TWI831996B - Massive micro-dispensing method and device - Google Patents
Massive micro-dispensing method and device Download PDFInfo
- Publication number
- TWI831996B TWI831996B TW109127214A TW109127214A TWI831996B TW I831996 B TWI831996 B TW I831996B TW 109127214 A TW109127214 A TW 109127214A TW 109127214 A TW109127214 A TW 109127214A TW I831996 B TWI831996 B TW I831996B
- Authority
- TW
- Taiwan
- Prior art keywords
- glue
- micro
- probe
- groove
- dispensing
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract description 17
- 239000000523 sample Substances 0.000 claims abstract description 50
- 239000003292 glue Substances 0.000 claims abstract description 49
- 238000007598 dipping method Methods 0.000 claims abstract description 9
- 238000009499 grossing Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000007790 scraping Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 6
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002096 quantum dot Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
一種巨量微點膠方法,包括:藉由點膠機將膠狀物塗在沾膠平台的凹槽中;刮平凹槽的膠狀物,避免溢出沾膠平台;以及,以陣列的探針多次錯位深入凹槽,每次以探針端部的微紋路結構決定膠狀物的沾粘量。為了實現上開方法,本發明的一種巨量微點膠裝置包括:一個沾膠平台、一個刮板、一個點膠機與一個巨量轉移探針模組。該沾膠平台具備一個凹槽,該巨量轉移探針模組配置陣列的一組探針。其中,該膠狀物使微型LED或QD粘著在探針的端部,隨著探針移動到預定位置,輕鬆地完成單次巨量轉移作業。A massive micro-dispensing method, including: applying glue in the grooves of the glue-dip platform through a dispensing machine; scraping the glue in the grooves to avoid overflowing the glue-dip platform; and using an array of detectors to The needle is misaligned and penetrated into the groove multiple times, and each time the micro-texture structure at the end of the probe determines the amount of glue that sticks. In order to realize the top-opening method, a large-volume micro-dispensing device of the present invention includes: a glue-dipping platform, a scraper, a dispensing machine and a large-volume transfer probe module. The glue-dipping platform has a groove, and the massive transfer probe module configures a set of probes of the array. Among them, the glue allows micro-LEDs or QDs to stick to the end of the probe, and as the probe moves to a predetermined position, a single large-volume transfer operation can be easily completed.
Description
本發明涉及顯示器的點膠技術,尤指一種巨量微點膠方法,以及該方法實現巨量微點膠的一種裝置。The present invention relates to dispensing technology for displays, in particular to a method of massive micro-dispensing and a device for realizing massive micro-dispensing using the method.
現今的顯示器,邁入輕、薄、短、小的高科技領域。主要是借助一些微型發光二極體(Micro LED,以下簡稱為微型LED)或量子點(Quantum Dot,縮寫為QD)特殊的光電性質,產生紅、綠、藍(RGB)純粹三原色光的技術應用在顯示產業。Today's displays have entered the high-tech field of being light, thin, short, and small. It mainly relies on the special photoelectric properties of some micro light-emitting diodes (Micro LED, hereinafter referred to as micro LED) or quantum dots (Quantum Dot, abbreviated as QD) to produce pure three primary color lights of red, green and blue (RGB). in the display industry.
無論是微型LED或QD,都擁有微小的體積,採用導電銀膠固化在一片基板上。藉由一個點膠設備將導電銀膠點在基板指定位置,經過一定溫度的烘烤時間,該導電銀膠成為固體,使微型LED或QD粘著於基板表面。Whether it is a micro-LED or QD, they all have a tiny size and are solidified on a substrate using conductive silver glue. A dispensing equipment is used to place conductive silver glue at a designated position on the substrate. After baking at a certain temperature, the conductive silver glue becomes solid, allowing micro LEDs or QDs to adhere to the surface of the substrate.
但是,目前的點膠設備停留在單點出膠的技術。假設,該基板粘著一萬顆微型LED或QD,那麼點膠設備需要執行單點出膠動作,連續且不間斷的運作一萬次;或者,一萬台點膠設備同時進行一次單點出膠動作。However, the current dispensing equipment is stuck in the single-point dispensing technology. Assuming that 10,000 micro-LEDs or QDs are adhered to the substrate, the dispensing equipment needs to perform a single-point dispensing action and operate continuously and uninterrupted 10,000 times; or, 10,000 dispensing equipment needs to perform a single-point dispensing operation at the same time. glue action.
因此,如何改善傳統式點膠技術的弊端,就成為本發明亟待解決的課題。Therefore, how to improve the shortcomings of traditional dispensing technology has become an urgent issue to be solved in the present invention.
鑒於此,本案發明人提出一種巨量微點膠方法,主要目的在於:採用鋪平方式,在多次錯位沾黏過程中,以陣列的微紋路結構獲得沾粘量均勻的膠狀物,幫助微型LED或QD完成巨量轉移。In view of this, the inventor of this case proposed a massive micro-dispensing method. The main purpose is to use the paving method to obtain a uniform amount of glue with the micro-texture structure of the array during multiple dislocation bonding processes, helping Micro LED or QD completes mass transfer.
本發明提出一種巨量微點膠裝置,主要目的在於:實現上開方法完成微型LED或QD巨量轉移之效能。The present invention proposes a large-volume micro-dispensing device, whose main purpose is to realize the efficiency of the top-opening method to complete the large-volume transfer of micro-LEDs or QDs.
源於上述目的之達成,本發明巨量微點膠方法,包括:Based on the achievement of the above objectives, the massive micro-dispensing method of the present invention includes:
塗膠:藉由點膠機將膠狀物塗在沾膠平台的凹槽中;Gluing: Use a glue dispensing machine to apply glue to the grooves of the glue platform;
鋪平:刮平凹槽的膠狀物,避免溢出沾膠平台;以及Smoothing: Smooth the glue in the groove to avoid overflowing the glue-stained platform; and
沾粘:以陣列的探針多次錯位深入凹槽,每次以探針端部的微紋路結構決定膠狀物的沾粘量。Sticking: The probes of the array are dislocated multiple times and penetrate into the groove. The micro-texture structure at the end of the probe determines the amount of glue sticking each time.
如此,本發明的巨量微點膠方法中,該沾膠平台在凹槽鋪平厚度均勻的膠狀物,允許探針多次深入凹槽沾黏膠狀物。因為錯位關係,所以探針插入凹槽的位置,每次都是不同的,致使微紋路結構獲得沾粘量均勻的膠狀物。In this way, in the massive micro-dispensing method of the present invention, the glue-spreading platform spreads glue with a uniform thickness in the groove, allowing the probe to penetrate deeply into the groove multiple times to dip the glue-like substance. Because of the misalignment, the position where the probe is inserted into the groove is different every time, resulting in a micro-textured structure with a uniform amount of glue.
當探針離開沾膠平台,該膠狀物使微型LED或QD粘著在探針的端部,隨著探針移動到預定位置(如乘載基板),輕鬆地完成單次巨量轉移作業。When the probe leaves the glue-dipping platform, the glue causes the micro LED or QD to stick to the end of the probe. As the probe moves to a predetermined position (such as carrying a substrate), a single large-volume transfer operation can be easily completed. .
為了實現上開方法關於巨量轉移之效能,本發明的巨量微點膠裝置,包括:一個沾膠平台具備一個凹槽;一個點膠機將膠狀物塗在凹槽中;一個刮板刮平凹槽的膠狀物;以及,一個巨量轉移探針模組操作陣列的一組探針深入凹槽中,該探針的端部形成一個微紋路結構決定膠狀物的沾粘量。In order to realize the performance of the top-opening method on large-volume transfer, the massive micro-dispensing device of the present invention includes: a glue-dip platform with a groove; a glue-dispensing machine to apply glue in the groove; and a scraper Smooth out the glue in the groove; and, a massive transfer probe module operates a set of probes of the array to penetrate deeply into the groove, and the end of the probe forms a micro-texture structure to determine the amount of glue stuck .
其中,該微紋路結構是隆起探針端部的凸紋。或者,該微紋路結構是陷入探針端部的凹紋。Wherein, the micro-texture structure is a ridge that raises the end of the probe. Alternatively, the microtextured structure is a dimple that is sunk into the tip of the probe.
另外,該膠狀物是導電銀錫,在探針改變溫度時,該導電銀錫(亦即膠狀物)粘著微紋路結構的程度會隨之變化。In addition, the gel is conductive silver-tin. When the temperature of the probe changes, the degree to which the conductive silver-tin (ie the gel) adheres to the micro-texture structure will change accordingly.
為使本發明之目的、特徵和優點淺顯易懂,茲舉一個或以上較佳的實施例,配合所附的圖式詳細說明如下。In order to make the purpose, features and advantages of the present invention easy to understand, one or more preferred embodiments are described in detail below with reference to the attached drawings.
第1圖是流程圖,繪製本發明的巨量微點膠方法,歷經下列三道程序:Figure 1 is a flow chart depicting the massive micro-dispensing method of the present invention, which goes through the following three procedures:
塗膠10步驟:藉由點膠機將膠狀物塗在沾膠平台的凹槽中;10 steps of glue application: Use a glue dispensing machine to apply the glue into the groove of the glue platform;
鋪平12步驟:刮平凹槽的膠狀物,避免溢出沾膠平台;以及12 steps of paving: Smooth the glue in the groove to avoid overflowing the glue-stained platform; and
沾粘14步驟:以陣列的探針多次錯位深入凹槽,每次以探針端部的微紋路結構決定膠狀物的沾粘量。14 steps of adhesion: The probes of the array are dislocated multiple times and penetrated into the groove. Each time, the micro-texture structure at the end of the probe determines the amount of glue to be adhered.
如第2〜4圖所示,為了實現上開方法關於巨量轉移之效能,本發明的一種巨量微點膠裝置,包括:一個沾膠平台20、一個刮板24、一個點膠機30與一個巨量轉移探針模組40。其中,該沾膠平台20具備一個凹槽22,該巨量轉移探針模組40配置陣列的一組探針42。As shown in Figures 2 to 4, in order to realize the efficiency of the top-opening method in terms of large-volume transfer, a large-volume micro-dispensing device of the present invention includes: a glue-dipping
在第2圖中,所述的點膠機30擠出四條膠狀物32,每條膠狀物32順著沾膠平台20的寬度方向塗在凹槽22底面,完成塗膠步驟。In Figure 2, the
在第3圖中,所述的刮板24沿著沾膠平台20長度方向滑過凹槽22,將厚度均勻的膠狀物32抹在凹槽22底面,避免溢出沾膠平台20,完成鋪平步驟。In Figure 3, the
如第4圖所示,該巨量轉移探針模組40是橫向(或稱水平方向)移動的,操作該組探針42多次沿著縱向(或稱垂直方向)深入凹槽22中。該探針42單次深入凹槽22的方位,與前次落在凹槽22位置是錯開的,確保探針42的端部浸潤大致相同的膠狀物32,完成沾粘步驟。As shown in FIG. 4 , the mass
第5圖是立體圖,顯示該探針42的端部44形成一個微紋路結構46A。圖中,該微紋路結構46A是環形的一個凹紋,該凹紋陷入探針42的端部44,決定膠狀物的沾粘量。Figure 5 is a perspective view showing that the
至於凹紋狀態的實施例,還有第8圖的微紋路結構46D,以及第9圖的微紋路結構46E。As for the embodiments of the dimpled state, there are also the
第6圖同樣是立體圖,顯示該微紋路結構46B是環形的一個凸紋,該凸紋隆起探針42的端部44,決定膠狀物的沾粘量。Figure 6 is also a perspective view, showing that the
表現凸紋狀態的實施例,則有第7圖的微紋路結構46C、第10圖的微紋路結構46F、第11圖的微紋路結構46G以及第12圖的微紋路結構46H。Examples that express the ridge state include the
回頭看到第4圖,該膠狀物32是導電銀錫。在探針42(或巨量轉移探針模組40)改變溫度時,該導電銀錫(亦即膠狀物32)粘著微紋路結構的程度會隨之變化。Looking back at Figure 4, the
此處所稱的溫度改變,可通過熱傳導、熱對流與熱輻射三種傳播方式之一,改變探針42的溫度。The temperature change referred to here can change the temperature of the
當探針42離開沾膠平台,該膠狀物32使微型LED或QD(圖未繪)粘著探針42,移動到預定位置(如乘載基板)完成轉移作業。When the
10:塗膠
12:鋪平
14:沾粘
20:沾膠平台
22:凹槽
24:刮板
30:點膠機
32:膠狀物
40:巨量轉移探針模組
42:探針
44:端部
46A、46B、46C、46D、46E、46F、46G、46H:微紋路結構10: Glue
12: Pave
14: Sticky
20: Glue-dipping platform
22: Groove
24:Scraper
30:Glue dispensing machine
32:Gel
40: Mass transfer probe module
42:Probe
44:
第1圖繪製本發明巨量微點膠方法的流程。 第2〜4圖表現本發明實現巨量微點膠的裝置。 第5〜12圖顯示微紋路結構的形狀。Figure 1 depicts the process of the massive micro-dispensing method of the present invention. Figures 2 to 4 show the device of the present invention for realizing massive micro-dispensing. Figures 5 to 12 show the shape of the microtexture structure.
20:沾膠平台20: Glue-dipping platform
22:凹槽22: Groove
32:膠狀物32:Gel
40:巨量轉移探針模組40: Mass transfer probe module
42:探針42:Probe
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109127214A TWI831996B (en) | 2020-08-11 | 2020-08-11 | Massive micro-dispensing method and device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109127214A TWI831996B (en) | 2020-08-11 | 2020-08-11 | Massive micro-dispensing method and device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202207279A TW202207279A (en) | 2022-02-16 |
TWI831996B true TWI831996B (en) | 2024-02-11 |
Family
ID=81323526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109127214A TWI831996B (en) | 2020-08-11 | 2020-08-11 | Massive micro-dispensing method and device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI831996B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115172538A (en) * | 2022-06-17 | 2022-10-11 | 广东工业大学 | Display chip's huge transfer device and system |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM468777U (en) * | 2013-08-20 | 2013-12-21 | Mpi Corp | Glue disk rotating device and die bonder having the same |
CN203417814U (en) * | 2013-08-20 | 2014-02-05 | 铜陵富仕三佳机器有限公司 | Multi-array dispensing device |
TWM489367U (en) * | 2014-05-07 | 2014-11-01 | Premtek Int Inc | Glue dispensing device with glue amount adjustment |
CN104993034A (en) * | 2015-07-21 | 2015-10-21 | 广东广晟光电科技有限公司 | Novel LED packaging process |
-
2020
- 2020-08-11 TW TW109127214A patent/TWI831996B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM468777U (en) * | 2013-08-20 | 2013-12-21 | Mpi Corp | Glue disk rotating device and die bonder having the same |
CN203417814U (en) * | 2013-08-20 | 2014-02-05 | 铜陵富仕三佳机器有限公司 | Multi-array dispensing device |
TWM489367U (en) * | 2014-05-07 | 2014-11-01 | Premtek Int Inc | Glue dispensing device with glue amount adjustment |
CN104993034A (en) * | 2015-07-21 | 2015-10-21 | 广东广晟光电科技有限公司 | Novel LED packaging process |
Also Published As
Publication number | Publication date |
---|---|
TW202207279A (en) | 2022-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI831996B (en) | Massive micro-dispensing method and device | |
TWI771309B (en) | Method and device for transferring micro components in batches | |
WO2020248750A1 (en) | Micro led transfer method and display panel | |
CN104425219B (en) | The metal mask for manufacturing the method for metal mask and being formed using this method | |
CN107017319A (en) | The preparation method of colored micro- LED array substrate | |
TWI568028B (en) | Deposition of phosphor on die top by stencil printing | |
CN110034224A (en) | A kind of transfer method based on bar shaped Micro-LED | |
CN107342305B (en) | Flexible substrate structure and preparation method thereof | |
CN114823996B (en) | LED chip transferring method and display panel | |
CN110808227A (en) | Micro device transfer head, micro device manufacturing method and micro device transfer method | |
EP2506333A3 (en) | Method for patterning a lacquer layer to hold electrical gridlines | |
CN117153962B (en) | Transfer method and device of light emitting diode and array substrate | |
KR102427474B1 (en) | LED Transfer device and transferring method using the same | |
WO2024078541A1 (en) | Solder strip pressing tool | |
TWI426480B (en) | Display apparatus and manufacturing method thereof | |
CN105990530A (en) | Method for manufacturing OLED module having heat dissipation function, and heat dissipation structure | |
WO2019148581A1 (en) | Flexible led device and manufacturing method thereof | |
CN108987556A (en) | A kind of white chip | |
CN109390267B (en) | Method and apparatus for transferring micro-components in batches | |
US12062642B2 (en) | Mass transfer device, manufacturing method thereof and display apparatus | |
CN114551686A (en) | Process method for solving problem of inconsistent color of glue-coated ink on surface of mini LED COB | |
CN104409609A (en) | LED lamp as well as manufacturing method and manufacturing mold thereof | |
CN117558855A (en) | Blue light LED and red light quantum dot conversion structure, preparation method and display screen | |
WO2023108450A1 (en) | Addressing transfer device | |
CN215933629U (en) | Transfer head and transfer system |