TWI844013B - Content addressable memory device, content addressable memory cell and method for data searching and comparing thereof - Google Patents

Content addressable memory device, content addressable memory cell and method for data searching and comparing thereof Download PDF

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TWI844013B
TWI844013B TW111116004A TW111116004A TWI844013B TW I844013 B TWI844013 B TW I844013B TW 111116004 A TW111116004 A TW 111116004A TW 111116004 A TW111116004 A TW 111116004A TW I844013 B TWI844013 B TW I844013B
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search
content
match
addressable memory
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TW202343252A (en
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曾柏皓
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旺宏電子股份有限公司
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Abstract

The application provides a content addressable memory (CAM) memory device, a CAM memory cell and a method for searching and comparing data thereof. The CAM memory device includes: a plurality of CAM memory strings; and an electrical characteristic detection circuit. In data searching, a search data is compared with a storage data stored in the CAM memory strings, the CAM memory strings generate a plurality of memory string currents, the electrical characteristic detection circuit detects the memory string currents to generate a plurality of sensing results, or detects a plurality of match line voltages on a plurality of match lines coupled to the CAM memory string to generate the plurality of search results. The storage data and the search data is a range storage data and a single-bit search data, or the storage data and the search data is a single-bit storage data and a range search data.

Description

內容定址記憶體裝置、內容定址記憶體晶胞及其 資料搜尋比對方法 Content-addressable memory device, content-addressable memory cell and its data search and comparison method

本發明係有關於一種內容定址記憶體(Content Addressable Memory,CAM)、內容定址記憶體晶胞裝置及其資料搜尋比對方法,且特別有關於一種可用於實現記憶體內近似搜尋(In-memory approximate searching)的內容定址記憶體裝置、內容定址記憶體晶胞及其資料搜尋比對方法。 The present invention relates to a content addressable memory (CAM), a CAM cell device and a data search and comparison method thereof, and in particular to a CAM device, a CAM cell and a data search and comparison method thereof that can be used to implement in-memory approximate searching.

隨著大數據與人工智慧(AI)硬體加速器的興起,資料搜尋與資料比對是重要功能。現有的三元內容定址記憶體(Ternary Content Addressable Memory,TCAM)可用於實現高度平行搜尋(highly parallel searching)。傳統TCAM通常由靜態隨機存取記憶體(Static Random Access Memory,SRAM)組成,因此記憶密度低且存取功率高。為了提高記憶密度並節省功耗,最近提出了基於TCAM的非揮發性記憶體陣列。 With the rise of big data and artificial intelligence (AI) hardware accelerators, data search and data comparison are important functions. Existing ternary content addressable memory (TCAM) can be used to achieve highly parallel searching. Traditional TCAM is usually composed of static random access memory (SRAM), so the memory density is low and the access power is high. In order to improve the memory density and save power consumption, a non-volatile memory array based on TCAM has been proposed recently.

相較於具有16個電晶體(16T)之基於SRAM的TCAM,最近發展出具有2個電晶體與2個電阻(2T2R)結構之基 於電阻式隨機存取記憶體(Resistive Random Access Memory,RRAM)的TCAM,以減少晶胞面積。待機功耗(standby power consumption)也可藉由使用基於RRAM的非揮發性TCAM來改善。然而,現有的非揮發性TCAM難以實現範圍搜尋(range search)與範圍儲存(range storage),也難以實現記憶體內近似搜尋(In-memory approximate searching)。 Compared to SRAM-based TCAMs with 16 transistors (16T), RRAM-based TCAMs with 2 transistors and 2 resistors (2T2R) have been recently developed to reduce the cell area. Standby power consumption can also be improved by using RRAM-based non-volatile TCAMs. However, existing non-volatile TCAMs have difficulty implementing range search and range storage, as well as in-memory approximate searching.

故而,需要有一種內容定址記憶體(Content Addressable Memory,CAM)裝置、CAM記憶體晶胞,及其資料搜尋比對方法,可用於實現記憶體內近似搜尋,及實現範圍搜尋(range search)與範圍儲存(range storage)。 Therefore, there is a need for a content addressable memory (CAM) device, a CAM memory cell, and a data search and comparison method thereof, which can be used to implement similarity search within the memory, and to implement range search and range storage.

根據本案一實例,提出一種內容定址記憶體裝置,包括:複數個內容定址記憶體串;以及一電性特徵偵測電路,耦接至該些內容定址記憶體串;其中,於進行資料搜尋時,將一搜尋資料比對於該些內容定址記憶體串所儲存之一儲存資料,該些內容定址記憶體串產生複數個記憶體串電流,該電性特徵偵測電路偵測該些記憶體串電流或偵測耦接至該些內容定址記憶體串之複數條匹配線之複數個匹配線電壓,以產生複數個搜尋結果,其中,該儲存資料與該搜尋資料為一範圍儲存資料與單一位元搜尋資料,或者,該儲存資料與該搜尋資料為一單一位元儲存資料與一範圍搜尋資料。 According to an example of the present invention, a content-addressable memory device is provided, comprising: a plurality of content-addressable memory strings; and an electrical characteristic detection circuit coupled to the content-addressable memory strings; wherein, when performing a data search, a search data is compared with a storage data stored in the content-addressable memory strings, and the content-addressable memory strings generate a plurality of memory string currents. The electrical characteristic detection circuit detects the memory string currents or detects the plurality of match line voltages of the plurality of match lines coupled to the content-addressed memory strings to generate a plurality of search results, wherein the storage data and the search data are a range storage data and a single-bit search data, or the storage data and the search data are a single-bit storage data and a range search data.

根據本案另一實例,提出一種內容定址記憶體裝置之資料搜尋比對方法,包括:儲存一儲存資料於複數個內容定址記憶體串內;以一搜尋資料對該些內容定址記憶體串進行資料搜尋;該些內容定址記憶體串產生複數個記憶體串電流;偵測該些記憶體串電流或偵測耦接至該些內容定址記憶體串之複數條匹配線之複數個匹配線電壓,以產生複數個搜尋結果,其中,該儲存資料與該搜尋資料為一範圍儲存資料與單一位元搜尋資料,或者,該儲存資料與該搜尋資料為一單一位元儲存資料與一範圍搜尋資料。 According to another example of the present case, a data search and comparison method of a content-addressable memory device is proposed, including: storing a storage data in a plurality of content-addressable memory strings; performing a data search on the content-addressable memory strings with a search data; the content-addressable memory strings generate a plurality of memory string currents; detecting the memory string currents or detecting a plurality of match line voltages of a plurality of match lines coupled to the content-addressable memory strings to generate a plurality of search results, wherein the storage data and the search data are a range storage data and a single-bit search data, or the storage data and the search data are a single-bit storage data and a range search data.

根據本案又一實例,提出一種內容定址記憶體晶胞,包括:複數個記憶體晶胞,其中,該些記憶體晶胞彼此串聯,且代表一搜尋資料之複數個搜尋電壓輸入至該些記憶體晶胞之複數個控制端;或者該些記憶體晶胞的該些控制端接收一選擇電壓或一通過電壓,且該些搜尋電壓透過複數條信號線而輸入至該些記憶體晶胞之複數個第一端;或者該些記憶體晶胞的該些控制端耦接至複數條字元線以接收該些搜尋電壓,且該些記憶體晶胞之該些第一端更耦接至一匹配線與一預充電控制電路,該些記憶體晶胞之複數個第二端耦接至接地端,其中,該內容定址記憶體晶胞之一儲存資料與該搜尋資料為一範圍儲存資料與單一位元搜尋資料,或者,該儲存資料與該搜尋資料為一單一位元儲存資料與一範圍搜尋資料。 According to another embodiment of the present invention, a content-addressable memory cell is provided, comprising: a plurality of memory cells, wherein the memory cells are connected in series, and a plurality of search voltages representing a search data are input to a plurality of control terminals of the memory cells; or the control terminals of the memory cells receive a selection voltage or a pass voltage, and the search voltages are input to a plurality of first terminals of the memory cells through a plurality of signal lines; or the memory cells The control terminals of the cells are coupled to a plurality of word lines to receive the search voltages, and the first terminals of the memory cells are further coupled to a matching line and a precharge control circuit, and the second terminals of the memory cells are coupled to a ground terminal, wherein a storage data and the search data of the content-addressable memory cell are a range storage data and a single-bit search data, or the storage data and the search data are a single-bit storage data and a range search data.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to better understand the above and other aspects of the present invention, the following is a specific example and a detailed description with the attached drawings as follows:

200、300、400、500:內容定址記憶體晶胞 200, 300, 400, 500: content-addressable memory cells

T1~T4:快閃記憶體晶胞 T1~T4: Flash memory cell

WL1~WL4、WL21~WL28、WL31~WL38、WL41~WL44:字元線 WL1~WL4, WL21~WL28, WL31~WL38, WL41~WL44: character lines

SS21~SS24、SS31~SS34:記憶體串 SS21~SS24, SS31~SS34: memory string

C21~C28、C31~C38:內容定址記憶體晶胞 C21~C28, C31~C38: content-addressable memory cells

SA:感應放大器 SA: Inductive amplifier

BL1~BL12:位元線 BL1~BL12: bit line

ML、ML1~MLn:匹配線 ML, ML1~MLn: matching line

501:預充電控制電路 501: Pre-charge control circuit

502:電壓偵測電路 502: Voltage detection circuit

710~740:步驟 710~740: Steps

第1A圖顯示單一位元儲存資料與單一位元搜尋資料之示意圖。 Figure 1A shows a schematic diagram of single-bit storage data and single-bit search data.

第1B圖顯示範圍儲存資料與單一位元搜尋資料之示意圖。 Figure 1B shows a schematic diagram of range storage data and single-bit search data.

第1C圖顯示單一位元儲存資料與範圍搜尋資料之示意圖。 Figure 1C shows a schematic diagram of single-bit storage data and range search data.

第2A圖顯示根據本案第二實施例的內容定址記憶體晶胞,以及其臨界電壓分布圖。 FIG. 2A shows a content-addressable memory cell according to the second embodiment of the present invention, and its critical voltage distribution diagram.

第2B圖顯示根據本案第二實施例之「範圍儲存與單一位元搜尋」操作示意圖。 Figure 2B shows a schematic diagram of the "range storage and single bit search" operation according to the second embodiment of the present invention.

第3A圖顯示根據本案第三實施例的內容定址記憶體晶胞,以及其臨界電壓分布圖。 FIG. 3A shows a content-addressable memory cell according to the third embodiment of the present invention, and its critical voltage distribution diagram.

第3B圖顯示根據本案第三實施例之「範圍儲存與單一位元搜尋」操作示意圖。 Figure 3B shows a schematic diagram of the "range storage and single bit search" operation according to the third embodiment of the present invention.

第4A圖顯示根據本案第四實施例的內容定址記憶體晶胞,以及其臨界電壓分布圖。 FIG. 4A shows a content-addressable memory cell according to the fourth embodiment of the present invention, and its critical voltage distribution diagram.

第4B圖與第4C圖顯示根據本案第四實施例之「範圍儲存與單一位元搜尋」操作示意圖。 Figures 4B and 4C show schematic diagrams of the "range storage and single bit search" operation according to the fourth embodiment of the present invention.

第5A圖顯示根據本案第五實施例的內容定址記憶體晶胞,以及其臨界電壓分布圖。 FIG. 5A shows a content-addressable memory cell according to the fifth embodiment of the present invention, and its critical voltage distribution diagram.

第5B圖顯示根據本案第五實施例之「範圍儲存與單一位元搜 尋」操作示意圖。 Figure 5B shows a schematic diagram of the "range storage and single bit search" operation according to the fifth embodiment of the present invention.

第6A圖與第6B圖顯示根據本案一實施例之「範圍儲存與單一位元搜尋」,以及「單一位元儲存與範圍搜尋」之操作示意圖。 Figures 6A and 6B show the operation diagrams of "range storage and single bit search" and "single bit storage and range search" according to an embodiment of the present invention.

第7圖顯示根據本案一實施例之CAM記憶體裝置之資料搜尋比對方法之流程圖。 Figure 7 shows a flow chart of a data search and comparison method of a CAM memory device according to an embodiment of the present invention.

本說明書的技術用語係參照本技術領域之習慣用語,如本說明書對部分用語有加以說明或定義,該部分用語之解釋係以本說明書之說明或定義為準。本揭露之各個實施例分別具有一或多個技術特徵。在可能實施的前提下,本技術領域具有通常知識者可選擇性地實施任一實施例中部分或全部的技術特徵,或者選擇性地將這些實施例中部分或全部的技術特徵加以組合。 The technical terms in this specification refer to the customary terms in this technical field. If this specification explains or defines some terms, the interpretation of these terms shall be based on the explanation or definition in this specification. Each embodiment disclosed in this disclosure has one or more technical features. Under the premise of possible implementation, a person with ordinary knowledge in this technical field can selectively implement part or all of the technical features in any embodiment, or selectively combine part or all of the technical features in these embodiments.

在本案一實施例中,揭露一種可實施記憶體近似搜尋的CAM記憶體裝置、CAM記憶體晶胞及其資料搜尋比對方法。搜尋資料係由字元線或位元線輸入至內容定址記憶體晶胞,而儲存資料則儲存於內容定址記憶體晶胞內。在本案一實施例中,儲存於內容定址記憶體晶胞內的儲存資料可以是範圍儲存資料(亦即,其所儲存資料乃是範圍資料),而搜尋資料則是單一位元搜尋資料。或者,在本案另一實施例中,儲存於內容定址記憶體晶胞內的儲存資料可以是單一位元儲存資料(亦即,其所儲存資料乃是單一位元資料),而搜尋資料則是範圍搜尋資料。至於「範圍儲存資料」與「範圍搜尋資料」的定義將於底下說明之。 In one embodiment of the present invention, a CAM memory device, a CAM memory cell and a data search and comparison method thereof that can implement memory proximity search are disclosed. Search data is input to a content-addressable memory cell via a word line or a bit line, and storage data is stored in the content-addressable memory cell. In one embodiment of the present invention, the storage data stored in the content-addressable memory cell can be range storage data (i.e., the stored data is range data), and the search data is single-bit search data. Alternatively, in another embodiment of the present case, the storage data stored in the content-addressable memory cell may be single-bit storage data (that is, the stored data is single-bit data), and the search data is range search data. The definitions of "range storage data" and "range search data" will be explained below.

於本案一實施例中,於進行資料搜尋或資料比對時,於匹配狀態下,該內容定址記憶體晶胞提供晶胞電流;以及,於不匹配狀態下,該內容定址記憶體晶胞不提供晶胞電流。於本案另一實施例中,於進行資料搜尋或資料比對時,於匹配狀態下,該內容定址記憶體晶胞不提供晶胞電流;以及,於不匹配狀態下,該內容定址記憶體晶胞提供晶胞電流。 In one embodiment of the present invention, when performing data search or data comparison, in a matching state, the content addressable memory cell provides a cell current; and, in a mismatching state, the content addressable memory cell does not provide a cell current. In another embodiment of the present invention, when performing data search or data comparison, in a matching state, the content addressable memory cell does not provide a cell current; and, in a mismatching state, the content addressable memory cell provides a cell current.

於本案一實施例中,當搜尋資料全匹配於儲存資料時,一記憶體串提供高記憶體串電流;當搜尋資料部份匹配於儲存資料時,該記憶體串提供中等記憶體串電流;以及,當搜尋資料全不匹配於儲存資料時,該記憶體串提供低記憶體串電流。於本案另一實施例中,當搜尋資料全匹配於儲存資料時,一記憶體串提供低記憶體串電流;當搜尋資料部份匹配於儲存資料時,該記憶體串提供中等記憶體串電流;以及,當搜尋資料全不匹配於儲存資料時,該記憶體串提供高記憶體串電流。亦即,記憶體串電流的大小取決於搜尋資料與儲存資料之間的匹配程度(或者是不匹配程度)。 In one embodiment of the present invention, when the search data fully matches the stored data, a memory string provides a high memory string current; when the search data partially matches the stored data, the memory string provides a medium memory string current; and, when the search data does not match the stored data at all, the memory string provides a low memory string current. In another embodiment of the present invention, when the search data fully matches the stored data, a memory string provides a low memory string current; when the search data partially matches the stored data, the memory string provides a medium memory string current; and, when the search data does not match the stored data at all, the memory string provides a high memory string current. That is, the size of the memory string current depends on the degree of match (or mismatch) between the search data and the stored data.

此外,於本案另一實施例中,當搜尋資料全匹配於儲存資料時,匹配線上的匹配線電壓可以維持而不被放電(亦即無放電電流);當搜尋資料部份匹配於儲存資料時,匹配線上的匹配線電壓會被中等放電(亦即放電電流為中等放電電流);以及,當搜尋資料全不匹配於儲存資料時,匹配線上的匹配線電壓會被高等放電(亦即放電電流為高等放電電流)。亦即,匹配線電壓的放 電程度取決於搜尋資料與儲存資料之間的匹配程度(或者是不匹配程度)。 In addition, in another embodiment of the present case, when the search data fully matches the stored data, the match line voltage on the match line can be maintained without being discharged (i.e., no discharge current); when the search data partially matches the stored data, the match line voltage on the match line will be moderately discharged (i.e., the discharge current is a moderate discharge current); and, when the search data does not match the stored data at all, the match line voltage on the match line will be highly discharged (i.e., the discharge current is a high discharge current). That is, the discharge degree of the match line voltage depends on the degree of match (or mismatch) between the search data and the stored data.

第1A圖顯示單一位元儲存資料與單一位元搜尋資料之示意圖。以內容定址記憶體晶胞是三元內容定址記憶體(Ternary Content Addressable Memory,TCAM)為例做說明。單一個內容定址記憶體晶胞的單一位元儲存資料可以是邏輯1、邏輯0或X(don’t care,不重要)。單一位元搜尋資料可以是邏輯1、邏輯0或萬用字元(wildcard,WC)。當搜尋資料匹配於儲存資料時,搜尋結果為匹配,反之亦然。 Figure 1A shows a schematic diagram of single-bit storage data and single-bit search data. Take the CAM cell as an example. The single-bit storage data of a single CAM cell can be logic 1, logic 0, or X (don’t care). The single-bit search data can be logic 1, logic 0, or wildcard (WC). When the search data matches the storage data, the search result is a match, and vice versa.

第1B圖顯示範圍儲存資料與單一位元搜尋資料之示意圖。單一個內容定址記憶體晶胞的範圍儲存資料可以是範圍資料或X(don’t care,不重要)。範圍儲存資料是指,例如但不受限於,1~3、2~5、1~8、「1~2或5」等。當搜尋資料匹配於儲存資料時,搜尋結果為匹配,反之亦然。以對第1B圖的第一列進行搜尋來說明,當搜尋資料是2而儲存資料是1~3時,搜尋結果為匹配;當搜尋資料是5而儲存資料是2~5時,搜尋結果為匹配;以及,當搜尋資料是萬用字元(1~8)而儲存資料是「1~2或5」時,搜尋結果為匹配。所以,對第一列的搜尋結果為匹配,其餘列可依此類推。 FIG. 1B is a schematic diagram showing range storage data and single-bit search data. The range storage data of a single content-addressable memory cell can be range data or X (don’t care, not important). The range storage data refers to, for example but not limited to, 1~3, 2~5, 1~8, "1~2 or 5", etc. When the search data matches the storage data, the search result is a match, and vice versa. To illustrate by searching the first row of FIG. 1B, when the search data is 2 and the storage data is 1~3, the search result is a match; when the search data is 5 and the storage data is 2~5, the search result is a match; and, when the search data is a wildcard (1~8) and the storage data is "1~2 or 5", the search result is a match. Therefore, the search result for the first column is a match, and the same applies to the remaining columns.

第1C圖顯示單一位元儲存資料與範圍搜尋資料之示意圖。由位元線或字元線所輸入的範圍搜尋資料是指,例如但不受限於,1~2、5~8、4~5等。當搜尋資料匹配於儲存資料時,搜尋結果為匹配,反之亦然。以對第1C圖的第一列進行搜尋來說明,當搜尋資料 是1~2而儲存資料是1時,搜尋結果為匹配;當搜尋資料是5~8而儲存資料是5時,搜尋結果為匹配;以及,當搜尋資料是4~5而儲存資料是2時,搜尋結果為不匹配。所以,對第一列的搜尋結果為不匹配,其餘列可依此類推。 FIG. 1C shows a schematic diagram of single-bit storage data and range search data. The range search data input by the bit line or word line refers to, for example but not limited to, 1~2, 5~8, 4~5, etc. When the search data matches the storage data, the search result is a match, and vice versa. To illustrate, when the search data is 1~2 and the storage data is 1, the search result is a match; when the search data is 5~8 and the storage data is 5, the search result is a match; and, when the search data is 4~5 and the storage data is 2, the search result is a mismatch. Therefore, the search result for the first row is a mismatch, and the same can be applied to the remaining rows.

在本案一實施例中,1個內容定址記憶體晶胞包括N個(N為大於等於3的正整數)快閃記憶體晶胞時,該些N個快閃記憶體晶胞之編碼定義如下。 In one embodiment of the present case, when a content addressable memory cell includes N (N is a positive integer greater than or equal to 3) flash memory cells, the encoding definition of these N flash memory cells is as follows.

當N個快閃記憶體晶胞用於表示1個十位數字資料組合時(0,1,2,…N)時,亦即,此CAM記憶體晶胞用於儲存(0,1,2,…N)之一,該N個快閃記憶體晶胞可被編碼成:1個快閃記憶體晶胞為高臨界電壓(“0”)及(N-1)個快閃記憶體晶胞為低臨界電壓(“1”),或者是,1個快閃記憶體晶胞為低臨界電壓(“1”)及(N-1)個快閃記憶體晶胞為高臨界電壓(“0”),故而,其組合數共有

Figure 111116004-A0305-02-0010-25
個。 When N flash memory cells are used to represent a ten-digit digital data combination (0, 1, 2, ... N), that is, the CAM memory cell is used to store one of (0, 1, 2, ... N), the N flash memory cells can be encoded as: 1 flash memory cell is a high critical voltage ("0") and (N-1) flash memory cells are low critical voltage ("1"), or, 1 flash memory cell is a low critical voltage ("1") and (N-1) flash memory cells are high critical voltage ("0"), so the total number of combinations is
Figure 111116004-A0305-02-0010-25
Piece.

當N個快閃記憶體晶胞用於表示2個十位數字資料組合時(0與1,0與2,1與3,…(N-1)與N)時,亦即,此CAM記憶體晶胞用於儲存(0與1,0與2,1與3,…(N-1)與N)之一,該N個快閃記憶體晶胞可被編碼成:2個快閃記憶體晶胞為高臨界電壓(“0”)及(N-2)個快閃記憶體晶胞為低臨界電壓(“1”),或者是,2個快閃記憶體晶胞為低臨界電壓(“1”)及(N-2)個快閃記憶體晶胞為高臨界電壓(“0”),故而,其組合數共有

Figure 111116004-A0305-02-0010-26
個。 When N flash memory cells are used to represent 2 ten-digit digital data combinations (0 and 1, 0 and 2, 1 and 3, ... (N-1) and N), that is, the CAM memory cell is used to store one of (0 and 1, 0 and 2, 1 and 3, ... (N-1) and N), the N flash memory cells can be encoded as: 2 flash memory cells are high critical voltage ("0") and (N-2) flash memory cells are low critical voltage ("1"), or, 2 flash memory cells are low critical voltage ("1") and (N-2) flash memory cells are high critical voltage ("0"), so the total number of combinations is
Figure 111116004-A0305-02-0010-26
Piece.

當N個快閃記憶體晶胞用於表示3個十位數字資料組合時(0與1與2,0與1與3,…(N-2)與(N-1)與N)時,亦即, 此CAM記憶體晶胞用於儲存(0與1與2,0與1與3,…(N-2)與(N-1)與N)之一,該N個快閃記憶體晶胞可被編碼成:3個快閃記憶體晶胞為高臨界電壓(“0”)及(N-3)個快閃記憶體晶胞為低臨界電壓(“1”),或者是,3個快閃記憶體晶胞為低臨界電壓(“1”)及(N-3)個快閃記憶體晶胞為高臨界電壓(“0”),故而,其組合數共有

Figure 111116004-A0305-02-0011-27
個。 When N flash memory cells are used to represent three 10-bit digital data combinations (0 and 1 and 2, 0 and 1 and 3, ... (N-2) and (N-1) and N), that is, The CAM memory cell is used to store one of (0 and 1 and 2, 0 and 1 and 3, ... (N-2) and (N-1) and N). The N flash memory cells can be encoded as: 3 flash memory cells are high critical voltage ("0") and (N-3) flash memory cells are low critical voltage ("1"), or 3 flash memory cells are low critical voltage ("1") and (N-3) flash memory cells are high critical voltage ("0"), so the total number of combinations is
Figure 111116004-A0305-02-0011-27
Piece.

依此類推。當N個快閃記憶體晶胞用於表示N個十位數字資料組合時(0與1與2...與N)時,亦即,此CAM記憶體晶胞用於儲存(0與1與2...與N)時,該N個快閃記憶體晶胞可被編碼成:N個快閃記憶體晶胞為高臨界電壓(“0”)及0個快閃記憶體晶胞為低臨界電壓(“1”),或者是,N個快閃記憶體晶胞為低臨界電壓(“1”)及0個快閃記憶體晶胞為高臨界電壓(“0”),故而,其組合數共有

Figure 111116004-A0305-02-0011-28
個。 And so on. When N flash memory cells are used to represent N ten-digit digital data combinations (0 and 1 and 2... and N), that is, when the CAM memory cells are used to store (0 and 1 and 2... and N), the N flash memory cells can be encoded as: N flash memory cells are high critical voltage ("0") and 0 flash memory cells are low critical voltage ("1"), or, N flash memory cells are low critical voltage ("1") and 0 flash memory cells are high critical voltage ("0"), so the total number of combinations is
Figure 111116004-A0305-02-0011-28
Piece.

在本案一實施例中,搜尋資料由N個(N為大於等於3的正整數)搜尋電壓所定義時,該些N個搜尋電壓之編碼定義如下。 In one embodiment of the present case, when the search data is defined by N (N is a positive integer greater than or equal to 3) search voltages, the encoding definition of these N search voltages is as follows.

當N個搜尋電壓用於表示1個十位數字資料組合時(0,1,2,…N)時,亦即,搜尋資料代表(0,1,2,…N)之一,該N個搜尋電壓可被編碼成:1個搜尋電壓為高搜尋電壓(可為電壓VH、VH2、VD或VS,其將於底下分別說明之)及(N-1)個搜尋電壓為低搜尋電壓(可為VL、VH1、0V或0V,其將於底下分別說明之),或者是,1個搜尋電壓為低搜尋電壓及(N-1)個搜尋電壓為高搜尋電壓,故而,其組合數共有

Figure 111116004-A0305-02-0011-1
個。 When N search voltages are used to represent a ten-digit digital data combination (0, 1, 2, ... N), that is, the search data represents one of (0, 1, 2, ... N), the N search voltages can be encoded as: 1 search voltage is a high search voltage (which can be a voltage of VH, VH2, VD or VS, which will be described below) and (N-1) search voltages are low search voltages (which can be VL, VH1, 0V or 0V, which will be described below), or, 1 search voltage is a low search voltage and (N-1) search voltages are high search voltages. Therefore, the number of combinations is a total of
Figure 111116004-A0305-02-0011-1
Piece.

當N個搜尋電壓用於表示2個十位數字資料組合時 (0與1,0與2,1與3,…(N-1)與N)時,亦即,搜尋資料代表(0與1,0與2,1與3,…(N-1)與N)之一,該N個搜尋電壓可被編碼成:2個搜尋電壓為高搜尋電壓及(N-2)個搜尋電壓為低搜尋電壓,或者是,2個搜尋電壓為低搜尋電壓及(N-2)個搜尋電壓為高搜尋電壓,故而,其組合數共有

Figure 111116004-A0305-02-0012-2
個。 When N search voltages are used to represent 2 combinations of ten-digit digital data (0 and 1, 0 and 2, 1 and 3, ... (N-1) and N), that is, the search data represents one of (0 and 1, 0 and 2, 1 and 3, ... (N-1) and N), the N search voltages can be encoded as: 2 search voltages are high search voltages and (N-2) search voltages are low search voltages, or, 2 search voltages are low search voltages and (N-2) search voltages are high search voltages. Therefore, the total number of combinations is
Figure 111116004-A0305-02-0012-2
Piece.

當N個搜尋電壓用於表示3個十位數字資料組合時(0與1與2,0與1與3,…(N-2)與(N-1)與N)時,亦即,搜尋資料代表(0與1與2,0與1與3,…(N-2)與(N-1)與N)之一,該N個搜尋電壓可被編碼成:3個搜尋電壓為高搜尋電壓及(N-3)個搜尋電壓為低搜尋電壓,或者是,3個搜尋電壓為低搜尋電壓及(N-3)個搜尋電壓為高搜尋電壓,故而,其組合數共有

Figure 111116004-A0305-02-0012-3
個。 When N search voltages are used to represent three combinations of ten-digit digital data (0 and 1 and 2, 0 and 1 and 3, ... (N-2) and (N-1) and N), that is, the search data represents one of (0 and 1 and 2, 0 and 1 and 3, ... (N-2) and (N-1) and N), the N search voltages can be encoded as: 3 search voltages are high search voltages and (N-3) search voltages are low search voltages, or, 3 search voltages are low search voltages and (N-3) search voltages are high search voltages. Therefore, the total number of combinations is
Figure 111116004-A0305-02-0012-3
Piece.

依此類推。當N個搜尋電壓用於表示N個十位數字資料組合時(0與1與2...與N)時,亦即,搜尋資料代表(0與1與2...與N),該N個搜尋電壓可被編碼成:N個搜尋電壓為高搜尋電壓及0個搜尋電壓為低搜尋電壓,或者是,N個搜尋電壓為低搜尋電壓及0個搜尋電壓為高搜尋電壓,故而,其組合數共有

Figure 111116004-A0305-02-0012-4
個。 And so on. When N search voltages are used to represent N ten-digit digital data combinations (0 and 1 and 2... and N), that is, the search data represents (0 and 1 and 2... and N), the N search voltages can be encoded as: N search voltages are high search voltages and 0 search voltages are low search voltages, or, N search voltages are low search voltages and 0 search voltages are high search voltages. Therefore, the total number of combinations is
Figure 111116004-A0305-02-0012-4
Piece.

第一實施例 First embodiment

於本案第一實施例中,為實現「範圍儲存與單一位元搜尋」,複數快閃記憶體晶胞的臨界電壓,以及複數個搜尋電壓之設定可如下表1-1所示。在底下以內容定址記憶體晶胞括:4個快閃記憶體晶胞為例做說明,但當知本案並不受限於此。 In the first embodiment of the present case, in order to realize "range storage and single-bit search", the critical voltage of multiple flash memory cells and the setting of multiple search voltages can be shown in the following Table 1-1. Below, the content addressable memory cell including 4 flash memory cells is used as an example for explanation, but it should be known that the present case is not limited to this.

表1-1

Figure 111116004-A0305-02-0013-5
Table 1-1
Figure 111116004-A0305-02-0013-5

以表1-1為例,當4個快閃記憶體晶胞的臨界電壓分別為1101或0010時,則該內容定址記憶體晶胞的儲存資料為1; 當四個搜尋電壓分別為HHLH或LLHL時,則搜尋資料為1。其餘可依此類推。 Taking Table 1-1 as an example, when the critical voltages of the four flash memory cells are 1101 or 0010, the storage data of the content addressable memory cell is 1; When the four search voltages are HHLH or LLHL, the search data is 1. The rest can be deduced in the same way.

當儲存資料是0,1,2,3(XX,不重要)時,不論搜尋資料為何,搜尋結果皆為匹配。當儲存資料是無效資料時,不論搜尋資料為何,搜尋結果皆為不匹配。當搜尋資料是萬用字元0,1,2,3(XX,WC)時,不論儲存資料為何,搜尋結果皆為匹配。當搜尋資料是無效資料時,不論儲存資料為何,搜尋結果皆為不匹配。 When the stored data is 0,1,2,3 (XX, not important), the search results are matches regardless of the search data. When the stored data is invalid data, the search results are mismatches regardless of the search data. When the search data is the wildcard 0,1,2,3 (XX, WC), the search results are matches regardless of the stored data. When the search data is invalid data, the search results are mismatches regardless of the stored data.

於本案第一實施例中,為實現「單一位元儲存與範圍搜尋」,複數個快閃記憶體晶胞的臨界電壓,以及複數個搜尋電壓之設定可如下表1-2所示。 In the first embodiment of the present case, in order to realize "single bit storage and range search", the critical voltages of multiple flash memory cells and the settings of multiple search voltages can be shown in the following Table 1-2.

Figure 111116004-A0305-02-0014-6
Figure 111116004-A0305-02-0014-6
Figure 111116004-A0305-02-0015-7
Figure 111116004-A0305-02-0015-7

第二實施例 Second embodiment

第2A圖顯示根據本案第二實施例的內容定址記憶體晶胞200,以及其臨界電壓分布圖。 FIG. 2A shows a content addressable memory cell 200 according to the second embodiment of the present invention, and its critical voltage distribution diagram.

內容定址記憶體晶胞200包括:複數個串聯的快閃記憶體晶胞,其中,該些快閃記憶體晶胞例如但不受限於為,浮接閘極記憶體晶胞(floating gate memory cell)、矽-氧化物-氮化物-氧化物-矽(Silicon-Oxide-Nitride-Oxide-Silicon,SONOS)記憶體晶胞、浮點記憶體晶胞(floating dot memory cell)、鐵電場效電晶體記憶體晶胞(Ferroelectric FET(FeFET)memory cell)、可變電阻式記憶體(Resistive random-access memory,RRAM或ReRAM)、相變化記憶體(Phase-change memory,PCM)、導電橋接隨機存取記憶體(conductive-bridging RAM,CBRAM)等。在第2A圖中, 以內容定址記憶體晶胞200包括4個串聯的快閃記憶體晶胞T1~T4為例做說明,但當知本案並不受限於此,於本案其他實施例中,內容定址記憶體晶胞200包括N個串聯的快閃記憶體晶胞(N為大於等於3的正整數)。 The content addressable memory cell 200 includes: a plurality of flash memory cells connected in series, wherein the flash memory cells are, for example but not limited to, floating gate memory cells, Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) memory cells, floating dot memory cells, Ferroelectric FET (FeFET) memory cells, Resistive random-access memory (RRAM or ReRAM), Phase-change memory (PCM), conductive-bridging RAM (CBRAM), etc. In FIG. 2A, the content addressable memory cell 200 includes 4 serially connected flash memory cells T1 to T4 as an example for illustration, but it should be noted that the present invention is not limited thereto. In other embodiments of the present invention, the content addressable memory cell 200 includes N serially connected flash memory cells (N is a positive integer greater than or equal to 3).

快閃記憶體晶胞T1的閘極連接至字元線WL1,用以接收第一搜尋電壓SL_1,快閃記憶體晶胞T2的閘極連接至字元線WL2,用以接收第二搜尋電壓SL_2,快閃記憶體晶胞T3的閘極連接至字元線WL3,用以接收第三搜尋電壓SL_3,快閃記憶體晶胞T4的閘極連接至字元線WL4,用以接收第四搜尋電壓SL_4。快閃記憶體晶胞T1的源極係與快閃記憶體晶胞T2的汲極電性連接,其餘可依此類推。快閃記憶體晶胞T1的汲極與快閃記憶體晶胞T4的源極則電性連接至其他信號線(未示出)。 The gate of the flash memory cell T1 is connected to the word line WL1 to receive the first search voltage SL_1, the gate of the flash memory cell T2 is connected to the word line WL2 to receive the second search voltage SL_2, the gate of the flash memory cell T3 is connected to the word line WL3 to receive the third search voltage SL_3, and the gate of the flash memory cell T4 is connected to the word line WL4 to receive the fourth search voltage SL_4. The source of the flash memory cell T1 is electrically connected to the drain of the flash memory cell T2, and the rest can be deduced accordingly. The drain of the flash memory cell T1 and the source of the flash memory cell T4 are electrically connected to other signal lines (not shown).

內容定址記憶體晶胞200之儲存資料決定於該些快閃記憶體晶胞T1~T4之複數個臨界電壓之組合。 The storage data of the content addressable memory cell 200 is determined by the combination of multiple critical voltages of the flash memory cells T1~T4.

如第2A圖所示,於本案第二實施例中,當該快閃記憶體晶胞具有高參考臨界電壓(HVT)時,該快閃記憶體晶胞儲存邏輯0;以及,當該快閃記憶體晶胞具有低參考臨界電壓(LVT)時,該快閃記憶體晶胞儲存邏輯1。此外,參考搜尋電壓VH(H)與VL(L)(VH>VL)則代表第一搜尋電壓SL_1至第四搜尋電壓SL_4之可能值。 As shown in FIG. 2A, in the second embodiment of the present invention, when the flash memory cell has a high reference critical voltage (HVT), the flash memory cell stores logic 0; and when the flash memory cell has a low reference critical voltage (LVT), the flash memory cell stores logic 1. In addition, the reference search voltages VH (H) and VL (L) (VH>VL) represent possible values of the first search voltage SL_1 to the fourth search voltage SL_4.

於本案第二實施例中,透過對該些快閃記憶體晶胞的該些臨界電壓之編碼,以及對該些搜尋電壓的編碼,可以實現「範圍儲存與單一位元搜尋」,以及「單一位元儲存與範圍搜尋」。底下將分 別說明之。 In the second embodiment of the present case, by encoding the critical voltages of the flash memory cells and encoding the search voltages, "range storage and single bit search" and "single bit storage and range search" can be realized. They will be explained below.

第二實施例之「範圍儲存與單一位元搜尋」 The second embodiment of "range storage and single-bit search"

於本案第二實施例中,為實現「範圍儲存與單一位元搜尋」,該些快閃記憶體晶胞T1~T4的臨界電壓,以及該些搜尋電壓SL_1~SL_4之設定可如下表2-1所示。 In the second embodiment of the present case, in order to realize "range storage and single-bit search", the critical voltages of the flash memory cells T1~T4 and the settings of the search voltages SL_1~SL_4 can be shown in the following Table 2-1.

Figure 111116004-A0305-02-0017-8
Figure 111116004-A0305-02-0017-8
Figure 111116004-A0305-02-0018-9
Figure 111116004-A0305-02-0018-9

以表2-1為例,當T1~T4的臨界電壓分別為0001時,則該內容定址記憶體晶胞200的儲存資料為1;當搜尋電壓SL_1~SL_4分別為VH、VH、VL、VH時,則搜尋資料為1。其餘可依此類推。 Taking Table 2-1 as an example, when the critical voltages of T1~T4 are 0001 respectively, the storage data of the content addressable memory cell 200 is 1; when the search voltages SL_1~SL_4 are VH, VH, VL, VH respectively, the search data is 1. The rest can be deduced in the same way.

第二實施例之「單一位元儲存與範圍搜尋」 The second embodiment of "single-bit storage and range search"

於本案第二實施例中,為實現「單一位元儲存與範圍搜尋」,該些快閃記憶體晶胞T1~T4的臨界電壓,以及該些搜尋電壓SL_1~SL_4之設定可如下表2-2所示。 In the second embodiment of the present case, in order to realize "single bit storage and range search", the critical voltages of the flash memory cells T1~T4 and the settings of the search voltages SL_1~SL_4 can be shown in the following Table 2-2.

Figure 111116004-A0305-02-0018-10
Figure 111116004-A0305-02-0018-10
Figure 111116004-A0305-02-0019-11
Figure 111116004-A0305-02-0019-11

第2A圖亦顯示根據本案第二實施例的臨界電壓分布圖。 Figure 2A also shows the critical voltage distribution diagram according to the second embodiment of the present invention.

於本案第二實施例中,將施加至字元線的搜尋電壓與臨界電壓之間的電壓差稱為閘極過驅動電壓(gate overdrive voltage,GO)。於匹配狀態下,閘極過驅動電壓超過一門檻值,該電晶體提供晶胞電流;相反地,於不匹配狀態下,閘極過驅動電壓低於該門檻值,該電晶體不提供晶胞電流。以第2A圖為例,參考搜尋電壓VH與VL可分別為6V與2V,高參考臨界電壓例如但不受限於為6V,而低參考臨界電壓例如但不受限於為2V。參考搜尋電壓VH與高參考臨界電壓之間的閘極過驅動電壓約為2V,可視為是高閘極過驅動電壓;參考搜尋電壓VH與低參考臨界電壓間的閘極過驅動電壓約為6V,可視為是高閘極過驅動電壓;參考搜尋電壓VL 與高參考臨界電壓之間的閘極過驅動電壓約為<0V,可視為是低閘極過驅動電壓;參考搜尋電壓VL與低參考臨界電壓之間的閘極過驅動電壓約為2V,可視為是高閘極過驅動電壓。 In the second embodiment of the present case, the voltage difference between the search voltage and the critical voltage applied to the word line is called the gate overdrive voltage (GO). In the matched state, the gate overdrive voltage exceeds a threshold value, and the transistor provides a cell current; on the contrary, in the unmatched state, the gate overdrive voltage is lower than the threshold value, and the transistor does not provide a cell current. Taking FIG. 2A as an example, the reference search voltages VH and VL can be 6V and 2V respectively, the high reference critical voltage is, for example but not limited to, 6V, and the low reference critical voltage is, for example but not limited to, 2V. The gate overdrive voltage between the reference search voltage VH and the high reference critical voltage is about 2V, which can be regarded as a high gate overdrive voltage; the gate overdrive voltage between the reference search voltage VH and the low reference critical voltage is about 6V, which can be regarded as a high gate overdrive voltage; The gate overdrive voltage between the search voltage VL and the high reference critical voltage is approximately <0V, which can be regarded as a low gate overdrive voltage; the gate overdrive voltage between the reference search voltage VL and the low reference critical voltage is approximately 2V, which can be regarded as a high gate overdrive voltage.

細言之,當搜尋電壓為高參考搜尋電壓(VH)時,不論電晶體的臨界電壓是低參考臨界電壓(LVT)或高參考臨界電壓(HVT),該電晶體的該閘極過驅動電壓超過該門檻值,所以,該電晶體提供晶胞電流。當搜尋電壓為低參考搜尋電壓(VL)時,(1)如果電晶體的臨界電壓是低參考臨界電壓(LVT),該電晶體的該閘極過驅動電壓超過該門檻值,所以,該電晶體提供參考晶胞電流;以及,(2)如果晶胞的臨界電壓是高參考臨界電壓(HVT),該電晶體的該閘極過驅動電壓低於該門檻值,所以,該電晶體不提供晶胞電流。 In detail, when the search voltage is a high reference search voltage (VH), regardless of whether the critical voltage of the transistor is a low reference critical voltage (LVT) or a high reference critical voltage (HVT), the gate overdrive voltage of the transistor exceeds the threshold value, so the transistor provides a cell current. When the search voltage is a low reference search voltage (VL), (1) if the critical voltage of the transistor is a low reference critical voltage (LVT), the gate overdrive voltage of the transistor exceeds the threshold value, so the transistor provides a reference cell current; and (2) if the critical voltage of the cell is a high reference critical voltage (HVT), the gate overdrive voltage of the transistor is lower than the threshold value, so the transistor does not provide a cell current.

第2B圖顯示根據本案第二實施例之「範圍儲存與單一位元搜尋」操作示意圖。於該些記憶體串(memory string)SS21~SS24中,該些內容定址記憶體晶胞C21~C28之儲存資料如第2B圖所示。在此以搜尋資料為2與1為做說明。該些搜尋資料透過字元線WL21~WL28而輸入至該些內容定址記憶體晶胞C21~C28。 FIG. 2B shows a schematic diagram of the "range storage and single bit search" operation according to the second embodiment of the present invention. In the memory strings SS21~SS24, the storage data of the content addressable memory cells C21~C28 are shown in FIG. 2B. Here, the search data are 2 and 1 for illustration. The search data are input to the content addressable memory cells C21~C28 through word lines WL21~WL28.

搜尋資料為2(搜尋電壓分別為VH、VL、VH、VH),內容定址記憶體晶胞C21的4個臨界電壓分別為0111(內容定址記憶體晶胞C21的範圍儲存資料為0~2),內容定址記憶體晶胞C21的4個快閃記憶體晶胞T1~T4皆提供晶胞電流,所以,內容定址記憶體晶胞C21的搜尋結果為匹配。搜尋資料為1(搜尋電壓分別為VH、VH、 VL、VH),內容定址記憶體晶胞C22的4個臨界電壓分別為0010(內容定址記憶體晶胞C22的範圍儲存資料為1),內容定址記憶體晶胞C22的4個快閃記憶體晶胞T1~T4皆提供晶胞電流,所以,內容定址記憶體晶胞C22的搜尋結果為匹配。故而,記憶體串SS21會產生匹配電流給感應放大器SA(亦可稱為電流偵測電路或者是電性特徵偵測電路),代表對記憶體串SS21的的搜尋結果為匹配。 The search data is 2 (the search voltages are VH, VL, VH, VH), the four critical voltages of the content addressable memory cell C21 are 0111 (the range storage data of the content addressable memory cell C21 is 0~2), and the four flash memory cells T1~T4 of the content addressable memory cell C21 all provide cell currents, so the search result of the content addressable memory cell C21 is a match. The search data is 1 (the search voltages are VH, VH, VL, VH), the four critical voltages of the content addressable memory cell C22 are 0010 (the range storage data of the content addressable memory cell C22 is 1), and the four flash memory cells T1~T4 of the content addressable memory cell C22 all provide cell currents, so the search result of the content addressable memory cell C22 is a match. Therefore, the memory string SS21 will generate a matching current to the inductive amplifier SA (also called a current detection circuit or an electrical characteristic detection circuit), indicating that the search result of the memory string SS21 is a match.

同理,記憶體串SS22不會產生匹配電流給感應放大器SA,代表對記憶體串SS22的的搜尋結果為不匹配。記憶體串SS23會產生匹配電流給感應放大器SA,代表對記憶體串SS23的的搜尋結果為匹配。記憶體串SS24不會產生匹配電流給感應放大器SA,代表對記憶體串SS24的的搜尋結果為不匹配。 Similarly, memory string SS22 will not generate a matching current to the sense amplifier SA, indicating that the search result for memory string SS22 is a mismatch. Memory string SS23 will generate a matching current to the sense amplifier SA, indicating that the search result for memory string SS23 is a match. Memory string SS24 will not generate a matching current to the sense amplifier SA, indicating that the search result for memory string SS24 is a mismatch.

第三實施例 Third embodiment

第3A圖顯示根據本案第三實施例的內容定址記憶體晶胞300,以及其臨界電壓分布圖。內容定址記憶體晶胞300的電路架構可相同或相似於內容定址記憶體晶胞200,故其細節在此省略。 FIG. 3A shows a CAM cell 300 according to the third embodiment of the present invention and its critical voltage distribution diagram. The circuit architecture of the CAM cell 300 may be the same or similar to that of the CAM cell 200, so its details are omitted here.

如第3A圖所示,於本案第三實施例中,當該快閃記憶體晶胞具有高參考臨界電壓(HVT)(例如但不受限於,3~4V)時,該快閃記憶體晶胞儲存邏輯0;以及,當該快閃記憶體晶胞具有低參考臨界電壓(LVT)(例如但不受限於,小於0V)時,該快閃記憶體晶胞儲存邏輯1。此外,參考搜尋電壓VH1與VH2(VH2>VH1)則代表第一搜尋電壓SL_1至第四搜尋電壓SL_4之可能值,其中,VH2與VH1例如但不受限於,為8V與5V。 As shown in FIG. 3A, in the third embodiment of the present invention, when the flash memory cell has a high reference critical voltage (HVT) (for example, but not limited to, 3~4V), the flash memory cell stores logic 0; and, when the flash memory cell has a low reference critical voltage (LVT) (for example, but not limited to, less than 0V), the flash memory cell stores logic 1. In addition, reference search voltages VH1 and VH2 (VH2>VH1) represent possible values of the first search voltage SL_1 to the fourth search voltage SL_4, wherein VH2 and VH1 are, for example, but not limited to, 8V and 5V.

於本案第三實施例中,透過對該些快閃記憶體晶胞的該些臨界電壓之編碼,以及對該些搜尋電壓的編碼,可以實現「範圍儲存與單一位元搜尋」,以及「單一位元儲存與範圍搜尋」。底下將分別說明之。 In the third embodiment of the present case, by encoding the critical voltages of the flash memory cells and encoding the search voltages, "range storage and single bit search" and "single bit storage and range search" can be realized. They will be explained below.

第三實施例之「範圍儲存與單一位元搜尋」 The third embodiment of "range storage and single-bit search"

於本案第三實施例中,為實現「範圍儲存與單一位元搜尋」,該些快閃記憶體晶胞T1~T4的臨界電壓,以及該些搜尋電壓SL_1~SL_4之設定可如下表3-1所示。 In the third embodiment of the present case, in order to realize "range storage and single-bit search", the critical voltages of the flash memory cells T1~T4 and the settings of the search voltages SL_1~SL_4 can be shown in the following Table 3-1.

Figure 111116004-A0305-02-0022-13
Figure 111116004-A0305-02-0022-13
Figure 111116004-A0305-02-0023-14
Figure 111116004-A0305-02-0023-14

以表3-1為例,當T1~T4的臨界電壓分別為0001時,則該內容定址記憶體晶胞200的儲存資料為1;當搜尋電壓SL_1~SL_4分別為VH2、VH2、VH1、VH2時,則搜尋資料為1。其餘可依此類推。 Taking Table 3-1 as an example, when the critical voltages of T1~T4 are 0001 respectively, the storage data of the content addressable memory cell 200 is 1; when the search voltages SL_1~SL_4 are VH2, VH2, VH1, VH2 respectively, the search data is 1. The rest can be deduced in the same way.

第三實施例之「單一位元儲存與範圍搜尋」 The third embodiment of "single-bit storage and range search"

於本案第三實施例中,為實現「單一位元儲存與範圍搜尋」,該些快閃記憶體晶胞T1~T4的臨界電壓,以及該些搜尋電壓SL_1~SL_4之設定可如下表3-2所示。 In the third embodiment of the present case, in order to realize "single bit storage and range search", the critical voltages of the flash memory cells T1~T4 and the settings of the search voltages SL_1~SL_4 can be shown in the following Table 3-2.

表3-2

Figure 111116004-A0305-02-0024-15
Figure 111116004-A0305-02-0025-16
Table 3-2
Figure 111116004-A0305-02-0024-15
Figure 111116004-A0305-02-0025-16

第3A圖亦顯示根據本案第三實施例的臨界電壓分布圖。 Figure 3A also shows the critical voltage distribution diagram according to the third embodiment of the present invention.

當搜尋電壓為高參考搜尋電壓(VH2)時,不論電晶體的臨界電壓是低參考臨界電壓(LVT)或高參考臨界電壓(HVT),該電晶體的該閘極過驅動電壓超過該門檻值,所以,該電晶體提供晶胞電流。當搜尋電壓為低參考搜尋電壓(VH1)時,(1)如果電晶體的臨界電壓是低參考臨界電壓(LVT),該電晶體的該閘極過驅動電壓超過該門檻值,所以,該電晶體提供參考晶胞電流;以及,(2)如果晶胞的臨界電壓是高參考臨界電壓(HVT),該電晶體的該閘極過驅動電壓低於該門檻值,所以,該電晶體不提供晶胞電流。 When the search voltage is a high reference search voltage (VH2), regardless of whether the critical voltage of the transistor is a low reference critical voltage (LVT) or a high reference critical voltage (HVT), the gate overdrive voltage of the transistor exceeds the threshold value, so the transistor provides a cell current. When the search voltage is a low reference search voltage (VH1), (1) if the critical voltage of the transistor is a low reference critical voltage (LVT), the gate overdrive voltage of the transistor exceeds the threshold value, so the transistor provides a reference cell current; and (2) if the critical voltage of the cell is a high reference critical voltage (HVT), the gate overdrive voltage of the transistor is lower than the threshold value, so the transistor does not provide a cell current.

第3B圖顯示根據本案第三實施例之「範圍儲存與單 一位元搜尋」操作示意圖。於該些記憶體串SS31~SS34中,該些內容定址記憶體晶胞C31~C38之儲存資料如第3B圖所示。在此以搜尋資料為2與1為做說明。該些搜尋資料透過字元線WL31~WL38而輸入至該些內容定址記憶體晶胞C31~C38。 FIG. 3B shows a schematic diagram of the "range storage and single-bit search" operation according to the third embodiment of the present invention. In the memory strings SS31~SS34, the storage data of the content-addressable memory cells C31~C38 are shown in FIG. 3B. Here, the search data are 2 and 1 for illustration. The search data are input to the content-addressable memory cells C31~C38 through word lines WL31~WL38.

以記憶體串SS32為例做說明。搜尋資料為2(搜尋電壓分別為VH2、VH1、VH2、VH2),內容定址記憶體晶胞C33的4個臨界電壓分別為1100(內容定址記憶體晶胞C33的範圍儲存資料為2~3),所以,內容定址記憶體晶胞C33的4個快閃記憶體晶胞皆提供晶胞電流。搜尋資料為1(搜尋電壓分別為VH2、VH2、VH1、VH2),內容定址記憶體晶胞C34的4個臨界電壓分別為0100(內容定址記憶體晶胞C34的範圍儲存資料為2),所以,內容定址記憶體晶胞C34的3個快閃記憶體晶胞T1、T2與T4提供晶胞電流但內容定址記憶體晶胞C34的快閃記憶體晶胞T3不提供晶胞電流。所以,感應放大器SA對記憶體串SS32的感應結果代表一位元不匹配。 Take memory string SS32 as an example. The search data is 2 (the search voltages are VH2, VH1, VH2, and VH2), and the four critical voltages of content addressable memory cell C33 are 1100 (the range storage data of content addressable memory cell C33 is 2~3). Therefore, the four flash memory cells of content addressable memory cell C33 all provide cell current. The search data is 1 (the search voltages are VH2, VH2, VH1, and VH2), and the four critical voltages of the content addressable memory cell C34 are 0100 (the range storage data of the content addressable memory cell C34 is 2). Therefore, the three flash memory cells T1, T2, and T4 of the content addressable memory cell C34 provide cell currents, but the flash memory cell T3 of the content addressable memory cell C34 does not provide cell currents. Therefore, the sensing result of the sense amplifier SA on the memory string SS32 represents a bit mismatch.

同理,感應放大器SA對記憶體串SS31的感應結果代表全匹配。感應放大器SA對記憶體串SS33的感應結果代表全匹配。感應放大器SA對記憶體串SS34的感應結果代表二位元不匹配。 Similarly, the sensing result of the sense amplifier SA on the memory string SS31 represents a full match. The sensing result of the sense amplifier SA on the memory string SS33 represents a full match. The sensing result of the sense amplifier SA on the memory string SS34 represents a two-bit mismatch.

亦即,在第三實施例中,當匹配結果為全匹配時,可以感應到最高電流;當匹配結果為部份匹配(如一位元匹配、二位元匹配等)時,可以感應到中等電流;當匹配結果為全不匹配時,可以感應到最低電流。 That is, in the third embodiment, when the matching result is a full match, the highest current can be sensed; when the matching result is a partial match (such as a one-bit match, a two-bit match, etc.), a medium current can be sensed; when the matching result is a full mismatch, the lowest current can be sensed.

第四實施例 Fourth embodiment

第4A圖顯示根據本案第四實施例的內容定址記憶體晶胞400,以及其臨界電壓分布圖。內容定址記憶體晶胞400包括4個快閃記憶體晶胞,該4個快閃記憶體晶胞的閘極耦接在一起,此外,該4個快閃記憶體晶胞的源極端耦接至位元線BL1~BL4,以分別接收4個搜尋電壓,該4個快閃記憶體晶胞的汲極端耦接至下一個內容定址記憶體晶胞的4個快閃記憶體晶胞的源極端。 FIG. 4A shows a content addressable memory cell 400 according to the fourth embodiment of the present invention and its critical voltage distribution diagram. The content addressable memory cell 400 includes four flash memory cells, the gates of which are coupled together. In addition, the source terminals of the four flash memory cells are coupled to the bit lines BL1 to BL4 to receive four search voltages respectively, and the drain terminals of the four flash memory cells are coupled to the source terminals of the four flash memory cells of the next content addressable memory cell.

如第4A圖所示,於本案第四實施例中,當該快閃記憶體晶胞具有高參考臨界電壓(HVT)時,該快閃記憶體晶胞儲存邏輯0;以及,當該快閃記憶體晶胞具有低參考臨界電壓(LVT)時,該快閃記憶體晶胞儲存邏輯1。此外,參考搜尋電壓VD與0V(VD>0V)則代表第一搜尋電壓SL_1至第四搜尋電壓SL_4之可能值。例如但不受限於,VD接近1V。 As shown in FIG. 4A, in the fourth embodiment of the present invention, when the flash memory cell has a high reference critical voltage (HVT), the flash memory cell stores logic 0; and when the flash memory cell has a low reference critical voltage (LVT), the flash memory cell stores logic 1. In addition, the reference search voltage VD and 0V (VD>0V) represent possible values of the first search voltage SL_1 to the fourth search voltage SL_4. For example, but not limited to, VD is close to 1V.

當要選擇內容定址記憶體晶胞400時,透過字元線WL41~44從被選的內容定址記憶體晶胞400的4個快閃記憶體晶胞的閘極施加選擇電壓Vselect(Vselect介於高參考臨界電壓(HVT)與低參考臨界電壓(LVT之間),而未選的內容定址記憶體晶胞400的4個快閃記憶體晶胞的閘極施加通過電壓Vpass。例如但不受限於,Vpass接近7V。當被施加選擇電壓Vselect時,該內容定址記憶體晶胞400的4個快閃記憶體晶胞是否為導通則依快閃記憶體晶胞的個別臨界電壓而定,其中,當該快閃記憶體晶胞具有高參考臨界電壓(HVT)時,該快閃記憶體晶胞為導通,以及當該快閃記憶體晶胞具有低參考臨界 電壓(LVT)時,該快閃記憶體晶胞為不導通。當被施加通過電壓Vpass時,該內容定址記憶體晶胞400的4個快閃記憶體晶胞皆為導通。 When the content addressable memory cell 400 is to be selected, a selection voltage Vselect (Vselect is between a high reference threshold voltage (HVT) and a low reference threshold voltage (LVT)) is applied to the gates of the four flash memory cells of the selected content addressable memory cell 400 through word lines WL41-44, and a pass voltage Vpass is applied to the gates of the four flash memory cells of the unselected content addressable memory cell 400. For example but not limited to, Vpass is close to 7V. When the selection voltage Vs is applied When the pass voltage Vpass is applied, the four flash memory cells of the content addressable memory cell 400 are all turned on. When the pass voltage Vpass is applied, the four flash memory cells of the content addressable memory cell 400 are all turned on. When the pass voltage Vpass is applied, the four flash memory cells of the content addressable memory cell 400 are all turned on. When the pass voltage Vpass is applied, the four flash memory cells of the content addressable memory cell 400 are all turned on. When the pass voltage Vpass is applied, the four flash memory cells of the content addressable memory cell 400 are all turned on. When the pass voltage Vpass is applied, the four flash memory cells of the content addressable memory cell 400 are all turned on.

於本案第四實施例中,透過對該些快閃記憶體晶胞的該些臨界電壓之編碼,以及對該些搜尋電壓的編碼,可以實現「範圍儲存與單一位元搜尋」,以及「單一位元儲存與範圍搜尋」。底下將分別說明之。 In the fourth embodiment of the present case, by encoding the critical voltages of the flash memory cells and encoding the search voltages, "range storage and single bit search" and "single bit storage and range search" can be realized. They will be explained below.

第四實施例之「範圍儲存與單一位元搜尋」 The fourth embodiment of "range storage and single-bit search"

於本案第四實施例中,為實現「範圍儲存與單一位元搜尋」,該些快閃記憶體晶胞T1~T4的臨界電壓,以及該些搜尋電壓SL_1~SL_4之設定可如下表4-1所示。 In the fourth embodiment of the present case, in order to realize "range storage and single-bit search", the critical voltages of the flash memory cells T1~T4 and the settings of the search voltages SL_1~SL_4 can be shown in the following Table 4-1.

Figure 111116004-A0305-02-0028-17
Figure 111116004-A0305-02-0028-17
Figure 111116004-A0305-02-0029-18
Figure 111116004-A0305-02-0029-18

以表4-1為例,當T1~T4的臨界電壓分別為1101,則該內容定址記憶體晶胞400的儲存資料為1;當搜尋電壓SL_1~SL_4分別為0V、0V、VD、0V時,則搜尋資料為1。其餘可依此類推。 Taking Table 4-1 as an example, when the critical voltages of T1~T4 are 1101 respectively, the storage data of the content addressable memory cell 400 is 1; when the search voltages SL_1~SL_4 are 0V, 0V, VD, 0V respectively, the search data is 1. The rest can be deduced in the same way.

第四實施例之「單一位元儲存與範圍搜尋」 The fourth embodiment of "single bit storage and range search"

於本案第四實施例中,為實現「單一位元儲存與範圍搜尋」,該些快閃記憶體晶胞T1~T4的臨界電壓,以及該些搜尋電壓SL_1~SL_4之設定可如下表4-2所示。 In the fourth embodiment of the present case, in order to realize "single bit storage and range search", the critical voltages of the flash memory cells T1~T4 and the settings of the search voltages SL_1~SL_4 can be shown in the following Table 4-2.

Figure 111116004-A0305-02-0029-19
Figure 111116004-A0305-02-0029-19
Figure 111116004-A0305-02-0030-20
Figure 111116004-A0305-02-0030-20

第4A圖亦顯示根據本案第四實施例的臨界電壓分布圖。於本案第四實施例中,當搜尋資料匹配於儲存資料時,該內容定址記憶體晶胞400不提供晶胞電流;以及,當搜尋資料不匹配於儲存資料時,該內容定址記憶體晶胞400提供晶胞電流。 FIG. 4A also shows a critical voltage distribution diagram according to the fourth embodiment of the present invention. In the fourth embodiment of the present invention, when the search data matches the stored data, the content addressable memory cell 400 does not provide a cell current; and when the search data does not match the stored data, the content addressable memory cell 400 provides a cell current.

第4B圖與第4C圖顯示根據本案第四實施例之「範圍儲存與單一位元搜尋」操作示意圖。該些內容定址記憶體晶胞之儲 存資料如第4B圖與第4C圖所示。在此以搜尋資料為1、2、2為做說明。該些搜尋資料透過位元線BL1~BL12而輸入至該些內容定址記憶體晶胞。 FIG. 4B and FIG. 4C show schematic diagrams of the "range storage and single bit search" operation according to the fourth embodiment of the present invention. The storage data of the content addressable memory cells are shown in FIG. 4B and FIG. 4C. Here, the search data is 1, 2, 2 for illustration. The search data is input to the content addressable memory cells through bit lines BL1~BL12.

以選擇字元線WL41為例做說明。搜尋資料為1(搜尋電壓分別為0V、0V、VD、0V),第一內容定址記憶體晶胞的4個臨界電壓分別為1101(內容定址記憶體晶胞的範圍儲存資料為1),所以,第一內容定址記憶體晶胞的4個快閃記憶體晶胞皆不提供晶胞電流。搜尋資料為2(搜尋電壓分別為0V、VD、0V、0V),第二個內容定址記憶體晶胞的4個臨界電壓分別為1000(內容定址記憶體晶胞的範圍儲存資料為0~2),所以,第二個內容定址記憶體晶胞的4個快閃記憶體晶胞皆不提供晶胞電流。搜尋資料為2(搜尋電壓分別為0V、VD、0V、0V),第三個內容定址記憶體晶胞的4個臨界電壓分別為0011(內容定址記憶體晶胞的範圍儲存資料為2~3),所以,第三個內容定址記憶體晶胞的4個快閃記憶體晶胞皆不提供晶胞電流。所以,電流偵測電路410對字元線WL41的偵測結果代表全匹配(無電流)。 Take the selection of word line WL41 as an example. The search data is 1 (the search voltages are 0V, 0V, VD, and 0V respectively), and the four critical voltages of the first content addressable memory cell are 1101 respectively (the range storage data of the content addressable memory cell is 1). Therefore, the four flash memory cells of the first content addressable memory cell do not provide cell current. The search data is 2 (the search voltages are 0V, VD, 0V, and 0V respectively), and the four critical voltages of the second content addressable memory cell are 1000 (the range of content addressable memory cells is 0 to 2), so none of the four flash memory cells of the second content addressable memory cell provide cell current. The search data is 2 (the search voltages are 0V, VD, 0V, and 0V respectively), and the four critical voltages of the third content addressable memory cell are 0011 (the range of content addressable memory cells is 2 to 3), so none of the four flash memory cells of the third content addressable memory cell provide cell current. Therefore, the detection result of the current detection circuit 410 on the word line WL41 represents full match (no current).

同理,於第4C圖中,電流偵測電路410對字元線WL43的偵測結果代表2位元不匹配(有電流),其中,第一個內容定址記憶體晶胞與第二個內容定址記憶體晶胞提供電流,而第三個內容定址記憶體晶胞則不提供電流。 Similarly, in FIG. 4C , the detection result of the current detection circuit 410 on the word line WL43 represents a 2-bit mismatch (current), wherein the first content addressable memory cell and the second content addressable memory cell provide current, while the third content addressable memory cell does not provide current.

在第四實施例中,當匹配結果為全匹配時,感應不到電流;當匹配結果為部份匹配(如一位元不匹配、二位元不匹配 等)時,可以感應到中等電流;當匹配結果為全不匹配時,可以感應到最高電流。 In the fourth embodiment, when the matching result is a full match, no current can be sensed; when the matching result is a partial match (such as a one-bit mismatch, a two-bit mismatch, etc.), a medium current can be sensed; when the matching result is a full mismatch, the highest current can be sensed.

第五實施例 Fifth embodiment

第5A圖顯示根據本案第五實施例的內容定址記憶體晶胞500,以及其臨界電壓分布圖。內容定址記憶體晶胞500包括4個快閃記憶體晶胞,該4個快閃記憶體晶胞的閘極分別耦接至不同字元線WL1~WL4,以分別接收4個搜尋電壓。此外,該4個快閃記憶體晶胞的源極端耦接至匹配線ML,該4個快閃記憶體晶胞的汲極端耦接至接地端。 FIG. 5A shows a content-addressable memory cell 500 according to the fifth embodiment of the present invention and its critical voltage distribution diagram. The content-addressable memory cell 500 includes four flash memory cells, and the gates of the four flash memory cells are respectively coupled to different word lines WL1-WL4 to receive four search voltages respectively. In addition, the source terminals of the four flash memory cells are coupled to the matching line ML, and the drain terminals of the four flash memory cells are coupled to the ground terminal.

如第5A圖所示,於本案第五實施例中,當該快閃記憶體晶胞具有高參考臨界電壓(HVT)時,該快閃記憶體晶胞儲存邏輯0;以及,當該快閃記憶體晶胞具有低參考臨界電壓(LVT)時,該快閃記憶體晶胞儲存邏輯1。此外,參考搜尋電壓VS與0V(VS>0V)則代表第一搜尋電壓SL_1至第四搜尋電壓SL_4之可能值。例如但不受限於,VS接近3V。 As shown in FIG. 5A, in the fifth embodiment of the present invention, when the flash memory cell has a high reference critical voltage (HVT), the flash memory cell stores logic 0; and when the flash memory cell has a low reference critical voltage (LVT), the flash memory cell stores logic 1. In addition, the reference search voltage VS and 0V (VS>0V) represent possible values of the first search voltage SL_1 to the fourth search voltage SL_4. For example, but not limited to, VS is close to 3V.

當要搜尋內容定址記憶體晶胞500時,透過字元線WL1~WL4從施加搜尋電壓至內容定址記憶體晶胞500的4個快閃記憶體晶胞。此外,每條匹配線ML皆耦接至預充電控制電路501。預充電控制電路501例如但不受限於,由電晶體所組成,其中,該電晶體之閘極接收啟動電壓VST,源極耦接至參考電壓VM,汲極則耦接至匹配線ML。匹配線ML更耦接至電壓偵測電路502(亦可稱為電性特徵偵測電路)。於搜尋開始前,啟動電壓VST開啟預充電控制電 路501,使得該匹配線ML被預充電至該參考電壓VM。 When searching for the content addressable memory cell 500, a search voltage is applied to the four flash memory cells of the content addressable memory cell 500 through the word lines WL1-WL4. In addition, each match line ML is coupled to a pre-charge control circuit 501. The pre-charge control circuit 501 is, for example but not limited to, composed of a transistor, wherein the gate of the transistor receives a start voltage VST, the source is coupled to a reference voltage VM, and the drain is coupled to the match line ML. The match line ML is further coupled to a voltage detection circuit 502 (also referred to as an electrical characteristic detection circuit). Before the search starts, the start voltage VST turns on the pre-charge control circuit 501, so that the match line ML is pre-charged to the reference voltage VM.

於本案第五實施例中,透過對該些快閃記憶體晶胞的該些臨界電壓之編碼,以及對該些搜尋電壓的編碼,可以實現「範圍儲存與單一位元搜尋」,以及「單一位元儲存與範圍搜尋」。底下將分別說明之。 In the fifth embodiment of the present case, by encoding the critical voltages of the flash memory cells and encoding the search voltages, "range storage and single bit search" and "single bit storage and range search" can be realized. They will be explained below.

第五實施例之「範圍儲存與單一位元搜尋」 The fifth embodiment of "range storage and single-bit search"

於本案第五實施例中,為實現「範圍儲存與單一位元搜尋」,該些快閃記憶體晶胞T1~T4的臨界電壓,以及該些搜尋電壓SL_1~SL_4之設定可如下表5-1所示。 In the fifth embodiment of the present case, in order to realize "range storage and single-bit search", the critical voltages of the flash memory cells T1~T4 and the settings of the search voltages SL_1~SL_4 can be shown in the following Table 5-1.

Figure 111116004-A0305-02-0033-21
Figure 111116004-A0305-02-0033-21
Figure 111116004-A0305-02-0034-22
Figure 111116004-A0305-02-0034-22

以表5-1為例,當T1~T4的臨界電壓分別為1101,則該內容定址記憶體晶胞500的儲存資料為1;當搜尋電壓SL_1~SL_4分別為0V、0V、VS、0V時,則搜尋資料為1。其餘可依此類推。 Taking Table 5-1 as an example, when the critical voltages of T1~T4 are 1101 respectively, the storage data of the content addressable memory cell 500 is 1; when the search voltages SL_1~SL_4 are 0V, 0V, VS, 0V respectively, the search data is 1. The rest can be deduced in the same way.

第五實施例之「單一位元儲存與範圍搜尋」 The fifth embodiment of "single bit storage and range search"

於本案第五實施例中,為實現「單一位元儲存與範圍搜尋」,該些快閃記憶體晶胞T1~T4的臨界電壓,以及該些搜尋電壓SL_1~SL_4之設定可如下表5-2所示。 In the fifth embodiment of the present case, in order to realize "single bit storage and range search", the critical voltages of the flash memory cells T1~T4 and the settings of the search voltages SL_1~SL_4 can be shown in the following Table 5-2.

Figure 111116004-A0305-02-0034-23
Figure 111116004-A0305-02-0034-23
Figure 111116004-A0305-02-0035-24
Figure 111116004-A0305-02-0035-24

第5A圖亦顯示根據本案第五實施例的臨界電壓分布圖。於本案第五實施例中,當搜尋資料匹配於儲存資料時,該內容定址記憶體晶胞500為不導通,以保持該匹配線電壓;以及,當搜尋資料不匹配於儲存資料時,該內容定址記憶體晶胞500為導通,以放電該匹配線電壓。 FIG. 5A also shows a critical voltage distribution diagram according to the fifth embodiment of the present invention. In the fifth embodiment of the present invention, when the search data matches the stored data, the content addressable memory cell 500 is non-conductive to maintain the matching line voltage; and when the search data does not match the stored data, the content addressable memory cell 500 is conductive to discharge the matching line voltage.

第5B圖顯示根據本案第五實施例之「範圍儲存與單一位元搜尋」操作示意圖。該些內容定址記憶體晶胞之儲存資料如第 5B圖所示。在此以搜尋資料為1、2、2為做說明。該些搜尋資料透過字元線而輸入至該些內容定址記憶體晶胞。 FIG. 5B shows a schematic diagram of the "range storage and single bit search" operation according to the fifth embodiment of the present invention. The storage data of the content addressable memory cells is shown in FIG. 5B. Here, the search data is 1, 2, 2 for illustration. The search data is input to the content addressable memory cells through word lines.

以匹配線ML1為例做說明。搜尋資料為1(搜尋電壓分別為0V、0V、VS、0V)時,第一內容定址記憶體晶胞的4個臨界電壓分別為1101(內容定址記憶體晶胞的範圍儲存資料為1),所以,第一內容定址記憶體晶胞的4個快閃記憶體晶胞皆不導通。搜尋資料為2(搜尋電壓分別為0V、VS、0V、0V)時,第二個內容定址記憶體晶胞的4個臨界電壓分別為1000(內容定址記憶體晶胞的範圍儲存資料為0~2),所以,第二個內容定址記憶體晶胞的4個快閃記憶體晶胞皆不導通。當搜尋資料為2(搜尋電壓分別為0V、VS、0V、0V)時,第三個內容定址記憶體晶胞的4個臨界電壓分別為0011(內容定址記憶體晶胞的範圍儲存資料為2~3),所以,第三個內容定址記憶體晶胞的4個快閃記憶體晶胞皆不導通。由於匹配線ML1上的所有內容定址記憶體晶胞皆不導通,故而,匹配線ML1不會被放電,匹配線ML1可以保持於參考電壓VM,匹配線ML1的搜尋結果代表全匹配(無放電電流)。 Take the matching line ML1 as an example. When the search data is 1 (the search voltages are 0V, 0V, VS, and 0V respectively), the four critical voltages of the first content addressable memory cell are 1101 respectively (the range storage data of the content addressable memory cell is 1), so the four flash memory cells of the first content addressable memory cell are not turned on. When the search data is 2 (the search voltage is 0V, VS, 0V, 0V), the four critical voltages of the second content addressable memory cell are 1000 (the range of content addressable memory cell storage data is 0~2), so the four flash memory cells of the second content addressable memory cell are not conducting. When the search data is 2 (the search voltage is 0V, VS, 0V, 0V), the four critical voltages of the third content addressable memory cell are 0011 (the range of content addressable memory cell storage data is 2~3), so the four flash memory cells of the third content addressable memory cell are not conducting. Since all content-addressed memory cells on the match line ML1 are not conducting, the match line ML1 will not be discharged. The match line ML1 can be maintained at the reference voltage VM. The search result of the match line ML1 represents a full match (no discharge current).

同理,於第5B圖中,匹配線ML2上有2個內容定址記憶體晶胞會導通,進而對匹配線ML2放電,亦即,匹配線ML2的搜尋結果代表2位元不匹配;匹配線MLn上有1個內容定址記憶體晶胞會導通,進而對匹配線MLn放電,亦即,匹配線MLn的搜尋結果代表1位元不匹配。當愈多的位元不匹配時(愈多的內容定址記憶體晶胞導通時),對匹配線的放電速度愈快。 Similarly, in Figure 5B, two content addressable memory cells on the match line ML2 are turned on, and the match line ML2 is discharged, that is, the search result of the match line ML2 represents a 2-bit mismatch; one content addressable memory cell on the match line MLn is turned on, and the match line MLn is discharged, that is, the search result of the match line MLn represents a 1-bit mismatch. When there are more bit mismatches (more content addressable memory cells are turned on), the discharge speed of the match line is faster.

在第五實施例中,透過匹配線的放電程度,可以判斷該匹配線的匹配結果是全匹配、部份匹配或全不匹配。 In the fifth embodiment, the discharge level of the matching line can be used to determine whether the matching result of the matching line is full match, partial match or no match at all.

第六實施例 Sixth embodiment

第6A圖與第6B圖顯示根據本案一實施例之「範圍儲存與單一位元搜尋」,以及「單一位元儲存與範圍搜尋」之操作示意圖。於本案第六實施例中,透過對該些快閃記憶體晶胞的該些臨界電壓之編碼,以及對該些搜尋電壓的編碼,可以實現「範圍儲存與單一位元搜尋」,以及「單一位元儲存與範圍搜尋」。在第6A圖與第6B圖以一個內容定址記憶體晶胞600包括6個快閃記憶體晶胞為例做說明,但當知本案並不受限於此。 FIG. 6A and FIG. 6B show the operation schematic diagrams of "range storage and single bit search" and "single bit storage and range search" according to an embodiment of the present invention. In the sixth embodiment of the present invention, by encoding the critical voltages of the flash memory cells and encoding the search voltages, "range storage and single bit search" and "single bit storage and range search" can be realized. In FIG. 6A and FIG. 6B, a content addressable memory cell 600 including 6 flash memory cells is used as an example for explanation, but it should be known that the present invention is not limited to this.

於第6A圖與第6B圖中,可以用匹配結果來找出搜尋資料與儲存資料之間的漢明距離(hamming distance,HD)。 In Figures 6A and 6B, the matching results can be used to find the Hamming distance (HD) between the search data and the stored data.

第7圖顯示根據本案一實施例之CAM記憶體裝置之資料搜尋比對方法之流程圖。如第7圖所示,資料搜尋比對方法包括:儲存一儲存資料於複數個內容定址記憶體串內(710);以一搜尋資料對該些內容定址記憶體串進行資料搜尋(720);該些內容定址記憶體串產生複數個記憶體串電流(730);以及,偵測該些記憶體串電流或偵測耦接至該些內容定址記憶體串之複數條匹配線之複數個匹配線電壓,以產生複數個搜尋結果,其中,該搜尋資料與該儲存資料為一範圍儲存資料與單一位元搜尋資料,或者,該搜尋資料與該儲存資料為一單一位元儲存資料與一範圍搜尋資料(740)。 FIG. 7 is a flow chart of a data search and matching method of a CAM memory device according to an embodiment of the present invention. As shown in FIG. 7, the data search and matching method includes: storing a storage data in a plurality of content-addressable memory strings (710); performing a data search on the content-addressable memory strings using a search data (720); the content-addressable memory strings generating a plurality of memory string currents (730); and detecting the memory string currents or Detecting a plurality of match line voltages of a plurality of match lines coupled to the content addressable memory strings to generate a plurality of search results, wherein the search data and the storage data are a range storage data and a single bit search data, or the search data and the storage data are a single bit storage data and a range search data (740).

在本案上述實施例中,CAM記憶體裝置可為二維 (2D)快閃記憶體架構或三維(3D)快閃記憶體架構,此皆在本案精神範圍內。 In the above embodiments of the present invention, the CAM memory device may be a two-dimensional (2D) flash memory architecture or a three-dimensional (3D) flash memory architecture, which is within the spirit of the present invention.

在本案一實施例中,於進行記憶體內近似搜尋時,可在一個讀取周期內完成資料搜尋與比對。配合CAM記憶體裝置的高儲存密度,本案實施例的記憶體內近似搜尋可用於多種領域,例如但不受限於,大資料搜尋(Big-data searching),人工智慧硬體加速器/分類器(AI hardware accelerator/classifier)、近似計算(Approximate Computing)、相聯記憶體(Associative memory)、固態硬碟(Solid-state drive,SSD)資料管理(SSD data management)、脫氧核醣核酸(deoxyribonucleic acid,DNA)匹配、資料過濾(Data filter)等。 In an embodiment of the present case, when performing in-memory similarity search, data search and comparison can be completed within one read cycle. With the high storage density of CAM memory devices, the in-memory similarity search of the present embodiment can be used in a variety of fields, such as but not limited to, big-data searching, AI hardware accelerator/classifier, approximate computing, associative memory, solid-state drive (SSD) data management, deoxyribonucleic acid (DNA) matching, data filtering, etc.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Those with common knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope defined in the attached patent application.

710~740:步驟 710~740: Steps

Claims (15)

一種內容定址記憶體裝置,包括:複數個內容定址記憶體串;以及一電性特徵偵測電路,耦接至該些內容定址記憶體串;其中,於進行資料搜尋時,將一搜尋資料比對於該些內容定址記憶體串所儲存之一儲存資料,該些內容定址記憶體串產生複數個記憶體串電流,該電性特徵偵測電路偵測該些記憶體串電流或偵測耦接至該些內容定址記憶體串之複數條匹配線之複數個匹配線電壓,以產生複數個搜尋結果,各該些內容定址記憶體串包括複數個內容定址記憶體晶胞,其中,該儲存資料與該搜尋資料為一範圍儲存資料與單一位元搜尋資料,或者,該儲存資料與該搜尋資料為一單一位元儲存資料與一範圍搜尋資料,以及當該範圍儲存資料包括多筆不同儲存資料時,該多筆不同儲存資料係儲存於該些內容定址記憶體晶胞之單一個內容定址記憶體晶胞內。 A content-addressable memory device includes: a plurality of content-addressable memory strings; and an electrical characteristic detection circuit coupled to the content-addressable memory strings; wherein, when performing a data search, a search data is compared with a storage data stored in the content-addressable memory strings, the content-addressable memory strings generate a plurality of memory string currents, and the electrical characteristic detection circuit detects the memory string currents or detects a plurality of matching line currents of a plurality of matching lines coupled to the content-addressable memory strings. Press to generate a plurality of search results, each of the CAM strings includes a plurality of CAM cells, wherein the storage data and the search data are a range storage data and a single-bit search data, or the storage data and the search data are a single-bit storage data and a range search data, and when the range storage data includes a plurality of different storage data, the plurality of different storage data are stored in a single CAM cell of the CAM cells. 如請求項1所述之內容定址記憶體裝置,其中,當該搜尋資料匹配於該儲存資料時,該電性特徵偵測電路偵測到該記憶體串電流;以及當該搜尋資料不匹配於該儲存資料時,該電性特徵偵測電路偵測不到該記憶體串電流, 該範圍儲存資料包括多筆不同的連續或不連續儲存資料,以及,該範圍搜尋資料包括多筆不同的連續或不連續搜尋資料。 A content-addressable memory device as described in claim 1, wherein when the search data matches the stored data, the electrical characteristic detection circuit detects the memory string current; and when the search data does not match the stored data, the electrical characteristic detection circuit does not detect the memory string current, the range stored data includes a plurality of different continuous or discontinuous stored data, and the range search data includes a plurality of different continuous or discontinuous search data. 如請求項1所述之內容定址記憶體裝置,其中,當該搜尋資料匹配於該儲存資料時,該電性特徵偵測電路偵測不到該記憶體串電流;以及當該搜尋資料不匹配於該儲存資料時,該電性特徵偵測電路偵測到該記憶體串電流。 A content-addressable memory device as described in claim 1, wherein when the search data matches the stored data, the electrical characteristic detection circuit cannot detect the memory string current; and when the search data does not match the stored data, the electrical characteristic detection circuit detects the memory string current. 如請求項1所述之內容定址記憶體裝置,其中,根據該些搜尋結果以判斷該搜尋資料與該儲存資料間之一匹配程度屬於下列之一:全匹配、部份匹配與全不匹配。 A content-addressable memory device as described in claim 1, wherein the degree of match between the search data and the stored data is determined to be one of the following based on the search results: full match, partial match, and no match. 如請求項4所述之內容定址記憶體裝置,其中,當該搜尋資料全匹配於該儲存資料時,該電性特徵偵測電路偵測到一第一記憶體串電流;當該搜尋資料部份匹配於該儲存資料時,該電性特徵偵測電路偵測到一第二記憶體串電流;以及當該搜尋資料全不匹配於儲存於該儲存資料時,該電性特徵偵測電路偵測到一第三記憶體串電流,該第一記憶體串電流高於該第二記憶體串電流,且,該第二記憶體串電流高於該第三記憶體串電流。 A content-addressable memory device as described in claim 4, wherein when the search data fully matches the stored data, the electrical characteristic detection circuit detects a first memory string current; when the search data partially matches the stored data, the electrical characteristic detection circuit detects a second memory string current; and when the search data does not fully match the data stored in the stored data, the electrical characteristic detection circuit detects a third memory string current, the first memory string current is higher than the second memory string current, and the second memory string current is higher than the third memory string current. 如請求項4所述之內容定址記憶體裝置,其中,當該搜尋資料全匹配於該儲存資料時,該電性特徵偵測電路偵測到一第一記憶體串電流; 當該搜尋資料部份匹配於該儲存資料時,該電性特徵偵測電路偵測到一第二記憶體串電流;以及當該搜尋資料全不匹配於儲存於該儲存資料時,該電性特徵偵測電路偵測到一第三記憶體串電流,該第一記憶體串電流低於該第二記憶體串電流,且,該第二記憶體串電流低於該第三記憶體串電流。 A content-addressable memory device as described in claim 4, wherein when the search data fully matches the stored data, the electrical characteristic detection circuit detects a first memory string current; when the search data partially matches the stored data, the electrical characteristic detection circuit detects a second memory string current; and when the search data does not fully match the data stored in the stored data, the electrical characteristic detection circuit detects a third memory string current, the first memory string current is lower than the second memory string current, and the second memory string current is lower than the third memory string current. 如請求項4所述之內容定址記憶體裝置,更包括:一預充電控制電路,耦接至該些匹配線,於搜尋開始前,該預充電控制電路將該些匹配線預充電至一參考電壓;其中,當該搜尋資料全匹配於該儲存資料時,該電性特徵偵測電路偵測到一第一匹配線電壓;當該搜尋資料部份匹配於該儲存資料時,該電性特徵偵測電路偵測到一第二匹配線電壓;以及當該搜尋資料全不匹配於儲存於該儲存資料時,該電性特徵偵測電路偵測到一第三匹配線電壓,該第一匹配線電壓高於該第二匹配線電壓,且,該第二匹配線電壓高於該第三匹配線電壓。 The content addressable memory device as described in claim 4 further includes: a precharge control circuit coupled to the match lines, and before the search starts, the precharge control circuit precharges the match lines to a reference voltage; wherein when the search data fully matches the stored data, the electrical characteristic detection circuit detects a first match line voltage; when the search data When the search data partially matches the stored data, the electrical characteristic detection circuit detects a second match line voltage; and when the search data does not match the stored data at all, the electrical characteristic detection circuit detects a third match line voltage, the first match line voltage is higher than the second match line voltage, and the second match line voltage is higher than the third match line voltage. 一種內容定址記憶體裝置之資料搜尋比對方法,包括: 儲存一儲存資料於複數個內容定址記憶體串內,各該些內容定址記憶體串包括複數個內容定址記憶體晶胞;以一搜尋資料對該些內容定址記憶體串進行資料搜尋;該些內容定址記憶體串產生複數個記憶體串電流;偵測該些記憶體串電流或偵測耦接至該些內容定址記憶體串之複數條匹配線之複數個匹配線電壓,以產生複數個搜尋結果,其中,該儲存資料與該搜尋資料為一範圍儲存資料與單一位元搜尋資料,或者,該儲存資料與該搜尋資料為一單一位元儲存資料與一範圍搜尋資料,以及當該範圍儲存資料包括多筆不同儲存資料時,該多筆不同儲存資料係儲存於該些內容定址記憶體晶胞之單一個內容定址記憶體晶胞內。 A data search and matching method for a content-addressable memory device, comprising: Storing a storage data in a plurality of content-addressable memory strings, each of which includes a plurality of content-addressable memory cells; performing a data search on the content-addressable memory strings using a search data; the content-addressable memory strings generate a plurality of memory string currents; detecting the memory string currents or detecting a plurality of matching lines coupled to the content-addressable memory strings; A plurality of matching line voltages are connected to generate a plurality of search results, wherein the storage data and the search data are a range storage data and a single-bit search data, or the storage data and the search data are a single-bit storage data and a range search data, and when the range storage data includes a plurality of different storage data, the plurality of different storage data are stored in a single content addressable memory cell of the content addressable memory cells. 如請求項8所述之內容定址記憶體裝置之資料搜尋比對方法,其中,當該搜尋資料匹配於該儲存資料時,一電性特徵偵測電路偵測到該記憶體串電流;以及當該搜尋資料不匹配於該儲存資料時,該電性特徵偵測電路偵測不到該記憶體串電流,該範圍儲存資料包括多筆不同的連續或不連續儲存資料,以及,該範圍搜尋資料包括多筆不同的連續或不連續搜尋資料。 A data search and comparison method for a content-addressable memory device as described in claim 8, wherein when the search data matches the stored data, an electrical characteristic detection circuit detects the memory string current; and when the search data does not match the stored data, the electrical characteristic detection circuit cannot detect the memory string current, the range stored data includes a plurality of different continuous or discontinuous stored data, and the range search data includes a plurality of different continuous or discontinuous search data. 如請求項8所述之內容定址記憶體裝置之資料搜尋比對方法,其中, 當該搜尋資料匹配於該儲存資料時,一電性特徵偵測電路偵測不到該記憶體串電流;以及當該搜尋資料不匹配於該儲存資料時,該電性特徵偵測電路偵測到該記憶體串電流。 A data search and matching method for a content-addressable memory device as described in claim 8, wherein: When the search data matches the stored data, an electrical characteristic detection circuit cannot detect the memory string current; and when the search data does not match the stored data, the electrical characteristic detection circuit detects the memory string current. 如請求項8所述之內容定址記憶體裝置之資料搜尋比對方法,其中,根據該些搜尋結果以判斷該搜尋資料與該儲存資料間之一匹配程度屬於下列之一:全匹配、部份匹配與全不匹配。 A data search and comparison method for a content-addressable memory device as described in claim 8, wherein the degree of match between the search data and the stored data is determined to be one of the following based on the search results: full match, partial match, and no match. 如請求項11所述之內容定址記憶體裝置之資料搜尋比對方法,其中,當該搜尋資料全匹配於該儲存資料時,一電性特徵偵測電路偵測到一第一記憶體串電流;當該搜尋資料部份匹配於該儲存資料時,該電性特徵偵測電路偵測到一第二記憶體串電流;以及當該搜尋資料全不匹配於儲存於該儲存資料時,該電性特徵偵測電路偵測到一第三記憶體串電流,該第一記憶體串電流高於該第二記憶體串電流,且,該第二記憶體串電流高於該第三記憶體串電流。 A data search and comparison method for a content-addressable memory device as described in claim 11, wherein when the search data fully matches the stored data, an electrical characteristic detection circuit detects a first memory string current; when the search data partially matches the stored data, the electrical characteristic detection circuit detects a second memory string current; and when the search data does not fully match the data stored in the stored data, the electrical characteristic detection circuit detects a third memory string current, the first memory string current is higher than the second memory string current, and the second memory string current is higher than the third memory string current. 如請求項11所述之內容定址記憶體裝置之資料搜尋比對方法,其中,當該搜尋資料全匹配於該儲存資料時,一電性特徵偵測電路偵測到一第一記憶體串電流; 當該搜尋資料部份匹配於該儲存資料時,該電性特徵偵測電路偵測到一第二記憶體串電流;以及當該搜尋資料全不匹配於儲存於該儲存資料時,該電性特徵偵測電路偵測到一第三記憶體串電流,該第一記憶體串電流低於該第二記憶體串電流,且,該第二記憶體串電流低於該第三記憶體串電流。 A data search and comparison method for a content-addressable memory device as described in claim 11, wherein when the search data fully matches the stored data, an electrical characteristic detection circuit detects a first memory string current; when the search data partially matches the stored data, the electrical characteristic detection circuit detects a second memory string current; and when the search data does not fully match the data stored in the stored data, the electrical characteristic detection circuit detects a third memory string current, the first memory string current is lower than the second memory string current, and the second memory string current is lower than the third memory string current. 如請求項11所述之內容定址記憶體裝置之資料搜尋比對方法,其中,於搜尋開始前,將該些匹配線預充電至一參考電壓;當該搜尋資料全匹配於該儲存資料時,偵測到一第一匹配線電壓;當該搜尋資料部份匹配於該儲存資料時,偵測到一第二匹配線電壓;以及當該搜尋資料全不匹配於儲存於該儲存資料時,偵測到一第三匹配線電壓,該第一匹配線電壓高於該第二匹配線電壓,且,該第二匹配線電壓高於該第三匹配線電壓。 A data search and comparison method for a content-addressable memory device as described in claim 11, wherein the match lines are precharged to a reference voltage before the search begins; when the search data fully matches the stored data, a first match line voltage is detected; when the search data partially matches the stored data, a second match line voltage is detected; and when the search data does not fully match the stored data, a third match line voltage is detected, the first match line voltage is higher than the second match line voltage, and the second match line voltage is higher than the third match line voltage. 一種內容定址記憶體晶胞,包括:複數個記憶體晶胞,其中,該些記憶體晶胞彼此串聯,且代表一搜尋資料之複數個搜尋電壓輸入至該些記憶體晶胞之複數個控制端;或者 該些記憶體晶胞的該些控制端接收一選擇電壓或一通過電壓,且該些搜尋電壓透過複數條信號線而輸入至該些記憶體晶胞之複數個第一端;或者該些記憶體晶胞的該些控制端耦接至複數條字元線以接收該些搜尋電壓,且該些記憶體晶胞之該些第一端更耦接至一匹配線與一預充電控制電路,該些記憶體晶胞之複數個第二端耦接至接地端,其中,該內容定址記憶體晶胞之一儲存資料與該搜尋資料為一範圍儲存資料與單一位元搜尋資料,或者,該儲存資料與該搜尋資料為一單一位元儲存資料與一範圍搜尋資料,以及當該範圍儲存資料包括多筆不同儲存資料時,該多筆不同儲存資料係儲存於該內容定址記憶體晶胞內。 A content-addressable memory cell comprises: a plurality of memory cells, wherein the memory cells are connected in series, and a plurality of search voltages representing a search data are input to a plurality of control terminals of the memory cells; or the control terminals of the memory cells receive a selection voltage or a pass voltage, and the search voltages are input to a plurality of first terminals of the memory cells through a plurality of signal lines; or the control terminals of the memory cells are coupled to a plurality of word lines to receive the search voltages, and the control terminals of the memory cells receive a selection voltage or a pass voltage, and the search voltages are input to a plurality of first terminals of the memory cells through a plurality of signal lines. The first terminals of the memory cells are further coupled to a matching line and a precharge control circuit, and the second terminals of the memory cells are coupled to the ground terminal, wherein a storage data and the search data of the content-addressable memory cell are a range storage data and a single-bit search data, or the storage data and the search data are a single-bit storage data and a range search data, and when the range storage data includes a plurality of different storage data, the plurality of different storage data are stored in the content-addressable memory cell.
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