TWI882036B - 攝像元件及攝像裝置 - Google Patents

攝像元件及攝像裝置 Download PDF

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Publication number
TWI882036B
TWI882036B TW109139673A TW109139673A TWI882036B TW I882036 B TWI882036 B TW I882036B TW 109139673 A TW109139673 A TW 109139673A TW 109139673 A TW109139673 A TW 109139673A TW I882036 B TWI882036 B TW I882036B
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TW
Taiwan
Prior art keywords
shielding wall
light
incident light
light shielding
semiconductor substrate
Prior art date
Application number
TW109139673A
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English (en)
Chinese (zh)
Other versions
TW202133457A (zh
Inventor
田中洋志
守屋雄介
重歲卓志
Original Assignee
日商索尼半導體解決方案公司
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Application filed by 日商索尼半導體解決方案公司 filed Critical 日商索尼半導體解決方案公司
Publication of TW202133457A publication Critical patent/TW202133457A/zh
Application granted granted Critical
Publication of TWI882036B publication Critical patent/TWI882036B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8067—Reflectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW109139673A 2019-11-21 2020-11-13 攝像元件及攝像裝置 TWI882036B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-210864 2019-11-21
JP2019210864 2019-11-21

Publications (2)

Publication Number Publication Date
TW202133457A TW202133457A (zh) 2021-09-01
TWI882036B true TWI882036B (zh) 2025-05-01

Family

ID=75981598

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109139673A TWI882036B (zh) 2019-11-21 2020-11-13 攝像元件及攝像裝置

Country Status (5)

Country Link
US (1) US20220406832A1 (https=)
JP (1) JP7636339B2 (https=)
CN (1) CN114556573B (https=)
TW (1) TWI882036B (https=)
WO (1) WO2021100298A1 (https=)

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KR102598243B1 (ko) * 2021-02-25 2023-11-03 동우 화인켐 주식회사 화상표시장치용 격벽, 이를 제조하는 방법 및 상기 격벽을 포함하는 화상표시장치
CN115881738A (zh) * 2021-09-26 2023-03-31 群创光电股份有限公司 光学感测装置
US20240413179A1 (en) * 2021-10-20 2024-12-12 Sony Semiconductor Solutions Corporation Imaging device
TW202333488A (zh) * 2022-02-03 2023-08-16 日商索尼半導體解決方案公司 固態攝像元件及電子機器
JP7425428B2 (ja) * 2022-07-05 2024-01-31 国立大学法人 熊本大学 光学測定器用サンプルホルダおよび光学測定器
WO2024187453A1 (en) * 2023-03-16 2024-09-19 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Imaging lens assembly, camera module, and imaging device
CN118214952B (zh) * 2024-05-20 2024-08-02 浙江大华技术股份有限公司 图像采集方法、设备、电子设备和计算机可读存储介质

Citations (4)

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JPH11195655A (ja) * 1998-01-06 1999-07-21 Fuji Electric Co Ltd 炭化けい素縦形ｆｅｔの製造方法および炭化けい素縦形ｆｅｔ
JP2005294647A (ja) * 2004-04-01 2005-10-20 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法
JP2011119445A (ja) * 2009-12-03 2011-06-16 Toshiba Corp 裏面照射型固体撮像装置
JP2015065270A (ja) * 2013-09-25 2015-04-09 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器

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JP2009021415A (ja) * 2007-07-12 2009-01-29 Panasonic Corp 固体撮像装置およびその製造方法
JP2010239076A (ja) * 2009-03-31 2010-10-21 Sony Corp 固体撮像装置とその製造方法、及び電子機器
KR20120120669A (ko) * 2011-04-25 2012-11-02 에스케이하이닉스 주식회사 Ｃｍｏｓ 이미지 센서
TWI577001B (zh) * 2011-10-04 2017-04-01 新力股份有限公司 固體攝像裝置、固體攝像裝置之製造方法及電子機器
JP2014049575A (ja) * 2012-08-30 2014-03-17 Sony Corp 撮像素子、撮像装置、製造装置および方法
JP2015060855A (ja) * 2013-09-17 2015-03-30 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
CN106068563B (zh) * 2015-01-13 2022-01-14 索尼半导体解决方案公司 固态成像装置、固态成像装置的制造方法和电子设备
US10818718B2 (en) * 2016-07-20 2020-10-27 Sony Corporation Light receiving element, method of manufacturing light receiving element, imaging device, and electronic apparatus
WO2019215986A1 (ja) * 2018-05-08 2019-11-14 ソニーセミコンダクタソリューションズ株式会社 撮像素子および撮像素子の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11195655A (ja) * 1998-01-06 1999-07-21 Fuji Electric Co Ltd 炭化けい素縦形ｆｅｔの製造方法および炭化けい素縦形ｆｅｔ
JP2005294647A (ja) * 2004-04-01 2005-10-20 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法
JP2011119445A (ja) * 2009-12-03 2011-06-16 Toshiba Corp 裏面照射型固体撮像装置
JP2015065270A (ja) * 2013-09-25 2015-04-09 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器

Also Published As

Publication number Publication date
TW202133457A (zh) 2021-09-01
WO2021100298A1 (ja) 2021-05-27
US20220406832A1 (en) 2022-12-22
CN114556573B (zh) 2025-07-15
CN114556573A (zh) 2022-05-27
JP7636339B2 (ja) 2025-02-26
JPWO2021100298A1 (https=) 2021-05-27

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