TWI847464B - Cleaning device - Google Patents
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- TWI847464B TWI847464B TW111150621A TW111150621A TWI847464B TW I847464 B TWI847464 B TW I847464B TW 111150621 A TW111150621 A TW 111150621A TW 111150621 A TW111150621 A TW 111150621A TW I847464 B TWI847464 B TW I847464B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 114
- 230000007246 mechanism Effects 0.000 claims abstract description 95
- 238000000034 method Methods 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 43
- 229910052710 silicon Inorganic materials 0.000 abstract description 43
- 239000010703 silicon Substances 0.000 abstract description 43
- 230000000694 effects Effects 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 35
- 239000000463 material Substances 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 208000037805 labour Diseases 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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Abstract
本發明公開了一種清洗裝置,包括:清洗槽,清洗槽具有清洗腔;第 一承載結構用於承載待清洗件,第一承載結構可移動;第二承載結構用於承載待清洗件,第二承載結構可移動;驅動機構用於在驅動第一承載結構移動至脫離待清洗件的情況下,驅動第二承載結構移動至承載待清洗件;驅動機構用於在驅動第一承載結構移動至承載待清洗件的情況下,驅動第二承載結構移動至脫離待清洗件。待清洗件可以為矽晶片,在槽內清洗矽晶片時,通過第一承載結構與第二承載結構可以交替進行承載待清洗件,使承載結構與矽晶片接觸部位得到較好清洗,提高矽晶片的清洗效果。 The present invention discloses a cleaning device, comprising: a cleaning tank having a cleaning cavity; a first supporting structure for supporting an object to be cleaned, the first supporting structure being movable; a second supporting structure for supporting an object to be cleaned, the second supporting structure being movable; a driving mechanism for driving the second supporting structure to move to the object to be cleaned when the first supporting structure is driven to move to the object to be cleaned away; and a driving mechanism for driving the second supporting structure to move to the object to be cleaned away when the first supporting structure is driven to move to the object to be cleaned. The object to be cleaned can be a silicon wafer. When cleaning the silicon wafer in the tank, the first supporting structure and the second supporting structure can alternately support the object to be cleaned, so that the contact part between the supporting structure and the silicon wafer can be better cleaned, thereby improving the cleaning effect of the silicon wafer.
Description
本發明屬於矽晶片技術領域,具體是關於一種清洗裝置。 The present invention belongs to the field of silicon chip technology, and specifically relates to a cleaning device.
矽晶片清洗作為製作太陽能電池和積體電路的基礎,非常重要,清洗的效果直接影響到太陽能電池和積體電路最終的性能、效率和穩定性。矽晶片從矽棒上切割下來,矽晶片表面的多層晶格處於被破的狀態,佈滿不飽和的懸掛鍵,懸掛鍵的活性較高,十分容易吸附外界的雜質粒子,導致矽晶片表面被污染且性能變差。顆粒雜質會導致矽晶片的介電強度降低,金屬離子會增大太陽能電池P-N結的反向漏電流和降低少子的壽命,有機化合物使氧化層的品質劣化,H2O會加劇矽表面的腐蝕。清洗矽晶片不僅要除去矽晶片表面的雜質,而且要使矽晶片表面鈍化,從而減小矽晶片表面的吸附能力。高規格的矽晶片對表面的潔淨度要求非常嚴格,理論上不允許存在任何顆粒、金屬離子、有機黏附、水汽、氧化層等,而且矽晶片表面要求具有原子級的平整度,矽晶片邊緣的懸掛鍵以結氫終止。由於矽晶片清洗技術的缺陷,大型積體電路中因為矽基體的潔淨度不夠而產生問題,甚至失效的比例達到50%,因此優化矽晶片的清洗製程極其必要。 Silicon wafer cleaning is very important as the basis for manufacturing solar cells and integrated circuits. The cleaning effect directly affects the final performance, efficiency and stability of solar cells and integrated circuits. When silicon wafers are cut from silicon rods, the multi-layer lattices on the surface of the silicon wafers are in a broken state and are filled with unsaturated hanging bonds. The hanging bonds are highly active and easily absorb foreign impurity particles, causing the surface of the silicon wafer to be contaminated and the performance to deteriorate. Particle impurities will reduce the dielectric strength of silicon wafers, metal ions will increase the reverse leakage current of the solar cell PN junction and reduce the life of minority carriers, organic compounds will deteriorate the quality of the oxide layer, and H2O will aggravate the corrosion of the silicon surface. Cleaning silicon wafers not only removes impurities on the surface of silicon wafers, but also passivates the surface of silicon wafers, thereby reducing the adsorption capacity of the surface of silicon wafers. High-specification silicon wafers have very strict requirements on the cleanliness of the surface. In theory, no particles, metal ions, organic adhesion, water vapor, oxide layer, etc. are allowed to exist. In addition, the surface of silicon wafers is required to have atomic-level flatness, and the hanging bonds at the edges of silicon wafers are terminated with hydrogen. Due to defects in silicon wafer cleaning technology, problems arise in large integrated circuits due to insufficient cleanliness of the silicon substrate, and the failure rate can even reach 50%. Therefore, it is extremely necessary to optimize the silicon wafer cleaning process.
目前,矽晶片的清洗步驟主要使用槽式清洗方式,在槽內部清洗時,使用承載件承接矽晶片,由於承載件與矽晶片的接觸部位是固定的,矽晶片在接觸點清洗不到,造成清洗效果不佳。 At present, the cleaning process of silicon wafers mainly uses a tank cleaning method. When cleaning inside the tank, a carrier is used to hold the silicon wafer. Since the contact part between the carrier and the silicon wafer is fixed, the silicon wafer cannot be cleaned at the contact point, resulting in poor cleaning effect.
本發明實施例的目的是提供一種清洗裝置,用以解決在槽內清洗矽晶片時,承載件與矽晶片的接觸部位不易清洗,清洗效果差的問題。 The purpose of the embodiment of the present invention is to provide a cleaning device to solve the problem that when cleaning silicon wafers in a tank, the contact area between the carrier and the silicon wafer is difficult to clean and the cleaning effect is poor.
本發明實施例提供了一種清洗裝置,包括:清洗槽,該清洗槽具有清洗腔;第一承載結構,該第一承載結構用於承載待清洗件,該第一承載結構可移動;第二承載結構,該第二承載結構用於承載該待清洗件,該第二承載結構可移動;驅動機構,該驅動機構用於在驅動該第一承載結構移動至脫離該待清洗件的情況下,驅動該第二承載結構移動至承載該待清洗件;該驅動機構用於在驅動該第一承載結構移動至承載該待清洗件的情況下,驅動該第二承載結構移動至脫離該待清洗件。 The embodiment of the present invention provides a cleaning device, comprising: a cleaning tank, the cleaning tank having a cleaning cavity; a first supporting structure, the first supporting structure is used to support the object to be cleaned, the first supporting structure is movable; a second supporting structure, the second supporting structure is used to support the object to be cleaned, the second supporting structure is movable; a driving mechanism, the driving mechanism is used to drive the second supporting structure to move to support the object to be cleaned when the first supporting structure is driven to move away from the object to be cleaned; the driving mechanism is used to drive the second supporting structure to move away from the object to be cleaned when the first supporting structure is driven to move to support the object to be cleaned.
其中,該驅動機構包括:第一驅動機構與第二驅動機構,該第一驅動機構在驅動該第一承載結構沿該清洗腔的高度方向向下移動至脫離該待清洗件的情況下,該第二驅動機構驅動該第二承載結構沿該清洗腔的高度方向向上移動至承載該待清洗件; 該第一驅動機構在驅動該第一承載結構沿該清洗腔的高度方向向上移動至承載該待清洗件的情況下,該第二驅動機構驅動該第二承載結構沿該清洗腔的高度方向向下移動至脫離該待清洗件。 Wherein, the driving mechanism includes: a first driving mechanism and a second driving mechanism, wherein the first driving mechanism drives the first supporting structure to move downward along the height direction of the cleaning chamber to be separated from the object to be cleaned, and the second driving mechanism drives the second supporting structure to move upward along the height direction of the cleaning chamber to carry the object to be cleaned; When the first driving mechanism drives the first supporting structure to move upward along the height direction of the cleaning chamber to carry the object to be cleaned, the second driving mechanism drives the second supporting structure to move downward along the height direction of the cleaning chamber to be separated from the object to be cleaned.
其中,該第一承載結構包括:多個第一承載桿,多個該第一承載桿間隔設置,該第一承載桿用於承載該待清洗件,該第一承載桿可移動,在該第一承載桿移動過程中,該第一承載桿脫離或承載該待清洗件。 The first bearing structure includes: a plurality of first bearing rods, the plurality of first bearing rods are arranged at intervals, the first bearing rods are used to bear the object to be cleaned, the first bearing rods are movable, and during the movement of the first bearing rods, the first bearing rods are separated from or bear the object to be cleaned.
其中,該驅動機構包括:第一驅動機構,每個該第一驅動機構用於驅動一個該第一承載桿移動。 Wherein, the driving mechanism includes: a first driving mechanism, each of which is used to drive a first bearing rod to move.
其中,該第一驅動機構包括第一凸輪,在該第一凸輪轉動過程中,該第一凸輪驅動該第一承載桿移動。 Wherein, the first driving mechanism includes a first cam, and during the rotation of the first cam, the first cam drives the first bearing rod to move.
其中,該第一驅動機構還包括:第一齒輪,該第一凸輪上設有該第一齒輪,該第一齒輪轉動過程中帶動該第一凸輪轉動。 The first driving mechanism further includes: a first gear, the first cam is provided with the first gear, and the first gear drives the first cam to rotate during the rotation process.
其中,該第二承載結構包括:多個第二承載桿,多個該第二承載桿間隔設置,該第二承載桿用於承載該待清洗件,該第二承載桿可移動;該驅動機構還包括:第二驅動機構與第三齒輪,該第二驅動機構包括第二凸輪與第二齒輪,該第二凸輪上設有該第二齒輪;該第一齒輪與該第二齒輪均和該第三齒輪嚙合,該第三齒輪可帶動該第一齒輪與該第二齒輪轉動,該第二齒輪轉動過程中帶動該第二凸輪轉動,該第二凸輪轉動過程中驅動該第二承載桿移動; 該第一凸輪驅動該第一承載桿移動至脫離該待清洗件的情況下,該第二凸輪驅動該第二承載桿移動至承載該待清洗件;該第一凸輪驅動該第一承載桿移動至承載該待清洗件的情況下,該第二凸輪驅動該第二承載桿移動至脫離該待清洗件。 The second bearing structure includes: a plurality of second bearing rods, the plurality of second bearing rods are arranged at intervals, the second bearing rods are used to bear the items to be cleaned, and the second bearing rods are movable; the driving mechanism also includes: a second driving mechanism and a third gear, the second driving mechanism includes a second cam and a second gear, the second cam is provided with the second gear; the first gear and the second gear are both engaged with the third gear, and the third gear can drive the first gear and the second gear to move. The gear rotates, and the second gear rotates to drive the second cam to rotate, and the second cam rotates to drive the second bearing rod to move; When the first cam drives the first bearing rod to move away from the object to be cleaned, the second cam drives the second bearing rod to move to carry the object to be cleaned; When the first cam drives the first bearing rod to move to carry the object to be cleaned, the second cam drives the second bearing rod to move away from the object to be cleaned.
其中,該第一承載桿與該第二承載桿間隔平行設置;和/或該驅動機構還包括:第四齒輪與驅動電機,該第四齒輪與該第三齒輪嚙合,該驅動電機用於驅動該第四齒輪轉動,該第四齒輪轉動帶動該第三齒輪轉動;和/或該第一承載桿與該清洗腔底部的間隔距離大於該第二承載桿與該清洗腔底部的間隔距離;和/或每個該第一承載桿與該清洗腔底部的間隔距離相等,每個該第二承載桿與該清洗腔底部的間隔距離相等。 Among them, the first supporting rod and the second supporting rod are arranged in parallel with each other; and/or the driving mechanism further includes: a fourth gear and a driving motor, the fourth gear is engaged with the third gear, the driving motor is used to drive the fourth gear to rotate, and the rotation of the fourth gear drives the third gear to rotate; and/or the spacing distance between the first supporting rod and the bottom of the cleaning chamber is greater than the spacing distance between the second supporting rod and the bottom of the cleaning chamber; and/or the spacing distance between each of the first supporting rods and the bottom of the cleaning chamber is equal, and the spacing distance between each of the second supporting rods and the bottom of the cleaning chamber is equal.
其中,該第一承載結構與該第二承載結構的結構相同;該驅動機構包括:第二驅動機構,該第一驅動機構與該第二驅動機構的結構相同,該第二驅動機構用於驅動該第二承載結構。 The first bearing structure is the same as the second bearing structure; the driving mechanism includes: a second driving mechanism, the first driving mechanism is the same as the second driving mechanism, and the second driving mechanism is used to drive the second bearing structure.
其中,該第一承載結構與該第二承載結構的結構相同。 Wherein, the first supporting structure has the same structure as the second supporting structure.
在本發明實施例的清洗裝置中,第一承載結構用於承載待清洗件,該第二承載結構用於承載待清洗件,該驅動機構用於在驅動該第一承載結構移動至脫離該待清洗件的情況下,驅動該第二承載結構移動至承載該待清洗件;該驅動機構用於在驅動該第一承載結構移動至承載該待清洗件的情況下,驅動該第二承載結構移動至脫離該待清洗件。待清洗件可以為矽晶片,在槽內清洗矽晶片時,通過第一承載結構與第二承載結構可以交替進行承載待清洗 件,使得承載結構與矽晶片的接觸部位可以得到較好清洗,使得矽晶片邊緣清洗完全,避免承載結構與矽晶片接觸位置無法清洗完全的問題,提高矽晶片的清洗效果。 In the cleaning device of the embodiment of the present invention, the first supporting structure is used to support the object to be cleaned, the second supporting structure is used to support the object to be cleaned, and the driving mechanism is used to drive the second supporting structure to move to support the object to be cleaned when the first supporting structure is driven to move away from the object to be cleaned; the driving mechanism is used to drive the second supporting structure to move to away from the object to be cleaned when the first supporting structure is driven to move to support the object to be cleaned. The part to be cleaned can be a silicon wafer. When cleaning the silicon wafer in the tank, the first supporting structure and the second supporting structure can alternately support the part to be cleaned, so that the contact part between the supporting structure and the silicon wafer can be better cleaned, and the edge of the silicon wafer can be completely cleaned, avoiding the problem that the contact part between the supporting structure and the silicon wafer cannot be completely cleaned, thereby improving the cleaning effect of the silicon wafer.
10:清洗槽 10: Cleaning tank
11:清洗腔 11: Cleaning cavity
20:待清洗件 20: Parts to be cleaned
A:驅動機構 A: Driving mechanism
30:第三齒輪 30: Third gear
3:第一承載結構 3: The first bearing structure
31:第一承載桿 31: First load bearing rod
32:第一凸輪 32: First cam
40:第四齒輪 40: Fourth gear
4:第二承載結構 4: Second bearing structure
41:第二承載桿 41: Second bearing rod
42:第二凸輪 42: Second cam
圖1為清洗裝置中第一承載桿脫離待清洗件的一個示意圖;圖2為清洗裝置中第二承載桿脫離待清洗件的一個示意圖;圖3為清洗裝置的一個側示圖;圖4為清洗裝置的一個俯視圖;圖5為清洗裝置中凸輪與承載桿配合的一個示意圖。 Figure 1 is a schematic diagram of the first supporting rod in the cleaning device being separated from the object to be cleaned; Figure 2 is a schematic diagram of the second supporting rod in the cleaning device being separated from the object to be cleaned; Figure 3 is a side view of the cleaning device; Figure 4 is a top view of the cleaning device; Figure 5 is a schematic diagram of the cam and the supporting rod in the cleaning device.
下面將結合本發明實施例中的附圖,對本發明實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例是本發明一部分實施例,而不是全部的實施例。基於本發明中的實施例,本領域普通技術人員在沒有作出進步性勞動前提下所獲得的所有其他實施例,都屬於本發明保護的範圍。 The following will combine the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making progressive labor are within the scope of protection of the present invention.
本發明的說明書和申請專利範圍中的術語「第一」、「第二」等是用於區別類似的物件,而不用於描述特定的順序或先後次序。應該理解這樣使用的資料在適當情況下可以互換,以便本發明的實施例能夠以除了在這裡圖示或描述的那些以外的順序實施。此外,說明書以及申請專利範圍中「和/或」 表示所連線物件的至少其中之一,字元「/」,一般表示前後關聯物件是一種「或」的關係。 The terms "first", "second", etc. in the specification and patent application of the present invention are used to distinguish similar objects, rather than to describe a specific order or precedence. It should be understood that the data used in this way can be interchanged where appropriate so that the embodiments of the present invention can be implemented in an order other than those illustrated or described herein. In addition, "and/or" in the specification and patent application indicates at least one of the connected objects, and the character "/" generally indicates that the objects connected before and after are in an "or" relationship.
下面結合附圖1至圖5所示,通過具體的實施例及其應用場景對本發明實施例提供的清洗裝置進行詳細地說明。 The cleaning device provided by the embodiment of the present invention is described in detail below with reference to Figures 1 to 5 through specific embodiments and their application scenarios.
如圖1至圖5所示,本發明實施例的清洗裝置包括:清洗槽10、第一承載結構3、第二承載結構4與驅動機構A,其中,清洗槽10具有清洗腔11,清洗腔11中可以放置清洗液。第一承載結構3可以用於承載待清洗件,待清洗件可以為矽晶片,第一承載結構3可以移動,第一承載結構3可以沿清洗腔11的高度方向移動。第二承載結構4可以用於承載待清洗件,第二承載結構4可移動,第二承載結構4可以沿清洗腔11的高度方向移動。第一承載結構3可以為承載盤或承載柱,第二承載結構4可以為承載盤或承載柱,承載結構可以根據具體的待清洗件進行選擇。
As shown in Figures 1 to 5, the cleaning device of the embodiment of the present invention includes: a
驅動機構A用於在驅動第一承載結構3移動至脫離待清洗件20的情況下,驅動第二承載結構4移動至承載待清洗件20,通過第二承載結構4承載待清洗件20,讓第一承載結構3脫離待清洗件20,使得第一承載結構3與待清洗件20原來接觸的區域可以得到清洗,待清洗件20與承載結構接觸部位可以得到較好清洗。驅動機構A用於在驅動第一承載結構3移動至承載待清洗件20的情況下,驅動第二承載結構4移動至脫離待清洗件20,通過第一承載結構3承載待清洗件20,讓第二承載結構4脫離待清洗件20,使得第二承載結構4與待清洗件20原來接觸的區域可以得到清洗,待清洗件20與承載結構接觸部位可以得到較好清洗。在待清洗件20與承載結構脫離過程中,通過承載結構的移動可以對局部的清洗液進行擾動,達到更好的清洗效果。在待清洗件20與承載結構脫離過程
中,清洗待清洗件20時,承載結構上從待清洗件20帶下的污染物可以被清洗,承載結構上與待清洗件20接觸部位也可以得到較好清洗,防止再次承載待清洗件20時污染待清洗件20。
The driving mechanism A is used to drive the second supporting
在本發明實施例的清洗裝置中,通過第一承載結構3承載待清洗件,通過第二承載結構4承載待清洗件,驅動機構A在驅動第一承載結構3移動至脫離待清洗件的情況下,驅動第二承載結構4移動至承載待清洗件;驅動機構A用於在驅動第一承載結構3移動至承載待清洗件的情況下,驅動第二承載結構4移動至脫離待清洗件。待清洗件可以為矽晶片,在槽內清洗矽晶片時,通過第一承載結構3與第二承載結構4可以交替進行承載待清洗件,使得承載結構與矽晶片的接觸部位可以得到較好清洗,使得矽晶片邊緣清洗完全,避免承載結構與矽晶片接觸位置無法清洗完全的問題,提高矽晶片的清洗效果。
In the cleaning device of the embodiment of the present invention, the items to be cleaned are carried by the first supporting
在一些實施例中,驅動機構A包括:第一驅動機構與第二驅動機構,第一驅動機構在驅動第一承載結構3沿清洗腔11的高度方向移動至脫離待清洗件20的情況下,第二驅動機構驅動第二承載結構4沿清洗腔11的高度方向移動至承載待清洗件20;比如,第一驅動機構在驅動第一承載結構3沿清洗腔11的高度方向向下移動至脫離待清洗件20的情況下,第二驅動機構驅動第二承載結構4沿清洗腔11的高度方向向上移動至承載待清洗件20。
In some embodiments, the driving mechanism A includes: a first driving mechanism and a second driving mechanism, the first driving mechanism drives the first supporting
第一驅動機構在驅動第一承載結構3沿清洗腔11的高度方向移動至承載待清洗件20的情況下,第二驅動機構驅動第二承載結構4沿清洗腔11的高度方向移動至脫離待清洗件20。比如,第一驅動機構在驅動第一承載結構3沿清洗腔11的高度方向向上移動至承載待清洗件20的情況下,第二驅動機構驅動第二承載結構4沿清洗腔11的高度方向向下移動至脫離待清洗件20。通過承載結構
沿清洗腔11的高度方向的移動,可以使得承載結構承載或脫離待清洗件20,通過第一承載結構3與第二承載結構4可以交替進行承載待清洗件,使得承載結構與待清洗件的接觸部位可以得到較好清洗,提高清洗效果。
When the first driving mechanism drives the first supporting
在另一些實施例中,如圖1至圖5所示,第一承載結構3包括:多個第一承載桿31,比如,第一承載桿31的數量可以為兩個,多個第一承載桿31間隔設置,第一承載桿31用於承載待清洗件20,比如,通過多個第一承載桿31止抵在待清洗件20的外周來實現承載。第一承載桿31可以移動,在第一承載桿31移動過程中,第一承載桿31脫離或承載待清洗件20,第一承載桿31可以根據需要脫離或承載待清洗件20,以便於第一承載桿31脫離待清洗件20時,使得第一承載桿31與待清洗件20的接觸部位可以得到較好清洗,避免第一承載桿31與待清洗件20的接觸位置無法清洗完全的問題。第一承載桿31可以為塑膠件或金屬件等,比如,第一承載桿31可以為聚醚醚酮(Poly Ether-Ether-Ketone,PEEK)材料件,具體的材料可以根據實際選擇。
In other embodiments, as shown in Figures 1 to 5, the first supporting
在一些實施例中,第一承載桿31用於承載待清洗件20,第一承載桿31上具有第一承載槽,可以通過第一承載槽來承載待清洗件20,便於穩定地承載待清洗件20,防止出現滑動或脫落。第一承載槽的內側壁可以設置彈性層,具有緩衝作用,減少第一承載槽與待清洗件20之間的硬性碰撞,避免損傷待清洗件20。第一承載槽的側壁上可以設置鏤空孔,清洗液可以從鏤空孔流過,便於清洗第一承載槽的內側壁。
In some embodiments, the first supporting
可選地,驅動機構A包括:第一驅動機構,每個第一驅動機構用於驅動一個第一承載桿31移動,比如,第一驅動機構可以驅動第一承載桿31沿
清洗腔的高度方向移動。第一驅動機構可以包括驅動凸輪、驅動電機、驅動氣缸或電致形變件等具有驅動作用的機構,具體可以根據實際情況選擇。
Optionally, the driving mechanism A includes: a first driving mechanism, each first driving mechanism is used to drive a first supporting
可選地,如圖5所示,第一驅動機構包括第一凸輪32,在第一凸輪32轉動過程中,第一凸輪32驅動第一承載桿31移動。第一凸輪32的外周壁可以止抵第一承載桿31的外側壁,在第一凸輪32轉動過程中,由於第一凸輪32的徑向尺寸並不是完全相同的,通過第一凸輪32可以驅動第一承載桿31移動,比如,通過第一凸輪32可以驅動第一承載桿31沿清洗腔的高度方向移動。
Optionally, as shown in FIG5 , the first driving mechanism includes a
在一些實施例中,第一凸輪32的外周可以設置第一導槽,第一承載桿31可以設置於第一導槽中,第一凸輪32轉動過程中,使得第一凸輪32與第一承載桿31穩定地接觸,防止第一承載桿31從第一凸輪32上脫離。第一導槽的內側壁可以設置彈性層,具有緩衝作用,減少第一凸輪32轉動過程中第一承載桿31的振動。
In some embodiments, a first guide groove may be provided on the outer periphery of the
可選地,第一驅動機構還包括:第一齒輪,第一凸輪上設有第一齒輪,第一齒輪轉動過程中帶動第一凸輪32轉動。通過第一齒輪的轉動帶動第一凸輪32轉動,可以使得第一凸輪32可以穩定轉動。
Optionally, the first driving mechanism further includes: a first gear, the first cam is provided with a first gear, and the first gear drives the
在一些實施例中,如圖1至圖5所示,第二承載結構4包括:多個第二承載桿41,比如,第二承載桿41的數量可以為兩個。多個第二承載桿41間隔設置,第二承載桿41用於承載待清洗件20,比如,通過多個第二承載桿41止抵在待清洗件20的外周來實現承載。第二承載桿41可移動,在第二承載桿41移動過程中,第二承載桿41脫離或承載待清洗件20,第二承載桿41可以根據需要脫離或承載待清洗件20,以便於第二承載桿41脫離待清洗件20時,使得第二承載桿41與待清洗件20的接觸部位可以得到較好清洗,避免第二承載桿41與待清
洗件20的接觸位置無法清洗完全的問題。第二承載桿41可以為塑膠件或金屬件等,比如,第二承載桿41可以為聚醚醚酮材料件,具體的材料可以根據實際選擇。第一承載桿31與第二承載桿41的形狀和材質可以相同或不同,具體根據實際選擇。
In some embodiments, as shown in FIGS. 1 to 5 , the second supporting
如圖5所示,驅動機構A還包括:第二驅動機構與第三齒輪30,第二驅動機構包括第二凸輪42與第二齒輪,第二凸輪42上設有第二齒輪。第一齒輪與第二齒輪均和第三齒輪30嚙合,第三齒輪30可帶動第一齒輪與第二齒輪轉動,第二齒輪轉動過程中帶動第二凸輪42轉動,第二凸輪42轉動過程中驅動第二承載桿41移動。
As shown in FIG5 , the driving mechanism A further includes: a second driving mechanism and a
第一凸輪32驅動第一承載桿31移動至脫離待清洗件20的情況下,第二凸輪42驅動第二承載桿41移動至承載待清洗件20;第一凸輪32驅動第一承載桿31移動至承載待清洗件20的情況下,第二凸輪42驅動第二承載桿41移動至脫離待清洗件20。比如,如圖1所示,第一凸輪32驅動第一承載桿31沿清洗腔的高度方向向下移動至脫離待清洗件20的情況下,第二凸輪42驅動第二承載桿41沿清洗腔的高度方向向上移動至承載待清洗件20;如圖2所示,第一凸輪32驅動第一承載桿31沿清洗腔的高度方向向上移動至承載待清洗件20的情況下,第二凸輪42驅動第二承載桿41沿清洗腔的高度方向向下移動至脫離待清洗件20。通過承載結構沿清洗腔11的高度方向的移動,可以使得承載桿承載或脫離待清洗件20,通過第一承載桿31與第二承載桿41可以交替進行承載待清洗件,使得承載結構與待清洗件的接觸部位可以得到較好清洗,提高清洗效果。
When the
第一凸輪32與第二凸輪42的形狀可以相同或不同,比如,如圖5所示,第一凸輪32與第二凸輪42的截面可以均為橢圓形,第一凸輪32與第二凸
輪42的截面橢圓的長軸夾角可以為90度,以便第一凸輪32與第二凸輪42轉動過程中,通過凸輪可以驅動承載桿交替承載待清洗件。
The shapes of the
在本發明的實施例中,第一承載桿31與第二承載桿41可以間隔平行設置,第一承載桿31與第二承載桿41可以在清洗腔的高度方向上間隔平行設置,以便於承載待清洗件20。
In an embodiment of the present invention, the first supporting
可選地,驅動機構A還包括:第四齒輪40與驅動電機,第四齒輪40與第三齒輪30嚙合,驅動電機的驅動軸與第四齒輪40連接,驅動電機用於驅動第四齒輪40轉動,第四齒輪40轉動帶動第三齒輪30轉動,通過第三齒輪30可以帶動第一齒輪與第二齒輪轉動,第一齒輪轉動帶動第一凸輪32轉動,第一凸輪32轉動過程中帶動第一承載桿31移動,第二齒輪轉動過程中帶動第二凸輪42轉動,第二凸輪42轉動過程中帶動第二承載桿41移動,以使得承載桿可以承載或脫離待清洗件20。
Optionally, the driving mechanism A further includes: a
可選地,第一承載桿31與清洗腔11底部的間隔距離大於第二承載桿41與清洗腔11底部的間隔距離,間隔距離為承載桿與清洗腔11底部的垂直距離,第一承載桿31位於第二承載桿41的上方,便於承載桿可以承載或脫離待清洗件20。在承載桿與清洗腔11底部平行設置的情況下,承載桿上不同位置與清洗腔11底部的間隔距離相等;在承載桿與清洗腔11底部非平行且非垂直設置在的情況下,承載桿上不同位置與清洗腔11底部的間隔距離不相等,第一承載桿31與清洗腔11底部的間隔距離的最小距離可以大於第二承載桿41與清洗腔11底部的間隔距離的最大距離,第一承載桿31整體位於第二承載桿41的上方。
Optionally, the spacing distance between the first supporting
可選地,每個第一承載桿31與清洗腔11底部的間隔距離相等,每個第二承載桿41與清洗腔11底部的間隔距離相等,間隔距離為承載桿與清洗腔
11底部的垂直距離。第一承載桿31的數量可以為兩個,第二承載桿41的數量可以為兩個,兩個第一承載桿31的高度位置相同,兩個第二承載桿41的高度位置相同,兩個第一承載桿31在左右方向上的間隔距離大於兩個第二承載桿41在左右方向上的間隔距離,矽晶片呈圓形,便於承載或脫離矽晶片。
Optionally, the spacing distance between each first supporting
在一些實施例中,第一承載結構3與第二承載結構4的結構相同;驅動機構A可以包括:第二驅動機構,第一驅動機構與第二驅動機構的結構相同,第二驅動機構用於驅動第二承載結構4。通過第二驅動機構驅動第二承載結構4與通過第一驅動機構驅動第一承載結構3可以具有相同的作用。
In some embodiments, the first supporting
可選地,第一承載結構3與第二承載結構4的結構相同。如圖1至圖5所示,第二承載結構4包括:多個第二承載桿41,第二承載桿41間隔設置,第二承載桿41用於承載待清洗件20,第二承載桿41可移動,在第二承載桿41移動的過程中,第二承載桿41可脫離或承載待清洗件20。第二承載桿41可以根據需要脫離或承載待清洗件20,以便第二承載桿41脫離待清洗件20時,第二承載桿41與待清洗件20的接觸部位可以得到較好清洗,避免第二承載桿41與待清洗件20的接觸位置無法清洗完全的問題。
Optionally, the first supporting
在一些實施例中,第二承載桿41用於承載待清洗件20,第二承載桿41上具有第二承載槽,可以通過第二承載槽來承載待清洗件20,便於穩定地承載待清洗件20,防止出現滑動或脫落。第二承載槽的內側壁可以設置彈性層,具有緩衝作用,減少第二承載槽與待清洗件20之間的硬性碰撞,避免損傷待清洗件20。第二承載槽的側壁上可以設置鏤空孔,清洗液可以從鏤空孔流過,便於清洗第二承載槽的內側壁。
In some embodiments, the second supporting
可選地,驅動機構A包括:第二驅動機構,第二驅動機構用於驅動第二承載桿41移動。比如,第二驅動機構可以驅動第二承載桿41沿清洗腔的高度方向移動。第二驅動機構可以包括驅動凸輪、驅動電機、驅動氣缸或電致形變件等具有驅動作用的機構,具體可以根據實際情況選擇。
Optionally, the driving mechanism A includes: a second driving mechanism, which is used to drive the second supporting
可選地,第一驅動機構與第二驅動機構的結構相同。如圖5所示,第二驅動機構包括第二凸輪42,在第二凸輪42轉動過程中,第二凸輪42驅動第二承載桿41移動。第二凸輪42的外周壁可以止抵第二承載桿41的外側壁,在第二凸輪42轉動過程中,由於第二凸輪42的徑向尺寸並不是完全相同的,通過第二凸輪42可以驅動第二承載桿41移動,比如,通過第二凸輪42可以驅動第二承載桿41沿清洗腔的高度方向移動。
Optionally, the first driving mechanism has the same structure as the second driving mechanism. As shown in FIG5 , the second driving mechanism includes a
可選地,第二凸輪42的外周可以設置第二導槽,第二承載桿41可以設置於第二導槽中,第二凸輪42轉動過程中,使得第二凸輪42與第二承載桿41穩定地接觸,防止第二承載桿41從第二凸輪42上脫離。第二導槽的內側壁可以設置彈性層,具有緩衝作用,減少第二凸輪42轉動過程中第二承載桿41的振動。
Optionally, a second guide groove may be provided on the outer periphery of the
在本發明的實施例中,第二驅動機構還包括:第二齒輪,第二凸輪上設有第二齒輪,第二齒輪轉動過程中帶動第二凸輪42轉動。通過第二齒輪轉動帶動第二凸輪42轉動,可以使得第二凸輪42可以穩定轉動。
In the embodiment of the present invention, the second driving mechanism further includes: a second gear, and the second cam is provided with a second gear, and the second gear drives the
上面結合附圖對本發明的實施例進行了描述,但是本發明並不局限於上述的具體實施方式,上述的具體實施方式僅僅是示意性的,而不是限制性的,本領域的普通技術人員在本發明的啟示下,在不脫離本發明宗旨和申請專利範圍所保護的範圍情況下,還可做出很多形式,均屬於本發明的保護之內。 The embodiments of the present invention are described above in conjunction with the attached drawings, but the present invention is not limited to the above specific implementations, which are only illustrative and not restrictive. Under the inspiration of the present invention, ordinary technicians in this field can make many forms without departing from the purpose of the present invention and the scope of protection of the patent application, all of which are within the protection of the present invention.
10:清洗槽 10: Cleaning tank
11:清洗腔 11: Cleaning cavity
20:待清洗件 20: Parts to be cleaned
3:第一承載結構 3: The first bearing structure
31:第一承載桿 31: First load bearing rod
4:第二承載結構 4: Second bearing structure
41:第二承載桿 41: Second bearing rod
Claims (10)
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CN202211535384.8A CN115815198A (en) | 2022-11-30 | 2022-11-30 | Cleaning device |
CN202211535384.8 | 2022-11-30 |
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TW202330116A TW202330116A (en) | 2023-08-01 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20140116466A1 (en) | 2012-10-25 | 2014-05-01 | Ebara Corporation | Substrate cleaning apparatus and substrate cleaning method |
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US20140116466A1 (en) | 2012-10-25 | 2014-05-01 | Ebara Corporation | Substrate cleaning apparatus and substrate cleaning method |
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