TWI828022B - 接合基板和基板的基板接合設備中的基板收容及對準裝置 - Google Patents

接合基板和基板的基板接合設備中的基板收容及對準裝置 Download PDF

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TWI828022B
TWI828022B TW110147287A TW110147287A TWI828022B TW I828022 B TWI828022 B TW I828022B TW 110147287 A TW110147287 A TW 110147287A TW 110147287 A TW110147287 A TW 110147287A TW I828022 B TWI828022 B TW I828022B
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方鎬千
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韓商细美事有限公司
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Abstract

本發明的實施例提供能夠有效地充分利用空間的基板接合設備中的基板收容及對準裝置。根據本發明的實施例的接合基板和基板的基板接合設備中的基板收容及對準裝置，包括：前端緩衝器，包括用於臨時收容基板的前端收容插槽以及從所述前端收容插槽輸送所述基板的輸送機械手能夠移動的前端開口部；以及前端校準器，形成為層疊於所述前端緩衝器的上方而通過旋轉所述基板來對準所述基板。

Description

接合基板和基板的基板接合設備中的基板收容及對準裝置
本發明涉及用於接合基板和基板的基板接合設備中的基板收容及對準裝置。
半導體（或者顯示器）製造製程作為用於在基板（例如：晶圓）上製造半導體元件的製程，例如包括曝光、蒸鍍、蝕刻、離子注入、清洗等。作為用於連接通過半導體製造製程形成的晶片間的方法，介紹有通過貫通電極將晶片電連接的TSV（Through Silicon Via；矽通孔）製程。
另一方面，為了TSV製程，可以執行將基板和基板彼此接合的W2W（Wafer-to-Wafer；晶圓到晶圓）焊接，可以提供這樣的用於接合基板和基板的基板接合設備。用於在這樣的基板接合設備中有效地執行基板的輸送以及處理的設備佈局結構正得到研究。
因此，本發明的實施例提供能夠有效地充分利用空間的基板接合設備中的基板收容及對準裝置。
本發明的解決課題不限於以上提及的，本領域技術人員可以從下面的記載明確地理解未提及的其它解決課題。
根據本發明的實施例的用於接合基板和基板的基板接合設備中的基板收容及對準裝置包括：前端緩衝器，包括用於臨時收容基板的前端收容插槽以及從所述前端收容插槽輸送所述基板的輸送機械手能夠移動的前端開口部；以及前端校準器，形成為層疊於所述前端緩衝器的上方而通過旋轉所述基板來對準所述基板。
根據本發明的實施例，所述前端收容插槽包括向垂直方向提供為多個並用於在下方支承所述基板的前端緩衝器支承部件。
根據本發明的實施例，可以是，所述前端開口部包括：第一前端開口部，供從在所述基板接合設備中裝載所述基板的EFEM（Equipment Front End Module；晶圓移載模組）向所述前端收容插槽輸送所述基板的EFEM輸送機械手出入；以及第二前端開口部，供從所述前端收容插槽向所述前端校準器輸送所述基板的主輸送機械手出入。
根據本發明的實施例，所述前端校準器包括：前端對準檢查部，檢查所述基板的對準狀態；以及前端旋轉驅動部，根據所述基板的對準狀態來旋轉驅動所述基板。
根據本發明的實施例，可以是，所述前端對準檢查部在所述基板的等離子體處理之前檢查所述基板的切口部是否對準特定方向，所述前端旋轉驅動部將所述基板旋轉成所述基板的切口部朝向所述特定方向。
根據本發明的實施例，可以是，所述前端對準檢查部在被接合的基板的接合檢查之前檢查所述被接合的基板是否對準特定方向，所述前端旋轉驅動部將所述基板旋轉成所述被接合的基板對準特定方向。
根據本發明的另一實施例的用於接合基板和基板的基板接合設備中的基板收容及對準裝置包括：後端緩衝器，包括用於臨時收容基板的後端收容插槽以及供從所述後端收容插槽輸送所述基板的輸送機械手能夠移動的後端開口部；後端校準器，形成為層疊於所述後端緩衝器的上方而通過旋轉所述基板來對準所述基板；以及冷卻部件，形成為層疊於所述後端緩衝器的下方而用於冷卻被接合的基板。
根據本發明的實施例，可以是，所述後端收容插槽包括向垂直方向提供為多個並用於在下方支承所述基板的後端緩衝器支承部件。
根據本發明的實施例，可以是，所述後端開口部包括：第一後端開口部，供在所述基板接合設備中將被等離子體處理的基板向所述後端收容插槽輸送的主輸送機械手出入；以及第二後端開口部，形成為與所述第一後端開口部相對，並供從所述後端收容插槽將所述被等離子體處理的基板翻轉的翻轉輸送機械手出入。
根據本發明的實施例，可以是，所述後端校準器包括：後端對準檢查部，檢查所述基板的對準狀態；以及後端旋轉驅動部，根據所述基板的對準狀態來旋轉驅動所述基板。
根據本發明的實施例，可以是，所述後端對準檢查部在所述基板的接合處理之前檢查所述基板是否對準特定方向，所述後端旋轉驅動部將所述基板旋轉成所述基板朝向所述特定方向。
根據本發明的實施例，可以是，所述基板收容及對準裝置還包括：厚度檢查部，位於所述後端校準器的上方而測定所述基板的厚度。
根據本發明的實施例的用於接合基板和基板的基板接合設備包括：EFEM（Equipment Front End Module；晶圓移載模組），裝載所述基板；EFEM輸送機械手，從所述EFEM輸送所述基板；前端基板收容及對準模組，臨時收容通過所述EFEM輸送機械手輸送的所述基板並為了後續處理而對準所述基板；主輸送機械手，從所述前端基板收容及對準模組輸送所述基板；等離子體處理模組，對所述基板執行等離子體處理；後端基板收容及對準模組，臨時收容被等離子體處理的所述基板並為了後續處理而對準所述基板；翻轉輸送機械手，將臨時收容在所述後端基板收容及對準模組中的基板翻轉後輸送；焊接模組，執行所述基板和所述基板之間的接合；以及焊接檢查模組，檢查所述基板和所述基板之間的接合狀態。可以是，所述前端基板收容及對準模組包括：前端緩衝器，包括用於臨時收容所述基板的前端收容插槽以及所述EFEM輸送機械手以及所述主輸送機械手能夠從所述前端收容插槽移動的前端開口部；以及前端校準器，形成為層疊於所述前端緩衝器的上方而通過旋轉所述基板來對準所述基板。
根據本發明的實施例，可以是，所述前端開口部包括：第一前端開口部，供所述EFEM輸送機械手出入；以及第二前端開口部，供所述主輸送機械手出入。
根據本發明的實施例，可以是，所述主輸送機械手通過所述第二前端開口部而將所述基板支承並向所述前端校準器輸送，所述前端校準器為了所述等離子體處理而將所述基板的切口部對準特定方向，所述主輸送機械手將對準的所述基板向所述等離子體處理模組輸送。
根據本發明的實施例，可以是，所述後端基板收容及對準模組包括：後端緩衝器，包括用於臨時收容基板的後端收容插槽以及所述主輸送機械手以及所述翻轉輸送機械手能夠從所述後端收容插槽移動的後端開口部；後端校準器，形成為層疊於所述後端緩衝器的上方而通過旋轉所述基板來對準所述基板；冷卻部件，形成為層疊於所述後端緩衝器的下方而用於冷卻被接合的所述基板；以及厚度檢查部，位於所述後端校準器的上方而測定所述基板的厚度。
根據本發明的實施例，可以是，所述主輸送機械手從所述等離子體處理模組支承所述基板向所述後端校準器輸送，所述後端校準器將所述基板按照所述焊接模組對準，所述翻轉輸送機械手將所述基板翻轉後向所述焊接模組輸送，將被接合的基板向所述冷卻部件輸送。
根據本發明的實施例，可以是，所述主輸送機械手將所述被接合的基板從所述冷卻部件向所述前端校準器輸送，所述前端校準器將所述被接合的基板對準特定方向。
根據本發明的實施例，可以是，所述主輸送機械手將通過所述前端校準器對準的所述被接合的基板向焊接檢查模組輸送，所述焊接檢查模組對所述被接合的基板執行接合檢查。
根據本發明的實施例，可以是，所述主輸送機械手將執行所述接合檢查後的所述被接合的基板向所述前端緩衝器輸送，所述EFEM輸送機械手將收容在所述前端緩衝器中的所述被接合的基板向所述EFEM輸送，所述EFEM排出所述被接合的基板。
根據本發明的實施例，將臨時收容基板的緩衝器和對準基板的校準器向垂直方向層疊構成，從而能夠有效地充分利用基板接合設備內空間。
本發明的效果不限於以上提及的，本領域技術人員可以從下面的記載明確地理解未提及的其它效果。
以下，參照附圖來詳細說明本發明的實施例，以使得本發明所屬技術領域中具有通常知識的人能夠容易地實施。本發明可以以各種不同方式實現，不限於在此說明的實施例。
為了清楚地說明本發明，省略了與說明無關的部分，貫穿說明書整體對相同或類似的構成要件標注相同的附圖標記。
另外，在多個實施例中，對具有相同結構的構成要件，使用相同的附圖標記來僅說明代表性實施例，在其餘的其它實施例中僅說明與代表性實施例不同的結構。
在說明書整體中，當表述某部分與其它部分“連接（或者結合）”時，其不僅是“直接連接（或者結合）”的情況，還包括將其它部件置於中間“間接連接（或者結合）”的情況。另外，當表述某部分“包括”某構成要件時，只要沒有特別相反記載，其意指可以還包括其它構成要件而不是排除其它構成要件。
只要沒有不同地定義，包括技術或科學術語在內在此使用的所有術語具有與本發明所屬技術領域中具有通常知識的人一般所理解的含義相同的含義。在通常使用的詞典中定義的術語之類的術語應解釋為具有與相關技術文脈上具有的含義一致的含義，只要在本申請中沒有明確定義，不會理想性或過度地解釋為形式性含義。
圖1示出基板接合設備的結構以及基板輸送路徑。根據本發明的實施例的基板接合設備是接收基板（第一基板）和基板（第二基板），通過將第一基板和第二基板彼此接合而輸出接合的基板的設備。
根據本發明的實施例的用於接合基板和基板的基板接合設備包括：EFEM（Equipment Front End Module；晶圓移載模組）10，裝載基板；EFEM輸送機械手20，從EFEM 10輸送基板；前端基板收容及對準模組30，臨時收容通過EFEM輸送機械手20輸送的所述基板，並為了後續處理而對準基板；主輸送機械手40，從前端基板收容及對準模組30輸送基板；等離子體處理模組50，對基板執行等離子體處理；後端基板收容及對準模組60，臨時收容被等離子體處理的基板，並為了後續處理而對準基板；翻轉輸送機械手70，翻轉並輸送臨時收容於後端基板收容及對準模組60的基板；焊接模組80，執行基板和基板之間的接合；以及焊接檢查模組90，檢查基板和基板之間的接合狀態。另外，基板接合設備可以還包括用於將等離子體處理前基板的表面處理為親水性的親水化處理模組45。
另一方面，前端基板收容及對準模組30和後端基板收容及對準模組60的話，需要在使用最小限度的空間的同時恰當地執行收容及對準功能。因此，本發明的實施例提供通過最小化使用面積而能夠有效地使用空間的基板收容及對準裝置。
圖2以及圖3示出根據本發明的一實施例的基板收容及對準裝置的構造。圖2以及圖3的基板收容及對準裝置可以相當於圖1的前端基板收容及對準模組30。圖2是基板收容及對準裝置的立體圖，圖3相當於從上方觀察的基板收容及對準裝置。
基板收容及對準裝置（前端基板收容及對準模組30）包括：前端緩衝器310，包括用於臨時收容基板的前端收容插槽311以及從前端收容插槽311輸送基板的輸送機械手20、30能夠移動的前端開口部312A、312B；以及前端校準器320，形成為層疊於前端緩衝器310的上方而通過旋轉基板來對準基板。如圖2以及圖3所示，臨時收容基板的前端緩衝器310和執行用於處理基板的對準的前端校準器320彼此以層疊狀態配置。於是，用於以最小限度的空間進行基板收容及對準的裝置可以設置於基板接合設備的內部。
前端收容插槽311包括向垂直方向提供為多個並用於在下方支承基板的前端緩衝器支承部件。如圖2所示，前端緩衝器支承部件可以包括用於在3點支承基板的支承銷以及設置支承銷的支承軸。另外，用於檢查基板是否安放於前端緩衝器支承部件的基板檢測部可以設置於前端緩衝器支承部件。
所述前端開口部312A、312B包括：第一前端開口部312A，供從在基板接合設備中裝載基板的EFEM 10向前端收容插槽311輸送基板的EFEM輸送機械手20出入；以及第二前端開口部312B，供從前端收容插槽向前端校準器320輸送基板的主輸送機械手40出入。即，可以是，EFEM輸送機械手20從EFEM 10接收基板而通過第一前端開口部312A向前端收容插槽傳送基板，主輸送機械手40通過第二前端開口部312B從前端收容插槽接收基板而向前端校準器320輸送基板。
前端校準器320包括檢查基板的對準狀態的前端對準檢查部321以及根據基板的對準狀態來旋轉驅動基板的前端旋轉驅動部322。
主輸送機械手40可以為了在向等離子體處理模組50輸送基板之前將基板的切口部向所想的方向對準而從前端收容插槽接收基板而向前端校準器320輸送。根據一實施例，前端對準檢查部321在基板的等離子體處理之前檢查基板的切口部是否對準特定方向，前端旋轉驅動部322將基板旋轉成所述基板的切口部朝向所述特定方向。若完成基板的對準，則主輸送機械手40可以將基板從前端校準器320接收而向等離子體處理模組50（或者親水化處理模組45）輸送。
另外，主輸送機械手40可以將完成接合而接合的基板從後端基板收容及對準模組60接收而向前端校準器320輸送。可以是，前端對準檢查部321在檢查被接合的基板的接合之前檢查被接合的基板是否對準特定方向，前端旋轉驅動部322將基板旋轉成被接合的基板以特定形態對準。若完成基板的對準，則主輸送機械手40可以接收被接合的基板而向焊接檢查模組90輸送。
圖4示出根據本發明的另一實施例的基板收容及對準裝置的構造。圖4的基板收容及對準裝置可以相當於圖1的後端基板收容及對準模組60。圖4示出從側面觀察的後端基板收容及對準模組60。
基板收容及對準裝置（後端基板收容及對準模組60）包括：後端緩衝器610，包括用於臨時收容基板的後端收容插槽611以及供從後端收容插槽611輸送基板的主輸送機械手40與翻轉輸送機械手70能夠移動的後端開口部612；後端校準器620，形成為層疊於後端緩衝器610的上方而通過旋轉基板來對準基板；以及冷卻部件630，形成為層疊於後端緩衝器610的下方層疊而用於冷卻被接合的基板。如圖4所示，後端校準器620、後端緩衝器610、冷卻部件630構成為彼此層疊。於是，用於以最小限度的空間進行基板收容及對準的裝置可以設置於基板接合設備的內部。
後端收容插槽611包括向垂直方向提供為多個並用於在下方支承基板的後端緩衝器支承部件。如圖4所示，後端緩衝器支承部件可以包括用於在3點支承基板的支承銷以及設置支承銷的支承軸。另外，用於檢查基板是否安放於後端緩衝器支承部件的基板檢測部可以設置於後端緩衝器支承部件。
後端開口部612包括：第一後端開口部612A，供在基板接合設備中將被等離子體處理的基板向後端收容插槽611輸送的主輸送機械手40出入；以及第二後端開口部612B，形成為與第一後端開口部612A相對，並供從後端收容插槽611將被等離子體處理的基板翻轉的翻轉輸送機械手70出入。
後端校準器620包括：後端對準檢查部621，檢查基板的對準狀態；以及後端旋轉驅動部622，根據基板的對準狀態來旋轉驅動基板。可以是，後端對準檢查部621在基板的接合處理之前檢查基板是否對準特定方向，後端旋轉驅動部622將基板旋轉成所述基板朝向特定方向。通過親水化處理模組45以及等離子體處理模組50進行表面處理的基板通過主輸送機械手40向後端基板收容及對準模組60輸送，在後端基板收容及對準模組60中對準以及收容基板。
另外，基板收容及對準裝置（後端基板收容及對準模組60）可以還包括位於後端校準器620的上方而測定基板厚度的厚度檢查部640。可以是，厚度檢查部640在對準基板時測定基板的厚度，基板的厚度資訊在接合基板時用於加壓程度以及定位。例如，主輸送機械手40將被等離子體處理的基板向後端校準器620輸送，在此，基板被執行對準以及厚度檢查。若完成對準以及厚度檢查，則主輸送機械手40通過第一後端開口部612A向後端收容插槽611輸送基板，翻轉輸送機械手70通過第二後端開口部612B接收基板而向焊接模組80輸送基板。
在接合基板時，可以是一個基板位於上方而另一個基板位於下方，將上方的基板向下方加壓來執行接合。在此，要位於上方的基板可以以倒置狀態配置，翻轉輸送機械手70可以將要位於上方的基板翻轉後使基板位於上卡盤。
圖5以及圖6示出用於基板間的接合的基板輸送路徑。圖5示出接合基板之前輸送各個基板的路徑，圖6示出輸送通過接合製程彼此接合的基板的路徑。
如前面所說明那樣，包括：EFEM 10，裝載基板；EFEM輸送機械手20，從EFEM 10輸送基板；前端基板收容及對準模組30，臨時收容通過EFEM輸送機械手20輸送的所述基板，並為了後續處理而對準基板；主輸送機械手40，從前端基板收容及對準模組30輸送基板；等離子體處理模組50，對基板執行等離子體處理；後端基板收容及對準模組60，臨時收容被等離子體處理的基板，並為了後續處理而對準基板；翻轉輸送機械手70，將臨時收容在後端基板收容及對準模組60中的基板翻轉後輸送；焊接模組80，執行基板和基板之間的接合；以及焊接檢查模組90，檢查基板和基板之間的接合狀態。另外，基板接合設備可以還包括用於將等離子體處理前基板的表面處理為親水性的親水化處理模組45。
參照圖5，投進EFEM 10中的基板通過EFEM輸送機械手20向前端基板收容及對準模組30輸送。如參照圖2以及圖3所說明那樣，前端基板收容及對準模組30包括：前端緩衝器310，包括用於臨時收容基板的前端收容插槽311以及EFEM輸送機械手20和主輸送機械手40能夠從前端收容插槽311移動的前端開口部312A、312B；以及前端校準器320，形成為層疊於前端緩衝器310的上方而通過旋轉基板來對準基板。
前端開口部312A、312B包括：第一前端開口部312A，供EFEM輸送機械手20出入；以及第二前端開口部312B，供主輸送機械手40出入。
可以是，主輸送機械手40通過第二前端開口部312B而將基板支承並向前端校準器320輸送，前端校準器320為了等離子體處理而將基板的切口部對準特定方向，主輸送機械手40將對準的基板向親水化處理模組45以及等離子體處理模組50輸送。
完成親水化以及等離子體處理的基板通過主輸送機械手40向後端基板收容及對準模組60輸送。後端基板收容及對準模組60包括：後端緩衝器610，包括用於臨時收容基板的後端收容插槽611以及從後端收容插槽611輸送基板的主輸送機械手40以及翻轉輸送機械手70能夠移動的後端開口部；後端校準器620，形成為層疊於後端緩衝器610的上方層疊而通過旋轉基板來對準基板；冷卻部件630，形成為層疊於後端緩衝器610的下方層疊而用於冷卻被接合的基板；以及厚度檢查部640，位於後端校準器620的上方而測定基板的厚度。
可以是，主輸送機械手40從等離子體處理模組50支承基板向後端校準器620輸送，後端校準器620將基板按照焊接模組80對準，翻轉輸送機械手70將基板翻轉後向焊接模組80輸送，將被接合的基板向冷卻部件630輸送。
之後，如圖6所示，被接合的基板通過前端基板收容及對準模組30對準之後向焊接檢查模組90輸送而執行接合檢查。另外，完成接合檢查的基板收容於前端基板收容及對準模組30，之後，通過EFEM輸送機械手20向EFEM 10輸送。
即，主輸送機械手40將通過前端基板收容及對準模組30對準的被接合的基板向焊接檢查模組90輸送，焊接檢查模組90對被接合的基板執行接合檢查。
之後，可以是，主輸送機械手40將執行接合檢查後的被接合的基板向前端緩衝器310輸送，EFEM輸送機械手20將收容於前端基板收容及對準模組30的被接合的基板向EFEM 10輸送，EFEM 10排出所述被接合的基板。可以通過位於基板接合設備外部的輸送車輛（例如：OHT）或者作業者排出被接合的基板。另外，可以通過OHT或者作業者投進又另一基板。
本實施例以及本說明書中所附的附圖只不過明確表示包括在本發明中的技術構思的一部分，顯而易見由本領域技術人員能夠在包括在本發明的說明書以及附圖中的技術構思的範圍內容易匯出的變化例和具體實施例均包括在本發明的申請專利範圍中。
因此，本發明的構思不應局限於所說明的實施例，不僅是所附的申請專利範圍，與其申請專利範圍等同或等價變形的所有構思屬於本發明構思的範疇。
10 EFEM 20 EFEM輸送機械手 30 前端基板收容及對準模組 310 前端緩衝器 311 前端收容插槽 312A、312B 前端開口部 320 前端校準器 321 前端對準檢查部 322 前端旋轉驅動部 40 主輸送機械手 45 親水化處理模組 50 等離子體處理模組 60 後端基板收容及對準模組 610 後端緩衝器 611 後端收容插槽 612 後端開口部 612A 第一後端開口部 612B 第二後端開口部 620 後端校準器 621 後端對準檢查部 622 後端旋轉驅動部 630 冷卻部件 640 厚度檢查部 70 翻轉輸送機械手 80 焊接模組 90 焊接檢查模組
圖1示出基板接合設備的結構以及基板輸送路徑。 圖2以及圖3示出根據本發明的一實施例的基板收容及對準裝置的構造。 圖4示出根據本發明的另一實施例的基板收容及對準裝置的構造。 圖5以及圖6示出用於基板間的接合的基板輸送路徑。
10 EFEM 20 EFEM輸送機械手 30 前端基板收容及對準模組 40 主輸送機械手 45 親水化處理模組 50 等離子體處理模組 60 後端基板收容及對準模組 70 翻轉輸送機械手 80 焊接模組 90 焊接檢查模組

Claims (18)

  1. 一種用於接合基板和基板的基板接合設備中的基板收容及對準裝置，其中，所述基板收容及對準裝置包括：前端緩衝器，包括用於臨時收容基板的前端收容插槽以及從所述前端收容插槽輸送所述基板的輸送機械手能夠移動的前端開口部，其中所述前端收容插槽包括：多個前端緩衝器支承部件，向垂直方向配置且用於在下方支承所述基板；以及多個基板檢測部，設置於所述前端緩衝器支承部件，用於檢查所述基板是否安放於所述前端緩衝器支承部件；以及前端校準器，形成為層疊於所述前端緩衝器的上方而通過旋轉所述基板來對準所述基板至特定方向。
  2. 如請求項1所述的基板收容及對準裝置，其中，所述前端開口部包括：第一前端開口部，供從在所述基板接合設備中裝載所述基板的晶圓移載模組(Equipment Front End Module,EFEM)向所述前端收容插槽輸送所述基板的EFEM輸送機械手出入；以及第二前端開口部，供從所述前端收容插槽向所述前端校準器輸送所述基板的主輸送機械手出入。
  3. 如請求項1所述的基板收容及對準裝置，其中，所述前端校準器包括：前端對準檢查部，檢查所述基板的對準狀態；以及前端旋轉驅動部，根據所述基板的對準狀態來旋轉驅動所述基板。
  4. 如請求項3所述的基板收容及對準裝置，其中，所述前端對準檢查部在所述基板的等離子體處理之前檢查所述基板的切口部是否對準特定方向，所述前端旋轉驅動部將所述基板旋轉成所述基板的切口部朝向所述特定方向。
  5. 如請求項3所述的基板收容及對準裝置，其中，所述前端對準檢查部在被接合的基板的接合檢查之前檢查所述被接合的基板是否對準特定方向，所述前端旋轉驅動部將所述基板旋轉成所述被接合的基板對準特定方向。
  6. 一種用於接合基板和基板的基板接合設備中的基板收容及對準裝置，其中，所述基板收容及對準裝置包括：後端緩衝器，包括用於臨時收容基板的後端收容插槽以及供從所述後端收容插槽輸送所述基板的輸送機械手能夠移動的後端開口部，其中所述後端收容插槽包括：多個後端緩衝器支承部件，向垂直方向配置且用於在下方支承所述基板；以及多個基板檢測部，設置於所述後端緩衝器支承部件，用於檢查所述基板是否安放於所述後端緩衝器支承部件；後端校準器，形成為層疊於所述後端緩衝器的上方而通過旋轉所述基板來對準所述基板至特定方向；以及冷卻部件，形成為層疊於所述後端緩衝器的下方而用於冷卻被接合的基板。
  7. 如請求項6所述的基板收容及對準裝置，其中，所述後端開口部包括：第一後端開口部，供在所述基板接合設備中將被等離子體處理的基板向所述後端收容插槽輸送的主輸送機械手出入；以及 第二後端開口部，形成為與所述第一後端開口部相對，並供從所述後端收容插槽將所述被等離子體處理的基板翻轉的翻轉輸送機械手出入。
  8. 如請求項6所述的基板收容及對準裝置，其中，所述後端校準器包括：後端對準檢查部，檢查所述基板的對準狀態；以及後端旋轉驅動部，根據所述基板的對準狀態來旋轉驅動所述基板。
  9. 如請求項8所述的基板收容及對準裝置，其中，所述後端對準檢查部在所述基板的接合處理之前檢查所述基板是否對準特定方向，所述後端旋轉驅動部將所述基板旋轉成所述基板朝向所述特定方向。
  10. 如請求項6所述的基板收容及對準裝置，其中，所述基板收容及對準裝置還包括：厚度檢查部，位於所述後端校準器的上方而測定所述基板的厚度。
  11. 一種用於接合基板和基板的基板接合設備，包括：晶圓移載模組(Equipment Front End Module；EFEM)，裝載所述基板；EFEM輸送機械手，從所述EFEM輸送所述基板；前端基板收容及對準模組，臨時收容通過所述EFEM輸送機械手輸送的所述基板並為了後續處理而對準所述基板至特定方向；主輸送機械手，從所述前端基板收容及對準模組輸送所述基板；等離子體處理模組，對所述基板執行等離子體處理；後端基板收容及對準模組，臨時收容被等離子體處理的所述基板並為了後續處理而對準所述基板至特定方向；翻轉輸送機械手，將臨時收容在所述後端基板收容及對準模組中的基板翻轉後輸送；焊接模組，執行所述基板和所述基板之間的接合；以及 焊接檢查模組，檢查所述基板和所述基板之間的接合狀態，所述前端基板收容及對準模組包括：前端緩衝器，包括用於臨時收容所述基板的前端收容插槽以及所述EFEM輸送機械手以及所述主輸送機械手能夠從所述前端收容插槽移動的前端開口部，其中所述前端收容插槽包括：多個前端緩衝器支承部件，向垂直方向配置且用於在下方支承所述基板；以及多個基板檢測部，設置於所述前端緩衝器支承部件，用於檢查所述基板是否安放於所述前端緩衝器支承部件；以及前端校準器，形成為層疊於所述前端緩衝器的上方而通過旋轉所述基板來對準所述基板至特定方向。
  12. 如請求項11所述的基板接合設備，其中，所述前端開口部包括：第一前端開口部，供所述EFEM輸送機械手出入；以及第二前端開口部，供所述主輸送機械手出入。
  13. 如請求項12所述的基板接合設備，其中，所述主輸送機械手通過所述第二前端開口部而將所述基板支承並向所述前端校準器輸送，所述前端校準器為了所述等離子體處理而將所述基板的切口部對準特定方向，所述主輸送機械手將對準的所述基板向所述等離子體處理模組輸送。
  14. 如請求項11所述的基板接合設備，其中，所述後端基板收容及對準模組包括：後端緩衝器，包括用於臨時收容基板的後端收容插槽以及所述主輸送機械手以及所述翻轉輸送機械手能夠從所述後端收容插槽移動的後端開口部； 後端校準器，形成為層疊於所述後端緩衝器的上方而通過旋轉所述基板來對準所述基板；冷卻部件，形成為層疊於所述後端緩衝器的下方而用於冷卻被接合的所述基板；以及厚度檢查部，位於所述後端校準器的上方而測定所述基板的厚度。
  15. 如請求項14所述的基板接合設備，其中，所述主輸送機械手從所述等離子體處理模組支承所述基板向所述後端校準器輸送，所述後端校準器將所述基板按照所述焊接模組對準，所述翻轉輸送機械手將所述基板翻轉後向所述焊接模組輸送，將被接合的基板向所述冷卻部件輸送。
  16. 如請求項15所述的基板接合設備，其中，所述主輸送機械手將所述被接合的基板從所述冷卻部件向所述前端校準器輸送，所述前端校準器將所述被接合的基板對準特定方向。
  17. 如請求項16所述的基板接合設備，其中，所述主輸送機械手將通過所述前端校準器對準的所述被接合的基板向焊接檢查模組輸送，所述焊接檢查模組對所述被接合的基板執行接合檢查。
  18. 如請求項17所述的基板接合設備，其中，所述主輸送機械手將執行所述接合檢查後的所述被接合的基板向所述前端緩衝器輸送，所述EFEM輸送機械手將收容在所述前端緩衝器中的所述被接合的基板向所述EFEM輸送，所述EFEM排出所述被接合的基板。
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