TWI832102B - Potting method of electronic device - Google Patents

Abstract

A potting method of electronic device includes placing an electronic device in a mold, injecting a potting sealant into the mold, inserting a release tool between the potting sealant and the mold to form an opening after the potting sealant being cured and integrated with the electronic device, injecting a release liquid into the opening continuously to separate the cured potting sealant and the mold, and taking out the integrated electronic device and the cured potting sealant from the mold.

Description

Potting methods for electronic devices

The invention relates to a potting method for electronic devices.

In the development process of electronic devices, in order to strengthen the integrity of the electronic device, improve the shock-absorbing effect, avoid direct exposure of the components and circuits of the electronic device, and improve the insulation between the components and circuits of the electronic device, it will have a negative impact on the electronic device. One way to pott the device is to put the electronic device into a mold and pott it so that the surface of the electronic device and around the contacts are covered with potting glue to structurally strengthen and protect it.

Generally speaking, when an existing mold is used for the first time, the demoulding method requires cutting and peeling the mold with a knife before the electronic device can be taken out smoothly. If the damaged mold needs to be reused, it needs to be bound. Or the mold can be filled with glue again only by attaching the means to restore the approximate original state of the mold enough to hold the potting glue. However, due to the inconsistent traces of the first demoulding and cutting, subsequent surface sealing of electronic devices will have different traces, and reused molds are prone to glue overflow due to poor binding or attachment methods. and deformation, resulting in the need for further processing and trimming, which increases the working hours and the complexity of the process.

Therefore, how to demould the potted electronic device without damaging the mold, and make the electronic device and potting glue have a more consistent surface when the mold is reused, so as to improve the product yield and Saving man-hours is a problem that those skilled in the art must overcome.

The present invention provides a potting method for an electronic device, which can efficiently complete the potting operation of the electronic device and ensure that the finished product has higher quality.

The potting method of an electronic device of the present invention includes placing the electronic device into a mold, injecting potting glue into the mold, and after the potting glue solidifies and becomes integrated with the electronic device, a demoulding tool is inserted between the potting glue and the mold. To form an opening, continuously pour the demoulding liquid from the opening to separate the potting glue and the mold, and finally take out the integrated electronic device and the potting glue from the mold.

Based on the above, in the potting method of the electronic device of the present invention, after the potting glue is solidified and integrated with the electronic device, a demoulding tool is first inserted between the mold and the potting glue to form an opening, and the demoulding liquid is injected At the opening, as the demoulding liquid spreads, the friction between the potting glue and the mold is also reduced by the demoulding liquid until the two separate. Therefore, the electronic device can be smoothly connected to the potting material without damaging the mold. The sealant is removed from the mold to complete the demoulding operation, and the mold can also be recycled and reused after cleaning. According to this, when the mold is not damaged, the potting operation of the electronic device can maintain stable quality, which means that the consistency of its surface can be maintained. This also means that there is no need for additional potting of the electronic device. Glue for trimming or other processing, so it can have Effectively save man-hours and reduce the complexity of the production process.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings.

100:Mold

200:Electronic devices

300: Potting glue

400: Mold release tool

500: Defilming liquid

A1: Open your mouth

A2: Block

S100, S200, S300, S400, S410, S420, S500: Steps

FIG. 1 is a flow chart of a potting method for an electronic device according to an embodiment of the present invention.

Figures 2 and 3 respectively illustrate schematic diagrams corresponding to part of the process in Figure 1.

4A and 4B illustrate steps and schematic diagrams of part of the process in FIG. 1 .

FIG. 1 is a flow chart of a potting method for an electronic device according to an embodiment of the present invention. Figures 2 and 3 respectively show schematic diagrams corresponding to part of the process in Figure 1. Please refer to FIG. 1 and compare with FIG. 2 or FIG. 3. In this embodiment, the electronic device 200 is, for example, a motor controller of an electric bicycle, which is arranged outside the body (vehicle tube) of the electric bicycle to serve as a drive and control device. For the purpose of the motor, the electronic device 200 is composed of multiple circuit boards with electronic components and wires on them. In order to provide sufficient protection, waterproofing, and dustproof effects, the electronic device 200 needs to be potted.

As shown in FIG. 1 , the potting method of the electronic device 200 includes: step S100 , placing the electronic device 200 into the accommodation space of the mold 100 , as shown in FIG. 2 . Next, please refer to FIG. 3 , step S200 , inject the potting glue 300 into the mold 100 , where the depth after the injection of the potting glue 300 is sufficient to cover the electronic device 200 but is less than the accommodation space of the mold 100 . the depth between. In step S300, after the potting glue 300 is solidified, the demoulding tool 400 is inserted between the potting glue 300 and the inner wall of the mold 100 to form an opening A1. Step S400 , continuously inject the mold release liquid 500 from the opening A1 to separate the solidified potting glue 300 and the mold 100 through the mold release liquid 500 . Finally, in step S500, after the cured potting glue 300 and the mold 100 are roughly separated, the integrated electronic device 200 and the (cured) potting glue 300 are taken out from the mold 100, and the mold 100 is cleaned. Can be recycled and reused.

In this embodiment, the mold 100 is made of silicone, and its elastic deformability is beneficial to the subsequent demoulding operation of the electronic device 200 and the potting glue 300, which will be further described later. Furthermore, the potting glue 300 in this embodiment may be one of polyurethane potting glue, organic silicon potting glue, and epoxy resin potting glue. The demoulding tool 400 is a flat rod made of plastic material, and the end profile is tapered to form a tip-like profile, which is also beneficial to the demoulding operation. On the other hand, the release liquid 500 in this embodiment is liquid water at normal temperature. In addition to the physical properties of the liquid, it easily penetrates between the potting glue 300 and the inner wall of the mold 100 and spreads accordingly. Its chemical properties are also This prevents chemical changes from the potting glue 300 or the mold 100, thereby avoiding damage to the potting glue 300 or the mold 100.

4A and 4B illustrate steps and schematic diagrams of part of the process in FIG. 1 . Please compare Figure 4A, Figure 4B and Figure 3 at the same time. Specifically, when the cured potting glue 300 and the electronic device 200 become an integrated object, due to the elasticity of the mold 100, the flat rod is demoulded. The end of the tool 400 can be inserted between the potting compound 300 and the inner wall of the mold 100 to form the opening A1, as shown in Figures 3 and 4A, and then continue. Inject liquid normal temperature water from opening A1 to allow it to gradually penetrate. As shown in FIG. 4A , the opening A1 also represents the space where the demoulding liquid 500 exists, while the remaining area A2 represents the range where the potting glue 300 is still attached to the inner wall of the mold 100 . Due to the elastic characteristics of the mold 100, during the process of continuously injecting the demoulding liquid 500, the mold 100 can be extruded and deformed to expand the opening A1 in step S410. This also means that the demoulding liquid 500 is squeezed and the opening A1 is expanded. Driven to block A2 to spread. In step S420, the demoulding tool 400 originally used to form the opening A1 is gradually inserted into the bottom of the internal accommodation space of the mold 100, which is equivalent to using the demoulding tool 400 to enlarge the opening A1. At the same time, this also means that when the demoulding tool 400 is used to open the potting glue 300 and the inner wall of the mold 100, the demoulding liquid 500 can be used as a gap, so that the opened potting glue 300 and the mold 100 can be separated. The inner walls will not stick together again. Among them, the demoulding liquid 500 can also reduce the friction between the potting glue 300 and the inner wall of the mold 100, and also provide a lubrication effect, which is beneficial to integrating the potting glue. 300 and the electronic device 200 are extruded from the mold 100 .

To sum up, in the potting method of the electronic device of the present invention, after the potting glue is solidified and integrated with the electronic device, a demoulding tool is first inserted between the mold and the potting glue to form an opening, and the demoulding tool is injected into the potting method. The film liquid is in the opening. As the release liquid spreads, the friction between the potting glue and the mold is also reduced by the release liquid until the two separate. Therefore, the electronic device can be smoothly attached to the mold without damaging the mold. The potting glue is removed from the mold to complete the demoulding operation, and the mold can also be recycled and reused after cleaning. According to this, when the mold is not damaged, the potting operation of electronic devices can maintain stable quality, that is, the consistency of its surface can be maintained, and it also represents this This eliminates the need for additional trimming or other processing of the potting glue on the electronic device, so it can effectively save man-hours and reduce the complexity of the manufacturing process.

Although the present invention has been disclosed above through embodiments, they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the appended patent application scope.

S100, S200, S300, S400, S500: steps

Claims (10)

A potting method for an electronic device, including: placing the electronic device into a mold; injecting potting glue into the mold; after the potting glue solidifies and becomes integrated with the electronic device, inserting a demoulding tool into the potting glue and the mold An opening is formed between the molds; a release liquid is continuously injected from the opening to separate the potting glue and the mold; and the integrated electronic device and the potting glue are taken out from the mold, wherein the mold is elastic , so that the electronic device and the potting glue are not damaged and the surface consistency of the mold is maintained during the process of taking out the electronic device and the potting glue, so that the mold can be recycled and reused. The potting method of the electronic device according to claim 1, further comprising: during the process of continuously injecting the demoulding liquid, extruding and deforming the mold to expand the opening. The potting method of an electronic device as described in claim 1 further includes: during the process of continuously injecting the demoulding liquid, continuing to separate the potting glue and the mold with the demoulding tool to expand the opening. The potting method for an electronic device as claimed in claim 1, wherein the potting glue is one of a polyurethane potting glue, an organic silicon potting glue, and an epoxy resin potting glue. The potting method of an electronic device as described in claim 1, wherein the mold is made of silicone. The potting method for an electronic device as claimed in claim 1, wherein the demoulding tool is a flat rod. The potting method for an electronic device as claimed in claim 1, wherein the demoulding tool is made of plastic. The potting method for an electronic device as claimed in claim 1, wherein the film-removing liquid is liquid water at room temperature. The potting method of the electronic device as described in claim 1 further includes: when the demoulding liquid spreads to 90% to 95% of the contact area between the inner wall surface of the mold and the potting glue, The mold is squeezed to push out or pull out the integrated electronic device and the potting glue. The potting method of an electronic device as described in claim 1, wherein the mold release liquid reduces the friction between the cured potting glue and the inner wall of the mold.

Images