TWI704102B - Multi-layer reusable adhesive device and method for miscellaneous surfaces - Google Patents
Multi-layer reusable adhesive device and method for miscellaneous surfaces Download PDFInfo
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本發明係關於一種多層次〔multi-layer〕可重覆〔reusable〕黏貼裝置〔adhesive device〕及其方法;特別是關於一種適用於多種特性表面〔miscellaneous surface〕之多層次可重覆黏貼裝置及其方法;特別是關於一種具配置局部微小吸盤結構〔partial miniature sucker structure〕或局部奈米吸盤〔nano-sucker〕結構及配置局部微小柱狀〔miniature pillar〕結構之多層次可重覆黏貼裝置及其方法。 The present invention relates to a multi-layer (multi-layer) reusable adhesive device (adhesive device) and method thereof; in particular, it relates to a multi-layer reusable adhesive device suitable for a miscellaneous surface (miscellaneous surface) and The method; in particular, it relates to a multi-layer repetitive pasting device with a partial miniature sucker structure (partial miniature sucker structure) or a partial nano-sucker structure and a local miniature pillar (miniature pillar) structure, and Its method.
舉例而言,習用奈米吸盤裝置及其製造方法,如中華民國專利公告第TW-I263513號之〝具有吸盤式奈米孔洞的生醫植入物及製造方法〞發明專利,其揭示一種生醫植入物。該生醫植入物包含數個吸盤式奈米孔洞,而該生醫植入物之一部份或全部表面設置一吸盤式奈米孔洞結構。該吸盤式奈米孔洞結構為具有複數個具奈米尺寸之管狀物。 For example, the conventional nano sucker device and its manufacturing method, such as the invention patent of "Biomedical implants with suction cup-type nano-holes and its manufacturing method" in the Republic of China Patent Publication No. TW-I263513, which discloses a kind of biomedical Implants. The biomedical implant includes a plurality of suction cup type nano-holes, and part or all of the surface of the biomedical implant is provided with a suction cup type nano-hole structure. The sucker-type nanoporous structure has a plurality of nano-sized tubes.
承上,前述第TW-I263513號之該管狀物的全部或部份呈現為採用以矩陣排列,且將各個該管狀物設置為一可供填入生物可吸收材料〔或藥物〕之孔洞。各個該孔洞之大小在實質上為介於10nm至100nm之間。另外,該生醫植入物可選自一純鈦片。 In addition, all or part of the aforementioned tube of No. TW-I263513 appears to be arranged in a matrix, and each tube is set as a hole for filling bioabsorbable materials (or drugs). The size of each hole is substantially between 10 nm and 100 nm. In addition, the biomedical implant can be selected from a pure titanium sheet.
前述第TW-I263513號之該生醫植入物之製造 方法主要包含步驟:〔A〕、先將該生醫植入物施以陽極處理,使該生醫植入物之表面形成一氧化膜,且以一溶劑添加於陽極處理時之溶液內;〔B〕、再加以一外加電壓,使該生醫植入物之表面形成數個該管狀物,且該管狀物為具有該孔洞。 Manufacture of the aforementioned biomedical implant No. TW-I263513 The method mainly includes the steps: [A], first apply anodizing treatment to the biomedical implant to form an oxide film on the surface of the biomedical implant, and add a solvent to the solution during the anodizing treatment; [ B]. Applying an additional voltage to form several tubes on the surface of the biomedical implant, and the tubes have the holes.
承上,前述第TW-I263513號於將該生醫植入物進行陽極處理時,該溶劑可選擇為氫氟酸或硫酸。另外,於該生醫植入物加以該外加電壓時,該外加電壓可選擇為於50伏特以內。然而,第TW-I263513號之該吸盤式奈米孔洞僅適用於生醫植入用途,其並不適用於一般吸附重物,且該吸盤式奈米孔洞結構易遭受破壞。 In addition, in the aforementioned No. TW-I263513, when the biomedical implant is anodized, the solvent can be hydrofluoric acid or sulfuric acid. In addition, when the applied voltage is applied to the biomedical implant, the applied voltage can be selected to be within 50 volts. However, the suction cup type nanoporous No. TW-I263513 is only suitable for biomedical implantation purposes, it is not suitable for general adsorption of heavy objects, and the suction cup type nanoporous structure is easily damaged.
另一習用奈米吸盤裝置及其操作方法,如中華民國專利公告第TW-I538874號之〝微細結構吸盤裝置及其操作方法〞發明專利,其揭示一種微細結構吸盤裝置及其操作方法。該微細結構吸盤裝置包含一吸盤基板、一微細結構及一按壓操作面。該吸盤基板包含一第一表面及一第二表面。該微細結構設置於該吸盤基板之第一表面,以形成一吸附層。該按壓操作面設置於該吸盤基板之第二表面,且該吸附層對應該按壓操作面。 Another conventional nano sucker device and its operating method, such as the invention patent of "Micro-structured sucker device and its operation method" of ROC Patent Publication No. TW-I538874, discloses a micro-structured sucker device and its operating method. The fine structure sucker device includes a sucker substrate, a fine structure and a pressing operation surface. The suction cup substrate includes a first surface and a second surface. The fine structure is arranged on the first surface of the suction cup substrate to form an adsorption layer. The pressing operation surface is arranged on the second surface of the suction cup substrate, and the adsorption layer corresponds to the pressing operation surface.
承上,前述第TW-I538874號之該微細結構吸盤裝置操作方法:利用該吸附層對應於一待吸附表面;將該吸附層之至少一部分對應貼附於該待吸附表面;利用按壓操作該吸附層之至少一部分,以擠壓排出該微細結構內之至少一部分之氣體,以便該吸附層之至少一部分吸附該待吸附表面;將該吸附層之至少一邊緣進行撥開,以便該吸附層之至少一部分剝離該待吸附表面。 Continuing, the operation method of the aforementioned micro-structure suction cup device of No. TW-I538874: using the adsorption layer corresponding to a surface to be adsorbed; attaching at least a part of the adsorption layer to the surface to be adsorbed correspondingly; operating the adsorption by pressing At least a part of the layer is squeezed to discharge at least a part of the gas in the microstructure so that at least a part of the adsorption layer adsorbs the surface to be adsorbed; at least one edge of the adsorption layer is pushed aside so that at least the adsorption layer A part of the surface to be adsorbed is peeled off.
另一習用奈米吸盤裝置及其操作方法,如中華民國專利公告第TW-I539089號之〝奈米吸盤裝置及其操作方法〞發明專利,其揭示一種奈米吸盤裝置及其操作方法。 該奈米吸盤裝置包含一吸盤基板、數個奈米空穴及一按壓操作面。該吸盤基板包含一第一表面及一第二表面。該奈米空穴排列設置於該吸盤基板之第一表面,以形成一吸附層。該按壓操作面設置於該吸盤基板之第二表面,且該吸附層對應該按壓操作面。 Another conventional nano sucker device and its operation method, such as the invention patent of "Nano sucker device and its operation method" of Republic of China Patent Publication No. TW-I539089, which discloses a nano sucker device and its operation method. The nano sucker device includes a sucker substrate, a plurality of nano cavities and a pressing operation surface. The suction cup substrate includes a first surface and a second surface. The nano-cavities are arranged on the first surface of the suction cup substrate to form an adsorption layer. The pressing operation surface is arranged on the second surface of the suction cup substrate, and the adsorption layer corresponds to the pressing operation surface.
承上,前述第TW-I539089號之該奈米吸盤裝置操作方法:利用該吸附層對應於一待吸附表面;將該吸附層之至少一部分對應貼附於該待吸附表面;利用按壓操作該吸附層之至少一部分,以擠壓排出該奈米空穴內之至少一部分之氣體,以便該吸附層之至少一部分吸附該待吸附表面;將該吸附層之至少一邊緣進行撥開,以便該吸附層之至少一部分剝離該待吸附表面。 Continuing, the operation method of the aforementioned nano sucker device No. TW-I539089: using the adsorption layer corresponding to a surface to be adsorbed; attaching at least a part of the adsorption layer to the surface to be adsorbed correspondingly; operating the adsorption by pressing At least a part of the layer is squeezed to discharge at least a part of the gas in the nano-cavity, so that at least a part of the adsorption layer adsorbs the surface to be adsorbed; at least one edge of the adsorption layer is pulled apart so that the adsorption layer At least part of it peels off the surface to be adsorbed.
另一習用奈米吸盤裝置及其操作方法,如中華民國專利公告第TW-I549901號之〝雙面微細結構吸盤裝置及其操作方法〞發明專利,其揭示一種雙面微細結構吸盤裝置及其操作方法。該雙面微細結構吸盤裝置包含吸盤基板、數個第一奈米空穴及數個第二奈米空穴。該第一微細結構及第二微細結構排列設置於該吸盤基板之二相反表面,以形成一第一吸附層及一第二吸附層。 Another conventional nano sucker device and its operation method, such as the invention patent of "Double-sided micro-structure sucker device and its operation method" of the Republic of China Patent Publication No. TW-I549901, which discloses a double-sided micro-structure sucker device and its operation method. The double-sided microstructure suction cup device includes a suction cup substrate, a plurality of first nano-cavities and a plurality of second nano-cavities. The first microstructure and the second microstructure are arranged on two opposite surfaces of the suction cup substrate to form a first adsorption layer and a second adsorption layer.
承上,前述第TW-I549901號之該微細結構吸盤裝置操作方法:將該第一吸附層或第二吸附層對應貼附於一待吸附表面;按壓操作該吸附層第一吸附層或第二吸附層,以擠壓排出該第一微細結構或第二微細結構內之氣體,以便該第一吸附層或第二吸附層可吸附該待吸附表面;在進行脫離操作時,將該第一吸附層或第二吸附層之至少一邊緣進行撥開,以便該第一吸附層或第二吸附層之至少一部分可剝離該待吸附表面。 Continuing the above, the operation method of the micro-structure suction cup device of No. TW-I549901: attach the first adsorption layer or the second adsorption layer to a surface to be adsorbed correspondingly; press the first adsorption layer or the second adsorption layer of the adsorption layer The adsorption layer is used to squeeze out the gas in the first microstructure or the second microstructure, so that the first adsorption layer or the second adsorption layer can adsorb the surface to be adsorbed; during the separation operation, the first adsorption At least one edge of the layer or the second adsorption layer is pulled apart so that at least a part of the first adsorption layer or the second adsorption layer can peel off the surface to be adsorbed.
然而,雖然前述第TW-I538874號專利之微細結構吸盤裝置、第TW-I539089號之奈米吸盤裝置及第 TW-I549901號之雙面微細結構吸盤裝置已提供各種奈米吸盤裝置,但其必然存在進一步改良其結構、其操作方法及製造方法之潛在需求。 However, although the aforementioned fine structure suction cup device of No. TW-I538874 patent, the nano suction cup device of No. TW-I539089 and the first The TW-I549901 double-sided microstructure suction cup device has provided various nano suction cup devices, but there is bound to be a potential demand for further improvement of its structure, its operation method and manufacturing method.
前述第TW-I263513號專利、第TW-I538874號專利、第TW-I539089號專利及第TW-I549901號專利僅為本發明技術背景之參考及說明目前技術發展狀態而已,其並非用以限制本發明之範圍。 The aforementioned Patent No. TW-I263513, Patent No. TW-I538874, Patent No. TW-I539089, and Patent No. TW-I549901 are only a reference for the technical background of the present invention and illustrate the current state of technology development, and they are not intended to limit the present invention. The scope of the invention.
另外,習用乾式膠帶在使用上面臨的問題包含:1、乾式膠帶經常由於待黏著物表面濕潤而造成水分子破壞膠帶與待黏著物表面之間的作用力,因此乾式膠帶無法黏貼在濕潤的待黏著物表面;2、乾式膠帶不易黏著於凹凸不平的粗糙表面上,由於凹凸不平的粗糙表面減少膠帶與待黏著物表面之間的接觸面積,因此導致乾式膠帶的黏著力下降。 In addition, the problems faced by conventional dry tapes in use include: 1. Dry tapes often cause water molecules to destroy the force between the tape and the surface of the object to be adhered because the surface of the object to be adhered is wet, so the dry tape cannot be adhered to the wet area. Adhesive surface; 2. The dry tape is not easy to adhere to the uneven rough surface, because the uneven rough surface reduces the contact area between the tape and the surface of the object to be adhered, resulting in a decrease in the adhesive force of the dry tape.
有鑑於此,本發明為了滿足上述技術問題及需求,其提供一種適用於多種表面之多層次可重覆黏貼裝置及其方法,其將至少一微小柱狀結構及至少一微小或奈米吸盤結構適當結合,以形成一可重覆黏貼結構,並利用該微小柱狀結構提供一黏著力,且利用該微小或奈米吸盤結構提供一真空吸力,如此利用該可重覆黏貼結構可重覆黏貼於各種特性表面上,因此相對於習用膠帶或貼片可大幅提升其可重覆黏貼之黏著性質及不殘膠性質。 In view of this, in order to meet the above-mentioned technical problems and needs, the present invention provides a multi-layer repeatable pasting device and method suitable for a variety of surfaces, which combines at least one tiny columnar structure and at least one tiny or nano sucker structure Properly combined to form a repeatable adhesive structure, and use the tiny columnar structure to provide an adhesive force, and use the tiny or nano sucker structure to provide a vacuum suction, so that the repeatable adhesive structure can be used to repeatedly paste On the surface with various characteristics, compared with conventional tapes or patches, it can greatly improve its repetitive adhesive properties and non-residual adhesive properties.
本發明之主要目的係提供一種適用於多種表面之多層次可重覆黏貼裝置及其方法,其將至少一微小柱狀結構及至少一微小或奈米吸盤結構適當結合,以形成一可重覆黏貼結構,並利用該微小柱狀結構提供一黏著力,且利用該微小或奈米吸盤結構提供一真空吸力,如此利用該可重覆黏貼結構可重覆黏貼於各種特性表面上,以達成 可直接黏貼各種特性表面〔例如:凹凸不平的粗糙表面〕上之目的。 The main purpose of the present invention is to provide a multi-layer repeatable pasting device and method suitable for a variety of surfaces, which appropriately combines at least one micro columnar structure and at least one micro or nano suction cup structure to form a repeatable Adhesive structure, and use the tiny columnar structure to provide an adhesive force, and use the tiny or nano suction cup structure to provide a vacuum suction force, so that the repeatable adhesive structure can be repeatedly pasted on surfaces with various characteristics to achieve It can be directly pasted on the surface with various characteristics (for example: rough surface with unevenness).
本發明之另一目的係提供一種適用於多種表面之多層次可重覆黏貼裝置及其方法,其將至少一微小柱狀結構層及至少一微小或奈米吸盤結構層適當堆疊結合,以形成一多層可重覆黏貼結構,並利用該微小柱狀結構層之微小柱狀結構提供一黏著力於各種特性表面上,且利用該微小或奈米吸盤結構層之微小或奈米吸盤結構提供一真空吸力於該微小柱狀結構層之微小柱狀結構上,如此利用該多層可重覆黏貼結構可重覆黏貼於該各種特性表面上,以達成可直接黏貼各種特性表面〔例如:凹凸不平的粗糙表面〕上之目的。 Another object of the present invention is to provide a multi-layer repeatable pasting device and method suitable for multiple surfaces, which combines at least one micro columnar structure layer and at least one micro or nano suction cup structure layer appropriately to form A multi-layer repetitive adhesive structure, and the use of the tiny columnar structure of the tiny columnar structure layer to provide an adhesive force on the surface with various characteristics, and the use of the tiny or nano sucker structure of the tiny or nano sucker structure layer to provide A vacuum suction force is applied to the tiny columnar structure of the tiny columnar structure layer, so that the multilayer repetitive pasting structure can be repeatedly pasted on the surface with various characteristics, so as to achieve direct sticking of various characteristic surfaces (for example: uneven On the rough surface].
為了達成上述目的,本發明較佳實施例之可重覆黏貼裝置包含:至少一微小柱狀結構,其配置於一第一位置;至少一微小或奈米吸盤結構,其配置於一第二位置;及一可重覆黏貼結構,其由該微小柱狀結構及奈米吸盤結構適當結合而形成;其中在黏貼作業時,利用該微小柱狀結構提供一黏著力,且利用該微小或奈米吸盤結構提供一真空吸力,如此利用該可重覆黏貼結構可重覆黏貼於各種特性表面上。 In order to achieve the above objective, the repeatable pasting device of a preferred embodiment of the present invention includes: at least one tiny columnar structure arranged at a first position; at least one tiny or nano suction cup structure arranged at a second position ; And a repeatable pasting structure, which is formed by the proper combination of the tiny columnar structure and the nano sucker structure; wherein the tiny columnar structure is used to provide an adhesive force during the pasting operation, and the tiny or nanometer The suction cup structure provides a vacuum suction force, so that the repeatable adhesive structure can be used to repeatedly adhere to a surface with various characteristics.
為了達成上述目的,本發明另一較佳實施例之多層次可重覆黏貼裝置包含:至少一微小柱狀結構層,其配置於一第一層體,且該微小柱狀結構層具有一微小柱狀結構;至少一微小或奈米吸盤結構層,其配置於一第二層體,且該微小或奈米吸盤結構層具有一奈米吸盤結 構;及一多層可重覆黏貼結構,其由該微小柱狀結構層及微小或奈米吸盤結構層適當堆疊結合而形成;其中在黏貼作業時,利用該微小柱狀結構層之微小柱狀結構提供一黏著力於一預定特性表面上,且利用該微小或奈米吸盤結構層之微小或奈米吸盤結構提供一真空吸力於該微小柱狀結構層之微小柱狀結構上,如此利用該多層可重覆黏貼結構可重覆黏貼於該預定特性表面上。 In order to achieve the above-mentioned object, the multi-layered repetitive pasting device of another preferred embodiment of the present invention includes: at least one minute columnar structure layer disposed on a first layer body, and the minute columnar structure layer has a minute Columnar structure; at least one micro or nano suction cup structure layer, which is arranged in a second layer, and the micro or nano suction cup structure layer has a nano suction cup structure Structure; and a multi-layer re-adhesive structure, which is formed by appropriately stacking and combining the micro columnar structure layer and the micro or nano sucker structure layer; wherein the micro column of the micro column structure layer is used in the pasting operation The structure provides an adhesive force on a surface with predetermined characteristics, and uses the micro or nano suction cup structure of the micro or nano suction cup structure layer to provide a vacuum suction force on the micro column structure of the micro column structure layer. The multilayer repetitive pasting structure can be repeatedly pasted on the surface with predetermined characteristics.
為了達成上述目的,本發明較佳實施例之可重覆黏貼方法包含:提供至少一微小柱狀結構,且將該微小柱狀結構配置於一第一位置;提供至少一微小或奈米吸盤結構,並將該微小或奈米吸盤結構配置於一第二位置,且將該微小柱狀結構及微小或奈米吸盤結構適當結合,以形成一可重覆黏貼結構;利用該微小柱狀結構提供一部分黏著力,並利用該微小或奈米吸盤結構提供一部分真空吸力,且該微小柱狀結構及微小或奈米吸盤結構之間具有一預定比例;及將該可重覆黏貼結構黏貼於一預定特性表面上,且利用該可重覆黏貼結構自該預定特性表面拆卸。 In order to achieve the above objective, the repeatable pasting method of a preferred embodiment of the present invention includes: providing at least one tiny columnar structure and disposing the tiny columnar structure at a first position; providing at least one tiny or nano sucker structure , And dispose the micro or nano sucker structure in a second position, and appropriately combine the micro columnar structure and the micro or nano sucker structure to form a repeatable sticking structure; using the micro column structure to provide A part of the adhesive force, and a part of the vacuum suction force is provided by the micro or nano suction cup structure, and there is a predetermined ratio between the micro columnar structure and the micro or nano suction cup structure; and the repeatable adhesive structure is pasted to a predetermined On the characteristic surface, and using the repeatable adhesive structure to be detached from the predetermined characteristic surface.
為了達成上述目的,本發明另一較佳實施例之多層次可重覆黏貼方法包含:提供至少一微小柱狀結構層,且該微小柱狀結構層具有一微小柱狀結構;提供至少一微小或奈米吸盤結構層,且該微小或奈米吸盤結構層具有一奈米吸盤結構;將至少一微小柱狀結構層及至少一微小或奈米吸盤結構層適當堆疊結合,以形成一多層可重覆黏貼結 構;及利用該微小柱狀結構層之微小柱狀結構提供一黏著力於一預定特性表面上,且利用該微小或奈米吸盤結構層之微小或奈米吸盤結構提供一真空吸力於該微小柱狀結構層之微小柱狀結構上,如此利用該多層可重覆黏貼結構可重覆黏貼於該預定特性表面上。 In order to achieve the above objective, a multi-layered repetitive pasting method of another preferred embodiment of the present invention includes: providing at least one micro columnar structure layer, and the micro column structure layer has a micro column structure; providing at least one micro Or a nano suction cup structure layer, and the micro or nano suction cup structure layer has a nano suction cup structure; at least one micro columnar structure layer and at least one micro or nano suction cup structure layer are appropriately stacked and combined to form a multilayer Repeatable pasting knot Structure; and the use of the tiny columnar structure of the tiny columnar structure layer to provide an adhesive force on a predetermined characteristic surface, and the use of the tiny or nanometer sucker structure layer to provide a vacuum suction force on the tiny On the tiny columnar structure of the columnar structure layer, the multilayer repetitive adhesive structure can be used to repeatedly adhere to the surface with predetermined characteristics.
本發明較佳實施例之該微小柱狀結構由壓克力膠、聚氨酯、橡膠、矽膠或其任意組合物製成。 The small columnar structure in the preferred embodiment of the present invention is made of acrylic glue, polyurethane, rubber, silicon glue or any combination thereof.
本發明較佳實施例之該微小或奈米吸盤結構包含數個微小或奈米吸盤空穴,且該微小或奈米吸盤空穴具有一半開放氣室。 In the preferred embodiment of the present invention, the micro or nano suction cup structure includes several micro or nano suction cup cavities, and the micro or nano suction cup cavities have half open air cells.
本發明較佳實施例之該可重覆黏貼結構或多層可重覆黏貼結構具有一掛釘裝置或一掛鉤裝置。 The repeatable pasting structure or multilayer repeatable pasting structure of the preferred embodiment of the present invention has a peg device or a hook device.
1‧‧‧可重覆黏貼結構 1‧‧‧Repeatable pasting structure
1A‧‧‧可重覆黏貼多層結構 1A‧‧‧Multilayer structure can be pasted repeatedly
1B‧‧‧保護膜 1B‧‧‧Protective film
10‧‧‧連接桿 10‧‧‧Connecting rod
11‧‧‧微小柱狀結構層 11‧‧‧Micro columnar structure layer
12‧‧‧微小或奈米吸盤結構層 12‧‧‧Micro or nano suction cup structure layer
21‧‧‧微小柱狀結構 21‧‧‧Micro columnar structure
211‧‧‧微小柱狀體 211‧‧‧Tiny cylinder
22‧‧‧微小或奈米吸盤結構 22‧‧‧Micro or nano suction cup structure
221‧‧‧微小或奈米吸盤空穴 221‧‧‧Micro or nano suction cup cavity
30‧‧‧組合基板 30‧‧‧Combined substrate
31‧‧‧掛釘裝置 31‧‧‧ Nail device
32‧‧‧掛鉤裝置 32‧‧‧Hook device
5‧‧‧待黏貼表面 5‧‧‧The surface to be pasted
6‧‧‧牆面 6‧‧‧Wall
第1圖:本發明第一較佳實施例之可重覆黏貼裝置之側視示意圖。 Figure 1: A schematic side view of the repeatable pasting device of the first preferred embodiment of the present invention.
第2圖:本發明第一較佳實施例之可重覆黏貼方法之流程示意圖。 Figure 2: A schematic flow diagram of the repeatable pasting method of the first preferred embodiment of the present invention.
第3圖:本發明第二較佳實施例之多層次可重覆黏貼裝置之側視示意圖。 Figure 3: A schematic side view of the multi-layer repetitive pasting device of the second preferred embodiment of the present invention.
第4圖:本發明第二較佳實施例之多層次可重覆黏貼方法之流程示意圖。 Figure 4: A schematic flow diagram of a multi-layer repetitive pasting method according to a second preferred embodiment of the present invention.
第5圖:本發明第三較佳實施例之可重覆黏貼裝置實施重覆黏貼於牆面之正視示意圖。 Figure 5: A schematic front view of the repeatable pasting device of the third preferred embodiment of the present invention implementing repeated pasting on the wall.
為了充分瞭解本發明,於下文將舉例較佳實施例並配合所附圖式作詳細說明,且其並非用以限定本發明。 In order to fully understand the present invention, preferred embodiments are exemplified below and described in detail with the accompanying drawings, and they are not intended to limit the present invention.
本發明較佳實施例之適用於多種〔特性〕表 面之多層次可重覆黏貼裝置及其方法適合貼附於各種物件,例如:各種光學玻璃〔optical glass〕、各種液晶顯示面板〔LCD panel〕、各種太陽能電池元件〔solar cell〕、各種半導體元件〔semiconductor element〕、各種半導體晶圓〔silicon wafer〕、3C產品〔3C product〕、各種金屬配件或鋼材產品〔metal or steel product〕、各種塑膠製品〔plastic product〕、各種零件〔spare part〕、各種自動化或非自動化生產作業裝置,例如:各種機械手臂裝置、各種自動或非自動運輸裝置或各種夾持作業裝置或其它需貼附保護的物件,但其並非用以限制本發明之應用範圍。 The preferred embodiment of the present invention is applicable to multiple [characteristic] tables The multi-layer repeatable pasting device and its method are suitable for attaching to various objects, such as various optical glass (optical glass), various liquid crystal display panels (LCD panel), various solar cell components (solar cell), and various semiconductor components. [Semiconductor element], various semiconductor wafers [silicon wafer], 3C products [3C products], various metal or steel products [metal or steel products], various plastic products [plastic products], various parts [spare part], various Automated or non-automated production operation devices, such as various robotic arm devices, various automatic or non-automatic transportation devices, various clamping operation devices, or other objects that need to be attached and protected, but they are not intended to limit the application scope of the present invention.
本發明較佳實施例之各種特性表面之定義包含各種凹凸不平特性的粗糙表面、各種油性表面、各種水性表面、各種高溫特性表面、各種底溫特性表面、各種材質特性表面或其它各種特性表面,但其並非用以限制本發明之應用範圍。 The definition of various characteristic surfaces of the preferred embodiment of the present invention includes various rough surfaces with uneven characteristics, various oily surfaces, various water-based surfaces, various high-temperature characteristic surfaces, various bottom temperature characteristic surfaces, various material characteristic surfaces or other various characteristic surfaces, But it is not used to limit the scope of application of the present invention.
第1圖揭示本發明第一較佳實施例之可重覆黏貼裝置之側視示意圖。請參照第1圖所示,本發明第一較佳實施例之可重覆黏貼裝置適用於多種特性表面,且該可重覆黏貼裝置包含一可重覆黏貼結構1、至少一個或數個微小柱狀結構〔單元〕21及至少一個或數個微小或奈米吸盤結構〔單元〕22,且依各種不同需求以一預定比例配置該微小柱狀結構21之數量及該微小或奈米吸盤結構22之數量,以形成一複合微小結構陣列。
Fig. 1 shows a schematic side view of the repeatable pasting device according to the first preferred embodiment of the present invention. Please refer to Figure 1, the repeatable pasting device of the first preferred embodiment of the present invention is suitable for a variety of surface characteristics, and the repeatable pasting device includes a
請再參照第1圖所示,舉例而言,該可重覆黏貼結構1之微小柱狀結構21及微小或奈米吸盤結構22選擇以一體化方式彈性結合,以形成一單一可重覆黏片體,而該可重覆黏貼結構1具有一預定長度、一預定寬度及一預定厚度,且可依各種不同需求調整該可重覆黏貼結構1之規格尺寸。
Please refer to Figure 1 again. For example, the micro
請再參照第1圖所示,舉例而言,該微小柱狀結構21具有數個高黏度微小柱狀體,而該微小柱狀結構21具有適當彈性變形及黏著特性,且該微小柱狀結構21選自一彈性刷毛〔bristle〕結構、一彈性根毛〔root〕結構、一彈性壁虎〔house lizard〕腳結構或其它具類似高黏度功能之彈性柱狀結構。另外,該微小柱狀結構21適用於黏貼各種粗糙表面。
Please refer to Figure 1 again. For example, the micro
請再參照第1圖所示,舉例而言,該微小柱狀結構21具有一第一表面及一第二表面,而該第一表面及第二表面位於該微小柱狀結構21之兩側,且該微小柱狀結構21之第一表面對應於一待黏貼表面5。該微小柱狀結構21可選擇各種具高黏度材質製成,或該微小柱狀結構21可選擇由壓克力膠、聚氨酯〔PU〕、橡膠、矽膠或其任意組合物製成。另外,該微小柱狀結構〔單元〕21之比例範圍約為1%至99%。
Please refer to Figure 1 again. For example, the tiny
請再參照第1圖所示,舉例而言,該微小或奈米吸盤結構22具有一第一表面及一第二表面,而該第一表面及第二表面位於該微小或奈米吸盤結構22之兩側,且該微小或奈米吸盤結構22之第一表面對應於該待黏貼表面5。另外,該微小或奈米吸盤結構22可選擇為一微小吸盤結構、一奈米吸盤結構或一微小與奈米組合之吸盤結構。另外,該微小或奈米吸盤結構22適用於黏貼各種平滑表面。
Please refer to Figure 1 again. For example, the micro or nano
請再參照第1圖所示,舉例而言,該微小或奈米吸盤結構22內部體積可藉由其適當機械性及彈性變形之壓縮方式〔或恢復原形方式〕提供操作低壓吸附物體或表面〔或釋放物體或表面〕之功能。另外,該微小或奈米吸盤結構〔單元〕22之比例範圍約為1%至99%。
Please refer to Figure 1 again. For example, the internal volume of the tiny or
舉例而言,本發明另一較佳實施例之該微小或
奈米吸盤結構22選自數個傾斜槽溝,且該數個傾斜槽溝選擇以等間距或不等間距方式相互平行延伸於該微小或奈米吸盤結構22之第一表面上。
For example, in another preferred embodiment of the present invention, the tiny or
The nano-
舉例而言,本發明另一較佳實施例之該微小或奈米吸盤結構22包含數個圓形凸點部或數個圓形凹穴部,且該數個圓形凸點部或數個圓形凹穴部以規則等距或逐漸規則變化不等距方式排列形成一圓凸點陣列或一圓形凹穴陣列於該微小或奈米吸盤結構22之第一表面上。
For example, the micro or nano
舉例而言,本發明另一較佳實施例之該微小或奈米吸盤結構22包含數個橢圓凸點部或數個橢圓凹穴部,且該數個橢圓凸點部或數個橢圓凹穴部以規則等距或逐漸規則變化不等距方式排列形成一橢圓凸點陣列或一橢圓凹穴陣列於該微小或奈米吸盤結構22之第一表面上。
For example, the micro or
舉例而言,本發明另一較佳實施例之該微小或奈米吸盤結構22包含數個第一槽溝部及數個第二槽溝部,且該第一槽溝部及第二槽溝部相互交叉形成一交叉陣列於該微小或奈米吸盤結構22之第一表面上。
For example, the micro or
請再參照第1圖所示,舉例而言,該可重覆黏貼結構具有一掛釘裝置31或具類似掛釘功能之裝置,而該掛釘裝置31具有至少一組合基板30,且利用該組合基板30將該掛釘裝置31以適當技術手段組合於該可重覆黏貼結構之微小柱狀結構21及微小或奈米吸盤結構22之適當位置上。
Please refer to Figure 1 again. For example, the repeatable pasting structure has a
第2圖揭示本發明第一較佳實施例之可重覆黏貼方法之流程示意圖。請參照第1及2圖所示,舉例而言,本發明第一較佳實施例之可重覆黏貼方法包含步驟S1:首先,以適當技術手段於一可重覆黏貼裝置提供至少一個或數個該微小柱狀結構21,且將該微小柱狀結構21配置於一第一位置。
Figure 2 shows a schematic flow diagram of the repetitive pasting method according to the first preferred embodiment of the present invention. Please refer to Figures 1 and 2. For example, the repeatable pasting method of the first preferred embodiment of the present invention includes step S1: Firstly, at least one or more data is provided on a repeatable pasting device by appropriate technical means. The minute
請再參照第1及2圖所示,舉例而言,本發明第一較佳實施例之可重覆黏貼方法包含步驟S2:接著,以適當技術手段於該可重覆黏貼裝置提供至少一個或數個微小或奈米吸盤結構22,並將該微小或奈米吸盤結構22配置於一第二位置,且將該微小柱狀結構21及微小或奈米吸盤結構22適當結合,以形成一可重覆黏貼結構。
Please refer to Figures 1 and 2. For example, the repeatable pasting method of the first preferred embodiment of the present invention includes step S2: Then, at least one or A number of micro or nano
請再參照第1及2圖所示,舉例而言,本發明第一較佳實施例之可重覆黏貼方法包含步驟S3:接著,於該待黏貼表面5上利用該微小柱狀結構21提供一黏著力,並利用該微小或奈米吸盤結構22提供一真空吸力,且依各種不同配置需求在該微小柱狀結構21及微小或奈米吸盤結構22之間具有一預定比例,以便該微小柱狀結構21及微小或奈米吸盤結構22共同黏著及吸附結合於該待黏貼表面5上。
Please refer to FIGS. 1 and 2. For example, the repetitive pasting method of the first preferred embodiment of the present invention includes step S3: Then, the micro
請再參照第1及2圖所示,舉例而言,本發明第一較佳實施例之可重覆黏貼方法包含步驟S4:接著,在黏貼作業時,將該可重覆黏貼結構黏貼於該待黏貼表面5之一預定特性表面上,且在拆卸作業時,利用該可重覆黏貼結構之微小或奈米吸盤結構22自該待黏貼表面5之預定特性表面進行拆卸操作。
Please refer to Figures 1 and 2. For example, the repetitive pasting method of the first preferred embodiment of the present invention includes step S4: Then, during the pasting operation, pasting the repetitive pasting structure on the The
第3圖揭示本發明第二較佳實施例之多層次可重覆黏貼裝置之側視示意圖。請參照第3圖所示,相對於第一實施例,本發明第二較佳實施例之多層次可重覆黏貼裝置包含一微小柱狀結構層11及一微小或奈米吸盤結構層12,以形成一可重覆黏貼多層結構1A,而該微小柱狀結構層11具有至少一個或數個微小柱狀結構21,且該微小或奈米吸盤結構層12具有至少一個或數個微小或奈米吸盤結構22。
Fig. 3 shows a schematic side view of the multi-layer repetitive pasting device according to the second preferred embodiment of the present invention. Please refer to FIG. 3, compared to the first embodiment, the multi-layered repetitive pasting device of the second preferred embodiment of the present invention includes a micro
請再參照第3圖所示,舉例而言,本發明另一
較佳實施例之該微小柱狀結構層11之微小柱狀結構21可結合黏貼一保護膜1B或具類似功能的薄膜,且在需要使用時,可將該保護膜1B自該微小柱狀結構層11之微小柱狀結構21適當剝離即可。
Please refer to Figure 3 again, for example, another
In the preferred embodiment, the
請再參照第3圖所示,舉例而言,將該微小柱狀結構層11及微小或奈米吸盤結構層12選擇以適當方式操作堆疊結合,並將該微小柱狀結構層11配置於一第一層體,且將該微小或奈米吸盤結構層12配置於一第二層體,以便形成一雙層體結構。
Please refer to Figure 3 again. For example, the micro
請再參照第3圖所示,舉例而言,該微小柱狀結構21具有一第一表面及一第二表面,而該第一表面及第二表面位於該微小柱狀結構21之兩側,且該微小柱狀結構21之第一表面對應於一待黏貼表面5。另外,該微小或奈米吸盤結構22具有一第一表面及一第二表面,而該第一表面及第二表面位於該微小或奈米吸盤結構22之兩側,並將該微小或奈米吸盤結構22之第一表面對應吸附於該微小柱狀結構21之第二表面。
Please refer to FIG. 3 again. For example, the tiny
請再參照第3圖所示,舉例而言,該微小柱狀結構層21具有數個微小柱狀體211,且該微小柱狀體211延伸設置於該微小柱狀結構層21上。另外,該微小或奈米吸盤結構22具有數個微小或奈米吸盤空穴221,且該微小或奈米吸盤空穴221適當排列設置於該微小或奈米吸盤結構22上。
Please refer to FIG. 3 again. For example, the minute
請再參照第3圖所示,舉例而言,在該微小或奈米吸盤結構22之微小或奈米吸盤空穴221上形成一吸附層、一吸附表面及一背部結合表面〔或按壓操作面〕。每個該微小或奈米吸盤空穴221具有一吸附開口及一開口環緣,以便經由該吸附開口及開口環緣連通至該微小或奈米吸盤空穴221之內部,如此該微小或奈米吸盤空穴221可
提供通入或排放適量氣體。另外,該吸附開口之直徑較佳大於該開口環緣之直徑。
Please refer to Figure 3 again. For example, an adsorption layer, an adsorption surface and a back bonding surface (or pressing operation surface) are formed on the micro or nano
請再參照第3圖所示,舉例而言,每個該微小或奈米吸盤空穴221之間具有一隔牆〔例如:環牆〕,且該隔牆以適當間距〔隔牆厚度〕分隔每個該微小或奈米吸盤空穴221之間,以提升該微小或奈米吸盤空穴221之結構強度,如此該微小或奈米吸盤空穴221可承受適當的機械性及彈性變形而不產生破壞其結構。
Please refer to Figure 3 again. For example, each of the tiny or
請再參照第3圖所示,舉例而言,每個該微小或奈米吸盤空穴221具有一半開放氣室,而該半開放氣室可產生適當彈性變形,且該半開放氣室可容置適量氣體及適當種類氣體〔例如:空氣、氮氣或其它惰性氣體〕。如此,經由該按壓操作面操作,該微小或奈米吸盤空穴221之內部體積可藉由其適當機械性及彈性變形之壓縮方式〔或恢復原形方式〕提供操作低壓吸附物體〔或釋放物體〕之功能。
Please refer to Figure 3 again. For example, each of the tiny or
請再參照第3圖所示,舉例而言,該可重覆黏貼結構具有一掛鉤裝置32或具類似掛釘功能之裝置,而該掛鉤裝置32具有至少一組合基板30,且利用該組合基板30將該掛鉤裝置32以適當技術手段組合於該可重覆黏貼結構之微小或奈米吸盤結構層12之適當位置上。
Please refer to FIG. 3 again. For example, the repeatable pasting structure has a
請再參照第1及3圖所示,舉例而言,本發明另一較佳實施例之該微小柱狀結構層11之微小柱狀結構21可選擇以一預定比例方式混合配置至少一個或數個該微小或奈米吸盤結構〔單元〕22,如第1圖所示;或,該微小或奈米吸盤結構層12之微小或奈米吸盤結構22可選擇以一預定比例方式混合配置至少一個或數個微小柱狀結構〔單元〕21,如第1圖所示,以提供選擇另一多層次可重覆黏貼裝置。
Please refer to Figures 1 and 3 again. For example, in another preferred embodiment of the present invention, the
第4圖揭示本發明第二較佳實施例之多層次可重覆黏貼方法之流程示意圖。請參照第3及4圖所示,舉例而言,本發明第二較佳實施例之多層次可重覆黏貼方法包含步驟S1:首先,以適當技術手段於一多層次可重覆黏貼裝置提供該微小柱狀結構層11,且該微小柱狀結構層11具有一微小柱狀結構21。
FIG. 4 shows a schematic flow diagram of the multi-layer repetitive pasting method according to the second preferred embodiment of the present invention. Please refer to Figures 3 and 4, for example, the multi-level repeatable pasting method of the second preferred embodiment of the present invention includes step S1: First, provide a multi-level repeatable pasting device with appropriate technical means The minute
請再參照第3及4圖所示,舉例而言,本發明第二較佳實施例之多層次可重覆黏貼方法包含步驟S2:接著,以適當技術手段於該多層次可重覆黏貼裝置提供該微小或奈米吸盤結構層12,且該微小或奈米吸盤結構層12具有一微小或奈米吸盤結構22。
Please refer to Figures 3 and 4 again. For example, the multi-layer repeatable pasting method according to the second preferred embodiment of the present invention includes step S2: Then, the multi-layer repeatable pasting device is applied by appropriate technical means The micro or nano suction
請再參照第3及4圖所示,舉例而言,本發明第二較佳實施例之多層次可重覆黏貼方法包含步驟S3:接著,將該微小柱狀結構層11及微小或奈米吸盤結構層12適當堆疊結合,以形成一多層可重覆黏貼結構,且在拆卸作業時,允許該微小或奈米吸盤結構層12可適當自該微小柱狀結構層11拆卸操作。
Please refer to Figures 3 and 4 again. For example, the multi-layer repetitive pasting method of the second preferred embodiment of the present invention includes step S3: Next, the micro
請再參照第3及4圖所示,舉例而言,本發明第二較佳實施例之多層次可重覆黏貼方法包含步驟S4:接著,在黏貼作業時,利用該微小柱狀結構層11之微小柱狀結構21提供一黏著力於該待黏貼表面5之一預定特性表面上,且利用該微小或奈米吸盤結構層12之微小或奈米吸盤結構22提供一真空吸力於該微小柱狀結構層11之微小柱狀結構21上,如此利用該多層可重覆黏貼結構可重覆黏貼於該預定特性表面5上。
Please refer to Figures 3 and 4 again. For example, the multi-layer repetitive pasting method of the second preferred embodiment of the present invention includes step S4: Then, during the pasting operation, the tiny
第5圖揭示本發明第三較佳實施例之可重覆黏貼裝置實施黏貼於牆面之正視示意圖。請參照第5圖所示,舉例而言,相對於第一及第二實施例,本發明第三較佳實施例之多層次可重覆黏貼裝置包含二可重覆黏貼結構
1,且將一連接桿10之兩端黏貼結合於一牆面6上。
FIG. 5 shows a schematic front view of the repeatable pasting device of the third preferred embodiment of the present invention applied to the wall surface. Please refer to FIG. 5, for example, compared to the first and second embodiments, the multi-layer repeatable pasting device of the third preferred embodiment of the present invention includes two
前述較佳實施例僅舉例說明本發明及其技術特徵,該實施例之技術仍可適當進行各種實質等效修飾及/或替換方式予以實施;因此,本發明之權利範圍須視後附申請專利範圍所界定之範圍為準。本案著作權限制使用於中華民國專利申請用途。 The foregoing preferred embodiments only illustrate the present invention and its technical features. The technology of this embodiment can still be implemented with various substantially equivalent modifications and/or alternatives; therefore, the scope of rights of the present invention is subject to patent application. The scope defined by the scope shall prevail. The copyright in this case is restricted to the use of patent applications in the Republic of China.
1‧‧‧可重覆黏貼結構 1‧‧‧Repeatable pasting structure
21‧‧‧微小柱狀結構 21‧‧‧Micro columnar structure
211‧‧‧微小柱狀體 211‧‧‧Tiny cylinder
22‧‧‧微小或奈米吸盤結構 22‧‧‧Micro or nano suction cup structure
221‧‧‧微小或奈米吸盤空穴 221‧‧‧Micro or nano suction cup cavity
30‧‧‧組合基板 30‧‧‧Combined substrate
31‧‧‧掛釘裝置 31‧‧‧ Nail device
5‧‧‧待黏貼表面 5‧‧‧The surface to be pasted
Claims (10)
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TW201627139A (en) * | 2015-01-29 | 2016-08-01 | 國立高雄大學 | Protective film and manufacturing method thereof |
TW201703801A (en) * | 2015-07-17 | 2017-02-01 | 忽瓦契有限公司 | Microstructured surface |
TWM561002U (en) * | 2017-10-12 | 2018-06-01 | Zhang ji yuan | Repeating adhesive patch |
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TW201703801A (en) * | 2015-07-17 | 2017-02-01 | 忽瓦契有限公司 | Microstructured surface |
TWM561002U (en) * | 2017-10-12 | 2018-06-01 | Zhang ji yuan | Repeating adhesive patch |
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