TWI840287B - Quartz cutting speed adjustment system - Google Patents

Abstract

A quartz cutting speed adjustment system includes a cutting module having a cutting device and a driving device for driving the cutting device, a control module for driving the cutting module and provided with a central processing unit, a detection unit, a speed unit and a timing unit connected to one another, the driving device is connected to the central processing unit, the timing unit prestores a cutting time information, the speed unit prestores a cutting speed information, the cutting time information is bound to the cutting speed information and stored in the central processing unit, the central processing unit drives the drive device according to the cutting time information and the cutting speed information, so as to reduce the instantaneous stress of quartz wafers and the risk of deformation.

Description

Quartz cutting speed adjustment system

The present invention relates to a cutting speed adjustment system, and more particularly to a quartz cutting speed adjustment system.

Wafer cutting is an important step in the semiconductor manufacturing process. The quality and efficiency of wafer cutting will directly affect the yield and cost of the chip. Therefore, the parameters and conditions of cutting need to be strictly controlled. Among them, the feed rate determines the time and accuracy of cutting. A feed rate that is too low will reduce cutting efficiency and increase production costs. A feed rate that is too high and the relative cutting speed is too fast may lead to excessive cutting force and heat accumulation. This will increase the risk of deformation of the cut object, such as bending, twisting, warping or cracking, and will cause increased wear of the cutter, affecting the cutting quality.

In the past, when cutting quartz columns, when the cutting wire saw touched the quartz column, the instantaneous stress was too large due to the too fast feed rate, which could easily cause the wafer to bend and damage, and produce defects such as cracks, notches, and debris, reducing the reliability of the chip. However, if the feed rate is adjusted too slowly, the cutting efficiency will be reduced, which is not cost-effective.

The purpose of the present invention is to provide a quartz cutting speed adjustment system to reduce instantaneous pressure and reduce chip deformation.

To achieve this purpose, the present invention provides a quartz cutting speed adjustment system, comprising:

A cutting module having a cutting device and a driving device, wherein the cutting device is informationally connected to the driving device, the driving device drives the cutting device to operate, and the driving device adjusts the speed and time of the operation of the cutting device; and

a control module, the control module drives the cutting module, the control module has a central processing unit, a detection unit, a speed unit and a timing unit, the driving device is information-connected to the central processing unit, the central processing unit, the detection unit, the speed unit and the timing unit are information-connected to each other, the timing unit stores a cutting time information in advance, the speed unit stores a cutting speed information in advance, the cutting time information is bound to the cutting speed information and stored in the central processing unit, the cutting time information includes a plurality of times, the cutting speed information includes a plurality of cutting speeds, the central processing unit controls the driving device according to the cutting time information and the cutting speed information,

The cutting speed information is a plurality of speed groups, including a first speed group, a second speed group, a third speed group and a fourth speed group. The speed of the first speed group is less than that of the second speed group, the speed of the second speed group is greater than that of the third speed group, and the speed of the fourth speed group is less than that of the second speed group.

More specifically, the timing unit has a timer.

More specifically, the detection unit has at least one detector.

Preferably, the last speed of the fourth speed group is equal to the first speed of the first speed group.

The present invention sets the cutting time information through the timing unit and the cutting speed information through the speed unit, and drives the driving device according to different cutting speeds and different cutting times through the central processing unit, thereby enabling the driving device to adjust the actuation time and speed of the cutting device, thereby achieving the goal of reducing the instantaneous stress of the quartz wafer and at the same time being able to significantly reduce the possibility of deformation of the quartz wafer.

The present invention provides a quartz cutting speed adjustment system, as shown in FIG1 , comprising:

A cutting module 2 and a control module 3, the cutting module 2 is electrically and informationally connected to the control module 3, the control module 3 is used to adjust the speed and time of the cutting module 2 when it is in motion, and the cutting module 2 is used to cut a quartz wafer.

The cutting module 2 has a cutting device 20 and a driving device 21. The cutting device 20 is informationally connected to the driving device 21. The driving device 21 drives the cutting device 20 to operate and adjusts the speed and time of the cutting device 20 during operation.

The control module 3 has a central processing unit 30, a detection unit 31, a speed unit 32 and a timing unit 33. The central processing unit 30, the detection unit 31, the speed unit 32 and the timing unit 33 are connected to each other for information. The driving device 21 is connected to the central processing unit 30 for information. The timing unit 33 pre-stores a cutting time information 331. The speed unit 32 pre-stores a cutting speed information 321. The cutting time information 331 is bound to the cutting speed information 321 and stored in the central processing unit 30. The central processing unit 30 sends a cutting command to the driving device 21. The driving device 21 receives the cutting command and controls the cutting device 20 to move. The detection unit 31 has at least one detector. The detection unit 31 is used to sense whether the cutting device 20 cuts or touches the quartz wafer. If the cutting device 20 cuts or touches the quartz wafer, the detection unit 31 sends a cutting signal. The detection unit 31 transmits the cutting signal to the central processing unit 30. The central processing unit 30 receives the cutting signal and triggers the timing unit 33 to start timing.

The timing unit 33 has a timer. After the central processing unit 30 receives the cutting signal, it drives the timer to start timing according to the cutting time information 331. The cutting time information 331 includes multiple times. After the timing unit 33 completes the timing according to the cutting time information 331, it will send an adjustment signal to the central processing unit 30. The cutting time information 331 can be adjusted according to user needs. In this embodiment, the times have a first time and a second time. Each first time is the time for maintaining different cutting speeds. Please refer to Figure 2. When the cutting speed is 10.8 mm/hr, it is maintained for 24 seconds. The above 24 seconds is the first time. The second time is the time for switching between two different cutting speeds. Please refer to Figure 2. The cutting speed is switched from 10.8 mm/hr to 11 The time of mm/hr is the second time. For example, the first time is 24 seconds, and the second time is 3 seconds. The first time and the second time are repeated series, that is, there is a second time between every two first times, and there is a first time between every two second times. The timing unit 33 transmits the adjustment signal to the central processing unit 30 every time a time is counted according to the cutting time information 331. After the central processing unit 30 receives the adjustment signal, the central processing unit 30 controls the driving device 21 according to the cutting time information 331 and the cutting speed information 321.

The central processing unit 30 transmits a speed signal to the driving device 21 according to the cutting time information 331 and the cutting speed information 321. The cutting speed information 321 includes a plurality of cutting speeds, and the cutting speeds are adjusted according to user needs. More specifically, after the central processing unit 30 receives the adjustment signal, the central processing unit 30 transmits the speed signal to the driving device 21, so that the driving device 21 drives the cutting device 21 according to the speed signal. 0 cutting, until the timing unit 33 completes the timing according to the cutting time information 331, the timing unit 33 then transmits the adjustment signal to the central processing unit 30, and the central processing unit 30 then transmits the speed signal to the driving device 21 according to the cutting time information 331 and the cutting speed information 321. Specifically, the driving device 21 adjusts the actuation speed of the cutting device 20 according to the second cutting speed in the cutting speed information 321. In this embodiment, the cutting time information 331 is shown in Table 1. The cutting speeds are represented by different feed rates, that is, the distance that the cutting device 20 moves relative to the quartz wafer. A higher feed rate results in a faster cutting speed, while a lower feed rate results in a slower cutting speed. The material removal rate is used to measure the volume of the quartz wafer removed by the cutting device 20.

In summary, the driving device 21 drives the cutting device 20 to operate according to the cutting time information 331 and the cutting speed information 321 until the cutting time information 331 and the cutting speed information 321 are terminated. More specifically, the second times are interspersed between the first times, and each cutting speed is maintained for the first time. Please refer to FIG. 2 . In this embodiment, the cutting speed 1 is maintained for the first time (i.e., 24 seconds), and is switched from the cutting speed 1 to the cutting speed 2 within the second time (i.e., 3 seconds). The cutting speed 2 is maintained for the first time (i.e., 24 seconds), and is switched from the cutting speed 2 to the cutting speed 3 within the second time (i.e., 3 seconds), and so on, until the cutting speed 20 is maintained for the first time.

Table I Cutting speed information Feed rate unit: mm/hr Material removal rate unit: mm ³ /hr Cutting speed 1 10.8 1.944 Cutting speed 2 11.0 1.980 Cutting speed 3 11.5 2.070 Cutting speed 4 11.3 2.034 Cutting speed 5 11.0 1.980 Cutting speed 6 10.8 1.944 Cutting speed 7 10.5 1.890 Cutting speed 8 10.2 1.836 Cutting speed 9 10.1 1.818 Cutting speed 10 10.0 1.800 Cutting speed 11 10.0 1.800 Cutting speed 12 10.1 1.818 Cutting speed 13 10.2 1.836 Cutting speed 14 10.5 1.890 Cutting speed 15 10.8 1.944 Cutting speed 16 11.0 1.980 Cutting speed 17 11.3 2.034 Cutting speed 18 11.5 2.070 Cutting speed 19 11.0 1.980 Cutting speed 20 10.8 1.944

It is worth noting that, referring to Table 1, the cutting device 20 starts to cut the quartz wafer at the cutting speed 1, at which the cutting speed 1 is a line speed, and at the same time the timing unit 33 starts to drive the timer to count according to the cutting time information 331, and the driving device 21 also drives the cutting device 20 to change the cutting speed according to the cutting speed information 321. The speed and time of the cutting module 2 are shown in FIG. 2 , which is a speed and time relationship diagram of the cutting device 20 at the cutting time information 331 (time) and the cutting speed information 321 (feeding amount). It is worth noting that the quartz cutting speed adjustment system uses the cutting device 20 to feed the quartz wafer slowly when it encounters the quartz wafer so that the quartz wafer will not be overstressed due to the instantaneous stress, and then gradually speeds up the feeding amount to 11.5 mm/hr, at this time the cutting device 20 enters 1/2 of the circumference of the quartz wafer, and gradually slows down the feed rate until it reaches 10.0 mm/hr. The cutting device 20 leaves the longest circumference of the quartz wafer, and then starts to increase the feed rate to 11.5 mm/hr, and finally drops to the cutting speed 20, at which time the cutting speed 20 is 10.8 mm/hr. The cutting speed 20 is an outlet speed, so that the cutting device 20 touches the quartz wafer (i.e., the entry speed) and leaves the quartz wafer (i.e., the outlet speed) at the slowest feed rate. In other words, the entry speed is equal to the outlet speed, so that the stress of the quartz wafer will not be overly concentrated, reducing the deformation factor of the quartz wafer.

The speeds in the cutting speed information 321 are further defined as a plurality of speed groups, including a first speed group S1, a second speed group S2, a third speed group S3 and a fourth speed group S4, the average speed of the first speed group S1 is less than the average speed of the second speed group S2, the average speed of the second speed group S2 is greater than the average speed of the third speed group S3, the average speed of the fourth speed group S4 is less than the average speed of the second speed group S2, and the average speed of the fourth speed group S4 is equal to the average speed of the first speed group S1.

In another embodiment, the first speed group S1, the second speed group S2, the third speed group S3 and the fourth speed group S4 are also included, the last speed of the first speed group S1 is less than the first speed of the second speed group S2, the last speed of the second speed group S2 is greater than the first speed of the third speed group S3, the first speed of the fourth speed group S4 is less than the last speed of the third speed group S3, the first speed of the fourth speed group S4 is less than the last speed of the second speed group S2, and the last speed of the fourth speed group S4 is equal to the first speed of the first speed group S1.

In another embodiment, the first speed group S1, the second speed group S2, the third speed group S3 and the fourth speed group S4 are also included, which are substantially the same as the first embodiment. To avoid redundancy, only the differences are described, wherein the average speed of the fourth speed group S4 is less than the average speed of the first speed group S1.

The present invention uses the quartz cutting speed adjustment system to enable the control module 3 to pre-store the time and speed in the timing unit 33 and the speed unit 32, thereby ensuring that the control module 3 can drive the cutting module 2 according to the pre-stored speed and time, thereby enabling the cutting device 20 to control the generation of cutting force and heat, reduce the instantaneous pressure of the quartz wafer being cut, reduce the risk of deformation, and at the same time help provide a stable cutting process, reduce vibration and instability, and thus ensure stability.

2: Cutting module 20: Cutting device 21: Driving device 3: Control module 30: Central processing unit 31: Detection unit 32: Speed unit 321: Cutting speed information 33: Timing unit 331: Cutting time information S1: First speed group S2: Second speed group S3: Third speed group S4: Fourth speed group

Figure 1 is a diagram of the system architecture of the present invention. Figure 2 is a diagram showing the relationship between feed amount and time coordinates of an embodiment of the present invention.

2: Cutting module

20: Cutting device

21: Drive device

3: Control module

30: Central processing unit

31: Detection unit

32: Speed unit

321: Cutting speed information

33: Timing unit

331: Cutting time information

Claims (4)

A quartz cutting speed adjustment system comprises: a cutting module having a cutting device and a driving device, the cutting device is informationally connected to the driving device, the driving device drives the cutting device to operate, and the driving device adjusts the speed and time of the operation of the cutting device; and A control module drives the cutting module. The control module has a central processing unit, a detection unit, a speed unit and a timing unit. The driving device is information-connected to the central processing unit. The central processing unit, the detection unit, the speed unit and the timing unit are information-connected to each other. The timing unit stores a cutting time information. The speed unit stores a cutting speed information. The cutting time information is bound to the cutting speed information and stored in the central processing unit. The cutting time information includes multiple times. The cutting speed information includes multiple cutting speeds. The central processing unit controls the driving device according to the cutting time information and the cutting speed information. The cutting speed information is a plurality of speed groups, including a first speed group, a second speed group, a third speed group and a fourth speed group. The speed of the first speed group is less than the speed of the second speed group, the speed of the second speed group is greater than the speed of the third speed group, and the speed of the fourth speed group is less than the speed of the second speed group. A quartz cutting speed adjustment system as described in claim 1, wherein the timing unit has a timer. A quartz cutting speed adjustment system as described in claim 1, wherein the detection unit has at least one detector. A quartz cutting speed adjustment system as described in claim 1, wherein the last speed of the fourth speed group is equal to the first speed of the first speed group.

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