resin film was again prepared using the same procedure as above. The exposed surface of the resin film was bonded to the other side of the first foaming resin layer (center foaming resin layer) to obtain a foam substrate.
<評價> 對實施例、比較例中獲得之雙面黏著帶進行以下評價。結果示於表4~5。 <Evaluation> The double-sided adhesive tapes obtained in the Examples and Comparative Examples were evaluated as follows. The results are shown in Tables 4 and 5.
(1)評價階差追隨性 將單面黏著帶(125 mm×20 mm、厚度300 μm)貼附於玻璃板(125 mm×50 mm,厚度1.5 mm),製作高度為300 μm之階差。將雙面黏著帶切成25 mm×50 mm之大小,其一面襯以厚度為23 μm之聚對苯二甲酸乙二酯(PET)片材。將雙面黏著帶之另一面貼附於玻璃板之製作有階差之面,並使2 kg橡膠輥從玻璃板側往返一次,進行壓接。測定來自階差部分的空氣之咬入距離,根據以下標準進行評價。 A:空氣之咬入距離未達700 μm B:空氣之咬入距離為700 μm以上且未達800 μm C:空氣之咬入距離為800 μm以上且未達900 μm D:空氣之咬入距離為900 μm以上且未達1000 μm E:空氣之咬入距離為1000 μm以上 (1) Evaluation of step tracking performance A single-sided adhesive tape (125 mm × 20 mm, 300 μm thick) was attached to a glass plate (125 mm × 50 mm, 1.5 mm thick) to create a step height of 300 μm. A double-sided adhesive tape was cut into 25 mm × 50 mm pieces, and one side was lined with a 23 μm thick polyethylene terephthalate (PET) sheet. The other side of the double-sided adhesive tape was attached to the stepped surface of the glass plate, and a 2 kg rubber roller was moved back and forth once from the side of the glass plate to perform press bonding. The distance of air penetrating the stepped portion was measured and evaluated according to the following criteria. A: Air penetration distance less than 700 μm B: Air penetration distance 700 μm or more and less than 800 μm C: Air penetration distance 800 μm or more and less than 900 μm D: Air penetration distance 900 μm or more and less than 1000 μm E: Air penetration distance 1000 μm or more
(2)評價保持力 (2-1)45°傾斜保持力試驗 圖1係表示雙面黏著帶之45°傾斜保持力試驗之示意圖。 將所得雙面黏著帶18切成25 mm×25 mm之大小,於玻璃板17貼合第2發泡樹脂層(最外層)-2側之黏著劑層,使2 kg之橡膠輥以300 mm/分鐘之速度於雙面黏著帶18上往返一次。其次,於SUS板16貼合雙面黏著帶18之第2發泡樹脂層(最外層)-1側之黏著劑層,用5 kg砝碼從SUS板16側加壓10秒進行壓接,然後於23℃、相對濕度50%之環境下放置24小時,製作試驗樣品。 對於該試驗樣品,於60℃、相對濕度90%,在SUS板16之中心安裝1 kg砝碼15以對雙面黏著帶18及SUS板16施加負載,並保持為傾斜45°之狀態,測定砝碼15歷時多久落下(落下時間),根據以下標準進行評價。 〇:落下時間為250小時以上 △:落下時間為50小時以上且未達250小時 ×:落下時間未達50小時 (2) Evaluation of holding power (2-1) 45° tilt holding power test Figure 1 is a schematic diagram showing the 45° tilt holding power test of a double-sided adhesive tape. The obtained double-sided adhesive tape 18 was cut into 25 mm × 25 mm pieces. The adhesive layer on the second side of the second foamed resin layer (outermost layer) was attached to a glass plate 17. A 2 kg rubber roller was moved back and forth once on the double-sided adhesive tape 18 at a speed of 300 mm/min. Next, the adhesive layer on the -1 side of the second foam resin layer (outermost layer) of double-sided adhesive tape 18 was attached to a SUS plate 16. A 5 kg weight was applied from the side of the SUS plate 16 for 10 seconds. The plate was then placed in an environment at 23°C and 50% relative humidity for 24 hours to create a test sample. For this test sample, a 1 kg weight 15 was attached to the center of the SUS plate 16 at 60°C and 90% relative humidity to apply a load to the double-sided adhesive tape 18 and the plate 16. The plate was tilted at 45°. The time it took for the weight 15 to fall (fall time) was measured and evaluated according to the following criteria. ○: The falling time is 250 hours or more △: The falling time is 50 hours or more but less than 250 hours ×: The falling time is less than 50 hours
(2-2)剪切保持力試驗 圖2係表示雙面黏著帶之剪切保持力試驗之示意圖。再者,圖2(a)為前視圖,圖2(b)為側視圖。 如圖2(a)及(b)所示,對雙面黏著帶3之第2發泡樹脂層(最外層)-2側之黏著劑層襯以PET膜(#50)4。將雙面黏著帶3之第2發泡樹脂層(最外層)-1側之黏著劑層貼附於SUS板1及SUS板2上,製作SUS板1與雙面黏著帶3之貼附面積為25 mm×25 mm之試驗樣品。試驗樣品之製作方式如下所述。 首先,準備SUS板1(厚度2 mm×50 mm×70 mm,JIS-G-4305規定之SUS304鋼板之表面經水砂紙360號均勻研磨者)、及SUS板2(厚度1 mm×30 mm×50 mm,未研磨)。用乙醇將SUS板1及SUS板2洗淨後,使其充分乾燥。將雙面黏著帶3裁剪成寬度25 mm×長度140 mm,剝離其中一面之脫模膜,於所露出之黏著劑層貼附PET膜(#50)4。其次,剝離其中另一面之脫模膜,以不進入氣泡之方式將所露出之黏著劑層之端部貼附於SUS板1,使2 kg之橡膠輥以10 mm/秒之速度往返一次,進行壓接。此時,以雙面黏著帶3與SUS板1之重疊成為30 mm之方式進行貼附。進而,將黏著劑層之與貼附於SUS板1之端部為相反側之端部貼附於SUS板2,使2 kg之橡膠輥以10 mm/秒之速度往返一次,進行壓接。此時,雙面黏著帶3以覆蓋SUS板2之前面及背面之方式配置。然後,於雙面黏著帶3連同SUS板2設置貫通孔5,並以SUS板1與雙面黏著帶3之貼附面積為25 mm×25 mm之方式切斷雙面黏著帶3。 將如上所述製作之試驗樣品於50℃、80%RH之恆溫槽放置24小時後,於相同環境,在貫通孔5安裝2 kg之砝碼6,測定200小時後之位移,根據以下標準進行評價。又,對雙面黏著帶3之第2發泡樹脂層(最外層)-2側之黏著劑層之剪切保持力亦進行相同評價。 〇:200小時後之位移未達2 mm △:200小時後之位移為2 mm以上,未達10 mm ×:200小時後之位移為10 mm以上 (2-2) Shear Holding Strength Test Figure 2 is a schematic diagram illustrating the shear holding strength test of a double-sided adhesive tape. Figure 2(a) is a front view, and Figure 2(b) is a side view. As shown in Figures 2(a) and (b), the adhesive layer on the second side (outermost layer) of the second foamed resin layer of the double-sided adhesive tape 3 is lined with a PET film (#50) 4. The adhesive layer on the first side (outermost layer) of the second foamed resin layer of the double-sided adhesive tape 3 is attached to SUS plates 1 and 2, producing a test sample with a 25 mm × 25 mm attachment area between the SUS plates 1 and the double-sided adhesive tape 3. The test sample was prepared as follows. First, prepare SUS plate 1 (2 mm × 50 mm × 70 mm thick, SUS304 steel plate specified in JIS-G-4305, surface evenly polished with 360 grit sandpaper) and SUS plate 2 (1 mm × 30 mm × 50 mm thick, unpolished). Wash SUS plates 1 and 2 with ethanol and allow them to dry thoroughly. Cut double-sided adhesive tape 3 into a 25 mm wide × 140 mm long sheet. Peel off the release film from one side and attach PET film (#50) 4 to the exposed adhesive layer. Next, peel off the release film from the other side and attach the exposed adhesive layer's edge to SUS plate 1, preventing air bubbles from forming. Press-bond the tape using a 2 kg rubber roller moving back and forth at a speed of 10 mm/second. At this point, the double-sided adhesive tape 3 is attached to the SUS plate 1 so that it overlaps by 30 mm. The end of the adhesive layer opposite the end attached to the SUS plate 1 is then attached to the SUS plate 2. A 2 kg rubber roller is used to reciprocate once at a speed of 10 mm/second for pressure bonding. The double-sided adhesive tape 3 is positioned to cover both the front and back surfaces of the SUS plate 2. Through holes 5 are then formed in the double-sided adhesive tape 3 and the SUS plate 2. The double-sided adhesive tape 3 is then cut so that the area between the SUS plate 1 and the double-sided adhesive tape 3 is 25 mm x 25 mm. After placing the test sample prepared as described above in a constant temperature chamber at 50°C and 80% RH for 24 hours, a 2 kg weight 6 was attached to the through-hole 5 in the same environment. Displacement after 200 hours was measured and evaluated according to the following criteria. The shear holding strength of the adhesive layer on the second side of the second foam resin layer (outermost layer) of the double-sided adhesive tape 3 was also evaluated in the same manner. ○: Displacement less than 2 mm after 200 hours △: Displacement of 2 mm or more but less than 10 mm after 200 hours X: Displacement of 10 mm or more after 200 hours
(3)評價23℃重工性及80℃重工性 將雙面黏著帶切成5 mm×100 mm之大小,將其一面貼附於玻璃板。將雙面黏著帶之另一面亦貼附於玻璃板,製作玻璃板/雙面黏著帶/玻璃板之積層體,以5 kg之重量壓接10秒。用羽毛刀片將所得積層體之第1發泡樹脂層(中心部分)切片。藉此,分成玻璃板/黏著劑層/第2發泡樹脂層(最外層)-1/第1發泡樹脂層(大約一半厚度)之樣品(設為「第2發泡樹脂層(最外層)-1側之樣品」)、及第1發泡樹脂層(大約一半厚度)/第2發泡樹脂層(最外層)-2/黏著劑層/玻璃板之樣品(設為「第2發泡樹脂層(最外層)-2側之樣品」)。 於23℃重工性之評價中,將各樣品於23℃放置4天後,手動快速地將雙面黏著帶部分從玻璃板剝離。 於80℃重工性之評價中,將各樣品於80℃放置1天後取出,然後立即手動快速地將雙面黏著帶部分從玻璃板剝離。 ◎:無糊劑殘留,雙面黏著帶部分未斷裂,玻璃板可重工 ○:有糊劑殘留,但雙面黏著帶未斷裂,玻璃板可重工 ×:雙面黏著帶斷裂,玻璃板無法重工 (3) Evaluation of 23°C and 80°C Reworkability Double-sided adhesive tape was cut into 5 mm × 100 mm pieces and one side was attached to a glass plate. The other side of the double-sided adhesive tape was also attached to the glass plate to produce a glass plate/double-sided adhesive tape/glass plate laminate. The laminate was pressed together with a 5 kg weight for 10 seconds. The first foamed resin layer (center portion) of the laminate was sliced with a feather blade. This resulted in samples consisting of glass plate/adhesive layer/second foamed resin layer (outermost layer)-1/first foamed resin layer (approximately half the thickness) (referred to as "second foamed resin layer (outermost layer)-1 sample") and first foamed resin layer (approximately half the thickness)/second foamed resin layer (outermost layer)-2/adhesive layer/glass plate (referred to as "second foamed resin layer (outermost layer)-2 sample"). To evaluate reworkability at 23°C, each sample was stored at 23°C for four days, and then the double-sided adhesive tape was manually and quickly peeled off the glass plate. To evaluate reworkability at 80°C, each sample was placed at 80°C for one day, then removed and immediately and quickly peeled from the glass plate with the double-sided adhesive tape. ◎: No adhesive residue, the double-sided adhesive tape was not broken, and the glass plate was reworkable. ○: Adhesive residue was present, but the double-sided adhesive tape was not broken, and the glass plate was reworkable. ×: The double-sided adhesive tape was broken, and the glass plate could not be reworked.
根據第2發泡樹脂層(最外層)-1側之樣品及第2發泡樹脂層(最外層)-2側之樣品之評價結果,按照以下標準,對23℃重工性及80℃重工性分別進行重工性綜合評價。 ◎:第2發泡樹脂層(最外層)-1側之樣品及第2發泡樹脂層(最外層)-2側之樣品之評價結果均為◎ 〇:第2發泡樹脂層(最外層)-1側之樣品及第2發泡樹脂層(最外層)-2側之樣品之評價結果中,至少一者為◎,或均為〇 △:第2發泡樹脂層(最外層)-1側之樣品及第2發泡樹脂層(最外層)-2側之樣品之評價結果中,至少一者為〇 ×:第2發泡樹脂層(最外層)-1側之樣品及第2發泡樹脂層(最外層)-2側之樣品之評價結果均為× Based on the evaluation results of the samples on the second foamed resin layer (outermost layer) -1 side and the samples on the second foamed resin layer (outermost layer) -2 side, comprehensive evaluations of heavy-duty properties were conducted for both 23°C and 80°C, respectively, according to the following standards. ◎: The evaluation results for the sample on the second foamed resin layer (outermost layer) -1 side and the sample on the second foamed resin layer (outermost layer) -2 side were both ◎. ○: At least one of the evaluation results for the sample on the second foamed resin layer (outermost layer) -1 side and the sample on the second foamed resin layer (outermost layer) -2 side was ◎, or both were 0. △: At least one of the evaluation results for the sample on the second foamed resin layer (outermost layer) -1 side and the sample on the second foamed resin layer (outermost layer) -2 side was 0. ×: The evaluation results for the sample on the second foamed resin layer (outermost layer) - side 1 and the sample on the second foamed resin layer (outermost layer) - side 2 were both ×.
(4)評價操作性 將所得雙面黏著帶切成寬度3 mm×長度10 mm之大小,於25℃、相對濕度50%,使用Autograph AGS-X(島津製作所製造),將雙面黏著帶以1 N拉伸10秒,測定伸長(mm)。根據以下標準進行評價。初始負載變化設為1 N/秒。 ○:伸長未達10 mm。 ×:伸長為10 mm以上。 (4) Evaluation of operability The obtained double-sided adhesive tape was cut into pieces of 3 mm wide and 10 mm long. The tape was stretched at 1 N for 10 seconds using an Autograph AGS-X (manufactured by Shimadzu Corporation) at 25°C and a relative humidity of 50%. The elongation (mm) was measured. Evaluation was performed according to the following criteria. The initial load change was set to 1 N/second. ○: Elongation was less than 10 mm. ×: Elongation was 10 mm or more.
(5)評價有無彎折 將所得雙面黏著帶切成100 mm×300 mm之大小,以第2發泡樹脂層(最外層)-2側為內側之方式捲繞於直徑為3英吋之紙芯,獲得卷狀體。 從所得卷狀體上拉出雙面黏著帶後,目視觀察,並根據以下標準進行評價。 ○:未觀察到彎折。 ×:觀察到彎折。 (5) Evaluation of the presence of bends The obtained double-sided adhesive tape was cut into a size of 100 mm × 300 mm and wound around a paper core with a diameter of 3 inches with the second foam resin layer (outermost layer) -2 side as the inner side to obtain a roll. After pulling the double-sided adhesive tape out of the obtained roll, visually observe and evaluate according to the following criteria. ○: No bends were observed. ×: Bending was observed.
[表2]
[表4]
[表5]
根據本發明,可提供一種雙面黏著帶,其兩個黏著面之階差追隨性高,且可對剪切負載及傾斜負載表現出高保持力,至少一個黏著面之重工性優異,進而,於貼附時操作性亦優異。According to the present invention, a double-sided adhesive tape can be provided, wherein the two adhesive surfaces have high step tracking properties and can exhibit high holding force against shear loads and tilt loads. At least one adhesive surface has excellent workability, and further, the workability during attachment is also excellent.
1,2:SUS板 3:試驗片(雙面黏著帶) 4:PET膜(#50) 5:貫通孔 6:砝碼(3 kg) 7:雙面黏著帶 8:發泡體基材 91,92:黏著劑層 10:第1發泡樹脂層 11,12:第2發泡樹脂層 15:砝碼(1 kg) 16:SUS板 17:玻璃板 18:雙面黏著帶 1, 2: SUS board 3: Test piece (double-sided adhesive tape) 4: PET film (#50) 5: Through hole 6: Weight (3 kg) 7: Double-sided adhesive tape 8: Foam substrate 91, 92: Adhesive layer 10: First foaming resin layer 11, 12: Second foaming resin layer 15: Weight (1 kg) 16: SUS board 17: Glass board 18: Double-sided adhesive tape
[圖1]係表示雙面黏著帶之45°傾斜保持力試驗之示意圖。 [圖2]係表示雙面黏著帶之剪切保持力試驗之示意圖。 [圖3]係示意性地表示本發明之雙面黏著帶之一例之剖視圖。 Figure 1 is a schematic diagram showing a 45° tilt holding strength test for a double-sided adhesive tape. Figure 2 is a schematic diagram showing a shear holding strength test for a double-sided adhesive tape. Figure 3 is a schematic cross-sectional view of an example of the double-sided adhesive tape of the present invention.
7:雙面黏著帶 7: Double-sided adhesive tape
8:發泡體基材 8: Foam substrate
10:第1發泡樹脂層 10: 1st foam resin layer
11,12:第2發泡樹脂層 11,12: Second foam resin layer
91,92:黏著劑層 91,92: Adhesive layer
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|---|---|---|---|---|
| CN113755113A (en) * | 2021-09-15 | 2021-12-07 | 苏州德佑新材料科技股份有限公司 | Reworked adhesive tape and stripping method thereof |
| WO2025013892A1 (en) * | 2023-07-11 | 2025-01-16 | 積水化学工業株式会社 | Double-sided adhesive tape |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI534237B (en) * | 2011-06-17 | 2016-05-21 | 積水化學工業股份有限公司 | Transparent adhesive tape, film panel with metal film, cover panel - touch panel module laminated body, cover panel - display panel module laminated body, touch panel module - display panel module laminated body, and image display Device |
| JP2019137795A (en) * | 2018-02-13 | 2019-08-22 | 積水化学工業株式会社 | Expanded sheet and adhesive tape |
Family Cites Families (11)
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|---|---|---|---|---|
| JPH0753929A (en) * | 1993-08-10 | 1995-02-28 | Nitto Denko Corp | Pressure sensitive adhesive tape |
| JP6426887B2 (en) | 2013-09-20 | 2018-11-21 | 積水化学工業株式会社 | Acrylic adhesive for portable electronic devices and double-sided adhesive tape for portable electronic devices |
| WO2018179098A1 (en) | 2017-03-28 | 2018-10-04 | 株式会社ナム | Adhesive member |
| WO2019026510A1 (en) | 2017-07-31 | 2019-02-07 | 日東電工株式会社 | Double-sided adhesive sheet |
| JP6901366B2 (en) | 2017-09-29 | 2021-07-14 | 積水化学工業株式会社 | Adhesive tape and laminated structure |
| JP7003545B2 (en) * | 2017-10-03 | 2022-01-20 | Dic株式会社 | Foam-based adhesive tapes, articles and electronic devices |
| JP7323360B2 (en) | 2018-07-04 | 2023-08-08 | 積水化学工業株式会社 | double sided adhesive tape |
| JP7265374B2 (en) | 2019-02-28 | 2023-04-26 | 積水化学工業株式会社 | Foam composite sheet and adhesive tape |
| JP7215932B2 (en) | 2019-02-28 | 2023-01-31 | 積水化学工業株式会社 | Foam composite sheet and adhesive tape |
| JP7265379B2 (en) | 2019-03-06 | 2023-04-26 | 積水化学工業株式会社 | Laminates and adhesive tapes |
| JP2019214739A (en) | 2019-08-26 | 2019-12-19 | 積水化学工業株式会社 | Acryl adhesive and adhesive sheet for electronic apparatus |
-
2021
- 2021-09-22 CN CN202411048081.2A patent/CN118978871A/en active Pending
- 2021-09-22 WO PCT/JP2021/034884 patent/WO2022065392A1/en not_active Ceased
- 2021-09-22 JP JP2022514216A patent/JP7681004B2/en active Active
- 2021-09-22 CN CN202180028783.2A patent/CN115427527B/en active Active
- 2021-09-23 TW TW110135353A patent/TWI891908B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI534237B (en) * | 2011-06-17 | 2016-05-21 | 積水化學工業股份有限公司 | Transparent adhesive tape, film panel with metal film, cover panel - touch panel module laminated body, cover panel - display panel module laminated body, touch panel module - display panel module laminated body, and image display Device |
| JP2019137795A (en) * | 2018-02-13 | 2019-08-22 | 積水化学工業株式会社 | Expanded sheet and adhesive tape |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202219210A (en) | 2022-05-16 |
| WO2022065392A1 (en) | 2022-03-31 |
| CN118978871A (en) | 2024-11-19 |
| CN115427527B (en) | 2024-08-20 |
| JP7681004B2 (en) | 2025-05-21 |
| JPWO2022065392A1 (en) | 2022-03-31 |
| CN115427527A (en) | 2022-12-02 |
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