TWI831441B - Electronic device - Google Patents

Abstract

An electronic device includes a substrate, a bonding pad, a retaining wall, a connecting piece and an electronic component. The bonding pad is disposed on the substrate. The retaining wall is disposed on the bonding pad. The connecting piece is disposed on the substrate and is in contact with the retaining wall. The electronic component is electrically connected to the bonding pad through the connecting piece.

Description

electronic device

The present disclosure relates to an electronic device, and in particular, to an electronic device with better structural reliability.

At present, the joint surface between the chip and the substrate is electroless nickel immersion gold (ENIG) plus solder paste (Sn solder paste), or electroless nickel immersion gold plus copper pillars, or copper plus Conductive silver glue (Silver Epoxy), or electroless nickel immersion gold plus conductive silver glue. However, the process temperature required for solder paste during reflow is relatively high, making it less suitable for flexible substrates; while the process temperature required for conductive silver glue is relatively low, which can reduce warpage of the substrate, but after reflow, the silver glue requires It is easy to flow and difficult to control its range. It is easy to produce skew during chip bonding. When the silver glue flows and becomes flat, it is easy to affect the gap height and adhesion between the chip and the substrate during chip bonding, thus affecting the structural reliability of the product. .

The present disclosure provides an electronic device with better structural reliability.

The electronic device of the present disclosure includes a substrate, a bonding pad, a retaining wall, a connector and an electronic component. The bonding pad is disposed on the substrate. The retaining wall is arranged on the joint pad. The connecting piece is arranged on the base plate and in contact with the retaining wall. The electronic components are electrically connected to the bonding pads through the connectors.

Based on the above, in the electronic device of the present disclosure, the retaining wall is disposed on the bonding pad, and the connector is disposed on the substrate and contacts the retaining wall, thereby limiting the range and position of the connector, and accurately controlling the electronic components and The gap height and uniformity between substrates can reduce the possibility of skew in electronic components. Therefore, the electronic device of the present disclosure can have better structural reliability.

In order to make the above features and advantages of the present disclosure more obvious and understandable, embodiments are given below and described in detail with reference to the attached drawings.

The following is a detailed description of the electronic device according to the embodiment of the present disclosure. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the present disclosure. The specific components and arrangements described below are only used to briefly and clearly describe some embodiments of the present disclosure. Of course, these are only examples and not limitations of the present disclosure. In addition, similar and/or corresponding reference numerals may be used to identify similar and/or corresponding elements in different embodiments to clearly describe the present disclosure. However, the use of these similar and/or corresponding reference numerals is only for the purpose of simply and clearly describing some embodiments of the present disclosure, and does not imply any correlation between the different embodiments and/or structures discussed.

It should be understood that relative terms, such as "lower" or "bottom" or "higher" or "top" may be used in the embodiments to describe the relative relationship of one element to another element in the drawings. It will be understood that if the device in the figures is turned upside down, elements described as being on the "lower" side would then be elements described as being on the "higher" side. The embodiments of the present disclosure can be understood together with the drawings, and the drawings of the present disclosure are also regarded as part of the disclosure description. It should be understood that the drawings of the present disclosure are not drawn to scale and, in fact, the dimensions of elements may be arbitrarily enlarged or reduced in order to clearly illustrate features of the present disclosure.

Furthermore, when it is said that a first material layer is located on or above a second material layer, it may include the situation of direct contact between the first material layer and the second material layer or the situation between the first material layer and the second material layer. There may not be direct contact, that is, there may be one or more other material layers separated between the first material layer and the second material layer. However, if the first material layer is directly located on the second material layer, it means that the first material layer and the second material layer are in direct contact.

In addition, it should be understood that ordinal numbers such as "first", "second", etc. used in the description and claims are used to modify elements and do not themselves imply or represent the element(s). There are no previous ordinal numbers, nor does it represent the order of one component with another component, or the order of the manufacturing method. The use of these ordinal numbers is only used to make a component with a certain name and another component with the same name Can make clear distinctions. The claims and the description may not use the same words. For example, a first element in the description may be a second element in the claims.

In some embodiments of the present disclosure, terms related to joining and connecting, such as "connection", "interconnection", etc., unless otherwise defined, may mean that two structures are in direct contact, or may also mean that two structures are not in direct contact. There are other structures located between these two structures. And the terms about joining and connecting can also include the situation where both structures are movable, or both structures are fixed. In addition, the terms "electrical connection" or "electrical coupling" include any direct and indirect means of electrical connection.

In this article, the terms "about" and "substantially" usually mean within 10%, or within 5%, or within 3%, or within 2%, or within 1%, of a given value or range. or within 0.5%. The quantities given here are approximate quantities, that is, even if "approximately" and "substantially" are not specified, the meaning of "approximately" and "substantially" can still be implied. The term "range between a first value and a second value" means that the range includes the first value, the second value, and other values therebetween. Furthermore, any two numerical values or directions used for comparison may have certain errors. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, then the difference between the first direction and the second direction The angle between them can be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction can be between 0 degrees and 10 degrees.

Throughout this disclosure and the appended claims, certain words are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may refer to the same component by different names. This article is not intended to differentiate between components that have the same function but have different names. In the following description and patent application, words such as "include", "contains", and "have" are open-ended words, so they should be interpreted as meaning "including but not limited to...". Therefore, when the terms "comprises," "containing," and/or "having" are used in the description of the present disclosure, they specify the presence of the corresponding features, regions, steps, operations, and/or elements, but do not exclude the presence of one or more the existence of corresponding features, regions, steps, operations and/or components.

It should be understood that the following embodiments can be replaced, reorganized, and combined with features of several different embodiments without departing from the spirit of the present disclosure to complete other embodiments. The features of various embodiments may be combined and used in any combination as long as they do not violate the spirit of the invention or conflict with each other.

In addition, the electronic device disclosed in the present disclosure may include a display device, a backlight device, an antenna device, a sensing device, a splicing device, a touch electronic device (touch display), a curved electronic device (curved display) or a non-rectangular electronic device (free shape display), but not limited to this. The electronic device may include, for example, liquid crystal, light emitting diode, fluorescence, phosphor, other suitable display media, or a combination of the above, but is not limited thereto. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device, but is not limited thereto. The antenna device may be a phased array antenna or a microstrip antenna, but is not limited thereto. The sensing device may be a sensing device that senses capacitance, light, heat energy or ultrasonic waves, but is not limited thereto. Electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light emitting diode (LED) or a photodiode (photodiode). The light emitting diode may include, for example, an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro light emitting diode (micro LED) or a quantum dot light emitting diode (quantum LED). dot LED), but not limited to this. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device can be any combination of the above, but is not limited thereto. In addition, the electronic device may be a bendable or flexible electronic device. It should be noted that the electronic device can be any combination of the above, but is not limited thereto. In addition, the shape of the electronic device may be a rectangular shape, a circular shape, a polygonal shape, a shape with curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a driving system, a control system, a light source system, a shelf system, etc. to support the display device, antenna device or splicing device. For convenience of explanation, the electronic device will be described below as a backlight device, but the present disclosure is not limited thereto.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant technology and the background or context of the present disclosure, and should not be interpreted in an idealized or overly formal manner. Unless otherwise defined in the embodiments of this disclosure.

Reference will now be made in detail to the exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or similar parts.

FIG. 1 is a schematic top view of an electronic device according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view along line A-A in FIG. 1 . It should be noted that for the sake of convenience of explanation, some components, such as insulating layers and electronic components, are omitted in FIG. 1 , while dotted lines in FIG. 2 represent electronic components before they are joined.

Please refer to FIG. 1 and FIG. 2 simultaneously. In this embodiment, the electronic device 10 includes a substrate 110 , a bonding pad 112 , a retaining wall 120 , a connector 130 and an electronic component 200 . The bonding pad 112 is disposed on the substrate 110 . The retaining wall 120 is disposed on the joint pad 112 . The connector 130 is disposed on the base plate 110 and contacts the retaining wall 120 . The electronic component 200 is electrically connected to the bonding pad 112 through the connector 130 .

Specifically, in this embodiment, the substrate 110 includes a motherboard and a circuit located on the motherboard, where the motherboard may be a flexible motherboard or an inflexible motherboard, and the material of the motherboard may be glass, glass, or glass. fiber (FR4), plastic or other suitable materials, but not limited to this. The material of the bonding pad 112 includes, for example, any suitable conductive material, such as tin, copper, and gold, but is not limited thereto. The electronic device 10 of this embodiment further includes an insulating layer 114 disposed on the substrate 110 and covering part of the bonding pads 112 , where the insulating layer 114 is disposed between the bonding pads 112 and the retaining wall 120 .

As shown in FIG. 2 , the blocking wall 120 in this embodiment is disposed on the insulating layer 114 on the bonding pad 112 , where the orthographic projection of the blocking wall 120 on the substrate 110 overlaps with the orthographic projection of the bonding pad 112 on the substrate 110 . In one embodiment, the material of the blocking wall 120 may be, for example, photoresist, polymer, or dry film. In one embodiment, the blocking wall 120 may be, for example, a photo spacer or a polymer pattern. The edge S2 of the retaining wall 120 in this embodiment can be flush with the edge S1 of the insulating layer 114 . In one embodiment, the ratio of a height H to a width W of the retaining wall 120 is, for example, between 0.1 and 2, which can reduce the material dielectric constant (Dielectric Constant, Dk)/dielectric loss (Dissipation Factor, Df for short) ) characteristics affect microwave characteristics (i.e. wave loss). Here, in a cross section, the height H of the blocking wall 120 may be the maximum height perpendicular to the extending direction of the substrate 110 , and the width W of the blocking wall 120 may be the maximum width along the extending direction of the substrate 110 .

In addition, the connector 130 in this embodiment is, for example, conductive silver glue, which is formed by, for example, steel plate, screen printing or spraying, but is not limited to this. The electronic component 200 is, for example, a light-emitting diode chip (LED die), which can be made of silicon (Si), gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), sapphire (Sapphire) or a glass substrate wafers produced, but are not limited to this. In another embodiment, the chip can also be a semiconductor packaging component, such as a Ball Grid Array (BGA) packaging component, a Chip Size Package (CSP) component, a flip chip or a 2.5-dimensional/ 3-dimensional (2.5D/3D) semiconductor packaging components, but not limited to this. In another embodiment, the chip can also be any type of flip-chip bonding component. The flip-chip bonding component can include, for example, integrated circuits (ICs), transistors, controlled silicon rectifiers, and valves. , Thin Film Transistors, capacitors, inductors, variable capacitors, filters, resistors, diodes, light-emitting diodes, microelectromechanical system components (MEMS), liquid crystal chips, etc., but Not limited to this. The connection pad 202 of the electronic component 200 can be electrically connected to the bonding pad 112 through the connector 130 . That is to say, the connection pad 202 and the bonding pad 112 are structurally and electrically connected together through the connection member 130 . That is to say, the electronic component 200 of this embodiment is bonded to the substrate 110 in a flip-chip manner, for example.

In short, in this embodiment, the retaining wall 120 is disposed on the bonding pad 112, and the connector 130 is disposed on the substrate 110 and contacts the retaining wall 120, thereby limiting the range and position of the connector 130, and The height and uniformity of the gap between the electronic component 200 and the substrate 110 can be precisely controlled, and the possibility of distortion of the electronic component 200 can be reduced. Therefore, the electronic device 10 of the present disclosure can have better structural reliability.

It should be noted here that the following embodiments use the component numbers and part of the contents of the previous embodiments, where the same numbers are used to represent the same or similar components, and descriptions of the same technical contents are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in the following embodiments.

FIG. 3 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to FIG. 2 and FIG. 3 at the same time. The electronic device 10a of this embodiment is similar to the electronic device 10 of FIG. They are separated by a distance D, where the distance D is, for example, between 1 micron and 10 microns. Here, the retaining wall 120a extends from the insulating layer 114 to the substrate 110, and covers the edge S1 of the insulating layer 114 and part of the surface of the substrate 110.

FIG. 4 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to FIG. 2 and FIG. 4 at the same time. The electronic device 10b of this embodiment is similar to the electronic device 10 of FIG. They are separated by a distance G, where the distance G is, for example, between 1 micron and 10 microns. Here, the retaining wall 120b is located on the insulating layer 114, and the orthographic projection of the retaining wall 120b on the substrate 110 completely overlaps the orthographic projection of the bonding pad 112 on the substrate 110.

5 to 7 are schematic cross-sectional views of a manufacturing method of an electronic device according to an embodiment of the present invention. FIG. 8 is a schematic top view of FIG. 7 . It should be noted that, for convenience of explanation, FIG. 7 is a schematic cross-sectional view along line B-B in FIG. 8 , and some components, such as insulating layers and electronic components, are omitted in FIG. 8 .

Please refer to FIG. 5 first. In this embodiment, the dry film 120' and the covering layer 140 thereon can be attached to the substrate 110, where the dry film 120' is located between the covering layer 140, the insulating layer 114 and the bonding pad 112. . Here, the material of the covering layer 140 is, for example, polyethylene terephthalate (PET), but is not limited thereto.

Next, please refer to FIG. 6 , a laser process is performed on the covering layer 140 and the dry film 120′, and the laser light L is used to form the blocking wall 120c and the covering layer 142. Here, due to laser ablation, the formed retaining wall 120c has a rough surface 121.

After that, please refer to FIG. 7 and FIG. 8 at the same time, and the connecting member 130 is disposed on the substrate 110 and contacts the retaining wall 120 c. At this time, a surface in contact between the retaining wall 120c and the connecting member 130 is the rough surface 121, which can increase the adhesion between the connecting member 130 and the retaining wall 120c. Finally, the electronic component 200 is bonded, so that the electronic component 200 is electrically connected to the bonding pad 112 through the connector 130 . At this point, the production of the electronic device 10c has been completed.

FIG. 9 is a schematic top view of an electronic device according to an embodiment of the present invention. FIG. 10 is a schematic cross-sectional view along line C-C in FIG. 9 . It should be noted that for the sake of convenience of explanation, some components, such as insulating layers and electronic components, are omitted in FIG. 9 .

Please refer to Figures 1, 2, 9 and 10 at the same time. The electronic device 10d of this embodiment is similar to the electronic device 10 of Figure 2. The difference between the two is that in this embodiment, when viewed from above, the retaining wall 120d has at least one opening (two openings 125d are schematically shown), and the connecting member 130d can extend into the opening 125d to adjust the amount of the connecting member 130 through the design of the opening 125d, so as to accurately control the electronic component 200 and The height of the gap between substrates 110. It is worth mentioning that the number and position of the openings 125d of the retaining wall 120d can be changed according to the needs, and are not limited here.

FIG. 11 is a schematic top view of an electronic device according to an embodiment of the present invention. FIG. 12 is a schematic cross-sectional view along line D-D in FIG. 11 . It should be noted that for the sake of convenience of explanation, some components, such as insulating layers and electronic components, are omitted in FIG. 11 .

Please refer to Figures 9, 10, 11 and 12 at the same time. The electronic device 10e of this embodiment is similar to the electronic device 10d of Figure 10. The difference between the two is that in this embodiment, when viewed from above, the retaining wall 120e includes a first retaining wall portion 122e and a second retaining wall portion 124e. The first retaining wall portion 122e has a plurality of openings 125e, and the second retaining wall portion 124e surrounds the first retaining wall portion 122e. The partial connecting piece 130e extends into the opening 125e and is located between the first retaining wall portion 122e and the second retaining wall portion 124e. In other words, the retaining wall 120e of this embodiment is designed with multiple loops (such as double loops) to reduce the overflow of the connector 130e, and can accurately control the gap height between the electronic component 200 and the substrate 110. It is worth mentioning that the number and position of the openings 125e of the first retaining wall portion 122e can be changed according to the needs, and are not limited here.

FIG. 13 is a top perspective view of an electronic device according to another embodiment of the present invention. It should be noted that for the sake of convenience of explanation, some components, such as bonding pads and connectors, are omitted from FIG. 13 . Please refer to Figure 13. In this embodiment, in a top view of the electronic device 10f, the electronic component 300 includes a connection pad 302, a connection pad 304, a connection pad 306 and a connection pad 308, and the retaining wall 120f includes a retaining wall portion 122f, The retaining wall portion 124f, the retaining wall portion 126f, and the retaining wall portion 128f. In one embodiment, the retaining wall 120f can be disposed on the electronic component 300, but is not limited thereto. The barrier portion 122f has an opening 125f1, the barrier portion 124f has an opening 125f2, the barrier portion 126f has an opening 125f3, and the barrier portion 128f has an opening 125f4. Barrier portion 122f surrounds connection pad 302, barrier portion 124f surrounds connection pad 304, barrier portion 126f surrounds connection pad 306, and barrier portion 128f surrounds connection pad 308. The opening 125f1 of the retaining wall portion 122f and the opening 125f2 of the retaining wall portion 124f are disposed facing away from each other, and the opening 125f3 of the retaining wall portion 126f and the opening 125f4 of the retaining wall portion 128f are disposed facing away from each other. That is to say, the opening 125f1 and the opening 125f2 face different directions, and the opening 125f3 and the opening 125f4 face different directions, thereby reducing the chance of short circuit. It is worth mentioning that the number of connection pads 302, 304, 306, and 308 of the electronic component 300 can be increased or decreased according to needs, and is not limited here.

FIG. 14 is a top perspective view of an electronic device according to another embodiment of the present invention. It should be noted that, for convenience of explanation, some components, such as bonding pads and connectors, are omitted from FIG. 14 . Please refer to Figures 13 and 14 at the same time. The electronic device 10g of this embodiment is similar to the electronic device 10f of Figure 13. The difference between the two is that in this embodiment, viewed from above, the retaining wall 120g includes multiple retaining walls. Part 120g1, 120g2, 120g3, 120g4. The retaining wall portion 120g1 includes a first retaining wall portion 122g and a second retaining wall portion 124g1, wherein the second retaining wall portion 124g1 surrounds the first retaining wall portion 122. The retaining wall portion 120g2 includes a first retaining wall portion 122g and a second retaining wall portion 124g2, wherein the second retaining wall portion 124g2 surrounds the first retaining wall portion 122. The retaining wall portion 120g3 includes a first retaining wall portion 122g and a second retaining wall portion 124g3, wherein the second retaining wall portion 124g3 surrounds the first retaining wall portion 122. The retaining wall portion 120g4 includes a first retaining wall portion 122g and a second retaining wall portion 124g4, wherein the second retaining wall portion 124g4 surrounds the first retaining wall portion 122. The first retaining wall portion 122g has two openings 125g provided in the middle of the left and right sides. The second retaining wall portion 124g1 has an opening 127g1 provided at the upper left corner. The second retaining wall portion 124g2 has an opening 127g2 provided at the upper right corner. The second retaining wall portion 124g3 has an opening 127g3 provided at the lower left corner. The second retaining wall portion 124g4 has an opening 127g4 provided at the upper right corner. In other words, the retaining wall portions 120g1, 120g2, 120g3, and 120g4 of this embodiment are designed with multiple loops (such as double loops) and openings 125g, 127g1, 127g2, 127g3, and 127g4, which can reduce the possibility of the electronic component 200 being skewed properties, which can increase stability.

To sum up, in the electronic device of the present disclosure, the retaining wall is disposed on the bonding pad, and the connector is disposed on the substrate and in contact with the retaining wall. This can limit the range and position of the connector and accurately control the electronics. The height and uniformity of the gap between the component and the substrate can reduce the possibility of skew in electronic components. Therefore, the electronic device of the present disclosure can have better structural reliability.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present disclosure, but not to limit it. Although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or substitutions do not deviate from the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present disclosure. Scope.

10, 10a, 10b, 10c, 10d, 10e, 10f, 10g: electronic devices 110:Substrate 112:Joining pad 114:Insulation layer 120, 120a, 120b, 120c, 120d, 120e, 120f, 120g: retaining wall 120’:dry film 121: Rough surface 122e, 122g: first retaining wall part 122f, 124f, 126f, 128f, 120g1, 120g2, 120g3, 120g4: retaining wall part 124e, 124g1, 124g2, 124g3, 124g4: second retaining wall part 125d, 125e, 125f1, 125f2, 125f3, 125f4, 125g, 127g1, 127g2, 127g3, 127g4: opening 130, 130d, 130e: Connector 140, 142: Covering layer 200, 300: Electronic components 202, 302, 304, 306, 308: Connection pad D: distance G: spacing H: height L:Laser light S1, S2, S3, S4, S5: Edge W: Width

FIG. 1 is a schematic top view of an electronic device according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view along line A-A in FIG. 1 . FIG. 3 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. 5 to 7 are schematic cross-sectional views of a manufacturing method of an electronic device according to an embodiment of the present invention. FIG. 8 is a schematic top view of FIG. 7 . FIG. 9 is a schematic top view of an electronic device according to an embodiment of the present invention. FIG. 10 is a schematic cross-sectional view along line C-C in FIG. 9 . FIG. 11 is a schematic top view of an electronic device according to an embodiment of the present invention. FIG. 12 is a schematic cross-sectional view along line D-D in FIG. 11 . FIG. 13 is a top perspective view of an electronic device according to another embodiment of the present invention. FIG. 14 is a top perspective view of an electronic device according to another embodiment of the present invention.

10: Electronic devices

110:Substrate

112:Joining pad

114:Insulation layer

120: retaining wall

130: Connector

200:Electronic components

202:Connection pad

H: height

W: Width

S1, S2: edge

Claims (10)

An electronic device includes: a substrate; a bonding pad disposed on the substrate; a retaining wall disposed on the bonding pad; a connector disposed on the substrate and in contact with the retaining wall; and an electronic component , is electrically connected to the bonding pad through the connecting piece, wherein the space enclosed by the retaining wall is filled with the connecting piece. The electronic device according to claim 1, further comprising: an insulating layer disposed between the bonding pad and the retaining wall. The electronic device as claimed in claim 2, wherein an edge of the retaining wall is flush with an edge of the insulating layer. The electronic device as claimed in claim 2, wherein an edge of the retaining wall is separated from an edge of the insulating layer by a distance. The electronic device as claimed in claim 1, wherein an edge of the retaining wall is separated from an edge of the bonding pad by a distance, and the distance is between 1 micron and 10 micron. The electronic device as claimed in claim 1, wherein a surface of the retaining wall in contact with the connecting member is a rough surface. The electronic device of claim 1, wherein the retaining wall has at least one opening when viewed from above, and the connecting member extends into the at least one opening. The electronic device according to claim 1, wherein in plan view, the retaining wall includes a first retaining wall portion and a second retaining wall portion, and the first retaining wall portion has a plurality of openings. The second retaining wall portion surrounds the first retaining wall portion, and part of the connecting member extends into the openings and is located between the first retaining wall portion and the second retaining wall portion. The electronic device of claim 1, wherein the electronic component includes a plurality of connection pads when viewed from above, the blocking wall includes a plurality of blocking wall portions, and each of the blocking wall portions has an opening, and the blocking wall portions The connecting pads are not surrounded, and the openings of the retaining wall portions are arranged away from each other. The electronic device as claimed in claim 1, wherein a ratio of a height to a width of the retaining wall is between 0.1 and 2.

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