TWI827443B - Shock absorbing flooring system - Google Patents

Abstract

A shock absorbing flooring system is provided, including: a cushion layer, configured to be disposed on a rigid base of a floor slab, having an amount of deformation in a thickness direction under a condition of per square centimeter per kilogram of weight (kgf/cm ²), the amount of deformation is 1％ to 14％ of a thickness of the cushion layer before compression; a supporter, disposed on the cushion layer; and a floor covering, disposed on the supporter.

Description

Floor shock absorbing system

The invention relates to a floor shock absorbing system.

Common floor materials include tiles, stone, wooden floors, etc. Among them, stone floor laying operations are divided into two types: wet construction and dry construction. Wet construction first lays a cement mortar layer on the floor, and then lays the stone floor on the cement mortar layer to combine the two. It is suitable for lighter and thinner buildings. The dry construction method is to lock multiple fixing parts on the floor, and then fix the stone floor to the multiple fixing parts, which is suitable for thicker stone floors.

However, in wet construction, the stone base plate and cement mortar layer are integrated into one, which is easy to deform, fall off or crack due to environmental factors, and the sound insulation and earthquake resistance effects are also poor; in dry construction, due to the stone floor, fixings and floor slabs, They are all rigidly connected structures, and their sound insulation and earthquake resistance effects are limited. There are shortcomings that need to be improved urgently.

Therefore, it is necessary to provide a novel and progressive floor shock absorbing system to solve the above problems.

The main purpose of the present invention is to provide a floor shock absorbing system with good earthquake resistance and sound insulation effects.

In order to achieve the above object, the present invention provides a floor shock absorbing system, including: a buffer layer, which is provided on a rigid foundation of the first floor floor, under the condition of weight per square centimeter per kilogram (kgf/cm ² ) There is a deformation amount in the thickness direction, the deformation amount accounts for 1% to 14% of the thickness of the buffer layer before being compressed; a supporter is provided on the buffer layer; and a floor plate is provided on the supporter .

The following examples are only used to illustrate the possible implementation modes of the present invention, but are not intended to limit the scope of protection of the present invention.

Please refer to Figures 1 to 8, which show a preferred embodiment of the present invention. The floor shock absorbing system 1 of the present invention includes a buffer layer 10, a supporter 20 and a floor panel 30.

The buffer layer 10 is provided on a rigid foundation 2 of the first floor. The buffer layer 10 has a deformation amount in a thickness direction under the condition of weight per square centimeter per kilogram (kgf/cm ² ). The deformation amount is Accounting for 1% to 14% of the thickness of the buffer layer 10 before being compressed; the supporter 20 is provided on the buffer layer 10 ; the floor block 30 is provided on the supporter 20 . Thereby, there is a gap between the floor block 30 and the rigid foundation 2. The floor block 30 (such as but not limited to stone slabs) is not easily deformed by the influence of the floor slab, and the buffer layer 10 has moderate elasticity and can provide Adequate cushioning, shock absorption and sound insulation effects.

The creep deformation rate (Creep deflection) of the buffer layer 10 is less than 1.5%, so the buffer layer 10 can still maintain elasticity after being subjected to heavy pressure, has good buffering and shock-absorbing effects, and has good durability. It should be noted that the creep deformation rate is based on the test method of ISO8013-1998. A pressure of 0.0045MPa is applied to the buffer layer 10 and the continuous test results are observed for at least 10 ³ hours. The creep deformation rate is based on the buffer layer 10 The creep amount after compression is calculated as a percentage of the thickness before compression.

Referring to FIGS. 2 to 5 , the buffer layer 10 includes a plurality of resin particles 11 (for example but not limited to rubber particles). A plurality of holes 12 are formed between the resin particles 11 . The plurality of holes 12 may be perforations or blind holes. , providing deformation space to prevent the buffer layer 10 from protruding in the thickness direction when pressed. The buffer layer 10 further includes an adhesive, which combines the plurality of resin particles 11 into one body, whereby the buffer layer 10 has better flexibility, and when the rigid base 2 is uneven, the plurality of resin particles 11. It can be partially moved relative to each other to reduce the height difference of the concave and convex parts to facilitate subsequent operations.

During manufacturing, the plurality of resin particles 11 and the adhesive are fully mixed to form a semi-finished product. The semi-finished product is pressurized and dried for at least six months to form a block. The block is then cut to a predetermined thickness to form a plurality of the semi-finished products. The buffer layer 10 has simple steps and can be formed into a thin layer.

Preferably, the average thickness of the buffer layer 10 is not less than 2 mm and not more than 10 mm, for example but not limited to 2, 4 or 8 mm, which can be selected according to needs, and has good elasticity and anti-seismic effects. In this embodiment, the thickness of the buffer layer 10 is 4 mm; the deformation amount of the buffer layer 10 accounts for 2.5% to 10% of the thickness of the buffer layer 10 before being compressed. Referring to Figure 8, for example, when the pressure on the buffer layer 10 is 0.1MPa (approximately 1 kgf/cm ² ), the deformation amount is approximately 0.33 mm (accounting for approximately 8.25% of the thickness before compression) ); when the pressure on the buffer layer 10 is 0.4MPa (about 4 kgf/cm ² ), the deformation amount is about 0.8 mm (about 20% of the thickness before pressure, ranging from 10% to 40 %). Thereby, the buffer layer 10 can be appropriately deformed to provide excellent buffering and supporting effects.

The buffer layer 10 has a dry heat aging rate of less than 20% after being thermally aged at 80°C for 72 hours. It is not easily damaged by heat and has good durability. The density of the buffer layer 10 is between 0.5 grams per cubic centimeter (g/cm3 ^). ) to 1.0 grams/cubic centimeter, lightweight, compressible and deformable to provide good cushioning effect. Furthermore, the thermal conductivity coefficient of the buffer layer 10 is between 0.10W/(m·K) and 0.16W/(m·K), which can effectively isolate the temperature of the floor; the impact sound reduction index of the buffer layer 10 is The amount is not less than 18dB respectively, which can effectively reduce impact sound; the impact sound insulation level of the buffer layer 10 is not less than 45dB, and the sound insulation effect is good; the tensile strength of the buffer layer 10 is greater than 300kPa, and the structural strength is good. The aforementioned dry heat aging rate was tested based on the dry heat aging test method of CNS 15559 Accelerated Aging Test Method for Soft and Hard Foam Materials. The hardness of 5 sampling points on the buffer layer 10 was first measured and the average value was calculated as To determine the hardness before aging, the buffer layer 10 is then heat aged at 80°C for 72 hours. The hardness of the aforementioned five sampling points is measured again and the average value is calculated as the hardness after aging. Finally, the hardness change before and after aging is calculated. The ratio of hardness before aging is used to obtain the dry heat aging rate. In this embodiment, the average thickness of the buffer layer 10 is approximately 8 mm; the dry heat aging rate of the buffer layer 10 is 12.53%; and the density of the buffer layer 10 is approximately 0.78g/cm ³ . In addition, after being soaked in sodium hypochlorite solution and potassium hydroxide solution for 12 hours respectively, the appearance of the buffer layer 10 did not change significantly, and the buffer layer 10 has good acid and alkali resistance. In other embodiments, the density, thickness, etc. of the buffer layer can also be adjusted according to needs.

A plurality of the floor panels 30 are arranged adjacently on a plurality of the supports 20 , and each supporter 20 supports at least two of the floor panels 30 in the thickness direction, so that the weight of the plurality of floor panels 30 can be evenly distributed. The contact area between a supporting surface 21 of each supporter 20 and a floor panel 30 is not less than 1/4 of the supporting surface 21. As shown in Figures 6 and 7, the supportability and stability are good. The distance between the floor panel 30 and the buffer layer 10 in the thickness direction is between 3 cm and 10 cm. The height and level of the floor panels 30 can be adjusted by adjusting the plurality of supports 20, which is easy to install and has good earthquake resistance. . In this embodiment, the rigid base 2 has a setting surface 2a facing the buffer layer 10, the buffer layer 10 has a contact surface 13 facing the supporter 20, and the supporter 20 has a contact surface 2a facing the buffer layer 10. The extension area of the fixed surface 22 and the contact surface 13 is smaller than the extension area of the installation surface 2a and larger than the extension area of the fixed surface 22. Therefore, the buffer layer 10 only needs to be partially laid on each of the supports 20 and the rigid foundation. 2 can provide good buffering and sound insulation effects, while saving costs and reducing the difficulty of construction. In other embodiments, the buffer layer can also be completely laid on the rigid foundation.

Preferably, the floor shock absorbing system 1 further includes a first glue layer 40, which is disposed between the supporter 20 and the buffer layer 10 (Fig. 2); the first glue layer 40 The thickness is between 0.50 mm and 1.00 mm to prevent the supporter 20 from moving relative to the buffer layer 10 and achieve better stability. The floor earthquake-absorbing system 1 further includes a second glue layer 50, which is provided between the buffer layer 10 and the rigid foundation 2 (Fig. 3); the thickness of the second glue layer 50 is between Between 0.05 mm and 0.30 mm, it provides positioning and moisture isolation effects. Furthermore, the thickness of the first glue layer 40 is greater than the thickness of the second glue layer 50; in this embodiment, the thickness of the first glue layer 40 is 0.75 mm, which can be stably connected to the supporter 20. The thickness of the second glue layer 50 is 0.15 mm to prevent excessive colloid from penetrating into the plurality of holes 12 and affecting the elasticity of the buffer layer 10; the first glue layer 40 and the second glue layer 50 are each made of an epoxy resin. Made of materials, it has good bonding strength and stability. In other embodiments, the first glue layer and the second glue layer can also be composed of polymer structural glue of other materials.

1: Floor shock absorber system 2: Rigid foundation 2a: Setting surface 10: Buffer layer 11: Resin particles 12:hole 13: Contact surface 20:Supporter 21:Support surface 22: Fixed surface 30:Floor block 40: First glue layer 50: Second glue layer

Figure 1 is a partial cross-sectional view of a preferred embodiment of the present invention. Figure 2 is a partial enlarged view of area A in Figure 1. Figure 3 is a partial enlarged view of area B in Figure 1. FIG. 4 is a schematic diagram of a buffer layer according to a preferred embodiment of the present invention. FIG. 5 is a partial enlarged view of the buffer layer according to a preferred embodiment of the present invention. Figure 6 is a top view of a preferred embodiment of the present invention. Figure 7 is a partial enlarged view of Figure 6. Figure 8 is a pressure-deformation change diagram of a preferred embodiment of the present invention.

1: Floor shock absorber system

2: Rigid foundation

2a: Setting surface

10: Buffer layer

13: Contact surface

20:Supporter

21:Support surface

22: Fixed surface

30:Floor block

Claims (8)

A floor shock absorbing system, including: a buffer layer, which is provided on a rigid foundation of the first floor floor and has a deformation amount in a thickness direction under the condition of weight per square centimeter per kilogram (kgf/cm ² ) , the deformation accounts for 1% to 14% of the thickness of the buffer layer before compression; a supporter, located on the buffer layer; and a floor plate, located on the supporter; wherein, on the buffer layer The creep deformation rate is less than 1.5%. The floor earthquake-absorbing system as claimed in claim 1, wherein a plurality of floor panels are adjacently provided on a plurality of supports, and each supporter supports at least two of the floor panels in the thickness direction. The floor earthquake-absorbing system as claimed in claim 2, wherein the contact area between a supporting surface of each supporter and a floor panel is not less than 1/4 of the supporting surface. The floor shock absorbing system as claimed in claim 1, wherein the dry heat aging rate of the buffer layer after heat aging at 80° for 72 hours is less than 20%. The floor earthquake-absorbing system as claimed in claim 1, wherein the rigid foundation has a setting surface facing the buffer layer, the buffer layer has a contact surface facing the supporter, and the supporter has a fixed surface facing the buffer layer. surface, the extension area of the contact surface is smaller than the extension area of the setting surface and larger than the extension area of the fixing surface. The floor earthquake-absorbing system according to claim 1 further includes a first adhesive layer, wherein the first adhesive layer is provided between the supporter and the buffer layer. The floor earthquake-absorbing system according to claim 1 further includes a second adhesive layer, wherein the second adhesive layer is provided between the buffer layer and the rigid foundation. The floor shock absorbing system as described in claim 3, wherein the dry heat aging rate of the buffer layer after thermal aging at 80° for 72 hours is less than 20%; the rigid foundation has a setting surface facing the buffer layer, and the buffer layer The layer has a contact surface facing the supporter, and the supporter has a fixed surface facing the buffer layer. The extended area of the contact surface is smaller than the extended area of the setting surface and larger than the extended area of the fixed surface; the average of the buffer layer The thickness is not less than 2 mm and not more than 10 mm; the distance between the floor slab and the buffer layer in the thickness direction is between 3 cm and 10 cm; the floor shock absorbing system also includes a first adhesive layer, the The first adhesive layer is provided between the supporter and the buffer layer; the floor shock absorbing system further includes a second adhesive layer, the second adhesive layer is provided between the buffer layer and the rigid foundation; the third adhesive layer is provided between the buffer layer and the rigid foundation; The thickness of the first glue layer is greater than the thickness of the second glue layer; the thickness of the first glue layer is between 0.50 mm and 1.00 mm; the thickness of the second glue layer is between 0.05 mm and 0.30 mm; the thickness of the first glue layer is between 0.05 mm and 0.30 mm. A glue layer and the second glue layer are respectively composed of a material including epoxy resin; the average density of the buffer layer is between 0.5 grams per cubic centimeter (g/cm ³ ) and 1.0 grams per cubic centimeter; the buffer layer has The thermal conductivity coefficient is between 0.10W/(m.K) and 0.16W/(m.K); the impact sound reduction index of the buffer layer is not less than 18dB; the impact sound insulation level of the buffer layer is not less than 45dB; and The tensile strength of the buffer layer is greater than 300kPa.

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