TWI848870B - Tic-tac-toe shaped device for stripping die and method for the same - Google Patents

Abstract

A tic-tac-toe shaped device for stripping die includes a bottom base, a first guide device, a second guide device, a sliding device, a regulating device and a vacuum device. The bottom base has a channel. The first guide device and the second guide device are disposed on the bottom base. The sliding device is disposed on the first guide device. The regulating device is disposed on the second guide device. The vacuum device is connected to the channel. Such that, firstly, the tic-tac-toe shaped device for stripping die can control a size of a first gap to correspond target dies having different sizes by the sliding device and the regulating device, secondly, the tic-tac-toe shaped device for stripping die can separate a target die from a film with a moderate manner by the sliding device and the regulating device as well as the negative pressure, the stress concentration cannot be happened, and the target die can avoid from damaging or the film can avoid from damaging and remaining on a surface of the target die.

Description

Tic-tac-toe die stripping device and method

The present invention relates to a device and method for chip stripping, and in particular to a chip stripping device and method for chip stripping in a tic-tac-toe pattern.

After the wafer is cut into multiple dies, the dies will be transferred from the carrier film to the substrate. During the transfer process, first, the support device supports the die placement area of the carrier film; then, under ideal conditions, multiple pushers rise from the inside of the support device to the outside of the support device and push the target die up through the die placement area of the carrier film, so that the periphery of the target die is separated from the periphery of the die placement area of the carrier film, and the center of the target die is separated from the center of the die placement area of the carrier film; during the rise of the target die, the target die contacts the die bonding device, and the die bonding device absorbs the target die; finally, the pushers descend to the inside of the support device, and the die bonding device moves the target die to the substrate.

However, when the pushers push the target die up through the die placement area of the carrier film, the top of the pushers is sharp and the stress is easily over-concentrated, resulting in damage to the target die or damage to the carrier film and residues on the surface of the target die.

The main purpose of the present invention is to provide a tic-tac-toe die stripping device and method, which can separate the target die from the die placement area of the carrier film in a gentle manner.

In order to achieve the above-mentioned purpose, the present invention provides a tic-tac-toe-shaped die stripping device, comprising a base, a first guide device, a second guide device, a sliding device, an adjusting device and a vacuum device. The base has a channel. The first guide device is arranged on the base. The second guide device is arranged on the base. The sliding device is arranged on the first guide device. The adjusting device is arranged on the second guide device. The vacuum device is connected to the channel.

Among them, the first guiding device controls the movement of the sliding device, and the second guiding device controls the movement of the adjusting device, so that a first gap is formed between the sliding device and the adjusting device, and the first gap is aligned with a target grain on a grain placement area of a supporting film, and the length and width of the first gap can be adjusted according to the length and width of the target grain.

The first guide device further controls the movement of the sliding device, and the second guide device further controls the movement of the adjusting device, so that the sliding device and the adjusting device are close to each other and close the first gap.

Among them, the first guiding device further controls the sliding device to move and gradually move away from the target grain, and the second guiding device controls the adjusting device to be fixed, so that a second gap is formed between the sliding device and the adjusting device, and the second gap gradually becomes larger; the channel is connected to the second gap, and the vacuum device evacuates the channel to generate a vacuum and provide a negative pressure. The negative pressure passes through the channel and the second gap in sequence to absorb the grain placement area of the supporting film. The grain placement area of the supporting film gradually bends and enters the second gap, so that the target grain gradually leaves the grain placement area of the supporting film.

In some embodiments, the sliding device includes a first slider and a second slider, and the adjusting device includes a first adjusting block and a second adjusting block; wherein the first guiding device controls the movement of the first slider and the second slider, and the second guiding device controls the movement of the first adjusting block and the second adjusting block, so that the first gap is formed between the first slider, the second slider, and the first adjusting block and the second adjusting block; wherein the first guiding device further controls the movement of the first slider and the second slider, and the second guiding device controls the movement of the first adjusting block and the second adjusting block. The device further controls the movement of the first adjusting block and the second adjusting block, so that the first slider, the second slider, the first adjusting block and the second adjusting block are close to each other and the first gap is closed; wherein the first guiding device further controls the movement of the first slider and the second slider, so that the second slider gradually moves away from the target grain, and the second guiding device controls the first adjusting block and the second adjusting block to be fixed, so that the second gap is formed between the first slider, the second slider, the first adjusting block and the second adjusting block.

In some embodiments, the length of the target die is less than or equal to the length of the first slit, and the width of the target die is less than or equal to the width of the first slit.

In some embodiments, the width of the target grain is less than or equal to the width of the second slit, and the length of the second slit gradually increases.

In order to achieve the above-mentioned purpose, the present invention provides a tic-tac-toe grain stripping method, comprising the following steps: (a) a first guide device controls the movement of a sliding device, and a second guide device controls the movement of an adjusting device, so that a first gap is formed between the sliding device and the adjusting device, the first gap is aligned with a target grain on a grain placement area of a carrier film, and the length and width of the first gap can be adjusted according to the length and width of the target grain; (b) the first guide device further controls the movement of the sliding device, and the second guide device further controls the movement of the adjusting device, so that the sliding device and the adjusting device are close to each other and closed. The first gap; and (c) the first guiding device further controls the sliding device to move and gradually move away from the target grain, and the second guiding device controls the adjusting device to be fixed, so that a second gap is formed between the sliding device and the adjusting device, and the second gap gradually becomes larger; a channel of a base is connected to the second gap, a vacuum device evacuates the channel to generate a vacuum and provides a negative pressure, the negative pressure passes through the channel and the second gap in sequence to absorb the grain placement area of the carrier film, the grain placement area of the carrier film gradually bends and enters the second gap, so that the target grain gradually leaves the grain placement area of the carrier film.

In some embodiments, step (a) further includes: the first guide device controls a first slider and a second slider of the sliding device to move, and the second guide device controls a first adjusting block and a second adjusting block of the adjusting device to move, so that the first slider, the second slider, and the first adjusting block and the second adjusting block form the first gap; wherein, step (b) further includes: the first guide device further controls the first slider and the second slider to move, and the second guide device further controls the first adjusting block to move. The node block and the second adjusting block move so that the first slider, the second slider, the first adjusting block and the second adjusting block approach each other and close the first gap; wherein, step (c) further includes: the first guiding device further controls the first slider and the second slider to move so that the second slider gradually moves away from the target grain, and the second guiding device controls the first adjusting block and the second adjusting block to be fixed so that the second gap is formed between the first slider, the second slider, the first adjusting block and the second adjusting block.

In some embodiments, step (a) further includes: the length of the target grain is less than or equal to the length of the first slit, and the width of the target grain is less than or equal to the width of the first slit.

In some embodiments, step (c) further includes: the width of the target grain is less than or equal to the width of the second slit, and the length of the second slit gradually increases.

The effectiveness of the present invention lies in that the present invention can first control the size of the first gap by means of a sliding device and an adjusting device to correspond to target grains of different sizes, and then control the size of the second gap by means of a sliding device and an adjusting device and cooperate with negative pressure to separate the target grain from the grain placement area of the carrier film in a more gentle manner without the problem of stress concentration, thereby avoiding damage to the target grain or damage to the grain placement area of the carrier film and residues remaining on the surface of the target grain.

The following is a more detailed description of the implementation of the present invention with reference to the drawings and component symbols, so that those skilled in the art can implement the present invention accordingly after reading this specification.

FIG. 1A is a three-dimensional diagram of the device of the present invention. FIG. 1B is a schematic diagram of the connection relationship between the vacuum device 60 of the present invention and the channel 11. As shown in FIG. 1A and FIG. 1B, the present invention provides a tic-tac-toe-shaped die stripping device, comprising a base 10, a first guide device 20, a second guide device 30, a sliding device 40, an adjusting device 50 and a vacuum device 60. The base 10 has a channel 11, and the first guide device 20 and the second guide device 30 are arranged on the base 10. The sliding device 40 is arranged on the first guide device 20 and includes a first slider 41 and a second slider 42. The adjusting device 50 is arranged on the second guide device 30 and includes a first adjusting block 51 and a second adjusting block 52. The vacuum device 60 is connected to the channel 11.

Fig. 2 is a flow chart of the method of the present invention. Fig. 3 is a top view of step S10 of the method of the present invention. Fig. 4 is a cross-sectional view taken along line IV-IV of Fig. 3. Fig. 5 is a cross-sectional view taken along line V-V of Fig. 3. Figs. 6 to 9 are top views of step S10 of the method of the present invention, in which the length and width of the first slit 71 are adjusted according to the length and width of the target grain 90. Fig. 10 is a top view of step S20 of the method of the present invention. Fig. 11 is a cross-sectional view taken along line XI-XI of Fig. 10. Fig. 12 is a top view of step S30 of the method of the present invention, in which the target grain 90 begins to detach from the carrier film 80. Fig. 13 is a cross-sectional view taken along line XIII-XIII of Fig. 12. FIG. 14 is a top view of the target grain 90 of step S30 of the method of the present invention continuously detaching from the carrier film 80. FIG. 15 is a cross-sectional view of line XV-XV of FIG. 14. FIG. 16 is a top view of the target grain 90 of step S30 of the method of the present invention completely detaching from the carrier film 80. FIG. 17 is a cross-sectional view of line XVII-XVII of FIG. 16. The present invention provides a tic-tac-toe grain peeling method, comprising the following steps:

In step S10, as shown in FIGS. 2 to 9 , the first guide device 20 controls the movement of the first slider 41 and the second slider 42 of the sliding device 40, and the second guide device 30 controls the movement of the first adjusting block 51 and the second adjusting block 52 of the adjusting device 50, so that a first gap 71 is formed between the first slider 41, the second slider 42, the first adjusting block 51 and the second adjusting block 52, and the first gap 71 is aligned with a target grain 90 on a grain placement area 81 of a carrier film 80, and the length and width of the first gap 71 can be adjusted according to the length and width of the target grain 90.

In step S20, as shown in FIGS. 2 , 10 and 11 , the first guide device 20 further controls the movement of the first slider 41 and the second slider 42 of the sliding device 40, and the second guide device 30 further controls the movement of the first adjusting block 51 and the second adjusting block 52 of the adjusting device 50, so that the first slider 41, the second slider 42, the first adjusting block 51 and the second adjusting block 52 approach each other and close the first gap 71.

In step S30, as shown in FIG. 2 and FIG. 12 to FIG. 17, the first guide device 20 further controls the first slider 41 and the second slider 42 of the sliding device 40 to move so that the second slider 42 gradually moves away from the target die 90, and the second guide device 30 controls the first adjusting block 51 and the second adjusting block 52 of the adjusting device 50 to be fixed so that a first slider 41, the second slider 42, the first adjusting block 51 and the second adjusting block 52 are formed. The channel 11 is connected to the second slit 72, and the vacuum device 60 evacuates the channel 11 to generate a vacuum and provides a negative pressure 61. The negative pressure 61 passes through the channel 11 and the second slit 72 in sequence to adsorb the grain placement area 81 of the carrier film 80. The grain placement area 81 of the carrier film 80 gradually bends and enters the second slit 72, so that the target grain 90 gradually detaches from the grain placement area 81 of the carrier film 80.

Preferably, step S10 further includes: the length of the target grain 90 is less than or equal to the length of the first slit 71 , and the width of the target grain 90 is less than or equal to the width of the first slit 71 .

Preferably, step S30 further includes: the width of the target die 90 is less than or equal to the width of the second slit 72, and the length of the second slit 72 gradually increases. Thereby, the negative pressure 61 absorbs the die placement area 81 of the carrier film through the second slit 72, and the die placement area 81 of the carrier film 80 gradually bends and enters the second slit 72, so that the target die 90 gradually detaches from the die placement area 81 of the carrier film 80.

In summary, the present invention can first control the size of the first gap 71 by the sliding device 40 and the adjusting device 50 to correspond to target grains 90 of different sizes, and then control the size of the second gap 72 by the sliding device 40 and the adjusting device 50 and cooperate with the negative pressure 61 to separate the target grain 90 from the grain placement area 81 of the carrier film 80 in a gentle manner without the problem of stress concentration, thereby avoiding damage to the target grain 90 or damage to the grain placement area 81 of the carrier film 80 and residues remaining on the surface of the target grain 90.

The above is only used to explain the preferred embodiments of the present invention, and is not intended to limit the present invention in any form. Therefore, any modifications or changes made to the present invention under the same spirit of the invention should still be included in the scope of protection of the present invention.

10: base 11: channel 20: first guide device 30: second guide device 40: sliding device 41: first slider 42: second slider 50: adjusting device 51: first adjusting block 52: second adjusting block 60: vacuum device 61: negative pressure 71: first gap 72: second gap 80: carrier film 81: die placement area 90: target die S10～S30: steps

FIG. 1A is a three-dimensional diagram of the device of the present invention. FIG. 1B is a schematic diagram of the connection relationship between the vacuum device of the present invention and the channel. FIG. 2 is a flow chart of the method of the present invention. FIG. 3 is a top view of step S10 of the method of the present invention. FIG. 4 is a cross-sectional view of line IV-IV of FIG. 3. FIG. 5 is a cross-sectional view of line V-V of FIG. 3. FIG. 6 to 9 are top views of step S10 of the method of the present invention, in which the length and width of the first slit are adjusted according to the length and width of the target grain. FIG. 10 is a top view of step S20 of the method of the present invention. FIG. 11 is a cross-sectional view of line XI-XI of FIG. 10. FIG. 12 is a top view of step S30 of the method of the present invention, in which the target grain begins to detach from the carrier film. FIG. 13 is a cross-sectional view taken along line XIII-XIII of FIG. 12 . FIG. 14 is a top view of the target grains of step S30 of the method of the present invention continuously detaching from the carrier film. FIG. 15 is a cross-sectional view taken along line XV-XV of FIG. 14 . FIG. 16 is a top view of the target grains of step S30 of the method of the present invention completely detaching from the carrier film. FIG. 17 is a cross-sectional view taken along line XVII-XVII of FIG. 16 .

10: Base

20: First guide device

30: Second guiding device

40: Sliding device

41: First slider

42: Second slider

50: Adjustment device

51: First adjustment block

52: Second adjustment block

Claims (8)

A tic-tac-toe-shaped grain stripping device comprises: a base having a channel; a first guide device disposed on the base; a second guide device disposed on the base; a sliding device disposed on the first guide device; an adjusting device disposed on the second guide device; and a vacuum device connected to the channel; wherein the first guide device controls the movement of the sliding device, and the second guide device controls the movement of the adjusting device, so that a first gap is formed between the sliding device and the adjusting device, the first gap is aligned with a target grain on a grain placement area of a carrier film, and the length and width of the first gap can be adjusted according to the length and width of the target grain; Wherein, the first guide device further controls the movement of the sliding device, and the second guide device further controls the movement of the adjusting device, so that the sliding device and the adjusting device are close to each other and close the first gap; and The first guide device further controls the sliding device to move and gradually move away from the target crystal grain, and the second guide device controls the adjusting device to be fixed, so that a second gap is formed between the sliding device and the adjusting device, and the second gap gradually becomes larger; the channel is connected to the second gap, and the vacuum device evacuates the channel to generate a vacuum and provide a negative pressure, which passes through the channel and the second gap in sequence to absorb the crystal grain placement area of the carrier film, and the crystal grain placement area of the carrier film gradually bends and enters the second gap, so that the target crystal grain gradually leaves the crystal grain placement area of the carrier film. The tic-tac-toe die stripping device as described in claim 1, wherein the sliding device includes a first slider and a second slider, and the adjusting device includes a first adjusting block and a second adjusting block; wherein the first guiding device controls the movement of the first slider and the second slider, and the second guiding device controls the movement of the first adjusting block and the second adjusting block, so that the first gap is formed between the first slider, the second slider, and the first adjusting block and the second adjusting block; wherein the first guiding device further controls the movement of the first slider and the second slider, and The second guide device further controls the movement of the first adjusting block and the second adjusting block, so that the first slider, the second slider, the first adjusting block and the second adjusting block approach each other and close the first gap; wherein, the first guide device further controls the movement of the first slider and the second slider, so that the second slider gradually moves away from the target grain, and the second guide device controls the first adjusting block and the second adjusting block to be fixed, so that the second gap is formed between the first slider, the second slider, the first adjusting block and the second adjusting block. A tic-tac-toe die stripping device as described in claim 1, wherein the length of the target die is less than or equal to the length of the first slit, and the width of the target die is less than or equal to the width of the first slit. A tic-tac-toe die stripping device as described in claim 1, wherein the width of the target die is less than or equal to the width of the second slit, and the length of the second slit gradually increases. A tic-tac-toe grain stripping method comprises the following steps: (a) a first guide device controls the movement of a sliding device, and a second guide device controls the movement of an adjusting device, so that a first gap is formed between the sliding device and the adjusting device, the first gap is aligned with a target grain on a grain placement area of a carrier film, and the length and width of the first gap can be adjusted according to the length and width of the target grain; (b) the first guide device further controls the movement of the sliding device, and the second guide device further controls the movement of the adjusting device, so that the sliding device and the adjusting device are close to each other and close the first gap; and (c) The first guide device further controls the sliding device to move and gradually move away from the target crystal grain, and the second guide device controls the adjusting device to be fixed, so that a second gap is formed between the sliding device and the adjusting device, and the second gap gradually becomes larger; a channel of a base is connected to the second gap, and a vacuum device evacuates the channel to generate a vacuum and provide a negative pressure, and the negative pressure passes through the channel and the second gap in sequence to absorb the crystal grain placement area of the carrier film, and the crystal grain placement area of the carrier film gradually bends and enters the second gap, so that the target crystal grain gradually leaves the crystal grain placement area of the carrier film. The tic-tac-toe die stripping method as described in claim 5, wherein step (a) further comprises: the first guide device controls the movement of a first slider and a second slider of the sliding device, and the second guide device controls the movement of a first adjusting block and a second adjusting block of the adjusting device, so that the first gap is formed between the first slider, the second slider, and the first adjusting block and the second adjusting block; wherein step (b) further comprises: the first guide device further controls the movement of the first slider and the second slider, and the second guide device further controls the movement of the first adjusting block and the second adjusting block. The first adjusting block and the second adjusting block are controlled to move so that the first slider, the second slider, the first adjusting block and the second adjusting block are close to each other and the first gap is closed; wherein, step (c) further includes: the first guiding device further controls the first slider and the second slider to move so that the second slider gradually moves away from the target grain, and the second guiding device controls the first adjusting block and the second adjusting block to be fixed so that the second gap is formed between the first slider, the second slider, the first adjusting block and the second adjusting block. A tic-tac-toe grain stripping method as described in claim 5, wherein step (a) further includes: the length of the target grain is less than or equal to the length of the first gap, and the width of the target grain is less than or equal to the width of the first gap. The tic-tac-toe grain stripping method as described in claim 5, wherein step (c) further includes: the width of the target grain is less than or equal to the width of the second slit, and the length of the second slit gradually increases.

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