TWI832397B - Encapsulation composition and light-emitting device - Google Patents

Abstract

Provided are an encapsulation composition including a monomer compound and an initiator, wherein the monomer compound includes a first monomer and a second monomer, wherein the first monomer is represented by Formula 1 below, the second monomer comprises a polyfunctional monomer having two or more functional groups, and the functional group includes at least one of acrylate and methacrylate, and a light-emitting device having at least one surface including an organic cured film formed of the encapsulation composition.

Description

Sealing composition and light-emitting element

The present disclosure relates to a sealing composition, and more specifically, to a sealing composition, an organic cured film formed from the sealing composition, and a stack and light emitting element including the organic cured film.

Light-emitting components (especially organic light-emitting devices (OLED)) are self-luminous components used in televisions (TV), computers, mobile communication components and similar devices, and have wide viewing angles and excellent contrast. , fast response speed, excellent brightness, low driving voltage, excellent response rate characteristics, and a variety of colors, and are widely used in various fields.

Exposure of organic light-emitting elements to oxygen, moisture, and ultraviolet rays can adversely cause their physical properties and lifespan to deteriorate due to degradation. To this end, a sealing method that can protect the organic light-emitting element from oxygen, moisture and ultraviolet rays is introduced into the organic light-emitting element. For example, a sealing method is being considered in which an organic layer having the property of acting as a barrier blocking the passage of gas and moisture and an inorganic layer having excellent mechanical properties are alternately stacked. In this case, the inorganic layer can be formed using deposition, and the organic layer can be formed using inkjet printing.

Meanwhile, in recent years, the reduction in thickness and improvement in resolution of organic light-emitting elements have introduced various causes of driving failures. Among them, external static electricity will disturb electrical signals, causing drive failure. To solve this problem, it is important to lower the dielectric constant of the sealing layer.

Therefore, various embodiments of the present disclosure have been made in view of the above problems, and an object of the present disclosure is to provide a sealing composition and a light-emitting element including the sealing composition that can prevent external static electricity from being introduced into the light-emitting element. The sealing composition also does not interfere with electrical signals and can be optimized by setting based on the discovery that general photocurable monomers cannot simultaneously optimize both curability and dielectric constant. The problem of driving failure is solved by a composition that improves both curability and dielectric constant.

According to the present disclosure, the above and other objects can be achieved by providing a sealing composition that includes a monomer compound and a initiator, wherein the monomer compound includes a first monomer and a second monomer, wherein the One monomer is represented by the following formula 1, the second monomer includes a multifunctional monomer having two or more functional groups, and the functional group includes at least one of acrylate and methacrylate, [Formula 1 ] Where R is hydrogen (H) or methyl, and n is an integer from 5 to 9.

The second monomer can be represented by the following formula 2: [Formula 2] Wherein R and R' are each independently hydrogen (H) or methyl, and n is an integer from 10 to 14.

Based on 100 parts by weight of the total amount of the first monomer and the second monomer, the monomer compound may include 35 to 50 parts by weight of the first monomer and 50 to 65 parts by weight of the second monomer.

The content of the starter may be 0.1 to 10 parts by weight based on 100 parts by weight of the monomeric compound.

The sealing composition may have a liquid dielectric constant of 4.45 or less at 25°C.

When cured, the sealing composition may have a solid dielectric constant at 25°C of 2.75 or less.

The sealing composition may have a viscosity of 1 to 25 centipoise at 25°C.

According to another aspect of the present disclosure, a light-emitting element is provided, at least one surface of the light-emitting element includes an organic cured film formed of the sealing composition.

Hereinafter, embodiments of the present disclosure will be explained in detail. However, the following examples are provided by way of illustration only to clearly understand the present disclosure, and the following examples do not limit the scope of the present disclosure.

The shapes, sizes, ratios, angles, and quantities disclosed in the drawings used to illustrate embodiments of the disclosure are examples only, and the disclosure is not limited to the details shown. Throughout this specification, the same reference numbers refer to the same components. In the following description, when it is determined that a detailed description of related known functions or configurations will unnecessarily obscure the gist of the present disclosure, they will not be described again.

Unless "only" is used, where terms such as "includes," "has," or "includes" are used in this specification, there may also be another part. Unless stated to the contrary, terms in the singular may include the plural. Furthermore, when interpreting a component, the component should be interpreted to include a margin of error even if this is not expressly stated.

When describing a positional relationship, for example, when a positional relationship is described as "on", "above", "below" or "near", it can include situations where there is no contact between them, unless "just" is used Or "directly".

Spatially relative terms, such as "below," "below," "lower," "above," and "upper," may be used herein to describe the relationship of one element or component in the figures to another element or component . It will be understood that the spatially relative terms are intended to encompass different orientations of the elements during use or operation in addition to the orientation depicted in the figures. For example, if components in one of the figures are turned upside down, components described as "below" or "beneath" other components would then be oriented "above" the other components. Thus, the exemplary terms "below" or "below" may encompass both "below" and "above." Likewise, the exemplary terms "above" or "upper" may encompass both "above" and "below."

When describing a temporal relationship, for example, when using "after", "following", "next" or "before" to describe a temporal sequence, this may include the case of a non-continuous relationship, unless "exactly" or "directly" is used.

It should be understood that although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish the individual components. Therefore, within the technical idea of the present disclosure, the first component may be called the second component.

It should be understood that the term "at least one" includes all combinations associated with any one item. For example, "at least one of the first component, the second component, and the third component" may include all combinations of two or more components selected from the first component, the second component, and the third component, and the third component. Each of the first component, the second component and the third component.

As those skilled in the art will readily appreciate, features of the various embodiments of the present disclosure may be partially or fully coupled or combined with each other, and may interoperate with each other and be technically driven in various ways. Embodiments of the present disclosure may be performed independently of each other or may be performed together in a related manner.

Before the present disclosure is described in detail below, it is to be understood that the terminology used herein is provided for describing particular embodiments only and is not limited only by the scope of the appended claims. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one skilled in the art.

Furthermore, the terms or words used in this specification and the scope of the following claims are intended to be interpreted as having meanings and concepts consistent with the technical ideas of the present disclosure described in this specification, and on the basis that the inventor can appropriately define the terms. Concepts are used to best describe the principles of the present disclosure, and the terms or words are not limited to common or dictionary meanings.

In one embodiment of the present disclosure, the present disclosure relates to a sealing composition that can be printed and photocured on a substrate. Specifically, the sealing composition is an organic composition capable of forming an organic layer of the sealant.

The term "printing" as used herein may refer to any of various types of coating including inkjet.

A sealant including a cured product formed of an organic composition may be disposed on an organic light-emitting element to reduce or prevent damage to the organic layer of the organic light-emitting element due to physical impact or foreign materials such as oxygen or moisture.

In addition, the composition of the organic cured film for the sealant according to the present disclosure is configured to perform the function of protecting the light-emitting element, which is an inherent function of the sealant, and to effectively prevent the introduction of static electricity that interferes with electrical signals.

In the present disclosure, the sealing composition may be a solvent-free photocurable composition. That is, the composition for forming an organic cured film for a sealant described later may be a composition that does not contain a solvent and contains a photocurable component.

The term "solvent-free composition" as used herein refers to a composition that does not contain solvents (eg, organic solvents or aqueous solvents).

The term "photocurable composition" as used herein refers to a composition that can be cured by free radical polymerization using light irradiation. Photocuring may be performed, for example, by irradiation with electromagnetic waves (eg, microwaves, infrared rays, ultraviolet rays, and gamma rays) or particle beams (eg, alpha particle beams including proton beams and neutron beams or electron beams).

Specific photocuring conditions are not particularly limited. However, for example, when ultraviolet light is used for photocuring, its wavelength can be in the range of 290 nanometers to 400 nanometers, which is the near ultraviolet region, and the light intensity during the total period of ultraviolet irradiation can be 400 milliwatts/cm² (mW/cm ² ) or less than 400 mW/cm2, or in the range of 100 mW/cm2 to 400 mW/cm2, and the light amount can be between 300 mJ/cm2 to 2,500 mJ/cm2 centimeters or in the range of 500 mJ/cm2 to 1,500 mJ/cm2.

Compared with solvent-based compositions, solvent-free compositions avoid the solvent drying process, thereby improving process efficiency and overcoming shortcomings such as bubble generation due to solvents and functional deterioration of the sealant.

In addition, the solvent-free composition can reduce the amount of moisture in the sealing composition, and therefore has the advantage of being suitable for organic light-emitting elements that are easily affected by moisture.

Furthermore, the composition may be a composition applied to the substrate by inkjet printing. Generally speaking, inkjet printing is advantageous for mass production or similar production because it uses multiple heads including multiple nozzles connected to each other. The compositions are configured to meet the viscosity and surface energy (tension) requirements set forth below in order to be suitable for inkjet printing.

In order to photo-cure the composition, the composition may include a compound having a photo-curable functional group. Specifically, the composition may be provided as a composition imparted with a reduced dielectric constant by including the first monomer.

Unless otherwise stated, the term "dielectric constant" as used herein refers to the liquid dielectric constant. The specific measurement method is disclosed in the experimental example described later.

To lower the dielectric constant, weakly polar monomers should be used. Despite their weak polarity, monomers with low dielectric constants often have only one functional group that generates free radicals during photocuring. For this reason, dielectric constant and curability are incompatible with each other; for example, a cured film is not formed even after photocuring.

Therefore, monomers that can compensate for lack of curability—for example, have a high dielectric constant but have sufficient functional groups that generate free radicals during photocuring and are capable of forming the desired cured film during photocuring. monomers—are used in combination to provide a sealing composition that exhibits storage stability and sufficient spray spreadability while significantly reducing the dielectric constant by 10% or more compared to related technologies.

In order to digitize the decrease in dielectric constant, the dielectric constant measured in the sealing composition is defined as "C" and will be measured in the sealing composition containing only 1,14-tetradecyl dimethacrylate (known in the industry as The dielectric constant measured in the sealing composition (i.e., 4.48) is defined as "D" as the reference value, and the correlation between C and D calculated according to Equation 1 below is 10 or greater than 10 , 12 or more, 12 to 20, 20 to 30 or 12 to 18. The range defined above can overcome the incompatibility between curability and dielectric constant and provide significantly both improved curability and significantly reduced dielectric constant. In this case, a value of 10 or more calculated using Equation 1 means that the dielectric constant is increased by 10% or more compared to the aforementioned reference value (D, 4.48), and curability is also ensured. [Equation 1] (D-C)/D × 100

The sealing composition according to the embodiment of the present disclosure contains a monomer compound and an initiator. The monomer compound includes a first monomer and a second monomer, wherein the first monomer is represented by the following formula 1, and the second monomer includes a multifunctional monomer having two or more functional groups. [Formula 1] Where R is hydrogen (H) or methyl, and n is an integer from 5 to 9.

According to an embodiment of the present disclosure, the monomer compound includes the first monomer represented by Formula 1 above.

In Formula 1, the first monomer may have an acrylate group or a (meth)acrylate group as a photocurable functional group.

According to embodiments of the present disclosure, in Formula 1, n may be, for example, 5, 7, or 9.

As a specific example, the first monomer may have any one of the structures represented by the following formulas 1-1 to 1-6. [Formula 1-1] [Formula 1-2] [Formula 1-3] [Formula 1-4] [Formula 1-5] [Formula 1-6]

According to embodiments of the present disclosure, the monomer compound may include at least one of the first monomers represented by Formula 1 above.

According to embodiments of the present disclosure, the first dielectric constant of the first monomer may be 2.90 to 3.50, more specifically, 3.00 to 3.30.

When the first dielectric constant of the first monomer is 2.90 to 3.50, it can provide spray spreadability and solid phase transmittance while reducing the dielectric constant measured in the composition by 10% or more compared to the prior art. More than 10%, while solving the compatibility problem between curing and dielectric constant.

According to embodiments of the present disclosure, the first monomer may be liquid at room temperature. When the first monomer is liquid at room temperature, storage stability is good.

According to an embodiment of the present disclosure, the monomer compound further includes a second monomer, and the second monomer includes a multifunctional monomer having two or more functional groups. The functional group includes at least one of acrylate and methacrylate.

Most low polarity monomers include only one functional group that generates free radicals during photocuring. Therefore, a cured film is not formed even after photocuring. That is, dielectric constant and curability are incompatible with each other.

Therefore, a sealing composition that has excellent storage stability and sufficient spray spreadability compared to the prior art while significantly reducing the dielectric constant to 10% or more can be obtained using a combination of the following monomers, Monomers that can compensate for lack of curability, such as monomers that have a high dielectric constant but have sufficient functional groups that generate free radicals during photocuring and can form the desired cured film during photocuring .

The monomer compound according to the embodiment of the present disclosure may further include a second monomer, thereby obtaining a sealing composition with excellent storage stability and spray spreadability while reducing the dielectric constant.

According to embodiments of the present disclosure, the second monomer may include a compound represented by the following Formula 2: [Formula 2] Wherein R and R' are each independently hydrogen (H) or methyl, and n is an integer from 10 to 14.

According to Formula 2, the second monomer may have an acrylate group or a (meth)acrylate group as a photocurable functional group.

The second monomer is a multifunctional monomer having two or more photocurable functional groups. When polyfunctional monomers are used, high cure rates are ensured, resulting in shorter cure times. Therefore, it can be advantageous in ensuring required physical properties of the organic cured film used for the sealing material.

When a cured film is formed by photocuring using a radical reaction, a phenomenon occurs in which the polymerization rate decreases as the generation of free radicals on the surface layer of the sealing composition decreases due to the influence of oxygen in the air. Furthermore, as the thickness of the cured film decreases, the ratio of the surface of the film to its interior increases, and therefore the problem of reduced polymerization rate due to this phenomenon may be more serious. Using a multifunctional monomer in consideration of this can increase the curing rate and shorten the curing time, whereby the required physical properties of the organic cured film for the sealing material can be easily ensured.

According to embodiments of the present disclosure, in Formula 2, n may be, for example, 10, 12, or 14.

As a specific example, the second monomer may have any one of the structures represented by the following formulas 2-1 to 2-6. [Formula 2-1] [Formula 2-2] [Formula 2-3] [Formula 2-4] [Formula 2-5] [Formula 2-6]

According to embodiments of the present disclosure, the monomer compound may include at least one of the second monomers represented by Formula 2 above.

According to embodiments of the present disclosure, the second dielectric constant of the second monomer may be 4.20 to 5.30, more specifically, 4.40 to 5.15.

When the second dielectric constant of the second monomer is 4.20 to 5.30, the compatibility problem between curing and dielectric constant is solved. Compared with the prior art, the dielectric constant measured in the composition is A reduction of 10% or more is achieved, and jet spreadability, solid phase transmittance, and similar properties can be obtained.

According to embodiments of the present disclosure, the second monomer may be liquid at room temperature. Storage stability increases when the second monomer is liquid at room temperature.

According to embodiments of the present disclosure, based on the total amount of 100 parts by weight of the first monomer and the second monomer, the monomer compound may include 35 to 50 parts by weight of the first monomer and 50 to 50 parts by weight. 65 parts by weight of the second monomer.

When based on 100 parts by weight of the total amount of the first monomer and the second monomer, the monomer compound includes 35 to 50 parts by weight of the first monomer and 50 to 65 parts by weight of the second monomer. When solid, the dielectric constant of the sealing composition can be reduced to a predetermined level, and excellent storage stability and spray spreadability can be obtained. In addition, even if external static electricity is supplied through thin films and high-resolution light-emitting elements, driving failure can be avoided and the viscosity range of 1 centipoise to 25 centipoise can be satisfied, which is suitable for use as a sealing composition.

According to embodiments of the present disclosure, the sealing composition contains an initiator. The initiator can absorb light energy from the outside and supply free radicals for photocuring the monomer compound to the acrylic end group of each monomer.

The starter may be, for example, a material that includes a backbone containing heteroatoms in the molecule that provides free radicals, and at least one aryl end group connected to the backbone via a carbonyl linking group. .

As a specific example, the initiator may have a main chain structure represented by any one of Formula 3 and Formula 4 below. [Formula 3] [Formula 4]

For example, an aryl end group connected to the main chain through a carbonyl linking group may have a structure represented by Formula 5 below. [Formula 5]

In addition, the initiator may use materials with absorption wavelengths in the range of 500 nanometers or less, specifically in the range of 380 nanometers to 410 nanometers, to improve the photocuring effect.

Specific examples of the starter include: hydroxyketone compounds, such as 1-hydroxycyclohexyl phenyl ketone (Irgacure 184); amino ketone compounds, such as 2-benzyl-2-(dimethylamine) base)-1-[4-(4-morpholinyl)phenyl]-1-butanone (Irgacure 369) and α-aminoacetophenone (Irgacure 907); benzyl dimethyl ketal compounds, For example, benzyldimethyl ketal (Irgacure-651); bisylphosphine-based compounds, such as phenylbis(2,4,6)-trimethylbenzylphosphonyl (Irgacure 819); and monocarboxylic acid phosphine Compounds, such as 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO).

Additionally, the sealing composition may include one or more additives selected from the group consisting of heat stabilizers, ultraviolet stabilizers, and antioxidants, and the additives may be selected from various other types of additives.

In addition, according to embodiments of the present disclosure, the content of the starter may be 10 parts by weight or less, more specifically 0.1 to 10 parts by weight based on 100 parts by weight of the monomer compound. When light energy is incident on the sealing composition, the content of the initiator within the range defined above supplies the acrylic end group of each of the first monomer and the second monomer constituting the sealing composition. It is preferable in terms of free radicals suitable for forming a coating film.

In this case, the light energy may, for example, range from an intensity of 400 mW/cm² or less, more specifically 100 mW/cm² to 400 mW/cm² or 200 mW. /cm² to 400 mW/cm² of laser or plasma supply, but not limited to this.

According to one embodiment of the present disclosure, the sealing composition may further contain additives within the scope that will not adversely affect the sealing composition, such as surfactants, adhesion aids for improving adhesion to the substrate, stabilizers, Adhesion accelerators, cure accelerators, thermal polymerization inhibitors, dispersants, plasticizers, fillers, defoaming agents or the like.

This additive may be used in an amount of 0.001% to 10% by weight, based on the total weight of the sealing composition. In this case, when the content of the additive is not within the above range, the cured film may have poor permeability, heat resistance, adhesion to the inorganic barrier layer, spray stability, and the like.

In this case, the surfactant can improve applicability, defoaming, leveling or similar properties, and examples thereof include fluorine-based surfactants such as BM-1000, BM-1100, Megapack F142D, Megapack F172, Megapack F173, Megapack F183, Fluorad FC-135, Fluorad FC-170C, Fluorad FC-430, Fluorad FC-431, Saffron S-112, Saffron S- 113. Saffron S-131, Saffron S-141, Saffron S-145, SH-28PA, SH-190, SH-193, SZ-6032 and SF-8428.

Furthermore, adhesion assistants are, for example, silane coupling agents having reactive substituents such as carboxyl groups, methacryl groups, isocyanate groups or epoxy groups. Specific examples thereof include trimethoxysilyl benzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetyloxysilane, vinyltrimethoxysilane, γ-glycidoxysilane Propyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and the like.

According to one embodiment of the present disclosure, the composition may not include silicon-derived units. When the composition does not include a silicon-derived unit, siloxane-based outgassing may occur at high temperatures, thereby causing damage to the light-emitting element.

According to embodiments of the present disclosure, the moisture content of the composition before curing may be 20 ppm or less. Traditional light-emitting components are easily affected by moisture. For this reason, if necessary, the moisture content before curing can be adjusted to 20 ppm or less through a moisture removal process.

Regarding the inkjet process, preferably, the sealing composition has a viscosity suitable for the inkjet process, such as a viscosity of 1 to 25 centipoise measured at 25° C. using a Brookfield viscometer. When the viscosity of the sealing composition at room temperature is 1 to 25 centipoise, both printing performance and curing performance can be improved. For reference, when the viscosity is too high, it is difficult to eject the composition from the inkjet nozzle, and when the viscosity is too low, it is difficult to form a coating film with an appropriate thickness due to increased fluidity.

According to one embodiment of the present disclosure, the sealing composition may have a surface energy (tension) in the range of 20 to 45 millinewtons per meter (mN/m) to facilitate self-spraying The ink nozzle ejects. The above range is suitable for smooth ejection of ink from the inkjet device. For reference, when the surface energy of the ink is large, the ink droplets may disperse, while when the surface energy is low, the spreadability or dispersion of the solution may increase when the solution collides with the substrate. Measurement of surface energy (tension) can be performed at 25°C using any of a variety of known methods (eg, the hanging ring method).

The sealing composition according to embodiments of the present disclosure may have a liquid dielectric constant measured at 25°C of 4.45 or less. More specifically, the sealing composition may have a liquid dielectric constant measured at 25° C. of 3.20 to 4.45. Within the above range, the sealing composition having a liquid dielectric constant of 4.45 or less can prevent driving failure in the light-emitting element even when external static electricity is introduced into the coating film, and can effectively protect the coating film from Oxygen, moisture and UV rays without the need for additional sealants.

Conventional mass-produced compositions have liquid dielectric constants in the range of about 4.50 or more and 6.20 or less, and therefore have disadvantages such as the generation of parasitic capacitance between electrodes or the inability to sufficiently prevent capacitance disturbances. However, the dielectric constant of the sealing composition having the aforementioned configuration may be 4.45 or less, more specifically 3.20 to 4.45. The lower limit of the dielectric constant is not particularly limited because lowering the dielectric constant is helpful in preventing capacitance disturbance.

Preferably, since the coating film that improves the physical properties of the light-emitting element can be effectively produced, the sealing composition according to the embodiment of the present disclosure has a curability measured at 1,000 millijoules at a wavelength of 395 nanometers under an _N2 atmosphere. is 95% or greater than 95%.

When the sealing composition provided according to embodiments of the present disclosure has an optical property (transmittance) of 95% or greater as measured using a UV-visible spectrometer, the luminescent characteristics and physical properties of the light-emitting element can be improved.

According to one embodiment of the present disclosure, a method for photopolymerizing a compound containing ethylenically unsaturated double bonds is provided, the method comprising using a laser with an intensity of 400 mW/cm2 or less. Or plasma is irradiated onto the sealing composition, in which the surface hardness increases due to the action of free radicals generated by light irradiation.

The measured solid dielectric constant of the organic cured film obtained by curing the sealing composition according to embodiments of the present disclosure may be 2.75 or less. The case where a sealing composition having a dielectric constant measured as a solid when cured is 2.75 or less is applied to an organic light-emitting element is suitable for protecting the coating film from external static electricity, and thus preventing driving failure of the light-emitting element.

According to embodiments of the present disclosure, the sealing composition can operate in a wavelength range of 290 nm to 400 nm, a light intensity of 100 mW/cm2 to 400 mW/cm2, and a light amount of 300 mJ/cm2. Centimeter to 2,500 millijoules/square centimeter by ultraviolet (UV) curing.

According to embodiments of the present disclosure, the sealing composition exists in a liquid form at room temperature, and therefore exhibits excellent storage stability.

According to another embodiment, an organic cured film including a cured product of the composition is provided.

In another embodiment of the present disclosure, the thickness of the organic cured film used for the sealant may be 0.5 micron to 100 micron, 1 micron to 90 micron, or 5 micron to 70 micron.

According to another embodiment of the present disclosure, a sealant is provided. Specifically, the sealant may include an organic cured film for the sealant and an inorganic layer including metal.

The inorganic layer may include metal components. The inorganic layer can also be a thin metal film.

In one embodiment, the inorganic layer may include at least one oxide or nitride selected from the group consisting of Al, Zr, Ti, Hf, Ta, In, Sn, Zn, Ce, and Si. The inorganic layer can be formed by vapor deposition. In this case, the specific deposition process is not particularly limited. For example, when the inorganic layer includes a Si component, the inorganic layer may have a SiNx film and/or a SiOx film.

According to another embodiment of the present disclosure, there is provided a light-emitting element having at least one surface thereof as an organic cured film formed of the sealing composition.

The configuration of the light emitting element is not particularly limited, and may be any configuration known to those of ordinary skill in the art.

Cured films are used in applications such as printing inks, printing plates, encapsulants, photoresists for electronic components, plating resists, etch resists, liquid and dry films, solder resists, used in the production of various display applications Resistants for color filters, resists used to produce structures in the process of producing plasma display panels, electroluminescent displays and liquid crystal displays (LCD), compositions used to produce spacers for LCDs, Compositions for holographic data storage (HDS), compositions for sealing electrical and electronic components, production of magnetic recording materials, micromechanical components, waveguides, optical switches, plating masks, etching In applications for masking, color correction systems, fiberglass cable coatings and screen printing templates, in applications for the production of three-dimensional objects by stereolithography, in applications as image recording materials, in applications for Decolorizing materials for holographic recording, microelectronic circuits and image recording materials, in applications for use in image recording materials using microcapsules, in applications as photoresist materials for ultraviolet and visible laser induced imaging systems, and in applications Used as a photoresist material for forming dielectric layers in sequentially built layers.

The transmittance of the cured film was measured according to ASTM D1003 using a UV-visible spectrometer, and it was found that the transmittance was 95% or greater, and its surface hardness was significantly improved compared to related technologies.

According to one embodiment, there is provided an electronic component including a cured film formed of a sealing film material or an overcoat material.

Non-limiting examples of the substrate for the cured film include substrates for electronic components, substrates with predetermined wiring patterns formed thereon, and the like. Examples of substrates include glass or plastic substrates coated or uncoated with silicon, silicon nitride, silicon oxide, titanium, tantalum, palladium, titanium tungsten, copper, chromium, aluminum, AlNd, ITO, IGZO, or the like .

Hereinafter, the present disclosure will be described in more detail with reference to examples. These examples are provided only to provide a better understanding of the disclosure and should not be construed to limit the scope of the disclosure. Examples ＜ Examples and Comparative Examples ＞

The compositions of Examples and Comparative Examples were prepared using the photocurable first monomer and the second monomer shown in Table 1 while changing their contents as shown in Table 2 below. All monomers A1 to A4 shown in Table 1 below are compounds of formula 1, where R is methyl, and B1 to B5 are compounds of formula 2, where R is methyl, and R' is methyl. In addition, the molecular formula of 01, another photocurable monomer, is C ₁₇ H ₁₆ O ₃ and is o-phenylphenol EO acrylate (CAS 72009-86-0).

Mix 3 to 4 parts by weight of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide as a starter with a total of 100 parts by weight of the first monomer and the second monomer. .

Irradiate short-wavelength ultraviolet light (UV light emitting diode (LED) light source, light intensity throughout the irradiation time: 400 milliwatts/cm², light quantity: 1,000 millijoules/cm²) at room temperature to The composition was cured to a thickness of 8 microns.

Tables 1 to 3 below show physical properties measured using the following evaluation items of raw materials, sealing compositions, or cured products. Assessment item * Calculation and equation of liquid dielectric constant 1

Liquid dielectric constant: The liquid dielectric constant was measured at room temperature at 10 kHz using a dielectric constant meter (Model 871) and is shown in Tables 1 and 3 below.

In addition, the measured dielectric constant of the liquid is set to "C" in Equation 1 below. In the C value, the dielectric constant of the liquid measured using 100% monomer B4 is used as the value "D" in Equation 1 below, and the calculation results (in %) are listed in Table 3 below. [Equation 1] (D-C)/D × 100 *Calculation and equation 1 of solid dielectric constant

Solid dielectric constant: The dielectric constant was measured using a precision impedance analyzer at 100 kHz.

In addition, the measured solid dielectric constant is set to "C" in Equation 1, and the solid dielectric constant measured using 100% monomer B4 is used as the value "D" in Equation 1, and calculated The results (in %) are illustrated in Table 3 below.

By spin-coating the composition on a Cr glass (Cr thickness: 1,600 angstroms) substrate, curing (thickness: 8.0 microns, exposure dose: 1,000 mJ/cm2), and depositing Al on the organic cured film (Al thickness: 1,000 angstroms) Angstrom, Al size is 3.0*3.0 mm2) and the solid dielectric constant sample was prepared.

*Viscosity (cPs at 25°C): Measured using Brookfield/DV-II+Pro viscometer.

*Storage stability (phase change): The phase change is observed when the sealed composition is stored at 15°C for 3 days, and when the composition remains liquid without phase change for 3 days, the storage stability is considered For excellence. In Table 3 below, the composition that solidified after 3 days is represented as solid, and the composition that remained liquid is represented as liquid.

*Curing rate: The sealing composition is spin-coated on a bare glass substrate (8.0 micron thickness, 1,000 mJ/cm2 exposure) and then cured. The solidified material was scraped off and measured in FT-IR reflectance mode (ATR). FT-IR: Spectrum 100 PerkinElmer/ATR Durascope SensIR (Spectrum 100 PerkinElmer/ATR Durascope SensIR)

The measured peak area was calculated using the following equation and based on this the cure rate was calculated. Cure rate=

*Inkjet spreadability: Spreadability was evaluated based on the change in droplet size after 5 minutes of curing compared to the initial droplet size when the sealing composition was sprayed in a volume of 13 picoliters at an inkjet head temperature of 35°C. . For reference, when the spreadability is about 110% to about 130%, the coating surface is well formed. When spreadability is low, the droplets will not spread and the surface will not form properly. When the spreadability is too high, the sealing composition flows downward before UV curing, which disadvantageously makes it impossible to form a normal surface.

[Table 1] photocurable monomer Unit number n or compound name viscosity Liquid dielectric constant solid dielectric constant The first monomer (Formula 1) A1 n=5 8.39 3.29 2.42 A2 n=7 12.18 3.19 2.39 A3 n=9 18.16 3.08 2.36 A4 n=11 26.32 2.98 2.33 The second monomer (Formula 2) B1 n=9 8.26 5.23 2.97 B2 n=10 9.31 5.08 2.93 B3 n=12 11.93 4.78 2.84 B4 (D, based on equation 1) n=14 15.25 4.48 2.76 B5 n=16 19.27 4.18 2.67 other O1 o-Phenylphenol EO acrylate 135.00 5.18 2.96

*n in Table 1 is the same as n in Formula 1 or 2.

[Table 2] Project First unit First monomer content (parts by weight) Second monomer Second monomer content (parts by weight) Example 1 A3 50 B4 50 Example 2 A3 50 B3 50 Example 3 A3 55 B2 45 Example 4 A2 35 B4 65 Example 5 A2 50 B3 50 Example 6 A1 50 B3 50 Comparative example 1 A4 100 - - Comparative example 2 A3 100 - - Comparative example 3 - - B5 100 Comparative example 4 - - B4 100 Comparative example 5 - - B3 100 Comparative example 6 - - B1 100 Comparative example 7 A4 50 B4 50 Comparative example 8 A2 35 B1 65 Comparative example 9 A1 35 B1 65 Comparative example 10 O1 35 B3 65

[table 3] Project Liquid dielectric constant Equation 1 for liquid dielectric constant (%) solid dielectric constant Equation 1 for solid dielectric constant (%) Viscosity (cPs) Curing rate (%) Inkjet spreadability (%) Storage stability (phase change) Example 1 3.78 16% 2.56 7% 16.70 98.8% 117% liquid Example 2 3.93 12% 2.60 6% 15.04 98.4% 119% liquid Example 3 3.98 11% 2.62 5% 14.17 98.3% 120% liquid Example 4 4.03 10% 2.63 5% 14.18 98.6% 118% liquid Example 5 3.98 11% 2.62 5% 12.05 97.9% 117% liquid Example 6 4.04 10% 2.75 0% 10.16 98.8% 110% liquid Comparative example 1 2.98 34% - - 26.32 0% - solid Comparative example 2 3.08 31% - - 18.16 0% - liquid Comparative example 3 4.18 7% - - 19.27 0% 102% solid Comparative example 4 4.48 0% 2.76 0% 15.25 89.0% 100% liquid Comparative example 5 4.78 -7% 2.84 -3% 11.93 90.1% 117% liquid Comparative example 6 5.23 -17% 2.97 -8% 8.26 91.3% 105% liquid Comparative example 7 3.73 17% 2.54 8% 20.79 95.6% 116% solid Comparative example 8 4.51 -1% 2.77 0% 9.63 97.5% 114% liquid Comparative example 9 4.55 -2% 2.78 -1% 8.31 98.3% 112% liquid Comparative example 10 4.92 -10% 2.88 -5% 20.01 95.2% 117% liquid

From the results in Table 3, it can be seen that the dielectric constants of the sealing compositions according to Examples 1 to 6 that are properly mixed in consideration of the compatibility between curability and dielectric constant are lower than those that are not mixed or are not properly mixed. Dielectric constant of the sealing compositions of Comparative Examples 1 to 10.

Specifically, Examples 1 to 6 exhibit liquid dielectric constants in the range of 3.78 to 4.04, while Comparative Examples 4 to 6 and Comparative Examples 8 to 10 exhibit liquid dielectric constants higher than 4.45.

Furthermore, as can be seen from the calculated values in Equation 1 which quantifies the degree of decrease in the dielectric constant of the liquid, the sealing compositions according to Examples 1 to 6 were found to be appropriately mixed in consideration of the compatibility between curability and dielectric constant. Compared with the reference value (D, 4.48), the material reduces the dielectric constant by 10% or more.

On the other hand, it can be seen that the sealing compositions according to Comparative Examples 3 to 6 and Comparative Examples 8 to 10 that were not mixed to solve the compatibility problem exhibited a decrease in dielectric constant of only 7% or less, and Therefore the desired low dielectric properties are not fully achieved.

In addition, since the sealing compositions according to Comparative Examples 1 to 3 are not fully cured, the solid dielectric constant cannot be measured, and the sealing compositions according to Comparative Examples 4 to 6 and Comparative Examples 8 to 10 The composition has a solid dielectric constant greater than 2.75.

In addition, Comparative Example 1 had a high viscosity of 26.32 centipoise, while Comparative Examples 1, 3 and 7 solidified and showed poor storage stability when stored at 15°C for 3 days.

As is apparent from the above, the sealing composition according to the embodiments of the present disclosure can exhibit a low dielectric constant, and therefore can solve the problem of external electrostatic interference introduced into the substrate when achieving a dielectric film with high resolution. signal and cause driver failure.

Furthermore, sealing compositions according to embodiments of the present disclosure may exhibit low dielectric constant and thus prevent capacitance disturbance.

In addition, the sealing composition according to the embodiments of the present disclosure has a low dielectric constant but ensures curability (the curability is generally considered to be a property incompatible with the dielectric constant), providing improved storage stability. and jet spreadability, can be used in inkjet processes, and improve the lifespan and reliable stability associated with the physical properties of the light-emitting element.

Furthermore, the sealing composition according to the embodiment of the present disclosure has the effect of acting as a sealant without additionally forming a sealing film.

The features, structures, effects, and the like illustrated in each of the above embodiments may be combined or modified in other embodiments by those skilled in the embodiments. Accordingly, matters relating to such combinations and modifications should be construed as falling within the scope of this disclosure.

without

without

Claims (6)

A sealing composition, including: a monomer compound; and a initiator, wherein the monomer compound includes: a first monomer; and a second monomer, wherein the first monomer is represented by the following formula 1, The second monomer includes a multifunctional monomer having two or more functional groups, and the functional groups include at least one of acrylate and methacrylate,

Wherein R is hydrogen (H) or methyl, and n is an integer from 5 to 9, wherein the second monomer is represented by the following formula 2:

wherein R and R' are each independently hydrogen (H) or methyl; and n is an integer from 10 to 14, where based on 100 parts by weight of the total amount of the first monomer and the second monomer, The monomer compound includes 35 to 50 parts by weight of the first monomer and 50 to 65 parts by weight of the second monomer. The sealing composition according to claim 1, wherein the content of the initiator is 0.1 to 10 parts by weight based on 100 parts by weight of the monomer compound. The sealing composition according to claim 1, wherein the liquid dielectric constant of the sealing composition at 25°C is 4.45 or less than 4.45. The sealing composition of claim 1, wherein when cured, the sealing composition has a solid dielectric constant at 25° C. of 2.75 or less. The sealing composition as claimed in claim 1, wherein the viscosity of the sealing composition at 25°C is 1 centipoise to 25 centipoise. A light-emitting element, at least one surface of which includes an organic cured film formed of the sealing composition according to claim 1.