TW202418514A - Electronic device - Google Patents

Abstract

An electronic device includes a substrate, a bonding pad, a retaining wall, a connecting piece and an electronic component. The bonding pad is disposed on the substrate. The retaining wall is disposed on the bonding pad. The connecting piece is disposed on the substrate and is in contact with the retaining wall. The electronic component is electrically connected to the bonding pad through the connecting piece.

Description

Electronic devices

The present disclosure relates to an electronic device, and more particularly to an electronic device with better structural reliability.

Currently, the bonding surface between the chip and the substrate is electroless nickel immersion gold (ENIG) plus solder paste (Sn solder paste), or electroless nickel immersion gold plus copper pillars, or copper plus conductive silver epoxy, or electroless nickel immersion gold plus conductive silver epoxy. However, the process temperature required for solder paste during reflow is relatively high, making it less suitable for soft substrates. The process temperature required for conductive silver paste is relatively low, which can reduce the warping of the substrate. However, the silver paste is prone to fluidity after reflow and its range is difficult to control, which can easily cause chip tilt during chip bonding. When the silver paste flows into a flat surface, it is easy to affect the gap height and adhesion between the chip and the substrate during chip bonding, thereby affecting the structural reliability of the product.

The present disclosure provides an electronic device having better structural reliability.

The electronic device disclosed in the present invention comprises a substrate, a bonding pad, a baffle, a connector and an electronic element. The bonding pad is arranged on the substrate. The baffle is arranged on the bonding pad. The connector is arranged on the substrate and contacts the baffle. The electronic element is electrically connected to the bonding pad through the connector.

Based on the above, in the electronic device disclosed in the present invention, the baffle is disposed on the bonding pad, and the connector is disposed on the substrate and contacts the baffle, thereby limiting the range and position of the connector, and accurately controlling the height and uniformity of the gap between the electronic component and the substrate, and reducing the possibility of the electronic component being skewed. Therefore, the electronic device disclosed in the present invention can have better structural reliability.

In order to make the above features and advantages of the present disclosure more clearly understood, embodiments are specifically cited below and described in detail with reference to the accompanying drawings.

The following is a detailed description of the electronic device of the disclosed embodiment. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the disclosed embodiment. The specific elements and arrangements described below are only for simple and clear description of some embodiments of the disclosed embodiment. Of course, these are only used for exemplification and are not limitations of the disclosed embodiment. In addition, similar and/or corresponding numbers may be used in different embodiments to indicate similar and/or corresponding elements to clearly describe the disclosed embodiment. However, the use of these similar and/or corresponding numbers is only for simple and clear description of some embodiments of the disclosed embodiment, and does not represent any correlation between the different embodiments and/or structures discussed.

It should be understood that relative terms, such as "lower" or "bottom" or "higher" or "top", may be used in the embodiments to describe the relative relationship of one element of the diagram to another element. It is understood that if the device of the diagram is turned upside down, the element described on the "lower" side will become the element on the "higher" side. The embodiments of the present disclosure can be understood in conjunction with the drawings, and the drawings of the present disclosure are also considered to be part of the disclosure. It should be understood that the drawings of the present disclosure are not drawn to scale, and in fact, the size of the elements may be arbitrarily enlarged or reduced in order to clearly show the features of the present disclosure.

Furthermore, when a first material layer is mentioned as being located on or above a second material layer, it may include a situation where the first material layer is in direct contact with the second material layer or the first material layer and the second material layer may not be in direct contact, that is, there may be one or more other material layers between the first material layer and the second material layer. However, if the first material layer is directly located on the second material layer, it means that the first material layer and the second material layer are in direct contact.

In addition, it should be understood that the ordinal numbers used in the specification and claims, such as "first", "second", etc., to modify the components, do not imply or represent any previous ordinal numbers of the components (or components), nor do they represent the order of one component and another component, or the order of the manufacturing method. The use of these ordinal numbers is only used to make a component with a certain name clearly distinguishable from another component with the same name. The same terms may not be used in the claims and the specification. For example, the first component in the specification may be the second component in the claims.

In some embodiments of the present disclosure, terms such as "connected", "interconnected", etc., related to bonding and connection, unless otherwise specifically defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, wherein other structures are disposed between the two structures. Moreover, such terms related to bonding and connection may also include situations where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" or "electrically coupled" include any direct and indirect electrical connection means.

In the text, the terms "about" and "substantially" usually mean within 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5% of a given value or range. The quantities given here are approximate quantities, that is, in the absence of specific description of "about" and "substantially", the meaning of "about" and "substantially" can still be implied. The term "ranging from a first value to a second value" means that the range includes the first value, the second value, and other values therebetween. Furthermore, any two values or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

Certain terms are used throughout the specification and the claims that follow to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same component by different names. This document is not intended to distinguish between components that have the same function but different names. In the following specification and patent application, the words "include", "contain", "have" and the like are open-ended words, and therefore should be interpreted as "including but not limited to..." Therefore, when the terms "include", "contain" and/or "have" are used in the description of the present disclosure, they specify the existence of corresponding features, regions, steps, operations and/or components, but do not exclude the existence of one or more corresponding features, regions, steps, operations and/or components.

It should be understood that the following embodiments may replace, reorganize, or combine features in several different embodiments to complete other embodiments without departing from the spirit of the present disclosure. Features between embodiments may be combined and used in any manner as long as they do not violate the spirit of the invention or conflict with each other.

In addition, the electronic device disclosed in the present disclosure may include a display device, a backlight device, an antenna device, a sensing device, a splicing device, a touch display, a curved display, or a free shape display, but is not limited thereto. The electronic device may, for example, include a liquid crystal, a light emitting diode, fluorescence, phosphor, other suitable display media, or a combination thereof, but is not limited thereto. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, but is not limited thereto. The antenna device may be a phase array antenna or a microstrip antenna, but is not limited thereto. The sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but is not limited thereto. The electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light emitting diode (LED) or a photodiode. The light emitting diode may, for example, include an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro LED or a quantum dot light emitting diode (quantum dot LED), but is not limited thereto. The splicing device may, for example, be a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any combination of the aforementioned arrangements, but is not limited thereto. In addition, the electronic device may be a bendable or flexible electronic device. It should be noted that the electronic device may be any arrangement or combination of the aforementioned, but is not limited thereto. In addition, the shape of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, a control system, a light source system, a shelf system, etc. to support a display device, an antenna device, or a splicing device. For ease of explanation, the following description will be based on the electronic device being a backlight device, but the present disclosure is not limited thereto.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by a person skilled in the art to which the present disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

Reference will now be made in detail to exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and description to represent the same or like parts.

Fig. 1 is a schematic top view of an electronic device according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view along line A-A in Fig. 1. It should be noted that, for the sake of convenience, some components such as an insulating layer and electronic components are omitted in Fig. 1, and the electronic components before bonding are indicated by dashed lines in Fig. 2.

Please refer to FIG. 1 and FIG. 2 at the same time. In this embodiment, the electronic device 10 includes a substrate 110, a bonding pad 112, a baffle 120, a connector 130 and an electronic component 200. The bonding pad 112 is disposed on the substrate 110. The baffle 120 is disposed on the bonding pad 112. The connector 130 is disposed on the substrate 110 and contacts the baffle 120. The electronic component 200 is electrically connected to the bonding pad 112 through the connector 130.

Specifically, in the present embodiment, the substrate 110 includes a motherboard and a circuit on the motherboard, wherein the motherboard may be a flexible motherboard or a non-flexible motherboard, and the material of the motherboard may be glass, glass fiber (FR4), plastic or other suitable materials, but not limited thereto. The material of the bonding pad 112 may include, for example, any suitable conductive material, such as tin, copper, gold, but not limited thereto. The electronic device 10 of the present embodiment further includes an insulating layer 114, which is disposed on the substrate 110 and covers a portion of the bonding pad 112, wherein the insulating layer 114 is disposed between the bonding pad 112 and the baffle 120.

As shown in FIG. 2 , the baffle 120 of the present embodiment is disposed on the insulating layer 114 located on the bonding pad 112, wherein the orthographic projection of the baffle 120 on the substrate 110 overlaps the orthographic projection of the bonding pad 112 on the substrate 110. In one embodiment, the material of the baffle 120 may be, for example, a photoresist, a polymer, or a dry film. In one embodiment, the baffle 120 may be, for example, a photo spacer or a polymer pattern. The edge S2 of the baffle 120 of the present embodiment may be aligned with the edge S1 of the insulating layer 114. In one embodiment, the ratio of a height H to a width W of the baffle 120 is, for example, between 0.1 and 2, which can reduce the influence of the dielectric constant (Dk)/dissipation factor (Df) characteristics of the material on the microwave characteristics (i.e., wave loss). Here, in a cross section, the height H of the baffle 120 can be the maximum height perpendicular to the extension direction of the substrate 110, and the width W of the baffle 120 can be the maximum width along the extension direction of the substrate 110.

In addition, the connector 130 of the present embodiment is, for example, a conductive silver paste, which is formed by, for example, a steel plate, screen printing or spray coating, but is not limited thereto. The electronic component 200 is, for example, a light emitting diode chip (LED die), which can be a chip made of silicon (Si), gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), sapphire (Sapphire) or a glass substrate, but is not limited thereto. In another embodiment, the chip can also be a semiconductor package component, such as a ball grid array (BGA) package component, a chip size package (CSP) component, a flip chip or a 2.5D/3D (2.5D/3D) semiconductor package component, but is not limited thereto. In another embodiment, the chip can also be any kind of flip chip bonding component, and the flip chip bonding component may include, for example, an integrated circuit (IC), transistors, silicon controlled rectifiers, valves, thin film transistors, capacitors, inductors, variable capacitors, filters, resistors, diodes, light-emitting diodes, micro-electromechanical system components (MEMS), liquid crystal chips, etc., but not limited to these. The connection pad 202 of the electronic component 200 can be electrically connected to the bonding pad 112 through the connector 130. In other words, the connection pad 202 and the bonding pad 112 are structurally and electrically connected together through the connector 130. That is, the electronic component 200 of this embodiment is, for example, bonded to the substrate 110 in a flip chip manner.

In short, in this embodiment, the baffle 120 is disposed on the bonding pad 112, and the connector 130 is disposed on the substrate 110 and contacts the baffle 120, thereby limiting the range and position of the connector 130, and accurately controlling the height and uniformity of the gap between the electronic component 200 and the substrate 110, thereby reducing the possibility of the electronic component 200 being skewed. Therefore, the electronic device 10 disclosed in the present invention can have better structural reliability.

It should be noted that the following embodiments use the same component numbers and some contents of the previous embodiments, wherein the same number is used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can refer to the previous embodiments, and the following embodiments will not be repeated.

FIG3 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Referring to FIG2 and FIG3 at the same time, the electronic device 10a of this embodiment is similar to the electronic device 10 of FIG2 , and the difference between the two is that: in this embodiment, the edge S3 of the retaining wall 120a is separated from the edge S1 of the insulating layer 114 by a distance D, wherein the distance D is, for example, between 1 micron and 10 microns. Here, the retaining wall 120a extends from the insulating layer 114 to the substrate 110, and covers the edge S1 of the insulating layer 114 and a portion of the surface of the substrate 110.

FIG4 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Referring to FIG2 and FIG4 at the same time, the electronic device 10b of this embodiment is similar to the electronic device 10 of FIG2 , and the difference between the two is that: in this embodiment, the edge S4 of the retaining wall 120b and the edge S5 of the bonding pad 112 are separated by a distance G, wherein the distance G is, for example, between 1 micron and 10 microns. Here, the retaining wall 120b is located on the insulating layer 114, and the orthographic projection of the retaining wall 120b on the substrate 110 completely overlaps the orthographic projection of the bonding pad 112 on the substrate 110.

Fig. 5 to Fig. 7 are cross-sectional schematic diagrams of a method for manufacturing an electronic device according to an embodiment of the present invention. Fig. 8 is a top view schematic diagram of Fig. 7. It should be noted that, for the sake of convenience, Fig. 7 is a cross-sectional schematic diagram along the line B-B in Fig. 8, and some components, such as an insulating layer and electronic components, are omitted in Fig. 8.

Please refer to FIG. 5 . In this embodiment, the dry film 120′ and the cover layer 140 thereon may be attached to the substrate 110, wherein the dry film 120′ is located between the cover layer 140 and the insulating layer 114 and the bonding pad 112. Here, the material of the cover layer 140 is, for example, polyethylene terephthalate (PET), but is not limited thereto.

Next, referring to Fig. 6, a laser process is performed on the cover layer 140 and the dry film 120' to form the barrier 120c and the cover layer 142 by laser light L. Here, the barrier 120c formed has a rough surface 121 due to laser ablation.

Afterwards, please refer to FIG. 7 and FIG. 8 at the same time, the connector 130 is set on the substrate 110 and contacts the baffle 120c. At this time, the surface of the baffle 120c that contacts the connector 130 is the rough surface 121, which can increase the adhesion between the connector 130 and the baffle 120c. Finally, the electronic component 200 is bonded so that the electronic component 200 is electrically connected to the bonding pad 112 through the connector 130. At this point, the production of the electronic device 10c has been completed.

Fig. 9 is a schematic top view of an electronic device according to an embodiment of the present invention. Fig. 10 is a schematic cross-sectional view along line C-C in Fig. 9. It should be noted that, for the sake of convenience of explanation, some components, such as insulating layers and electronic components, are omitted in Fig. 9.

Please refer to FIG. 1, FIG. 2, FIG. 9 and FIG. 10 simultaneously. The electronic device 10d of this embodiment is similar to the electronic device 10 of FIG. 2. The difference between the two is that in this embodiment, in a top view, the retaining wall 120d has at least one opening (two openings 125d are schematically shown), and the connecting member 130d can extend into the opening 125d, so that the amount of the connecting member 130 can be adjusted by the design of the opening 125d, and the height of the gap between the electronic component 200 and the substrate 110 can be accurately controlled. It is worth mentioning that the number and position of the openings 125d of the retaining wall 120d can be changed according to needs, and are not limited here.

Fig. 11 is a schematic top view of an electronic device according to an embodiment of the present invention. Fig. 12 is a schematic cross-sectional view along line D-D in Fig. 11. It should be noted that, for the sake of convenience of explanation, some components, such as insulating layers and electronic components, are omitted in Fig. 11.

Please refer to FIG. 9, FIG. 10, FIG. 11 and FIG. 12 simultaneously. The electronic device 10e of this embodiment is similar to the electronic device 10d of FIG. 10. The difference between the two is that in this embodiment, in a top view, the baffle 120e includes a first baffle portion 122e and a second baffle portion 124e. The first baffle portion 122e has a plurality of openings 125e, and the second baffle portion 124e surrounds the first baffle portion 122e. A portion of the connecting member 130e extends into the opening 125e and is located between the first baffle portion 122e and the second baffle portion 124e. In other words, the baffle 120e of this embodiment is designed with multiple loops (such as double loops) to reduce the overflow of the connector 130e, and can accurately control the height of the gap between the electronic component 200 and the substrate 110. It is worth mentioning that the number and position of the openings 125e of the first baffle portion 122e can be changed according to needs and are not limited here.

FIG. 13 is a schematic diagram of an electronic device according to another embodiment of the present invention, which is viewed from above. It should be noted that, for the sake of convenience, some components, such as bonding pads and connectors, are omitted in FIG. 13 . Referring to FIG. 13 , in this embodiment, the electronic device 10f is viewed from above, and its electronic component 300 includes a connection pad 302, a connection pad 304, a connection pad 306, and a connection pad 308, and the baffle 120f includes a baffle portion 122f, a baffle portion 124f, a baffle portion 126f, and a baffle portion 128f. In one embodiment, the baffle 120f can be disposed on the electronic component 300, but is not limited thereto. The baffle 122f has an opening 125f1, the baffle 124f has an opening 125f2, the baffle 126f has an opening 125f3, and the baffle 128f has an opening 125f4. The baffle 122f surrounds the connection pad 302, the baffle 124f surrounds the connection pad 304, the baffle 126f surrounds the connection pad 306, and the baffle 128f surrounds the connection pad 308. The opening 125f1 of the baffle 122f and the opening 125f2 of the baffle 124f are disposed opposite to each other, and the opening 125f3 of the baffle 126f and the opening 125f4 of the baffle 128f are disposed opposite to each other. In other words, the opening 125f1 and the opening 125f2 face different directions, and the opening 125f3 and the opening 125f4 face different directions, thereby reducing the chance of short circuit. It is worth mentioning that the number of the connection pads 302, 304, 306, and 308 of the electronic component 300 can be increased or decreased according to demand, and is not limited here.

FIG. 14 is a schematic diagram of an electronic device according to another embodiment of the present invention, which is viewed from above. It should be noted that, for the sake of convenience, some components, such as the bonding pad and the connector, are omitted in FIG. 14. Please refer to FIG. 13 and FIG. 14 simultaneously. The electronic device 10g of this embodiment is similar to the electronic device 10f of FIG. 13. The difference between the two is that in this embodiment, the baffle 120g includes a plurality of baffle portions 120g1, 120g2, 120g3, and 120g4 when viewed from above. The baffle portion 120g1 includes a first baffle portion 122g and a second baffle portion 124g1, wherein the second baffle portion 124g1 surrounds the first baffle portion 122. The baffle 120g2 includes a first baffle 122g and a second baffle 124g2, wherein the second baffle 124g2 surrounds the first baffle 122. The baffle 120g3 includes a first baffle 122g and a second baffle 124g3, wherein the second baffle 124g3 surrounds the first baffle 122. The baffle 120g4 includes a first baffle 122g and a second baffle 124g4, wherein the second baffle 124g4 surrounds the first baffle 122. The first baffle 122g has two openings 125g disposed in the middle of the left and right sides. The second baffle 124g1 has an opening 127g1 disposed in the upper left corner. The second baffle 124g2 has an opening 127g2 disposed in the upper right corner. The second baffle 124g3 has an opening 127g3 disposed in the lower left corner. The second baffle 124g4 has an opening 127g4 disposed in the upper right corner. In other words, the retaining wall portions 120g1, 120g2, 120g3, and 120g4 of the present embodiment are designed with multiple loops (such as double loops) and openings 125g, 127g1, 127g2, 127g3, and 127g4, which can reduce the possibility of the electronic component 200 being skewed and increase stability.

In summary, in the electronic device disclosed herein, the baffle is disposed on the bonding pad, and the connector is disposed on the substrate and contacts the baffle, thereby limiting the range and position of the connector, and accurately controlling the height and uniformity of the gap between the electronic component and the substrate, thereby reducing the possibility of the electronic component being skewed. Therefore, the electronic device disclosed herein can have better structural reliability.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, ordinary technical personnel in this field should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present disclosure.

10, 10a, 10b, 10c, 10d, 10e, 10f, 10g: electronic device 110: substrate 112: bonding pad 114: insulating layer 120, 120a, 120b, 120c, 120d, 120e, 120f, 120g: baffle 120': dry film 121: rough surface 122e, 122g: first baffle 122f, 124f, 126f, 128f, 120g1, 120g2, 120g3, 120g4: baffle 124e, 124g1, 124g2, 124g3, 124g4: second baffle 125d, 125e, 125f1, 125f2, 125f3, 125f4, 125g, 127g1, 127g2, 127g3, 127g4: opening 130, 130d, 130e: connector 140, 142: cover layer 200, 300: electronic components 202, 302, 304, 306, 308: connection pads D: distance G: spacing H: height L: laser light S1, S2, S3, S4, S5: edge W: width

FIG. 1 is a schematic top view of an electronic device according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view along line A-A in FIG. 1. FIG. 3 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. FIG. 5 to FIG. 7 are schematic cross-sectional views of a method for manufacturing an electronic device according to an embodiment of the present invention. FIG. 8 is a schematic top view of FIG. 7. FIG. 9 is a schematic top view of an electronic device according to an embodiment of the present invention. FIG. 10 is a schematic cross-sectional view along line C-C in FIG. 9. FIG. 11 is a schematic top view of an electronic device according to an embodiment of the present invention. FIG. 12 is a schematic cross-sectional view along line D-D in FIG. 11. FIG. 13 is a schematic diagram of a top perspective view of an electronic device according to another embodiment of the present invention. FIG. 14 is a schematic diagram of a top perspective view of an electronic device according to another embodiment of the present invention.

10: Electronic devices

110: Substrate

112:Joint pad

114: Insulation layer

120:Block

130: Connectors

200: Electronic components

202:Connection pad

H: Height

W: Width

S1, S2: Edge

Claims (10)

An electronic device includes: a substrate; a bonding pad disposed on the substrate; a baffle disposed on the bonding pad; a connector disposed on the substrate and in contact with the baffle; and an electronic component electrically connected to the bonding pad through the connector. The electronic device as described in claim 1 further comprises: An insulating layer disposed between the bonding pad and the baffle. An electronic device as described in claim 2, wherein an edge of the barrier is aligned with an edge of the insulating layer. An electronic device as described in claim 2, wherein an edge of the retaining wall is separated from an edge of the insulating layer by a distance. The electronic device as described in claim 1, wherein the edge of the baffle is spaced apart from the edge of the bonding pad by a distance, and the distance is between 1 micron and 10 microns. An electronic device as described in claim 1, wherein a surface of the baffle in contact with the connector is a rough surface. An electronic device as described in claim 1, wherein the retaining wall has at least one opening when viewed from above, and the connecting member extends into the at least one opening. An electronic device as described in claim 1, wherein, in a top view, the baffle includes a first baffle portion and a second baffle portion, the first baffle portion having a plurality of openings, the second baffle portion surrounding the first baffle portion, and a portion of the connecting member extending into the openings and located between the first baffle portion and the second baffle portion. An electronic device as described in claim 1, wherein in a top view, the electronic element includes a plurality of connection pads, the baffle includes a plurality of baffle portions, and each of the baffle portions has an opening, the baffle portions respectively surround the connection pads, and the openings of the baffle portions are arranged back to back. An electronic device as described in claim 1, wherein a ratio of a height to a width of the baffle is between 0.1 and 2.

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