TWI837847B - Circuit board and method of fabricating the same - Google Patents
Circuit board and method of fabricating the same Download PDFInfo
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Abstract
Description
本發明是關於一種電路板及其製造方法,特別是關於一種兼具散熱及電磁屏蔽的電路板及其製造方法。The present invention relates to a circuit board and a manufacturing method thereof, and in particular to a circuit board and a manufacturing method thereof having both heat dissipation and electromagnetic shielding.
近年來,電子設備的發展快速,多功能化、高線路密度及小型化是主要的研究方向。然而,隨著設備中電子元件密度的增加,電子設備產生的熱量也隨之增加,因此須提升電子設備的散熱效果。再者,例如智慧性手機等的各種具有射頻元件的產品會有電磁干擾而導致電路功能受影響,故還須處理電子設備的電磁屏蔽問題。In recent years, electronic equipment has developed rapidly, with multifunctionality, high circuit density and miniaturization being the main research directions. However, as the density of electronic components in the equipment increases, the heat generated by the electronic equipment also increases, so the heat dissipation effect of the electronic equipment must be improved. In addition, various products with RF components such as smart phones will have electromagnetic interference and affect the circuit function, so the electromagnetic shielding problem of electronic equipment must also be dealt with.
本發明的一態樣是提供一種電路板,其包含填充相變材料的彎折金屬板,以達到散熱及電磁屏蔽的效果。One aspect of the present invention is to provide a circuit board comprising a bent metal plate filled with a phase change material to achieve the effects of heat dissipation and electromagnetic shielding.
本發明的另一態樣是提供一種電路板的製造方法。Another aspect of the present invention is to provide a method for manufacturing a circuit board.
根據本發明的一態樣,提供一種電路板,其包含第一基板、設置在第一基板上的第二基板、設置在第一基板及第二基板之間的介電層及設置在介電層中的彎折金屬板。第一基板包含第一線路層,且第二基板包含第二線路層。彎折金屬板包含第一U型板及第二U型板,所述第一U型板包含下底板、第一外側板及第二外側板,所述第二U型板包含上底板、第一內側板及第二內側板。所述第一內側板連接所述第一外側板,所述第二內側板連接所述第二外側板。所述第一U型板及所述第二U型板之間具有空腔。電路板還包含填充於空腔內的相變材料及設置在上底板上且在第一內側板及第二內側板之間的電子元件。According to one aspect of the present invention, a circuit board is provided, which includes a first substrate, a second substrate disposed on the first substrate, a dielectric layer disposed between the first substrate and the second substrate, and a bent metal plate disposed in the dielectric layer. The first substrate includes a first circuit layer, and the second substrate includes a second circuit layer. The bent metal plate includes a first U-shaped plate and a second U-shaped plate, the first U-shaped plate includes a lower base plate, a first outer side plate and a second outer side plate, and the second U-shaped plate includes an upper base plate, a first inner side plate and a second inner side plate. The first inner side plate is connected to the first outer side plate, and the second inner side plate is connected to the second outer side plate. There is a cavity between the first U-shaped plate and the second U-shaped plate. The circuit board also includes a phase change material filled in the cavity and an electronic component disposed on the upper base plate and between the first inner side plate and the second inner side plate.
根據本發明的一實施例,上述電路板還包含第一導熱黏接層,其設置在第一基板的第一線路層及彎折金屬板之間。According to an embodiment of the present invention, the circuit board further includes a first thermally conductive adhesive layer disposed between the first circuit layer of the first substrate and the bent metal plate.
根據本發明的一實施例,上述電路板還包含第二導熱黏接層,其設置在彎折金屬板及電子元件之間。According to an embodiment of the present invention, the circuit board further comprises a second thermally conductive adhesive layer disposed between the bent metal plate and the electronic component.
根據本發明的一實施例,上述電路板還包含多個導電盲孔,其自第二線路層延伸至電子元件。According to an embodiment of the present invention, the circuit board further includes a plurality of conductive blind vias extending from the second circuit layer to the electronic components.
根據本發明的一實施例,上述電路板還包含至少一個導電通孔,其自第二線路層延伸至第一線路層。According to an embodiment of the present invention, the circuit board further includes at least one conductive via extending from the second circuit layer to the first circuit layer.
根據本發明的一實施例,所述電子元件與所述彎折金屬板的第一內側板及第二內側板之間形成間隙,且介電層填入所述間隙中。According to an embodiment of the present invention, a gap is formed between the electronic component and the first inner plate and the second inner plate of the bent metal plate, and a dielectric layer is filled in the gap.
根據本發明的一實施例,所述電子元件直接接觸所述彎折金屬板的第一內側板及第二內側板。According to an embodiment of the present invention, the electronic component directly contacts the first inner plate and the second inner plate of the bent metal plate.
根據本發明的另一態樣,提供一種電路板的製造方法,方法包含提供下基板,其中下基板包含第一基材層及在第一基材層下方的第一金屬層;移除部分第一基材層,以形成暴露出部分第一金屬層的凹槽;形成彎折金屬板在所述凹槽上,其中所述彎折金屬板包含第一U型板及第二U型板,所述第一U型板包含下底板、第一外側板及第二外側板,所述第二U型板包含上底板、第一內側板及第二內側板。所述第一內側板連接所述第一外側板,所述第二內側板連接所述第二外側板。所述第一U型板及所述第二U型板之間具有空腔,且相變材料填充於彎折金屬板的空腔內;放置電子元件在彎折金屬板的上底板上且在所述第一內側板及所述第二內側板之間;形成上基板在所述電子元件上方,其中所述上基板包含第二基材層及在所述第二基材層上方的第二金屬層;以及圖案化第一金屬層及第二金屬層,以分別形成多個線路層。According to another aspect of the present invention, a method for manufacturing a circuit board is provided, the method comprising providing a lower substrate, wherein the lower substrate comprises a first substrate layer and a first metal layer below the first substrate layer; removing a portion of the first substrate layer to form a groove exposing a portion of the first metal layer; forming a bent metal plate on the groove, wherein the bent metal plate comprises a first U-shaped plate and a second U-shaped plate, the first U-shaped plate comprises a lower bottom plate, a first outer side plate and a second outer side plate, the second U-shaped plate comprises an upper bottom plate, a first inner side plate and a second inner side plate. The first inner side plate is connected to the first outer side plate, and the second inner side plate is connected to the second outer side plate. There is a cavity between the first U-shaped plate and the second U-shaped plate, and a phase change material is filled in the cavity of the bent metal plate; an electronic component is placed on the upper base plate of the bent metal plate and between the first inner plate and the second inner plate; an upper substrate is formed above the electronic component, wherein the upper substrate includes a second substrate layer and a second metal layer above the second substrate layer; and the first metal layer and the second metal layer are patterned to form multiple circuit layers respectively.
根據本發明的一實施例,形成所述彎折金屬板在所述凹槽上的步驟還包含形成第一導熱黏接層在凹槽內;以及貼合所述彎折金屬板在第一導熱黏接層上。According to an embodiment of the present invention, the step of forming the bent metal plate on the groove further includes forming a first thermally conductive adhesive layer in the groove; and laminating the bent metal plate on the first thermally conductive adhesive layer.
根據本發明的一實施例,放置所述電子元件的步驟還包含形成第二導熱黏接層在所述彎折金屬板的所述上底板上;以及放置電子元件在第二導熱黏接層上。According to one embodiment of the present invention, the step of placing the electronic component further includes forming a second thermally conductive adhesive layer on the upper base plate of the bent metal plate; and placing the electronic component on the second thermally conductive adhesive layer.
根據本發明的一實施例,形成所述上基板在所述電子元件上方的步驟還包含形成介電層在所述下基板及所述上基板之間。According to an embodiment of the present invention, the step of forming the upper substrate above the electronic element further includes forming a dielectric layer between the lower substrate and the upper substrate.
根據本發明的一實施例,在形成所述線路層之前,上述方法還包含形成多個導電盲孔,其中所述導電盲孔自所述上基板延伸至所述電子元件。According to an embodiment of the present invention, before forming the circuit layer, the method further comprises forming a plurality of conductive blind vias, wherein the conductive blind vias extend from the upper substrate to the electronic element.
根據本發明的一實施例,在形成所述線路層之前,上述方法還包含形成至少一個導電通孔,其中所述導電通孔自所述上基板延伸至所述下基板。According to an embodiment of the present invention, before forming the circuit layer, the method further comprises forming at least one conductive via, wherein the conductive via extends from the upper substrate to the lower substrate.
根據本發明的一實施例,形成所述彎折金屬板的步驟包含彎折第一金屬板成所述第一U型板,其中所述第一U型板具有凹陷區域;填充所述相變材料至所述凹陷區域中;連接第二金屬板與所述第一U型板,其中所述第二金屬板覆蓋所述相變材料;以及彎折所述第二金屬板成所述第二U型板,以使所述相變材料密封於所述第一U型板及所述第二U型板之間。According to one embodiment of the present invention, the step of forming the bent metal plate includes bending the first metal plate into the first U-shaped plate, wherein the first U-shaped plate has a recessed area; filling the phase change material into the recessed area; connecting the second metal plate and the first U-shaped plate, wherein the second metal plate covers the phase change material; and bending the second metal plate into the second U-shaped plate so that the phase change material is sealed between the first U-shaped plate and the second U-shaped plate.
應用本發明的電路板及其製造方法,利用相變材料填充於彎折金屬板內的空腔中,並將電子元件設置在彎折金屬板的上底板上且在第一內側板及第二內側板之間,以同時達到散熱及電磁屏蔽的效果。By applying the circuit board and the manufacturing method thereof of the present invention, the cavity in the bent metal plate is filled with phase change material, and the electronic components are arranged on the upper base plate of the bent metal plate and between the first inner plate and the second inner plate, so as to achieve the effects of heat dissipation and electromagnetic shielding at the same time.
本發明提供許多不同實施例或例示,以實施發明的不同特徵。以下敘述的組件和配置方式的特定例示是為了簡化本發明。這些當然僅是做為例示,其目的不在構成限制。舉例而言,第一特徵形成在第二特徵的上或上方的描述包含第一特徵和第二特徵有直接接觸的實施例,也包含有其他特徵形成在第一特徵和第二特徵之間,以致第一特徵和第二特徵沒有直接接觸的實施例。除此之外,本發明在各種具體例中重覆元件符號及/或字母。此重覆的目的是為了使說明簡化且清晰,並不表示各種討論的實施例及/或配置之間有關係。The present invention provides many different embodiments or examples to implement different features of the invention. The specific examples of components and configurations described below are intended to simplify the present invention. These are of course only examples and are not intended to be limiting. For example, a description of a first feature formed on or above a second feature includes embodiments in which the first feature and the second feature are in direct contact, and also includes embodiments in which other features are formed between the first feature and the second feature, so that the first feature and the second feature are not in direct contact. In addition, the present invention repeats component symbols and/or letters in various specific examples. The purpose of this repetition is to simplify and clarify the description and does not represent a relationship between the various discussed embodiments and/or configurations.
再者,空間相對性用語,例如「下方(beneath)」、「在…之下(below)」、「低於(lower)」、「在…之上(above)」、「高於(upper)」等,是為了易於描述圖式中所繪示的零件或特徵和其他零件或特徵的關係。空間相對性用語除了圖式中所描繪的方向外,還包含元件在使用或操作時的不同方向。裝置可以其他方式定向(旋轉90度或在其他方向),而本發明所用的空間相對性描述也可以如此解讀。Furthermore, spatially relative terms, such as "beneath," "below," "lower," "above," "upper," etc., are used to facilitate description of the relationship of a part or feature to other parts or features depicted in the drawings. Spatially relative terms include different orientations of the component when in use or operation in addition to the orientation depicted in the drawings. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used in the present invention can be interpreted in this manner.
在習知的電路板中,電磁屏蔽及散熱的功能須分別設置不同的元件來達成,然而其通常會存在製作成本高、產品良率不佳或電磁屏蔽效果不佳等的問題。因此,本發明提供一種電路板及其製造方法,其利用將相變材料(phase change material,PCM)填充於彎折金屬板內的空腔中,並將電子元件設置在彎折金屬板的上底板上且在第一內側板及第二內側板之間,以同時達到散熱及電磁屏蔽的效果。In conventional circuit boards, electromagnetic shielding and heat dissipation functions must be achieved by separately setting different components, but they usually have problems such as high manufacturing cost, poor product yield or poor electromagnetic shielding effect. Therefore, the present invention provides a circuit board and a manufacturing method thereof, which utilizes phase change material (PCM) to fill the cavity in the bent metal plate, and sets the electronic components on the upper base plate of the bent metal plate and between the first inner plate and the second inner plate to achieve the effects of heat dissipation and electromagnetic shielding at the same time.
請參閱圖1,其繪示根據本發明一些實施例的電路板100的剖面視圖。電路板100包含第一基板110及在第一基板110上的第二基板120。在一些實施例中,第一基板110包含第一基材層102及第一線路層104,且第二基板120包含第二基材層112及第二線路層114。電路板100還包含設置在第一基板110及第二基板120之間的介電層130。Please refer to FIG. 1, which shows a cross-sectional view of a
電路板100包含在介電層130中的彎折金屬板140。彎折金屬板140包含第一U型板210及第二U型板235。第一U型板210包含下底板202、第一外側板204及第二外側板206,而第二U型板235包含上底板232、第一內側板234及第二內側板236。第一內側板234連接第一外側板204,且第二內側板236連接第二外側板206。第一U型板210主要是用來支撐彎折金屬板140的結構,而第二U型板235則是用來承載電子元件160(以下說明)。在一些實施例中,彎折金屬板140包含具有機械強度、可塑性及高導熱性的材料,例如銅板、鋁板、鐵板或合金。彎折金屬板140具有在第一U型板210及第二U型板235之間的空腔,且相變材料150填充於此空腔內。在一些實施例中,相變材料150為固-液轉換的相變材料。在一些具體例中,相變材料150可為石蠟(C
nH
2n+2,其中n為20至40)、無機鹽水合物(例如磷酸二鈉鹽十二水合物、硝酸鈣四水合物及乙酸鈉三水合物)及脂肪酸(例如月桂酸及肉豆蔻酸)等。
The
在一些實施例中,可選擇性地設置第一導熱黏接層135在第一基板110的凹槽(圖未標示)中,以使彎折金屬板140設置在第一導熱黏接層135上。換言之,第一導熱黏接層135是在第一線路層104及彎折金屬板140的下底板202之間。在一些實施例中,第一導熱黏接層135可為高導熱矽膠、環氧樹脂或丙烯酸樹脂。In some embodiments, the first thermally conductive
電路板100還包含設置在彎折金屬板140的上底板232上且在第一內側板234及第二內側板236之間的電子元件160。因此,第一內側板234及第二內側板236之間的距離須根據所要放置的電子元件160的尺寸而調整。利用彎折金屬板140包圍電子元件160可防止電子元件160受到電磁波的干擾,以達到電磁屏蔽的效果。再者,由於彎折金屬板140內部填充的相變材料150,故電子元件160在運作過程中產生的熱量可有效地傳遞出去。在一些實施例中,電子元件160與彎折金屬板140的第一內側板234及第二內側板236之間分別具有填充介電層130的間隙10,如圖1所示,即電子元件160不接觸彎折金屬板140的第一內側板234及/或第二內側板236。在另一些實施例中,電子元件160的側邊可直接接觸彎折金屬板140的第一內側板234及/或第二內側板236。The
在一些實施例中,可選擇性地設置第二導熱黏接層165在彎折金屬板140的上底板232上,以使電子元件160放置在第二導熱黏接層165上,而第二導熱黏接層165能將電子元件160黏合在上底板232上。在一些實施例中,第二導熱黏接層165可為高導熱矽膠、環氧樹脂或丙烯酸樹脂。第一導熱黏接層135及第二導熱黏接層165的設置皆有助於電路板100的散熱。In some embodiments, the second thermally conductive
在一些實施例中,電路板100可選擇性地包含多個導電盲孔170及/或至少一個導電通孔180。導電盲孔170可為自第二線路層114延伸至電子元件160。導電通孔180可為自第二線路層114延伸至第一線路層104。導電盲孔170及導電通孔180的設置亦可幫助電路板100的散熱。In some embodiments, the
請參閱圖2A至圖2D,其繪示根據一些實施例的填充相變材料150的彎折金屬板140的製造過程中間階段的剖面視圖。首先,請參閱圖2A,將第一金屬板彎折成第一U型板210,以使第一U型板210包含下底板202、第一外側板204及第二外側板206,下底板202是連接在第一外側板204及第二外側板206之間,並形成凹陷區域R1。2A to 2D illustrate cross-sectional views of intermediate stages of the manufacturing process of the
接著,如圖2B所示,填充相變材料150至凹陷區域R1中,而這時候的相變材料150為固態,以避免在彎折金屬板140的製造過程中流失相變材料150。然後,請參閱圖2C,在第一U型板210的第一外側板204及第二外側板206的頂部分別填加焊料220,再將第二金屬板230利用焊料220連接在第一U型板210上。因此,第二金屬板230會覆蓋在相變材料150上。
Next, as shown in FIG. 2B , the
接著,請參閱圖2D,彎折第二金屬板230成第二U型板235,同時使相變材料150的形狀變為U型,而密封於第一U型板210及第二U型板235之間。相似於第一U型板210,第二U型板235亦包含上底板232、第一內側板234及第二內側板236,且上底板232連接在第一內側板234及第二內側板236之間。再者,第一內側板234連接第一外側板204,第二內側板236連接第二外側板206。換言之,相變材料150是分布於下底板202及上底板232之間、第一外側板204及第一內側板234之間及第二外側板206及第二內側板236之間。圖2D中的第一U型板210及第二U型板235即共同形成圖1中的彎折金屬板140。
Next, referring to FIG. 2D , the
請參閱圖3A至圖3G,其繪示根據本發明一些實施例的電路板100的製造方法的中間階段的剖面視圖。首先,請參閱圖3A,提供下基板310。下基板310包含第一基材層102及第一金屬層304,其中第一金屬層304在第一基材層102下方。在一些實施例中,下基板310為單面覆銅基板。接著,請參閱圖3B,移除部分的第一基材層102,以形成凹槽R2,其中凹槽R2會暴露出部分的第一金屬層304。Please refer to FIG. 3A to FIG. 3G, which are cross-sectional views of the intermediate stages of the manufacturing method of the
請參閱圖3C,將如圖2D所製得的填充相變材料150的彎折金屬板140放置在凹槽R2(參照圖3B)上。在一些實施例中,可先形成第一導熱黏接層135在凹槽R2(參照圖3B)上,再將圖2D的彎折金屬板140貼合在第一導熱黏接層135上,以幫助電路板100的散熱。在一些實施例中,第一導熱黏接層135可為高導熱矽膠、環氧樹脂或丙烯酸樹脂。彎折金屬板140的上底板232、第一內側板234及第二內側板236可形成凹槽R3。Referring to FIG. 3C , the
請參閱圖3D,放置電子元件160在凹槽R3(參照圖3C)中,即在彎折金屬板140的上底板232上且在第一內側板234及第二內側板236之間,故電子元件160是被三面環繞,進而可達到電磁屏蔽的效果。在一些實施例中,可先形成第二導熱黏接層165在凹槽R3(參照圖3C)的上底板232上,再將電子元件160放置在第二導熱黏接層165上,以幫助電子元件160的散熱。在一些實施例中,第二導熱黏接層165可為高導熱矽膠、環氧樹脂或丙烯酸樹脂。Please refer to FIG. 3D , the
請參閱圖3E,形成介電層130在下基板310及電子元件160上,再壓合上基板320在介電層130及電子元件160上。換言之,介電層130是設置在上基板320及下基板310之間。上基板320包含第二基材層112及第二金屬層314。在一些實施例中,上基板320為單面覆銅板。藉此,電子元件160內埋於介電層130中,而不須另外進行開槽的步驟。Referring to FIG. 3E , a
請參閱圖3F,進行鑽孔操作,以形成開口O1自上基板320延伸至暴露出電子元件160,以及形成貫孔V1自上基板320延伸至下基板310。圖3F僅繪示形成兩個開口O1及一個貫孔V1,但本發明並不限制開口O1及貫孔V1的數量,故可根據後續應用而形成不同數量的開口O1及貫孔V1。Referring to FIG. 3F , a drilling operation is performed to form an opening O1 extending from the
請參閱圖3G,填充導電材料至開口O1及貫孔V1(參閱圖3F)中,以分別形成導電盲孔170及導電通孔180。在一些實施例中,導電盲孔170及導電通孔180可利用電鍍或化學鍍的方式形成。如上所述,導電盲孔170及導電通孔180的數量可隨後續應用而調整。導電盲孔170自第二金屬層314延伸至電子元件160,以使電子元件160產生的熱量可快速的散失。接著,分別圖案化第一金屬層304及第二金屬層314,以分別形成第一線路層104及第二線路層114。如此,即可製得圖1所示的電路板100。Please refer to FIG. 3G , and fill the opening O1 and the through hole V1 (see FIG. 3F ) with conductive material to form a conductive blind via 170 and a conductive through
應用本發明提供的電路板及其製造方法,利用將相變材料填充於彎折金屬板內的空腔中,並將電子元件設置在彎折金屬板的上底板上且在第一內側板及第二內側板之間,不僅可省略開槽的步驟,即使電子元件內埋於電路板中,更可同時達到散熱及電磁屏蔽的效果。再者,填充相變材料的彎折金屬板製造流程簡單,且可節省材料,以降低成本。By applying the circuit board and the manufacturing method thereof provided by the present invention, the phase change material is filled in the cavity in the bent metal plate, and the electronic components are arranged on the upper bottom plate of the bent metal plate and between the first inner plate and the second inner plate, not only the slotting step can be omitted, but also the heat dissipation and electromagnetic shielding effects can be achieved at the same time even if the electronic components are buried in the circuit board. Furthermore, the manufacturing process of the bent metal plate filled with phase change material is simple, and materials can be saved to reduce costs.
雖然本發明已以數個實施例揭露如上,然其並非用以限定本發明,在本發明所屬技術領域中任何具有通常知識者,在不脫離本發明的精神和範圍內,當可作各種的更動與潤飾,因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with several embodiments, they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the scope of the attached patent application.
10:間隙 100:電路板 102:第一基材層 104:第一線路層 110:第一基板 112:第二基材層 114:第二線路層 120:第二基板 130:介電層 135:第一導熱黏接層 140:彎折金屬板 150:相變材料 160:電子元件 165:第二導熱黏接層 170:導電盲孔 180:導電通孔 202:下底板 204:第一外側板 206:第二外側板 210:第一U型板 220:焊料 230:第二金屬板 232:上底板 234:第一內側板 235:第二U型板 236:第二內側板 304:第一金屬層 310:下基板 314:第二金屬層 320:上基板 O1:開口 R1:凹陷區域 R2:凹槽 R3:凹槽 V1:貫孔 10: gap 100: circuit board 102: first substrate layer 104: first circuit layer 110: first substrate 112: second substrate layer 114: second circuit layer 120: second substrate 130: dielectric layer 135: first thermal conductive adhesive layer 140: bent metal plate 150: phase change material 160: electronic component 165: second thermal conductive adhesive layer 170: conductive blind hole 180: conductive through hole 202: lower base plate 204: first outer plate 206: second outer plate 210: first U-shaped plate 220: solder 230: second metal plate 232: upper base plate 234: first inner plate 235: Second U-shaped plate 236: Second inner plate 304: First metal layer 310: Lower substrate 314: Second metal layer 320: Upper substrate O1: Opening R1: Recessed area R2: Groove R3: Groove V1: Through hole
根據以下詳細說明並配合附圖閱讀,使本發明的態樣獲致較佳的理解。需注意的是,如同業界的標準作法,許多特徵並不是按照比例繪示的。事實上,為了進行清楚討論,許多特徵的尺寸可以經過任意縮放。 [圖1]繪示根據本發明一些實施例的電路板的剖面視圖。 [圖2A]至[圖2D] 繪示根據本發明一些實施例的填充相變材料的彎折金屬板的製造過程中間階段的剖面視圖。 [圖3A]至[圖3G]繪示根據本發明一些實施例的電路板的製造方法的中間階段的剖面視圖。 The present invention is best understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, as is standard practice in the industry, many features are not drawn to scale. In fact, for the sake of clarity of discussion, the dimensions of many features may be arbitrarily scaled. [FIG. 1] shows a cross-sectional view of a circuit board according to some embodiments of the present invention. [FIG. 2A] to [FIG. 2D] show cross-sectional views of intermediate stages in the manufacturing process of a bent metal plate filled with a phase change material according to some embodiments of the present invention. [FIG. 3A] to [FIG. 3G] show cross-sectional views of intermediate stages in the manufacturing method of a circuit board according to some embodiments of the present invention.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None
10:間隙 100:電路板 102:第一基材層 104:第一線路層 110:第一基板 112:第二基材層 114:第二線路層 120:第二基板 130:介電層 135:第一導熱黏接層 140:彎折金屬板 150:相變材料 160:電子元件 165:第二導熱黏接層 170:導電盲孔 180:導電通孔 202:下底板 204:第一外側板 206:第二外側板 210:第一U型板 232:上底板 234:第一內側板 235:第二U型板 236:第二內側板 10: gap 100: circuit board 102: first base material layer 104: first circuit layer 110: first substrate 112: second base material layer 114: second circuit layer 120: second substrate 130: dielectric layer 135: first thermal conductive adhesive layer 140: bent metal plate 150: phase change material 160: electronic component 165: second thermal conductive adhesive layer 170: conductive blind hole 180: conductive through hole 202: lower base plate 204: first outer side plate 206: second outer side plate 210: first U-shaped plate 232: upper base plate 234: first inner side plate 235: second U-shaped plate 236: Second medial plate
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20020149298A1 (en) * | 1995-06-30 | 2002-10-17 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
TWI710312B (en) * | 2020-02-12 | 2020-11-11 | 亞洲電材股份有限公司 | High-frequency covering film with electromagnetic shielding function and preparing methods thereof |
EP3430877B1 (en) * | 2016-05-04 | 2021-11-10 | Samsung Electronics Co., Ltd. | Hollow shielding structure for different types of circuit elements and manufacturing method thereof |
CN114698228A (en) * | 2020-12-29 | 2022-07-01 | 恩智浦美国有限公司 | Circuit module with front side interposer end and through module heat dissipation structure |
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2022
- 2022-09-23 CN CN202211164440.1A patent/CN117769108A/en active Pending
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Publication number | Priority date | Publication date | Assignee | Title |
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US20020149298A1 (en) * | 1995-06-30 | 2002-10-17 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
EP3430877B1 (en) * | 2016-05-04 | 2021-11-10 | Samsung Electronics Co., Ltd. | Hollow shielding structure for different types of circuit elements and manufacturing method thereof |
TWI710312B (en) * | 2020-02-12 | 2020-11-11 | 亞洲電材股份有限公司 | High-frequency covering film with electromagnetic shielding function and preparing methods thereof |
CN114698228A (en) * | 2020-12-29 | 2022-07-01 | 恩智浦美国有限公司 | Circuit module with front side interposer end and through module heat dissipation structure |
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