TWI831036B - Reusable adhesion device having a complex structure and method thereof - Google Patents

Abstract

A reusable adhesion method includes: providing at least one first adhesion surface on a main structural layer, with the first adhesion surface formed with a plurality of cavities; providing a plurality of support blocks to form at least one structural support layer for providing a buffer protection structure or an auxiliary adhesion on the first adhesion surface; correspondingly inserting the support blocks of the structural support layer into the cavities of the main structural layer such that the support blocks of the structural support layer are embedded in the cavities of the main structural layer to form a reusable adhesion structure; and detachably adhering the reusable adhesion structure on various properties of surfaces.

Description

Repeatable adhesive composite structure adhesive device and method thereof

The present invention relates to a reusable composite structure adhesive device and an operation method thereof; in particular, to a device configuration suitable for miscellaneous surfaces with various characteristics. A re-pastable composite structural adhesive device with a miniature pillar structure and its operating method; more particularly, it relates to a re-pastable composite independently embedded structural adhesive device and its operating method.

For example, commonly used nano-suction cup devices and their manufacturing methods, such as Chinese Patent Publication No. CN-106395729 "A Dry Adhesion Functional Structure and Manufacturing Process Based on Liquid Crystal Elastic Polymer" invention patent application, which discloses a liquid crystal-based Dry adhesive functional structures of elastic polymers. The dry adhesive functional structure based on liquid crystal elastic polymer includes a two-layer structure, and the two-layer structure includes a top layer and a bottom layer.

Following the above, the top layer of the aforementioned No. CN-106395729 is selected from a mushroom-shaped array structure, and the top layer can be made of a micron-level photoresist, and the mushroom-shaped array structure is selected from a raised state; or, The top layer can optionally be a liquid crystal elastomeric polymer [LCE] doped with carbon nanotubes or a graphene.

Following the above, the bottom layer of the aforementioned No. CN-106395729 is selected from a groove structure, and the groove structure has a side wall, and the side wall has several A through hole is provided for inflating the groove structure or exhausting air from the groove structure, and the groove structure is selected from a high elastic modulus polymer; or, the high elastic modulus polymer of the bottom layer can be selected from 1. Polymethyl methacrylate [PMMA].

However, the two-layer structure of the aforementioned No. CN-106395729 only provides the dry adhesion functional structure of the micro-nano engineering of the mushroom-shaped array structure of the top layer and the groove structure of the bottom layer, and the mushroom-shaped array structure of the top layer and the bottom layer of the groove structure are The groove structure is easily damaged in general use, so there must be a potential need to further improve its structure, its operating method and manufacturing method.

Another commonly used nano-suction cup device and its manufacturing method, such as Chinese Patent Publication No. CN-110076938 "Flexible molded body and its preparation method and application" invention patent application, which discloses a method of preparing a flexible molded body. The preparation method of the flexible molded body includes: selecting a base material, and the base material has a through hole, and the through hole is a through hole; the base material has a first surface and a second surface, and the base material is A first metal coating is formed on the first surface of the through hole.

Following the above, the method for preparing the flexible molded body in the aforementioned No. CN-110076938 also includes: filling the through hole of the base material with a metal substance close to the first metal coating; filling the through hole of the base material with a metal substance; A second metal coating is coated on the second surface; a photoresist layer is coated on the second metal coating or the first metal coating and the second metal coating.

Following the above, the method for preparing the flexible molded body in the aforementioned No. CN-110076938 further includes: removing part of the second metal coating and part of the photoresist layer of the second metal coating to expose part of the through hole, so as to expose part of the through hole. Form an exposed through hole; fill the exposed through hole with a photoresist; remove the remaining second metal coating and the photoresist layer on the surface of the second metal coating.

Following the above, the method for preparing the flexible molded body in the aforementioned No. CN-110076938 also includes: performing an etching operation on the base material and removing The metal substance in the through hole is used to obtain a mold, and the mold is used to prepare a flexible molded body.

Following on from the above, the method for preparing the flexible molded body in the aforementioned No. CN-110076938 also includes: adding a flexible polymer solution to the mold, solidifying the flexible polymer solution, and obtaining the flexible mold after removing the mold. Molded body; the through hole has an axial length H1; the position filled with the metal substance in the through hole has an axial length H2, and there is a relationship: H1>H2.

Following the above, the flexible molded body of the aforementioned No. CN-110076938 includes a flexible base and an adhesive part, and the adhesive part includes a primary structure, and the primary structure also includes a secondary structure to obtain a dual-level structure. A flexible molded body, and the flexible molded body has a two-stage structure similar to a gecko's foot.

However, the aforementioned flexible molded body No. CN-110076938 only simply obtains a flexible molded body with a two-stage structure or a two-stage structure similar to a gecko's foot, and the flexible molded body with a two-stage structure is susceptible to damage in general use. Destruction, therefore there must be a potential need to further improve its structure, its operating methods and manufacturing methods.

Another commonly used nano-suction cup structure device and its manufacturing method, such as the "Biomedical implant with suction cup-type nanoholes and manufacturing method" invention patent No. TW-I263513 of the Republic of China, discloses a biomedical implant. Enter things. The biomedical implant includes a plurality of suction cup nanopores, and a suction cup nanopore structure is provided on part or all of the surface of the biomedical implant. The sucker-type nanohole structure has a plurality of tubes with nanometer dimensions.

Following the above, all or part of the tubes in the aforementioned No. TW-I263513 are arranged in a matrix, and each tube is set as a hole that can be filled with bioabsorbable materials [or drugs]. The size of each hole is substantially between 10nm and 100nm. in addition, The biomedical implant can be selected from a pure titanium sheet.

The aforementioned manufacturing method of the biomedical implant No. TW-I263513 mainly includes the following steps: [A] First, the biomedical implant is subjected to anodizing treatment to form an oxide film on the surface of the biomedical implant. , and add a solvent to the solution during anodization; [B], and then apply an external voltage to form a plurality of tubular objects on the surface of the biomedical implant, and the tubular objects have the holes.

Following the above, in the aforementioned No. TW-I263513, when the biomedical implant is anodized, the solvent can be hydrofluoric acid or sulfuric acid. In addition, when the applied voltage is applied to the biomedical implant, the applied voltage may be selected to be within 50 volts.

However, the suction cup nanopore structure or its use in No. TW-I263513 is only suitable for biomedical implant purposes, that is, it is not suitable for general adsorption of heavy objects, and the suction cup nanopore structure is not suitable for general use. It is susceptible to damage, so there must be a potential need to further improve its structure, its operating methods and manufacturing methods.

Another commonly used nano-suction cup structure device and its operating method, such as the "Micro-structured suction cup device and its operating method" invention patent No. TW-I538874 of the Republic of China, discloses a micro-structured suction cup device and its operating method. The microstructure suction cup device includes a suction cup substrate, a microstructure and a pressing operation surface. The suction cup substrate includes a first surface and a second surface. The microstructure is disposed on the first surface of the suction cup substrate to form an adsorption layer. The pressing operation surface is disposed on the second surface of the suction cup substrate, and the adsorption layer corresponds to the pressing operation surface.

Following the above, the operation method of the microstructure suction cup device of the aforementioned No. TW-I538874: utilize the adsorption layer to correspond to a surface to be adsorbed; attach at least a part of the adsorption layer to the surface to be adsorbed; use pressing to operate the adsorption At least part of the layer is used to squeeze out at least part of the gas in the fine structure, so that at least part of the adsorption layer adsorbs the The surface to be adsorbed; spreading at least one edge of the adsorption layer so that at least a part of the adsorption layer is peeled off the surface to be adsorbed.

Another commonly used nano-suction cup structure device and its operating method, such as the "Nano-suction cup device and its operating method" invention patent No. TW-I539089 of the Republic of China, discloses a nano-suction cup device and its operating method. The nano-suction cup device includes a suction cup substrate, several nano-cavities and a pressing operation surface. The suction cup substrate includes a first surface and a second surface. The nanohole array is arranged on the first surface of the sucker substrate to form an adsorption layer. The pressing operation surface is disposed on the second surface of the suction cup substrate, and the adsorption layer corresponds to the pressing operation surface.

Following the above, the operation method of the nano-suction cup device of the aforementioned No. TW-I539089 is as follows: using the adsorption layer to correspond to a surface to be adsorbed; attaching at least a part of the adsorption layer to the surface to be adsorbed; and operating the adsorption by pressing At least a portion of the layer is used to squeeze out at least a portion of the gas in the nanocavities so that at least a portion of the adsorption layer adsorbs the surface to be adsorbed; at least one edge of the adsorption layer is pushed aside so that the adsorption layer At least part of the surface to be adsorbed is peeled off.

Another commonly used nano-suction cup structure device and its operating method, such as the "Double-sided micro-structure suction cup device and its operating method" invention patent No. TW-I549901 of the Republic of China, discloses a double-sided micro-structure suction cup device and its operating method. How to do it. The double-sided microstructure suction cup device includes a suction cup substrate, a plurality of first nano-holes and a plurality of second nano-holes. The first microstructure and the second microstructure are arranged on two opposite surfaces of the suction cup substrate to form a first adsorption layer and a second adsorption layer.

Following the above, the operation method of the microstructure suction cup device No. TW-I549901 mentioned above: attach the first adsorption layer or the second adsorption layer to a surface to be adsorbed; press the first adsorption layer or the second adsorption layer to operate the adsorption layer. The adsorption layer is used to squeeze out the gas in the first fine structure or the second fine structure, so that the first adsorption layer or the second adsorption layer can adsorb the surface to be adsorbed. surface; when performing the detachment operation, at least one edge of the first adsorption layer or the second adsorption layer is pushed aside, so that at least a part of the first adsorption layer or the second adsorption layer can peel off the surface to be adsorbed.

However, although the microstructure suction cup device of the aforementioned patent No. TW-I538874, the nanosuction cup device of TW-I539089, and the double-sided microstructure suction cup device of TW-I549901 have provided various nanosuction cup devices and their structures, However, its device or structure is susceptible to damage during normal use, so there must be a potential need to further improve its structure, its operating methods and manufacturing methods.

Obviously, the aforementioned Chinese Patent Publication No. CN-106395729, Patent Publication No. CN-110076938, Republic of China Patent Announcement Patent No. TW-I263513, Patent Announcement No. TW-I538874, and Announcement No. TW-I539089 The patent and patent announcement No. TW-I549901 are only for reference and explanation of the technical background of the present invention and the current state of technological development. They are not intended to limit the scope of the present invention.

In view of this, in order to meet the above technical problems and needs, the present invention provides a re-pastable composite structure adhesive device and a method thereof, which combines a main structural adhesive layer with accommodating at least one structural auxiliary layer to form a reusable composite structure adhesive layer. Repeat the pasting of the structure, and use the structural auxiliary layer to provide a buffering and protective structure or provide an auxiliary adhesion force to assist the main structural adhesive layer, and use the main structural adhesive layer to provide an accommodation and protective structure on the structural auxiliary layer, In this way, the re-stickable structure can be re-sticked on various surfaces with various characteristics, and the main structural adhesive layer is further used to accommodate the buffer and protect the structural auxiliary layer. Therefore, compared with conventional tapes or patches, the repeatability can be greatly improved. The high adhesive properties of the adhesive prevent damage to the adhesive structure and different adhesive operability.

The main purpose of the present invention is to provide a re-pastable composite structure adhesive device and its method, which combines a main structural adhesive layer with a container Arrange at least one structural auxiliary layer to form a re-adhesive structure, and use the structural auxiliary layer to provide a buffering protective structure or provide an auxiliary adhesion force to assist the main structural adhesive layer, and use the main structural adhesive layer to provide A protective structure is accommodated in the structural auxiliary layer, so that the re-adhesive structure can be re-adhered to various characteristic surfaces to achieve the purpose of being directly adhered to various characteristic surfaces (for example: uneven rough surfaces) and effect.

Another object of the present invention is to provide a re-adhesive composite structure adhesive device and method, which combines a main structural adhesive layer with at least one structural auxiliary layer to form a re-adherable structure, and utilizes the The structural auxiliary layer provides a buffering and protective structure or provides an auxiliary adhesion force to assist the main structural adhesive layer, and uses the main structural adhesive layer to provide an accommodation and protective structure on the structural auxiliary layer, thus utilizing the re-adhesive structure It can be repeatedly pasted on surfaces with various characteristics, and the main structural adhesive layer is further used to contain and buffer the structural auxiliary layer to achieve high adhesive properties that can be repeatedly pasted, avoid damage to the adhesive structure, and operate with different adhesive properties. its purpose and efficacy.

In order to achieve the above object, the re-adhesive composite structure adhesive device according to the preferred embodiment of the present invention includes:

a main structural adhesive layer made of a first material;

At least one first adhesive surface is provided on the main structural adhesive layer;

Several chambers are arranged on the first adhesive surface of the adhesive layer of the main structure;

At least one structural auxiliary layer made of a second material; and

Several auxiliary blocks are arranged on the structural auxiliary layer, and the several auxiliary blocks of the structural auxiliary layer correspond to several chambers of the main structural adhesive layer, and the auxiliary blocks are used to provide a buffer protection structure Or provide an auxiliary adhesive force to assist the first adhesive surface;

Several auxiliary blocks of the structural auxiliary layer are placed in corresponding chambers of the main structural adhesive layer, so that the number of the main structural adhesive layer is Each chamber is combined with several auxiliary blocks that accommodate the structural auxiliary layer to form a re-stickable structure, and the re-stickable structure can be re-sticked to surfaces with various characteristics.

In the preferred embodiment of the present invention, a plurality of the auxiliary blocks protrude outside a plurality of chamber openings of the first adhesive surface of the main structure adhesive layer, so as to form a plurality of adhesive protrusions.

In the preferred embodiment of the present invention, a plurality of the auxiliary blocks are recessed into a plurality of chamber openings on the first adhesive surface of the main structural adhesive layer, so as to form a plurality of adhesive chambers.

In the preferred embodiment of the present invention, the plurality of auxiliary blocks are slightly aligned with the plurality of chamber openings on the first adhesive surface of the main structure adhesive layer, so that the plurality of auxiliary blocks and the first adhesive layer of the main structure adhesive layer are The surfaces together form a composite adhesive surface.

In the preferred embodiment of the present invention, several chambers of the main structural adhesive layer extend relatively parallel or obliquely to a longitudinal axis of the main structural adhesive layer.

In order to achieve the above object, the re-pastable composite structure bonding method according to the preferred embodiment of the present invention includes:

Provide at least one first adhesive surface on a main structural adhesive layer, and configure several chambers on the first adhesive surface;

Arrange several auxiliary blocks on at least one structural auxiliary layer, and use the auxiliary blocks to provide a buffer protection structure or provide an auxiliary adhesion force to assist the first adhesive surface;

Several auxiliary blocks of the structural auxiliary layer are placed correspondingly into several chambers of the main structural adhesive layer, so that several chambers of the main structural adhesive layer are combined to accommodate several auxiliary blocks of the structural auxiliary layer. body to form a re-stickable structure; and

The re-pastable structure can be re-pasted on surfaces with various characteristics.

The number of adhesive layers of the main structure in the preferred embodiment of the present invention The containment chamber provides a plurality of auxiliary blocks for accommodating the protective structure on the auxiliary layer of the structure.

In the preferred embodiment of the present invention, several chambers of the main structure adhesive layer form a cross-sectional structure, and the cross-sectional structure includes a fibrous cross-sectional structure, a columnar cross-sectional structure, and a mushroom strip-shaped cross-sectional structure. , a concave strip-shaped cross-section structure or any combination thereof.

In a preferred embodiment of the present invention, the main structural adhesive layer further includes at least a second adhesive surface, and the second adhesive surface is selected from a sensitive adhesive layer.

The structural auxiliary layer in a preferred embodiment of the present invention includes a heat-sensitive material, an electro-sensitive material, a carbon nanotube material or a nanocarbon particle material.

1: Main structure adhesive layer

10:Room

11: The first microstructure

11a: Microstructure of shiitake mushroom strips

11b: concave strip-like microstructure

11c: Inclined microstructure

12: Inductive glue layer

2: Structural auxiliary layer

21: Auxiliary block

22:Extended bumps

A: First sticking surface

B: Second sticking surface

3: Object to be pasted

9: Longitudinal axis of the main structure adhesive layer

Figure 1: A schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the first preferred embodiment of the present invention.

Figure 2: A schematic flow chart of a re-pastable composite structure bonding method according to the first preferred embodiment of the present invention.

Figure 3: A schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the second preferred embodiment of the present invention.

Figure 4: A schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the third preferred embodiment of the present invention.

Figure 5: A schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the fourth preferred embodiment of the present invention.

Figure 6: A schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the fifth preferred embodiment of the present invention.

Figure 7: A schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the sixth preferred embodiment of the present invention.

Appendices 1 to 5: Photomicrographs of the re-adhesive composite structure adhesive device according to the preferred embodiment of the present invention.

In order to fully understand the present invention, preferred embodiments will be exemplified and described in detail below with the accompanying drawings, which are not intended to limit the present invention.

The re-stickable composite structure adhesive device and method of the preferred embodiment of the present invention are suitable for various [characteristic] surfaces or are suitable for being attached to various objects, such as: various optical glass [optical glass], various liquid crystal display panels [LCD] panel] or touch panel [touch panel], various solar cell elements [solar cell], various semiconductor elements [semiconductor element], various semiconductor wafers [silicon wafer], various 3C products [3C product], various metal accessories or steel materials Products [metal or steel product], various plastic products [plastic product], various electronic components [such as ceramic capacitors, MLCC], various parts [spare part], various automated or non-automated production equipment, such as various robotic arm devices , various automatic or non-automatic transportation devices or various clamping operating devices or other objects that need to be attached or protected, but they are not used to limit the scope of application of the present invention.

The definition of various characteristic surfaces in the preferred embodiment of the present invention includes various rough surfaces with uneven characteristics, various curved surfaces, various oily surfaces, various water-based surfaces, various high-temperature characteristic surfaces, various bottom-temperature characteristic surfaces, various material characteristic surfaces or other various surfaces characteristic surface, but it is not intended to limit the scope of application of the present invention.

Figure 1 shows a schematic cross-sectional view of a re-adhesive composite structure adhesive device according to a first preferred embodiment of the present invention. Referring to Figure 1, the re-stickable composite structure adhesive device according to the first preferred embodiment of the present invention is suitable for use on a variety of surfaces, and the re-stickable composite structure adhesive device includes a main structural adhesive layer 1 and at least one structural auxiliary layer 2.

Please refer to Figure 1 again. For example, the main structural adhesive layer 1 can choose to have a predetermined size specification (such as length, width and thickness), and the main structural adhesive layer 1 can choose to have a predetermined shape. or A predetermined shape piece [for example: rectangular parallelepiped, cube, ellipsoid, perfect circle or other appropriate shapes].

Please refer to Figure 1 again. For example, the main structure adhesive layer 1 can be formed in an integrated manner, and the main structure adhesive layer 1 can have a first adhesive surface A and a second adhesive surface B. And the main structural adhesive layer 1 is used to accommodate and protect the structural auxiliary layer 2, that is, it forms a protective body or a protective layer, so that the structural auxiliary layer 2 can help prevent several adhesion of the main structural adhesive layer 1 during use. The structure (for example: adhesive bars or adhesive blocks) is damaged or mutually adhered (for example: self-adhesive), and the structural auxiliary layer 2 can be used to buffer and protect the main structural adhesive layer 1.

Please refer to Figure 1 again. For example, the main structural adhesive layer 1 can be made of a first material, and the structural auxiliary layer 2 can be made of a second material, and the main structure The first material of the adhesive layer 1 can form an elastic glue layer or a viscous glue layer, such as pressure-sensitive glue, silicone, rubber or materials with similar functions, and the second material of the structural auxiliary layer 2 includes a A thermosensitive material, an electrosensitive material, a carbon nanotube material, a nanocarbon particle material or a mechanically deformable material, a photosensitive material, a magnetically sensitive material, a pH-sensitive material or a material with similar functions Material.

Please refer to Figure 1 again. For example, the second material of the structural auxiliary layer 2 can be selected from an environmentally sensitive material, and the environmentally sensitive material can be selected to utilize an operating variation [for example: light, electricity , water (or water vapor), changes in pH or other changes) control the viscosity of the second material of the structural auxiliary layer 2 in order to adjust the overall adhesion of the main structural adhesive layer 1 and the structural auxiliary layer 2.

For example, the second material of the structural auxiliary layer 2 is a photosensitive material that produces mechanical physical changes when exposed to light, or a colloidal material that has functional groups or components that can absorb light to produce reversible or irreversible physical changes in structure. For example: polymerizable C=C, diazo, spirobenzopyrane, spirooxazine, photoacids, photoinitiators, photocatalysts TiO ₂ , ZnO, etc.), photocatalysts [photoinitiators], etc.

For example, the second material of the structural auxiliary layer 2 is a thermosensitive material that produces mechanical physical changes when heated, or a colloidal material with functional groups or components that can absorb heat to produce reversible or irreversible physical changes in structure. For example, polymers with suitable phase transition temperatures [for example: poly(NIPAAm), Poly(EG-co-PG)di-(or multi-)block copolymers, etc.], polymers with side chain crystals [for example: long chain pressure gram copolymer, long side chain silicone, etc.], heat shrinkable film materials with specific volume changes [such as polyester, polyvinyl chloride, etc.], materials with shape memory [such as polyurethane, polymer-based fibers, bridged polymers, or Its composite materials, etc.].

Please refer to Figure 1 again. For example, depending on various operating requirements, the heat-sensitive material of the auxiliary layer 2 of the structure can be selected from tri-block (PEO-PPO-PEO), poly (N-isopropylacrylamide), poly ( propylene glycol), poly(ethylene glycol), poly(vinyl methyl ether), poly(vinyl methyl oxazolidone), poly(vinyl pyrrolidone), hydroxypropylcellulose, polyphosphazene derivatives, poly(N-vinylcaprolactam) or materials with similar heat-sensitive functions.

Please refer to Figure 1 again. For example, the electrosensitive material of the structural auxiliary layer 2 can be selected from polyfluorene, polypyrenes, polynaphthalenespoly(pyrrole), polyaniline [polyaniline], poly(thiophene), poly(3, 4-ethylenedioxythiophene)poly(p-phenylene sulfide), graphene or materials with similar electrosensitive functions. In addition, the structural auxiliary layer 2 may be selected from a photosensitive material, a magnetically sensitive material, a pH-sensitive material or materials with similar functions.

Please refer to Figure 1 again. For example, the main structural adhesive layer 1 can optionally include several cavities 10 to form a cavity array or a micro array structure, and each cavity 10 You can choose to have a predetermined shape chamber or a predetermined shape chamber (for example: a rectangular chamber, a square chamber, an elliptical chamber, a perfect circular chamber or other appropriate shape chambers), and each of the chambers 10 can Choose to have at least one opening so that the chamber 10 can be connected to the outside world. In addition, several chambers 10 of the main structural adhesive layer 1 extend relatively parallel to a longitudinal axis of the main structural adhesive layer (as shown by the vertical dotted line in Figure 5) 9.

For example, in another preferred embodiment of the present invention, the plurality of chambers 10 and their openings can be selected to be regularly equi-spaced, gradually regularly changing equi-spaced, or randomly equi-spaced. arranged and distributed on the first adhesive surface A of the main structure adhesive layer 1, and the chamber 10 of the main structure adhesive layer 1 forms a first micro structure 11, and the first micro structure 11 has a cross-sectional structure, And the cross-sectional structure includes a fibrous cross-sectional structure, a columnar cross-section structure, a mushroom strip-shaped cross-section structure, a concave strip-shaped cross-section structure or any combination thereof.

Please refer to Figure 1 again. For example, the first microstructure 11 can be selected to have several high-viscosity micro-cylinders, and the first microstructure 11 can be selected to have appropriate elastic deformation and adhesive properties, and the first microstructure 11 can be selected to have appropriate elastic deformation and adhesive properties. The first microstructure 11 can be selected from an elastic bristle structure, an elastic root structure, an elastic house lizard foot structure or other elastic columnar structures with similar high viscosity functions. In addition, the first microstructure 11 is suitable for adhering to various rough surfaces.

Please refer to Figure 1 again. For example, the main structural adhesive layer 1 can appropriately process the second adhesive surface B, so that the second adhesive surface B is selected from a sensitive adhesive layer 12 to form a double-sided adhesive. , and the sensing adhesive layer 12 can form a smart tape.

Please refer to Figure 1 again. For example, the structural auxiliary layer 2 can be selected to form an adhesive point array layer, an adhesive block array layer, and an adhesive block array layer. An adhesive pillar array layer or a structural layer with a similar array distribution, and the main structural adhesive layer 1 can optionally include several auxiliary blocks 21, and each of the auxiliary blocks 21 can optionally have a predetermined shape block or a predetermined Shaped cylinder [for example: rectangular cylinder, square cylinder, elliptical cylinder, right cylinder or other appropriately shaped cylinder].

Please refer to Figure 1 again. For example, the structural auxiliary layer 2 can be made of a second material, and the second material of the structural auxiliary layer 2 can be formed into an adhesive layer, such as silicone, Acrylic glue, polyurethane resin, rubber or materials with similar adhesive functions, and the plurality of auxiliary blocks 21 can be selected as several independent auxiliary blocks, and the second material of the structural auxiliary layer 2 provides an auxiliary adhesive force Assisting action on the first sticking surface A.

For example, in another preferred embodiment of the present invention, several of the auxiliary blocks 21 are arranged and distributed on the structural auxiliary layer 2 in a regular equidistant, gradually regular and unequal manner, or a random unequal manner, and the structure The auxiliary block 21 of the auxiliary layer 2 forms a second microstructure (not labeled), and the second microstructure has a cross-sectional structure, and the cross-sectional structure has a cross-sectional structure, and the cross-sectional structure includes a fibrous A cross-sectional structure, a columnar cross-section structure, a mushroom strip-shaped cross-section structure, a concave strip-shaped cross-section structure or any combination thereof.

Figure 2 shows a schematic flow chart of a re-pastable composite structure bonding method according to the first preferred embodiment of the present invention. Please refer to Figures 1 and 2. For example, the re-pastable composite structure adhesion method of the first preferred embodiment of the present invention includes step S1: first, use appropriate technical means to set the main structure adhesive layer 1 At least one or several first sticking surfaces A, and a plurality of the chambers 10 are appropriately arranged on the first sticking surfaces A.

Please refer to Figures 1 and 2 again. For example, the re-pastable composite structure bonding method according to the first preferred embodiment of the present invention includes step S2: then, use appropriate technical means to attach at least one or several of the The structural auxiliary layer 2 is configured with several auxiliary blocks 21 and utilizes several auxiliary blocks 21 Together, they provide a buffering and protective structure or provide an auxiliary adhesion force to act on the first adhesive surface A.

Please refer to Figures 1 and 2 again. For example, the re-pastable composite structure bonding method according to the first preferred embodiment of the present invention includes step S3: Next, several auxiliary blocks of the structure auxiliary layer 2 are The body 21 is correspondingly placed in the plurality of chambers 10 of the main structural adhesive layer 1, so that the plurality of chambers 10 of the main structural adhesive layer 1 are combined to accommodate the plurality of auxiliary blocks 21 of the structural auxiliary layer 2, so as to Form a re-pastable structure.

Please refer to Figures 1 and 2 again. For example, the re-pastable composite structure bonding method of the first preferred embodiment of the present invention includes step S4: Then, the re-pastable structure can be appropriately repeated It is adhered to various characteristic surfaces, such as non-flat surfaces, uneven surfaces, rough surfaces or other characteristic surfaces. At this time, there are several chambers 10 of the main structural adhesive layer 1 and several auxiliary blocks of the structural auxiliary layer 2. Several tiny sucker-like structures are formed between 21.

Please refer to Figures 1 and 2 again. For example, during the pasting operation, the re-adhesive structure is appropriately pasted on a predetermined characteristic surface of an object 3 to be pasted, and during the disassembly operation, the re-adhesive structure is used to The plurality of chambers 10 of the main structural adhesive layer 1 and the plurality of auxiliary blocks 21 of the structural auxiliary layer 2 of the re-adhesive structure can be properly disassembled from the predetermined characteristic surface of the object 3 to be adhered.

Please refer to Figure 1, for example, several auxiliary blocks 21 are recessed within several chamber openings of the first adhesive surface A of the main structural adhesive layer 1, so as to form several adhesive chambers. , in order to enhance its overall sticky properties. In addition, a plurality of auxiliary blocks 21 of the structural auxiliary layer 2 are provided with a housing protection structure in the plurality of chambers 10 of the main structure adhesive layer 1, so that the structural auxiliary layer 2 can assist in preventing the main structure from adhering during use. Several adhesive structures in layer 1 (for example: adhesive bars or blocks) are damaged or adhere to each other (for example: self-adhesive).

Figure 3 shows a schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the second preferred embodiment of the present invention. Please refer to Figure 3. Compared with the first embodiment, the main structure adhesive layer 1 of the re-pastable composite structure adhesive device of the second preferred embodiment of the present invention adopts a mushroom strip-shaped micro structure 11a. In order to enhance its overall sticky properties.

Figure 4 shows a schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the third preferred embodiment of the present invention. Please refer to Figure 4. Compared with the first and second embodiments, the main structural adhesive layer 1 of the re-pastable composite structure adhesive device of the third preferred embodiment of the present invention adopts a concave strip-shaped micro Structure 11b in order to enhance its overall adhesive properties.

Figure 5 shows a schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the fourth preferred embodiment of the present invention. Please refer to Figure 5. Compared with the first to third embodiments, the plurality of chambers 10 of the main structure adhesive layer 1 of the re-pastable composite structure adhesive device of the fourth preferred embodiment of the present invention are opposite to each other. It extends obliquely from the longitudinal axis of a main structural adhesive layer (as shown by the vertical dotted line in Figure 5) 9, thus forming an oblique microstructure 11c, and the oblique microstructure 11c has directionality in use and operation, so as to facilitate The predetermined characteristic makes it easy to tear and peel off the main structure adhesive layer 1 .

Figure 6 shows a schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the fifth preferred embodiment of the present invention. Please refer to Figure 6. Compared with the first embodiment, the auxiliary block 21 of the re-pastable composite structure adhesive device of the fifth preferred embodiment of the present invention has at least one extended protrusion 22, and several The extended protrusions 22 of the auxiliary block 21 protrude beyond the several chamber openings of the first adhesive surface A of the main structural adhesive layer 1 so as to form several adhesive protrusions, as indicated by the horizontal dotted lines in Figure 6 Show.

Please refer to Figure 6 again. For example, the extended protrusion 22 can be selected to have several high-viscosity micro-cylinders, and the extended protrusion 22 can be selected to have appropriate elastic deformation and adhesive properties, and the extended protrusion 22 can be selected to have appropriate elastic deformation and adhesive properties. Point 22 may be selected from an elastic bristle structure, an elastic root hair structure, an elastic gecko foot structure or other elastic columnar structures with similar high viscosity functions. In addition, the extended protrusions 22 are suitable for adhering to various rough surfaces.

Figure 7 shows a schematic cross-sectional view of a re-adhesive composite structure adhesive device according to the sixth preferred embodiment of the present invention. Please refer to Figure 7. Compared with the first and fifth embodiments, the auxiliary block 21 of the re-adhesive composite structure adhesive device of the sixth preferred embodiment of the present invention has at least one extended protrusion 22. And the extended protrusions 22 of the auxiliary blocks 21 are slightly aligned with the chamber openings of the first adhesive surface A of the main structure adhesive layer 1, so that the auxiliary blocks 21 and the main structure adhesive layer 1 The first adhesive surfaces A together form a composite adhesive surface.

The foregoing preferred embodiments only illustrate the present invention and its technical features. The technology of this embodiment can still be appropriately implemented with various substantially equivalent modifications and/or substitutions; therefore, the scope of rights of the present invention shall depend on the appended patent application. The scope defined shall prevail. The copyright in this case is restricted to use for patent applications in the Republic of China.

1: Main structure adhesive layer

10:Room

11: The first microstructure

12: Inductive glue layer

2: Structural auxiliary layer

21: Auxiliary block

A: First sticking surface

B: Second sticking surface

3: Object to be pasted

Claims (10)

A re-adhesive composite structure adhesive device, which includes: a main structural adhesive layer made of a first material; At least one first adhesive surface is provided on the main structural adhesive layer; Several chambers are arranged on the first adhesive surface of the adhesive layer of the main structure; At least one structural auxiliary layer made of a second material; and Several auxiliary blocks are arranged on the structural auxiliary layer, and the several auxiliary blocks of the structural auxiliary layer correspond to several chambers of the main structural adhesive layer, and the auxiliary blocks are used to provide a buffer protection structure Or provide an auxiliary adhesive force to assist the first adhesive surface; Wherein, several auxiliary blocks of the structural auxiliary layer are placed correspondingly into several chambers of the main structural adhesive layer, so that the several chambers of the main structural adhesive layer are combined to accommodate several auxiliary blocks of the structural auxiliary layer. block to form a re-stickable structure, and the re-stickable structure can be repeatedly stuck on surfaces with various characteristics. According to the re-adhesive composite structural adhesive device described in item 1 of the patent application, a plurality of the auxiliary blocks protrude from several chamber openings of the first adhesive surface of the main structural adhesive layer, so as to facilitate Several sticking convex bodies are formed. According to the re-adhesive composite structure adhesive device described in item 1 of the patent application, a plurality of the auxiliary blocks are recessed in a plurality of chamber openings on the first adhesive surface of the main structure adhesive layer, so as to facilitate Several sticking chambers are formed. According to the re-pastable composite structural adhesive device described in item 1 of the patent application, a plurality of the auxiliary blocks are slightly aligned with a plurality of chamber openings on the first adhesive surface of the main structural adhesive layer, such that The auxiliary block and the first adhesive surface of the main structure adhesive layer jointly form a composite adhesive surface. According to the re-adhesive composite structural adhesive device described in item 1 of the patent application, several chambers of the main structural adhesive layer extend relatively parallel or obliquely to a longitudinal axis of the main structural adhesive layer. A re-pastable composite structure bonding method, which includes: providing at least a first bonding surface on a main structure bonding layer, and arranging several chambers on the first bonding surface; arranging several chambers on at least one structural auxiliary layer Auxiliary blocks, and use the auxiliary blocks to provide a buffer protection structure or provide an auxiliary adhesive force to assist the first adhesive surface; place several auxiliary blocks of the structural auxiliary layer into the main structural adhesive layer correspondingly several accommodation chambers, so that the several accommodation chambers of the main structural adhesive layer are combined with the several auxiliary blocks that accommodate the structural auxiliary layer to form a re-adhesive structure; and the re-adherable structure can be Repeatedly pasted on a variety of surfaces. According to the re-adhesive composite structure adhesion method described in item 6 of the patent application, a plurality of chambers in the main structure adhesive layer provide a plurality of auxiliary blocks for accommodating the protective structure in the auxiliary layer of the structure. According to the re-pastable composite structure bonding method described in item 6 of the patent application, several chambers of the main structure adhesive layer form a cross-sectional structure, and the cross-sectional structure includes a columnar cross-sectional structure, A mushroom strip-shaped cross-section structure, a concave strip-shaped cross-section structure or any combination thereof. According to the re-pastable composite structure bonding method described in item 6 of the patent application, the main structure adhesive layer further includes at least a second bonding surface, and the second bonding surface is selected from a sensitive adhesive layer. According to the re-pastable composite structure adhesion method described in item 6 of the patent application, the structural auxiliary layer includes a photosensitive material, a magnetically sensitive material, a pH-sensitive material, a heat-sensitive material, and an electro-sensitive material. material, a carbon nanotube material or a carbon nanoparticle material.

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