TWI838337B - Layered body and method for producing multilayered body with concave part utilizing layered body - Google Patents

Abstract

The present disclosure provides a layered body comprising at least a first layer, a first adhesive layer, and a pattern-shaped structure body in this order, wherein an adhesive force of the first adhesive layer changes after subjected to an adhesive force adjusting treatment.

Description

Multilayer body and method for manufacturing multilayer body with recessed portion using the same

The present invention relates to a laminated body capable of easily transferring a patterned structure.

When the pattern-shaped structure to be arranged on the component is difficult to form directly on the surface to be arranged, or when it is desired to be arranged on multiple locations at once, it is arranged on the target surface by transfer method. Examples of pattern-shaped structures include wiring patterns in wiring boards, cell patterns used in living tissues or organs in the medical field, and protective components that are locally arranged at locations that need to be protected during the formation of wiring patterns or the manufacturing process of three-dimensional electronic parts.

As a method for transferring a pattern-like structure to a transfer object, for example, the following method is used: a carrier film on which a pattern-like structure is arranged is used, the structure on the carrier film is brought into contact with one surface of the transfer object, and then the carrier film is peeled off. Furthermore, Patent Document 1 discloses a protective film with a carrier film, which can prevent wrinkles from being generated in the protective layer when the protective layer is transferred to protect the circuit in the manufacture of a circuit substrate, etc. The protective layer is equivalent to a structure because it is transferred to the circuit, but it is not in a pattern. [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent No. 5647593 [Patent Document 2] Japanese Patent Publication No. 8-37378

[The problem the invention is trying to solve]

The support film on which the structure is arranged needs to be bonded to the support film with a certain degree of strength before transfer. However, if the bonding strength between the structure and the support film is too high, there are problems such as difficulty in transferring the structure to the transfer object at one time, and the structure is easily damaged during transfer due to the mechanical strength of the structure. Furthermore, depending on the type of structure, there is a problem that the adhesive components of the support film remaining on the structure have an adverse effect on the function or physical properties of the structure.

The present invention is completed in view of the above-mentioned actual situation, and its main purpose is to provide a multilayer body that can easily transfer a pattern-shaped structure to a transferred body, and a method for manufacturing a multilayer body with concave portions using the same. [Technical means to solve the problem]

The present invention provides a laminated body, which at least sequentially comprises a first layer, a first bonding layer, and a patterned structure, and the first bonding layer is subjected to bonding force adjustment treatment to change the bonding force.

Furthermore, the present invention provides a method for manufacturing a multilayer body with a concave portion, which is a method for manufacturing a multilayer body with a concave portion having an opening on one surface of the multilayer body using the above-mentioned laminate, and the method includes the following steps: a contacting step, which is to make the above-mentioned structure of the laminate directly contact one surface of the second layer or indirectly contact one surface of the second layer via the above-mentioned second bonding layer; a bonding force adjusting step, which is to reduce the bonding force of the above-mentioned first bonding layer by the above-mentioned bonding force adjusting treatment; a transfer step, which is to transfer at least the above-mentioned first bonding layer to the second bonding layer; The invention further comprises a step of peeling off the first layer and transferring the pattern portion including at least the structure to the second layer in the form of a pattern; a step of laminating the second layer on the side of the second layer having the pattern portion and the other layers above one layer; a step of dividing the pattern portion and the other layers above one layer into a first region including the pattern portion and the other layers overlapping the pattern portion in a top view, and a second region other than the first region; and a step of forming a concave portion by peeling off the first region to form the concave portion. [Effect of the invention]

The laminate of the present invention is capable of easily transferring a patterned structure to a transfer object at one time by changing the bonding force of the first bonding layer through the bonding force adjustment treatment, thereby suppressing damage to the structure or the generation of paste residue on the side of the structure. In addition, according to the manufacturing method of the multilayer with concave portions of the present invention, by using the laminate, the effect of easily forming concave portions on the surface of the multilayer is achieved.

In this specification, when a certain component or a certain region is "on (or below)" another component or another region or other structure, unless otherwise specified, it not only includes the situation where it is directly above (or directly below) other structures, but also includes the situation where it is above (or below) other structures, that is, it also includes the following situation: other components are included above (or below) other structures.

The present invention includes a method for manufacturing a multilayer body and a multilayer body with recessed portions in an implementation form. Hereinafter, the implementation form of the present invention will be described with reference to drawings and the like. However, the present invention can be implemented in a large number of different forms, and is not limited to the description of the implementation forms illustrated below. Furthermore, regarding the drawings, in order to explain more clearly, there are cases where the width, thickness, shape, etc. of each part are schematically represented compared to the implementation form, but this is only an example and does not limit the explanation of the present invention. Furthermore, in this specification and each drawing, there is the following situation: the same symbols are attached to the same elements as those described above with respect to the already-appeared drawings, and the detailed description is appropriately omitted. In addition, for the sake of convenience of explanation, there are cases where the words "upper" or "lower" are used for explanation, and the up and down directions may also be reversed.

I. Laminated body The laminated body of the present invention has at least a first layer, a first bonding layer, and a patterned structure in sequence, and the first bonding layer is subjected to bonding force adjustment treatment to change the bonding force.

Fig. 1 is a schematic top view showing an example of the laminate of the present invention, and Fig. 2 is a cross-sectional view taken along line XX of Fig. 1. The laminate 10 of the present invention has at least a first layer 1, a first bonding layer 2, and a patterned structure 3 in sequence, and the first bonding layer 2 undergoes bonding force adjustment processing to change the bonding force. Furthermore, in FIG2 , the bonding force between the first bonding layer 2 and the first layer 1 before the bonding force adjustment treatment is set to N ₁ , the bonding force between the first bonding layer 2 and the first layer 1 after the bonding force adjustment treatment is set to N ₁ ', the bonding force between the first bonding layer 2 and the structure 3 before the bonding force adjustment treatment is set to N ₂ , and the bonding force between the first bonding layer 2 and the structure 3 after the bonding force adjustment treatment is set to N ₂ '.

Figures 3(a) to (c) are step diagrams for explaining an example of a method for transferring a structure using the laminate of the present invention. As a method for transferring a structure to a transfer object (second layer) using the laminate of the present invention, first, the structure 3 of the laminate 10 of the present invention is directly contacted with one surface of the second layer 11 or indirectly contacted with one surface of the second layer 11 via the second bonding layer (Figure 3(a), contact step). Then, the bonding force of the first bonding layer 2 is reduced by bonding force adjustment treatment T (Figure 3(b), bonding force adjustment step). Thereafter, at least the first layer 1 is peeled off (Figure 3(c), transfer step). In FIG. 3( c ), the first layer 1 and the first bonding layer 2 are peeled off. Thus, the pattern portion 20 including at least the structure 3 is transferred to the second layer 11 in a pattern form at one time. In FIG. 3 , the bonding force between the structure and the second layer is set to N ₄ . Other symbols not explained in FIG. 3 are the same as those in FIG. 2 .

As a method of transferring a patterned structure to a transfer object, for example, there is a method of using a carrier film provided with a patterned structure. The carrier film provided with the structure requires that the structure and the carrier film be bonded to a certain degree of strength before transfer. However, if the bonding force between the structure and the carrier film is too high, there are the following problems: it is difficult to transfer the structure to the transfer object at one time, and damage occurs during transfer due to the mechanical strength of the structure. Furthermore, depending on the type of structure, there is a problem that the adhesive components of the carrier film remaining on the structure have an adverse effect on the function or physical properties of the structure.

In view of this problem, the inventors of the present invention have developed a laminated body in the form of a transfer laminated body for a patterned structure, which solves the above problem by arranging a patterned structure on a bonding layer whose bonding force is variable and whose bonding force is reduced by bonding force adjustment treatment. That is, according to the laminated body of the present invention, by arranging a patterned structure on a first bonding layer whose bonding force is reduced by bonding force adjustment treatment, before the bonding force adjustment treatment, the first bonding layer has a higher bonding force and can hold the structure, and on the other hand, after the bonding force adjustment treatment, the bonding force of the first bonding layer relative to the structure is reduced, so that the structure can be easily peeled off. Thus, the laminate of the present invention can transfer the structure to the transfer object at one time. In addition, the first bonding layer of the laminate of the present invention can sufficiently reduce the bonding force by adjusting the degree of bonding force, so the laminate of the present invention can achieve high transferability regardless of the mechanical strength or type of the structure, and can suppress the damage of the structure during transfer or the generation of paste residues on the side of the structure.

Here, the so-called "pattern state" refers to a state in which the adhered surface of the layer for arranging the structure has a part where the structure is provided and a part where the structure is not provided. In addition, the transfer body that at least includes the structure and is transferred to the transferred body by the laminate of the present invention is sometimes called the "pattern part". The pattern part can be transferred to the adhered body in a pattern state. The so-called transfer or being transferred to the transferred body refers to transfer or being transferred to one side of the transferred body. Furthermore, the transferred body to which the pattern part including the structure is transferred by the laminate of the present invention is sometimes referred to as the "second layer" for explanation. In the following, the laminate of the present invention is explained one by one.

A. First Adhesive Layer The first adhesive layer of the laminate of the present invention is a layer that undergoes adhesive force adjustment treatment to change the adhesive force. The first adhesive layer has adhesiveness and/or adhesion before the adhesive force adjustment treatment.

1. Aspects of the first bonding layer The first bonding layer undergoes bonding force adjustment processing to change the bonding force. Here, the so-called "element of bonding force adjustment processing to change the bonding force" may be subjected to bonding force adjustment processing to increase the bonding force compared to before the bonding force adjustment processing, or may be subjected to bonding force adjustment processing to reduce the bonding force compared to before the bonding force adjustment processing. Among them, in the present invention, it is preferred that the bonding force is reduced by the bonding force adjustment processing, and it is more preferred that the bonding force is eliminated by the bonding force adjustment processing.

The first bonding layer has a composition suitable for bonding force adjustment treatment. As bonding force adjustment treatment, it is preferred to use treatment that can reduce the bonding force of the first bonding layer, such as heat treatment of heating treatment or cooling treatment, energy beam irradiation treatment, electric field application treatment or electric field treatment without electric field treatment.

That is, the first bonding layer can be roughly divided into a first aspect of a temperature-sensitive bonding layer that receives a heating treatment or a cooling treatment to reduce bonding strength, a second aspect of an energy-ray responsive bonding layer that receives an energy-ray irradiation treatment to reduce bonding strength, and a third aspect of an electrical-responsive bonding layer that receives an electric field application treatment or an electric field-free treatment to reduce bonding strength. The first bonding layer is described below in terms of each aspect.

(1) First Aspect The first bonding layer of this aspect is a temperature-sensitive bonding layer that receives a heat treatment or a cooling treatment as a bonding force adjustment treatment to reduce the bonding force. The temperature-sensitive bonding layer is a bonding layer that repeats bonding and non-bonding in response to temperature changes. In the laminate of the present invention, it can be a heat-peelable type in which the bonding force is reduced by a heat treatment, or it can be a cooling-peelable type in which the bonding force is reduced by a cooling treatment.

(a) Thermal peelable temperature-sensitive adhesive layer The thermal peelable temperature-sensitive adhesive layer is heated above a specific switching temperature to reduce the adhesive force and enable peeling. The switching temperature can be appropriately set depending on the composition of the thermal peelable temperature-sensitive adhesive layer or its melting point, for example, it can be set to a range of 30°C to 200°C, preferably 40°C to 90°C. The reason is that by setting the switching temperature within the above range, it is possible to ensure workability at room temperature.

Furthermore, when the multilayer body of the present invention is used in a step accompanied by heat, the switch temperature is preferably higher than the temperature of the step accompanied by heat. The so-called step accompanied by heat includes, for example, the calcination step of the solder resist (e.g., about 120°C) and the reflow step (e.g., about 260°C) in the manufacture of the multilayer body with recessed portions described below.

The composition of the heat-peelable temperature-sensitive adhesive layer is not particularly limited as long as it can exhibit the desired physical properties, and examples thereof include a composition containing at least an adhesive and a foaming agent or an expansion agent (composition A), a composition containing at least an adhesive and a side-chain crystalline polymer (composition B), etc. Composition A is subjected to a heat treatment to foam the foaming agent or expand the expansion agent, and the contact area is physically reduced, thereby achieving a reduction in the adhesive force, thereby enabling easy peeling. In addition, regarding composition B, if the heat treatment is performed at a temperature above the melting point of the side-chain crystalline polymer, the physical properties of the side-chain crystalline polymer change due to phase change and flow, and the adhesion of the temperature-sensitive adhesive layer can be sufficiently reduced, thereby enabling easy peeling.

(i) Composition A Composition A of the heat-peelable temperature-sensitive adhesive layer comprises at least an adhesive and a foaming agent or an expanding agent.

The adhesive includes a polymer having adhesive properties. Examples of the adhesive include natural rubber adhesives, synthetic rubber adhesives, styrene/butadiene latex-based adhesives, block copolymer-type thermoplastic rubbers, butyl rubbers, polyisobutylene, acrylic adhesives, vinyl ether copolymers, etc. Specifically, adhesives disclosed in Japanese Patent Publication No. 2008-13590 and Japanese Patent Publication No. 3853247 can be cited.

As the foaming agent or swelling agent, a material that foams the foaming agent or expands the swelling agent when subjected to heat treatment can be used. The foaming agent can be a chemical foaming agent or a physical foaming agent. Specifically, the foaming agent disclosed in Japanese Patent Publication No. 2008-13590, the thermal expansion microsphere disclosed in Japanese Patent Publication No. 3853247, etc. can be used. The temperature at which the foaming agent or the expanding agent foams or expands, and the content of the foaming agent or the expanding agent in the heat-peelable temperature-sensitive adhesive layer can be appropriately set. Specifically, they can be set to the same foaming or expanding temperature and content as disclosed in Japanese Patent Publication No. 2008-13590 and Japanese Patent Publication No. 3853247.

The above-mentioned composition A may further include a side-chain crystalline polymer. Since the side-chain crystalline polymer will flow when heated at a temperature above the melting point, the adhesion of the temperature-sensitive adhesive layer can be sufficiently reduced. Therefore, the content of the foaming agent in the temperature-sensitive adhesive layer can be reduced, thereby thinning the temperature-sensitive adhesive layer. The side-chain crystalline polymer will be explained in "(ii) composition B", so the explanation is omitted here. The content of the side-chain crystalline polymer in the above-mentioned composition A is not particularly limited and can be set appropriately.

(ii) Composition B Composition B of the heat-peelable temperature-sensitive adhesive layer contains at least an adhesive and a side-chain crystalline polymer. The adhesive can be the same as that of composition A, so its description is omitted here.

A side-chain crystalline polymer is a polymer that crystallizes at a temperature below the melting point and exhibits fluidity at a temperature above the melting point, and is a polymer that can reversibly generate a crystal state and a fluid state in response to temperature changes. Examples of side-chain crystalline polymers include polymers containing (meth)acrylates having a linear alkyl group, acrylates or methacrylates having an alkyl group, and polar monomers. Specifically, the side-chain crystalline polymer disclosed in Japanese Patent Laid-Open No. 2008-13590 can be cited. The content of the side chain crystalline polymer in the composition B is not particularly limited, and can be appropriately set to a sufficient amount for the heat-peelable temperature-sensitive adhesive layer to exhibit the following characteristics: being substantially non-adhesive at a temperature above a set temperature, and being adhesive at a temperature below the set temperature. For example, the content can be set to the content disclosed in Japanese Patent Publication No. 2008-13590.

(iii) Others Furthermore, as the heat-peelable temperature-sensitive adhesive layer including the above-mentioned composition A, for example, the heat-expandable layer of the heat-peelable adhesive sheet disclosed in Japanese Patent No. 3853247 can be cited. Also, as the heat-peelable temperature-sensitive adhesive layer including the above-mentioned composition B, for example, the adhesive layer of the adhesive sheet disclosed in Japanese Patent Laid-Open No. 2008-13590 can be cited.

(b) Cooling-peelable temperature-sensitive adhesive layer The cooling-peelable temperature-sensitive adhesive layer is cooled below a specific switching temperature to reduce the adhesion force and thus can be peeled off. The switching temperature can be appropriately set according to the composition of the cooling-peelable temperature-sensitive adhesive layer or its melting point, for example, preferably above 10°C. In addition, the switching temperature can be set below 70°C, preferably below 20°C. The reason is that by setting the switching temperature within the above range, the cooling-peelable temperature-sensitive adhesive layer can be easily attached at room temperature and peeled off in a cooling environment.

The composition of the cold peelable thermosensitive adhesive layer is not particularly limited as long as it can exhibit the desired physical properties. For example, a composition including a side-chain crystallizable polymer having an alkyl acrylate and/or an alkyl methacrylate having a linear alkyl group of 16 or more as a side chain can be cited.

Examples of acrylates and/or methacrylates having a linear alkyl group with 16 or more carbon atoms as side chains (also collectively referred to as (meth)acrylates) include (meth)acrylates having a linear alkyl group with 16 to 22 carbon atoms, such as hexadecyl (meth)acrylate, stearyl (meth)acrylate, and behenyl (meth)acrylate.

The side chain crystallizable polymer is not particularly limited, and for example, a monomer polymer containing 40% to 60% by weight of an alkyl acrylate and/or alkyl methacrylate having an alkyl group with a carbon number of 1 to 6, 2% to 10% by weight of a carboxyl group-containing ethylenic unsaturated monomer, and 20% to 60% by weight of an alkyl acrylate and/or alkyl methacrylate having an alkyl group with a carbon number of 16 to 22 can be used.

The side chain crystallizable polymer preferably has a melting point (also called the first melting transition) in the range of 0°C to 70°C, and more preferably in the range of about 15°C to 55°C. In addition, the side chain crystallizable polymer preferably melts in a relatively narrow temperature range of less than about 35°C, preferably less than about 25°C. The amount of the side chain crystallizable polymer is not particularly limited, and can be appropriately set to an amount sufficient for the cold peel type thermosensitive adhesive layer to exhibit the following characteristics: substantially non-adhesive at a temperature below a set temperature, and adhesive at a temperature above the set temperature.

Furthermore, as the cold peelable temperature-sensitive adhesive layer including the above-mentioned composition, for example, the adhesive layer disclosed in Japanese Patent Laid-Open No. 2000-351951 can be used.

(2) Second Aspect The first bonding layer of this aspect is an energy ray responsive bonding layer that receives energy ray irradiation treatment as bonding force adjustment treatment to reduce bonding force. The energy ray responsive bonding layer is hardened and shrunk by energy ray irradiation, thereby enabling peeling due to the reduction of bonding force and the generation of shear force on the bonded surface.

The energy beam used in the energy beam irradiation treatment can be any energy beam that can cause the first bonding layer to react, and can be appropriately selected depending on the composition of the bonding layer that is energy beam responsive. Examples of energy beams include: far ultraviolet, ultraviolet, near ultraviolet, infrared, and other light, X-rays, electron beams, gamma-rays, and other electromagnetic waves, proton beams, neutron beams, and other ionizing radiations. Among them, ultraviolet and electron beams are preferred.

The composition of the energy ray responsive adhesive layer is not particularly limited as long as it can be cured by energy ray irradiation. The composition of the energy ray responsive adhesive layer includes, for example, an acrylic polymer, an energy ray polymerizable oligomer or monomer, a polymerization initiator, and a crosslinking agent. In the present invention, "acrylic acid" may also include "methacrylic acid".

Examples of acrylic polymers include copolymers of acrylic esters as main monomers and acrylic monomers containing functional groups copolymerizable with the acrylic esters, i.e., acrylic ester copolymers. Examples of functional groups of acrylic monomers containing functional groups include hydroxyl groups, carboxyl groups, epoxy groups, isocyanate groups, and amine groups. For example, acrylic esters and monomers disclosed in Japanese Patent Laid-Open No. 2012-31316 and Japanese Patent Laid-Open No. 2004-158812 can be used as acrylic esters and monomers constituting acrylic polymers. Furthermore, the acrylic polymers can be set to, for example, the mass average molecular weight (Mw) disclosed in the above-mentioned publications.

As the energy-ray polymerizable oligomer or monomer, there is no particular limitation as long as it can be polymerized by irradiation with energy rays, and examples thereof include oligomers or monomers that are photo-radical polymerizable, photo-cation polymerizable, and photo-cation polymerizable. Specifically, energy-ray polymerizable oligomers or monomers disclosed in Japanese Patent Laid-Open No. 2012-31316 and Japanese Patent Laid-Open No. 2004-158812 can be used. The energy-ray polymerizable oligomer or monomer can be set to, for example, the mass average molecular weight (Mw) and content disclosed in the above-mentioned publications.

Examples of the polymerization initiator include IRGACURE 754 (manufactured by BASF JAPAN), IRGACURE 2959 (manufactured by BASF JAPAN), and photopolymerization initiators disclosed in Japanese Patent Laid-Open No. 2004-158812. Examples of the crosslinking agent include isocyanate crosslinking agents, epoxy crosslinking agents, and the like. Specifically, the crosslinking agent disclosed in Japanese Patent Laid-Open No. 2012-31316 can be used.

The energy-beam-responsive bonding layer may further include a gas generator. The reason is that the gas generator generates gas due to energy-beam irradiation, and the gas is transferred to the interface between the bonding layer and the adherend, thereby becoming easier to peel off. There is no particular limitation on the gas generator, and for example, azo compounds and azide compounds can be used. Specifically, the azo compounds and azide compounds disclosed in Japanese Patent Publication No. 2004-158812 can be cited. As for the content of the gas generator, there is no particular limitation as long as it can exert the required function, and for example, it can be set to the amount disclosed in Japanese Patent Publication No. 2004-158812.

Furthermore, as the energy line responsive adhesive layer, for example, the adhesive layer or bonding layer disclosed in Japanese Patent Application Laid-Open No. 2012-31316 and Japanese Patent Application Laid-Open No. 2004-158812 can be used.

(3) The third aspect of the sample The first bonding layer of this aspect is an electrically responsive bonding layer that receives an electric field application treatment or an electric field-free treatment as a bonding force adjustment treatment to reduce the bonding force. The so-called electrically responsive bonding layer is a bonding layer that repeats bonding and non-bonding properties in accordance with the presence or absence of an electric field application. In the laminate of the present invention, the electrically responsive bonding layer may be an electrically exfoliative bonding layer that exhibits bonding force in the absence of an electric field and reduces the bonding force by applying an electric field, or an electrically adhesive bonding layer that exhibits bonding force by applying an electric field and reduces the bonding force in the absence of an electric field. Among them, an electrically exfoliative bonding layer that reduces the bonding force by applying an electric field is preferred. The reason is that the transfer operation or process can be carried out in a normal environment.

If the first bonding layer of the present embodiment is an electrically exfoliative bonding layer, the bonding force adjustment treatment refers to an electric field application treatment of applying an electric field to the first bonding layer in the absence of an electric field. That is, in the case where the first bonding layer of the present embodiment is an electrically exfoliative bonding layer, by placing the laminate of the present invention in the absence of an electric field, the first bonding layer can have bonding properties. On the other hand, when the pattern portion including the structure is transferred to the second layer, by placing the laminate of the present invention in an electric field as an electric field application treatment in a state where the second layer is configured with the laminate of the present invention, the bonding force of the first bonding layer to which the electric field is applied is reduced, and at least the first layer can be peeled off.

As the composition of such an electrolytically strippable adhesive layer, for example, a composition including an acrylic adhesive or a polyester adhesive and an electrolyte can be cited. The acrylic polymer constituting the acrylic adhesive is not particularly limited. From the perspective of adhesiveness, for example, an acrylic polymer having a weight average molecular weight in the range of 10,000 to 5,000,000 can be used. The calculation method of the weight average molecular weight and the specific examples of the acrylic monomer and polymerization initiator constituting such an acrylic polymer can be the same as the calculation method and materials disclosed in Japanese Patent Publication No. 2010-037354.

The electrolyte is not particularly limited as long as it can exhibit the required ionic conductivity, and an example thereof may include a mixture of a quaternary ammonium salt or an alkaline metal salt as an electrolyte and an organic solvent. The ionic conductivity of the electrolyte, the method for determining the ionic conductivity, and the specific composition of the electrolyte may be the same as those disclosed in Japanese Patent Publication No. 2010-37354.

On the other hand, if the first bonding layer of the present embodiment is an electrically bonded bonding layer, the bonding force adjustment process refers to a no-electric field process in which the application of an electric field to the first bonding layer is stopped to provide a no-electric field. That is, when the first bonding layer of the present embodiment is an electrically bonded bonding layer, the first bonding layer can have a desired bonding force by applying an electric field to the first bonding layer. On the other hand, when the pattern portion including the structure is transferred to the second layer, the bonding force of the first bonding layer is reduced by stopping the application of an electric field to the first bonding layer as a no-electric field process, and peeling can be performed at a desired interface with a layer adjacent to the first bonding layer.

As the composition of such an electrically adhesive bonding layer, for example, an electrorheological gel (ER gel) in which electrorheological particles (ER particles) are dispersed in a resin crosslinker can be cited. Furthermore, as the electrically adhesive bonding layer, for example, an electric adhesive sheet disclosed in Japanese Patent Publication No. 2013-049820 can also be used, specifically, a sheet formed by combining viscoelastic silicone gel, urethane rubber, or butadiene rubber with a two-layered porous sheet.

The method of applying an electric field to the first bonding layer can be a known method. For example, a method of connecting a terminal to the first conductive layer and the structure and applying a voltage between the terminals, a method of bringing the terminal into contact with the first conductive layer and the first bonding layer and applying a voltage between the terminals, etc. As the first conductive layer, for example, a metal foil such as copper foil or aluminum foil can be used. In addition, the application conditions are not particularly limited, and can be set, for example, within the range of 5 V to 50 V for the electric field and within the range of 10 seconds to 120 seconds for the application time.

(4) Others The first bonding layer of each embodiment may contain other optional additives as needed. Examples of the optional additives include: colorants, pigment powders, surfactants, plasticizers, adhesion promoters, low molecular weight polymers, surface lubricants, leveling agents, antioxidants, corrosion inhibitors, light stabilizers, ultraviolet absorbers, polymerization inhibitors, silane coupling agents, inorganic or organic fillers, metal powders, particles, foils, etc.

2. Others The first bonding layer preferably exhibits the required bonding force before and after the bonding force adjustment treatment. The bonding force of the first bonding layer before the bonding force adjustment treatment also depends on the composition and thickness of the bonding layer, for example, it is within the range of 0.1 N/25 mm or more and 10 N/25 mm or less, preferably within the range of 0.5 N/25 mm or more and 5 N/25 mm or less, and more preferably within the range of 1 N/25 mm or more and 3 N/25 mm or less. In addition, the bonding force of the first bonding layer after the bonding force adjustment treatment only needs to be lower than that before the bonding force adjustment treatment, wherein it is preferred that the first bonding layer can exhibit easy peelability or non-bonding to the first layer or the structure. The adhesion of the first adhesive layer after the adhesion adjustment treatment can be set, for example, to be 5 N/25 mm or less, preferably to be within the range of 0.05 N/25 mm or more and 2 N/25 mm or less, and more preferably to be within the range of 0.05 N/25 mm or more and 0.5 N/25 mm or less. Furthermore, the so-called non-adhesiveness refers to the physical property of not having adhesion in substance, and the so-called easy peelability refers to the physical property of having viscosity, being able to adhere to the first layer and the structure, and being able to be easily peeled off from the first layer or the structure.

The adhesion of the first adhesive layer before and after the adhesion adjustment process can be measured according to JIS Z0237-2009. The measurement is carried out as follows: a test piece with a PET (polyethylene terephthalate) film having a thickness of 50 μm as the first adhesive layer (width 25 mm, length 150 mm) is prepared, the first adhesive layer of the test piece is bonded to a SUS304BA plate, and the plate is pressed back and forth twice using a 2 kg roller, and is placed under conditions of a temperature of 20°C to 28°C and a humidity of 30%RH to 60%RH for 1 hour to 24 hours, and then a tensile tester (e.g., A&D (stock) manufactured, Tensilon universal tester RTF-1150H) is used under conditions in accordance with JIS Z0237-2009 (peel angle: 180° direction; tensile speed: 300 mm/min; peel distance: 50 In the case of measuring the adhesion of the first adhesion after the adhesion adjustment treatment, the first adhesion layer of the test piece prepared by the above method is attached to the SUS304BA plate, and is pressed back and forth twice by a 2 kg roller and placed under the above conditions. Thereafter, the adhesion adjustment treatment is performed, and the test piece after the treatment is peeled and measured using a tensile testing machine under the conditions of the above JIS Z0237-2009.

The thickness of the first bonding layer is not particularly limited as long as it can exhibit the required bonding strength with the first layer or the structure before and after the bonding strength adjustment process, and can be appropriately set, for example, it can be set to a range of 1 μm or more and 500 μm or less, preferably 5 μm or more and 300 μm or less. The first bonding layer can be in the form of a film or a sheet.

The first bonding layer can be arranged on the entire surface of one side of the first layer 1 as shown in FIG2, or can be arranged in the same pattern as the structure 3 as shown in FIG4. When the first bonding layer is in the same pattern as the structure, peeling occurs between the first layer after the bonding force adjustment treatment and the first bonding layer, thereby enabling the structure and the pattern portion of the first layer on the structure to be transferred to one side of the second layer.

The first bonding layer can be selected according to the use environment of the laminate of the present invention. For example, when used in a step of applying heat such as a heating step, it is preferably a heat-stripping type temperature-sensitive bonding layer, and in particular, an electrically responsive bonding layer is more preferred for ease of operation. Furthermore, when used in a step of ultraviolet irradiation, it is preferably an energy-ray-responsive bonding layer, and in particular, a temperature-sensitive bonding layer is more preferred.

B. First layer The first layer of the laminate of the present invention is a layer that supports the first bonding layer and the structure. The first layer is a layer that makes the laminate of the present invention contact with the second layer and performs bonding force adjustment on the first bonding layer before being peeled off and removed. Depending on the use of the laminate of the present invention, it is a layer that becomes a peeling layer or a base material.

The first layer can be made of a material that can be bonded to the first bonding layer before the bonding force adjustment treatment and can make the first bonding layer show the required bonding force. Examples of the first layer include a resin layer, a metal layer such as a metal foil, a vapor-deposited film having a metal film on one or both sides of the resin layer, a paper such as a release paper, and a composite material of these materials.

The resin layer is not particularly limited, and examples thereof include layers containing polyesters such as polyethylene terephthalate and polyethylene naphthalate, acrylic resins such as polycarbonate and polymethyl methacrylate, olefins such as polyethylene and polypropylene, polyimide, cyclic polyolefins, and triacetyl cellulose.

In addition, examples of metal foil include copper foil, aluminum foil, etc. As the copper foil, a foil of a single metal including copper can be used, and a foil of an alloy including copper and other metals (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) can also be used.

Among them, the first layer is preferably a resin layer. As described below, when the peeling position after the adhesion adjustment treatment is set between the first adhesion layer and the structure, the first layer is preferably a resin layer. The reason is that the adhesion between the first adhesion layer and the first layer after the adhesion adjustment treatment can be improved. As the first layer in this case, specifically, it is preferably a resin layer containing polyester such as PET, polyimide, polypropylene, polyethylene, etc.

Regarding the first layer, the surface on the side in contact with the first bonding layer can be subjected to surface treatment. The reason for this is that the bonding force between the first bonding layer before and after the bonding force adjustment treatment, especially the first bonding layer after the bonding force adjustment treatment, can be improved, and the first bonding layer after the bonding force adjustment treatment can be prevented from being easily peeled off from the first layer. The method for surface treatment of the surface on the side of the first bonding layer of the first layer can be appropriately selected depending on the type of material constituting the first layer, and for example, known methods such as oxidation method and embossing method can be listed.

The thickness of the first layer is not particularly limited, but is preferably a thickness that can at least provide strength to support the first connecting layer and the structure, for example, it can be set within a range of 5 μm to 1000 μm. The first layer can be in the form of a film or a sheet. In particular, from the perspective of peeling, a film is preferred.

The first layer may or may not be light-transmissive. When the first bonding layer is an energy-ray responsive bonding layer, the first layer is preferably energy-ray transparent. The reason is that irradiating the energy ray from the side of the first layer can easily reduce the bonding strength of the first bonding layer. The energy-ray transmittance of the first layer can be appropriately set according to the type of irradiated energy ray and the sensitivity of the material constituting the first layer to the energy ray. For example, if the energy ray is light, it is preferred that the transmittance of the first layer below 400 nm is 60% or more. Furthermore, the transmittance can be measured using a commercially available spectrophotometer (for example, MPC2200 manufactured by Shimadzu Corporation).

In addition, when the first adhesive layer is a heat-peelable thermosensitive adhesive layer, the first layer is preferably heat-resistant. The reason is that when the adhesion of the first adhesive layer is reduced by heat treatment, thermal degradation of the first layer can be prevented and peeling can be easily performed. The first layer is preferably heat-resistant enough to withstand the heat treatment temperature of the heat-peelable thermosensitive adhesive layer. Specifically, it is preferred that the melting point of the first layer is higher than the heat treatment temperature.

C. Structure The structure in the laminate of the present invention is a component disposed on the side of the first connecting layer opposite to the first layer. It has a function suitable for the application by directly transferring or transferring in a pattern through other layers to one side of the second layer. In the laminate of the present invention, one or more structures are disposed in a pattern on the side of the first connecting layer opposite to the first layer.

The structure may have a shape suitable for the use of the laminate of the present invention, for example, it may be a layered shape such as a sheet or film, a sphere, a cube, a cuboid or other three-dimensional shape. The layered structure may be a single layer or may have a layered structure. The size or thickness of the structure may be appropriately set depending on the function or shape of the structure and the use of the laminate of the present invention.

The material of the structure can be selected according to the purpose of the laminate of the embodiment of the present invention, the function or physical properties of the structure, and examples thereof include resin, metal, cells, etc.

The structure itself may or may not have adhesiveness. When the structure has adhesiveness, the laminate of the present invention can directly transfer the pattern portion including the structure to the second layer without passing through an adhesive layer or the like. Here, the structure having adhesiveness includes not only that the structure has viscosity (adhesiveness) at room temperature, but also that the structure exhibits viscosity by applying pressure or heat.

The adhesive force when the structure has adhesiveness is not particularly limited as long as it can fully adhere to the second layer as the transfer body, and can be set, for example, in the range of 0.1 N/25 mm or more and 5 N/25 mm or less, preferably in the range of 0.5 N/25 mm or more and 1 N/25 mm or less. The adhesive force of the structure can be measured in accordance with JIS Z0237-2009. The details of the measurement method are the same as the measurement method of the adhesive force described in the item "A. First Adhesive Layer".

On the other hand, when the structure has no adhesiveness, the laminate of the present invention can transfer the pattern portion including the structure and the second adhesive layer to the second layer by having the second adhesive layer described below on the side of the structure opposite to the first adhesive layer. That is, the structure can be indirectly transferred to the second layer via the second adhesive layer.

In addition to the above-mentioned adhesion, the structure may have required functions or properties depending on the type of structure, the application of the laminate of the present invention, etc. Examples of the properties required of the structure include heat resistance and chemical resistance.

The following is a detailed and methodical description of examples of uses of the multilayer structure of the present invention.

(Application Example 1) Application Example 1 is an example of using the laminate of the present invention as a transfer carrier, for example, it can be used to manufacture a multilayer body with a recessed portion. Specifically, by using one of the components constituting the multilayer body as the second layer, and using the laminate of the present invention to transfer the pattern portion containing the structure to the above-mentioned second layer, and then arranging the components constituting the multilayer body on the above-mentioned structure, the patterned structure can be arranged at a desired position during the manufacture of the multilayer body. In addition, by dividing the multilayer body according to the arrangement position of the structure, and then peeling off and removing the divided area that overlaps with the structure in a top view, a recessed portion can be formed in the multilayer body. Regarding Application Example 1, since it will be described in detail in the section "B. Manufacturing method of multi-layer body with recessed portions" described below, the description is omitted here.

In Application Example 1, the structure can be a member constituting a multilayer body. For example, when used in Application Example 1 for manufacturing a multilayer wiring board with a recess, as the structure, a member suitable for the step of using the multilayer body can be used, specifically, a protective layer, a wiring pattern, a solder ball, etc. Among them, as the structure, a protective layer can be preferably used.

In Application Example 1, the material of the structure can be appropriately selected to exhibit physical properties suitable for the step in which the laminate is used. For example, if the structure is a protective layer, resin can be listed as the material of the structure. Also, if the structure is a wiring pattern, metals generally used for wiring, conductive materials, etc. can be listed as the material of the structure.

In the application example 1, the structure may have required physical properties depending on the application. In this case, the material of the structure may be appropriately selected depending on the physical properties. For example, the structure may have adhesive properties. As the material of the structure having adhesive properties, for example, polyurethane, butyl rubber, polystyrene elastomer and other adhesive rubbers may be listed. One or more of these materials may be used.

Furthermore, in Application Example 1, the structure can have heat resistance. This is because the dimensional change of the structure caused by heat can be suppressed. In particular, when the structure is a protective layer and is used for manufacturing a multi-layer wiring board with a recess in Application Example 1, since a heating step is included and a recess with high dimensional accuracy needs to be formed, high heat resistance is required for the structure. Examples of materials for the heat-resistant structure include polyester resins such as polyimide resin, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT), polyolefin resins, polyamide resins, polyimide resins, polycarbonate resins, acrylic resins, polyvinyl chloride resins, and polyphenylene sulfide (PPS) resins. One or more of these resins may be used. Among them, polyphenylene sulfide (PPS) resin is preferred in terms of having chemical resistance as described below.

Furthermore, in Application Example 1, the structure can also have durability and chemical resistance in addition to heat resistance. The reason is that when used in the manufacture of a multi-layer wiring board with a recessed portion in Application Example 1, for example, when a chemical solution treatment is performed, the structure and the second layer can be prevented from being degraded by the chemical solution. Also, the reason is that when the partition area is removed by peeling, the generation of paste residue can be prevented.

In Application Example 1, the patterned structure is formed by arranging one or more structures in a pattern. When the structure is used for manufacturing a multi-layer wiring board with recesses in Application Example 1, the top view shape of each unit can be made equal to the top view shape of each unit of the recess of the multi-layer body with recesses. In addition, the arrangement pattern of the structure can be made the same as the arrangement pattern of the recesses formed in the multi-layer body.

(Application Example 2) Application Example 2 is an example of using the laminate of the present invention as a laminate for transferring a cell pattern. That is, by using a living tissue, a culture substrate, etc. as the second layer and transferring the pattern portion including the structure to the second layer using the laminate of the present invention, the cell pattern can be transplanted into the living tissue.

In the second application example, a cell sheet can be cited as a structure. A cell sheet is a sheet formed by cultured cells being aggregated and layered. Cells constituting the cell sheet include, for example, suspended cells such as hemocyte cells or lymphocytes, and adhesive cells. Specifically, cells disclosed in Japanese Patent Laid-Open No. 2007-014753 can be cited.

In Application Example 2, the patterned structure is formed by arranging one or more structures in a pattern, and the top view shape of each unit of the structure can be equal to the top view shape of each unit of the cell sheet in the cell pattern transfer laminate. In addition, the arrangement pattern of the structure can be the same as the arrangement pattern of the cell sheet in the cell pattern transfer laminate.

D. Second Adhesion Layer The laminate of the present invention may have a second adhesion layer having a different composition from the first adhesion layer on the side of the structure opposite to the first adhesion layer. The reason is that when the structure does not have adhesion, the structure can be transferred to the second layer through the second adhesion layer by having the second adhesion layer on the surface of the structure opposite to the first adhesion layer. At this time, the pattern portion transferred to the second layer has at least the second adhesion layer and the structure in sequence from the second layer side. FIG5 is a schematic cross-sectional view showing another example of the laminate of the present invention, in which a second adhesion layer 4 is provided on the side of the structure 3 opposite to the first adhesion layer 2 side. In Fig. 5 , the bonding force between the structure 3 and the second bonding layer 4 is assumed to be N ₃ . Other symbols not explained in Fig. 5 are the same as those in Figs. 1 to 3 .

The second bonding layer has bonding and/or adhesive properties. Since the second bonding layer is disposed on the surface of the structure that is opposite to the first bonding layer side, it is usually in a pattern shape having the same shape as the structure.

The second bonding layer has a different composition from the first bonding layer. The so-called different composition from the first bonding layer refers to a composition whose bonding force is not easily reduced when the bonding force adjustment treatment is applied to the first bonding layer. Specifically, it refers to a composition in which the bonding force of the second bonding layer after the bonding force adjustment treatment is higher than that of the first bonding layer after the bonding force adjustment treatment. In particular, the second bonding layer is preferably a composition in which the bonding force is not reduced by various bonding force adjustment treatments.

The composition of the second bonding layer is not particularly limited as long as it can exhibit the required bonding force, and a composition mainly composed of thermoplastic resins, curing resins, and other resins generally used in bonding agents or adhesives can be cited. Examples of the above-mentioned resins include: acrylic resins, epoxy resins, rubbers, silicone resins, polyester resins, and the like. The resins may include one or more. Among them, acrylic resins are preferred in terms of transparency, durability, heat resistance, and cost. The acrylic resin is not particularly limited, and a polymer of a previously known acrylic monomer or methacrylic monomer can be used. Specifically, the polymers of monomers used for the bonding layer disclosed in Japanese Patent Publication No. 2009-226621 can be cited. The second bonding layer may also contain the additives described in the section "A. First bonding layer" as needed.

The second bonding layer preferably has properties suitable for the use of the laminate of the present invention. For example, when the laminate of the present invention is used in the method for manufacturing a multilayer body with recessed portions described below, the second bonding layer preferably has heat resistance or chemical resistance.

The second bonding layer preferably has the required bonding properties to the structure and the second layer to be transferred. The reason is that when the structure is peeled off from the laminate of the present invention after the bonding force adjustment treatment, there is a possibility that the structure and the second bonding layer are peeled off, and there is a possibility that it is difficult to transfer the structure to the second layer through the second bonding layer. The bonding force of the second bonding layer can be set to, for example, a range of 0.1 N/25 mm or more and 5 N/25 mm or less, preferably a range of 0.5 N/25 mm or more and 1 N/25 mm or less. The bonding force of the second bonding layer can be measured in accordance with JIS Z0237-2009. The details of the measurement method are the same as the measurement method of adhesion described in "A. First Adhesion Layer".

The thickness of the second bonding layer is not particularly limited and can be appropriately designed in a manner that enables the structure and the second layer to exhibit the required bonding strength. For example, the thickness can be set in the range of 1 μm to 500 μm, preferably in the range of 5 μm to 50 μm.

E. Arbitrary Structure If the laminate of the present invention has adhesiveness, a peeling layer may be provided on the side of the structure opposite to the first layer. Also, if the laminate of the present invention has a second adhesive layer, a peeling layer may be provided on the second adhesive layer. The peeling layer may have the same pattern as the structure, or may have a shape that covers the entire area of the arrangement surface of the structure of the first layer in a plan view. The peeling layer may be a previously known one.

F. Others The laminate of the present invention can transfer at least one or more pattern parts of the structure to the second layer at one time. The pattern parts are arranged in a pattern shape on the second layer.

1. The second layer The second layer is a member that becomes a transferred body when transferring a pattern portion including a structure from the laminate of the present invention, excluding a peeling layer as an arbitrary structure. The second layer can be appropriately selected depending on the purpose of the laminate of the present invention. For example, when the laminate of the present invention is used to manufacture a multilayer body with a recessed portion as described below, the second layer can be set as one of the members constituting the multilayer body. Specifically, if the multilayer body is a multilayer wiring board, as the second layer, metal layers such as wiring layers, insulating layers, or resin layers such as resin substrates can be listed. Furthermore, when the multilayer of the present invention is used as a multilayer for transferring a cell pattern, the second layer may be a culture substrate, a living tissue, or the like.

The second layer may be made of the same material as the first layer or a different material. However, when one surface of the structure is in contact with the first bonding layer and the other surface is in contact with the second layer, the material of the second layer is preferably selected in such a way that the bonding force between the structure and the second layer is different from the bonding force between the first bonding layer and the structure before and after the bonding force adjustment process.

2. Relationship of inter-layer adhesive forces Regarding the laminate of the present invention, the adhesive force N ₁ between the first adhesive layer and the first layer before the adhesive force adjustment process and the adhesive force N ₁ ' between the first adhesive layer and the first layer after the adhesive force adjustment process may have a relationship of N ₁ > N ₁ ' or a relationship of N ₁ < N ₁ '. Furthermore, the adhesive force N ₂ between the first adhesive layer and the structure before the adhesive force adjustment process and the adhesive force N ₂ ' between the first adhesive layer and the structure after the adhesive force adjustment process may have a relationship of N ₂ > N ₂ ' or a relationship of N ₂ < N ₂ '.

Before the bonding force adjustment process, the magnitude relationship between the bonding force _N1 and the bonding force _N2 is not particularly limited, and for example, the relationship may be _N1 > _N2 .

On the other hand, after the bonding force adjustment process, the bonding force N ₁ ' and the bonding force N ₂ ' may have a relationship of N ₁ '>N ₂ ' or a relationship of N ₁ '<N ₂ ', and may be appropriately set according to the peeling position when the pattern portion including the structure is transferred to the second layer. That is, if N ₁ '>N ₂ ', the interface between the first bonding layer and the structure can be easily peeled when the pattern portion is transferred to the second layer. On the other hand, if N ₁ '<N ₂ ', the interface between the first bonding layer and the first layer can be easily peeled when the pattern portion is transferred to the second layer.

The bonding forces N ₁ and N ₁ ' between the first bonding layer and the first layer before and after the bonding force treatment are preferably of a desired magnitude regardless of the material or type of the first layer. The bonding force N ₁ can be set to, for example, 0.05 N/25 mm or more, and can be set to, for example, 0.1 N/25 mm or more and 0.5 N/25 mm or less. The upper limit of the bonding force N ₁ is not particularly limited, and can be set to, for example, 5 N/25 mm or less, and can be set to, for example _, 0.1 N/25 mm or more and 1 N/25 mm or less.

Furthermore, the bonding forces N ₂ and N ₂ ' between the first bonding layer and the structure before and after the bonding force treatment preferably show a desired magnitude regardless of the material or type of the structure. The bonding force N ₂ can be set, for example, in the range of 0.5 N/25 mm or more and 10 N/25 mm or less, and can particularly be set in the range of 1 N/25 mm or more and 5 N/25 mm or less. Furthermore, the bonding force N ₂ ' can be set, for example, in the range of 0.05 N/25 mm or more and 2 N/25 mm or less, and can particularly be set in the range of 0.05 N/25 mm or more and 0.5 N/25 mm or less.

Each adhesive force is measured by transferring the adhesive layer to the PET substrate, setting the structure of PET/adhesive layer, and measuring each adherend. The measurement method and measurement conditions can be the same as the measurement method and measurement conditions of the adhesive force described in the item "A. 1st adhesive layer 2. Others".

In the laminate of the present invention, when the structure has adhesion, as shown in Fig. 3 (a) to (b), the laminate of this form is in contact with the second layer at the surface of the structure opposite to the first bonding layer. Furthermore, the bonding force between the structure and the second layer is set to N ₄ . When the structure has adhesion, before the bonding force adjustment process, the magnitude relationship of the bonding force N ₁ , the bonding force N ₂ , and the bonding force N ₄ is not particularly limited, and for example, the relationship of N ₁ >N ₂ >N ₄ may be present.

On the other hand, after the bonding force adjustment process, the bonding force N ₁ ', the bonding force N ₂ ', and the bonding force N ₄ preferably have the largest bonding force N ₄ , for example, the bonding force N ₄ > N ₁ '> N ₂ ', or the bonding force N ₄ > N ₂ '> N ₁ '. The reason is that due to the above relationship between the bonding force N ₁ , the bonding force N ₂ , and the bonding force N ₄ , the interface between the first bonding layer and the structure or the interface between the first bonding layer and the first layer is easily and preferentially peeled off, so that the structure can be easily transferred to the second layer, and the structure can be fixed to the second layer with sufficient bonding force.

Furthermore, when the laminate of the present invention has the second bonding layer on the side of the structure opposite to the first bonding layer, the laminate of the present invention is in contact with the second layer on the side of the second bonding layer opposite to the structure. Regarding the laminate of the present invention, when the surface of the second bonding layer opposite to the structure side is brought into contact with the second layer, it can be roughly divided into: the first form, in which the first bonding layer and the structure and the second bonding layer and the second layer have a required bonding force relationship before and after the bonding force adjustment process; and the second form, in which the first layer and the first bonding layer and the second bonding layer have a required bonding force relationship. The following describes each form.

(a) First Form Regarding the laminate of this form, when the surface of the second bonding layer opposite to the structure is brought into contact with the second layer, the bonding force _N2 between the first bonding layer and the structure before the bonding force adjustment treatment is greater than the bonding force _N5 between the second bonding layer and the second layer, and the bonding force _N2 ' between the first bonding layer and the structure after the bonding force adjustment treatment is less than the bonding force _N5 between the second bonding layer and the second layer.

Fig. 6 (a) to (c) are schematic diagrams for explaining another example of the step of transferring the structure to the second layer using the first form of the laminate of the present invention, showing an example of transferring the pattern portion 20 including the structure 3 and the second bonding layer 4 to the second layer 11. In Fig. 6, the bonding force between the second bonding layer 4 and the second layer 11 is set to _N5 . Other symbols not explained in Fig. 6 are the same as those in Figs. 1 to 5.

According to this form, by having a specific bonding force relationship between the first bonding layer and the structure and between the second bonding layer and the second layer before and after the bonding force adjustment process, as shown in FIG6(c), the first bonding layer and the structure are peeled off due to the bonding force adjustment process, so that the pattern part including at least the structure can be transferred to the second layer at one time. The pattern part transferred to the second layer can have the second bonding layer and the structure from the second layer side, and be arranged on the second layer in a pattern. Furthermore, in this form, since the first bonding layer will remain on the first layer side, the first bonding layer can cover the entire area of one surface of the first layer, and can also be in the same pattern as the structure.

In this form, it is preferred that before the bonding force adjustment process, the bonding force _N2 and the bonding force _N5 have a relationship of _N2 ≧ _N5 . Moreover, before the bonding force adjustment process, the magnitude relationship of the bonding force _N1 , the bonding force _N2 , and the bonding force _N3 is not particularly limited, and for example, they may have a relationship of _N1 > _N2 > _N3 . By having the above relationship among the bonding force _N1 , the bonding force _N2 , the bonding force _N3 , and the bonding force _N5 , reattachment and position adjustment can be easily performed. On the other hand, in this embodiment, after the bonding force adjustment process, the bonding force _N2 ' and the bonding force _N5 have a relationship of _N2 '＜ _N5 , and more preferably, the bonding force _N2 ' is the smallest among the bonding force _N1 ', the bonding force _N2 ', the bonding force _N3 , and the bonding force _N5 . In addition, the bonding force relationship between the bonding force _N1 ' and the bonding force _N3 or the bonding force _N5 is not particularly limited, and for example, the relationship may be _N3 ≧ _N1 ' or _N5 ＞ _N1 '. By having the above relationship before and after the bonding force adjustment process, if it is before the bonding force adjustment process, the position can be readjusted, and if it is after the bonding force adjustment process, the first substrate and the first bonding layer can be peeled off at the same time.

The specific values of the adhesion force N ₃ and the adhesion force N ₅ are not particularly limited, and they can have required values depending on the material or type of the structure.

In this embodiment, regardless of the material or type of the second layer and the structure, the difference Δ(N ₅ -N ₂ ') between the adhesion force N ₂ ' and the adhesion force N ₅ is preferably within the range of 0.1 N/25 mm or more and 5.0 N/25 mm or less, and more preferably within the range of 0.5 N/25 mm or more and 2.0 N/25 mm or less. The reason is that when Δ(N ₅ -N ₂ ') is within the above range, the interface between the first adhesion layer and the structure can be easily peeled off during transfer. Δ(N ₅ -N ₂ ') is measured for each adherend by transferring the first adhesion layer and the second adhesion layer to a PET substrate, respectively, and setting the structure of PET/adhesion layer, and calculating the difference. The measuring method and measuring conditions may be the same as the measuring method and measuring conditions of the bonding force described in the item "A. First bonding layer 2. Others".

This form can be applied without being limited to the use of the laminate of the present invention, and is particularly preferably used as a laminate for transferring a cell pattern. The reason is that if the first bonding layer remains on the cell pattern, it will hinder the function of the cells.

(b) Second Form Regarding the above-mentioned laminated body of this form, when the surface of the above-mentioned second bonding layer opposite to the above-mentioned structural body side is brought into contact with the second layer, it is preferred that the bonding force _N1 between the above-mentioned first bonding layer and the above-mentioned first layer before the above-mentioned bonding force adjustment treatment is greater than the bonding force _N5 between the above-mentioned second bonding layer and the above-mentioned second layer, and the bonding force _N1 ' between the above-mentioned first bonding layer and the above-mentioned first layer after the above-mentioned bonding force adjustment treatment is lower than the bonding force _N5 between the above-mentioned second bonding layer and the above-mentioned second layer.

Fig. 7 (a) to (c) are schematic diagrams for explaining another example of the step of transferring the structure to the second layer using the second form of the laminate of the present invention, showing an example of transferring the pattern portion 20 including the first bonding layer 2, the structure 3, and the second bonding layer 4 after the bonding force adjustment process to the second layer 11. In addition, the symbols not explained in Fig. 7 are the same as those in Figs. 1 to 6.

According to this form, by having the above-mentioned bonding force relationship between the above-mentioned first layer and the above-mentioned first bonding layer and between the above-mentioned second bonding layer and the above-mentioned second layer before and after the bonding force adjustment process, the above-mentioned first layer and the above-mentioned first bonding layer are peeled off due to the bonding force adjustment process, so that the pattern part including at least the structure can be transferred to the second layer at one time. The pattern part transferred to the above-mentioned second layer has the second bonding layer, the structure, and the first bonding layer in order from the side of the above-mentioned second layer, and the above-mentioned pattern part is arranged on the above-mentioned second layer in a pattern shape. In this form, since the first bonding layer will remain on the side of the structure, the above-mentioned first bonding layer is preferably in the same pattern shape as the structure.

In this form, it is preferred that before the bonding force adjustment process, the bonding force _N1 and the bonding force _N5 have a relationship of _N1 ≧ _N5 . In addition, before the bonding force adjustment process, the magnitude relationship of the bonding force _N1 , the bonding force _N2 , and the bonding force _N3 is not particularly limited, and can be, for example, _N1 > _N2 > _N3 . On the other hand, in this form, it is preferred that after the bonding force adjustment process, the bonding force _N1 ' and the bonding force _N5 have a relationship of _N1 '< _N5 , and it is more preferred that among the bonding force _N1 ', the bonding force _N2 ', the bonding force _N3 , and the bonding force _N5 , the bonding force _N1 ' is the smallest. The reason is that by having the above-mentioned relationship before and after the bonding force adjustment process, only the first layer can be removed.

The contact force _N3 and contact force _N5 in this form are the same as those in the first form.

In this embodiment, regardless of the material or type of the first layer and the second layer, the difference Δ(N ₅ -N ₁ ') between the bonding force N ₁ ' and the bonding force N ₅ is preferably within the range of 0.1 N/25 mm or more and 5.0 N/25 mm or less, and particularly preferably within the range of 0.5 N/25 mm or more and 2.0 N/25 mm or less. The reason is that when Δ(N ₅ -N ₁ ') is within the above range, the interface between the first bonding layer and the structure can be easily peeled off during transfer. The calculation method of Δ(N ₅ -N ₁ ') can be set to be the same as the calculation method of Δ(N ₅ -N ₂ ').

This form can be applied without being limited to the use of the laminate of the present invention, and is particularly preferably used as a form for manufacturing a multi-layer body with a recessed portion. The reason is that when the laminate of the present invention is used to transfer the structure to the second layer and then other layers are laminated on the structure, the remaining bonding force in the first bonding layer can temporarily fix the other layers.

(c) In other cases where the laminate of the present type has a peeling layer on the second bonding layer, it is preferred that the bonding force N ₁ , bonding force N ₂ , and bonding force N ₃ before the bonding force adjustment process are higher than the bonding force N ₆ between the second bonding layer and the peeling layer.

F. Manufacturing method The manufacturing method of the laminate of the present invention is not particularly limited and can be appropriately selected depending on the application. For example, the following method can be used.

(1) First Example As a first example of the method for manufacturing a laminate of the present invention, the following method can be cited: a first member having a first layer and a first bonding layer and a second member including a structure having a pattern arranged on a peeling layer are bonded together, and the structure is arranged on the first bonding layer.

Specifically, first, a first connecting layer is formed on the first layer to obtain a first component. Furthermore, a structure-forming layer is arranged on the entire surface of the peeling layer to obtain a second component. The structure-forming layer is a structure formed by patterning, and the material of the structure-forming layer is the same as that of the structure. Then, the structure-forming layer is patterned into a desired shape on the peeling layer to form a patterned structure. The laminated body of the present invention in which a patterned structure is arranged on the first connecting layer can be obtained by bonding the surface of the second component opposite to the peeling layer side to the first connecting layer of the first component. When the structure-forming layer does not have adhesiveness, the second component is configured to have a structure in which a second adhesive layer and a structure-forming layer are sequentially arranged on a release layer, and the structure-forming layer and the second adhesive layer are patterned into desired shapes on the release layer, and then bonded to the first adhesive layer of the first component.

The first bonding layer can be formed by coating a bonding agent composition including the composition described in the above-mentioned "A. First bonding layer" on one side of the first layer and removing the solvent. The specific coating method is not particularly limited, and for example, the method disclosed in Japanese Patent Publication No. 2015-108156 can be used. Alternatively, a commercially available adhesive tape including the composition described in the above-mentioned "A. First bonding layer" can be used as the first bonding layer and attached to the first layer. The second bonding layer can also be formed on the release layer by the same method as the first bonding layer.

The method for forming the structure-forming layer is not particularly limited and can be appropriately selected depending on the type of the structure. For example, a method of coating the material of the structure on the peeling layer or the second bonding layer can be listed. The method for patterning the structure-forming layer can be appropriately selected depending on the type of the structure, for example, known methods such as punching and half-cutting can be used. The area other than the area of the structure to be the structure-forming layer is peeled and removed.

The above-mentioned manufacturing method is to pattern the structure-forming layer disposed on the entire surface of the release layer to form the structure, and the structure can also be formed directly on the release layer in a pattern. As a method for forming the structure on the release layer, it can be appropriately selected depending on the type of the structure, for example, a printing method can be listed.

(2) Second Example As a second example of the method for manufacturing the laminate of the present invention, the following method can be cited: forming a first bonding layer on the first layer, and directly forming a structure in a pattern on the first bonding layer. As a method for directly forming a structure on the first bonding layer, it can be appropriately selected depending on the type of the structure, and for example, a printing method can be cited.

(3) Example 3 As a third example of the method for manufacturing a laminated body of the present invention, the following method can be cited: as shown in FIG8 , a laminated body 50 is prepared in which at least a first layer 1, a first connecting layer 2, and a structure-forming layer 3A are sequentially stacked ( FIG8(a) ), and at least the structure-forming layer 3A is patterned to form a patterned structure 3 ( FIG8(b) ). The method for patterning the structure-forming layer can be the same as the method described in the first example of the manufacturing method. Furthermore, when the structure-forming layer is patterned, the first connecting layer can also be patterned at the same time.

(4) Example 4 As a fourth example of the method for manufacturing a laminate of the present invention, the following method can be cited: a laminate having at least a first peeling layer, a first bonding layer, a structure-forming layer, and a second peeling layer laminated in sequence is prepared, at least the first peeling layer, the first bonding layer, and the structure-forming layer are patterned, and then the first peeling layer is peeled off and the first layer is disposed. According to this method, a patterned portion including the structure and the first bonding layer can be formed on the first layer in a patterned manner. As a patterning method, it can be the same as the method described in the first example of the manufacturing method.

G. Applications The multilayer body of the present invention can be used for various applications that require the transfer of a structure in a pattern, depending on the function of the structure. For example, the multilayer body of the present invention can be made into a transfer carrier. Specifically, the multilayer body of the present invention can be made into a protective layer transfer carrier as follows: the first layer is a substrate, the structure is a protective layer, and has: a supporting film having a substrate and a first bonding layer, and a patterned protective layer. By making the multilayer body of the present invention into a protective layer transfer carrier, the patterned protective layer can be transferred to the desired position of the second layer. The protective layer transfer carrier can be preferably used for the formation of recesses in the manufacture of a multilayer body with recesses. In the case where the multilayer body with recessed portions is a multilayer wiring board with recessed portions, by transferring the protective layer and covering the surface of other layers, the other layers can be protected from being damaged by chemical solutions, etc. The manufacturing method of the multilayer body with recessed portions using the laminate of the present invention is described below. In addition, the protective layer transfer carrier can also be used as a masking material for masking the desired position of the second layer using the patterned protective layer.

Furthermore, the laminate of the present invention can be made into a laminate for transferring a cell pattern, for example: the first layer is a substrate, the structure is a cell sheet, and has: a cell support layer having a substrate and a first connecting layer, and a cell sheet in a pattern. By making the laminate of the present invention into a laminate for transferring a cell pattern, the cell pattern can be easily and directly transferred to the second layer of a cell culture substrate or a living tissue, etc., regardless of the shape or size. Furthermore, by selecting the type of the first connecting layer, the transfer can be performed without destroying the cells.

II. Manufacturing method of multilayer body with concave portion The manufacturing method of multilayer body with concave portion of the present invention is a manufacturing method of multilayer body with concave portion using the above-mentioned multilayer body to provide a concave portion with an opening on one side of the multilayer body, and the method comprises the following steps: a contacting step, which is to make the above-mentioned structure of the above-mentioned multilayer body directly contact one side of the above-mentioned second layer or indirectly contact one side of the above-mentioned second bonding layer via the above-mentioned second bonding layer; a bonding force adjusting step, which is to reduce the bonding force of the above-mentioned first bonding layer by the above-mentioned bonding force adjusting treatment; a transfer step, which is to transfer at least the above-mentioned first layer to the above-mentioned second bonding layer; Peeling off and transferring the pattern portion including at least the above-mentioned structure to the above-mentioned second layer in the form of a pattern; a lamination step, which is on the area layer of the second layer having the side of the above-mentioned pattern portion and other layers above the above-mentioned 1 layer; a dividing step, which is to divide the above-mentioned pattern portion and the above-mentioned 1 layer and other layers into a first area including the above-mentioned pattern portion and the above-mentioned other layers in an overlapping position with the above-mentioned pattern portion when viewed from above, and a second area other than the first area; and a recess forming step, which is to peel off and remove the above-mentioned first area to form the above-mentioned recess.

FIG. 9 is a step diagram showing an example of a method for manufacturing a multilayer body with recessed portions of the present invention. In addition, since the contact step, the adhesion force adjustment step and the transfer step have been described in FIG. 3 , FIG. 6 and FIG. 7 , the drawings and descriptions thereof are omitted here. FIG. 3 shows a case where the structure of the laminated body is directly in contact with one surface of the second layer in the contact step, and FIG. 6 and FIG. 7 show a case where the structure of the laminated body is indirectly in contact with one surface of the second layer via the second adhesion layer in the contact step. As shown in Figures 3, 6 and 7, after implementing the contact step (Figure 3(a), Figure 6(a), Figure 7(a)), followed by the force adjustment step (Figure 3(b), Figure 6(b), Figure 7(b)), and the transfer step (Figure 3(c), Figure 6(c), Figure 7(c)), more than one other layer 12 (12A~12C) is formed on the area of the second layer 11 having the side of the pattern portion 20 (Figure 9(a), lamination step). Next, in the second layer 11, the pattern portion 20 and the other layers 12A to 12C are divided into a first region 51 including the pattern portion 20 and the other layers 12A to 12C overlapping the pattern portion 20 in a plan view, and a second region 52 other than the first region 51 (Fig. 9(b), dividing step). Thereafter, the first region 51 is peeled off to form a concave portion P (Fig. 9(c), concave portion forming step). Thus, a multilayer body 30 with concave portions is obtained.

For example, in the case of a multi-layer wiring board for mounting components including a flexible printed wiring board (FPC), a structure is being promoted in which a recess having an opening is provided on one surface of the multi-layer wiring board and components such as a chip are placed in the recess (see Patent Document 2). According to the above structure, electronic components previously placed on the surface of the multi-layer wiring board can be placed in the recess, thereby achieving a thinner or smaller multi-layer wiring board for mounting components as a whole.

Here, as a method for forming a recess in a multi-layer body such as a multi-layer wiring board, generally, a cutting process using a milling cutter or laser processing is used. However, since these methods require processing each location where the recess is to be provided, there are problems such as difficulty in providing the recess, displacement of the recess formation position during processing, and damage to other layers due to the displacement of the recess formation position.

In order to solve this problem, the inventors have found the following method as a method for forming a recess in a multilayer wiring board: when manufacturing a multilayer body, a structure is arranged in the multilayer body as the starting point of the peeling, and the region of the multilayer body overlapping with the structure in a plan view is divided by half cutting or the like and peeled off, thereby easily forming a recess at a desired position of the multilayer body. It is estimated that according to this method, a recess can be easily formed at the position of the divided region, and positional deviation during processing or damage to other layers can be suppressed.

However, the above method has the following problems: the above structure must be arranged separately in the multi-layer body according to the position where the recess is to be set, which not only complicates the arrangement operation, but also reduces the accuracy of the arrangement position. In addition, since the above structure is arranged in the multi-layer body and becomes the starting point for peeling, it is required to be thin, flexible, and small in size. In particular, when the multi-layer body is a multi-layer wiring board, the above requirements for the structure will be increased. However, if such a structure is arranged separately in a pattern according to the formation position of the recess, the operability is poor, and there is a problem that the arrangement operation is further complicated.

As another method for arranging the structure in the multi-layer body, the following method can be assumed: the structure is directly formed by patterning on the layer to be adhered (the second layer of the method for manufacturing the multi-layer body with recessed portions of the present invention). However, there are the following problems: the number of steps increases, and the patterning method may have adverse effects on other layers.

Therefore, the inventors of the present invention have found that by using the laminate described in the item "I. Laminated body", it is possible to arrange the structure in the above-mentioned multi-layer body in a pattern by a simpler method. That is, if the above-mentioned adhesion adjustment treatment is performed while the second layer is in contact with the above-mentioned laminate, the adhesion of the first adhesion layer of the above-mentioned laminate is reduced, and the pattern part including the structure can be easily peeled off. Therefore, the above-mentioned pattern part can be transferred to the desired position of the above-mentioned second layer in a pattern at one time without being limited to the shape, thickness, size, etc. of the above-mentioned structure, and the transfer accuracy can be improved. Furthermore, by laminating other layers on the surface of the second layer on which the pattern portion is transferred, the pattern portion is arranged in a pattern shape inside the multilayer body, and by dividing the first area having the pattern portion on the second layer, the first area can be peeled off and removed at one time starting from the pattern portion. In this way, a concave portion with an opening can be formed at one time in a pattern shape on one side of the multilayer body. At this time, the first area can be divided in combination with the position of the pattern portion, so that the position accuracy of the formation of the concave portion can be improved. The following is a description of each step of the manufacturing method of the multilayer body with a concave portion of the invention.

1. Contacting step The contacting step of the present invention is a step of making the structure of the laminate directly contact one surface of the second layer or indirectly contact one surface of the second layer via the second bonding layer.

(1) Laminated body The laminate used in this step has been described in detail in the above section "I. Laminated body", so its description is omitted here.

(2) Second layer The second layer used in this step can be appropriately selected based on the target multi-layer body with recessed portion, and can be, for example, the components exemplified in the above-mentioned "I. Laminated body". The second layer may have other layers on the side opposite to the laminated body. The other layers will be described below.

(3) Contact method In this step, the patterned structure of the laminate is brought into direct contact with one surface of the second layer or is brought into indirect contact with one surface of the second layer via the second bonding layer. When the structure of the laminate has bonding properties, the structure of the laminate can be brought into direct contact with one surface of the second layer. Furthermore, when the laminate has a second bonding layer on the side of the structure opposite to the first bonding layer, the structure can be brought into indirect contact with one surface of the second layer via the second bonding layer. There is no particular limitation on the method for bringing the structure of the laminate into contact with one surface of the second layer, and a common method can be used. For example, there are various methods such as a single-wafer method and a roll-to-roll method.

2. Adhesion force adjustment step The adhesion force adjustment step of the present invention is a step of reducing the adhesion force of the first adhesion layer by the adhesion force adjustment process.

The above-mentioned adhesion adjustment process is performed to reduce the adhesion force of the above-mentioned first adhesion layer of the above-mentioned laminate. The above-mentioned adhesion adjustment process can be selected according to the aspect of the first adhesion layer described in the above-mentioned "I. Laminated body". The following describes the aspects of the first adhesion layer one by one with respect to the adhesion adjustment process.

(1) Case of the first bonding layer of the first aspect When the first bonding layer is the first aspect, i.e., a temperature-sensitive bonding layer, this step is to perform a heating treatment or a cooling treatment as a bonding force adjustment treatment.

If the first bonding layer of the present embodiment is a heat-peelable temperature-sensitive bonding layer, the bonding force of the first bonding layer can be reduced by performing a heat treatment on the first bonding layer as a bonding force adjustment treatment. The heating temperature at this time can be set to a temperature higher than the switching temperature of the heat-peelable temperature-sensitive bonding layer. Examples of heating methods for the heat-peelable temperature-sensitive bonding layer include a method of heating in an oven, a method of heating on a heating plate, and a method of heating using a spot heater. The heating time can be appropriately set in such a manner that the bonding force of the first bonding layer of the present embodiment after the heat treatment becomes within the range described in the above-mentioned item "I. Laminated body". The conditions of the heat treatment are not particularly limited, and can be, for example, 60° C. and 10 minutes.

On the other hand, if the first adhesive layer of this embodiment is a cooling peelable thermosensitive adhesive layer, the bonding strength of the first adhesive layer can be reduced by cooling the first adhesive layer as the bonding strength adjustment treatment. The cooling temperature at this time can be set to a temperature below the switch temperature of the cooling peelable thermosensitive adhesive layer. As a cooling method for the cooling peelable thermosensitive adhesive layer, for example, a method of cooling in a refrigerator and a method of cooling on a cooling plate can be listed. The cooling time can be appropriately set so that the adhesion of the first adhesive layer of the present embodiment after the cooling treatment is within the range described in the above-mentioned "I. Laminated body". The conditions of the above-mentioned cooling treatment are not particularly limited, and can be set to 5°C and 20 minutes, for example.

(2) Case of the first bonding layer of the second aspect When the first bonding layer is the second aspect, i.e., the energy beam responsive bonding layer, in this step, an energy beam irradiation treatment is performed as the bonding force adjustment treatment. In this step, the bonding force of the first bonding layer can be reduced by irradiating the first bonding layer with energy beams as the energy beam irradiation treatment.

The energy beam has been described in the above-mentioned "I. Laminated body" and therefore will not be described here. The light source of the energy beam is not particularly limited as long as it can emit light in the required wavelength range. When ultraviolet rays are used as the energy beam, examples include high-pressure mercury lamps, ultra-high-pressure mercury lamps, carbon arc lamps, metal halide lamps, xenon lamps, chemical lamps, etc. that emit light in the wavelength range of 150 nm to 450 nm. In addition, the accumulated light amount of the energy beam can be appropriately set in such a way that the first connecting layer of the present sample after irradiation with the energy beam becomes within the range described in the above-mentioned "I. Laminated body".

The energy beam may be irradiated from the first layer side of the laminate after the contacting step, or from the second layer side. It is particularly preferred to irradiate from the first layer side of the laminate because the first layer can be irradiated with energy beams regardless of whether the second layer is light-transmissive or not.

(3) Case of the first bonding layer of the third aspect When the first bonding layer is the third aspect, i.e., the electrically responsive bonding layer, in this step, an electric field application treatment or a no-electric field treatment is performed as a bonding force adjustment treatment.

If the first bonding layer of this embodiment is an electrically exfoliative bonding layer, the bonding force of the first bonding layer can be reduced by applying an electric field to the first bonding layer as a bonding force adjustment treatment. There is no particular limitation on the method of applying an electric field to the first bonding layer, and the method described in the above-mentioned "I. Laminated body" can be used. As a condition for the bonding force adjustment treatment, for example, in the case of exfoliation by electric field application treatment, the applied electric field can be set to be in the range of 5 V to 50 V and in the range of 10 seconds to 120 seconds. The magnitude of the applied voltage that defines the magnitude of the electric field and the application time can be appropriately set in such a way that the bonding force of the first bonding layer after the electric field application becomes the desired value. The upper limit of the applied voltage or the upper limit of the application time is not particularly specified from the perspective of peeling, but is preferably set in consideration of the electric field application device or the influence on other layers.

On the other hand, if the first bonding layer of this aspect is an electrically bonding bonding layer, the bonding force of the first bonding layer can be reduced by performing a no-electric-field treatment of stopping application of an electric field to the first bonding layer as a bonding force adjustment treatment.

3. Transfer step The transfer step of the present invention is a step of peeling off at least the first layer and transferring at least the pattern portion including the structure onto the second layer in a patterned form.

In this step, the bonding force of the first bonding layer is reduced by the bonding force adjustment step, so that the first layer is peeled off at the desired layer interface included in the structure in the laminate. In this way, the pattern part including at least the structure can be transferred to the second layer in a patterned manner.

The method for peeling at least the first layer from the laminate is not particularly limited as long as it is a method capable of peeling at a desired interface of the laminate, and the peeling may be performed manually or mechanically. Specific peeling methods include a method of peeling by adsorption, a method of attaching an adhesive film and peeling by the adhesive force of the adhesive film, and the like.

In this step, the peeling interface to be processed by the adhesive force adjustment can be determined according to the form of the laminate, and the pattern portion having a layer structure suitable for the peeling position can be transferred to the second layer in a patterned manner. That is, if the laminate is the first form described in the above-mentioned "I. Laminated body F. Other 2. Relationship between interlayer adhesive forces", peeling will occur at the interface between the first adhesive layer and the structure, so that the first layer and the first adhesive layer can be peeled. At this time, the pattern portion transferred to the second layer has the second adhesive layer and the structure in order from the second layer side. On the other hand, if the laminate is the second form described in the above-mentioned "I. Laminated body F. Other 2. Relationship between interlayer adhesion", peeling will occur at the interface between the first layer and the first bonding layer, thereby being able to peel the first layer. At this time, the pattern portion transferred to the second layer has the second bonding layer, the structure, and the first bonding layer in order from the second layer side.

4. Lamination Step The lamination step of the present invention is a step of forming at least one other layer on the area layer of the second layer having the side of the pattern portion.

By means of a transfer step, a pattern portion including at least a structure is arranged in a pattern on one surface of the second layer, and other layers are stacked on the surface of the second layer on the side having the pattern portion. As the above-mentioned other layers, it is possible to appropriately select the type of multi-layer body with recessed portion to be manufactured. For example, in the case of manufacturing a multi-layer wiring board with recessed portion using the manufacturing method of the multi-layer body with recessed portion of the present invention, as the above-mentioned other layers, layers constituting the multi-layer wiring board are generally used. Specifically, wiring substrates such as insulating layers, flexible wiring substrates, and rigid wiring substrates can be listed.

On the surface of the second layer having the pattern portion, the other layers may be stacked more than one layer, and the number of stacked layers may be appropriately adjusted according to the target multi-layer body with recessed portions. The stacking method of the other layers is not particularly limited, and for example, a coating method, a lamination method, or the like may be used for stacking. The other layers may be formed in a manner covering the surface of the second layer and the surface of the pattern portion opposite to the side of the second layer. In the case of manufacturing a multi-layer wiring board with recessed portions, as the stacking method of the other layers, a method capable of achieving conduction may be used, for example, the same stacking method as when a wiring substrate is generally multi-layered, such as stacking through conductive bumps. Furthermore, during lamination, lamination may be performed via a cover layer, a prepreg, an interlayer, an insulating layer, etc. Furthermore, the second layer may be laminated with one or more other layers on the surface opposite to the surface having the pattern portion.

5. Division step The division step of the present invention is a step of dividing the pattern portion and the one or more other layers into a first region including the pattern portion and the other layers overlapping the pattern portion in a plan view, and a second region other than the first region. The pattern portion and the one or more other layers disposed on the side of the second layer having the pattern portion are divided into the first region and the second region in a plan view, and each region on the second layer is separated and exists independently.

(1) Division method As a method for dividing the pattern portion on the second layer and the other layers above the first layer, any method can be used as long as it can divide the first area on the second layer. It can be a mechanical method or a chemical method.

As the mechanical method, for example, the pattern portion on the second layer and the other layers above the first layer are cut in the stacking direction (thickness direction) along the outer periphery of the pattern portion in a top view to divide the first area into half cuts. Specifically, the half cuts can be performed by moving an upper mold equipped with a cutting knife up and down, by using a syringe-type rotary cutter, or by performing heat treatment by laser processing.

As the chemical method, for example, half etching can be cited, in which the pattern portion on the second layer and the one or more layers are etched in the stacking direction (thickness direction) along the outer periphery of the pattern portion in a top view to divide the first region. Specifically, an anti-etching pattern corresponding to the outer periphery of the pattern portion can be formed on the surface of a stacked body including the pattern portion on the side of the second layer having the pattern portion and the one or more layers, and half etching can be performed by wet etching or dry etching. After etching, the anti-etching pattern is removed.

As a division method, a mechanical method is particularly preferred because the first area and the second area can be divided with higher position accuracy.

The pattern portion on the second layer and the one or more layers are cut in the thickness (laminate) direction and divided into the first region and the second region. The cutting line that divides the laminate into the first region and the second region is called a dividing line.

In the above-mentioned dividing step, the dividing line that divides the first area and the second area can be formed on the outer periphery of the above-mentioned pattern portion when viewed from above as shown in Figure 10(a), can also be formed on the outer side of the outer periphery of the above-mentioned pattern portion when viewed from above as shown in Figure 10(b), and can also be formed on the inner side of the outer periphery of the above-mentioned pattern portion when viewed from above as shown in Figure 10(c). In addition, the width of the dividing line is not particularly limited. For example, it can be formed with a width that includes the inner and outer sides of the outer periphery of the above-mentioned pattern portion when viewed from above as shown in Figure 10(d). Figures 10(a) to (d) are explanatory diagrams for explaining the position of the dividing line, the left figure is a schematic top view, and the right figure is an X-X line cross-sectional view of the left figure. In addition, in Figure 10, line L represents the dividing line.

The dividing line may be continuous or discontinuous in a plan view, depending on the dividing method. Also, the dividing line may be straight or non-straight in a plan view.

The dividing line is preferably formed on the side of the second layer having the pattern portion, passing through the pattern portion and the other layers overlapping the pattern portion in a top view. The reason is that in the recessed portion forming step described below, the first area can be easily peeled off and removed, and a part of the first area is not likely to remain on the surface of the second layer. Furthermore, the dividing line can be formed on a part of the second layer.

The first region includes the pattern portion and the other layers overlapping the pattern portion in a plan view on the side of the second layer having the pattern portion. The plan view shape of the first region can be the same as the plan view shape of the pattern portion. In addition, the plan view size of the first region can be larger than the plan view size of the pattern portion, smaller than the plan view size of the pattern portion, or the same as the plan view size of the pattern portion, depending on the position of the dividing line.

6. Recess Forming Step The recess forming step of the present invention is a step of removing the first region to form the recess.

The first region can be peeled off starting from the structure. Specifically, the peeling occurs at the contact interface between the structure and the second layer. The method for peeling off the first region is not particularly limited, and examples thereof include a method for peeling off by adsorption, a method for peeling off by attaching an adhesive film and using the adhesive force of the adhesive film, and the like.

If the first region is peeled off, a concave portion with an opening can be formed on one surface of the multilayer body. The concave portion is formed on one surface of the multilayer body in a pattern shape when viewed from above. The size of the concave portion when viewed from above is equivalent to the size of the first region when viewed from above.

7. Others The method for manufacturing a multilayer body with recessed portions of the present invention may include any steps in addition to the above steps. For example, when a multilayer wiring board with recessed portions is manufactured using the method for manufacturing a multilayer body with recessed portions of the present invention, the method may include a surface treatment step, an etching step, a plating step, and the like.

The method for manufacturing a multilayer body with recessed portions of the present invention can also further perform a transfer step of the laminated body described in the item "I. Laminated body" in the lamination step. The reason is that any structure can be transferred and arranged between the laminated layers of the above-mentioned other layers. In addition, the method for manufacturing a multilayer body with recessed portions of the present invention can perform a contact step, a bonding force adjustment step, a transfer step, a lamination step, a dividing step, and a recessed portion forming step on both sides of the second layer. The reason is that a multilayer body having recessed portions on both sides of the second layer can be manufactured.

8. Multilayer body with recesses The multilayer body with recesses obtained by the method for manufacturing the multilayer body with recesses of the present invention can be used as a multilayer wiring board with recesses, for example, depending on the types of the second layer and other layers. According to the method for manufacturing the multilayer body with recesses of the present invention, recesses can be easily formed with high positional accuracy during the manufacturing process of the multilayer wiring board, thereby obtaining a component-mounted multilayer wiring board in which components are mounted in the recesses.

III. Others The present invention includes the following technical matters. (1) A laminate having at least a first layer, a first bonding layer, and a patterned structure in sequence, wherein the first bonding layer undergoes a bonding force adjustment treatment to change the bonding force. (2) A laminate as described in (1), wherein the first bonding layer is a temperature-sensitive bonding layer that undergoes a heating treatment or a cooling treatment as the bonding force adjustment treatment to reduce the bonding force. (3) A laminate as described in (1), wherein the first bonding layer is an energy-beam-responsive bonding layer that undergoes an energy-beam-irradiation treatment as the bonding force adjustment treatment to reduce the bonding force. (4) A laminate as described in (1), wherein the first bonding layer is an electrically responsive bonding layer that receives an electric field application treatment or a no-electric field treatment as the bonding force adjustment treatment to reduce the bonding force. (5) A laminate as described in any one of (1) to (4), wherein the structure has bonding properties. (6) A laminate as described in (1) to (4), wherein the second bonding layer has a composition different from that of the first bonding layer on the side of the structure opposite to the first bonding layer. (7) A laminate as described in any one of (1) to (6), wherein the first bonding layer has the same pattern as that of the structure. (8) A laminate as described in (6) or (7), wherein when the surface of the second bonding layer opposite to the structure is brought into contact with the second layer, the bonding force between the first bonding layer and the structure before the bonding force adjustment treatment is greater than the bonding force between the second bonding layer and the second layer, and the bonding force between the first bonding layer and the structure after the bonding force adjustment treatment is less than the bonding force between the second bonding layer and the second layer. (9) A laminate as described in (7), wherein when the surface of the second bonding layer opposite to the structural body side is brought into contact with the second layer, the bonding force between the first bonding layer and the first layer before the bonding force adjustment treatment is greater than the bonding force between the second bonding layer and the second layer, and the bonding force between the first bonding layer and the first layer after the bonding force adjustment treatment is less than the bonding force between the second bonding layer and the second layer.

(10) A method for manufacturing a multilayer body with recessed portions, which is a method for manufacturing a multilayer body with recessed portions, using a laminate as described in any one of (6), (8) and (9) and having a recessed portion with an opening on one side of the multilayer body, and the method includes the following steps: a contacting step, in which the structure of the laminate is directly in contact with one side of the second layer or indirectly in contact with one side of the second layer via the second bonding layer; a bonding force adjusting step, in which the bonding force of the first bonding layer is reduced by the bonding force adjusting treatment; and a transfer step. (11) A method for manufacturing a multilayer body with a recess as described in (10), wherein the multilayer body with a recess is a multilayer wiring board with a recess. (12) A method for transferring a structure, which is a method for transferring the structure to a second layer using a layered structure as described in (6) or (7), and when the surface of the second bonding layer opposite to the structure is brought into contact with the second layer, the bonding force between the first bonding layer and the structure before the bonding force adjustment treatment is greater than the bonding force between the second bonding layer and the second layer, and the bonding force between the first bonding layer and the structure after the bonding force adjustment treatment is less than the bonding force between the second bonding layer and the second layer. (13) A method for transferring a structure, which is a method for transferring a structure to a second layer using a layered structure as described in (6), wherein the first bonding layer is in the same pattern as the structure, and when the surface of the second bonding layer opposite to the structure is brought into contact with the second layer, the bonding force between the first bonding layer and the first layer before the bonding force adjustment treatment is greater than the bonding force between the second bonding layer and the second layer, and the bonding force between the first bonding layer and the first layer after the bonding force adjustment treatment is less than the bonding force between the second bonding layer and the second layer. [Example]

Hereinafter, the present invention will be described in further detail with reference to embodiments and comparative examples.

[Example 1] 1. Preparation of a laminate A laminate was prepared by the following method.

(1) Preparation of adhesive composition with variable adhesive strength To 100 parts by weight of an acrylic adhesive (E-306 manufactured by E-TEC Co., Ltd.) containing an acrylic polymer (average molecular weight 650,000) and an energy ray polymerizable compound (average molecular weight 650,000), 60 parts by weight of urethane acrylate (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., trade name: UV-7600B) as an energy ray polymerizable compound and 60 parts by weight of 9-oxysulfide as an energy ray polymerizable compound were added. 2,4-Diethyl 9-sulfoxide 0.2 parts by weight of KAYACURE DETX-S (manufactured by Nippon Kayaku Co., Ltd.) and 1.6 parts by weight of an isocyanate crosslinking agent (crosslinking agent, manufactured by Nippon Polyurethane Industry Co., Ltd., trade name: Coronate L; solid content: 75%) were added, and diluted to 25% with a mixed solvent of toluene and methyl ethyl ketone to prepare an adhesive composition with variable adhesiveness.

(2) Preparation of Adhesive Sheet A A PET film (TOYOBO product name: E5100; thickness 50 μm) was used as the first layer, and the adhesive composition with variable adhesion was applied to the first layer using an applicator so that the coating thickness after heat drying was 10 μm, and dried to form the first adhesive layer. Then, a silicone release surface layer of a light-peel PET separator (TOYOBO product name: E7006; thickness 38 μm) having a silicone release surface was pressed onto the exposed surface of the first adhesive layer, and then cured at 40°C for 3 days to obtain an adhesive sheet A.

(3) Preparation of structural body sheet A A heat-resistant masking tape (3M product name: 7414) having a polyimide film, an acrylic adhesive layer, and a release layer in this order was used. The polyimide film and the acrylic adhesive layer were cut in half in the thickness direction and divided into a pattern. Thereafter, the unnecessary portion was removed. Thus, a structural body sheet A having a structure having a polyimide film and an acrylic adhesive layer in a pattern was arranged on the release layer.

(4) Preparation of laminated body A The peelable PET separator of the bonding sheet A is peeled off, and the exposed surface of the first bonding layer is bonded to the polyimide film of the structural sheet A, thereby obtaining a laminated body A having, in sequence, a PET film, a first bonding layer, a patterned structural body (having, in sequence from the first bonding layer side, a polyimide film and an acrylic adhesive layer), and a peeling layer of the structural sheet A.

2. Transfer of structure Using rolled copper foil (trade name: RCF-T5B-35 manufactured by Futian Metal Manufacturing Co., Ltd.) as the second layer, the light-peelable PET separator of the laminate A was peeled off, and the exposed acrylic adhesive layer was brought into contact with the second layer, and UV (ultraviolet) irradiation was performed at 500 mJ/cm ² (i-ray) from the first layer side of the laminate A. By UV irradiation, the first adhesive layer and the adhesive sheet A of the first layer can be peeled off from the interface between the first adhesive layer and the polyimide film, so that the structure having the pattern of the polyimide film and the acrylic adhesive layer can be transferred to the second layer.

[Example 2] 1. Preparation of a laminate A laminate was prepared by the following method.

(1) Preparation of Adhesive Composition for Second Adhesive Layer An adhesive composition for second adhesive layer was prepared by mixing 100 parts by weight of an acrylic copolymer (SK Dyne 1811L, manufactured by Soken Chemical Industry Co., Ltd.) with 3 parts by weight of an isocyanate curing agent (L-45, manufactured by Soken Chemical Industry Co., Ltd.; solid content: 45 wt%).

(2) Preparation of Adhesive Sheet B The adhesive composition for the second adhesive layer was applied to the silicone release-treated surface of a heavy-peel PET separator (TOYOBO product name: E7304; thickness 38 μm) using an applicator in such a manner that the thickness after drying would be 10 μm, and then dried to form a second adhesive layer. Next, a silicone release treated surface of a lightly peelable PET separator (TOYOBO product name: E7006; thickness 38 μm) was pressed onto the exposed surface of the second adhesive layer, and then cured at 40°C for 3 days to obtain an adhesive sheet B having a second adhesive layer.

(3) Preparation of structural body sheet B The light-peelable PET separator of the bonding sheet B was peeled off and laminated with a polyimide film (Toray Dupont, trade name: Kapton 200h). The polyimide film and the second bonding layer were cut in half in a pattern in the thickness direction, and then the unnecessary portion was removed. Thus, a structural body sheet B having a structure having a polyimide film and a second bonding layer in a pattern was arranged on the heavy-peelable PET separator.

(4) Preparation of laminate B The peelable PET separator of the bonding sheet A prepared in Example 1 was peeled off, and the exposed first bonding layer was bonded to the polyimide film of the structural sheet B to prepare the laminate B.

2. Transfer of structure The same rolled copper foil as in Example 1 was used as the second layer, the releasable PET separator of the laminate B was peeled off, and the exposed second adhesive layer was brought into contact with the second layer, and UV irradiation was performed at 500 mJ/ ^cm2 (i-ray) from the first layer side of the laminate B. By UV irradiation, the adhesive sheet A having the first adhesive layer and the first layer can be peeled off from the interface between the first adhesive layer and the polyimide film, so that the structure having the pattern of the polyimide film and the second adhesive layer can be transferred to the second layer.

[Example 3] 1. Preparation of a laminate A laminate was prepared by the following method.

(1) Preparation of Adhesive Sheet C A heavy-peel PET separator having a silicone release treatment surface (TOYOBO product name: 7304; thickness 50 μm) was used, and the adhesive composition with variable adhesion prepared in Example 1 was applied to the silicone release treatment surface of the first layer using an applicator in such a manner that the coating thickness after heat drying became 10 μm, and then dried to form a first adhesive layer. Next, a silicone release-treated surface of a light-peel PET separator (TOYOBO product name: E7006; thickness 38 μm) was pressed onto the exposed surface of the first adhesive layer, and then cured at 40°C for 3 days to obtain an adhesive sheet C.

(2) Preparation of laminate C The light-peelable PET separator of bonding sheet C was peeled off, and the exposed first bonding layer was bonded to one side of a polyimide film (Toray・Dupont, trade name: Kapton 200h). The heavy-peelable PET separator of bonding sheet B prepared in Example 2 was peeled off, and the exposed second bonding layer was bonded to the other side of the polyimide film. Then, bonding sheet B, the polyimide film, and the first bonding layer were cut in half in a pattern in the thickness direction, and then the unnecessary parts were removed. Thus, a structural sheet C is obtained in which a patterned structure having a light-peelable PET separator of a bonding sheet B, a second bonding layer, a polyimide film, and a first bonding layer is arranged on a heavy-peelable PET separator of a bonding sheet A. Then, the light-peelable PET separator on the first bonding layer side is peeled off, and an OPP (Oriented PolyPropylene) substrate is arranged as the first layer on the exposed first bonding layer, thereby obtaining a laminate C.

2. Transfer of structure The same rolled copper foil as in Example 1 was used as the second layer, and the light-peelable PET separator of the laminate C was peeled off so that the exposed second adhesive layer was in contact with the second layer, and UV irradiation was performed at 500 mJ/cm ² (i-ray) from the first layer side of the laminate C. By UV irradiation, the first layer was able to be peeled off from the interface between the first layer and the first adhesive layer, thereby successfully transferring the structure having the pattern of the first adhesive layer, the polyimide film, and the second adhesive layer to the second layer.

1‧‧‧1st layer 2‧‧‧1st bonding layer 3‧‧‧structure 3A‧‧‧structure forming layer 4‧‧‧2nd bonding layer 10‧‧‧laminated body 11‧‧‧2nd layer 12‧‧‧other layers 12A‧‧‧other layers 12B‧‧‧other layers 12C‧‧‧other layers 20‧‧‧pattern portion 30‧‧‧multilayer body with concave portion 50‧‧‧laminated body 51‧‧‧1st region 52‧‧‧2nd region L‧‧‧line N ₁ ‧‧‧bonding force N ₁ '‧‧‧bonding force N ₂ ‧‧‧bonding force N ₂ '‧‧‧bonding force N ₃ ‧‧‧bonding force N ₄ ‧‧‧bonding force N ₅ ‧‧‧Adjustment force P‧‧‧Concave portion T‧‧‧Adjustment force processing XX‧‧‧Line

Fig. 1 is a schematic top view showing an example of a laminate of the present invention. Fig. 2 is a cross-sectional view taken along line X-X of Fig. 1. Fig. 3(a) to (c) are step diagrams for explaining an example of a method for transferring a structure using the laminate of the present invention. Fig. 4 is a schematic cross-sectional view showing another example of a laminate of the present invention. Fig. 5 is a schematic cross-sectional view showing another example of a laminate of the present invention. Fig. 6(a) to (c) are step diagrams for explaining another example of a method for transferring a structure using the laminate of the present invention. Fig. 7(a) to (c) are step diagrams for explaining another example of a method for transferring a structure using the laminate of the present invention. Fig. 8 (a) and (b) are step diagrams showing an example of a method for manufacturing a multilayer body of the present invention. Fig. 9 (a) to (c) are step diagrams showing an example of a method for manufacturing a multilayer body with a recessed portion of the present invention. Fig. 10 (a) to (d) are explanatory diagrams for explaining the positions of dividing lines of dividing steps.

1‧‧‧Level 1

2‧‧‧1st layer

3‧‧‧Structure

10‧‧‧Layered body

X-X‧‧‧Line

Claims (11)

A laminated body, which has at least a first layer, a first bonding layer, and a patterned structure in sequence, and a second bonding layer having a composition different from that of the first bonding layer on the side of the structure opposite to the first bonding layer, the first bonding layer undergoes bonding force adjustment treatment to change the bonding force, the structure contains resin, and the structure is non-adhesive. The laminate of claim 1, wherein the first bonding layer is a temperature-sensitive bonding layer that is subjected to heating or cooling treatment as the bonding force adjustment treatment to reduce the bonding force. The laminate of claim 1, wherein the first bonding layer is an energy ray responsive bonding layer that receives energy ray irradiation treatment as the bonding force adjustment treatment to reduce the bonding force. The laminate of claim 1, wherein the first bonding layer is an electrically responsive bonding layer that receives an electric field application treatment or a no-electric field treatment as the bonding force adjustment treatment to reduce the bonding force. A layered body as claimed in any one of claims 1 to 4, wherein the first connecting layer is in the same pattern as the above-mentioned structure. The laminated body of claim 1, wherein when the surface of the second bonding layer opposite to the structure is brought into contact with the second layer, the bonding force between the first bonding layer and the structure before the bonding force adjustment treatment is greater than the bonding force between the second bonding layer and the second layer, and the bonding force between the first bonding layer and the structure after the bonding force adjustment treatment is less than the bonding force between the second bonding layer and the second layer. The laminated body of claim 5, wherein when the surface of the second bonding layer opposite to the structure side is brought into contact with the second layer, the bonding force between the first bonding layer and the first layer before the bonding force adjustment treatment is greater than the bonding force between the second bonding layer and the second layer, and the bonding force between the first bonding layer and the first layer after the bonding force adjustment treatment is less than the bonding force between the second bonding layer and the second layer. A method for manufacturing a multilayer body with concave portions, which uses a multilayer body as claimed in claim 1 and has a concave portion with an opening on one side of the multilayer body, and the method comprises the following steps: a contacting step, which is to make the structure of the multilayer body directly contact one side of the second layer or indirectly contact one side of the second layer via the second bonding layer; a bonding force adjusting step, which is to reduce the bonding force of the first bonding layer by the bonding force adjusting treatment; a transfer step, which is to transfer at least the first bonding layer to the bonding layer; The invention further comprises a step of peeling off the layers and transferring the pattern part including at least the structure to the second layer in the form of a pattern; a step of laminating the layer on the side of the second layer having the pattern part and the other layers above the first layer; a step of dividing the pattern part and the other layers above the first layer into a first region including the pattern part and the other layers overlapping the pattern part in a top view, and a second region other than the first region; and a step of forming a concave portion, which comprises peeling off and removing the first region to form the concave portion. A method for manufacturing a multi-layer body with a recess as claimed in claim 8, wherein the multi-layer body with a recess is a multi-layer wiring board with a recess. A method for transferring a structure, which is a method for transferring the structure to a second layer using a laminate as claimed in claim 1, and when the surface of the second bonding layer opposite to the structure is brought into contact with the second layer, the bonding force between the first bonding layer and the structure before the bonding force adjustment treatment is greater than the bonding force between the second bonding layer and the second layer, and the bonding force between the first bonding layer and the structure after the bonding force adjustment treatment is less than the bonding force between the second bonding layer and the second layer. A method for transferring a structure, which is a method for transferring a structure using a laminate as claimed in claim 1 and transferring the structure to a second layer, wherein the first bonding layer is in the same pattern as the structure, and when the surface of the second bonding layer opposite to the structure is brought into contact with the second layer, the bonding force between the first bonding layer and the first layer before the bonding force adjustment treatment is greater than the bonding force between the second bonding layer and the second layer, and the bonding force between the first bonding layer and the first layer after the bonding force adjustment treatment is less than the bonding force between the second bonding layer and the second layer.