JP6741157B2 - Laminated body and method for manufacturing multilayer body with concave portion using the same - Google Patents

Description

The present disclosure relates to a laminated body that can easily transfer a patterned structure.

The patterned structure to be placed on the member is transferred onto the target surface by the transfer method when it is difficult to form it directly on the surface to be placed or when it is desired to place it at multiple locations at once. Will be placed. Examples of the patterned structure include a wiring pattern on a wiring board, a cell pattern used for living tissues and organs in the medical field, a process of forming a wiring pattern, a process of manufacturing an electronic component having a three-dimensional structure, and the like. Examples include a protective member and the like arranged at a location where partial protection is required.

As a method of transferring the patterned structure to the transferred body, for example, using a carrier film in which the patterned structure is arranged, after bonding the structure on the carrier film and one surface of the transferred body, A method of peeling the carrier film is used. Note that Patent Document 1 discloses a protective film with a carrier film capable of preventing wrinkles from being generated in a protective layer when a protective layer is transferred and arranged for the purpose of protecting a circuit or the like in the production of a circuit board or the like. It is disclosed. The protective layer corresponds to the structure because it is transferred onto the circuit, but is not patterned.

Japanese Patent No. 5647593 JP-A-8-37378

The carrier film on which the structure is arranged needs to have the structure and the carrier film bonded to each other with a certain degree of strength before transfer. However, if the adhesive force between the structure and the carrier film is too high, it becomes difficult to transfer the structure to the transfer target at a time. Depending on the mechanical strength of the structure, damage may occur during transfer. There are problems such as easy occurrence. Furthermore, depending on the type of structure, there is a problem that the adhesive component of the carrier film remaining on the structure adversely affects the function and physical properties of the structure.

The present disclosure has been made in view of the above circumstances, and provides a laminate capable of easily transferring a patterned structure to a transfer target, and a method for producing a recessed multilayer body using the same. The main purpose.

The present disclosure provides a laminate having at least a first layer, a first adhesive layer, and a patterned structure in this order, and the first adhesive layer undergoes an adhesive force adjustment process to change the adhesive force. To do.

The present disclosure also provides a method for manufacturing a multilayer body with a recess, which includes a recess having an opening on one surface of the multilayer body, using the above-described multilayer body, wherein the multilayer body is provided on one surface of a second layer. A contact step of directly contacting the structure body or indirectly via a second adhesive layer, an adhesive force adjusting step of reducing the adhesive force of the first adhesive layer by the adhesive force adjusting process, and at least the first A transfer step of peeling off the layer and transferring the pattern portion containing at least the structure to the second layer in a pattern, and one or more other layers on the surface of the second layer on the side having the pattern portion. A laminating step of laminating the pattern part and the one or more other layers, and a first region including the pattern part and the other layer at a position overlapping with the pattern part in plan view, and other than the above. There is provided a method for manufacturing a multi-layered body with recesses, which includes a partitioning step of partitioning into a second area and a recess forming step of peeling and removing the first area to form the recess.

In the laminated body of the present disclosure, the first adhesive layer undergoes the adhesive force adjustment treatment to change the adhesive force, whereby the patterned structures can be easily and collectively transferred to the transferred body. It is possible to suppress the damage and the generation of adhesive residue on the structure side. Further, according to the method for manufacturing a multi-layered body with recesses of the present disclosure, it is possible to easily form recesses on the surface of the multi-layered body by using the above-mentioned laminated body.

It is a schematic plan view which shows an example of the laminated body of this indication. It is the XX sectional view taken on the line of FIG. FIG. 4 is a process diagram illustrating an example of a method of transferring a structure using the laminate of the present disclosure. It is a schematic sectional drawing which shows the other example of the laminated body of this indication. It is a schematic sectional drawing which shows the other example of the laminated body of this indication. FIG. 6 is a process diagram illustrating another example of the method for transferring a structure using the laminate of the present disclosure. FIG. 6 is a process diagram illustrating another example of the method for transferring a structure using the laminate of the present disclosure. FIG. 5 is a process chart showing an example of a method for manufacturing a laminate according to the present disclosure. FIG. 6 is a process drawing showing an example of a method for manufacturing a multilayer body with recesses of the present disclosure. It is explanatory drawing explaining the position of the division line in a division process.

In the present specification, when a certain configuration such as a certain member or a certain region is “above (or below)” another configuration such as another member or another region, unless otherwise specified, This includes not only directly above (or directly below) another configuration, but also above (or below) another configuration, that is, above or below another configuration, between other configurations. Includes cases where elements are included.

The present disclosure includes, in an embodiment, a method for manufacturing a laminate and a multi-layered body having a recess. Hereinafter, embodiments of the present disclosure will be described with reference to the drawings and the like. However, the present disclosure can be implemented in many different modes, and should not be construed as being limited to the description of the embodiments illustrated below. Further, in order to make the description clearer, the drawings may schematically show the width, thickness, shape, and the like of each part as compared with the embodiment, but this is merely an example, and the interpretation of the present disclosure should be understood. It is not limited. In the specification and the drawings, the same elements as those described above with reference to the already-explained drawings are designated by the same reference numerals, and detailed description thereof may be appropriately omitted. Further, for convenience of description, the terms “upper” and “lower” may be used, but the vertical direction may be reversed.

I. Laminated body The laminated body of the present disclosure has at least a first layer, a first adhesive layer, and a patterned structure in this order, and the first adhesive layer undergoes an adhesive force adjustment treatment to change its adhesive force. To do.

1 is a schematic plan view showing an example of a laminated body of the present disclosure, and FIG. 2 is a sectional view taken along line XX of FIG. The laminated body 10 of the present disclosure has at least the first layer 1, the first adhesive layer 2, and the patterned structure 3 in this order, and the first adhesive layer 2 undergoes an adhesive force adjustment process to obtain an adhesive force. Changes. In FIG. 2, the adhesive force between the first adhesive layer 2 and the first layer 1 before the adhesive force adjusting process is N ₁ , and the adhesive force between the first adhesive layer 2 and the first layer 1 after the adhesive force adjusting process is N ₁ . The adhesive force between the first adhesive layer 2 and the structure 3 is N ₁ ′, the adhesive force between the first adhesive layer 2 and the structure 3 before the adhesive force adjusting process is N ₂ , and the adhesive force between the first adhesive layer 2 and the structure 3 after the adhesive force adjusting process is N ₂ . The adhesive force between them is N ₂ '.

3A to 3C are process diagrams illustrating an example of a method for transferring a structure using the laminate of the present disclosure. As a method of transferring a structure to a transfer target (second layer) using the laminate of the present disclosure, first, the structure 3 of the laminate 10 of the present disclosure is directly attached to one surface of the second layer 11. Alternatively, they are indirectly contacted via the second adhesive layer (FIG. 3A, contact step). Next, the adhesive force of the first adhesive layer 2 is reduced by the adhesive force adjusting process T (FIG. 3B, adhesive force adjusting step). After that, at least the first layer 1 is peeled off (FIG. 3C, transfer step). In FIG. 3C, the first layer 1 and the first adhesive layer 2 are separated. As a result, the pattern portion 20 including at least the structure 3 is collectively transferred to the second layer 11 in a pattern on the second layer 11. In FIG. 3, the adhesive force between the structure and the second layer is N ₄ . Other than the above, reference numerals not described in FIG. 3 are the same as those in FIG.

As a method of transferring the patterned structure to the transfer target, for example, there is a method of using a carrier film on which the patterned structure is arranged. The carrier film on which the structure is arranged needs to have the structure and the carrier film bonded to each other with a certain degree of strength before transfer. However, if the adhesive force between the structure and the carrier film is too high, it is difficult to collectively transfer the structure to the transfer target. Depending on the mechanical strength of the structure, damage may occur during transfer. There are problems such as occurrence. Furthermore, depending on the type of structure, there is a problem that the adhesive component of the carrier film remaining on the structure adversely affects the function and physical properties of the structure.

In order to solve such a problem, the inventors of the present invention, as a transfer laminate of a patterned structure, have a patterned structure on an adhesive strength variable adhesive layer whose adhesive strength is reduced by an adhesive force adjustment process. The present invention has been accomplished by developing a laminated body of the present disclosure in which is arranged. That is, according to the laminated body of the present disclosure, by arranging the patterned structure on the first adhesive layer whose adhesive force is reduced by the adhesive force adjusting process, the first adhesive layer is formed before the adhesive force adjusting process. The structure can be held with a high adhesive force. On the other hand, after the adhesive force adjusting process, the adhesive force of the first adhesive layer to the structure is reduced, so that the structure can be easily peeled off. Accordingly, in the laminate of the present disclosure, the structure can be collectively transferred to the transfer target. Further, since the first adhesive layer in the laminate of the present disclosure can sufficiently reduce the adhesive force depending on the degree of the adhesive force adjustment treatment, the laminate of the present disclosure can reduce the mechanical strength and the type of the structure. In spite of this, high transferability can be realized, and it is possible to suppress damage to the structure during transfer and generation of adhesive residue on the structure side.

Here, the term "patterned" refers to a state in which a structure body is provided and a structure body is not provided on the adhered surface of the layer on which the structure body is arranged. In addition, a transfer body including at least a structure, which is transferred to a transfer target by the laminate of the present disclosure, may be referred to as a “pattern portion”. The pattern part can be transferred in a pattern on the adherend. Transferring or transferring to a transfer target means transferring or transferring onto one surface of the transfer target. Further, the transferred body to which the pattern portion including the structure is transferred by the laminated body of the present disclosure may be referred to as “second layer” and described. Hereinafter, the laminated body of the present disclosure will be described for each configuration.

A. First Adhesive Layer The first adhesive layer in the laminated body of the present disclosure is a layer whose adhesive force changes due to the adhesive force adjusting process. The first adhesive layer has adhesiveness and/or tackiness before the adhesive force adjusting process.

1. Aspect of First Adhesive Layer The first adhesive layer undergoes an adhesive force adjustment process to change its adhesive force. Here, "the adhesive force is changed by the adhesive force adjusting process" means that the adhesive force may be higher than that before the adhesive force adjusting process is performed. The adhesive force may be lower than that before receiving the adhesive force adjusting process. Among them, in the present disclosure, it is preferable that the adhesive force is reduced by the adhesive force adjusting process, and it is more preferable that the adhesive force is lost by the adhesive force adjusting process.

The first adhesive layer has a composition according to the type of adhesive force adjustment treatment. The adhesive force adjustment treatment is preferably a treatment capable of decreasing the adhesive force of the first adhesive layer, for example, heat treatment of heat treatment or cooling treatment, energy ray irradiation treatment, electric field application treatment or electric field treatment of no electric field treatment. , And the like.

That is, the first adhesive layer is a temperature-sensitive adhesive layer in which the adhesive strength is reduced by the heat treatment or the cooling treatment, the energy ray responsive adhesive layer in which the adhesive strength is reduced by the energy ray irradiation treatment. And the third aspect, which is an electrically responsive adhesive layer whose adhesive strength is reduced by an electric field application treatment or a non-electric field treatment. The first adhesive layer will be described below for each mode.

(1) First Aspect The first adhesive layer of the present aspect is a temperature-sensitive adhesive layer that undergoes a heat treatment or a cooling treatment as an adhesive force adjusting treatment to reduce the adhesive force. The temperature-sensitive adhesive layer is an adhesive layer that repeats adhesiveness and non-adhesiveness in response to temperature changes, and in the laminate of the present disclosure, even if it is a heat-peelable type whose adhesive strength is reduced by heat treatment. Of course, a cooling peeling type in which the adhesive strength is lowered by the cooling treatment may be used.

(A) Heat-peelable temperature-sensitive adhesive layer The heat-peelable temperature-sensitive adhesive layer is heated at a predetermined switching temperature or higher to reduce the adhesive force and enable peeling. The switching temperature can be appropriately set according to the composition of the heat-peelable temperature-sensitive adhesive layer, the melting point thereof, and the like, and can be, for example, in the range of 30°C or higher and 200°C or lower, and particularly 40°C or higher and 90° It is preferably in the range of ℃ or less. This is because by setting the switching temperature within the above range, workability at room temperature can be secured.

When the laminate of the present disclosure is used in a process involving heat, the switching temperature is preferably higher than the temperature in the process involving heat. Examples of the process involving heat include a baking process (for example, about 120° C.) of a solder resist and the like, a reflow process (for example, about 260° C.), and the like in the production of a multilayer body with recesses described later.

The composition of the heat-peelable temperature-sensitive adhesive layer is not particularly limited as long as it can exhibit desired physical properties. For example, a composition containing at least an adhesive and a foaming agent or an expanding agent (composition A), an adhesive And a side chain crystalline polymer (composition B). The composition A undergoes heat treatment to foam the foaming agent or expand the expanding agent, so that the contact area is physically reduced and thus the adhesive force can be reduced and the composition A can be easily peeled off. .. When the composition B is heated at a temperature equal to or higher than the melting point of the side chain crystalline polymer by heat treatment, the physical properties of the side chain crystalline polymer change and flow due to the phase change, and the adhesive strength of the temperature-sensitive adhesive layer is sufficiently increased. Can be reduced to a low level and can be easily peeled off.

(I) Composition A
The composition A of the heat-peelable temperature-sensitive adhesive layer contains at least an adhesive and a foaming agent or an expanding agent.

The adhesive includes a polymer having tackiness. Examples of the adhesive include natural rubber adhesive; synthetic rubber adhesive; styrene/butadiene latex base adhesive; block copolymer type thermoplastic rubber; butyl rubber; polyisobutylene; acrylic adhesive; vinyl ether copolymer and the like. Can be mentioned. Specific examples thereof include adhesives disclosed in Japanese Patent Application Laid-Open No. 2008-13590 and Japanese Patent No. 3853247.

As the foaming agent or the expanding agent, a material which undergoes heat treatment to foam the expanding agent or expand the expanding agent can be used. The foaming agent may be a chemical foaming agent or a physical foaming agent. As the foaming agent or the expanding agent, specifically, the foaming agent disclosed in Japanese Patent Application Laid-Open No. 2008-13590, the heat-expandable microspheres disclosed in Japanese Patent No. 3853247, or the like can be used. The temperature at which the foaming agent or expanding agent foams or expands, and the content of the foaming agent or expanding agent in the heat-peelable temperature-sensitive adhesive layer can be set as appropriate, and specifically, JP-A-2008-13590. The temperature and content for foaming or expanding disclosed in Japanese Patent Publication No. 3853247 and the like can be the same.

The composition A may further include a side chain crystalline polymer. The side-chain crystalline polymer flows when heated at a temperature higher than the melting point and can sufficiently reduce the adhesive strength of the temperature-sensitive adhesive layer, so that the content of the foaming agent in the temperature-sensitive adhesive layer is reduced. The temperature-sensitive adhesive layer can be thinned. The side-chain crystalline polymer will be described in “(ii) Composition B”, and thus the description thereof is omitted here. The content of the side chain crystalline polymer in the above composition A is not particularly limited and can be set appropriately.

(Ii) Composition B
The composition B of the heat-peelable temperature-sensitive adhesive layer contains at least an adhesive and a side chain crystalline polymer. The adhesive may be the same as the composition A, and thus the description thereof is omitted here.

The side-chain crystalline polymer is a polymer that crystallizes at a temperature lower than the melting point and exhibits fluidity at a temperature equal to or higher than the melting point, and is capable of reversibly generating a crystalline state and a fluidized state in response to a temperature change. Is. Examples of the side chain crystalline polymer include a polymer composed of a (meth)acrylate having a linear alkyl group, an acrylic acid ester or methacrylic acid ester having an alkyl group, and a polar monomer. Specific examples thereof include side chain crystalline polymers disclosed in JP-A-2008-13590. The content of the side-chain crystalline polymer in the above composition B is not particularly limited, and the heat-peelable temperature-sensitive adhesive layer becomes almost non-tacky at a temperature equal to or higher than the set temperature, and becomes tacky at a temperature lower than that. It is possible to appropriately set the amount sufficient to exhibit the characteristics. For example, the content can be set as disclosed in JP 2008-13590 A.

(Iii) Others Examples of the heat-peelable temperature-sensitive adhesive layer containing the composition A described above include the heat-expandable layer of the heat-peelable pressure-sensitive adhesive sheet disclosed in Japanese Patent No. 3853247. Examples of the heat-peelable temperature-sensitive adhesive layer containing the composition B described above include the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet disclosed in JP 2008-13590 A.

(B) Cooling/peeling type temperature-sensitive adhesive layer The cooling/peeling type temperature-sensitive adhesive layer has a lower adhesive strength and can be peeled off by cooling at a predetermined switching temperature or lower. The switching temperature can be appropriately set according to the composition of the cooling-peelable temperature-sensitive adhesive layer, the melting point thereof, and the like, and is preferably 10° C. or higher, for example. The switching temperature can be 70° C. or lower, and preferably 20° C. or lower. By setting the switching temperature within the above range, the cooling peeling type temperature-sensitive adhesive layer can be easily attached at room temperature and peeled under a cooling environment.

The composition of the cooling-peelable temperature-sensitive adhesive layer is not particularly limited as long as it can exhibit desired physical properties. For example, an acrylic acid alkyl ester having 16 or more linear alkyl groups as side chains and/or A composition containing a side-chain crystallizable polymer that constitutes an alkyl methacrylic acid component is included.

Examples of acrylic acid ester and/or methacrylic acid ester having 16 or more linear alkyl groups as side chains (also collectively referred to as (meth)acrylate) include hexadecyl (meth)acrylate, stearyl (meth)acrylate, and docosyl ( Examples thereof include (meth)acrylates having a linear alkyl group having 16 to 22 carbon atoms such as (meth)acrylate.

The side-chain crystallizable polymer is not particularly limited, and for example, an alkyl acrylate and/or methacrylic acid alkyl ester having an alkyl group with 1 to 6 carbon atoms in the range of 40% by weight to 60% by weight and a carboxy group Within the range of 2% by weight to 10% by weight of the group-containing ethylenically unsaturated monomer, and 20% by weight to 60% by weight of an alkyl acrylate and/or methacrylic acid alkyl ester in which the alkyl group has 16 to 22 carbon atoms. It is also possible to use a monomer polymer containing within the range.

The side-chain crystallizable polymer preferably has a melting point (also referred to as first-order melt transition) in the range of 0° C. or higher and 70° C. or lower, and more preferably in the range of approximately 15° C. or higher and 55° C. or lower. It is also preferred that the side chain crystallizable polymer melts in a relatively narrow temperature range below about 35°C, preferably below about 25°C. The amount of the side-chain crystallizable polymer is not particularly limited, and it has the property of making the cooling-peelable temperature-sensitive adhesive layer almost non-tacky at a temperature below a set temperature, and tacky at a temperature above it. A sufficient amount can be set appropriately.

As the cooling-peelable temperature-sensitive adhesive layer containing the above-mentioned composition, for example, a viscous adhesive layer disclosed in JP-A-2000-351951 can be used.

(2) Second Aspect The first adhesive layer of the present aspect is an energy ray responsive adhesive layer that undergoes an energy ray irradiation treatment as an adhesive force adjusting treatment to reduce the adhesive force. The energy ray responsive adhesive layer can be peeled off due to a decrease in the adhesive force and a shearing force generated on the adhered surface as the adhesive layer is cured and contracted by irradiation with energy rays.

The energy ray used for the energy ray irradiation treatment may be one that can cause a reaction of the first adhesive layer, and can be appropriately selected according to the composition of the energy ray responsive adhesive layer. Examples of energy rays include light rays such as deep ultraviolet rays, ultraviolet rays, near ultraviolet rays, and infrared rays, electromagnetic waves such as X-rays, electron rays, and γ rays, and various ionizing radiations such as proton rays and neutron rays. Of these, ultraviolet rays and electron beams are preferable.

The composition of the energy ray responsive adhesive layer is not particularly limited as long as it can be cured by the energy ray irradiation treatment. Examples of the composition of the energy ray responsive adhesive layer include a composition containing an acrylic polymer, an energy ray polymerizable oligomer or monomer, a polymerization initiator and a crosslinking agent. In addition, in the present disclosure, “acrylic” may include “methacrylic”.

Examples of the acrylic polymer include an acrylic ester which is a main monomer and an acrylic ester copolymer which is a copolymer of a functional group-containing acrylic monomer copolymerizable with the acrylic ester. Examples of the functional group of the functional group-containing acrylic monomer include a hydroxyl group, a carboxyl group, an epoxy group, an isocyanate group, an amino group, and the like. Regarding the acrylic acid ester and the functional group-containing monomer that compose the acrylic polymer, the acrylic acid ester and the monomer disclosed in, for example, JP2012-31316A and JP2004-158812A can be used. Further, the acrylic polymer may have the mass average molecular weight (Mw) disclosed in the above publication, for example.

The energy ray-polymerizable oligomer or monomer is not particularly limited as long as it can be polymerized by irradiation with energy rays, and examples thereof include photoradical-polymerizable, photocationic-polymerizable, and photoanionic-polymerizable oligomers or monomers. Can be mentioned. Specifically, the energy ray-polymerizable oligomer or monomer disclosed in JP 2012-31316 A, JP 2004-158812 A or the like can be used. The energy ray-polymerizable oligomer or monomer may be, for example, the mass average molecular weight (Mw) and the content disclosed in the above publication.

Examples of the polymerization initiator include IRGACURE754 (manufactured by BASF Japan), IRGACURE2959 (manufactured by BASF Japan), and photopolymerization initiators disclosed in JP 2004-158812 A and the like. Further, as the cross-linking agent, for example, an isocyanate-based cross-linking agent, an epoxy-based cross-linking agent, or the like can be used, and specifically, the cross-linking agent disclosed in JP 2012-31316 A can be used.

The energy ray responsive adhesive layer may further include a gas generating agent. This is because the gas generating agent generates gas upon irradiation with energy rays, and the gas migrates to the interface between the adhesive layer and the adherend, so that peeling is further facilitated. The gas generating agent is not particularly limited, but for example, an azo compound or an azide compound can be used. Specific examples thereof include azo compounds and azide compounds disclosed in JP-A 2004-158812. The content of the gas generating agent is not particularly limited as long as it can exhibit a desired function, but may be the amount disclosed in JP 2004-158812 A, for example.

As the energy ray responsive adhesive layer, for example, a tacky adhesive layer disclosed in JP2012-31316A, JP2004-158812A, or the like can be used.

(3) Third Aspect The first adhesive layer of this aspect is an electrically responsive adhesive layer whose adhesive force is reduced by being subjected to an electric field application process or a no-electric field process as an adhesive force adjusting process. The electrically responsive adhesive layer is an adhesive layer in which adhesiveness and non-adhesiveness are repeated depending on whether or not an electric field is applied. In the laminate of the present disclosure, the electrically responsive adhesive layer may be an electrically peelable adhesive layer that exhibits adhesive force in the absence of an electric field and whose adhesive force is reduced by applying an electric field. However, it may be an electrically adhesive adhesive layer whose adhesive strength is reduced in the absence of an electric field. Above all, an electrically peelable adhesive layer whose adhesive strength is reduced by application of an electric field is preferable. This is because the transfer work and process can be performed in a normal environment.

If the first adhesive layer of the present aspect is an electrically peelable adhesive layer, the adhesive force adjusting process means an electric field applying process of applying an electric field to the first adhesive layer under no electric field. That is, when the first adhesive layer of the present aspect is an electro-peeling adhesive layer, the first adhesive layer can have adhesiveness by placing the laminate of the present disclosure under an electric field. On the other hand, when the pattern portion including the structure is transferred to the second layer, the layered product of the present disclosure is placed under the electric field in the second layer as an electric field application process, so that the first field is applied. The adhesive force of the adhesive layer is reduced, and at least the first layer can be peeled off.

Examples of the composition of such an electrically peelable adhesive layer include a composition containing an acrylic adhesive or a polyester adhesive and an electrolytic solution. The acrylic polymer constituting the acrylic adhesive is not particularly limited, but from the viewpoint of adhesiveness, an acrylic polymer having a weight average molecular weight in the range of 10,000 to 5,000,000 can be used, for example. The method for calculating the weight average molecular weight, and specific examples of the acrylic monomer and the polymerization initiator that constitute such an acrylic polymer may be the same as the method and materials disclosed in JP2010-037354A. I can.

The electrolytic solution is not particularly limited as long as it can exhibit a desired ionic conductivity, and examples thereof include a mixture containing a quaternary ammonium salt or an alkali metal salt as an electrolyte and an organic solvent. Regarding the ionic conductivity of the electrolytic solution and the measuring method thereof, and the specific composition of the electrolytic solution, the same as the ionic conductivity and measuring method disclosed in JP 2010-37354 A, and the composition of the electrolytic solution are used. be able to.

On the other hand, if the first adhesive layer of the present aspect is an electric adhesive adhesive layer, the adhesive force adjusting process means a no-electric field process of stopping the application of the electric field to the first adhesive layer to make it an electric field. That is, when the first adhesive layer of the present aspect is an electrically adhesive adhesive layer, the first adhesive layer can have a desired adhesive force by applying an electric field to the first adhesive layer. On the other hand, when transferring the pattern portion including the structure to the second layer, by stopping the application of the electric field to the first adhesive layer as a no-electric field treatment, the adhesive force of the first adhesive layer is reduced and It can be peeled off at a desired interface between the adhesive layer and the adjacent layer.

Examples of the composition of such an electroadhesive adhesive layer include an electrorheological gel (ER gel) in which electrorheological particles (ER particles) are dispersed in a resin cross-linked body. As the electric adhesive layer, for example, an electric adhesive sheet as disclosed in Japanese Patent Application Laid-Open No. 2013-049820, specifically, a porous sheet having two layers laminated, viscoelastic silicon gel, urethane rubber Alternatively, a sheet in which butadiene rubber is combined may be used.

A known method can be used for applying an electric field to the first adhesive layer. For example, a method of connecting terminals to the conductive first layer and the structure to apply a voltage between the terminals, a method of bringing the terminals into contact with the conductive first layer and the first adhesive layer and applying a voltage between the terminals. Methods and the like. As the conductive first layer, for example, a metal foil such as a copper foil or an aluminum foil can be used. The application conditions are not particularly limited, and can be set, for example, within an electric field range of 5V to 50V and an application time range of 10 seconds to 120 seconds.

(4) Others The first adhesive layer of each aspect may include other optional additives, if necessary. Examples of optional additives include powders such as colorants and pigments, surfactants, plasticizers, tackifiers, low molecular weight polymers, surface lubricants, leveling agents, antioxidants, corrosion inhibitors, and light stabilizers. Agents, ultraviolet absorbers, polymerization inhibitors, silane coupling agents, inorganic or organic fillers, metal powders, particles, foils and the like.

2. Others The first adhesive layer preferably exhibits a desired adhesive force before and after the adhesive force adjusting process. The adhesive force of the first adhesive layer before the adhesive force adjustment treatment depends on the composition and thickness of the adhesive layer, but is, for example, in the range of 0.1 N/25 mm or more and 10 N/25 mm or less, preferably 0.5 N/ It is in the range of 25 mm or more and 5 N/25 mm or less, and more preferably in the range of 1 N/25 mm or more and 3 N/25 mm or less. Further, the adhesive force of the first adhesive layer after the adhesive force adjusting process may be lower than that before the adhesive force adjusting process, and in particular, the first adhesive layer is easily peelable or non-adhesive to the first layer or the structure. It is preferably capable of exhibiting sex. The adhesive force of the first adhesive layer after the adhesive force adjustment treatment is, for example, 5 N/25 mm or less, preferably 0.05 N/25 mm or more and 2 N/25 mm or less, and more preferably 0.05 N/25 mm or more. It can be within the range of 5 N/25 mm or less. Note that the non-adhesive property refers to a physical property that does not substantially have an adhesive force, and the easy peeling property has tack and can adhere to the first layer and the structure, and the first layer. Alternatively, it refers to a physical property that can be easily peeled from the structure.

The adhesive force of the first adhesive layer before and after the adhesive force adjustment treatment can be measured according to JIS Z0237-2009. For the measurement, a test piece prepared by backing a first adhesive layer (width 25 mm, length 150 mm) with a PET film having a thickness of 50 μm was prepared, and the first adhesive layer of this test piece was attached to a SUS304BA plate with a 2 kg roller. Two reciprocating pressure bonding, after leaving for 1 hour to 24 hours under the conditions of temperature 20°C to 28°C and humidity 30%RH to 60%RH, tensile tester (eg, A&D Corp., Tensilon universal test) Machine RTF-1150H), and peeling is performed under the conditions (peeling angle: 180° direction, pulling speed: 300 mm/min, peeling distance: 50 mm) based on JIS Z0237-2009. When measuring the adhesive force of the first adhesive force after the adhesive force adjustment treatment, the first adhesive layer of the test piece prepared by the above-mentioned method is attached to a SUS304BA plate, and two reciprocating pressures are applied by a 2 kg roller to the above. After standing under the conditions described above, an adhesive force adjustment treatment is performed, and the treated test piece is peeled off and measured using a tensile tester under the conditions based on JIS Z0237-2009 described above.

The thickness of the first adhesive layer is not particularly limited as long as it can exhibit a desired adhesive force with the first layer or the structure before and after the adhesive force adjustment treatment, and can be appropriately set. For example, it can be in the range of 1 μm or more and 500 μm or less, preferably in the range of 5 μm or more and 300 μm or less. The first adhesive layer may have a film shape or a sheet shape.

The first adhesive layer may be arranged on the entire surface of one surface of the first layer 1 as shown in FIG. 2, or may be arranged in the same pattern as the structure 3 as shown in FIG. .. When the first adhesive layer has the same pattern as the structure, peeling occurs between the first layer after the adhesive force adjustment treatment and the first adhesive layer, and thus the structure and the first layer on the structure. It is possible to transfer the pattern portion having the above to the one surface of the second layer.

The mode of the first adhesive layer can be selected according to the usage environment of the laminate of the present disclosure. For example, when used in a process such as a heating process where heat is applied, other than the heat-peelable temperature-sensitive adhesive layer is preferable, and among them, the electrically responsive adhesive layer is more preferable because the operation is simple. When used in the step of irradiating with ultraviolet rays, a layer other than the energy ray responsive adhesive layer is preferable, and a temperature sensitive adhesive layer is particularly preferable.

B. 1st layer The 1st layer in the laminated body of this indication is a layer which supports the said 1st adhesive layer and a structure. The first layer is a layer that is peeled off after the laminated body of the present disclosure is brought into contact with the second layer and the adhesive strength adjustment treatment is performed on the first adhesive layer, and is used for the application of the laminated body of the present disclosure. Accordingly, it is a layer serving as a release layer or a base material.

As the first layer, a layer that can be bonded to the first adhesive layer before the adhesive strength adjustment process and that can exhibit a desired adhesive strength can be used. Examples of the first layer include a resin layer, a metal layer such as a metal foil, a vapor deposition film having a metal film on one or both surfaces of the resin layer, paper such as release paper, and a composite material of these materials. ..

The resin layer is not particularly limited, for example, polyester such as polyethylene terephthalate and polyethylene naphthalate, polycarbonate, acrylic such as polymethylmethacrylate, olefin such as polyethylene and polypropylene, polyimide, cyclic polyolefin, triacetyl cellulose and the like resin. The layers are:

Examples of the metal foil include copper foil and aluminum foil. As the copper foil, a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium) is used. You may use.

Above all, the first layer is preferably a resin layer. As described later, when the peeling position after the adhesive force adjusting process is set between the first adhesive layer and the structure, the first layer is preferably a resin layer. This is because the adhesive force between the first adhesive layer and the first layer after the adhesive force adjustment process can be increased. As the first layer in this case, specifically, a resin layer made of polyester such as PET, polyimide, polypropylene, polyethylene or the like is preferable.

The surface of the first layer, which is in contact with the first adhesive layer, may be surface-treated. It is possible to increase the adhesive force between the first adhesive layer before and after the adhesive force adjusting process, and particularly between the adhesive layer and the first adhesive layer after the adhesive force adjusting process. This is because it is possible to make it difficult to peel off between them. The method of surface-treating the surface of the first layer on the side of the first adhesive layer can be appropriately selected according to the type of material forming the first layer, and for example, known methods such as an oxidation method and a roughening method. Is mentioned.

The thickness of the first layer is not particularly limited, but is preferably a thickness that can obtain strength enough to support at least the first adhesive layer and the structure, for example, in the range of 5 μm or more and 1000 μm or less. be able to. The first layer may have a film shape or a sheet shape. Among them, the film form is preferable from the viewpoint of peeling.

The first layer may or may not have optical transparency. When the first adhesive layer is an energy ray responsive adhesive layer, the first layer preferably has energy ray transparency. This is because it is possible to easily reduce the adhesive force of the first adhesive layer by irradiating the energy ray from the first layer side. The energy ray transparency of the first layer can be appropriately set according to the type of energy ray to be irradiated and the sensitivity of the material forming the first layer to the energy ray. For example, when the energy rays are light rays, the light transmittance of 400 nm or less of the first layer is preferably 60% or more. The light transmittance can be measured using a commercially available spectrophotometer (for example, MPC2200 manufactured by Shimadzu Corporation).

When the first adhesive layer is a heat-peelable temperature-sensitive adhesive layer, the first layer preferably has heat resistance. This is because when the adhesive strength of the first adhesive layer is reduced by the heat treatment, the first layer can be prevented from being deteriorated by heat and can be easily peeled off. The first layer preferably has heat resistance capable of withstanding the heat treatment temperature of the heat-peelable temperature-sensitive adhesive layer, and specifically, the melting point of the first layer is preferably higher than the heat treatment temperature.

C. Structure The structure in the laminated body of the present disclosure is a member arranged on the opposite side of the first adhesive layer to the first layer side. By being transferred in a pattern on one surface of the second layer directly or through another layer, it has a function according to the application. In the laminated body of the present disclosure, one or more structures are arranged in a pattern on the side of the first adhesive layer opposite to the first layer.

The structure can have a shape according to the use of the laminate of the present disclosure, and for example, may have a layered shape such as a sheet or a film, a spherical shape (ball) shape, a cubic shape, or a three-dimensional shape such as a rectangular parallelepiped shape. it can. The layered structure may be a single layer or may have a laminated structure. The size and thickness of the structure can be appropriately set depending on the function and form of the structure and the use of the laminate of the present disclosure.

The material of the structure can be selected according to the application of the laminate of the embodiment of the present disclosure, the function and physical properties of the structure, and examples thereof include resins, metals, and cells.

The structure itself may or may not have adhesiveness. When the structure has adhesiveness, the laminate of the present disclosure can directly transfer the pattern portion including the structure to the second layer without separately interposing an adhesive layer or the like. Here, that the structure has adhesiveness includes that the structure has tackiness (adhesiveness) at room temperature, and that it exhibits tackiness by pressurization or heating.

The adhesive force when the structure has adhesiveness is not particularly limited as long as it can sufficiently adhere to the second layer that is the transfer target, and is, for example, in the range of 0.1 N/25 mm or more and 5 N/25 mm or less. , And preferably in the range of 0.5 N/25 mm or more and 1 N/25 mm or less. The adhesive force of the structure can be measured according to JIS Z0237-2009. The details of the measuring method are the same as the measuring method of the adhesive force described in the section "A. First adhesive layer".

On the other hand, when the structure does not have adhesiveness, the laminate of the present disclosure has the structure and the second adhesive layer by having the second adhesive layer described below on the side opposite to the first adhesive layer side of the structure. It is possible to transfer the pattern portion containing the to the second layer. That is, the structure can be indirectly transferred to the second layer via the second adhesive layer.

In addition to the above-described adhesiveness, the structure can have desired functions and physical properties depending on the type of the structure, the application of the laminate of the present disclosure, and the like. The physical properties required for the structure include, for example, heat resistance and chemical resistance.

Hereinafter, the structure in the present disclosure will be described in more detail by dividing into application examples of the laminate of the embodiment of the present disclosure.

(Application example 1)
Application Example 1 is an example in which the laminate of the present disclosure is used as a carrier sheet for transfer, and can be used, for example, in the manufacture of a multilayer body with recesses. Specifically, one of the members constituting the multilayer body is used as the second layer, and the pattern portion including the structure is transferred to the second layer by using the laminated body of the present disclosure, and further on the structure. By arranging the constituent members of the multilayer body, the patterned structure can be arranged at a desired position in the production of the multilayer body. Then, after the multi-layered body is partitioned according to the arrangement position of the structure, the recessed region can be formed in the multi-layered body by peeling and removing the partitioned region that overlaps with the structure in plan view. The application example 1 will be described in detail in the section “B. Method for manufacturing multilayer body with concave portions” described later, and thus description thereof is omitted here.

In Application Example 1, the structure can be a member forming a multilayer body. For example, in the case of using in the production of a multi-layered wiring board with recesses in Application Example 1, a member corresponding to the step of using the laminate can be used as the structure, and specifically, a protective layer, Examples include wiring patterns and solder balls. Above all, a protective layer can be preferably used as the structure.

In Application Example 1, as the material of the structure, a material having physical properties according to the step of using the laminate can be appropriately selected. For example, if the structure is a protective layer, the material of the structure may be resin. If the structure is a wiring pattern, examples of the material of the structure include metals and conductive materials generally used for wiring.

In Application Example 1, the structure may have desired physical properties depending on the application. In this case, the material of the structure can be appropriately selected according to the physical properties. For example, the structure may be adhesive. Examples of the material of the structure having adhesiveness include adhesive rubber such as polyurethane, butyl rubber, and polystyrene elastomer. These materials may be used alone or in combination of two or more.

Further, in Application Example 1, the structure may have heat resistance. This is because it is possible to suppress the dimensional change of the structure due to heat. Above all, when the structure is a protective layer and is used for manufacturing a multi-layered wiring board with recesses in Application Example 1, a heating step is included, and it is necessary to form recesses with high dimensional accuracy. Is required to have high heat resistance. Examples of the material for the heat-resistant structure include polyester resins such as polyimide resin, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT), polyolefin resins, polyamide resins, polyimide resins, polycarbonate. Examples thereof include resins, acrylic resins, polyvinyl chloride resins, polyphenylene sulfide (PPS) resins, and the like. These resins may be used alone or in combination of two or more. Among them, polyphenylene sulfide (PPS) resin is preferable because it also has chemical resistance described later.

Further, in Application Example 1, the structure may have durability, chemical resistance, etc. in addition to heat resistance. This is because when used in the manufacture of the multi-layer wiring board with recesses in Application Example 1, for example, when chemical treatment is performed, deterioration of the structure and the second layer due to the chemical can be suppressed. Further, it is possible to suppress the generation of adhesive residue when peeling off the partitioned area.

In Application Example 1, the patterned structure is formed by arranging one or more structures in a pattern. The planar view shape of the structure per unit can correspond to the planar view shape of the recess in the recessed multilayer body when used for manufacturing the multilayer wiring board with recesses in Application Example 1. The arrangement pattern of the structures can be the same as the arrangement pattern of the recesses formed in the multilayer body.

(Application example 2)
Application Example 2 is an example in which the laminate of the present disclosure is used as a laminate for cell pattern transfer. That is, the cell pattern can be transplanted to the biological tissue by transferring the pattern portion including the structure to the second layer using the laminate of the present disclosure with the biological tissue, the culture substrate and the like as the second layer.

In Application Example 2, examples of the structure include a cell sheet. The cell sheet is a sheet in which cultured cells are assembled and layered. Examples of cells constituting the cell sheet include floating cells such as blood cells and lymphoid cells, adhesive cells, and the like. Specific examples thereof include cells disclosed in JP2007-014753A.

In Application Example 2, the pattern-shaped structure is formed by arranging one or more structures in a pattern, and the planar view shape per unit of the structure corresponds to that of the cell sheet in the cell pattern transfer laminate. It can correspond to a plan view shape. Further, the arrangement pattern of the structures can be the same as the arrangement pattern of the cell sheet in the cell pattern transfer laminate.

D. Second Adhesive Layer The laminate of the present disclosure can have a second adhesive layer having a composition different from that of the first adhesive layer on the side of the structure opposite to the first adhesive layer side. When the structure does not have adhesiveness, by having the second adhesive layer on the surface opposite to the first adhesive layer side of the structure, the structure becomes the second layer through the second adhesive layer. This is because it can be transferred. At this time, the pattern portion transferred to the second layer has at least the second adhesive layer and the structure in this order from the second layer side.
FIG. 5 is a schematic cross-sectional view showing another example of the laminated body of the present disclosure, and has the second adhesive layer 4 on the side of the structure 3 opposite to the first adhesive layer 2 side. Note that, in FIG. 5, the adhesive force between the structure 3 and the second adhesive layer 4 is N ₃ . Other reference numerals not described in FIG. 5 are the same as those in FIGS.

The second adhesive layer has adhesiveness and/or tackiness. Since the second adhesive layer is arranged on the surface of the structure opposite to the first adhesive layer side, the second adhesive layer is usually a pattern having the same shape as the structure.

The second adhesive layer has a composition different from that of the first adhesive layer. The composition different from that of the first adhesive layer refers to a composition in which the adhesive force is less likely to decrease when the adhesive force adjusting process for the first adhesive layer is performed. Specifically, it means a composition in which the adhesive force of the second adhesive layer after the adhesive force adjusting process is higher than that of the first adhesive layer after the adhesive force adjusting process. Above all, it is preferable that the second adhesive layer has a composition in which the adhesive force is not lowered by various adhesive force adjusting treatments.

The composition of the second adhesive layer is not particularly limited as long as it can exhibit a desired adhesive force, and is a composition containing a resin generally used for an adhesive or a pressure-sensitive adhesive as a main component, such as a thermoplastic resin or a curable resin. Is mentioned. Examples of the resin include acrylic resin, epoxy resin, rubber, silicone resin, polyester resin and the like. One type of these resins may be contained, or two or more types may be contained. Among them, acrylic resin is preferable because it is excellent in transparency, durability, heat resistance, and cost. The acrylic resin is not particularly limited, and conventionally known polymers of acrylic monomers or methacrylic monomers can be used. Specific examples thereof include polymers of monomers used in the adhesive layer disclosed in JP-A-2009-226621. The second adhesive layer may contain the additive described in the section “A. First adhesive layer”, if necessary.

The second adhesive layer preferably has physical properties according to the application of the laminate of the present disclosure. For example, when the laminate of the present disclosure is used in the method for producing a recessed multilayer body described below, the second adhesive layer preferably has heat resistance and chemical resistance.

The second adhesive layer preferably has a desired adhesiveness to each of the structure and the second layer to be the transferred body. When peeling the structure from the laminated body of the present disclosure after the adhesive force adjustment treatment, peeling may occur between the structure and the second adhesive layer, and the structure may be separated via the second adhesive layer. This is because it may be difficult to transfer to two layers. The adhesive force of the second adhesive layer can be, for example, in the range of 0.1 N/25 mm or more and 5 N/25 mm or less, preferably in the range of 0.5 N/25 mm or more and 1 N/25 mm or less. The adhesive force of the second adhesive layer can be measured according to JIS Z0237-2009. The details of the measuring method are the same as the measuring method of the adhesive force described in the section "A. First adhesive layer".

The thickness of the second adhesive layer is not particularly limited and can be appropriately designed so as to exhibit a desired adhesive force to the structure and the second layer, for example, within a range of 1 μm to 500 μm, The thickness can be preferably in the range of 5 μm to 50 μm.

E. Arbitrary Configuration When the laminate of the present disclosure has adhesiveness, a peeling layer can be provided on the side of the structure opposite to the first layer side. Moreover, when the laminated body of this indication has a 2nd adhesive layer, it can have a peeling layer on a 2nd adhesive layer. The release layer may have the same pattern as the structure, or may have a shape that covers the entire area of the arrangement surface of the structure of the first layer in plan view. A conventionally known release layer can be used as the release layer.

F. Others In the laminate of the present disclosure, one or more pattern portions including at least the structure can be collectively transferred to the second layer. The pattern portion is arranged in a pattern on the second layer.

1. Second Layer The second layer is a member that serves as a transfer target when the pattern portion including the structure is transferred from the laminate of the present disclosure, and the release layer having an arbitrary configuration is excluded. The second layer can be appropriately selected depending on the application of the laminate of the present disclosure. For example, when the laminate of the present disclosure is used for producing a recessed multilayer body described below, the second layer can be one of the members constituting the multilayer body. Specifically, when the multilayer body is a multilayer wiring board, examples of the second layer include a metal layer such as a wiring layer, an insulating layer and a resin layer such as a resin substrate. When the layered product of the present disclosure is used as a cell pattern transfer layered product, examples of the second layer include a culture substrate and a biological tissue.

The second layer may be made of the same material as the first layer or a different material. However, when one surface of the structure is in contact with the first adhesive layer and the other surface is in contact with the second layer, the material of the second layer is the material between the structure and the second layer before and after the adhesive force adjustment treatment. The adhesion is preferably selected to be different from the adhesion between the first adhesive layer and the structure.

2. Relationship between Interlayer Adhesive Forces The laminate of the present disclosure has an adhesive force N ₁ between the first adhesive layer and the first layer before the adhesive force adjusting process, and a first adhesive layer and the first layer after the adhesive force adjusting process. The adhesive force N ₁ ′ between and may have a relationship of N ₁ >N ₁ ′ or a relationship of N ₁ <N ₁ ′. Further, the adhesive force N ₂ between the first adhesive layer and the structure before the adhesive force adjusting process and the adhesive force N ₂ ′ between the first adhesive layer and the structure after the adhesive force adjusting process are N. _It may have a relationship of ₂ >N ₂ ′, or may have a relationship of N ₂ <N ₂ ′.

Before the adhesive force adjustment process, the magnitude relationship between the adhesive force N ₁ and the adhesive force N ₂ is not particularly limited, but may have a relationship of N ₁ >N ₂ , for example.

On the other hand, after the adhesive force adjustment processing, the adhesive force N ₁ ′ and the adhesive force N ₂ ′ may have a relationship of N ₁ ′>N ₂ ′, and have a relationship of N ₁ ′<N ₂ ′. The pattern portion including the structure may be appropriately set depending on the peeling position when the pattern portion including the structure is transferred to the second layer. That is, if N ₁ ′>N ₂ ′, it is possible to facilitate separation at the interface between the first adhesive layer and the structure when transferring the pattern portion to the second layer, while N ₁ ′< With N ₂ ′, it is possible to facilitate peeling at the interface between the first adhesive layer and the first layer when transferring the pattern portion to the second layer.

The adhesive forces N ₁ and N ₁ ′ between the first adhesive layer and the first layer before and after the adhesive force treatment preferably show desired sizes regardless of the material and type of the first layer. The adhesive force N ₁ may be, for example, 0.05 N/25 mm or more, and may be 0.1 N/25 mm or more and 0.5 N/25 mm or less. The upper limit of the adhesive force N ₁ is not particularly limited, but can be 5 N/25 mm or less. On the other hand, the adhesive force N ₁ ′ can be, for example, 5 N/25 mm or less, and can be 0.1 N/25 mm or more and 1 N/25 mm or less.

Further, it is preferable that the adhesive forces N ₂ and N ₂ ′ between the first adhesive layer and the structure before and after the adhesive force treatment have desired sizes regardless of the material and type of the material of the structure. The adhesive force N ₂ can be set, for example, in the range of 0.5 N/25 mm or more and 10 N/25 mm or less, and particularly in the range of 1 N/25 mm or more and 5 N/25 mm or less. Further, the adhesive force N ₂ ′ can be, for example, in the range of 0.05 N/25 mm or more and 2 N/25 mm or less, and particularly in the range of 0.05 N/25 mm or more and 0.5 N/25 mm or less. it can.

Each adhesive force is measured for each adherend by transferring the adhesive layer to a PET substrate to form a PET/adhesive layer. The measuring method and the measuring condition can be the same as the measuring method and the measuring condition of the adhesive force described in the section “A. First adhesive layer 2. Others”.

In the laminated body of the present disclosure, when the structure has adhesiveness, as shown in FIGS. 3A to 3B, the laminated body according to the present specification has a structure on the side opposite to the first adhesive layer side of the structure. The surface contacts the second layer. The adhesive force between the structure and the second layer is N ₄ . When the structure has adhesiveness, the magnitude relationship among the adhesive force N ₁ , the adhesive force N ₂ , and the adhesive force N ₄ is not particularly limited before the adhesive force adjusting process, but for example, N ₁ >N ₂ >N ₄ You can have a relationship.

On the other hand, after the adhesive force adjustment process, the adhesive force N ₄ is preferably the largest as a magnitude relationship among the adhesive force N ₁ ′, the adhesive force N ₂ ′, and the adhesive force N ₄ , for example, N ₄ >N ₁ It may have a relation of “>N ₂ ”, or may have a relation of N ₄ >N ₂ ′>N ₁ ′. By having the above relationship among the adhesive force N ₁ , the adhesive force N ₂ , and the adhesive force N ₄ , the interface between the first adhesive layer and the structure or the interface between the first adhesive layer and the first layer. Then, the peeling easily occurs preferentially, so that the structure can be easily transferred to the second layer, and the structure can be fixed to the second layer with a sufficient adhesive force.

Further, when the laminate of the present disclosure has the second adhesive layer on the side of the structure opposite to the first adhesive layer side, the laminate of the present disclosure is different from the structure side of the second adhesive layer. It contacts the second layer on the opposite surface. In the laminated body of the present disclosure, when the surface of the second adhesive layer on the side opposite to the structure side is brought into contact with the second layer, the first adhesive layer and the structure are formed before and after the adhesive force adjusting process. Specifications having a desired adhesive force relationship between the second adhesive layer and the second adhesive layer, and between the first layer and the first adhesive layer and the second adhesive layer. It can be roughly classified into a second specification having a desired adhesive force relationship with the second layer. Each specification will be described below.

(A) First specification The laminated body of the present specification has the first adhesive before the adhesive force adjusting process when the surface of the second adhesive layer opposite to the structure side is brought into contact with the second layer. The adhesive force N ₂ between the layer and the structure is equal to or more than the adhesive force N ₅ between the second adhesive layer and the second layer, and the first adhesive layer after the adhesive force adjustment treatment is performed. The adhesive force N ₂ ′ with the structure is lower than the adhesive force N ₅ between the second adhesive layer and the second layer.

FIGS. 6A to 6C are schematic diagrams illustrating another example of the step of transferring the structure to the second layer using the first specification of the laminated body of the present disclosure. An example in which the pattern portion 20 including the second adhesive layer 4 is transferred to the second layer 11 is shown. In FIG. 6, the adhesive force between the second adhesive layer 4 and the second layer 11 is N ₅ . Other than those, reference numerals not described in FIG. 6 are the same as those in FIGS.

According to this specification, by having a predetermined adhesive force relationship between the first adhesive layer and the structure and between the second adhesive layer and the second layer before and after the adhesive force adjustment process, As shown in FIG. 6C, peeling occurs between the first adhesive layer and the structure due to the adhesive force adjustment process, and the pattern portion including at least the structure can be collectively transferred to the second layer. The pattern portion transferred to the second layer can have a second adhesive layer and a structure from the second layer side, and is arranged in a pattern on the second layer. In this specification, since the first adhesive layer remains on the first layer side, the first adhesive layer may cover the entire area of one surface of the first layer and has the same pattern as the structure. May be.

In this specification, it is preferable that the adhesive force N ₂ and the adhesive force N ₅ have a relationship of N ₂ ≧N ₅ before the adhesive force adjustment process. Further, before the adhesive force adjustment process, the magnitude relationship among the adhesive force N ₁ , the adhesive force N ₂ , and the adhesive force N ₃ is not particularly limited, but for example, the relationship of N ₁ >N ₂ >N ₃ can be established. .. By having the above-mentioned relationship among the adhesive force N ₁ , the adhesive force N ₂ , the adhesive force N ₃ , and the adhesive force N ₅ , it is possible to easily perform re-sticking and position adjustment again. On the other hand, in this specification, it is preferable that the adhesive force N ₂ ′ and the adhesive force N ₅ have a relationship of N ₂ ′<N ₅ after the adhesive force adjusting process, and the adhesive force N ₁ ′ and the adhesive force N ₂ ′, It is more preferable that the adhesive force N ₂ ′ is the smallest among the adhesive forces N ₃ and N ₅ . Further, the relationship of the adhesive force between the adhesive force N ₁ ′ and the adhesive force N ₃ or the adhesive force N ₅ is not particularly limited, but for example, the relationship of N ₃ ≧N ₁ ′, the relationship of N ₅ >N ₁ ′, and the like. Can have By having the above relationships before and after the adhesive force adjusting process, the position can be readjusted before the adhesive force adjusting process, and the first base material and the first adhesive layer can be changed after the adhesive force adjusting process. It is possible to peel at the same time.

Specific values of the adhesive force N ₃ and the adhesive force N ₅ are not particularly limited, and may have desired values depending on the material and type of the structure.

In this specification, the difference Δ(N ₅ −N ₂ ′) between the adhesive force N ₂ ′ and the adhesive force N ₅ is 0.1 N/25 mm or more regardless of the materials and types of the second layer and the structure. It is preferably in the range of 0.0 N/25 mm or less, and particularly preferably in the range of 0.5 N/25 mm or more and 2.0 N/25 mm or less. When Δ(N ₅ −N ₂ ′) is within the above range, peeling can be easily caused at the interface between the first adhesive layer and the structure during transfer. Δ(N ₅ −N ₂ ′) is obtained by transferring each of the first adhesive layer and the second adhesive layer to a PET substrate to form a PET/adhesive layer, measuring each adherend, and calculating the difference. To do. The measuring method and the measuring condition can be the same as the measuring method and the measuring condition of the adhesive force described in the section “A. First adhesive layer 2. Others”.

The present specification is applicable regardless of the use of the laminate of the present disclosure, but is particularly suitable as a specification when used as a laminate for cell pattern transfer. This is because if the first adhesive layer remains on the cell pattern, the cell function may be hindered.

(B) Second specification In the laminated body of the present specification, when the second layer is brought into contact with the surface of the second adhesive layer on the side opposite to the structure side, the first layer before the adhesive force adjustment treatment is performed. The adhesive force N ₁ between the adhesive layer and the first layer is equal to or more than the adhesive force N ₅ between the second adhesive layer and the second layer, and the first adhesive after the adhesive force adjusting process is performed. The adhesive force N ₁ ′ between the layer and the first layer is preferably lower than the adhesive force N ₅ between the second adhesive layer and the second layer.

7A to 7C are schematic diagrams illustrating another example of the step of transferring the structure to the second layer by using the second specification of the laminated body of the present disclosure, and the adhesive force adjustment process. An example of transferring the pattern portion 20 including the later first adhesive layer 2, the structure 3 and the second adhesive layer 4 to the second layer 11 is shown. Reference numerals not described in FIG. 7 are the same as those in FIGS. 1 to 6.

According to this specification, the adhesive force relationship between the first layer and the first adhesive layer and the adhesive force between the second adhesive layer and the second layer before and after the adhesive force adjusting process are provided. Then, the adhesive force adjustment process causes peeling between the first layer and the first adhesive layer, and the pattern portion including at least the structure can be collectively transferred to the second layer. The pattern portion transferred to the second layer has a second adhesive layer, a structure, and a first adhesive layer in this order from the second layer side, and the pattern portion has a pattern on the second layer. Are arranged in a shape. In this specification, since the first adhesive layer remains on the structure side, the first adhesive layer preferably has the same pattern as the structure.

In this specification, it is preferable that the adhesive force N ₁ and the adhesive force N ₅ have a relationship of N ₁ ≧N ₅ before the adhesive force adjustment process. In addition, before the adhesive force adjusting process, the magnitude relationship among the adhesive force N ₁ , the adhesive force N ₂ , and the adhesive force N ₃ is not particularly limited, but for example, N ₁ >N ₂ >N ₃ can be set. On the other hand, the present specification, after the adhesive force adjustment process, it is preferable that the adhesive strength _{N 1} 'and the bonding strength _{N 5} is _{N 1'} have a relation of _{<N 5,} the adhesive force _{N 1} ', the adhesive force _{N 2',} It is more preferable that the adhesive force N ₁ ′ is the smallest among the adhesive forces N ₃ and N ₅ . This is because only the first layer can be removed by having the above relationships before and after the adhesive force adjusting process.

The adhesive force N ₃ and the adhesive force N ₅ in this specification are the same as those in the first specification.

In this specification, the difference Δ(N ₅ −N ₁ ′) between the adhesive force N ₁ ′ and the adhesive force N ₅ is 0.1 N/25 mm or more regardless of the materials and types of the first layer and the second layer. The range is preferably 5.0 N/25 mm or less, and more preferably 0.5 N/25 mm or more and 2.0 N/25 mm or less. This is because when Δ(N ₅ −N ₁ ′) is within the above range, peeling can be easily caused at the interface between the first adhesive layer and the structure during transfer. The calculation method of Δ(N ₅ −N ₁ ′) can be the same as the calculation method of Δ(N ₅ −N ₂ ′).

This specification can be applied regardless of the use of the laminated body of the present disclosure, but is particularly suitable as a specification when used for manufacturing a recessed multilayer body. After transferring the structure to the second layer by using the laminate of the present disclosure, when the other layer is laminated on the structure, the other layer may be temporarily fixed by the adhesive force remaining in the first adhesive layer. Because you can.

(C) Others When the laminate according to the present specification has a release layer on the second adhesive layer, the adhesive force N ₁ , the adhesive force N ₂ , and the adhesive force N ₃ before the adhesive force adjusting process are the same as those of the second adhesive layer. It is preferably higher than the adhesive force N ₆ with the release layer.

F. Manufacturing Method The manufacturing method of the laminate of the present disclosure is not particularly limited and can be appropriately selected depending on the application. For example, the following method can be used.

(1) First Example A first example of the method for manufacturing a laminated body according to the present disclosure includes a first member having a first layer and a first adhesive layer, and a patterned structure disposed on the release layer. A method of bonding the second member and arranging the structure on the first adhesive layer can be mentioned.

Specifically, first, a first adhesive layer is formed on the first layer to obtain a first member. Further, the structure forming layer is arranged on the entire surface of the peeling layer to obtain the second member. The structure forming layer is patterned to form a structure, and the material of the structure forming layer is the same as that of the structure. Next, the structure-forming layer is patterned into a desired shape on the peeling layer to form a patterned structure. By laminating the surface of the second member opposite to the release layer side and the first adhesive layer of the first member, the laminated body of the present disclosure in which the patterned structure is arranged on the first adhesive layer is obtained. Obtainable. When the structure forming layer does not have adhesiveness, the second member has a structure in which the second adhesive layer and the structure forming layer are arranged in this order on the peeling layer, and the structure is formed on the peeling layer. After patterning the forming layer and the second adhesive layer into a desired shape, the first adhesive layer of the first member is attached.

As a method of forming the first adhesive layer, an adhesive composition containing the composition described in the above section “A. First adhesive layer” is applied to one surface of the first layer, and the solvent is removed. Can be formed. The specific coating method is not particularly limited, and for example, the method disclosed in JP-A-2015-108156 can be used. Alternatively, a commercially available tape containing the composition described in the section “A. First adhesive layer” may be used as the first adhesive layer, and the tape may be attached on the first layer. The second adhesive layer can also be formed on the release layer by the same method as the first adhesive layer.

The method for forming the structure-forming layer is not particularly limited and can be appropriately selected depending on the type of structure. For example, a method of applying the material of the structure on the release layer or the second adhesive layer can be used. The method of patterning the structure-forming layer can be appropriately selected according to the type of structure, and for example, a known method such as punching or half-cutting can be used. Areas other than the area to be the structure of the structure forming layer are removed by peeling.

In the example of the manufacturing method described above, the structure is formed by patterning the structure-forming layer arranged on the entire surface of the release layer, but the structure may be directly formed in a pattern on the release layer. .. The method for forming the structure on the release layer can be appropriately selected according to the type of the structure, and examples thereof include a printing method.

(2) Second Example As a second example of the method for manufacturing a laminated body of the present disclosure, a first adhesive layer is formed on the first layer, and the structure is directly formed in a pattern on the first adhesive layer. There is a method. The method for directly forming the structure on the first adhesive layer can be appropriately selected according to the type of the structure, and examples thereof include a printing method.

(3) Third Example As a third example of the method for manufacturing a laminated body of the present disclosure, as illustrated in FIG. 8, the first layer 1, the first adhesive layer 2, and the structure forming layer 3A are at least in this order. A method of forming a patterned structure 3 (FIG. 8B) by preparing the laminated body 50 laminated in FIG. 8 (FIG. 8A) and patterning at least the structure forming layer 3A is exemplified. .. The method for patterning the structure-forming layer can be the same as the method described in the first example of the manufacturing method. Moreover, when patterning the structure forming layer, the first adhesive layer may be patterned together.

(4) Fourth Example As a fourth example of the method for manufacturing a laminate of the present disclosure, a first release layer, a first adhesive layer, a structure-forming layer, and a second release layer are laminated in this order at least. A method of preparing a laminated body, patterning at least the first peeling layer, the first adhesive layer, and the structure-forming layer, and then peeling the first peeling layer to arrange the first layer can be mentioned. According to the method of 1, the pattern portion including the structure and the first adhesive layer can be formed in a pattern on the first layer. The patterning method may be the same as the method described in the first example of the manufacturing method.

G. Applications The laminate of the present disclosure can be used for various applications that require transfer of a patterned structure, depending on the function of the structure and the like. For example, the laminate of the present disclosure can be used as a transfer carrier sheet. Specifically, the laminate of the present disclosure has the first layer as a base material, the structure as a protective layer, a carrier film having a base material and a first adhesive layer, and a patterned protective layer. It can be used as a carrier sheet for transferring a protective layer. By using the laminate of the present disclosure as a protective layer transfer carrier sheet, a patterned protective layer can be transferred to a desired position on the second layer. The carrier sheet for transferring the protective layer can be preferably used for forming the recesses in the production of the multilayer body with the recesses. In particular, when the multi-layered body with recesses is a multi-layered wiring board with recesses, by transferring the protective layer to cover the surface of the other layer, the other layer can be protected from the chemical solution or the like. A method for manufacturing a recessed multilayer body using the laminated body of the present disclosure will be described later. The carrier sheet for transferring the protective layer can also be used as a masking material for masking desired positions of the second layer with the patterned protective layer.

The laminate of the present disclosure has, for example, a first layer as a base material, a structure as a cell sheet, a cell support layer having a base material and a first adhesive layer, and a patterned cell sheet. It can be a laminate for cell pattern transfer. By using the laminate of the present disclosure as a laminate for cell pattern transfer, a cell pattern can be easily and directly transferred to a second layer such as a cell culture substrate or a biological tissue regardless of shape or size. Further, by selecting the type of the first adhesive layer, it is possible to transfer the cells without destroying them.

II. Method for Producing Multilayer Body with Recesses The method for producing a multilayer body with recesses according to the present disclosure is a method for producing a multilayer body with recesses, which includes a recess having an opening on one surface of the multi-layer body, using the above-described laminate. A contact step of directly contacting the structure of the laminate with one surface of the second layer or indirectly through the second adhesive layer; and An adhesive force adjusting step of reducing the adhesive force, a transferring step of peeling at least the first layer and transferring a pattern portion including at least the structure to the second layer in a pattern, and the transferring of the second layer. A laminating step of laminating one or more other layers on the surface having the pattern portion, and a position where the pattern portion and the one or more other layers overlap the pattern portion and the pattern portion in a plan view. The method includes a partitioning step of partitioning into a first region including the other layer and a second region other than that, and a recess forming step of peeling and removing the first region to form the recess.

FIG. 9 is a process chart showing an example of a method for manufacturing a multilayer body with recesses of the present disclosure. The contact process, the adhesive force adjusting process, and the transfer process have been described with reference to FIGS. 3, 6, and 7, and therefore, illustration and description thereof will be omitted here. FIG. 3 shows a case where the structure of the laminate is directly brought into contact with one surface of the second layer in the contacting step, and FIGS. The case where the above-mentioned structure of the above-mentioned layered product is contacted indirectly to one side of a layer via the above-mentioned 2nd adhesion layer is shown. As shown in FIGS. 3, 6, and 7, the contacting step (FIG. 3A, FIG. 6A, FIG. 7A), the adhesive force adjusting step (FIG. 3B, FIG. b), FIG. 7B), and the transfer step (FIGS. 3C, 6C, and 7C), after the second layer 11 has the pattern portion 20 on the side having the pattern portion 20. One or more other layers 12 (12A to 12C) are laminated on the surface (FIG. 9A, laminating step). Subsequently, in the second layer 11, the pattern portion 20 and the one or more other layers 12A to 12C are located above the pattern portion 20 and the pattern portion 20 in a plan view. It divides into the 1st area|region 51 containing 12C and the 2nd area|region 52 other than that (FIG.9(b), partitioning process). Then, the first region 51 is peeled and removed to form the recess P (FIG. 9C, recess forming step). As a result, the multi-layered body 30 with concave portions is obtained.

For example, in a component mounting multilayer wiring board including a flexible printed wiring board (FPC), adoption of a structure in which a concave portion having an opening is provided on one surface of the multilayer wiring board and a component such as a chip is placed in the concave portion is advanced. (See Patent Document 2). According to the above structure, the electronic component, which has been conventionally mounted on the surface of the multilayer wiring board, can be mounted in the concave portion, so that it is possible to reduce the thickness and size of the entire component mounting multilayer wiring board. Becomes

Here, as a method of forming a recess in a multilayer body such as a multilayer wiring board, a cutting process using an end mill or a laser process is generally used. However, in these methods, since it is necessary to process each portion where the recess is desired to be provided, the recess cannot be easily provided, the formation position of the recess is deviated during processing, and the formation position of the recess is deviated. There are problems such as damage to the layers.

In order to solve such a problem, the inventors of the present invention, as a method of forming a recess in a multilayer wiring board, arrange a structure that triggers the peeling in the multilayer body when manufacturing the multilayer body, and The inventors have found a method of easily forming a concave portion at a desired position of a multilayer body by partitioning and peeling a region of the multilayer body that overlaps with the above in plan view by a half cut or the like. According to this method, it is presumed that it is possible to easily form the concave portion at the position of the divided area, and it is possible to suppress positional deviation during processing, damage to other layers, and the like.

However, in the above method, the structures must be arranged in accordance with the positions where the recesses are to be formed in the multilayer body, which not only complicates the arrangement work but also lowers the arrangement position accuracy. Further, since the above-mentioned structure is arranged in the multi-layer body and triggers peeling, it is required to be thin, flexible, and small in size. In particular, when the multilayer body is a multilayer wiring board, these requirements for the structure are increased. However, if such structures are individually arranged so as to form a pattern according to the position where the recess is formed, there is a problem that the arrangement work becomes more complicated because the handling is poor.

Further, as another method of disposing the structure in the multilayer body, the structure body is formed by patterning directly on the layer to be an adherend (the second layer in the method for manufacturing a recessed multilayer body of the present disclosure). Methods are also envisioned. However, there are problems that the number of steps is increased, and other layers are adversely affected depending on the patterning method.

Therefore, the present inventors have found that it is possible to arrange the structures in a pattern in the multilayer body by a simpler method by using the laminate described in the section “I. Laminate”. I found it. That is, when the adhesive force adjusting process is performed in a state where the second layer and the laminated body are in contact with each other, the adhesive force of the first adhesive layer of the laminated body is reduced and the pattern portion including the structure is easily formed. Can be peeled off. Therefore, regardless of the shape, thickness, size, etc. of the structure, the pattern portion can be collectively transferred in a pattern at a desired position of the second layer, and transfer accuracy can be improved. Then, by stacking another layer on the surface of the second layer on which the pattern portion is transferred, the pattern portion is arranged in a pattern inside the multilayer body, and the pattern portion is formed on the second layer. By partitioning the first region having, the first region can be peeled off and removed collectively from the pattern portion. This makes it possible to collectively form a pattern of concave portions having openings on one surface side of the multilayer body. At this time, since it is possible to partition the first region according to the position of the pattern portion, it is possible to enhance the accuracy of the formation position of the recess.
Hereinafter, each process of the manufacturing method of the multilayer body with a recess of the present disclosure will be described.

1. Contacting step The contacting step in the present disclosure is a step of directly contacting the one surface of the second layer with the structure of the laminate or indirectly through the second adhesive layer.

(1) Laminated body Since the laminated body used in this step has been described in detail in the above-mentioned "I. Laminated body", the description thereof is omitted here.

(2) Second Layer The second layer used in this step can be appropriately selected according to the intended multi-layered body with recesses, for example, the members exemplified in the above-mentioned “I. Can be mentioned. The second layer may have another layer in advance on the surface opposite to the laminate side. The other layers will be described later.

(3) Contact Method In this step, the patterned structure of the laminate is directly or indirectly contacted to one surface of the second layer through the second adhesive layer. When the structure of the laminated body has adhesiveness, the structure of the laminated body can be brought into direct contact with one surface of the second layer. When the laminated body has a second adhesive layer on the side opposite to the first adhesive layer side of the structure, the structure is provided on one surface of the second layer via the second adhesive layer. It can be contacted indirectly. The method of bringing the structure of the laminate into contact with one surface of the second layer is not particularly limited, and a general method can be used. For example, various methods such as a single-wafer method and a roll-to-roll method can be mentioned.

2. Adhesive force adjusting step The adhesive force adjusting step in the present disclosure is a step of reducing the adhesive force of the first adhesive layer by the adhesive force adjusting process.

The adhesive force adjusting process is performed to reduce the adhesive force of the first adhesive layer in the laminate. The adhesive force adjustment treatment can be selected according to the aspect of the first adhesive layer described in the above section "I. Laminated body". Hereinafter, the adhesive force adjustment process will be described for each mode of the first adhesive layer.

(1) In the case of the first adhesive layer of the first aspect When the first adhesive layer is the first aspect, that is, the temperature-sensitive adhesive layer, in this step, heat treatment or cooling treatment is performed as the adhesive force adjustment treatment. To do.

If the first adhesive layer of the present embodiment is a heat-peelable temperature-sensitive adhesive layer, the adhesive force of the first adhesive layer can be increased by performing a heat treatment of heating the first adhesive layer as an adhesive force adjusting treatment. Can be lowered. The heating temperature at this time may be a temperature equal to or higher than the switching temperature of the heat-peelable temperature-sensitive adhesive layer described above. Examples of the heating method for the heat-peelable temperature-sensitive adhesive layer include a heating method in an oven, a heating method on a hot plate, and a heating method using a spot heater. The heating time can be appropriately set such that the adhesive force of the first adhesive layer of the present embodiment after the heat treatment is within the range described in the above section "I. Laminated body". The conditions of the heat treatment are not particularly limited, but may be, for example, 60° C. for 10 minutes.

On the other hand, if the first adhesive layer of the present embodiment is a cooling peeling type temperature-sensitive adhesive layer, a cooling process for cooling the first adhesive layer is performed as the adhesive force adjusting process, whereby the first adhesive layer The adhesive strength can be reduced. The cooling temperature at this time may be a temperature equal to or lower than the switching temperature of the above-mentioned cooling peeling type temperature-sensitive adhesive layer. Examples of the cooling method of the cooling peeling type temperature-sensitive adhesive layer include a method of cooling by placing in a refrigerator and a method of cooling on a cooling plate. The cooling time can be appropriately set so that the adhesive force of the first adhesive layer of the present aspect after the cooling treatment is within the range described in the above section “I. Laminated body”. The condition of the cooling treatment is not particularly limited, but may be, for example, 5° C. for 20 minutes.

(2) In the case of the first adhesive layer of the second aspect When the first adhesive layer is the second aspect, that is, the energy ray responsive adhesive layer, in this step, the energy ray irradiation treatment is performed as the adhesive force adjustment treatment. To do. In this step, the adhesive force of the first adhesive layer can be reduced by irradiating the first adhesive layer with energy rays as the energy ray irradiation treatment.

The energy rays have been described in the above section “I. Laminated body”, and thus the description thereof is omitted here. The light source of energy rays is not particularly limited as long as it can emit light in a desired wavelength range. When ultraviolet rays are used as the energy rays, for example, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a carbon arc lamp, a metal halide lamp, a xenon lamp, a chemical lamp or the like which emits light in the wavelength range of 150 nm to 450 nm can be used. Moreover, the integrated light amount of the energy rays can be appropriately set so that the first adhesive layer of the present embodiment after the energy ray irradiation is within the range described in the above section "I. Laminated body".

The energy beam may be irradiated from the first layer side or the second layer side of the laminate after the contacting step. It is preferable to irradiate from the 1st layer side of the said laminated body especially. This is because it is possible to perform the energy ray irradiation process on the first layer regardless of whether or not the second layer is light transmissive.

(3) In the case of the first adhesive layer of the third aspect When the above-mentioned first adhesive layer is the third aspect, that is, an electrically responsive adhesive layer, in this step, an electric field applying treatment or an electric field-free treatment is performed as an adhesive force adjusting treatment. Perform processing.

If the first adhesive layer of the present aspect is an electrically peelable adhesive layer, an electric field applying process of applying an electric field to the first adhesive layer is performed as an adhesive force adjusting process to reduce the adhesive force of the first adhesive layer. be able to. The method of applying an electric field to the first adhesive layer is not particularly limited, but the method described in the above section "I. Laminated body" can be used. As the condition of the adhesive force adjusting treatment, for example, in the case of peeling by the electric field applying treatment, the applied electric field can be set within the range of 5 V to 50 V and within the range of 10 seconds to 120 seconds.
The magnitude and application time of the applied voltage that defines the magnitude of the electric field can be appropriately set so that the adhesive force of the first adhesive layer after application of the electric field has a desired value. The upper limit of the applied voltage and the upper limit of the application time are not particularly specified from the viewpoint of peeling, but are preferably set in consideration of the influence on the electric field application device and other layers.

On the other hand, if the first adhesive layer of the present aspect is an electric adhesive adhesive layer, a non-electric field treatment for stopping the application of an electric field to the first adhesive layer is performed as the adhesive force adjustment treatment to obtain the first adhesive layer. The adhesive strength of can be reduced.

3. Transfer Step The transfer step in the present disclosure is a step of peeling at least the first layer and transferring the pattern portion including at least the structure to the second layer in a pattern.

In this step, since the adhesive force of the first adhesive layer is reduced by the adhesive force adjusting step, peeling occurs at a desired laminated interface including the first layer in the laminated body in the laminated body. Thereby, the pattern portion including at least the structure can be collectively transferred in a pattern on the second layer.

The method for peeling at least the first layer from the laminate is not particularly limited as long as it can be peeled at a desired interface of the laminate, and may be manually peeled or mechanically peeled. May be. Specific peeling methods include a method of peeling by adsorption, a method of attaching an adhesive film and peeling by the adhesive force of the adhesive film, and the like.

In this step, the peeling interface by the adhesive force adjustment treatment can be determined according to the specifications of the laminated body, and the pattern portion having the layer structure corresponding to the peeling position can be collectively transferred to the second layer in a pattern. You can That is, if the above-mentioned laminated body has the first specification described in the above-mentioned section "I. Laminated body F. Other 2. Relationship between interlayer adhesive force", peeling occurs at the interface between the first adhesive layer and the structure. Then, the first layer and the first adhesive layer can be peeled off. At this time, the pattern portion transferred onto the second layer has the second adhesive layer and the structure in this order from the second layer side.
On the other hand, if the laminated body has the second specification described in the above section “I. Laminated body F. Other 2. Relationship between interlayer adhesive strength”, peeling occurs at the interface between the first layer and the first adhesive layer. Occurs and the first layer can be peeled off. At this time, the pattern portion transferred onto the second layer has a second adhesive layer, a structure, and a first adhesive layer in this order from the second layer side.

4. Laminating Step The laminating step in the present disclosure is a step of laminating one or more other layers on the surface of the second layer having the pattern portion.

By the transfer step, since the pattern portion including at least the structure is arranged in a pattern on one surface of the second layer, the other layer is laminated on the surface of the second layer on the side having the pattern portion. To be done. The other layer can be appropriately selected according to the type of the recessed multilayer body to be manufactured. For example, in the case of manufacturing a multi-layer wiring board with recesses using the method for manufacturing a multi-layer body with recesses of the present disclosure, a layer that constitutes the multi-layer wiring board is generally used as the other layer. Specific examples thereof include an insulating layer, a flexible wiring board, and a wiring board such as a rigid wiring board.

On the surface of the second layer on the side having the pattern portion, one or more of the other layers can be laminated, and the number of layers can be appropriately adjusted according to the intended recessed multilayer body. The method for laminating the other layers is not particularly limited, and for example, a coating method, a laminating method, or the like can be used for laminating. The other layer can be formed so as to cover the surface of the second layer and the surface of the pattern portion opposite to the second layer side. In the case of manufacturing a multi-layer wiring board with recesses, as a method for laminating the above-mentioned other layers, a method capable of establishing conduction can be used. In addition, the same lamination method as that used when the wiring board is formed into multiple layers can be used. When laminating, a cover lay, a prepreg, an interlayer adhesive layer, an insulating layer and the like can be laminated. The second layer may have one or more other layers laminated on the surface opposite to the surface having the pattern portion.

5. Partitioning Step In the partitioning step in the present disclosure, a first region including the pattern portion and the one or more other layers, the pattern portion and the other layer at a position overlapping the pattern portion in a plan view, and It is a step of partitioning into a second region other than the above. The pattern portion and the one or more other layers arranged on the surface of the second layer on the side having the pattern portion are divided into the first region and the second region in plan view. The respective regions are separated and independently exist on the second layer.

(1) Partitioning Method As a method of partitioning the pattern portion on the second layer and the one or more other layers, any method capable of partitioning the first region on the second layer, It may be a mechanical method or a chemical method.

As the mechanical method, for example, along the outer periphery of the pattern portion in a plan view, the pattern portion on the second layer and the one or more other layers are cut in the stacking direction (thickness direction), A half cut that divides the first region may be used. Specifically, half cutting can be performed by using a method of vertically moving an upper die having a cutter blade to cut, a method of cutting with a cylinder type rotary cutter, a method of performing heat treatment with a laser processing means, or the like. ..

As the chemical method, for example, along the outer periphery of the pattern portion in plan view, the pattern portion on the second layer and the one or more other layers are etched in the stacking direction (thickness direction), One example is half etching for partitioning the first region. Specifically, the outer peripheral shape of the pattern part is formed on the surface of the laminated body composed of the pattern part and the one or more other layers, which is arranged on the surface of the second layer having the pattern part. It is possible to form a resist pattern according to the above and perform half etching by a wet etching method or a dry etching method. After etching, the resist pattern is removed.

Among them, it is preferable to use a mechanical method as the partitioning method. This is because it is possible to partition the first region and the second region with high positional accuracy.

The pattern portion on the second layer and the one or more other layers are cut in the thickness (stacking) direction to be divided into a first region and a second region. A cutting line that divides and separates the laminated body into a first region and a second region is referred to as a dividing line.

In the partitioning step, the partition line partitioning the first region and the second region may be formed on the outer periphery of the pattern portion in plan view, as shown in FIG. As shown in FIG. 10(b), it may be formed outside the outer periphery of the pattern portion in plan view, and as shown in FIG. 10(c), it may be formed from the outer periphery of the pattern portion in plan view. May be formed inside. Further, the width of the partition line is not particularly limited, but may be formed to have a width that includes the inside and the outside of the outer periphery of the pattern portion in plan view, for example, as shown in FIG.
10A to 10D are explanatory views for explaining the position of the division line, the left diagram is a schematic plan view, and the right diagram is a sectional view taken along line XX of the left diagram. Moreover, in FIG. 10, the line L shows a division line.

The partition line may be continuous or may be discontinuous in a plan view depending on the partition method. Further, the demarcation line may be linear or non-linear in a plan view.

The partition line preferably penetrates the pattern portion and the other layer at a position overlapping the pattern portion in a plan view on the surface of the second layer on the side having the pattern portion. This is because the first region can be easily peeled and removed in the recess forming step described later, and a part of the first region can be less likely to remain on the surface of the second layer. The partition line may be formed in a part of the second layer.

The first region includes the pattern portion and the other layer located at a position overlapping the pattern portion in a plan view on the surface of the second layer on the side having the pattern portion. The plan view shape of the first region may be the same as the plan view shape of the pattern portion. The size of the first region in plan view may be larger, smaller, or the same as the size of the pattern portion in plan view depending on the position of the lane marking.

6. Recessed Part Forming Process The recessed part forming process in the present disclosure is a process of peeling and removing the first region to form the recessed part.

The first region can be separated from the structure as a starting point. Specifically, peeling occurs at the contact interface between the structure and the second layer. The method of peeling off the first region is not particularly limited, and examples thereof include a method of peeling by adsorption and a method of attaching an adhesive film and peeling by the adhesive force of the adhesive film.

When the first region is peeled and removed, a concave portion having an opening is formed on one surface of the multilayer body. The recesses are formed in a pattern on one surface of the multilayer body in a plan view. The size of the recess in plan view corresponds to the size of the first region in plan view.

7. Others The method for producing a multilayer body with recesses of the present disclosure can include any step in addition to the above steps. For example, when a recessed multilayer wiring board is manufactured using the method for manufacturing a recessed multilayer body of the present disclosure, steps such as a surface treatment step, an etching step, and a plating step can be included.

In the method for manufacturing a multilayer body with recesses of the present disclosure, a transfer step using the laminate described in the section "I. Laminate" may be further performed in the laminating step. This is because an arbitrary structure can be transferred and arranged between the laminated layers of the other layers.
In addition, in the method for manufacturing a recessed multilayer body of the present disclosure, the contact step, the adhesive force adjusting step, the transferring step, the laminating step, the partitioning step, and the recess forming step may be performed on both surfaces of the second layer, respectively. good. This is because it is possible to manufacture a multilayer body having concave portions on both surfaces of the second layer.

8. Recessed Multilayer Body The recessed multilayer body obtained by the method for producing a recessed multilayer body of the present disclosure can be used as, for example, a recessed multilayer wiring board depending on the types of the second layer and other layers. According to the method for manufacturing a multilayer body with concave portions of the present disclosure, since the concave portions can be formed easily and with high positional accuracy in the manufacturing process of the multilayer wiring board, a component-mounted multilayer wiring board having components mounted in the concave portions can be provided. can get.

III. Others The present disclosure includes the following technical matters.
(1) A laminated body having at least a first layer, a first adhesive layer, and a patterned structure in this order, and the first adhesive layer undergoes an adhesive force adjustment treatment to change its adhesive force.
(2) The laminate according to (1), wherein the first adhesive layer is a temperature-sensitive adhesive layer whose adhesive force is reduced by being subjected to a heating treatment or a cooling treatment as the adhesive force adjusting treatment.
(3) The layered product according to (1), wherein the first adhesive layer is an energy ray responsive adhesive layer that undergoes an energy ray irradiation treatment as the adhesive force adjustment treatment to reduce the adhesive force.
(4) The laminated body according to (1), wherein the first adhesive layer is an electrically responsive adhesive layer whose adhesive force is reduced by being subjected to an electric field application process or a no-electric field process as the adhesive force adjusting process.
(5) The laminated body according to any one of (1) to (4), wherein the structure has adhesiveness.
(6) The laminated body according to (1) to (4), which has a second adhesive layer having a composition different from that of the first adhesive layer on the side of the structure opposite to the first adhesive layer side. ..
(7) The laminated body according to any one of (1) to (6), wherein the first adhesive layer has the same pattern as the structure.
(8) Adhesion between the first adhesive layer and the structure before the adhesive force adjusting process when the second layer is brought into contact with the surface of the second adhesive layer opposite to the structure side The force is equal to or greater than the adhesive force between the second adhesive layer and the second layer, and the adhesive force between the first adhesive layer and the structure after the adhesive force adjusting process is the second adhesive layer. The laminate according to (6) or (7), which has a lower adhesive strength between the adhesive layer and the second layer.
(9) When the surface of the second adhesive layer on the side opposite to the structure side is brought into contact with the second layer, between the first adhesive layer and the first layer before the adhesive force adjusting process. The adhesive force is equal to or more than the adhesive force between the second adhesive layer and the second layer, and the adhesive force between the first adhesive layer and the first layer after the adhesive force adjustment process is The laminate according to (7), which has a lower adhesive strength between the second adhesive layer and the second layer.

(10) A method for producing a multi-layered body with recesses, comprising a recessed body having an opening on one surface of the multi-layered body, which uses the laminate according to any one of (6), (8) and (9), A contact step of directly contacting the structure of the laminated body with one surface of the second layer or indirectly through the second adhesive layer; and adhering the first adhesive layer by the adhesive force adjusting process. An adhesive force adjusting step of reducing a force, a transferring step of peeling at least the first layer and transferring a pattern portion including at least the structure to the second layer in a pattern, and the pattern of the second layer A laminating step of laminating one or more other layers on a surface having a portion, and the pattern portion and the one or more other layers in a position overlapping the pattern portion and the pattern portion in a plan view. A recess having a partitioning step of partitioning into a first area including another layer and a second area other than that, and a recess forming step of peeling and removing the first area to form the recess Of manufacturing a laminated multilayer body.
(11) The method for producing a multilayer body with recesses according to (10), wherein the multilayer body with recesses is a multilayer wiring board with recesses.
(12) A method for transferring a structure using the laminate according to (6) or (7), wherein the structure is transferred to a second layer, which is opposite to the structure side of the second adhesive layer. When the side surface and the second layer are brought into contact with each other, the adhesive force between the first adhesive layer and the structure before the adhesive force adjustment process is performed by the second adhesive layer and the second layer. The adhesive force between the first adhesive layer and the structure after the adhesive force adjustment treatment is greater than the adhesive force between the second adhesive layer and the second layer. Also low, the method of transferring the structure.
(13) A method of transferring a structure using the laminate according to (6), wherein the structure is transferred to a second layer, wherein the first adhesive layer has the same pattern as the structure. Adhesion between the first adhesive layer and the first layer before the adhesive force adjusting process when the surface of the second adhesive layer opposite to the structure side is brought into contact with the second layer The force is equal to or greater than the adhesive force between the second adhesive layer and the second layer, and the adhesive force between the first adhesive layer and the first layer after the adhesive force adjustment treatment is the first adhesive layer. 2 A method for transferring a structure, which has a lower adhesive strength between the adhesive layer and the second layer.

Hereinafter, the present disclosure will be described in more detail with reference to Examples and Comparative Examples.

[Example 1]
1. Preparation of Laminated Body A laminated body was prepared by the following method.

(1) Preparation of variable adhesive strength adhesive composition Acrylic adhesive (E-306, manufactured by E-Tech Co., Ltd.) 100 containing acrylic polymer (average molecular weight 650,000) and energy ray polymerized compound (average molecular weight 650,000) 60 parts by mass of urethane acrylate (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., trade name: UV-7600B) as an energy ray-polymerizable compound, and 2,4-diethylthioxanthone as a thioxanthone-based polymerization initiator (Nippon Kasei) Yaku Co., Ltd., trade name: KAYACURE DETX-S) 0.2 parts by mass, isocyanate-based crosslinking agent (crosslinking agent, Nippon Polyurethane Industry Co., Ltd. trade name: Coronate L, solid content: 75%) 1.6 Each part by mass was added and diluted to 25% with a mixed solvent of toluene and methyl ethyl ketone to prepare a variable adhesive strength adhesive composition.

(2) Preparation of Adhesive Sheet A A PET film (manufactured by Toyobo, trade name: E5100, thickness 50 μm) was used as the first layer, and the coating thickness after heat-drying the adhesive strength variable adhesive composition using an applicator. Of 10 μm was applied to the first layer and dried to form a first adhesive layer. Next, after laminating a silicone release treated surface of a light release PET separator (manufactured by Toyobo, trade name: E7006, thickness: 38 μm) having a silicone release treated surface on the exposed surface of the first adhesive layer, it was subjected to 3° C. at 40° C. An adhesive sheet A was obtained by carrying out curing for one day.

(3) Preparation of Structure Sheet A Using a heat-resistant masking tape (trade name: 7414, manufactured by 3M) having a polyimide film, an acrylic adhesive layer, and a release layer in this order, the polyimide film and the acrylic adhesive layer are halved in the thickness direction. After cutting and partitioning the polyimide film and the acrylic adhesive layer into a pattern, unnecessary parts were removed. As a result, a structure sheet A was obtained in which the patterned structure having the polyimide film and the acrylic pressure-sensitive adhesive layer was arranged on the release layer.

(4) Manufacture of Laminated Body A The light release PET separator of the adhesive sheet A is peeled off, and the exposed first adhesive layer and the polyimide film of the structure sheet A are bonded so that they are in contact with each other. A laminate A having one adhesive layer, a patterned structure (having a polyimide film and an acrylic adhesive layer in this order from the first adhesive layer side), and a release layer of the structure sheet A in this order was obtained.

2. Transfer of Structure Using a rolled copper foil (trade name: FCF-T5B-35 manufactured by Fukuda Metal) as the second layer, the light release PET separator of the laminate A is peeled off, and the exposed acrylic adhesive layer and the second layer And was irradiated with UV from the first layer side of the layered product A at 500 mJ/cm ² (i-line). By UV irradiation, the adhesive sheet A having the first adhesive layer and the first layer can be peeled from the interface between the first adhesive layer and the polyimide film, and the patterned structure having the polyimide film and the acrylic pressure-sensitive adhesive layer can be formed into the second structure. Could be transferred onto the layer.

[Example 2]
1. Preparation of Laminated Body A laminated body was prepared by the following method.

(1) Preparation of adhesive composition for second adhesive layer 100 parts by mass of acrylic copolymer (trade name: SK Dyne 1811L manufactured by Soken Chemical Co., Ltd.), and isocyanate-based curing agent (trade name: L-45 manufactured by Soken Chemical Industry Co., Ltd., solid) 45 wt%) 3 parts by mass were mixed to prepare an adhesive composition for the second adhesive layer.

(2) Preparation of Adhesive Sheet B On the silicone release-treated surface of the heavy release PET separator (manufactured by Toyobo, trade name: E7304, thickness 38 μm) having a silicone release-treated surface, the thickness after drying becomes 10 μm. The adhesive composition for the second adhesive layer was applied to the above using an applicator and then dried to form the second adhesive layer. Next, after laminating a silicone release treated surface of a light release type PET separator (manufactured by Toyobo, trade name: E7006, thickness 38 μm) having a silicone release treated surface on the exposed surface of the second adhesive layer, at 40° C. Curing was carried out for 3 days to obtain an adhesive sheet B having a second adhesive layer.

(3) Fabrication of Structure Sheet B The light release PET separator of the adhesive sheet B is peeled off and bonded to a polyimide film (product name: Kapton 200h manufactured by Toray-DuPont), and the polyimide film and the second adhesive layer are laminated in the thickness direction. After half-cutting into a pattern, unnecessary parts were removed. Thus, a structure sheet B was obtained in which the patterned structure having the polyimide film and the second adhesive layer was arranged on the heavy release PET separator.

(4) Manufacture of Laminated Body B The light release PET separator of the adhesive sheet A prepared in Example 1 is peeled off and attached so that the exposed surface of the first adhesive layer and the polyimide film of the structure sheet B are in contact with each other. Together, a laminated body B was obtained.

2. Transfer of Structure Using the same rolled copper foil as in Example 1 as the second layer, the heavy release PET separator of the laminate B was peeled off, the exposed second adhesive layer and the second layer were brought into contact, and laminated. UV irradiation was performed from the first layer side of the body B at 500 mJ/cm ² (i-line). By the UV irradiation, the adhesive sheet A having the first adhesive layer and the first layer can be peeled from the interface between the first adhesive layer and the polyimide film, and the patterned structure having the polyimide film and the second adhesive layer can be formed into the second structure. Could be transferred onto the layer.

[Example 3]
1. Preparation of Laminated Body A laminated body was prepared by the following method.

(1) Preparation of Adhesive Sheet C Using a heavy release PET separator having a silicone release treated surface (TOYOBO, trade name: 7304, thickness 50 μm) and using an applicator, the adhesive strength variable type prepared in Example 1 was used. The adhesive composition was applied on the silicone release-treated surface of the first layer so that the coating thickness after heating and drying was 10 μm, and dried to form the first adhesive layer. Next, after laminating a silicone release treated surface of a light release type PET separator having a silicone release treated surface (TOYOBO product name: E7006, thickness 38 μm) on the exposed surface of the first adhesive layer, at 40° C. Curing was carried out for 3 days to obtain an adhesive sheet C.

(2) Manufacture of Laminated Body C The light release PET separator of the adhesive sheet C is peeled off, and the exposed first adhesive layer and one surface of the polyimide film (trade name: Kapton 200h manufactured by Toray DuPont) are attached, Further, the heavy release PET separator of the adhesive sheet B produced in Example 2 was peeled off, and the exposed second adhesive layer and the other surface of the polyimide film were bonded together. Next, the adhesive sheet B, the polyimide film, and the first adhesive layer were half-cut in a pattern in the thickness direction, and then unnecessary portions were removed. As a result, the patterned structure having the light release PET separator of the adhesive sheet B, the second adhesive layer, the polyimide film, and the first adhesive layer in this order was arranged on the heavy release PET separator of the adhesive sheet A. A structure sheet C was obtained. Then, the light release PET separator on the side of the first adhesive layer was peeled off, and an OPP substrate was placed as a first layer on the exposed first adhesive layer to obtain a laminate C.

2. Transfer of Structure Using the same rolled copper foil as in Example 1 as the second layer, the light release PET separator of the laminate C was peeled off, the exposed second adhesive layer and the second layer were brought into contact with each other, and laminated. UV irradiation was performed from the first layer side of the body C at 500 mJ/cm ² (i-line). The UV irradiation makes it possible to peel off the first layer from the interface between the first layer and the first adhesive layer, and transfer the patterned structure having the first adhesive layer, the polyimide film and the second adhesive layer onto the second layer. We were able to.

1... 1st layer 2... 1st adhesive layer 3... Structural body 4... 2nd adhesive layer 10... Laminated body 11... 2nd layer 12, 12A, 12B, 12C... Other layer 20... Pattern part 30... Multilayer with a recessed part Body P... Recess

Claims (7)

At least a first layer, a first adhesive layer, and a patterned structure in this order,
A second adhesive layer having a composition different from that of the first adhesive layer, on a side opposite to the first adhesive layer side of the structure,
The first adhesive layer is a layer whose adhesive force changes in response to an adhesive force adjusting process,
The structure contains a resin,
A laminate, wherein the structure has no adhesiveness . The laminate according to claim 1, wherein the first adhesive layer is a temperature-sensitive adhesive layer whose adhesive force is reduced by being subjected to heat treatment or cooling treatment as the adhesive force adjusting treatment. The laminate according to claim 1, wherein the first adhesive layer is an energy-ray responsive adhesive layer whose adhesive force is reduced by receiving an energy ray irradiation process as the adhesive force adjusting process. The laminate according to claim 1, wherein the first adhesive layer is an electrically responsive adhesive layer whose adhesive force is reduced by receiving an electric field application process or a no-electric field process as the adhesive force adjustment process. The layered product according to any one of claims 1 to 4, wherein the first adhesive layer has the same pattern as the structure. A method for producing a multi-layered body with recesses, comprising a recessed body having an opening on one surface of the multi-layered body, which uses the layered product according to any one of claims 1 to 5 .
A contact step of indirectly contacting the one surface of the second layer with the structure of the laminate through the second adhesive layer;
An adhesive force adjusting step of reducing the adhesive force of the first adhesive layer by the adhesive force adjusting process;
A transfer step in which at least the first layer is peeled off, and a pattern portion including at least the structure is transferred to the second layer in a pattern.
A laminating step of laminating one or more other layers on the surface of the second layer on the side having the pattern portion;
The pattern part and the one or more other layers are divided into a first region including the pattern part and the other layer at a position overlapping with the pattern part in a plan view, and a second region other than the first region. Partitioning process,
A method of manufacturing a multi-layered body with recesses, which comprises a step of forming the recesses by peeling off the first region to form the recesses. The method for producing a multilayer body with recesses according to claim 6 , wherein the multilayer body with recesses is a multilayer wiring board with recesses.

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