TW201627139A - Protective film and manufacturing method thereof - Google Patents

Abstract

A protective film structure includes a film body and a photosensitive polymer material which further includes a photoinitiator, a monomer and an oligomer. The monomer is selected from a hydrophobe monomer. The film body includes a first surface and a second surface. The photoinitiator, the monomer and the oligomer are mixed to form a photosensitive polymer composite. The photosensitive polymer material contained in the photosensitive polymer composite is capable of tightly adhering to a substrate surface.

Description

Protective patch and manufacturing method thereof

The present invention relates to a protective film or a tape or a method of manufacturing the same; or, the present invention relates to a protective patch having a microstructure and a method of manufacturing the same; It relates to a protective patch capable of repeating adhesion, no residue, high temperature resistance, corrosion resistance and moisture resistance, and a manufacturing method thereof.

For example, a conventional protective film, a material, and a method for producing the same, such as a photosensitive resin composition of the Republic of China Patent Publication No. I417661 and a protective film having good heat resistance and mechanical properties for a printed circuit board, which discloses a A photosensitive resin composition having good heat resistance and mechanical properties and a protective film for a printed circuit board. The photosensitive resin composition comprises an acid-modified oligomer, a photopolymerizable monomer, a photoinitiator, an epoxy resin, and a butadiene-modified epoxy resin. The main chain of the butadiene-modified epoxy resin contains an epoxy group and at least one double bond. A protective film for a printed circuit board is prepared using the photosensitive resin composition.

Another conventional protective film, material and method for producing the same, such as the protective film of the Republic of China Patent Publication No. 581933 and the method for producing the same, disclose a high-quality protective film for a dry film barrier layer. Polyethylene film protective film preparation method: using an ultra-high pressure compressor to press ethylene; then, polymerizing ethylene at a reaction temperature of 190 ° C to 300 ° C and a pressure of not less than 167 MPa and in the presence of a polymerization initiator Polyethylene; or, using an ultra-high pressure compressor to press ethylene; then, at a reaction temperature of 190 ° C to 300 ° C, and in the reaction system, there is a polymerization reaction The ethylene is polymerized in the presence of a starter and simultaneously in the presence of a radical polymerization inhibitor to obtain a polyethylene.

Another conventional protective film, material, and method for producing the same, such as the protective film composition of the Republic of China Patent Publication No. 201420696, the invention patent application, discloses a protective film composition. The protective film composition comprises a fluorinated resin, a photoinitiator and an ultraviolet curable resin, and the ultraviolet curable resin comprises a photosensitive oligomer and a reactive monomer. The content of the fluorinated resin is 5 to 200 parts by weight with respect to 100 parts by weight of the ultraviolet curable resin, and the content of the photoinitiator is 0.1 to 20 parts by weight. By adding the fluorinated resin, the cured protective film can be made resistant to hydrofluoric acid, so that substances covering the protective film can be protected from hydrofluoric acid attack.

Another conventional protective film, material, and method for producing the same, such as a bismuth binder composition of the Republic of China Patent Publication No. 201400571, and a protective film 使用 using the same, which discloses a protective film Binder composition and protective film. The adhesive composition for a protective film is composed of an ultraviolet curable rubber having an unsaturation of 70 to 85%. This protective film is formed of the binder composition for a protective film.

Another conventional protective film, material, and manufacturing method thereof, such as a photocurable resin composition of the Republic of China Patent Publication No. 201136997, a pattern forming method and a substrate protective film, and a film-like adhesive and an adhesive sheet using the composition The invention patent application discloses a photocurable resin composition. The photocurable resin composition comprises: a component A having a polyhydrazide polyfluorene having a primary alcoholic hydroxyl group; and a component B being at least one selected from the group consisting of an amine group modified by a formalin or a formalin-alcohol. a compound of the group consisting of a product having a phenolic compound having an average of two or more methylol groups or alkoxymethyl groups in one molecule thereof; and a component C which is a photoacid generator. When the adhesive is formed, the photocurable resin composition further contains a component D which is a polyfunctional epoxy compound.

Another conventional protective film, material and manufacturing method thereof, such as Chinese The invention relates to a process for manufacturing a protective film and a method for manufacturing the same according to the invention patent application, which discloses a method for manufacturing a protective film. The manufacturing method of the protective film comprises the steps of: heating an ultraviolet type rubber; then, forming an ultraviolet type adhesive layer on a substrate by using the heated ultraviolet type rubber; and then irradiating the ultraviolet light with ultraviolet light The optical adhesive layer is used to cure the ultraviolet adhesive layer to form a protective film.

However, the various protective films of the aforementioned Patent No. I417661, No. 581,933, No. 201420696, Patent No. 201400571, No. 201136997, and No. 201102402 are inevitably further improved in structure. And the need for manufacturing methods.

The above-mentioned technical application of the present invention is only a reference to the technical background of the present invention and the prior art is only the above-mentioned technical application of the present invention, the patent application No. PCT No. The state of development is not intended to limit the scope of the invention.

Another conventional micro or nano suction cup device and a method for manufacturing the same, such as the Chinese medical patent publication No. I263513, which has a suction-type nano hole and a biomedical implant and a manufacturing method, and an invention patent, which discloses a biomedical implant Things. The biomedical implant comprises a plurality of suction cup type nanoholes, and a part of or all of the surface of the biomedical implant is provided with a suction cup type nanohole structure. The suction cup type nanohole structure has a plurality of tubes having a nanometer size.

In the above, all or a part of the tubular material of the above-mentioned No. I263513 is presented in a matrix arrangement, and each of the tubular members is provided as a hole into which a bioabsorbable material (or drug) can be filled. Each of the holes has a size substantially between 10 nm and 100 nm. Additionally, the biomedical implant can be selected from a pure titanium sheet.

Method for manufacturing the biomedical implant of the above No. I263513 Mainly comprising the steps of: [A], first applying the anodic treatment to the biomedical implant to form an oxide film on the surface of the biomedical implant, and adding a solvent to the solution during the anodic treatment; And applying an additional voltage to form a plurality of the tubes on the surface of the biomedical implant, and the tube has the holes.

According to the above-mentioned No. I263513, when the biomedical implant is subjected to anodizing, the solvent may be selected from hydrofluoric acid or sulfuric acid. In addition, when the biomedical implant is subjected to the applied voltage, the applied voltage may be selected to be within 50 volts.

However, the chuck type nanohole of No. I263513 is only suitable for biomedical implant applications, and is not suitable for a protective patch for generally adsorbing heavy objects or articles, and the suction cup type nanopore structure is susceptible to damage. Moreover, the suction-type nanopore needs to form a nano-scale structure in the manufacture of components, so that it has the disadvantage of an increase in process difficulty. Therefore, the conventional micro or nano suction cup device and its manufacturing method necessarily have the need to further improve the structure and manufacturing method. The above-mentioned Patent No. I263513 is only a reference to the technical background of the present invention and the state of the art is not limited to the scope of the present invention.

In view of the above, in order to meet the above technical problems and needs, the present invention provides a protective patch and a manufacturing method thereof, which are suitable for re-sticking, no residue, high temperature resistance, corrosion resistance, and moisture resistance, which utilize a high photopolymerization. The molecular material is formed into a film body, and the photopolymerizable polymer material comprises a photoinitiator, a monomer material and an oligomer material to form a photopolymerizable polymer composition, and the monomer material is a monomer of a hydrophobic matrix, wherein the photopolymerizable polymer composition can be closely adhered to a surface of a substrate, so that the adhesive property of the re-adhesive adhesive, the non-resin property, and the high temperature resistance can be greatly improved compared with the conventional protective film. Properties, corrosion resistance and moisture resistance.

The main object of the present invention is to provide a protective patch and a manufacturing method thereof, which use a photopolymerizable polymer material to form a film body, and the photopolymerizable polymer material comprises a photoinitiator, a monomer material and a An oligomeric material to form a photopolymerizable polymer composition, and the monomer material is a monomer having a hydrophobic matrix, wherein the photopolymerizable polymer composition can be closely adhered to a surface of a substrate to achieve The protective patch provides re-sticking, no residue, high temperature resistance, corrosion resistance and moisture barrier.

In order to achieve the above object, a protective patch according to a preferred embodiment of the present invention includes: a film body including a first surface and a second surface; and a photopolymerizable polymer material for forming the film body. And the photopolymerizable polymer material comprises: a photoinitiator; a monomer material which is a monomer having a hydrophobic matrix; and an oligomer material; wherein the photoinitiator, monomer material and oligomer The material forms a photopolymerizable polymer composition, and the monomer having a hydrophobic matrix allows the photopolymerizable polymer composition to adhere tightly to the surface of a substrate.

In order to achieve the above object, a protective patch according to another preferred embodiment of the present invention includes: a film body including a first surface and a second surface; and a photopolymerizable polymer material for forming the film body And a fine structure arranged on the first surface of the film body to form an adhesion layer; the photopolymerizable polymer material comprises: a photoinitiator; a monomer material which is a monomer having a hydrophobic matrix; and an oligomer material; wherein the photoinitiator, monomer material and oligomer material form a photopolymerizable polymer composition, and the hydrophobic matrix The monomer can be used to closely adhere the photopolymerizable polymer composition to the surface of a substrate, so that the microstructure of the first surface of the film body is adsorbed and adhered to the surface of the substrate, or the film body is selected to be used. The two surfaces adhere to the surface of the substrate.

In the preferred embodiment of the present invention, the monomer having a hydrophobic matrix is a soft ether-based acrylic compound having carbon chains of various lengths, and the carbon chain has a carbon number of 1 to 12.

The photoinitiator of the preferred embodiment of the invention is selected from the group consisting of Irgacure initiator series or benzophenone series, and the ratio of the photoinitiator is from 1 to 20 weight percent.

The monomer material of the preferred embodiment of the present invention is selected from the series of isomers of acrylic acid series, dipropylene glycol methyl ether acrylate or propylene glycol methyl ether acrylate, and the ratio of the monomer material is from 10 to 80% by weight. .

The oligomer material of the preferred embodiment of the invention is selected from the group consisting of an acrylate series or an epoxy modified acrylate series, and the ratio of the oligomer material is between 20 and 85 weight percent.

In the preferred embodiment of the present invention, the microstructure is selected from a concave-convex structure portion, a columnar body portion, a groove portion, a recess portion or a hole portion.

The microstructure of the preferred embodiment of the invention has a size ranging from a few nanometers to a few hundred nanometers or a few microns.

In order to achieve the above object, a method for manufacturing a protective patch according to another preferred embodiment of the present invention comprises: preparing or providing a photopolymerizable polymer material, wherein the photopolymerizable polymer material comprises a photoinitiator, a monomer material, and An oligomeric material to form a photopolymerizable polymer composition, and the monomer material is sparse a monomer of a water base; the photopolymerizable polymer composition is coated on a lower mold substrate to form a photopolymerizable polymer layer; an upper mold cover is correspondingly covered on the photopolymerizable polymer layer; and the photopolymer is polymerized The polymer layer is exposed and cured through the upper mold cover to form a film body; and the film body is removed from the lower mold substrate, or the film body is removed from the upper mold cover and the lower mold substrate.

In order to achieve the above object, a method for manufacturing a protective patch according to another preferred embodiment of the present invention comprises: preparing or providing a photopolymerizable polymer material, wherein the photopolymerizable polymer material comprises a photoinitiator, a monomer material, and An oligomeric material to form a photopolymerizable polymer composition, wherein the monomer material is a monomer having a hydrophobic matrix; and the photopolymerizable polymer composition is coated on a lower mold substrate to form a photopolymerization high a molecular layer; correspondingly covering and pressing a fine structure of an upper mold cover on the photopolymerizable polymer layer; and exposing and curing the photopolymerizable polymer layer through the upper mold cover to form a thin film And removing the thin film body having the fine structure from the lower mold substrate, or removing the thin film body having the fine structure from the upper mold cover and the lower mold substrate.

In a preferred embodiment of the invention, the photopolymerizable polymer composition is applied to the lower mold substrate by spin coating or roll coating.

In the preferred embodiment of the present invention, when the photopolymerizable polymer material is prepared, the photoinitiator and the monomer material are uniformly mixed to generate a mixed solution, and the oligomer material is added to the mixed solution to be uniform. The photopolymerizable polymer material is obtained by mixing and defoaming.

1‧‧‧Photopolymerizable polymer materials

10‧‧‧Photopolymerized polymer layer

100‧‧‧film body

100a‧‧‧Microstructured film body

101‧‧‧Microstructured surface

101a‧‧‧Microstructure

101b‧‧‧Microstructure

101c‧‧‧Microstructure

101d‧‧‧Microstructure

102‧‧‧flat surface

11‧‧‧ Lower mold substrate

12‧‧‧Upper mold cover

121‧‧‧Microstructure

1(a) to 1(e) are schematic perspective views showing a series of processes for manufacturing a protective patch according to a first preferred embodiment of the present invention.

Fig. 2 is a flow chart showing a method of manufacturing a protective patch according to a first preferred embodiment of the present invention.

Fig. 3 is a schematic view showing the chemical structure of a protective material of a preferred embodiment of the present invention.

4(a) to 4(f) are schematic perspective views showing a series of processes for manufacturing a protective patch according to a second preferred embodiment of the present invention.

Fig. 5 is a flow chart showing a method of manufacturing a protective patch according to a second preferred embodiment of the present invention.

6(a) to 6(d) are schematic front views showing the protective patches of the second preferred embodiment of the present invention using various fine structures.

In order to fully understand the present invention, the preferred embodiments of the present invention are described in detail below, and are not intended to limit the invention.

The protective patch (or tape) and the manufacturing method thereof according to the preferred embodiment of the present invention are suitable for being attached to various articles, for example, various optical glass, various liquid crystal display panels (LCD panels), various solar cell components [solar] Cell], various semiconductor elements, various silicon wafers, 3C products, various metal or steel products, various plastic products, various parts [spare part] or other item to be protected, but it is not intended to limit the scope of application of the present invention.

1(a) to 1(e) are schematic perspective views showing a series of processes for manufacturing a protective patch according to a first preferred embodiment of the present invention, which are only suitable for The reduced size and shape indicate the fine structure suction cup device and the technical features of the forming mold; further, FIG. 1 is a schematic flow chart showing the manufacturing method of the protective patch according to the first preferred embodiment of the present invention, which corresponds to the first (a) to 1 (e). Referring to FIGS. 1(a) and 2, the method for manufacturing a protective patch according to a first preferred embodiment of the present invention comprises the step S1 of modulating or providing a photopolymerizable polymer material 1 and the photopolymerizable polymer material 1 A photoinitiator, a monomer, and an oligomer are formed to form a photopolymerizable polymer composition.

Referring again to Figures 1(a) and 2, the photoinitiator is selected from the Irgacure starter series or the benzophenone series, and the ratio of the photoinitiator is between 1 and 20 weight percent. The monomer material is selected from the series of isomers of acrylic acid series, dipropylene glycol methyl ether acrylate or propylene glycol methyl ether acrylate, and the ratio of the monomer material is from 10 to 80% by weight. The oligomer material is selected from the acrylate series or the epoxy modified acrylate series, and the ratio of the oligomer material is between 20 and 85 weight percent.

Figure 3 is a schematic view showing the chemical structure of a protective material of a preferred embodiment of the present invention. Referring to Figure 3, the monomer material is a monomer having a hydrophobic matrix. In another preferred embodiment of the present invention, the monomer having the hydrophobic matrix may be a soft ether-based acryl compound having carbon chains of various lengths, and the carbon chain has a carbon number of 1 to 12.

Referring again to FIG. 3, for example, the hydrophobic property of the monomer is mostly increased in hydrophobic properties as the length of the carbon chain increases (ie, is insoluble in water). When n=1, the last cross carbon chain can produce quite hydrophobic properties, so the monomer is very easy to obtain from n=1 to n=12, and n=1.

Referring to FIGS. 1(a) and 2, for example, when the photopolymerizable polymer material 1 is prepared, the photoinitiator and the monomer material are uniformly mixed to produce a mixed solution. Adding to the mixed solution The oligomer material is uniformly mixed and defoamed to obtain the photopolymerizable polymer material. The photopolymerizable polymer composition is prepared by using the photoinitiator, the monomer material and the oligomer material, and the monomer having the hydrophobic matrix is capable of closely adhering the photopolymerizable polymer composition to a surface of the substrate. [not shown].

Referring to FIGS. 1(b), 1(c) and 2, the method for manufacturing a protective patch according to a first preferred embodiment of the present invention comprises the step S2: subsequently, the photopolymerizable polymer material 1 [or light The polymerized polymer composition is applied onto the lower mold substrate 11 to form a photopolymerizable polymer layer 10. For example, in a preferred embodiment of the present invention, the photopolymerizable polymer composition may be applied to the lower mold substrate 11 by a spin coating method or a roll coating method, and the lower mold substrate may be selected. 11 has been properly cleaned. The lower mold substrate 11 is made of a UV-permeable material such as polyethylene terephthalate.

Referring to FIGS. 1(c) and 2, the method for manufacturing the protective chip according to the first preferred embodiment of the present invention includes the step S3: subsequently, correspondingly covering the lower mold substrate 11 and the photopolymerizable polymer layer 10. An upper mold cover 12 is formed, and the upper mold cover 12 is made of a UV permeable material such as polyethylene terephthalate.

Referring to FIGS. 1(c), 1(d) and 2, the method for manufacturing a protective patch according to a first preferred embodiment of the present invention comprises the step S4: subsequently, the photopolymerizable polymer layer 10 is passed through the upper layer. The mold cover 12 is exposed and cured by an ultraviolet irradiation device or other device having a similar function to form a film body 100 as shown in Fig. 1(d).

Referring to FIGS. 1(d), 1(e) and 2, the protective patch manufacturing method of the first preferred embodiment of the present invention comprises the step S5: Next, the film body 100 is from the lower mold substrate 11 The film body 100 is removed or the film body 100 is removed from the upper mold cover 12 and the lower mold substrate 11. For example, the preferred embodiment of the present invention may select the upper mold cover 12 and the film. The body 100 is separated, and as shown in Fig. 1(d), the film body 100 is removed from the lower mold substrate 11, as shown in Fig. 1(e).

Referring to FIG. 1(e), for example, when the film body 100 is used, any surface of the film body 100 may be attached to a surface of a substrate to be attached (not shown). on. After the bonding is completed, the monomer of the film body 100 having a hydrophobic substrate can be used to closely adhere the photopolymerizable polymer composition to the surface of the substrate. In addition, the film body 100 can be selectively combined with a backing or other similar functional object to increase its elasticity of use.

4(a) to 4(f) are schematic perspective views showing a series of processes for manufacturing a protective patch according to a second preferred embodiment of the present invention. Fig. 5 is a flow chart showing a method of manufacturing a protective chip according to a second preferred embodiment of the present invention, which corresponds to Figs. 4(a) to 4(f). Referring to Figures 4(a) and 5, the method for manufacturing a protective patch according to a second preferred embodiment of the present invention comprises the step S1 of modulating or providing a photopolymerizable polymer material 1 and the photopolymerizable polymer material 1 A photoinitiator, a monomer material and an oligomer material are included to form a photopolymerizable polymer composition.

Referring to FIGS. 4(b), 4(c) and 5, the method for manufacturing the protective patch according to the second preferred embodiment of the present invention comprises the step S2: subsequently, the photopolymerizable polymer material 1 [or light The polymerized polymer composition is applied onto the lower mold substrate 11 to form a photopolymerizable polymer layer 10. For example, in a preferred embodiment of the present invention, the photopolymerizable polymer composition may be applied to the lower mold substrate 11 by spin coating, roll coating or other coating, and the lower mold substrate 11 has been properly cleaned. . The lower mold substrate 11 is made of a material that is permeable to ultraviolet light, such as polyethylene terephthalate.

Referring to FIGS. 4(c), 4(d) and 5, the method for manufacturing the protective patch according to the second preferred embodiment of the present invention comprises the step S3: Next, the lower mold substrate 11 and the photopolymerizable polymer Corresponding covering and pressing on the layer 10 (as indicated by the downward arrow in Fig. 4(c)], a fine knot of the upper mold cover 12 Structure 121, and the upper mold cover 12 is made of a transparent material (for example: polybutylene terephthalate) or a transparent material that can be transparent to ultraviolet light (for example, polydimethyl methoxy oxide, PDMS, poly-dimethysiloxane). 〕production.

Referring to FIGS. 4(c) and 4(d), the microstructure 121 is disposed at a predetermined position on one of the stamping surfaces of the upper mold cover 12, and the microstructure 121 has a size of several nanometers. To several hundred nanometers in size or several micrometers, embossing is performed on the photopolymerizable polymer layer 10 at a predetermined pressure to form various pattern structures.

Referring to FIGS. 4(d), 4(e) and 5, the method for manufacturing a protective patch according to a second preferred embodiment of the present invention comprises the step S4: subsequently, the photopolymerizable polymer layer 10 is passed through the upper layer. The mold cover 12 is exposed and cured by an ultraviolet irradiation device or other device having a similar function to form a film body 100a having a fine structure as shown in Fig. 4(d). At this time, a fine structure surface 101 is formed on the thin film body 100a having a fine structure, and the microstructure surface 101 can be attached and adsorbed on a substrate surface (not shown).

Referring to FIGS. 4(e), 4(f) and 5, the method for manufacturing the protective patch according to the second preferred embodiment of the present invention comprises the step S5: the film body 100a having the microstructure is then The lower mold substrate 11 is removed, or the thin film body 100a having the fine structure is removed from the upper mold cover 12 and the lower mold substrate 11. For example, in the preferred embodiment of the present invention, the upper mold cover 12 may be separated from the fine structure surface 101 of the thin film body 100a having a fine structure, as shown in FIG. 4(e). After the thin film body 100a of the fine structure is removed from the lower mold substrate 11, the film body 100a having the fine structure forms a flat surface 102 as shown in Fig. 4(f). The fine structure of the surface 101 of the fine structure itself can provide an appropriate adsorption force, except that the monomer having a hydrophobic matrix can exert an adhesive force on the photopolymerizable polymer composition itself. In addition, the flat surface 102 can be selectively used in combination with a backing or other similar functional object to increase its Use elasticity.

Referring to FIG. 4(f) again, for example, when the film body 100a having the microstructure is used, the microstructure surface 101 or the flat surface 102 of the film body 100a having the fine structure may be attached. The film body 100a having a fine structure has a double-adhesive surface on the surface of the substrate to be attached (not shown), and the microstructure surface 101 or the flat surface 102 can be selectively used according to different requirements. After the bonding is completed, the monomer of the film body 100 having a hydrophobic substrate can be used to closely adhere the photopolymerizable polymer composition to the surface of the substrate.

6(a) to 6(d) are schematic front views showing the use of various fine structures for the protective patch of the second preferred embodiment of the present invention, which corresponds to Fig. 4(f). Referring to FIG. 6(a), for example, the protection patch of the second preferred embodiment of the present invention adopts a fine structure 101a having a plurality of inclined grooves, and the plurality of inclined grooves are selected to wait. Spacing or unequal spacing extends parallel to each other on the surface 101 of the microstructure.

Referring to FIG. 6(b), the protective patch according to the second preferred embodiment of the present invention adopts a fine structure 101b including a plurality of circular bump portions or a plurality of circular recess portions, and the plurality of circles The shaped bump portion or the plurality of circular recessed portions are arranged in a unequal manner in a regular equidistant or gradually regular manner to form an array of circular bumps or an array of circular recesses on the surface 101 of the microstructure.

Referring to FIG. 6(c), the protective patch according to the second preferred embodiment of the present invention adopts a microstructure 101c including a plurality of elliptical bump portions or a plurality of elliptical recess portions, and the plurality of elliptical bumps The portion or the plurality of elliptical pocket portions are arranged in a unequal manner in a regular equidistant or gradually regular manner to form an array of elliptical bumps or an array of elliptical pockets on the surface 101 of the microstructure.

Referring to FIG. 6(d), the protective patch of the second preferred embodiment of the present invention has a microstructure 101d including a plurality of first groove portions and a plurality of second groove portions, and the first groove portion and The second groove portions intersect each other to form a cross array on the surface 101 of the microstructure, and the first groove The portion and the second groove portion form a plurality of vertical columns.

The foregoing preferred embodiments are merely illustrative of the invention and the technical features thereof, and the techniques of the embodiments can be carried out with various substantial equivalent modifications and/or alternatives; therefore, the scope of the invention is subject to the appended claims. The scope defined by the scope shall prevail. The copyright limitation of this case is used for the purpose of patent application in the Republic of China.

1‧‧‧Photopolymerizable polymer materials

10‧‧‧Photopolymerized polymer layer

100‧‧‧film body

11‧‧‧ Lower mold substrate

12‧‧‧Upper mold cover

Claims (10)

A protective patch comprising: a film body comprising a first surface and a second surface; and a photopolymerizable polymer material for forming the film body, and the photopolymerizable polymer material comprises: a photoinitiator; a monomer material which is a monomer having a hydrophobic matrix; and an oligomer material; wherein the photoinitiator, monomer material and oligomer material form a photopolymerizable polymer composition And the monomer having a hydrophobic matrix is such that the photopolymerizable polymer composition can be closely adhered to a surface of a substrate. A protective patch comprising: a film body comprising a first surface and a second surface; a photopolymerizable polymer material for forming the film body; and a microstructure configured to be disposed on the film a first surface of the film body to form an adhesion layer; the photopolymerizable polymer material comprises: a photoinitiator; a monomer material which is a monomer having a hydrophobic matrix; and an oligomer material; The photoinitiator, the monomer material and the oligomer material form a photopolymerizable polymer composition, and the monomer having the hydrophobic matrix can be closely adhered to the surface of the substrate by the photopolymerizable polymer composition. The microstructure of the first surface of the film body is adsorbed and adhered to the surface of the substrate, or the second surface of the film body is selectively adhered to the surface of the substrate. The protective patch of claim 1 or 2, wherein the monomer having a hydrophobic matrix is a soft ether-based acrylic compound having carbon chains of various lengths. The protective patch according to claim 3, wherein the carbon chain has 1 to 12 carbon atoms. The protective patch according to claim 1 or 2, wherein the photoinitiator is selected from the group consisting of Irgacure initiator series or benzophenone series, and the monomer material is selected from the group consisting of acrylic acid series and dipropylene glycol methyl ether acrylic acid. A series of isomers of ester or propylene glycol methyl ether acrylate, or the oligomer material is selected from the acrylate series or the epoxy modified acrylate series. The protective patch according to claim 1 or 2, wherein the ratio of the photoinitiator is from 1 to 20% by weight, and the ratio of the monomer material is from 10 to 80% by weight, the oligomer The ratio of materials is between 20 and 85 weight percent. The protective patch of claim 2, wherein the microstructure is selected from a concave-convex structure, a columnar portion, a groove portion, a recess portion or a hole portion. A protective patch manufacturing method comprising: preparing or providing a photopolymerizable polymer material, wherein the photopolymerizable polymer material comprises a photoinitiator, a monomer material and an oligomer material to form a photopolymerization a polymer composition, wherein the monomer material is a monomer having a hydrophobic matrix; the photopolymerizable polymer composition is coated on a lower mold substrate to form a photopolymerizable polymer layer; on the photopolymerizable polymer layer Correspondingly covering an upper mold cover; exposing and curing the photopolymerizable polymer layer through the upper mold cover to form a film body; and removing the film body from the lower mold substrate. A protective patch manufacturing method comprising: preparing or providing a photopolymerizable polymer material, wherein the photopolymerizable polymer material comprises a photoinitiator, a monomer material and an oligomer material to form a photopolymerization a polymer composition, wherein the monomer material is a monomer having a hydrophobic matrix; the photopolymerizable polymer composition is coated on a lower mold substrate to form a photopolymerizable polymer layer; And correspondingly covering and pressing a fine structure of an upper mold cover layer on the photopolymerizable polymer layer; and exposing and curing the photopolymerizable polymer layer through the upper mold cover layer to form a film body having a fine structure; The film body having the fine structure is removed from the lower mold substrate. The method for producing a protective patch according to the above aspect of the invention, wherein the photopolymerizable polymer composition is applied to the lower mold substrate by spin coating or roll coating.