TWI831226B - 電容器 - Google Patents
電容器 Download PDFInfo
- Publication number
- TWI831226B TWI831226B TW111120022A TW111120022A TWI831226B TW I831226 B TWI831226 B TW I831226B TW 111120022 A TW111120022 A TW 111120022A TW 111120022 A TW111120022 A TW 111120022A TW I831226 B TWI831226 B TW I831226B
- Authority
- TW
- Taiwan
- Prior art keywords
- capacitor
- layer
- hole conductor
- hole
- porous layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/055—Etched foil electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/07—Dielectric layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021117803 | 2021-07-16 | ||
| JP2021-117803 | 2021-07-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202305846A TW202305846A (zh) | 2023-02-01 |
| TWI831226B true TWI831226B (zh) | 2024-02-01 |
Family
ID=84919999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111120022A TWI831226B (zh) | 2021-07-16 | 2022-05-30 | 電容器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240186071A1 (enExample) |
| JP (1) | JP7563605B2 (enExample) |
| CN (1) | CN117642833A (enExample) |
| TW (1) | TWI831226B (enExample) |
| WO (1) | WO2023286484A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI885959B (zh) * | 2023-07-28 | 2025-06-01 | 日商村田製作所股份有限公司 | 內建電容器之基板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007251101A (ja) * | 2006-03-20 | 2007-09-27 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ内蔵回路基板およびそれを用いたインターポーザおよびパッケージ |
| JP2008078301A (ja) * | 2006-09-20 | 2008-04-03 | Fujitsu Ltd | キャパシタ内蔵型配線基板およびその製造方法 |
| JP2012124281A (ja) * | 2010-12-07 | 2012-06-28 | Tdk Corp | 配線板、電子部品内蔵基板、配線板の製造方法及び電子部品内蔵基板の製造方法 |
| TW202036619A (zh) * | 2019-03-29 | 2020-10-01 | 日商村田製作所股份有限公司 | 電容器陣列及複合電子零件 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008130722A (ja) * | 2006-11-20 | 2008-06-05 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ内蔵回路基板とその製造方法 |
-
2022
- 2022-05-30 TW TW111120022A patent/TWI831226B/zh active
- 2022-06-02 CN CN202280049856.0A patent/CN117642833A/zh active Pending
- 2022-06-02 JP JP2023535175A patent/JP7563605B2/ja active Active
- 2022-06-02 WO PCT/JP2022/022439 patent/WO2023286484A1/ja not_active Ceased
-
2024
- 2024-01-11 US US18/410,307 patent/US20240186071A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007251101A (ja) * | 2006-03-20 | 2007-09-27 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ内蔵回路基板およびそれを用いたインターポーザおよびパッケージ |
| JP2008078301A (ja) * | 2006-09-20 | 2008-04-03 | Fujitsu Ltd | キャパシタ内蔵型配線基板およびその製造方法 |
| JP2012124281A (ja) * | 2010-12-07 | 2012-06-28 | Tdk Corp | 配線板、電子部品内蔵基板、配線板の製造方法及び電子部品内蔵基板の製造方法 |
| TW202036619A (zh) * | 2019-03-29 | 2020-10-01 | 日商村田製作所股份有限公司 | 電容器陣列及複合電子零件 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023286484A1 (ja) | 2023-01-19 |
| US20240186071A1 (en) | 2024-06-06 |
| CN117642833A (zh) | 2024-03-01 |
| TW202305846A (zh) | 2023-02-01 |
| JPWO2023286484A1 (enExample) | 2023-01-19 |
| JP7563605B2 (ja) | 2024-10-08 |
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