TWI836246B - Laser additive manufacturing equipment and laser additive manufacturing method - Google Patents
Laser additive manufacturing equipment and laser additive manufacturing method Download PDFInfo
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- 238000003475 lamination Methods 0.000 claims description 33
- 239000002105 nanoparticle Substances 0.000 claims description 26
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- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
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Abstract
Description
本發明係關於一種積層製造設備及積層製造方法,更特別的是關於一種高精密度、速度快且低耗能的雷射積層製造設備及雷射積層製造方法。 The present invention relates to a multilayer manufacturing device and a multilayer manufacturing method, and more particularly to a high-precision, high-speed and low-energy laser multilayer manufacturing device and a laser multilayer manufacturing method.
傳統以液相為基礎的雷射直接積層製造方法僅可運用在塑膠上,其做法一般是使用對光敏感的光固化膠,以光造形術(Stereolithography,SLA)或光聚合反應成形(Direct Light Processing,DLP)的方式照光固化,因此,可以做出精密的積層製造物件。但是,在金屬或其他材質方面,只能採用金屬(或相應材質)粉末,運用高能量逐層燒結來製作積層物件。使用粉末的設計,除了限制積層物件的精密度之外,高功率的雷射導致用電成本須高昂,並且還限制了積層製造的速度。 The traditional liquid-based laser direct layering manufacturing method can only be applied to plastics. The method generally uses light-sensitive photocurable glue and cures it by light using stereolithography (SLA) or direct light processing (DLP). Therefore, precise layered manufacturing objects can be made. However, in terms of metal or other materials, only metal (or corresponding material) powder can be used to produce layered objects by high-energy layer-by-layer sintering. In addition to limiting the precision of layered objects, the design using powders also leads to high electricity costs due to high-power lasers, and also limits the speed of layered manufacturing.
因此,為解決習知的雷射積層技術的種種問題,本發明提出一種高精密度、速度快且低耗能的雷射積層製造設備及雷射積層製造方法。 Therefore, in order to solve various problems of conventional laser lamination technology, the present invention proposes a high-precision, fast and low-energy-consuming laser lamination manufacturing equipment and laser lamination manufacturing method.
為達上述目的及其他目的,本發明提出一種雷射積層製造設備,其包含:一載板;一雷射構件,該雷射構件所發射之雷射光朝向該載板;一移動構件,連接該載板;以及一控制構件,訊號連接該雷射構件及該移動構 件,該控制構件控制該移動構件調整該載板在一前驅物溶液中的高度位置,並選擇性地根據該高度位置調整該雷射光與該載板在水平面上的相對位置。 To achieve the above and other purposes, the present invention provides a laser lamination manufacturing device, which includes: a carrier; a laser component, the laser light emitted by the laser component is directed toward the carrier; a moving component connected to the carrier; and a control component, the signal connecting the laser component and the moving component, the control component controls the moving component to adjust the height position of the carrier in a precursor solution, and selectively adjusts the relative position of the laser light and the carrier on the horizontal plane according to the height position.
於本發明之一實施例中,該載板相對該雷射光的波長為透明。 In one embodiment of the present invention, the carrier plate is transparent relative to the wavelength of the laser light.
於本發明之一實施例中,該雷射構件為雷射直寫裝置。 In one embodiment of the present invention, the laser component is a laser direct writing device.
於本發明之一實施例中,雷射構件為雷射陣列裝置。 In one embodiment of the invention, the laser component is a laser array device.
於本發明之一實施例中,該雷射構件初始將該雷射光聚焦於該載板的上表面,該控制構件將該載板自該前驅物溶液的表面位置朝向該前驅物溶液的底部位置移動。 In one embodiment of the present invention, the laser component initially focuses the laser light on the upper surface of the carrier, and the control component moves the carrier from the surface position of the precursor solution toward the bottom position of the precursor solution.
於本發明之一實施例中,該雷射構件初始將該雷射光聚焦於該載板的下表面,該控制構件將該載板自該前驅物溶液的底部位置朝向該前驅物溶液的表面位置移動。 In one embodiment of the present invention, the laser component initially focuses the laser light on the lower surface of the carrier plate, and the control component moves the carrier plate from the bottom position of the precursor solution toward the surface position of the precursor solution Move.
本發明又提出一種雷射積層製造方法,用以製造一指定材料之積層物件,雷射積層製造方法包括以下步驟:提供受熱後可形成該指定材料之前驅物溶液;提供該指定材料之奈米顆粒並分佈於該前驅物溶液中;設置一載板於該前驅物溶液中;以一雷射構件朝向該載板發射雷射光,以使首先位於該載板之表面之該奈米顆粒將該雷射光之光能轉換為熱能,其中該雷射光之波長至少為以下其中一種:該奈米顆粒的金屬表面電漿子之吸收波長、半導體的光吸收之吸收波長、奈米顆粒材料之吸收波長;該奈米顆粒產生之熱能使局部之該前驅物溶液反應產生該指定材料之沉積;調整該載板於該前驅物溶液中的高度位置,以使足量的該奈米顆粒位於該雷射構件之聚焦深度;以及選擇性地調整該雷射光與該載板在水平面上的相對位置。 The present invention also provides a laser lamination manufacturing method for manufacturing a laminated object of a specified material. The laser lamination manufacturing method includes the following steps: providing a precursor solution that can form the specified material after being heated; providing nanoparticles of the specified material and distributing them in the precursor solution; placing a carrier in the precursor solution; emitting laser light toward the carrier with a laser component, so that the nanoparticles first located on the surface of the carrier convert the light energy of the laser light into heat energy, wherein the laser light The wavelength is at least one of the following: the absorption wavelength of the metal surface plasmon of the nanoparticle, the absorption wavelength of the light absorption of the semiconductor, and the absorption wavelength of the nanoparticle material; the heat energy generated by the nanoparticle causes the local precursor solution to react to produce the deposition of the specified material; the height position of the carrier in the precursor solution is adjusted so that a sufficient amount of the nanoparticles are located at the focal depth of the laser component; and the relative position of the laser light and the carrier on the horizontal plane is selectively adjusted.
於本發明之一實施例中,其中於該雷射構件初始將該雷射光聚焦於該載板的上表面,則調整該載板自該前驅物溶液的表面位置朝向該前驅物溶液的底部位置移動。 In one embodiment of the present invention, when the laser component initially focuses the laser light on the upper surface of the carrier, the carrier is adjusted to move from the surface position of the precursor solution toward the bottom position of the precursor solution.
於本發明之一實施例中,其中於該雷射構件初始將該雷射光聚焦於該載板的下表面,則調整該載板自該前驅物溶液的底部位置朝向該前驅物溶液的表面位置移動。 In one embodiment of the present invention, when the laser component initially focuses the laser light on the lower surface of the carrier, the carrier is adjusted to move from the bottom position of the precursor solution toward the surface position of the precursor solution.
本發明的雷射積層製造設備及雷射積層製造方法利用前驅物溶液搭配指定材料之奈米顆粒,照射雷射光產生雷射積層之積層物件,使包含金屬、陶瓷等材料在內的雷射積層技術成為可能,並且同時達成低耗能、快速、成本低且高精密度、高解析度的實用需求。 The laser lamination manufacturing equipment and laser lamination manufacturing method of the present invention utilizes a precursor solution with nanoparticles of a specified material, and irradiates laser light to produce a laser-laminated object, making laser lamination technology including materials such as metals and ceramics possible, and at the same time achieving practical requirements of low energy consumption, rapidity, low cost, high precision, and high resolution.
100:雷射積層製造設備 100: Laser laminated manufacturing equipment
100a:雷射積層製造設備 100a: Laser laminated manufacturing equipment
100b:雷射積層製造設備 100b: Laser lamination manufacturing equipment
1:容器 1: Container
2:雷射構件 2:Laser component
21:透鏡 21: Lens
22:雷射產生元件 22: Laser generating element
2a:雷射構件 2a:Laser component
3:載板 3: Carrier board
31:上表面 31: Upper surface
32:下表面 32: Lower surface
4:移動構件 4: Moving components
5:控制構件 5:Control components
L:前驅物溶液 L: Precursor solution
N:奈米顆粒 N:Nanoparticles
P:圖樣 P:Pattern
S:積層物件 S: Layered object
S101~S107:步驟 S101~S107: Steps
圖1係為根據本發明第一實施例之雷射積層製造設備之示意圖。 FIG. 1 is a schematic diagram of a laser lamination manufacturing equipment according to the first embodiment of the present invention.
圖2係為根據本發明第一實施例之雷射直寫裝置之示意圖。 Figure 2 is a schematic diagram of a laser direct writing device according to the first embodiment of the present invention.
圖3係為根據本發明第一實施例之雷射積層製造設備之移動示意圖。 Figure 3 is a schematic diagram of the movement of the laser lamination manufacturing equipment according to the first embodiment of the present invention.
圖4係為根據本發明第一實施例之雷射積層之操作示意圖。 FIG. 4 is a schematic diagram of the operation of laser lamination according to the first embodiment of the present invention.
圖5係為根據本發明第二實施例之雷射積層製造設備之示意圖。 FIG. 5 is a schematic diagram of a laser lamination manufacturing equipment according to a second embodiment of the present invention.
圖6係為根據本發明第三實施例之雷射積層製造設備之示意圖。 Figure 6 is a schematic diagram of a laser lamination manufacturing device according to the third embodiment of the present invention.
圖7係為奈米銀粒子之吸收光譜圖。 Figure 7 is the absorption spectrum of silver nanoparticles.
圖8係為根據本發明實施例之雷射積層製造方法之流程圖。 FIG. 8 is a flow chart of a laser lamination manufacturing method according to an embodiment of the present invention.
為充分瞭解本發明,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明。本領域技術人員可由本說明書所公開的內容瞭解本發明的目的、特徵及功效。須注意的是,本發明可透過其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明的精神下進行各種修飾與變更。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的申請專利範圍。說明如後: In order to fully understand the present invention, the present invention is described in detail through the following specific embodiments and the accompanying drawings. Those skilled in the art can understand the purpose, features and effects of the present invention from the contents disclosed in this specification. It should be noted that the present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the patentable scope of the present invention. The description is as follows:
本發明之雷射積層製造方法,採用照射雷射光後可以局部反應形成所需材質(金屬、陶瓷、染色塑膠)的前驅物溶液,以此製造雷射積層物。目前,此種作法最大的問題在於,若欲以雷射局部加熱前驅溶液,由於溶液本身的散熱與對流速度相當快,事實上除非雷射到達極高的能量,不然很難達到局部反應的目的;然則,太高溫的反應容易產生氣泡,且往往需要提高前驅物溶液的黏度以減低對流的問題。黏稠的前驅物溶液,容易使雷射積層製造帶來參與反應離子分布不均勻的問題,換句話說,即喪失精準度(解析度)及實用性。 The laser laminated manufacturing method of the present invention uses a precursor solution that can react locally to form the required material (metal, ceramic, dyed plastic) after irradiation with laser light, thereby manufacturing the laser laminated product. At present, the biggest problem with this method is that if you want to use laser to locally heat the precursor solution, since the heat dissipation and convection speed of the solution itself is very fast, in fact, unless the laser reaches extremely high energy, it will be difficult to achieve the purpose of local reaction. ; However, reactions that are too high are prone to bubbles, and it is often necessary to increase the viscosity of the precursor solution to reduce convection problems. The viscous precursor solution can easily lead to uneven distribution of ions participating in the reaction during laser lamination manufacturing. In other words, the accuracy (resolution) and practicality will be lost.
因此,為解決上述的採用前驅物溶液的雷射積層製造的多種問題,本發明提出一種高精密度、速度快且低耗能的雷射積層製造設備及雷射積層製造方法。 Therefore, in order to solve the above-mentioned various problems of laser lamination manufacturing using precursor solution, the present invention proposes a high-precision, high-speed and low-energy laser lamination manufacturing equipment and laser lamination manufacturing method.
如圖1至圖4所示,本發明第一實施例之雷射積層製造設備100,其包含:一雷射構件2、一載板3、一移動構件4及一控制構件5。
As shown in FIGS. 1 to 4 , the laser
配合圖8,以下將說明如何採用本發明第一實施例之雷射積層製造設備100執行本發明之雷射積層製造方法,以製造一指定材料之積層物件S。
In conjunction with FIG8 , the following will describe how to use the laser
於步驟s101,首先在容器1中提供受熱後可形成前述指定材料之前驅物溶液L。前驅物溶液L可視需要而加以改變成分。例如需要積層銅金屬的積層物件,便使用受熱後能析出銅金屬的前驅物溶液。前述析出不限定為化學反應或物理反應。在本實施例中,指定材料為銀金屬,以硝酸銀粉末(AgNO3)及聚乙烯吡咯烷酮((C6H9NO)n)的乙二醇(HOCH2-CH2OH)溶液作為前驅物溶液L。然而本發明不限於此。 In step s101, a precursor solution L that can form the aforementioned specified material after being heated is first provided in the container 1. The composition of the precursor solution L can be changed as needed. For example, for laminated objects that require copper metal to be laminated, a precursor solution that can precipitate copper metal when heated is used. The aforementioned precipitation is not limited to a chemical reaction or a physical reaction. In this embodiment, the specified material is silver metal, and silver nitrate powder (AgNO 3 ) and polyvinylpyrrolidone ((C 6 H 9 NO) n ) in ethylene glycol (HOCH 2 -CH 2 OH) solution are used as precursor solutions L. However, the present invention is not limited to this.
接著,於步驟S102,提供指定材料之奈米顆粒N並分佈於前驅物溶液中。在本實施例中,銀金屬之奈米顆粒N可經由前述的前驅物溶液L中所含之硝酸銀粉末加以處理。例如將前述的前驅物溶液L加以加熱、攪拌數小時以形成銀金屬之奈米顆粒N。然而在其他實施例中,也可以外部添加銀金屬之奈米顆粒N至前驅物溶液L中。且本發明不限於此,可經尤其它物理或化學手段使前驅物溶液L中含有指定材料之奈米顆粒N。 Next, in step S102, nanoparticles N of specified material are provided and distributed in the precursor solution. In this embodiment, the silver metal nanoparticles N can be processed by the silver nitrate powder contained in the precursor solution L. For example, the aforementioned precursor solution L is heated and stirred for several hours to form silver metal nanoparticles N. However, in other embodiments, silver metal nanoparticles N can also be added externally to the precursor solution L. And the present invention is not limited thereto, and the precursor solution L can be made to contain the nanoparticles N of the specified material through other physical or chemical means.
接著,於步驟S103,設置載板3於前驅物溶液L中。如圖1所示,若雷射構件2所發射之雷射光係朝向載板3的上表面31時,較佳地載板3設置於前驅物溶液L中的淺層處,即靠近前驅物溶液L的表面。前驅物溶液L需至少淹沒上表面31。
Next, in step S103, the
接著,於步驟S104,以雷射構件2朝向載板3發射雷射光,以使首先位於載板3之表面(本實施例中為上表面31)之奈米顆粒N將雷射光之光能轉換為熱能。其中雷射光之波長至少為以下其中一種:奈米顆粒N的金屬表面電漿子之吸收波長;若指定材料為半導體時,可為半導體的光吸收之吸收波長
(例如本徵吸收、激子吸收、晶格振動吸收、雜質吸收及自由載流子吸收);或各種奈米顆粒材料所對應之吸收波長,此吸收波長可為吸收光譜中的波峰之波長,也可以為波峰附近的一定範圍的相對吸收較佳的波長。如圖7所示,顯示銀金屬之奈米顆粒N的數個吸收波峰。其中短波長的能量大,耗能高且容易造成設備損毀;300nm之處亦有一個波峰,載板3(本實施例為玻璃材質)會吸收300nm的波長,故本實施例的雷射構件2選擇450nm的藍光雷射。然而本發明不限於此,亦可以選擇其他有利波段,當指定材料非銀金屬時,雷射光之波長也需相應地選擇適合者。
Next, in step S104, the
指定材料例如是:金、銀、銅、鉛、錫等具有表面電漿吸收波長之材料,並選擇匹配對應的雷射光波長。也可以是半導體、陶瓷(例如6A族的氧化物)等材料甚至是染色塑膠。任何具有能將光能高效率轉換成熱能的奈米顆粒都適用於本發明之雷射積層製造方法。 The designated materials are, for example, gold, silver, copper, lead, tin, etc., which have surface plasma absorption wavelengths, and the corresponding laser light wavelengths are selected. It can also be semiconductors, ceramics (such as oxides of the 6A group), and even dyed plastics. Any nanoparticles that can efficiently convert light energy into heat energy are suitable for the laser lamination manufacturing method of the present invention.
在本實施例中,如圖1及圖2所示,雷射構件2為雷射直寫裝置,包含透鏡21及雷射產生元件22。雷射產生元件22所發出的雷射光經由透鏡21聚焦於載板3的上表面31。
In this embodiment, as shown in FIG. 1 and FIG. 2 , the
在步驟S104中,位於載板3的上表面31的奈米顆粒N受到雷射光的激發,將光能轉換成熱能,其所產生之熱能在接下來的步驟S105中使局部(即靠近上表面31的照光點附近)之前驅物溶液L反應產生指定材料之沉積。如圖2所示,由於雷射構件2為雷射直寫裝置,其光束匯聚成一個點,故雷射構件2可沿著載板3所預設的圖樣P移動,而形成第一層積層。其中,該移動為雷射構件2與載板3之間的相對移動,可透過移動雷射構件2或載板3的至少其中一者而達成。
In step S104, the nanoparticles N located on the
接著於步驟S106,由於載板3初始靠近前驅物溶液L的淺層位置,已耗盡附近相當質量的銀金屬形成積層,等待銀金屬慢慢擴散顯然來不及。若要快速補充上表面31附近的待沉積銀金屬,則調整載板3於前驅物溶液L中的高度位置(在本實施例中為使其下降,自前驅物溶液L的表面位置朝向底部位置移動),以使足量的奈米顆粒N位於雷射構件2之聚焦深度。如圖3及圖4所示,移動構件4連接載板3,控制構件5訊號連接雷射構件2及移動構件4,控制構件5調整載板3在前驅物溶液L中的高度位置,以補充待沉積的銀金屬。在這個實施例中,若移動構件4移動載板3的速度等同於銀金屬沉積生成的速度,則雷射構件2無須改變聚焦位置,隨著載板3的下移,繼續在前一層雷射積層沉積物上投射雷射光,而形成新一層的雷射積層。移動構件4可為步進馬達、伺服馬達等可提供動力之裝置。控制構件5例如是控制晶片或控制電路。
Then, in step S106, since the
如圖4所示,在步驟S107中,控制構件5根據載板3的高度位置選擇性地調整雷射構件2與載板3在水平面(相對高度方向)上的相對位置,以使新生成的積層與前一層積層相連但部分位移,而形成非單純柱狀的立體積層物件S。若不移動雷射構件2與載板3在水平面上的相對位置,而每一層積層都只是重複如圖2所示的同一個圖樣P,則會形成截面一致的柱狀物。然而生成截面一致的柱狀物有更多種成本低廉快速的方法可達成,故本方法的優勢在於生成柱狀體以外的積層物件S。
As shown in Figure 4, in step S107, the
綜上所述,本發明的雷射積層製造設備100及雷射積層製造方法利用前驅物溶液L搭配指定材料之奈米顆粒N,照射雷射光產生雷射積層之積層物件S,使包含金屬、陶瓷等材料在內的雷射積層技術成為可能,並且同時達成低耗能、快速、成本低且高精密度、高解析度的實用需求。
To sum up, the laser
進一步地,在本實施例中,載板3相對雷射光的波長為透明。亦即,載板3不會吸收雷射光而產生熱能。載板3若產生熱能可能會導致銀金屬不預期地沉積在非預定之位置,因而導致形成之積層物件S的精密度、解析度不佳。
Furthermore, in this embodiment, the
進一步地,本發明又提出第二實施例。第二實施例的雷射積層製造設備100a與第一實施例的雷射積層製造設備100的差異在於,雷射構件2a為雷射陣列裝置。雷射陣列裝置同時包含多個透鏡及多個雷射產生元件,可同時投射陣列之雷射圖案於載板3。相對於第一實施例的雷射直寫裝置,本實施例的雷射陣列裝置其生成積層物件S之效率更佳,唯雷射陣列裝置較為昂貴。
Furthermore, the present invention proposes a second embodiment. The difference between the laser
進一步地,如圖6所示,在本發明第三實施例中,第三實施例的雷射積層製造設備100b與第一實施例的雷射積層製造設備100的差異在於,雷射構件2自載板3的下方投射雷射光並聚焦於載板3的下表面32。其中光路可經由反射、折射等多種方式改變調整,雷射構件2未必一定要在載板3的下方,然而最終光路為雷射聚焦於載板3的下表面32。此時載板3較佳地為在前驅物溶液L的底部位置,控制構件5控制移動構件4移動載板3,使載板3自前驅物溶液L的底部位置朝向表面位置移動。其移動的原理、方式與第一實施例相同,積層物件S自載板3的下表面32朝下生長。此實施例較適用於高度不高之積層物件S,避免生成積層時,金屬受到重力影響而斷裂。
Furthermore, as shown in FIG6 , in the third embodiment of the present invention, the difference between the laser
本發明在上文中已以實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。 The present invention has been disclosed in the above by way of an embodiment, but those familiar with the present technology should understand that the embodiment is only used to describe the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to the embodiment should be included in the scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined by the patent application.
100:雷射積層製造設備 100: Laser laminated manufacturing equipment
1:容器 1:Container
2:雷射構件 2:Laser component
21:透鏡 21:Lens
22:雷射產生元件 22:Laser generating element
3:載板 3: Carrier board
31:上表面 31: Upper surface
4:移動構件 4: Moving components
5:控制構件 5:Control components
L:前驅物溶液 L: Precursor solution
N:奈米顆粒 N: nanoparticles
S:積層物件 S: Layered object
Claims (3)
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US20210145116A1 (en) | 2019-11-19 | 2021-05-20 | Nike, Inc. | Methods of manufacturing articles having foam particles |
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