TWI872058B - 撓性構件的支撐工具以及顯示裝置 - Google Patents

撓性構件的支撐工具以及顯示裝置 Download PDF

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Publication number
TWI872058B
TWI872058B TW109111111A TW109111111A TWI872058B TW I872058 B TWI872058 B TW I872058B TW 109111111 A TW109111111 A TW 109111111A TW 109111111 A TW109111111 A TW 109111111A TW I872058 B TWI872058 B TW I872058B
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Taiwan
Prior art keywords
hinge
housing
addition
blade
outer shell
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TW109111111A
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English (en)
Chinese (zh)
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TW202041128A (zh
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遠藤秋男
楠本直人
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日商半導體能源研究所股份有限公司
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
    • G06F1/1681—Details related solely to hinges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Telephone Set Structure (AREA)
  • Casings For Electric Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
TW109111111A 2019-04-19 2020-04-01 撓性構件的支撐工具以及顯示裝置 TWI872058B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019079998 2019-04-19
JP2019-079998 2019-04-19
JP2019088911 2019-05-09
JP2019-088911 2019-05-09

Publications (2)

Publication Number Publication Date
TW202041128A TW202041128A (zh) 2020-11-01
TWI872058B true TWI872058B (zh) 2025-02-11

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TW109111111A TWI872058B (zh) 2019-04-19 2020-04-01 撓性構件的支撐工具以及顯示裝置
TW114101461A TW202531819A (zh) 2019-04-19 2020-04-01 撓性構件的支撐工具以及顯示裝置

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Country Status (6)

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US (2) US12400920B2 (https=)
JP (4) JP7487183B2 (https=)
KR (1) KR20210149771A (https=)
CN (1) CN113841193A (https=)
TW (2) TWI872058B (https=)
WO (1) WO2020212797A1 (https=)

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CN111683166B (zh) * 2020-05-28 2022-02-01 维沃移动通信有限公司 电子设备
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CN114067688B (zh) * 2021-11-18 2024-04-23 合肥维信诺科技有限公司 屏体翻折治具和屏体翻折方法
WO2023159599A1 (zh) * 2022-02-28 2023-08-31 京东方科技集团股份有限公司 柔性显示模组的支撑结构、及柔性显示装置
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WO2024049077A1 (ko) * 2022-09-02 2024-03-07 삼성전자주식회사 힌지 체결 구조를 포함하는 전자 장치
CN115899485B (zh) * 2022-12-22 2024-11-15 京东方科技集团股份有限公司 显示装置
CN116110286B (zh) * 2022-12-30 2024-08-06 武汉天马微电子有限公司 柔性显示组件
TWI847854B (zh) * 2023-08-30 2024-07-01 友達光電股份有限公司 液晶顯示裝置
CN117608364A (zh) * 2023-11-30 2024-02-27 联想(北京)有限公司 一种电子设备
TWI910919B (zh) * 2024-11-20 2026-01-01 高熵材料科技股份有限公司 強化支撐片及包含其之可摺疊顯示器

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JP2025128277A (ja) 2025-09-02
WO2020212797A1 (ja) 2020-10-22
US20220181222A1 (en) 2022-06-09
JP2025114797A (ja) 2025-08-05
JP2024098508A (ja) 2024-07-23
CN113841193A (zh) 2021-12-24
TW202531819A (zh) 2025-08-01
TW202041128A (zh) 2020-11-01
JP7487183B2 (ja) 2024-05-20
JPWO2020212797A1 (https=) 2020-10-22
US20250336736A1 (en) 2025-10-30
US12400920B2 (en) 2025-08-26
KR20210149771A (ko) 2021-12-09

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