TWI830250B - Semiconductor device manufacturing apparatus and manufacturing method - Google Patents

Abstract

The manufacturing device of the semiconductor device of the present invention includes: soldering pins (30); wire clamps (34); moving mechanisms (18), including more than one drive motor (22); position sensors (28) to detect soldering pins (30); and the controller (50), which controls the driving of the welding pin (30), the wire clamp (34), and the moving mechanism (18), and the controller (50) is configured to perform the following processing: The tail cutting process is to move the welding needle (30) in a direction away from the target surface while the wire clamp (34) is closed, thereby cutting off the tail; and the index measurement process is to measure the welding value just after cutting the bonding wire W. The peak value of the position deviation of the needle (30) or the current value of the drive motor (22) when cutting the wire W is measured as the break index Sb.

Description

Semiconductor device manufacturing apparatus and manufacturing method

This specification discloses a manufacturing device and a manufacturing method of a semiconductor device including soldering pins for inserting wires and wire clips for clamping the wires.

Manufacturing apparatuses for manufacturing semiconductor devices by connecting electrodes of a semiconductor wafer and electrodes of a substrate using conductive wires have long been known. For example, Patent Document 1 discloses a semiconductor device manufacturing apparatus including a soldering pin for inserting wires (called a "bonding tool" in Patent Document 1) and a wire clip for holding the wires (called a "bonding tool" in Patent Document 1). "joining device").

In this manufacturing apparatus, wire bonding is used to connect the first joint point and the second joint point. In addition, in the manufacturing device, when the second (2nd) bonding of the bonded wire to the second bonding point is completed, tail cutting is performed, that is, after the tail is formed by moving the soldering pin with the wire clamp open, the closed line is In the clamped state, the soldering needle is moved to cut the wire. [Prior art documents] [Patent Document]

Patent Document 1: Japanese Patent Application Publication No. 2012-256861

[Problem to be solved by the invention]

Here, when the operating conditions of the manufacturing equipment when performing the second (2nd) bonding and tail cutting are not suitable, non-stick-soldering (Non-Stick-) may occur where the wiring is not fully bonded in the second bonding point On-Lead, NSOL), no tail (Notail) where the tail is not of sufficient length, and S-shaped bending where the wire inserted into the soldering pin bends into an S-shape. However, there has been no index that quantitatively evaluates the suitability of operating conditions. As a result, in the past, operators could only correct the operating conditions based on experience while observing the quality inspection results of the actually manufactured semiconductor devices, and the selection of operating conditions was time-consuming. In addition, in the past, in order to confirm the presence of defects, it was necessary to inspect the actually manufactured semiconductor devices, and it was difficult to determine the presence of defects during the manufacturing process.

Therefore, this specification discloses a semiconductor device manufacturing apparatus that provides an evaluation index for quantitatively evaluating the suitability of operating conditions of the manufacturing apparatus. [Means to solve the problem]

The manufacturing device of a semiconductor device disclosed in this specification includes: a soldering pin for inserting the bonding wire, and pressing the bonding wire extending from the front end to the object surface for joining; and a wire clamp that moves in conjunction with the soldering needle and clamps the bonding wire. The wire bonding; the moving mechanism includes more than one drive motor, which uses the power of the drive motor to move the soldering needle; a position sensor, which detects the position of the soldering needle as a detection position; and a controller, which The soldering needle, the wire clip, and the driving of the moving mechanism are controlled, and the controller is configured to perform the following processing: tail cutting processing, joining the wire bonding to the target surface, and forming the tail. Finally, in the state of closing the wire clamp, the soldering needle is moved in the direction of separation, thereby cutting off the tail; and an index measurement process is performed to measure the soldering needle just after cutting off the wire bonding. The peak value of the deviation between the movement command position and the detection position or the current value of the drive motor when cutting the bonding wire is measured as a fracture index.

In this case, the controller may also further measure the breaking distance during the index measurement process. The breaking distance is the movement of the soldering pin from closing the wire clamp to cutting off the bonding wire. distance.

It may further include: a user interface (UI) device that accepts operation input from an operator and outputs information to the operator, and the controller instructs the operator to measure the fracture index. When , the tail cutting process is repeatedly executed two or more times, and the measured values of the fracture index respectively obtained in the tail cutting process two or more times are prompted to the operator via the UI device.

In this case, the controller may present a list of the measured values of the fracture index obtained in the tail cutting process two or more times in the form of a graph.

In addition, the controller may output an alarm when the fracture index is outside a predetermined reference range.

The manufacturing method of the semiconductor device disclosed in this specification includes: a tail cutting step, pressing the bonding wire extending from the front end of the soldering pin to the object surface and joining it, and then closing the wire clip and clamping the bonding wire, so that the bonding wire is The soldering needle moves in a direction separated from the object surface; and an index measurement step is performed in parallel with the tail cutting step to measure the movement command position of the soldering needle just after cutting off the wire bonding and the detection. The peak value of the positional deviation or the current value of the drive motor when cutting the bonding wire is measured as a fracture index. [Effects of the invention]

According to the technology disclosed in this specification, since the breaking strength is quantitatively provided, the operator can easily evaluate whether the operating conditions are suitable.

Hereinafter, the semiconductor device manufacturing apparatus 10 will be described with reference to the drawings. FIG. 1 is a diagram showing the structure of the manufacturing apparatus 10 . The manufacturing device 10 is a wire bonding device that uses a wire W to connect the first bonding point B1 and the second bonding point B2. Usually, the first bonding point B1 is set on the bonding pad of the semiconductor wafer 110, and the second bonding point B2 is It is set on the wire of the substrate 100 which is a lead frame on which the semiconductor chip 110 is mounted.

The manufacturing apparatus 10 includes a bonding head 12 , a moving mechanism 18 , a stage 14 , a rotating spool 42 , a burner electrode 43 , a controller 50 , and a UI device 60 .

The bonding head 12 includes an ultrasonic welding head 24 and a wire clamp 34 . The ultrasonic horn 24 is a rod-shaped member including a base end portion, a flange portion, a horn portion, and a front end portion from the base end to the front end. The ultrasonic oscillator 26 which vibrates based on the drive signal from the controller 50 is arrange|positioned at the base end part. The flange portion is resonantly attached to the moving mechanism 18 at a position that becomes a node of ultrasonic vibration. The horn head is an arm extending longer than the diameter of the base end, and includes a structure that amplifies the amplitude of vibration generated by the ultrasonic oscillator 26 and conducts it to the tip. A soldering pin 30 is replaceably mounted on the front end. The soldering pin 30 is a cylindrical member through which the bonding wire W is inserted. The ultrasonic welding head 24 includes a resonance structure that resonates with the vibration of the ultrasonic oscillator 26 as a whole. It is configured such that the ultrasonic oscillator 26 and the flange are located at the nodes of the vibration during resonance, and the welding needle 30 is located at the antinode of the vibration. . Through these structures, the ultrasonic horn 24 functions as a converter that converts electrical drive signals into mechanical vibrations.

The wire clamp 34 includes a piezoelectric element that opens and closes based on a control signal from the controller 50, and is configured to clamp or release the bonding wire W at a predetermined time point. The wire clamp 34 is movable together with the soldering pin 30 .

The moving mechanism 18 moves the bonding head 12 and thus the soldering pin 30 along the horizontal and vertical directions, and includes an XY platform and a lifting mechanism (not shown). The moving mechanism 18 includes one or more drive motors 22, and the bonding head 12 is moved by the power output from the drive motors 22. Furthermore, the position of the soldering pin 30 can be detected by the position sensor 28 .

The rotating spool 42 replaceably holds the reel around which the wire W is wound. The rotating bobbin 42 is configured to unwind the wire W according to the progress of bonding. Furthermore, the material for the wiring W is selected in terms of ease of processing and low resistance. As the material of the wiring W, gold (Au), silver (Ag), aluminum (Al), copper (Cu), etc. can usually be used.

The burner electrode 43 is connected to a high-voltage power supply (not shown) via a discharge stabilizing resistor (not shown). The burner electrode 43 generates a spark (discharge) based on the control signal from the controller 50, and the heat of the spark forms a solder ball, that is, a free air ball, on the front end of the wire W rolled out from the front end of the soldering needle 30. FAB).

The carrier 14 supports the substrate 100 . The semiconductor chip 110 is pre-assembled on the substrate. A heater 46 is provided inside the stage 14 to heat the substrate 100 and the semiconductor wafer 110 to a temperature suitable for bonding.

The UI device 60 is a device that accepts operation input from an operator and outputs information to the operator. The UI device 60 includes an input device 62 and an output device 64 . The input device 62 accepts operation input from the operator, and includes, for example, a keyboard, a mouse, a trackball, a touch panel, a joystick, etc. The output device 64 outputs information to the operator, such as a display, a loudspeaker, a printer, etc.

The controller 50 controls the drive of the manufacturing apparatus 10 based on a predetermined software program. Specifically, the controller 50 controls the position of the soldering pin 30 by driving and controlling the moving mechanism 18 . In addition, the controller 50 also controls the opening and closing of the wire clamp 34, the application control of the discharge voltage, and the drive control of the heater 46 of the stage 14 according to the progress of the bonding process. In addition, during the wire bonding process, a second (2nd) bonding process of bonding the wire W to the second bonding point B2 and a tail cutting process of cutting the tail of the wire W are performed, and the controller 50 also measures and indicates the second Prescribed evaluation index for the quality of operating conditions in the joining process and the tail cutting process. As the evaluation index, the fracture index Sb and the fracture distance Ds are consistent, and these will be described in detail below. Furthermore, the controller 50 is a computer that physically includes a processor 52 that performs various operations, and a memory 54 that stores programs and data.

Next, the flow of wire bonding performed by the manufacturing apparatus 10 will be described. 2A to 2F are conceptual diagrams showing the flow of wire bonding. In wire bonding, a wire W is used to connect the first bonding point B1 and the second bonding point B2. The first joint point B1 is a bonding pad provided on the upper surface of the semiconductor chip 110 , and the second joint point B2 is a wire provided on the surface of the substrate 100 .

During wire bonding, as shown in FIG. 2A , the controller 50 forms FAB at the end of the wire W. That is, the burner electrode 43 to which a predetermined high voltage is applied is brought close to a part of the bonding wire W extending from the tip of the soldering needle 30, and a discharge is generated between the tip of the bonding wire W and the burner electrode 43. Due to this discharge, the tip of the bonding wire W is melted. Then, the molten wiring material forms a spherical FAB through surface tension.

Next, as shown in FIG. 2B , the controller 50 performs the first (1st) engagement of the FAB to the first engagement point B1. That is, the controller 50 moves the soldering needle 30 to just above the first bonding point B1. Thereafter, the controller 50 lowers the soldering pin 30 to bring the FAB into contact with the first joint point B1 and presses the FAB with the front end surface of the soldering pin 30 . At this time, the controller 50 drives the ultrasonic oscillator 26 to generate ultrasonic vibrations in the ultrasonic horn 24, thereby adding ultrasonic vibrations to the FAB. Furthermore, the controller 50 turns on the heater 46 of the stage 14 to heat the substrate 100 and the semiconductor wafer 110 to a predetermined temperature. Thereby, the load, the ultrasonic vibration, and the heat of the heater 46 act on the FAB, thereby joining the FAB to the first joining point B1.

Then, as shown in FIG. 2C , the controller 50 moves the soldering pin 30 according to a predetermined trajectory, thereby forming a loop connecting the first joint point B1 and the second joint point B2. That is, in a state where the wire clamp 34 is opened, the soldering needle 30 is moved, thereby unwinding the wire W from the rotating bobbin 42 to form a loop.

Then, as shown in FIG. 2D , the controller 50 performs second (2nd) joining of the bonding wire W to the second joining point B2. Specifically, the controller 50 causes the solder pin 30 to land on the second joint point B2, and uses the front end surface of the solder pin 30 to press the bonding wire W to the second joint point B2. At the same time, the ultrasonic oscillator 26 is driven to apply ultrasonic vibration to the tip of the welding needle 30 . Then, the bonding wire W is bonded to the second bonding point B2 by the ultrasonic vibration, the load, and the heat from the heater 46 .

After the bonding wire W is joined to the second joint point B2, as shown in FIG. 2E , the controller 50 forms a tail. Specifically, the controller 50 moves the soldering pin 30 in a direction away from the substrate 100 while the wire clamp 34 is open. By this movement, a tail portion, which is a wire bonding portion extending from the front end of the soldering pin 30, is formed. In addition, the amount of movement is determined based on the necessary distance of the tail.

After forming the tail, as shown in FIG. 2F , the controller 50 cuts off the tail. Specifically, the controller 50 moves the soldering pin 30 in a direction away from the substrate 100 while the wire clamp 34 is closed. With this, pull off the wire W. The same process is then repeated.

Here, as can be seen from the above description, the wire W is mechanically stretched and broken in the tail cutting process after the second (2nd) bonding process and the tail forming process. When the wire is pulled off, a reaction force acts on the wire W inserted into the soldering pin 30 . If the reaction force is too large, the bonding wire W inserted into the soldering pin 30 will be bent into an S-shape, causing an S-shaped bend. In addition, depending on the bonding strength of the bonded wire W and the operating conditions of the tail forming process and the tail cutting process, there may be problems such as a tail that does not meet the required length, or a wire that is peeled off at the joint and is not sticky. Problems such as S-shaped bends, no tails, and non-stick wires (hereinafter collectively referred to as "cutting defects") will lead to a decrease in the quality of semiconductor devices.

Therefore, the operator has previously adjusted the operating conditions in the second (2nd) joining process, tail forming process, and tail cutting process to avoid occurrence of cutting failure. Here, the operating conditions include, for example, the load value added to the bonding wire W, the speed at which the soldering needle 30 is moved, the moving trajectory of the soldering needle 30 , and the heating temperature of the heater 46 .

The operator adjusts the operating conditions according to the presence or absence of cutting defects, but conventionally there has been no index to quantitatively evaluate the quality of the operating conditions. Therefore, in the past, operators had to observe the actual manufactured products to confirm whether there were any cutting defects, and adjust operating conditions based on the confirmation results, which was very time-consuming and labor-intensive.

Therefore, in this specification, as an evaluation index for quantitatively evaluating the quality of operating conditions, especially the quality of operating conditions in the second (2nd) joining process, tail forming process, and tail cutting process, the break index Sb and The breaking distance Ds is determined, and the operator is prompted with the measurement result. This is explained in detail below.

First, the fracture index Sb and the fracture distance Ds will be explained. As mentioned above, in this example, after the second (2nd) joining process and the tail forming process are completed, the tail cutting process is subsequently performed. In the tail cutting process, after closing the wire clamp 34, the controller 50 moves the soldering pin 30 in a direction away from the second joint point B2, thereby cutting off the tail. In this example, a parameter indicating the force required for cutting off the tail is obtained as the fracture index Sb. In addition, the moving distance of the soldering pin 30 from closing the wire clip 34 to cutting off the tail is obtained as the breaking distance Ds.

To further describe in detail, during the tail cutting process, the controller 50 generates a command position P* in which the soldering needle 30 gradually moves in the separation direction, and inputs the command position P* to the moving mechanism 18 . The driver of the drive motor 22 provided in the moving mechanism 18 calculates the position deviation ΔP, which is the difference between the command position P* and the detection position Pd detected by the position sensor 28, and applies the position deviation ΔP to the drive motor 22. corresponding value of current. The drive motor 22 outputs torque proportional to the applied current. After the tail is cut off by the output of torque, the reaction causes the welding pin 30 to temporarily overtravel significantly in the separation direction.

FIG. 3 is a diagram illustrating an example of the temporal change of the positional deviation ΔP obtained when performing tail cutting processing. In the example of Figure 3, the tail is cut off at time t1, and the position deviation ΔP reaches a peak value immediately after time t1. The greater the reaction during cutting and the greater the force required for cutting, the greater the peak value. Therefore, in this example, the peak value of the positional deviation ΔP is measured as the fracture index Sb. In addition, the moving distance of the soldering needle 30 until the peak value is obtained is measured as the breaking distance Ds. The fracture index Sb or the fracture distance Ds can be used as an index indicating the magnitude of the force required to fracture the bonding wire W, that is, the fracture strength.

Here, the fracture index Sb and the fracture distance Ds greatly affect the presence or absence of bonding defects. For example, when S-shaped bending occurs, the fracture index Sb and the fracture distance Ds increase compared to the case where S-shaped bending does not occur. Especially when the types of wires W are the same, if the fracture index Sb becomes a certain level or above, S-shaped bending will occur. Therefore, by monitoring the fracture index Sb, the presence or absence of S-shaped bending can be determined. In addition, the maximum value of the fracture index Sb without S-shaped bending (hereinafter referred to as "permissible maximum strength Smax") varies depending on the type of wire W. When the composition of the bonding wire W is the same, the larger the diameter of the bonding wire W, the greater the allowable maximum strength Smax. Furthermore, when wire detachment occurs when the bonding wire W is not properly joined to the second joint point B2, compared with the case where the wire detachment does not occur, there is no big difference in the break index Sb, but the break distance Ds increases. . Therefore, by monitoring the breakage distance Ds, the presence or absence of non-stick conductors can be determined.

The controller 50 measures the fracture index Sb and the fracture distance Ds, and presents the measurement results to the operator via the output device 64 . Based on the prompted fracture index Sb and fracture distance Ds, the operator can determine the presence or absence of joint failure and thus the quality of the operating conditions. In addition, the value range of the fracture index Sb and the fracture distance Ds in which bonding failure does not occur, that is, the allowable range, varies depending on the type of wire W (ie, composition, diameter, manufacturing method, etc.), and is thus determined in advance through experiments and the like.

Next, the user interface in the manufacturing device 10 of this example will be described. In the manufacturing apparatus 10 of this example, a measurement pattern for the fracture index Sb and the fracture distance Ds, which are evaluation indexes for measuring the above-mentioned operating conditions, is prepared. When the operator selects the measurement mode, the display displays a measurement mode screen 70 as shown in FIG. 4 . In the measurement mode screen 70 , the operator can designate the start number 71 , which is the wire number to start the measurement of the evaluation index, and the measurement number 72 , which is the number of wires to be measured. In addition, the operator can set different operating conditions in advance according to each wiring number.

When the start button is selected, the controller 50 sequentially executes the wire bonding process in accordance with the number of measurements starting from the designated wire number. In the case of the example of FIG. 4 , since the start number is 81 and the number of measurements is 15, the controller 50 executes the bonding process on the 15 wires W from wire numbers 81 to 95.

The controller 50 measures the fracture index Sb and the fracture distance Ds as evaluation indexes for each joining process, and temporarily stores the results in the memory 54 . Then, after the joining process corresponding to the specified number of measurements is completed, the controller 50 presents the measurement results to the operator. Multiple fracture indexes Sb and fracture distance Ds are obtained (that is, quantities corresponding to the number of measurements). Therefore, the controller 50 prompts the operator to obtain statistical values of the plurality of fracture indexes Sb and fracture distance Ds as the measurement results. In the example of FIG. 4 , the final value, maximum value, minimum value, average value, and standard deviation of a plurality of fracture indexes Sb and fracture distance Ds are displayed in the measurement result column 73 as the measurement results.

In addition, the measurement mode screen 70 is provided with a graph button 74 . When the graph button 74 is selected, the operator is prompted with a plurality of measured values of the fracture index Sb and the fracture distance Ds in the form of a graph. 5A and 5B are diagrams each showing an example of a graph screen showing the fracture index Sb and the fracture distance Ds presented to the operator. As shown in FIGS. 5A and 5B , the graph screen has a type selection column 75 for the type of evaluation index to be displayed, and a graph of the selected type of evaluation index is displayed. In addition, the horizontal axis of the graph represents the wire number, and the vertical axis represents the measured value of the evaluation index (that is, the fracture index Sb or the fracture distance Ds).

By referring to this graph, the operator can easily identify the wire number where bonding failure occurs. In the examples of FIGS. 5A and 5B , the fracture index Sb and fracture distance Ds of wire number 88 are both high, so it can be inferred that S-shaped bending occurs. In addition, the breakage index Sb of wire number 91 is not high, but the breakage distance Ds is high, so it can be inferred that wire detachment has occurred. Then, as described above, the presence or absence of joint failure can be determined based on the evaluation index, whereby the operator can more easily determine whether the operating conditions are appropriate and can adjust the operating conditions more easily. Furthermore, when it is known that the range of the evaluation index in which joint failure does not occur, that is, the allowable range, the upper limit value and the lower limit value of the allowable range may be displayed on the graph. By setting this structure, the operator can more intuitively judge whether the joining conditions are suitable or not.

After adjusting the operating conditions with this curve as a reference, the operator starts mass production of the product under the adjusted operating conditions. At this time, the operating conditions are adjusted to conditions in which joint failure does not occur. However, when products are repeatedly manufactured, bonding defects may occur due to temperature changes, individual differences between batches, interference, etc. In order to detect the occurrence of such joint failure, the controller 50 may continuously or intermittently measure the evaluation index. Furthermore, when the evaluation index deviates from the predetermined allowable range, the controller 50 may output an alarm and interrupt the production of the product.

FIG. 6 is a flowchart showing the processing flow of the controller 50 during mass production of products. As shown in FIG. 6 , the controller 50 executes the joining of the n-th bonding wire W according to the operating conditions set by the operator ( S12 ). During this joining process, the controller 50 measures the fracture index Sb. Then, the obtained fracture index Sb is compared with the predetermined allowable maximum strength Smax (S14). When the comparison result is Sb≦Smax, it is determined that there is no problem, and the bonding process of the next bonding wire W is executed (S16, S18, S12). On the other hand, in the case of Sb>Smax, the possibility of S-shaped bending occurring is high. In this case, the controller 50 outputs an alarm (S20) and temporarily suspends the production of the product.

As described above, by monitoring the fracture index Sb during the mass production of products, joint defects can be detected as early as possible, and the quality of the final product can be further improved. Furthermore, in FIG. 6 , only the break index Sb is monitored, but of course, in addition to the break index Sb, the break distance Ds may also be managed. Moreover, in the current description, the manufacturing device 10 that performs wire bonding is taken as an example for description. However, as long as the manufacturing device performs the tail cutting process, the technology disclosed in this specification can also be applied to other types of manufacturing devices. Therefore, the technology disclosed in this specification can also be applied to a bump bonding device for forming bumps on the semiconductor wafer 110 .

In addition, in the present explanation, the peak value of the positional deviation ΔP immediately after cutting off the tail is obtained as the break index Sb. However, as long as the break index Sb is a parameter indicating the force required to cut off the tail, it may be another parameter, for example, it may be the applied current value of the drive motor 22 during cutting.

10:Manufacturing device 12:joint head 14: Carrier platform 18:Mobile mechanism 22: Drive motor 24: Ultrasonic welding head 26: Ultrasonic oscillator 28: Position sensor 30: Soldering pin 34:Cable clip 42: Rotating spool 43:Blowtorch electrode 46:Heater 50:Controller 52: Processor 54:Memory 60:UI device 62:Input device 64:Output device 70: Measurement mode screen 71:Start number 72:Measurement number 73: Measurement result column 74: Curve button 75: Category selection column 100:Substrate 110:Semiconductor wafer B1: first joint point B2: Second joint point W: Wire

FIG. 1 is a diagram showing the structure of a manufacturing apparatus. FIG. 2A is a conceptual diagram showing the flow of wire bonding. FIG. 2B is a conceptual diagram showing the flow of wire bonding. FIG. 2C is a conceptual diagram showing the flow of wire bonding. FIG. 2D is a conceptual diagram showing the flow of wire bonding. FIG. 2E is a conceptual diagram showing the flow of wire bonding. FIG. 2F is a conceptual diagram showing the flow of wire bonding. FIG. 3 is a diagram illustrating an example of changes over time in positional deviation obtained when performing tail cutting processing. FIG. 4 is a diagram showing an example of a measurement mode screen. FIG. 5A is a diagram showing an example of a graph screen of a fracture index presented to the operator. FIG. 5B is a diagram showing an example of a graph screen showing the breaking distance presented to the operator. FIG. 6 is a flowchart showing the processing flow of the controller during mass production of products.

10:Manufacturing device 12:joint head 14: Carrier platform 18:Mobile mechanism 22: Drive motor 24: Ultrasonic welding head 26: Ultrasonic oscillator 28: Position sensor 30: Soldering pin 34:Cable clip 42: Rotating spool 43:Blowtorch electrode 46:Heater 50:Controller 52: Processor 54:Memory 60:UI device 62:Input device 64:Output device 100:Substrate 110:Semiconductor wafer W: Wire

Claims (6)

A manufacturing device for a semiconductor device, including: a soldering needle for inserting wires, and pressing the wires extending from the front end to the object surface for joining; a wire clamp that moves in conjunction with the soldering needles and clamps the wires; The moving mechanism includes one or more drive motors that use the power of the drive motor to move the welding pins; a position sensor that detects the position of the welding pins as the detection position; and a controller that controls the welding pins. The needle, the wire clip, and the driving of the moving mechanism are controlled, and the controller is configured to perform the following processing: tail cutting processing, after the joining of the threading to the target surface and the formation of the tail, In a state where the wire clamp is closed, the soldering needle is moved in a separation direction to cut off the tail; and an index measurement process is performed to measure the movement of the soldering needle just after cutting off the bonding wire. The peak value of the deviation between the command position and the detected position is used as a fracture index. The manufacturing apparatus of a semiconductor device according to claim 1, wherein the controller further measures a breaking distance during the index measurement process, and the breaking distance is from closing the wire clamp to cutting off the bonding wire. The moving distance of the soldering pin. The semiconductor device manufacturing apparatus according to claim 1 or claim 2 further includes: A user interface device accepts operation input from an operator and outputs information to the operator, and the controller repeatedly executes the tail cutting process when the operator instructs the measurement of the fracture index. More than 2 times, and the measured values of the fracture index respectively obtained in the tail cutting process more than 2 times are prompted to the operator through the user interface device. The semiconductor device manufacturing apparatus according to Claim 3, wherein the controller presents a list of the measured values of the fracture index obtained in each of the tail cutting processes two or more times in the form of a graph. The semiconductor device manufacturing apparatus according to Claim 1 or Claim 2, wherein the controller outputs an alarm when the fracture index is outside a predetermined reference range. A method of manufacturing a semiconductor device, including: a tail cutting step, pressing the bonding wire extending from the front end of the soldering needle to the object surface and joining it, and then closing the wire clamp and clamping the bonding wire, so that the soldering needle is moving in a direction separated from the object surface; and an index measurement step, executed in parallel with the tail cutting step, to measure the deviation between the instruction position and the detection position of the movement of the soldering needle just after cutting off the bonding wire. The peak value is the fracture indicator.

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