TWI844551B - Heating Controller - Google Patents

Abstract

The present invention realizes a heating conditioner that fully cools electronic components. The heating conditioner (1) of the present invention is provided with a conduit (21) for supplying water to a water vapor generating section (11) in an air supply path (31) for cooling air that flows and contacts electronic components to be cooled.

Description

Heating Controller

The present invention relates to a heating cooker, and more particularly to a heating cooker for cooking using superheated water vapor.

As one of the heating conditioners, there is a heating conditioner that performs conditioning using superheated steam. In such a heating conditioner, there is a risk that the steam generating electric heater provided in the steam generating device that generates the heated steam and the circuit substrate used to drive and control the steam generating electric heater may become high in temperature, thereby causing problems such as the life of the circuit components and malfunction of the microcomputer. Therefore, in the heating conditioner, the temperature of the electronic components is lowered by exposing the electronic components to cooling air.

However, in the existing heating conditioner, since the electronic components are cooled by blowing air from the cooling fan installed in the heating conditioner to the electronic components, it is necessary to improve the capacity of the cooling fan or add a cooling fan to further cool the electronic components.

Therefore, in the microwave oven disclosed in Patent Document 1, when it is operated as an oven, the cooling fan for cooling the magnetron is operated even when the magnetron is not used as an oven, so that part of the cooling air used exclusively for the magnetron becomes the cooling air for the electronic parts, so there is no need to increase the capacity of the cooling fan or add cooling fans to lower the temperature of the electronic parts.

Patent document 1: Japanese Patent Publication No. 2007-327673.

However, in the microwave oven disclosed in Patent Document 1, since the cooling air used for the magnetron is used for cooling electronic components, it is necessary to add another air supply path from the original air supply path, and the air supply path for blowing the air used for cooling the electronic components becomes complicated. Therefore, the following problem arises: the air from the cooling fan cannot fully contact the electronic components, and the electronic components cannot be cooled efficiently.

One aspect of the present invention aims to realize a heating conditioner that can efficiently cool electronic components.

In order to solve the above-mentioned problem, a heating conditioner of one aspect of the present invention performs conditioning using at least water vapor, and includes: a water vapor generating unit that generates the water vapor and supplies it to the heating storage; and a duct that supplies water to the water vapor generating unit; wherein the duct is arranged in at least a part of the air supply path through which the cooling air that contacts the electronic components to be cooled flows.

According to one aspect of the present invention, it is possible to efficiently cool electronic components.

1: Heating Controller

2: Chassis

2a: Heating storage

2b: Opening

3: Door

3b: Frame

4: Handle

5: Display operation section

6: Dial

7: Button

8: Display panel

10: Control Department

10a: Heating control unit

10b: Display control unit

11: Water vapor generation section

12: Microwave heating section

13: Oven heating part

14: Cooling unit

15: Antenna rotation drive unit

16: Pump drive unit

17: Temperature sensor

18: Antenna

19: Pump

20: Sink

21: Catheter

31: Air supply path

31a, 31b: Wall parts

31c, 31d: opening part

32: Terminal part

33: Temperature sensor

34: Kune Light

41a: Opening

Figure 1 is a front view of the heating conditioner of the first embodiment of the present invention.

FIG2 is a functional block diagram of the heating conditioner shown in FIG1.

FIG3 is a side view schematically showing the state of removing the side panel on the side where the water vapor generating device is installed in the heating conditioner shown in FIG1.

FIG4 is a bottom view schematically showing the state of removing the bottom panel of the heating conditioner shown in FIG1.

FIG5 is a side view schematically showing the state of removing the side panel on the side opposite to the side where the water vapor generating device is provided in the heating conditioner shown in FIG1.

[Implementation form 1]

(General description of heating controller)

FIG. 1 is a front view of a heating cooker 1 of the present embodiment, (a) showing a state where a door (opening/closing door) 3 is closed, and (b) showing a state where the door 3 is opened. The heating cooker 1 is provided with a magnetron (not shown) for generating microwaves and a water vapor generating unit 11 (FIG. 2). If the heating cooker is used for cooking using a microwave oven, the cooking is performed using water vapor, especially superheated water vapor heated to a temperature exceeding 100°C, in a water oven.

As shown in FIG1 , the heating conditioner 1 has a rectangular housing 2 and a door 3, and the space surrounded by the housing 2 becomes a heating chamber 2a for accommodating the heated object. In addition, the magnetron is provided inside the housing 2 (for example, sandwiching the heating chamber 2a and on the opposite side of the door 3).

The door 3 is an opening and closing door for opening and closing the opening 2b of the heating storage 2a, and has a window (window portion) 3a arranged at a position opposite to the heating storage 2a, and a frame (frame portion) 3b surrounding the window 3a. Heat-resistant glass or heat-resistant transparent resin is embedded in the window 3a so that the heating storage 2a can be seen. The frame 3b is formed of a non-metallic material, such as a resin.

The heating storage 2a is provided with a door 3 that can be opened and closed, and the side of the lower end is rotated approximately at the center, and a handle 4 is installed on the upper side to assist the user in opening and closing the door 3. Although in this embodiment, the door 3 is opened and closed by rotating the door 3 approximately at the center, it is not limited to this. For example, the door 3 may be opened and closed by rotating the side of the left or right end of the door 3 approximately at the center. Details of the door 3 will be described later.

In addition, a shield material (not shown) having a size covering the opening 2b of the entrance of the heating storage 2a is formed on the surface of the door 3 facing the heating storage 2a.

The heating cooker 1 is provided with a display operation unit (operation panel) 5 in front of the door 3 for displaying various information about the heating cooker 1 and receiving operations on the heating cooker 1. The display operation unit 5 is provided with a dial 6, a button 7, and a display panel 8 for displaying various information such as operation information. In addition, the display operation unit 5 may also be configured as a touch panel without using physical components such as the dial 6 and the button 7. The display operation unit 5 is connected to the control unit 10 described later, and information is input and output between the control unit 10. The heating cooker 1 including the control unit 10 is described below.

(Functional block of heating regulator 1)

FIG2 is a functional block diagram of the heating cooker 1. As shown in FIG2, the heating cooker 1 includes a control unit 10. The control unit 10 is connected to the display operation unit 5, the steam generating unit 11, the microwave heating unit 12, the oven heating unit 13, the cooling unit 14, the antenna rotation drive unit 15, the pump drive unit 16, and the temperature sensor 17. The control unit 10 mainly includes a heating control unit 10a for performing control related to heating and a display control unit 10b for performing display control of the display panel 8 of the display operation unit 5. Therefore, the heating control unit 10a is connected to the dial 6, button 7, water vapor generating unit 11, microwave heating unit 12, oven heating unit 13, cooling unit 14, antenna rotation driving unit 15, pump driving unit 16, and temperature sensor 17 of the display operation unit 5. On the other hand, the display control unit 10b is connected to the display panel 8 of the display operation unit 5.

The steam generator 11 is driven when the heating conditioner 1 performs the cooking using superheated steam, supplies water from a water supply tank (not shown), and heats the water to generate steam. The generated steam is supplied to the heating tank 2a of the heating conditioner 1. The steam generated by the steam generator 11 is superheated steam (steam with a temperature higher than 100°C) or steam with a temperature lower than 100°C. The temperature of the steam can be adjusted appropriately. In addition, the steam supplied to the interior of the heating tank 2a heats the food (heated object) arranged inside the heating tank 2a.

The microwave heating unit 12 is a magnetron (microwave generating device) used when the microwave cooking is performed by the heating processor 1, and the oven heating unit 13 is a heater used when the oven cooking is performed by the heating processor 1. The cooling unit 14 is a driving motor used to drive a cooling fan (not shown) for cooling electronic components in the heating processor 1 when all the heating cooking is performed by the heating processor 1.

The antenna rotation drive unit 15 rotates the antenna 18 that radiates microwaves during microwave conditioning.

The pump driving unit 16 drives the pump 19 for supplying the water in the water tank 20 to the water vapor generating unit 11 when the water vapor generating unit 11 is operated.

The temperature sensor 17 is composed of, for example, a thermistor, and detects the temperature inside the heating chamber 2a. The control unit 10 controls the operation of the conditioning device such as the water vapor generating unit 11 based on the settings of the display operation unit 5 and the detected temperature of the temperature sensor 17.

(Air supply path)

FIG. 3 shows a state where the side panel of the water vapor generating device 11 of the heating conditioner 1 is removed, FIG. 4 shows a state where the bottom panel of the heating conditioner 1 is removed, and FIG. 5 shows a state where the back panel of the heating conditioner 1 is removed.

As shown in FIG3 , in the heating conditioner 1, an air supply passage 31 for cooling air to flow from the bottom side toward the top is formed. The air supply passage 31 is formed in such a manner that the cooling air blown out from the opening 41a provided at the bottom of the heating conditioner 1 is guided to the temperature sensor 33 arranged near the water vapor generating section 11 provided at the top of the heating conditioner 1, the terminal section 32 of the heater provided at the water vapor generating section 11, the internal lamp 34 irradiating the heating storage 2a, and the terminals 35 and 36 of the heater provided at the top surface of the heating storage 2a.

Therefore, the air supply path 31 has two wall parts 31a and 31b extending from the opening 41a to the vicinity of the electronic parts (temperature sensor, internal lamp, and heater terminal) to be cooled, and is arranged opposite to each other, and the openings 31c and 31d for blowing out cooling air are formed at the upper part. The cooling air blown out from the opening 31c mainly contacts the temperature sensor 33 and the heater terminal 32 provided in the water vapor generating part 11, and the heater terminal 35 provided on the top surface of the heating storage 2a, and the cooling air blown out from the opening 31d mainly contacts the internal lamp 34 and the heater terminal 36 provided on the top surface of the heating storage 2a.

As shown in FIG. 4 , the cooling air blown out from the opening 41a is obtained by rotating a fan (not shown) disposed on the bottom side of the heating conditioner 1.

(Configure ducts in the air supply path)

In the air supply path 31, a duct 21 for guiding water to the water vapor generating part 11 is arranged. That is, the duct 21 is arranged in the air supply path 31 that contacts the cooling air flowing through the electronic parts to be cooled (temperature sensor 33, end terminal 32 of the heater installed in the water vapor generating part 11, terminal parts 35 and 36 of the heater installed on the top surface of the heating storage 2a, and the lamp 34 in the storage). As shown in FIG. 4, the duct 21 is a duct that guides the water sucked out from the water tank 20 by the pump 19 to the water vapor generating part 11.

In this embodiment, a duct 21 through which water flows is arranged in the air supply path 31. As a result, the cooling air flowing through the air supply path 31 contacts the duct 21, so the cooling air flowing through the air supply path 31 is cooled by the duct 21 through which water flows. Therefore, the necessary electronic components can be cooled effectively.

Furthermore, the water flowing through the conduit 21 exchanges heat with the cooling air, so that the temperature rises, and the energy consumption in the water vapor generating section 11 is reduced, so that superheated water vapor can be generated efficiently.

Furthermore, in the present embodiment, when the heating chamber 2a is regarded as a rectangular parallelepiped, the water vapor generating portion 11 and the water tank 20 are respectively arranged near the two ends of the diagonal line of the rectangular parallelepiped. That is, when the direction in which the door 3 is opened is set as the front, the water vapor generating portion 11 is arranged on the upper left side when the heating chamber 2a is viewed from the front, and the water tank 20 is arranged on the lower right side when viewed from the front. Therefore, the conduit 21 is extended from the water tank 20 to the water vapor generating portion 11, and the water tank 20 is arranged on the lower right side when viewed from the front, and the water vapor generating portion 11 is arranged on the upper left side when viewed from the front. As a result, since the duct 21 disposed in the air supply path 31 becomes longer, the time that the cooling air is in contact with the duct 21 becomes longer, and the cooling air can be cooled more effectively.

[Implementation form 2]

Other embodiments of the present invention are described below. In addition, for the convenience of explanation, the same symbols are marked for components having the same functions as those described in the above embodiments, and their descriptions are not repeated.

In the heating conditioner of this embodiment, the duct 21 is arranged along the air supply path. Here, the air supply path includes the air supply path 31 (Figure 3) on the side where the water vapor generating part 11 of the heating conditioner 1 is arranged, and includes a path for guiding the wind obtained from the fan arranged on the bottom side of the heating conditioner 1 to the air supply path 31.

In this way, by configuring the duct 21 in almost all the air supply paths through which the cooling air flows, the cooling effect of the cooling air is increased because the time for the cooling air to be in contact with the duct 21 becomes longer. As a result, the necessary electronic components can be cooled more effectively.

[Implementation form three]

Other embodiments of the present invention are described below. In addition, for the convenience of explanation, the same symbols are marked for components having the same functions as those described in the above embodiments, and their descriptions are not repeated.

In the heating conditioner 1 of this embodiment, the conduit 21 is arranged close to the electronic components to be cooled (temperature sensor 33, terminal 32 of the heater provided in the water vapor generating section 11, terminals 35 and 36 of the heater provided on the top surface of the heating chamber 2a, and chamber lamp 34).

According to the above-mentioned structure, the conduit 21 for supplying water to the water vapor generating section 11 is arranged close to the electronic components to be cooled, so that the cooling air is cooled at a position close to the electronic components to be cooled. As a result, the cooling air can maintain the cooling state before being blown to the electronic components, so the electronic components can be cooled more effectively.

[Variation example]

In the above-mentioned embodiments 1 to 3, although the duct 21 does not have a special structure for having a cooling effect, it is also possible to have a structure having a cooling effect in the duct 21. For example, it is known that by attaching a plurality of fins to the surface of the duct 21, the surface area of the duct 21 is increased, and the cooling air is cooled more effectively.

In the above-mentioned embodiments 1 to 3, although the water vapor generator 11 and the water tank 20 are set at opposite corners when the heating chamber 2a is regarded as a rectangular parallelepiped, the water vapor generator 11 and the water tank 20 may be set at the same side. In this way, although there is no particular restriction on the setting positions of the water vapor generator 11 and the water tank 20, it is sufficient to arrange the duct 21 in the air supply path 31 that guides cooling air to the electronic components.

The present invention is not limited to the above-mentioned embodiments, but can be modified in various ways within the scope of the patent application. The embodiments obtained by appropriately combining the technical methods disclosed in different embodiments are also included in the technical scope of the present invention. Furthermore, new technical features can be formed by combining the technical methods disclosed in each embodiment.

1: Heating Controller

3: Door

4: Handle

6: Dial

11: Water vapor generation section

21: Catheter

31: Air supply path

31a, 31b: Wall parts

31c, 31d: opening part

32: Terminal part

33: Temperature sensor

34: Kune Light

35, 36: Terminals

41a: Opening

Claims (4)

A heating cooker performs cooking using at least water vapor, comprising: a water vapor generating unit that generates the water vapor and supplies it to a heating chamber; and a duct that supplies water to the water vapor generating unit; wherein the duct is disposed at least in a portion of an air supply path through which cooling air that contacts electronic components to be cooled flows; and when the heating chamber is viewed from the front with the door of the heating cooker opened in the direction facing the front, the water vapor generating unit and a water tank that supplies water to the water vapor generating unit are disposed at opposite corners of the heating chamber. A heating conditioner as described in claim 1, wherein the duct is arranged along the air supply path. A heating conditioner as described in claim 1 or 2, wherein the conduit is arranged close to the electronic component to be cooled. A heating conditioner as described in claim 3, wherein the electronic component to be cooled is a room light irradiating the heating room.