TWI834923B - Polylactic acid resin composition and application thereof - Google Patents
Polylactic acid resin composition and application thereof Download PDFInfo
- Publication number
- TWI834923B TWI834923B TW109135629A TW109135629A TWI834923B TW I834923 B TWI834923 B TW I834923B TW 109135629 A TW109135629 A TW 109135629A TW 109135629 A TW109135629 A TW 109135629A TW I834923 B TWI834923 B TW I834923B
- Authority
- TW
- Taiwan
- Prior art keywords
- content
- resin composition
- polylactic acid
- less
- acid resin
- Prior art date
Links
- 239000004626 polylactic acid Substances 0.000 title claims abstract description 89
- 229920000747 poly(lactic acid) Polymers 0.000 title claims abstract description 87
- 239000011342 resin composition Substances 0.000 title claims abstract description 43
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 48
- 239000004917 carbon fiber Substances 0.000 claims abstract description 48
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000006229 carbon black Substances 0.000 claims abstract description 43
- 239000007822 coupling agent Substances 0.000 claims abstract description 27
- 239000002667 nucleating agent Substances 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- -1 ester derivative of citric acid Chemical class 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 3
- 150000001413 amino acids Chemical class 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 229910052914 metal silicate Inorganic materials 0.000 claims description 2
- 229920001308 poly(aminoacid) Polymers 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims 1
- 235000019241 carbon black Nutrition 0.000 description 34
- 230000000052 comparative effect Effects 0.000 description 29
- 239000000203 mixture Substances 0.000 description 23
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 20
- 239000000047 product Substances 0.000 description 14
- 239000000945 filler Substances 0.000 description 12
- 239000002216 antistatic agent Substances 0.000 description 11
- 239000004310 lactic acid Substances 0.000 description 10
- 235000014655 lactic acid Nutrition 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- QNAYBMKLOCPYGJ-UHFFFAOYSA-N D-alpha-Ala Natural products CC([NH3+])C([O-])=O QNAYBMKLOCPYGJ-UHFFFAOYSA-N 0.000 description 6
- QNAYBMKLOCPYGJ-UWTATZPHSA-N L-Alanine Natural products C[C@@H](N)C(O)=O QNAYBMKLOCPYGJ-UWTATZPHSA-N 0.000 description 6
- 229960003767 alanine Drugs 0.000 description 6
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- UQDJGEHQDNVPGU-UHFFFAOYSA-N serine phosphoethanolamine Chemical compound [NH3+]CCOP([O-])(=O)OCC([NH3+])C([O-])=O UQDJGEHQDNVPGU-UHFFFAOYSA-N 0.000 description 4
- 208000034530 PLAA-associated neurodevelopmental disease Diseases 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920001955 polyphenylene ether Polymers 0.000 description 3
- 230000002195 synergetic effect Effects 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-REOHCLBHSA-N L-lactic acid Chemical compound C[C@H](O)C(O)=O JVTAAEKCZFNVCJ-REOHCLBHSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- KSILMCDYDAKOJD-UHFFFAOYSA-N 2-aminoisoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(N)C(=O)C2=C1 KSILMCDYDAKOJD-UHFFFAOYSA-N 0.000 description 1
- RGMMREBHCYXQMA-UHFFFAOYSA-N 2-hydroxyheptanoic acid Chemical compound CCCCCC(O)C(O)=O RGMMREBHCYXQMA-UHFFFAOYSA-N 0.000 description 1
- NYHNVHGFPZAZGA-UHFFFAOYSA-N 2-hydroxyhexanoic acid Chemical compound CCCCC(O)C(O)=O NYHNVHGFPZAZGA-UHFFFAOYSA-N 0.000 description 1
- JRHWHSJDIILJAT-UHFFFAOYSA-N 2-hydroxypentanoic acid Chemical compound CCCC(O)C(O)=O JRHWHSJDIILJAT-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- SJZRECIVHVDYJC-UHFFFAOYSA-N 4-hydroxybutyric acid Chemical compound OCCCC(O)=O SJZRECIVHVDYJC-UHFFFAOYSA-N 0.000 description 1
- QZCLKYGREBVARF-UHFFFAOYSA-N Acetyl tributyl citrate Chemical compound CCCCOC(=O)CC(C(=O)OCCCC)(OC(C)=O)CC(=O)OCCCC QZCLKYGREBVARF-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002261 Corn starch Polymers 0.000 description 1
- 229930182843 D-Lactic acid Natural products 0.000 description 1
- JVTAAEKCZFNVCJ-UWTATZPHSA-N D-lactic acid Chemical compound C[C@@H](O)C(O)=O JVTAAEKCZFNVCJ-UWTATZPHSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 125000003412 L-alanyl group Chemical group [H]N([H])[C@@](C([H])([H])[H])(C(=O)[*])[H] 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 229940024606 amino acid Drugs 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000008120 corn starch Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229940022769 d- lactic acid Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- JJTUDXZGHPGLLC-UHFFFAOYSA-N lactide Chemical compound CC1OC(=O)C(C)OC1=O JJTUDXZGHPGLLC-UHFFFAOYSA-N 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 108010094020 polyglycine Proteins 0.000 description 1
- 229920000232 polyglycine polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本發明係關於一種可生物降解之聚乳酸樹脂組合物及其應用,特別是一種包含上述聚乳酸樹脂組合物之電子件托盤。The present invention relates to a biodegradable polylactic acid resin composition and its application, in particular to an electronic component tray containing the above polylactic acid resin composition.
近年來,鑒於全球暖化問題,由天然植物作為原料而形成之塑膠正受到關注。聚乳酸(Polylactic Acid, PLA)樹脂可生物降解且可由諸如玉米澱粉的可再生資源獲得,因此是一種環境友善的聚合物。然而,公認PLA樹脂具有較差物理性質,諸如:低耐熱性、較差表面電阻值及較差的機械性質。另一方面,PLA樹脂展現低結晶速率及低結晶度,使得由PLA形成之產物可能無法具有足夠的熱變形溫度(Heat Deflection Temperature, HDT)及衝擊強度。因此難以使用PLA樹脂作為抗靜電材料及/或工業用之托盤。In recent years, in view of global warming issues, plastics made from natural plants are attracting attention. Polylactic Acid (PLA) resin is biodegradable and can be obtained from renewable resources such as corn starch, making it an environmentally friendly polymer. However, it is recognized that PLA resin has poor physical properties, such as low heat resistance, poor surface resistance and poor mechanical properties. On the other hand, PLA resin exhibits low crystallization rate and low crystallinity, so that products formed from PLA may not have sufficient heat deflection temperature (HDT) and impact strength. Therefore, it is difficult to use PLA resin as antistatic material and/or industrial pallets.
電子件托盤,例如積體電路(Intergrated Circuit, IC)托盤,可用於容納、處理及輸送IC封裝。對於用於例如回焊等製造過程及IC裝運的適合IC托盤而言,需要若干特定性質,例如HDT、衝擊強度及表面電阻值及其他性質。目前,仍需要一種具有所需性質的環境友善的IC托盤。典型IC托盤主要由聚苯醚(polyphenylene ether, PPE)形成,聚苯醚(PPE)為石油化學產物且在正常環境中不可生物降解。PPE類IC托盤在燃燒之後可釋放溫室氣體並對環境造成破壞。因此,需要一種具有高HDT、高衝擊強度及低表面電阻值之環境友善的IC托盤。Electronic component trays, such as integrated circuit (IC) trays, can be used to accommodate, handle and transport IC packages. For a suitable IC pallet for use in manufacturing processes such as resoldering and IC shipping, several specific properties are required, such as HDT, impact strength and surface resistance values, among other properties. Currently, there is still a need for an environmentally friendly IC tray with desired properties. Typical IC trays are mainly made of polyphenylene ether (PPE), which is a petrochemical product and is not biodegradable in normal environments. PPE IC pallets can release greenhouse gases and cause damage to the environment after burning. Therefore, there is a need for an environmentally friendly IC tray with high HDT, high impact strength and low surface resistance.
在一些實施例中,本發明提供一種聚乳酸樹脂組合物,其包含聚乳酸樹脂、碳纖維、碳黑、成核劑及偶合劑。其中,(a) 聚乳酸樹脂含量介於75-95wt%;(b)碳纖維含量介於2-9wt%;(c)碳黑含量介於0-9wt%;(d)成核劑含量介於0.001-5wt%;以及(e)偶合劑含量介於0.001-5wt%,其中所述含量係以組份(a)、(b)、(c)、(d)及(e)總重量為100wt%計。In some embodiments, the present invention provides a polylactic acid resin composition, which includes polylactic acid resin, carbon fiber, carbon black, nucleating agent and coupling agent. Among them, (a) the polylactic acid resin content is between 75-95wt%; (b) the carbon fiber content is between 2-9wt%; (c) the carbon black content is between 0-9wt%; (d) the nucleating agent content is between 0.001-5wt%; and (e) the coupling agent content is between 0.001-5wt%, wherein the content is based on the total weight of components (a), (b), (c), (d) and (e) being 100wt % calculation.
在一些實施例中,本發明進一步提供一種供用於電子件的托盤,其包含聚乳酸樹脂、碳纖維、碳黑、成核劑及偶合劑。其中,(a)聚乳酸樹脂含量介於75-95wt%;(b)碳纖維含量介於2-9wt%;(c)碳黑含量介於0-6wt%;(d)成核劑含量介於0.001-5wt%;以及(e)偶合劑含量介於0.001-5wt%,其中所述含量係以組份(a)、(b)、(c)、(d)及(e)總重量為100wt%計。In some embodiments, the present invention further provides a tray for electronic parts, which includes polylactic acid resin, carbon fiber, carbon black, nucleating agent and coupling agent. Among them, (a) the polylactic acid resin content is between 75-95wt%; (b) the carbon fiber content is between 2-9wt%; (c) the carbon black content is between 0-6wt%; (d) the nucleating agent content is between 0.001-5wt%; and (e) the coupling agent content is between 0.001-5wt%, wherein the content is based on the total weight of components (a), (b), (c), (d) and (e) being 100wt % calculation.
[聚乳酸][polylactic acid]
在本發明之一些實施例中,聚乳酸(PLA)可為乳酸之均聚物。乳酸存在光學異構體,亦即L-乳酸(L-形式)及D-乳酸(D-形式)。對於本發明之一些實施例而言,PLA可由該等光學異構體中之一種或兩種光學異構體製備。出於獲得高熔融溫度(T m)及高玻璃轉移溫度(T g)之PLA之目的,期望使用該等光學異構體中之一種作為主要組分。舉例而言,在PLA中,乳酸之L-形式之含量可不小於約80 mol%或不超過約20 mol%;諸如在PLA中,乳酸之L-形式之含量可不小於約85 mol%或不超過約16 mol%;或諸如在PLA中乳酸之L-形式之含量可不小於約90 mol%或不超過約12 mol%,其餘部分對應於或包括乳酸之D-形式。 In some embodiments of the present invention, polylactic acid (PLA) may be a homopolymer of lactic acid. Lactic acid exists in optical isomers, namely L-lactic acid (L-form) and D-lactic acid (D-form). For some embodiments of the present invention, PLA can be prepared from one or both of these optical isomers. For the purpose of obtaining PLA with high melting temperature (T m ) and high glass transition temperature (T g ), it is desirable to use one of these optical isomers as the main component. For example, in PLA, the content of the L-form of lactic acid may be no less than about 80 mol% or no more than about 20 mol%; such as in PLA, the content of the L-form of lactic acid may be no less than about 85 mol% or no more than about 20 mol%. About 16 mol%; or, such as in PLA, the content of the L-form of lactic acid may be no less than about 90 mol% or no more than about 12 mol%, with the remainder corresponding to or including the D-form of lactic acid.
在本發明之其他實施例中,PLA可為乳酸與除乳酸外的羥基羧酸組分的共聚物。除乳酸外的羥基羧酸組分可為,例如,乙醇酸、羥基丁酸、羥基戊酸、羥基己酸或羥基庚酸。In other embodiments of the invention, PLA may be a copolymer of lactic acid and a hydroxycarboxylic acid component other than lactic acid. The hydroxycarboxylic acid component other than lactic acid may be, for example, glycolic acid, hydroxybutyric acid, hydroxyvaleric acid, hydroxycaproic acid or hydroxyheptanoic acid.
PLA可使用上述單體由聚縮合方法形成,或使用上述單體之相應環狀二聚體或化合物(例如乳酸交酯,其為乳酸之環狀二聚體)由開環聚合方法形成。PLA can be formed by a polycondensation method using the above-mentioned monomers, or by a ring-opening polymerization method using the corresponding cyclic dimers or compounds of the above-mentioned monomers (such as lactide, which is a cyclic dimer of lactic acid).
在本發明之一些實施例中,PLA之重量平均分子量(M w)可至少為以下中之任一者:約10,000 g/mol、約20,000 g/mol、約30,000 g/mol、約40,000 g/mol及約50,000 g/mol;且可至多為以下中之任一者:約160,000 g/mol、約200,000 g/mol、約250,000 g/mol、約300,000 g/mol、約400,000 g/mol及約500,000 g/mol。舉例而言,PLA之重量平均分子量可為約30,000 g/mol至約250,000 g/mol。 In some embodiments of the present invention, the weight average molecular weight ( Mw ) of PLA may be at least any one of the following: about 10,000 g/mol, about 20,000 g/mol, about 30,000 g/mol, about 40,000 g/mol. mol and about 50,000 g/mol; and may be up to any of the following: about 160,000 g/mol, about 200,000 g/mol, about 250,000 g/mol, about 300,000 g/mol, about 400,000 g/mol, and about 500,000 g/mol. For example, PLA may have a weight average molecular weight of about 30,000 g/mol to about 250,000 g/mol.
在本發明之一些實施例中,以組份(a)、(b)、(c)、(d)及(e)總重量為100wt%計,聚乳酸樹脂的含量介於75-95wt%。例如,聚乳酸樹脂的含量可為75、77、80、83、85、87、89、90、92、93、94或95 wt%。 [成核劑] In some embodiments of the present invention, based on the total weight of components (a), (b), (c), (d) and (e) being 100wt%, the content of polylactic acid resin is between 75-95wt%. For example, the content of polylactic acid resin may be 75, 77, 80, 83, 85, 87, 89, 90, 92, 93, 94 or 95 wt%. [nucleating agent]
在一些實施例中,成核劑可用於改良PLA晶體的晶核排列且提高PLA之結晶速率及結晶度。提高PLA之結晶速率及結晶度可增加HDT及衝擊強度。在本發明之一些實施例中,可將可提高PLA之結晶速率及結晶度的成核劑用於樹脂組合物中。在一些實施例中,成核劑包含金屬碳酸鹽(例如鹼土金屬碳酸鹽,諸如碳酸鈣或碳酸鋇)、檸檬酸之酯衍生物(例如檸檬酸乙醯基三丁酯)、金屬矽酸鹽(例如水合矽酸鎂,諸如滑石)、胺基酸(例如甘胺酸或L-丙胺酸)、聚(胺基酸)(例如聚甘胺酸)、雜環有機化合物(例如N-胺基鄰苯二甲醯亞胺)、金屬氧化物(例如二氧化鈦)或其兩種或更多種之組合。在一些實施例中,成核劑為L-丙胺酸。In some embodiments, nucleating agents can be used to improve the nucleation arrangement of PLA crystals and increase the crystallization rate and crystallinity of PLA. Increasing the crystallization rate and crystallinity of PLA can increase HDT and impact strength. In some embodiments of the present invention, a nucleating agent that can increase the crystallization rate and crystallinity of PLA can be used in the resin composition. In some embodiments, the nucleating agent includes metal carbonates (eg, alkaline earth metal carbonates such as calcium carbonate or barium carbonate), ester derivatives of citric acid (eg, acetyltributyl citrate), metal silicates (e.g. hydrated magnesium silicate, such as talc), amino acids (e.g. glycine or L-alanine), poly(amino acids) (e.g. polyglycine), heterocyclic organic compounds (e.g. N-amino Phthalamide), metal oxides (such as titanium dioxide), or a combination of two or more thereof. In some embodiments, the nucleating agent is L-alanine.
在本發明之一些實施例中,以組份(a)、(b)、(c)、(d)及(e)總重量為100wt%計,成核劑的含量介於0.001-5wt%。例如,成核劑的含量可為0.001、0.005、0.1、0.5、1、1.5、2、3、4或5 wt%。 [填充劑] In some embodiments of the present invention, based on the total weight of components (a), (b), (c), (d) and (e) being 100wt%, the content of the nucleating agent is between 0.001-5wt%. For example, the nucleating agent may be present in an amount of 0.001, 0.005, 0.1, 0.5, 1, 1.5, 2, 3, 4 or 5 wt%. [filler]
可出於多種目的將填充劑添加至樹脂組合物中,諸如降低成本、改良機械強度或調整最終產品之外觀。針對不同目的選擇不同填充劑。已發現,一些填充劑對於樹脂組合物之一種性質可為有利的,但對於樹脂組合物之另一性質可能為不利的。另外,添加諸如橡膠及塑化劑之填充劑可能會對樹脂組合物之熱穩定性造成不利影響。Fillers may be added to resin compositions for a variety of purposes, such as reducing costs, improving mechanical strength, or adjusting the appearance of the final product. Different fillers are chosen for different purposes. It has been found that some fillers may be beneficial for one property of the resin composition but may be detrimental for another property of the resin composition. In addition, the addition of fillers such as rubber and plasticizers may adversely affect the thermal stability of the resin composition.
在本發明之一些實施例中,適用於本發明之PLA樹脂組合物的填充劑包含無機填充劑。無機填充劑可包含含碳填充劑。含碳填充劑包含碳纖維、碳黑或其他適合的材料。In some embodiments of the present invention, fillers suitable for the PLA resin composition of the present invention include inorganic fillers. Inorganic fillers may include carbonaceous fillers. Carbon-containing fillers include carbon fiber, carbon black or other suitable materials.
碳纖維為一種高強度補強材料,可提升PLA樹脂組合物的衝擊強度,並且降低PLA樹脂組合物的表面電阻。藉由成核劑與碳纖維的組合,能產生一協同作用,使得具有生物降解的PLA樹脂組合物獲得衝擊強度性質上的改良;此外,由於PLA係為有機高分子材料,其導電性不佳,容易產生靜電累積問題。在本發明一些實施例,於PLA中添加碳纖維的可以增加PLA的導電性,進而達到抗靜電的功效(例如表面電阻值<10 12ohm/sq)。 Carbon fiber is a high-strength reinforcing material that can increase the impact strength of the PLA resin composition and reduce the surface resistance of the PLA resin composition. Through the combination of nucleating agent and carbon fiber, a synergistic effect can be produced to improve the impact strength properties of the biodegradable PLA resin composition. In addition, since PLA is an organic polymer material, its conductivity is poor. It is easy to cause static electricity accumulation problems. In some embodiments of the present invention, adding carbon fiber to PLA can increase the conductivity of PLA, thereby achieving antistatic effect (for example, surface resistance value <10 12 ohm/sq).
在本發明之一些實施例中,以組份(a)、(b)、(c)、(d)及(e)總重量為100wt%計,碳纖維的含量小於10wt%,例如可介於2-9wt%。例如,碳纖維的含量可為2、3、4、5、6、7、8或9wt%。本發明之一些實施例中發現,增加碳纖維的含量可降低表面電阻值;然而,當碳纖維的含量大於或等於10wt%時,雖然可降低表面電阻值至10 12ohm/sq以下,然而,PLA樹脂組合物中的碳纖維會有釋出的可能性,易使成型品表面發生裂痕等缺陷。 In some embodiments of the present invention, based on the total weight of components (a), (b), (c), (d) and (e) being 100wt%, the content of carbon fiber is less than 10wt%, for example, it can be between 2 -9wt%. For example, the carbon fiber content may be 2, 3, 4, 5, 6, 7, 8 or 9 wt%. In some embodiments of the present invention, it is found that increasing the content of carbon fiber can reduce the surface resistance value; however, when the content of carbon fiber is greater than or equal to 10wt%, although the surface resistance value can be reduced to below 10 12 ohm/sq, however, PLA resin The carbon fiber in the composition may be released, which may easily cause defects such as cracks on the surface of the molded product.
可使用具有多種適合長度及/或粒徑之碳纖維。在一些實施例中,碳纖維之長度(例如平均長度)為約0.01 mm至約800 mm,例如約0.01 mm、約1 mm、約10 mm、約50 mm、約100 mm、約200 mm、約300 mm、約400 mm、約500 mm、約600 mm、約700 mm或約800 mm。在一些實施例中,碳纖維之粒徑(例如平均粒徑)為約0.01 μm至約100 μm,例如約0.01 μm、約1 μm、約10 μm、約20 μm、約30 μm、約40 μm、約50 μm、約60 μm、約70 μm、約80 μm、約90 μm或約100 μm。Carbon fibers with a variety of suitable lengths and/or particle sizes can be used. In some embodiments, the carbon fibers have a length (eg, average length) of about 0.01 mm to about 800 mm, such as about 0.01 mm, about 1 mm, about 10 mm, about 50 mm, about 100 mm, about 200 mm, about 300 mm. mm, approximately 400 mm, approximately 500 mm, approximately 600 mm, approximately 700 mm or approximately 800 mm. In some embodiments, the carbon fiber has a particle size (eg, average particle size) of about 0.01 μm to about 100 μm, such as about 0.01 μm, about 1 μm, about 10 μm, about 20 μm, about 30 μm, about 40 μm, About 50 μm, about 60 μm, about 70 μm, about 80 μm, about 90 μm, or about 100 μm.
在本發明之一些實施例中,可視需要添加碳黑。碳黑可以降低PLA樹脂組合物的表面電阻值,且相較碳纖維的成本較為低廉。In some embodiments of the present invention, carbon black may be added as needed. Carbon black can reduce the surface resistance value of the PLA resin composition, and is cheaper than carbon fiber.
在本發明之一些實施例中發現,單獨使用碳黑時,其效果不如單獨使用相同量的碳纖維,所得成型物的HDT、表面電阻值及機械強度皆較差。然而,在一些實施態樣中發現,將碳黑與碳纖維併用時,兩者可發揮協同作用,可降低表面電阻值至10 12ohm/sq以下且不會使成型品表面發生裂痕。在一些實施例中,甚至可進一步降低表面電阻值至10 10ohm/sq以下且不會使成型品表面發生裂痕。在本發明之一些實施例中,本發明之PLA樹脂組合物可視需要包含碳黑,其中以組份(a)、(b)、(c)、(d)及(e)總重量為100wt%計,碳黑的含量小於10wt%,例如可介於0-9wt%。例如,碳黑的含量可為0、1、2、3、4、5、6、7、8或9wt%。在本發明之另一些實施例中,以組份(a)、(b)、(c)、(d)及(e)總重量為100wt%計,碳黑的含量小於7wt%,例如可介於0-6wt%,有助於提升衝擊強度至約1.5 kg-cm/cm或更高且維持表面電阻值在10 12ohm/sq以下。在一些實施例中,該PLA樹脂組合物同時包含碳纖維及碳黑,且以組份(a)、(b)、(c)、(d)及(e)總重量為100wt%計,碳纖維及碳黑之總含量小於15 wt%,例如,小於或等於14 wt%、小於或等於13 wt%、小於或等於12wt%。 In some embodiments of the present invention, it was found that when carbon black is used alone, the effect is not as good as when the same amount of carbon fiber is used alone, and the HDT, surface resistance value and mechanical strength of the resulting molded article are poor. However, in some embodiments, it is found that when carbon black and carbon fiber are used together, the two can play a synergistic effect and can reduce the surface resistance value to below 10 12 ohm/sq without causing cracks on the surface of the molded product. In some embodiments, the surface resistance value can even be further reduced to below 10 10 ohm/sq without causing cracks on the surface of the molded product. In some embodiments of the present invention, the PLA resin composition of the present invention may optionally contain carbon black, wherein the total weight of components (a), (b), (c), (d) and (e) is 100wt% Calculated, the content of carbon black is less than 10wt%, for example, it can be between 0-9wt%. For example, the carbon black content may be 0, 1, 2, 3, 4, 5, 6, 7, 8 or 9 wt%. In other embodiments of the present invention, based on the total weight of components (a), (b), (c), (d) and (e) being 100wt%, the content of carbon black is less than 7wt%, for example, it can be At 0-6wt%, it helps to increase the impact strength to about 1.5 kg-cm/cm or higher and maintain the surface resistance value below 10 12 ohm/sq. In some embodiments, the PLA resin composition includes both carbon fiber and carbon black, and based on the total weight of components (a), (b), (c), (d) and (e) being 100wt%, the carbon fiber and carbon black are The total content of carbon black is less than 15 wt%, for example, less than or equal to 14 wt%, less than or equal to 13 wt%, less than or equal to 12 wt%.
可使用具有多種適合長度及/或粒徑之碳黑。在一些實施例中,碳黑之長度(例如平均長度)為約0.01 mm至約800 mm,例如約0.01 mm、約1 mm、約10 mm、約50 mm、約100 mm、約200 mm、約300 mm、約400 mm、約500 mm、約600 mm、約700 mm或約800 mm。在一些實施例中,碳纖維之粒徑(例如平均粒徑)為約0.01 μm至約100 μm,例如約0.01 μm、約1 μm、約10 μm、約20 μm、約30 μm、約40 μm、約50 μm、約60 μm、約70 μm、約80 μm、約90 μm或約100 μm。 [偶合劑] Carbon blacks having a variety of suitable lengths and/or particle sizes can be used. In some embodiments, the carbon black has a length (eg, average length) of about 0.01 mm to about 800 mm, such as about 0.01 mm, about 1 mm, about 10 mm, about 50 mm, about 100 mm, about 200 mm, about 300 mm, approximately 400 mm, approximately 500 mm, approximately 600 mm, approximately 700 mm or approximately 800 mm. In some embodiments, the carbon fiber has a particle size (eg, average particle size) of about 0.01 μm to about 100 μm, such as about 0.01 μm, about 1 μm, about 10 μm, about 20 μm, about 30 μm, about 40 μm, About 50 μm, about 60 μm, about 70 μm, about 80 μm, about 90 μm, or about 100 μm. [Coupling agent]
在本發明之一些實施例之PLA樹脂組合物中,PLA為有機材料,而填充劑為無機材料。不同於有機材料可藉由官能基在彼此之間形成鍵結,無機材料通常不會與有機材料形成強鍵結,結果可能導致PLA與無機填充劑之間的相容性及黏著度較差。為了解決此問題,可採用偶合劑來改質無機填充劑之表面,且經由偶合劑的雙重反應性將無機填充劑鍵結至有機材料。亦可將偶合劑用於有機填充劑,進一步提高PLA與有機填充劑之間的相容性及黏著度。在一些實施例中,填充劑經由偶合劑鍵結(例如共價鍵結)至PLA。In the PLA resin composition of some embodiments of the present invention, PLA is an organic material, and the filler is an inorganic material. Unlike organic materials that can form bonds with each other through functional groups, inorganic materials usually do not form strong bonds with organic materials. As a result, the compatibility and adhesion between PLA and inorganic fillers may be poor. In order to solve this problem, a coupling agent can be used to modify the surface of the inorganic filler, and the inorganic filler can be bonded to the organic material through the dual reactivity of the coupling agent. Coupling agents can also be used in organic fillers to further improve the compatibility and adhesion between PLA and organic fillers. In some embodiments, the filler is bonded (eg, covalently bonded) to the PLA via a coupling agent.
偶合劑可為矽烷偶合劑、鈦酸酯偶合劑或其組合。可選擇多種適合之矽烷偶合劑及鈦酸酯偶合劑。適用於本發明之一些實施例的矽烷偶合劑之實例包括,但不限於:三甲氧基矽烷、三乙氧基矽烷或其組合。根據本發明之一些實施例,矽烷偶合劑可為3-丙烯醯氧基丙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷或其組合。適用於本發明之一些實施例的鈦酸酯偶合劑之實例包括,但不限於:二(異丙苯基苯酚)氧乙酸鈦(titanium di(cumylphenylate) oxyacetate)、二(二辛基磷酸醯氧基)鈦酸伸乙酯(di(dioctylphosphato) ethylene titanate)或其組合。The coupling agent may be a silane coupling agent, a titanate coupling agent, or a combination thereof. A variety of suitable silane coupling agents and titanate coupling agents are available. Examples of silane coupling agents suitable for use in some embodiments of the present invention include, but are not limited to: trimethoxysilane, triethoxysilane, or combinations thereof. According to some embodiments of the present invention, the silane coupling agent may be 3-acryloxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, or a combination thereof. Examples of titanate coupling agents suitable for use in some embodiments of the present invention include, but are not limited to: titanium di(cumylphenylate) oxyacetate, di(dioctyl phosphate) di(dioctylphosphato) ethylene titanate) or a combination thereof.
可將偶合劑以不同的適當量添加至PLA樹脂組合物中,且可視填充劑含量而加以調整。在一些實施例中,以組份(a)、(b)、(c)、(d)及(e)總重量為100wt%計,偶合劑的含量介於0.001-5wt%。例如,偶合劑的含量可為0.001、0.005、0.1、0.5、1、1.5、2、3、4或5 wt%。 [聚乳酸樹脂組合物] The coupling agent can be added to the PLA resin composition in different appropriate amounts and can be adjusted depending on the filler content. In some embodiments, based on the total weight of components (a), (b), (c), (d) and (e) being 100wt%, the content of the coupling agent ranges from 0.001 to 5wt%. For example, the coupling agent may be present in an amount of 0.001, 0.005, 0.1, 0.5, 1, 1.5, 2, 3, 4 or 5 wt%. [Polylactic acid resin composition]
在本發明之一些實施例中,PLA樹脂組合物可藉由多種適當方法來製備。在一些實施例中,藉由以下製備PLA樹脂組合物:(1)將PLA樹脂與成核劑混合以形成第一混合物,(2)混合填充劑及偶合劑以形成第二混合物,及(3)將第二混合物添加至第一混合物(或以其他方式使第一混合物與第二混合物混合)以製備PLA樹脂組合物。In some embodiments of the present invention, the PLA resin composition can be prepared by a variety of appropriate methods. In some embodiments, a PLA resin composition is prepared by (1) mixing a PLA resin with a nucleating agent to form a first mixture, (2) mixing a filler and a coupling agent to form a second mixture, and (3) ) Add the second mixture to the first mixture (or otherwise mix the first mixture with the second mixture) to prepare a PLA resin composition.
PLA樹脂組合物可應用於作為抗靜電材料。當PLA樹脂組合物作為抗靜電材料時,可容許犧牲些微衝擊強度,著眼於表面電阻的改良。例如,若抗靜電材料的表面電阻值小於10 12ohm/sq,且衝擊強度大於1.3 kg-cm/cm,則可評價為優良的抗靜電材料。 The PLA resin composition can be used as an antistatic material. When the PLA resin composition is used as an antistatic material, a slight sacrifice in impact strength can be tolerated, focusing on the improvement of surface resistance. For example, if the surface resistance of an antistatic material is less than 10 12 ohm/sq and the impact strength is greater than 1.3 kg-cm/cm, it can be evaluated as an excellent antistatic material.
PLA樹脂組合物可進一步加工成最終產品,諸如電子產品(例如行動電話或電腦)之封蓋、食物容器或托盤、或工業組件之托盤。在一些實施例中,可藉由雙螺桿擠壓機捏合PLA樹脂組合物,且隨後在約150℃至約200℃之溫度範圍內用射出成型機加以射出以形成托盤。可進一步烘烤該托盤以便釋放應力且穩定托盤大小。The PLA resin composition can be further processed into final products, such as covers for electronic products (eg, mobile phones or computers), food containers or trays, or trays for industrial components. In some embodiments, the PLA resin composition may be kneaded by a twin-screw extruder and then injected using an injection molding machine at a temperature ranging from about 150°C to about 200°C to form a tray. The tray can be further baked to relieve stress and stabilize the tray size.
由本發明一些實施例之PLA樹脂組合物製得之產品為可生物降解的,使得該產品可在自然環境中,例如藉由微生物分解。在一些實施例中,PLA樹脂組合物在自然環境中在約90天內之分解度可為約70 wt%或更高。The product made from the PLA resin composition of some embodiments of the present invention is biodegradable, so that the product can be decomposed in the natural environment, such as by microorganisms. In some embodiments, the decomposition degree of the PLA resin composition in a natural environment within about 90 days may be about 70 wt% or higher.
在一些實施例中,將PLA樹脂組合物加工成可生物降解之抗靜電材料。在其他實施例中,可生物降解之抗靜電材料在自然環境中在約90天之後的可分解度為約70 wt%或更高。在其他實施例中,可生物降解之抗靜電材料之衝擊強度為約1.3 kg-cm/cm或更高 (例如,約1.4 kg-cm/cm或更高、約1.5 kg-cm/cm或更高);HDT為約125℃或更高 (例如,約128℃或更高、約130℃或更高、約130℃或更高、約135℃或更高);且表面電阻值為約10 12ohm/sq或更小 (例如,約10 11ohm/sq或更小、約10 10ohm/sq或更小、約10 9ohm/sq或更小、約10 8ohm/sq或更小、約10 7ohm/sq或更小、約10 6ohm/sq或更小、約10 5ohm/sq或更小、或約10 4ohm/sq或更小,且可低至約10 3ohm/sq或更小)。此外,在一些實施例中,所得抗靜電材料表面沒有或僅有些微裂痕。 In some embodiments, the PLA resin composition is processed into a biodegradable antistatic material. In other embodiments, the biodegradable antistatic material has a degree of decomposition in the natural environment of about 70 wt% or greater after about 90 days. In other embodiments, the biodegradable antistatic material has an impact strength of about 1.3 kg-cm/cm or higher (e.g., about 1.4 kg-cm/cm or higher, about 1.5 kg-cm/cm or higher). high); HDT is about 125°C or higher (e.g., about 128°C or higher, about 130°C or higher, about 130°C or higher, about 135°C or higher); and the surface resistance value is about 10 12 ohm/sq or less (for example, about 10 11 ohm/sq or less, about 10 10 ohm/sq or less, about 10 9 ohm/sq or less, about 10 8 ohm/sq or less, About 10 7 ohm/sq or less, about 10 6 ohm/sq or less, about 10 5 ohm/sq or less, or about 10 4 ohm/sq or less, and can be as low as about 10 3 ohm/ sq. or smaller). Furthermore, in some embodiments, the surface of the resulting antistatic material has no or only some microcracks.
在一些實施例中,可將PLA樹脂組合物加工成托盤。在其他實施例中,托盤之衝擊強度為約1.5 kg-cm/cm或更高;HDT為約125℃或更高 (例如,約128℃或更高、約130℃或更高、約133℃或更高、約135℃或更高);且表面電阻值為約10 12ohm/sq或更小 (例如,約10 11ohm/sq或更小、約10 10ohm/sq或更小、約10 9ohm/sq或更小、約10 8ohm/sq或更小、約10 7ohm/sq或更小、約10 6ohm/sq或更小、約10 5ohm/sq或更小或約10 4ohm/sq或更小,且可低至約10 3ohm/sq或更小)。托盤,諸如IC托盤適用於電子工業,其指定要高HDT、高衝擊強度及低表面電阻值(例如HDT為約125℃或更高,衝擊強度為約1.5 kg-cm/cm或更高且表面電阻值為約10 12ohm/sq或更小)。此外,在一些實施例中,所得托盤表面沒有或僅有些微裂痕。 實例 In some embodiments, the PLA resin composition can be processed into pallets. In other embodiments, the impact strength of the pallet is about 1.5 kg-cm/cm or higher; the HDT is about 125°C or higher (e.g., about 128°C or higher, about 130°C or higher, about 133°C or higher, about 135°C or higher); and the surface resistance value is about 10 12 ohm/sq or less (for example, about 10 11 ohm/sq or less, about 10 10 ohm/sq or less, about 10 9 ohm/sq or less, about 10 8 ohm/sq or less, about 10 7 ohm/sq or less, about 10 6 ohm/sq or less, about 10 5 ohm/sq or less or about 10 4 ohm/sq or less, and can be as low as about 10 3 ohm/sq or less). Trays, such as IC trays suitable for the electronics industry, are specified with high HDT, high impact strength and low surface resistance values (e.g. HDT of approximately 125°C or higher, impact strength of approximately 1.5 kg-cm/cm or higher and surface Resistance value is approximately 10 12 ohm/sq or less). Furthermore, in some embodiments, the resulting tray surface has no or only some microcracks. Example
參照以下實例及比較實例進一步解釋本發明之一些實施例;然而,此等實施例並不限制本發明之範疇。在實例中,使用聚乳酸(NatureWorks® 4032D)、L-丙胺酸(Merck公司)、碳纖維(TAIRYFIL® CS-2516)、碳黑(CABOT® XC-72)及偶合劑(ShinEtsu KBM-503)。各組分之相對量描述於表1、2中。Some embodiments of the present invention are further explained with reference to the following examples and comparative examples; however, these embodiments do not limit the scope of the present invention. In the example, polylactic acid (NatureWorks® 4032D), L-alanine (Merck), carbon fiber (TAIRYFIL® CS-2516), carbon black (CABOT® XC-72) and coupling agent (ShinEtsu KBM-503) are used. The relative amounts of each component are described in Tables 1 and 2.
將PLA與L-丙胺酸均勻混合以製備第一混合物。將碳纖維及/或碳黑與偶合劑混合以製備第二混合物。將第二混合物添加至第一混合物,以製備PLA組成物。在約160℃至約195℃之溫度範圍內藉由雙螺桿擠壓機捏合PLA樹脂組合物,且隨後在約150℃至約200℃之溫度範圍內用射出成型機加以射出成型。Mix PLA and L-alanine uniformly to prepare a first mixture. Carbon fibers and/or carbon black are mixed with a coupling agent to prepare a second mixture. The second mixture is added to the first mixture to prepare a PLA composition. The PLA resin composition is kneaded by a twin-screw extruder in a temperature range of about 160°C to about 195°C, and then injection molded using an injection molding machine in a temperature range of about 150°C to about 200°C.
根據表3及表4所述之ASTM方法測試各射出成型之PLA樹脂組合物之性質,並將結果記錄於表3及表4中。對各射出成型之PLA樹脂組合物之外觀評價,若外觀有明顯裂痕,則評價為不良(X),若無明顯裂痕,則評價為良好(O),將外觀評價描述於表5。The properties of each injection-molded PLA resin composition were tested according to the ASTM methods described in Tables 3 and 4, and the results were recorded in Tables 3 and 4. Regarding the appearance evaluation of each injection-molded PLA resin composition, if there were obvious cracks in the appearance, it was evaluated as poor (X), and if there were no obvious cracks, it was evaluated as good (O). The appearance evaluation is described in Table 5.
表1
由實例5及比較例1可知,添加碳纖維有助於提升機械強度及HDT,且能降低表面電阻值,改良抗靜電性質。由比較例1及4至6可知,添加碳黑雖可降低表面電阻值,其效果不如碳纖維,且在一些實例中可同時觀察到機械強度變差且HDT也變差。此外,亦發現當PLA組成物的碳纖維或碳黑含量太高時,則PLA組成物的射出成型物外觀容易有明顯裂痕,而降低其商業用途。例如,比較例2、3、7的碳纖維含量大於或等於10重量份,均勻性不佳,且PLA射出成型物外觀不平坦,甚或出現裂痕,而被評價為不良;比較例6含有過多碳黑(大於或等於10重量份),成型物中有碳黑浮出並聚集於表面,導致外觀評價不良。It can be seen from Example 5 and Comparative Example 1 that adding carbon fiber can help improve the mechanical strength and HDT, reduce the surface resistance value, and improve the antistatic properties. It can be seen from Comparative Examples 1 and 4 to 6 that although adding carbon black can reduce the surface resistance value, the effect is not as good as that of carbon fiber, and in some examples it can be observed that the mechanical strength becomes worse and the HDT also becomes worse. In addition, it was also found that when the carbon fiber or carbon black content of the PLA composition is too high, the appearance of the injection molded product of the PLA composition is prone to obvious cracks, which reduces its commercial use. For example, the carbon fiber content of Comparative Examples 2, 3, and 7 is greater than or equal to 10 parts by weight, the uniformity is poor, and the appearance of the PLA injection molded product is uneven, or even cracked, and is evaluated as poor; Comparative Example 6 contains too much carbon black (10 parts by weight or more), carbon black will float out of the molded article and accumulate on the surface, resulting in poor appearance evaluation.
實例1至4除碳纖維外進一步添加碳黑,結果顯示將碳黑與碳纖維併用時,兩者可發揮協同作用,可降低表面電阻值至10 12ohm/sq以下(甚至可進一步降低至10 10ohm/sq以下)且不會使成型品表面發生裂痕;此外,成型品具有優異的機械強度及HDT。如上所述,比較例2、3、7雖可降低表面電阻值至10 10ohm/sq以下,然而,因碳纖維含量過高表面發生裂痕;相反地,本案實例3及4具有可相比之表面電阻值,卻能保有較少或無表面裂痕,且可使用較少的碳纖維及碳黑總含量。由比較例4對照實例2及比較例5對照實例3可得知,碳纖維有助於提升機械強度及提升HDT,並且降低表面電阻值。由實例1-5可知,當碳纖維的含量小於10wt%(例如介於2-9wt%),且碳黑的含量小於10wt%(例如介於0-9wt%)時,PLA組成物的表面電阻值皆小於10 12ohm/sq,衝擊強度大於1.3 kg-cm/cm,HDT大於125℃(可達133℃或更高),且其射出成型物的外觀為評價良好,而能作為優異的抗靜電材料。特別是實例2-4的表面電阻值皆小於10 10ohm/sq,具有非常優異的抗靜電性質。其中,實例4的表面電阻值更達至152.32 ohm/sq,具有更優異的抗靜電性質。 In Examples 1 to 4, carbon black was added in addition to carbon fiber. The results show that when carbon black and carbon fiber are used together, the two can play a synergistic effect and can reduce the surface resistance value to below 10 12 ohm/sq (or even further reduce it to 10 10 ohm). /sq or less) and will not cause cracks on the surface of the molded product; in addition, the molded product has excellent mechanical strength and HDT. As mentioned above, although Comparative Examples 2, 3, and 7 can reduce the surface resistance value to less than 10 10 ohm/sq, however, cracks occur on the surface due to the excessive carbon fiber content. On the contrary, Examples 3 and 4 of this case have comparable surface resistance. Resistance value, but can maintain less or no surface cracks, and can use less total content of carbon fiber and carbon black. It can be seen from Comparative Example 4 compared to Example 2 and Comparative Example 5 compared to Example 3 that carbon fiber helps to improve mechanical strength and HDT, and reduces surface resistance. It can be seen from Examples 1-5 that when the content of carbon fiber is less than 10wt% (for example, between 2-9wt%) and the content of carbon black is less than 10wt% (for example, between 0-9wt%), the surface resistance value of the PLA composition All are less than 10 12 ohm/sq, the impact strength is greater than 1.3 kg-cm/cm, the HDT is greater than 125℃ (up to 133℃ or higher), and the appearance of the injection molded product is rated well, and it can be used as an excellent antistatic Material. In particular, the surface resistance values of Examples 2-4 are all less than 10 10 ohm/sq, and have very excellent antistatic properties. Among them, the surface resistance value of Example 4 reaches 152.32 ohm/sq, which has better antistatic properties.
此外,若要將PLA組成物製成用於電子件之托盤時,則需要有良好的衝擊強度,例如當其衝擊強度大於或等於1.5 kg-cm/cm時,則能將此PLA組成物作為用於電子件之托盤。由實例1、2、3、5可知,當碳纖維的含量小於10wt%(例如介於2-9wt%),且碳黑的含量小於7wt%(例如介於0-6wt%)時,其耐衝擊強度皆大於1.5 kg-cm/cm,而能用於製成電子件之托盤。In addition, if the PLA composition is to be made into a tray for electronic parts, it needs to have good impact strength. For example, when the impact strength is greater than or equal to 1.5 kg-cm/cm, the PLA composition can be used as Trays for electronic parts. It can be seen from Examples 1, 2, 3 and 5 that when the content of carbon fiber is less than 10wt% (for example, between 2-9wt%) and the content of carbon black is less than 7wt% (for example, between 0-6wt%), its impact resistance The strength is greater than 1.5 kg-cm/cm and can be used to make trays for electronic parts.
此外,若要將PLA組成物製成用於電子件之托盤時,則需要有較高的HDT,例如當其HDT大於或等於125℃時,則能將此PLA組成物作為用於電子件之托盤。由實例1至5可知,其HDT皆大於或等於133℃,具有優異的HDT。In addition, if the PLA composition is to be made into a tray for electronic parts, it needs to have a higher HDT. For example, when its HDT is greater than or equal to 125°C, the PLA composition can be used as a pallet for electronic parts. pallet. It can be seen from Examples 1 to 5 that their HDTs are all greater than or equal to 133°C, indicating excellent HDT.
總體而言,實例1-5藉由含有特定含量的碳纖維或進一步添加特定含量的碳黑,其製造的PLA組成物具有良好抗靜電特性可作為抗靜電材料,且其中實例1、2、3、5之PLA組成物亦能製成托盤,此托盤均具有適當的HDT及機械性質,可應用於於電子工業中,諸如IC托盤。In general, the PLA compositions produced by Examples 1-5 by containing a specific content of carbon fiber or further adding a specific content of carbon black have good antistatic properties and can be used as antistatic materials, and among Examples 1, 2, 3, The PLA composition of 5 can also be made into pallets. These pallets have appropriate HDT and mechanical properties and can be used in the electronics industry, such as IC pallets.
如本文所用且不加以另外定義,術語「實質上」、「實質」、「大約」及「約」用於描述且考慮微小變動。當與事件或情形結合使用時,術語可涵蓋事件或情形精確發生之情況以及事件或情形極近似於發生之情況。舉例而言,當結合數值使用時,術語可涵蓋小於或等於彼數值之±10%的變化範圍,諸如小於或等於±5%、小於或等於±4%、小於或等於±3%、小於或等於±2%、小於或等於±1%、小於或等於±0.5%、小於或等於±0.1%、或小於或等於±0.05%。舉例而言,若第一數值處於小於或等於第二數值之±10%之變化範圍內,諸如小於或等於±5%、小於或等於±4%、小於或等於±3%、小於或等於±2%、小於或等於±1%、小於或等於±0.5%、小於或等於±0.1%或小於或等於±0.05%,則第一數值可與第二數值「實質上」相同或相等。As used herein and not otherwise defined, the terms "substantially," "substantially," "approximately" and "approximately" are used for description and allow for minor variations. When used in connection with an event or situation, the term can cover the exact occurrence of the event or situation as well as the close approximation of the event or situation. For example, when used in conjunction with a numerical value, the term may encompass a range of less than or equal to ±10% of that value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to Equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the first value is within a variation range of less than or equal to ±10% of the second value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ± 2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, the first value can be "substantially" the same or equal to the second value.
除非上下文另外明確規定,否則如本文所用,單數術語「一(a/an)」及「該」可包括複數個指示物。As used herein, the singular terms "a/an" and "the" may include plural referents unless the context clearly dictates otherwise.
量、比率及其他數值本文中有時以範圍格式來呈現。可理解,此類範圍格式用於便利及簡潔起見,且應靈活地理解為不僅包括明確地指定為範圍限制之數值,且亦包括涵蓋於該範圍內之所有個別數值或子範圍,如同明確地指定每一數值及子範圍一般。Quantities, ratios, and other numerical values are sometimes presented in this document in range format. It is understood that such range formats are used for convenience and brevity, and should be flexibly understood to include not only the values expressly designated as range limits, but also all individual values or subranges encompassed within the range, as if expressly Specify each value and subrange individually.
儘管已參考本發明之特定實施例描述且說明本發明,但此等描述及說明並不限制本發明。熟習此項技術者可清楚地理解,可進行各種改變,且可在實施例內替代等效要素而不會脫離如由所附申請專利範圍所界定的本發明之真實精神及範疇。說明可不必按比例繪製。歸因於製造過程之類中的變數,本發明中之技藝再現與實際設備之間可存在區別。可存在並未特定說明的本發明之其他實施例。應將本說明書及圖式視為說明性而非限制性的。可作出修改,以使特定情形、材料、物質組成、方法或製程適應於本發明之目標、精神及範疇。所有此類修改意欲在此處附加之申請專利範圍之範疇內。儘管已參考按特定次序執行之特定操作描述本文中所揭示的方法,但可理解,在不脫離本發明之教示的情況下,可組合、細分或重新定序此等操作以形成等效方法。因此,除非在本文中特定指示,否則操作之次序及分組並非本發明之限制。While the invention has been described and illustrated with reference to specific embodiments thereof, such description and illustrations do not limit the invention. It will be apparent to those skilled in the art that various changes may be made and equivalent elements may be substituted within the embodiments without departing from the true spirit and scope of the invention as defined by the appended claims. Instructions need not be drawn to scale. Differences may exist between the representations of the invention and the actual device due to variables in manufacturing processes and the like. There may be other embodiments of the invention not specifically illustrated. This specification and drawings are to be regarded as illustrative rather than restrictive. Modifications may be made to adapt a particular situation, materials, compositions of matter, methods or processes to the objectives, spirit and scope of the invention. All such modifications are intended to be within the scope of the patent claims appended hereto. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it will be understood that such operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the invention.
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109135629A TWI834923B (en) | 2020-10-15 | 2020-10-15 | Polylactic acid resin composition and application thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109135629A TWI834923B (en) | 2020-10-15 | 2020-10-15 | Polylactic acid resin composition and application thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202216900A TW202216900A (en) | 2022-05-01 |
TWI834923B true TWI834923B (en) | 2024-03-11 |
Family
ID=82558781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109135629A TWI834923B (en) | 2020-10-15 | 2020-10-15 | Polylactic acid resin composition and application thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI834923B (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201005031A (en) * | 2008-07-16 | 2010-02-01 | Yongyu Applied Technology Material Co Ltd | PLA resin composition containing high performance VGCF and method for producing the same |
TW201114791A (en) * | 2009-06-30 | 2011-05-01 | Mitsui Chemicals Inc | Polylactic acid resin, method for producing polylactic acid resin, polylactic acid resin composition, stereocomplex polylactic acid resin composition, and method for producing stereocomplex polylactic acid resin composition |
TW201300450A (en) * | 2005-07-08 | 2013-01-01 | Toray Industries | Resin composition and molded article composed of the same |
CN102869724A (en) * | 2010-09-28 | 2013-01-09 | 东丽株式会社 | Thermoplastic resin composition and molded item formed from same |
TW201437251A (en) * | 2013-02-19 | 2014-10-01 | Toray Industries | Polylactic resin composition, molded product, and method for producing polylactic resin composition |
CN109401252A (en) * | 2018-11-02 | 2019-03-01 | 中国科学院长春应用化学研究所 | A kind of polylactic acid conducing composite material and preparation method thereof |
CN109749379A (en) * | 2017-11-01 | 2019-05-14 | 日月光半导体制造股份有限公司 | Polylactic acid resin composition and its application |
-
2020
- 2020-10-15 TW TW109135629A patent/TWI834923B/en active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201300450A (en) * | 2005-07-08 | 2013-01-01 | Toray Industries | Resin composition and molded article composed of the same |
TW201005031A (en) * | 2008-07-16 | 2010-02-01 | Yongyu Applied Technology Material Co Ltd | PLA resin composition containing high performance VGCF and method for producing the same |
TW201114791A (en) * | 2009-06-30 | 2011-05-01 | Mitsui Chemicals Inc | Polylactic acid resin, method for producing polylactic acid resin, polylactic acid resin composition, stereocomplex polylactic acid resin composition, and method for producing stereocomplex polylactic acid resin composition |
CN102869724A (en) * | 2010-09-28 | 2013-01-09 | 东丽株式会社 | Thermoplastic resin composition and molded item formed from same |
TW201437251A (en) * | 2013-02-19 | 2014-10-01 | Toray Industries | Polylactic resin composition, molded product, and method for producing polylactic resin composition |
CN109749379A (en) * | 2017-11-01 | 2019-05-14 | 日月光半导体制造股份有限公司 | Polylactic acid resin composition and its application |
TW201922837A (en) * | 2017-11-01 | 2019-06-16 | 日月光半導體製造股份有限公司 | Polylactic acid resin composition and application thereof |
CN109401252A (en) * | 2018-11-02 | 2019-03-01 | 中国科学院长春应用化学研究所 | A kind of polylactic acid conducing composite material and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW202216900A (en) | 2022-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20190127573A1 (en) | Polylactic acid resin composition and application thereof | |
JP5305590B2 (en) | Polylactic acid-containing resin composition and molded product obtained therefrom | |
JP5156925B2 (en) | Biodegradable resin composition, method for producing the same, and molded article using the same | |
JP5942447B2 (en) | Polyester resin composition, film formed from the resin composition, and bag formed from the film | |
KR101575617B1 (en) | Manufacturing method for polylactic acid resin compositions | |
JP5479747B2 (en) | Polylactic acid resin composition | |
JP2005281677A (en) | Aliphatic polyester resin composition and its molded product | |
KR101604043B1 (en) | Polylactic acid resin composite | |
WO2022065182A1 (en) | Resin composition for injection molding, and injection-molded object | |
JP2005281678A (en) | Aliphatic polyester resin composition and its molded product | |
TWI834923B (en) | Polylactic acid resin composition and application thereof | |
JP2015193750A (en) | Biodegradable resin | |
TWI851544B (en) | Polylactic acid resin composition and application thereof | |
JP5479748B2 (en) | Polylactic acid resin composition | |
JP2008088226A (en) | Flame-retardant resin composition and injection molded article | |
JP6885147B2 (en) | A resin composition and a resin molded product obtained by molding the resin composition. | |
JP2007262339A (en) | Polylactic acid-based polyester resin composition, method for producing the same and molding using the same | |
JP2011074354A (en) | Resin composition | |
JP2008195784A (en) | Polyester-based resin composition and molded article thereof | |
JP5004262B2 (en) | Resin composition and molded article comprising the same | |
JP5128750B2 (en) | Biodegradable resin composition | |
JP5256068B2 (en) | Polylactic acid resin composition | |
JP2010083914A (en) | Polylactic acid resin composition, and method for producing the same | |
JP2011127132A (en) | Aliphatic polyester resin composition and molded product thereof | |
EP3873990B1 (en) | High flow poly(phthalamide) compositions, and articles made therefrom |