TWI825244B - Polarizing film with adhesive layer - Google Patents
Polarizing film with adhesive layer Download PDFInfo
- Publication number
- TWI825244B TWI825244B TW108145841A TW108145841A TWI825244B TW I825244 B TWI825244 B TW I825244B TW 108145841 A TW108145841 A TW 108145841A TW 108145841 A TW108145841 A TW 108145841A TW I825244 B TWI825244 B TW I825244B
- Authority
- TW
- Taiwan
- Prior art keywords
- meth
- acrylate
- monomer
- adhesive layer
- weight
- Prior art date
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- 239000012790 adhesive layer Substances 0.000 title claims abstract description 94
- -1 polysiloxane Polymers 0.000 claims abstract description 124
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 55
- 229920005601 base polymer Polymers 0.000 claims abstract description 40
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 36
- 125000000524 functional group Chemical group 0.000 claims abstract description 26
- 239000000178 monomer Substances 0.000 claims description 203
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 115
- 230000009477 glass transition Effects 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 13
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 12
- 229920001519 homopolymer Polymers 0.000 claims description 12
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 abstract description 48
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical group CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract description 21
- 239000000853 adhesive Substances 0.000 description 62
- 230000001070 adhesive effect Effects 0.000 description 61
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 32
- 239000003431 cross linking reagent Substances 0.000 description 31
- 239000000243 solution Substances 0.000 description 27
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 22
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 18
- 239000006087 Silane Coupling Agent Substances 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 17
- 239000003999 initiator Substances 0.000 description 17
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 17
- 239000004372 Polyvinyl alcohol Substances 0.000 description 16
- 229920002451 polyvinyl alcohol Polymers 0.000 description 16
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 15
- 239000000203 mixture Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 13
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 239000003505 polymerization initiator Substances 0.000 description 11
- 238000006116 polymerization reaction Methods 0.000 description 11
- 238000002360 preparation method Methods 0.000 description 11
- 229920002554 vinyl polymer Polymers 0.000 description 11
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- 238000012958 reprocessing Methods 0.000 description 9
- 238000011282 treatment Methods 0.000 description 9
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 8
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 7
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000004043 dyeing Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000012948 isocyanate Substances 0.000 description 7
- 150000002513 isocyanates Chemical class 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- WYURNTSHIVDZCO-UHFFFAOYSA-N tetrahydrofuran Substances C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 7
- 239000004925 Acrylic resin Substances 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 6
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical group O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 6
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 5
- 239000003522 acrylic cement Substances 0.000 description 5
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000012986 chain transfer agent Substances 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910052740 iodine Inorganic materials 0.000 description 5
- 239000011630 iodine Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000012719 thermal polymerization Methods 0.000 description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000013522 chelant Substances 0.000 description 4
- 125000004093 cyano group Chemical group *C#N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 150000002466 imines Chemical class 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 4
- BFYSJBXFEVRVII-UHFFFAOYSA-N 1-prop-1-enylpyrrolidin-2-one Chemical compound CC=CN1CCCC1=O BFYSJBXFEVRVII-UHFFFAOYSA-N 0.000 description 3
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000004018 acid anhydride group Chemical group 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 3
- 239000002998 adhesive polymer Substances 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 150000003951 lactams Chemical class 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- 229920001567 vinyl ester resin Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 2
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 2
- CTXUTPWZJZHRJC-UHFFFAOYSA-N 1-ethenylpyrrole Chemical compound C=CN1C=CC=C1 CTXUTPWZJZHRJC-UHFFFAOYSA-N 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- MZNSQRLUUXWLSB-UHFFFAOYSA-N 2-ethenyl-1h-pyrrole Chemical compound C=CC1=CC=CN1 MZNSQRLUUXWLSB-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 2
- GAVHQOUUSHBDAA-UHFFFAOYSA-N 3-butyl-1-ethenylaziridin-2-one Chemical compound CCCCC1N(C=C)C1=O GAVHQOUUSHBDAA-UHFFFAOYSA-N 0.000 description 2
- RKFCJJGVLBBOQC-UHFFFAOYSA-N 3-ethenyl-2h-1,3-thiazole Chemical compound C=CN1CSC=C1 RKFCJJGVLBBOQC-UHFFFAOYSA-N 0.000 description 2
- UACBZRBYLSMNGV-UHFFFAOYSA-N 3-ethoxypropyl prop-2-enoate Chemical compound CCOCCCOC(=O)C=C UACBZRBYLSMNGV-UHFFFAOYSA-N 0.000 description 2
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 2
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 2
- JSZCJJRQCFZXCI-UHFFFAOYSA-N 6-prop-2-enoyloxyhexanoic acid Chemical compound OC(=O)CCCCCOC(=O)C=C JSZCJJRQCFZXCI-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 101100256177 Stachybotrys chartarum (strain CBS 109288 / IBT 7711) SAT10 gene Proteins 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 125000005670 ethenylalkyl group Chemical group 0.000 description 2
- 125000001033 ether group Chemical group 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
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- 239000001530 fumaric acid Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 2
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- MKIJJIMOAABWGF-UHFFFAOYSA-N methyl 2-sulfanylacetate Chemical compound COC(=O)CS MKIJJIMOAABWGF-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 2
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical class C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
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- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
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- 238000010186 staining Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
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- 125000000542 sulfonic acid group Chemical group 0.000 description 1
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- YXIMCNGUIIEJMO-UHFFFAOYSA-N tert-butyl 2-sulfanylacetate Chemical compound CC(C)(C)OC(=O)CS YXIMCNGUIIEJMO-UHFFFAOYSA-N 0.000 description 1
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
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- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical group CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical group CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
- G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
- G02B5/3033—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133528—Polarisers
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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Abstract
本發明提供一種具備高耐久性與再加工性之附黏著劑層之偏光膜。本發明提供一種附黏著劑層之偏光膜,其係具備偏光膜及黏著劑層者,且上述黏著劑層包含基礎聚合物及聚矽氧低聚物,上述基礎聚合物為(甲基)丙烯酸系聚合物,上述聚矽氧低聚物相對於上述(甲基)丙烯酸系聚合物100重量份包含0.1~20重量份,上述聚矽氧低聚物之Tg為-50℃以上100℃以下,側鏈之聚矽氧官能基當量為1000~20000 g/mol,重量平均分子量為10000以上300000以下。The present invention provides a polarizing film with an adhesive layer that has high durability and reworkability. The present invention provides a polarizing film with an adhesive layer, which is provided with a polarizing film and an adhesive layer, and the adhesive layer includes a base polymer and a polysiloxane oligomer, and the base polymer is (meth)acrylic acid. is a polymer, the above-mentioned polysiloxane oligomer contains 0.1 to 20 parts by weight relative to 100 parts by weight of the above-mentioned (meth)acrylic polymer, and the Tg of the above-mentioned polysiloxane oligomer is -50°C or more and 100°C or less, The polysiloxy functional group equivalent of the side chain is 1,000 to 20,000 g/mol, and the weight average molecular weight is between 10,000 and 300,000.
Description
本發明係關於一種附黏著劑層之偏光膜。The invention relates to a polarizing film with an adhesive layer.
對於液晶顯示裝置,根據其圖像形成方式於形成液晶面板表面之玻璃基板之兩側配置偏光膜不可或缺。偏光膜一般使用利用聚乙烯醇系接著劑等在包含聚乙烯醇系膜與碘等二色性材料之偏光元件之單面或雙面貼合有保護膜者。For a liquid crystal display device, it is indispensable to arrange polarizing films on both sides of the glass substrate that forms the surface of the liquid crystal panel depending on the image forming method. Polarizing films generally use a protective film bonded to one or both sides of a polarizing element containing a polyvinyl alcohol-based film and a dichroic material such as iodine using a polyvinyl alcohol-based adhesive or the like.
將上述偏光膜貼合於液晶單元等時,通常使用黏著劑。又,黏著劑由於具有能瞬時固定偏光膜,且對於固著偏光膜無需乾燥步驟等優點,故而預先設置於偏光膜之單面作為黏著劑層。即,對於偏光膜之貼合一般使用附黏著劑層之偏光膜(專利文獻1及2)。When bonding the above-mentioned polarizing film to a liquid crystal cell, etc., an adhesive is usually used. In addition, since the adhesive has the advantage of being able to instantly fix the polarizing film and does not require a drying step for fixing the polarizing film, it is pre-disposed on one side of the polarizing film as an adhesive layer. That is, a polarizing film with an adhesive layer attached is generally used for laminating polarizing films (Patent Documents 1 and 2).
又,於使偏光膜或附黏著劑層之偏光膜貼合於液晶面板之玻璃基板之情形時,要求耐久性,例如要求於作為環境促進試驗通常進行之利用加熱及加濕等之耐久試驗中,不發生因黏著劑層所導致之剝落或隆起等不良情況。In addition, when the polarizing film or the polarizing film with an adhesive layer is bonded to the glass substrate of the liquid crystal panel, durability is required, for example, in a durability test using heating and humidification that is commonly performed as an environmental acceleration test. , undesirable phenomena such as peeling or swelling caused by the adhesive layer will not occur.
如此,用於偏光膜之黏著劑被要求高耐久性,另一方面,為了改善因貼合偏光板時之步驟不良所產生之缺陷或貼合失誤,再加工性之期望亦提高。近年來,根據面板之薄型化或大型化之趨勢,面板之再生期望變高,因此再加工性為重要之項目。然而,高耐久性與再加工性存在取捨關係,為非常難兼顧之特性。 [先前技術文獻] [專利文獻]In this way, adhesives used for polarizing films are required to have high durability. On the other hand, in order to improve defects or bonding errors caused by poor steps when bonding polarizing plates, expectations for reworkability have also increased. In recent years, as panels become thinner or larger, expectations for panel recycling have increased, so reprocessability is an important item. However, there is a trade-off between high durability and reworkability, which is a very difficult characteristic to balance. [Prior technical documents] [Patent documents]
[專利文獻1]日本專利特開2011-219765號 [專利文獻2]日本專利特開2018-169612號[Patent Document 1] Japanese Patent Publication No. 2011-219765 [Patent Document 2] Japanese Patent Publication No. 2018-169612
[發明所欲解決之問題][Problem to be solved by the invention]
鑒於上述背景技術,強烈期望一種能夠兼備存在取捨關係之高耐久性與再加工性之附黏著劑層之偏光膜。 [解決問題之技術手段]In view of the above background technology, there is a strong demand for a polarizing film that can have an adhesive layer that has a trade-off relationship between high durability and reworkability. [Technical means to solve problems]
本發明者等人進行了專心研究,結果發現藉由本發明之附黏著劑層之偏光膜能夠解決上述課題,從而完成本發明。The present inventors conducted intensive research and found that the above-mentioned problems can be solved by the polarizing film with an adhesive layer of the present invention, and thus completed the present invention.
即,本發明包括下述實施形態。That is, the present invention includes the following embodiments.
(1)一種附黏著劑層之偏光膜,其係具備偏光膜及黏著劑層者,且 上述黏著劑層包含基礎聚合物及聚矽氧低聚物Ps, 上述基礎聚合物為(甲基)丙烯酸系聚合物, 上述聚矽氧低聚物Ps相對於上述(甲基)丙烯酸系聚合物100重量份包含0.1~20重量份, 上述聚矽氧低聚物Ps之Tg為-50℃以上100℃以下,側鏈之聚矽氧官能基當量為1000~20000 g/mol,重量平均分子量Mw為10000以上300000以下。(1) A polarizing film with an adhesive layer, which has a polarizing film and an adhesive layer, and the adhesive layer includes a base polymer and a polysiloxane oligomer Ps, and the base polymer is (methyl) Acrylic polymer, the above-mentioned polysilicone oligomer Ps contains 0.1 to 20 parts by weight relative to 100 parts by weight of the above-mentioned (meth)acrylic polymer, and the Tg of the above-mentioned polysilicone oligomer Ps is -50°C or above 100 ℃ or below, the polysiloxy functional group equivalent of the side chain is 1000~20000 g/mol, and the weight average molecular weight Mw is between 10000 and 300000.
(2)如上述(1)中記載之附黏著劑層之偏光膜,其中上述聚矽氧低聚物Ps包含具有聚有機矽氧烷骨架之單體S1、及均聚物之玻璃轉移溫度為-70℃以上180℃以下之單體作為單體單元。(2) The polarizing film with an adhesive layer as described in (1) above, wherein the polysiloxane oligomer Ps includes monomer S1 having a polyorganosiloxane skeleton, and the glass transition temperature of the homopolymer is -Monomers above 70℃ and below 180℃ are used as monomer units.
(3)如上述(1)或(2)中記載之附黏著劑層之偏光膜,其含有均聚物之玻璃轉移溫度為-60℃以上0℃以下之(甲基)丙烯酸烷基酯(A)80重量%以上作為上述基礎聚合物之單體單元。(3) The polarizing film with an adhesive layer as described in the above (1) or (2), which contains an alkyl (meth)acrylate (meth)acrylate ( A) More than 80% by weight as monomer units of the above-mentioned base polymer.
(4)如上述(3)中記載之附黏著劑層之偏光膜,其進而含有選自由含羧基單體(b1)及含氮單體(b2)所組成之群中之至少1種極性單體(B)0~20重量%作為上述基礎聚合物之單體單元。(4) The polarizing film with an adhesive layer as described in (3) above, which further contains at least one polar monomer selected from the group consisting of a carboxyl group-containing monomer (b1) and a nitrogen-containing monomer (b2). 0 to 20% by weight of body (B) is used as the monomer unit of the above-mentioned base polymer.
(5)如上述(1)至(4)中任一項記載之附黏著劑層之偏光膜,其中上述基礎聚合物之重量平均分子量Mw為50~250萬。(5) The polarizing film with an adhesive layer as described in any one of the above (1) to (4), wherein the weight average molecular weight Mw of the above-mentioned base polymer is 500,000 to 2.5 million.
(6)如上述(1)至(5)中任一項記載之附黏著劑層之偏光膜,其中上述聚矽氧低聚物Ps之熔融溫度為0~100℃。 [發明之效果](6) The polarizing film with an adhesive layer as described in any one of (1) to (5) above, wherein the melting temperature of the polysiloxy oligomer Ps is 0 to 100°C. [The effect of the invention]
根據本發明,可提供一種能夠賦予剛貼合後之再加工性,並且加熱後黏著力上升能夠賦予耐久性之附黏著劑層之偏光膜。According to the present invention, it is possible to provide a polarizing film with an adhesive layer that can provide reworkability immediately after lamination and can provide durability by increasing the adhesive force after heating.
以下,對本發明之較佳之實施形態進行說明。業者可基於與本說明書中記載之發明之實施相關的教示及申請時之技術常識來理解本說明書中特別提及之事項以外且本發明之實施所需之情況。本發明可基於本說明書中揭示之內容及本領域中之技術常識實施。Hereinafter, preferred embodiments of the present invention will be described. Those in the industry can understand the circumstances necessary for the implementation of the invention other than the matters specifically mentioned in this specification based on the teachings related to the implementation of the invention described in this specification and the technical common sense at the time of filing. The present invention can be implemented based on the content disclosed in this specification and the technical common sense in the field.
<附黏著劑層之偏光膜> 本發明之附黏著劑層之偏光膜具備偏光膜及黏著劑層。於本發明中,黏著劑層可存在於偏光膜之單面,亦可存在於雙面。<Polarizing film with adhesive layer> The polarizing film with adhesive layer of the present invention includes a polarizing film and an adhesive layer. In the present invention, the adhesive layer can be present on one side of the polarizing film or on both sides.
將一實施形態之附黏著劑層之偏光膜之構造模式性地示於圖1。該附黏著劑層之偏光膜10構成為具備偏光膜3、及設置於其單面之黏著劑層4之附黏著劑層之偏光膜。於圖1中,偏光膜3包含偏光元件1及設置於偏光元件1之兩面之保護膜2、2',但保護膜亦可僅設置於偏光元件之單面。黏著劑層4固定地設置於偏光膜3之單側,即不意圖將黏著劑層4自該偏光膜3分離地設置。附黏著劑層之偏光膜10係將黏著劑層4貼附於被黏著體而使用。作為隔片5,例如可較佳地使用如下構成者,即,藉由將利用剝離處理劑所得之剝離層設置於片狀基材(襯墊基材)之單面而使該單面成為剝離面。附黏著劑層之偏光膜之構造並不限定於圖1中模式性示出之實施形態。The structure of a polarizing film with an adhesive layer according to one embodiment is schematically shown in FIG. 1 . The polarizing film 10 with an adhesive layer is configured as a polarizing film including a polarizing film 3 and an adhesive layer 4 provided on one side of the polarizing film. In Figure 1, the polarizing film 3 includes a polarizing element 1 and protective films 2 and 2' provided on both sides of the polarizing element 1, but the protective film can also be provided on only one side of the polarizing element. The adhesive layer 4 is fixedly disposed on one side of the polarizing film 3 , that is, there is no intention to dispose the adhesive layer 4 separately from the polarizing film 3 . The polarizing film 10 with an adhesive layer is used to attach the adhesive layer 4 to an adherend. As the separator 5, for example, a structure in which a release layer obtained by using a release treatment agent is provided on one side of a sheet-like base material (gasket base material) so that the one side becomes a release layer can be suitably used. noodle. The structure of the polarizing film with the adhesive layer is not limited to the embodiment schematically shown in FIG. 1 .
<偏光元件> 偏光元件並無特別限定,可使用各種偏光元件。作為偏光元件,例如可列舉:使聚乙烯醇系膜、部分縮甲醛化聚乙烯醇系膜、乙烯-乙酸乙烯酯共聚物系部分皂化膜等親水性高分子膜吸附碘或二色性染料之二色性物質並單軸延伸而得者;聚乙烯醇之脫水處理物或聚氯乙烯之脫氯化氫處理物等多烯系配向膜等。其等之中,較佳為包含聚乙烯醇系膜及碘等二色性物質之偏光元件。該等偏光元件之厚度並無特別限制,一般為2~25 μm。<Polarizing element> The polarizing element is not particularly limited, and various polarizing elements can be used. Examples of polarizing elements include hydrophilic polymer films such as polyvinyl alcohol-based films, partially formalized polyvinyl alcohol-based films, and ethylene-vinyl acetate copolymer-based partially saponified films that adsorb iodine or dichroic dyes. Dichroic substances obtained by uniaxial extension; polyene alignment films such as dehydrated polyvinyl alcohol or dehydrochlorinated polyvinyl chloride. Among them, a polarizing element containing a polyvinyl alcohol-based film and a dichroic material such as iodine is preferred. The thickness of these polarizing elements is not particularly limited, generally ranging from 2 to 25 μm.
由碘將聚乙烯醇系膜染色並單軸延伸而得之偏光元件例如可藉由如下方式製作,即,藉由將聚乙烯醇系膜浸漬於碘之水溶液中而進行染色,並將其延伸至原長之3~7倍。亦可視需要浸漬於硼酸或可包含硫酸鋅、氯化鋅等之碘化鉀等之水溶液中。進而,亦可視需要於染色前將聚乙烯醇系膜浸漬於水中進行水洗。藉由對聚乙烯醇系膜進行水洗,能夠將聚乙烯醇系膜表面之污垢或抗黏連劑洗淨,除此以外,藉由使聚乙烯醇系膜膨潤,亦具有防止染色不均等不均勻之效果。延伸可於由碘進行染色之後進行,亦可一面進行染色一面進行延伸,又,亦可於延伸後由碘進行染色。於硼酸或碘化鉀等之水溶液或水浴中均可進行延伸。A polarizing element obtained by dyeing a polyvinyl alcohol-based film with iodine and uniaxially stretching it can be produced, for example, by immersing a polyvinyl alcohol-based film in an aqueous solution of iodine, dyeing it, and stretching it. to 3 to 7 times its original length. It can also be immersed in boric acid or an aqueous solution of potassium iodide or the like that may contain zinc sulfate, zinc chloride, etc. if necessary. Furthermore, if necessary, the polyvinyl alcohol-based film may be immersed in water and washed before dyeing. By washing the polyvinyl alcohol-based film, the dirt or anti-adhesive agent on the surface of the polyvinyl alcohol-based film can be washed away. In addition, by swelling the polyvinyl alcohol-based film, it can also prevent uneven dyeing and other uneven staining. Uniform effect. The stretching may be carried out after dyeing with iodine, the stretching may be carried out while dyeing, or the dyeing with iodine may be carried out after stretching. It can be extended in aqueous solutions such as boric acid or potassium iodide or in water baths.
<黏著劑層> 本發明中所使用之黏著劑層包含基礎聚合物及聚矽氧低聚物Ps。<Adhesive layer> The adhesive layer used in the present invention includes a base polymer and polysiloxane oligomer Ps.
構成本發明中所使用之黏著劑層之黏著劑並無特別限定,可使用橡膠系黏著劑、丙烯酸系黏著劑、聚矽氧系黏著劑、胺基甲酸酯系黏著劑、乙烯基烷基醚系黏著劑、聚乙烯醇系黏著劑、聚乙烯吡咯啶酮系黏著劑、聚丙烯醯胺系黏著劑、纖維素系黏著劑等。可根據所使用之黏著劑使用各種基礎聚合物。The adhesive constituting the adhesive layer used in the present invention is not particularly limited. Rubber adhesives, acrylic adhesives, polysiloxane adhesives, urethane adhesives, and vinyl alkyl adhesives can be used. Ether-based adhesives, polyvinyl alcohol-based adhesives, polyvinylpyrrolidone-based adhesives, polyacrylamide-based adhesives, cellulose-based adhesives, etc. A variety of base polymers can be used depending on the adhesive used.
上述黏著劑中,較佳地使用光學透明性優異,展現出適當之濡濕性、凝聚性及接著性之黏著特性,且耐候性或耐熱性等優異者。作為展現出此種特徵者,較佳地使用丙烯酸系黏著劑。作為丙烯酸系黏著劑之基礎聚合物,使用(甲基)丙烯酸系聚合物。再者,(甲基)丙烯酸酯包括丙烯酸酯及/或甲基丙烯酸酯。Among the above-mentioned adhesives, those having excellent optical transparency, exhibiting appropriate adhesive properties of wettability, cohesiveness, and adhesiveness, and having excellent weather resistance or heat resistance are preferably used. As one exhibiting such characteristics, an acrylic adhesive is preferably used. As the base polymer of the acrylic adhesive, a (meth)acrylic polymer is used. In addition, (meth)acrylate includes acrylate and/or methacrylate.
<基礎聚合物> 於本發明中,作為基礎聚合物,通常使用(甲基)丙烯酸系聚合物。<Base polymer> In the present invention, a (meth)acrylic polymer is generally used as the base polymer.
(1)(甲基)丙烯酸烷基酯(A) (甲基)丙烯酸系聚合物通常含有作為單體單元之(甲基)丙烯酸烷基酯作為主成分。作為構成(甲基)丙烯酸系聚合物之主骨架之(甲基)丙烯酸烷基酯(A),可使用直鏈狀或支鏈狀之C1~C20之(甲基)丙烯酸烷基酯。作為C1~C20之(甲基)丙烯酸烷基酯,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸異十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等,但並不限定於該等。該等(甲基)丙烯酸烷基酯可單獨使用或者組合使用。(1) (Meth)acrylic acid alkyl ester (A) (Meth)acrylic acid-based polymers usually contain (meth)acrylic acid alkyl ester as a monomer unit as a main component. As the (meth)acrylic acid alkyl ester (A) constituting the main skeleton of the (meth)acrylic polymer, a linear or branched C1 to C20 (meth)acrylic acid alkyl ester can be used. Examples of C1 to C20 (meth)acrylic acid alkyl esters include: (meth)acrylic acid methyl ester, (meth)acrylic acid ethyl ester, (meth)acrylic acid ethyl ester, (meth)acrylic acid propyl ester, Isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, 2-butyl (meth)acrylate, 3-butyl (meth)acrylate, (meth)acrylate )Amyl acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, Isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, eleven (meth)acrylate Alkyl ester, dodecyl (meth)acrylate, tridecyl (meth)acrylate, myristyl (meth)acrylate, pentadecyl (meth)acrylate, (meth)acrylate Cetyl acrylate, heptadecyl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, nineteen (meth)acrylate Alkyl ester, eicosanyl (meth)acrylate, etc., but are not limited to these. These alkyl (meth)acrylates can be used alone or in combination.
於本發明之一實施形態中,(甲基)丙烯酸系聚合物較佳為可包含丙烯酸正丁酯(BA)及丙烯酸2-乙基己酯(2EHA)中之一種或兩種作為單體單元。作為可較佳地用作(甲基)丙烯酸系聚合物之單體單元之其他(甲基)丙烯酸烷基酯之例,可列舉:丙烯酸甲酯、甲基丙烯酸甲酯(MMA)、甲基丙烯酸正丁酯(BMA)、甲基丙烯酸2-乙基己酯(2EHMA)等。In one embodiment of the present invention, the (meth)acrylic polymer preferably contains one or both of n-butyl acrylate (BA) and 2-ethylhexyl acrylate (2EHA) as monomer units. . Examples of other (meth)acrylic acid alkyl esters that can be preferably used as monomer units of (meth)acrylic polymers include: methyl acrylate, methyl methacrylate (MMA), methyl acrylate n-Butyl acrylate (BMA), 2-ethylhexyl methacrylate (2EHMA), etc.
於本發明之一實施形態中,用作基礎聚合物之單體單元之(甲基)丙烯酸烷基酯(A)之均聚物之玻璃轉移溫度為-80℃以上0℃以下。(甲基)丙烯酸烷基酯(A)之均聚物之玻璃轉移溫度較佳為-70℃~-5℃,更佳為-60℃~-10℃。In one embodiment of the present invention, the glass transition temperature of the homopolymer of the alkyl (meth)acrylate (A) used as the monomer unit of the base polymer is -80°C or more and not more than 0°C. The glass transition temperature of the homopolymer of alkyl (meth)acrylate (A) is preferably -70°C to -5°C, more preferably -60°C to -10°C.
於本發明之一實施形態中,用作基礎聚合物之單體單元之(甲基)丙烯酸烷基酯(A)以基礎聚合物之重量為基準可含有80重量%以上。(甲基)丙烯酸烷基酯(A)以基礎聚合物之重量為基準,較佳為85重量%以上,更佳為90重量%以上。In one embodiment of the present invention, the alkyl (meth)acrylate (A) used as the monomer unit of the base polymer may contain 80% by weight or more based on the weight of the base polymer. The alkyl (meth)acrylate (A) is preferably 85% by weight or more based on the weight of the base polymer, more preferably 90% by weight or more.
於本發明之較佳之實施形態中,可含有均聚物之玻璃轉移溫度為-60℃以上0℃以下之(甲基)丙烯酸烷基酯(A)80重量%以上作為基礎聚合物之單體單元。In a preferred embodiment of the present invention, more than 80% by weight of (meth)acrylic acid alkyl ester (A) whose homopolymer has a glass transition temperature of -60°C or more and 0°C or less can be contained as a monomer of the base polymer. unit.
於本發明之一實施形態中,(甲基)丙烯酸系聚合物除了包含作為主成分之(甲基)丙烯酸烷基酯(A)以外,亦可視需要進而包括可與(甲基)丙烯酸烷基酯共聚之其他單體(共聚性單體)。作為共聚性單體,可較佳地使用具有極性基(例如羧基、羥基、含氮原子之環等)之單體。具有極性基之單體可有益於將交聯點導入至丙烯酸系聚合物,或者提高(甲基)丙烯酸系聚合物之凝聚力。共聚性單體可單獨使用1種,或將2種以上組合使用。In one embodiment of the present invention, in addition to the (meth)acrylic acid alkyl ester (A) as the main component, the (meth)acrylic acid polymer may further include (meth)acrylic acid alkyl esters that can be combined with the (meth)acrylic acid alkyl ester if necessary. Other monomers (copolymerizable monomers) for ester copolymerization. As the copolymerizable monomer, a monomer having a polar group (such as a carboxyl group, a hydroxyl group, a nitrogen atom-containing ring, etc.) can be preferably used. Monomers with polar groups can be beneficial in introducing cross-linking points into acrylic polymers or improving the cohesion of (meth)acrylic polymers. A copolymerizable monomer can be used individually by 1 type, or in combination of 2 or more types.
作為共聚性單體之非限定性具體例,可列舉:含羧基單體、含酸酐基單體、含羥基單體、含磺酸基或磷酸基之單體、含環氧基單體、含氰基單體、含異氰酸基單體、含醯胺基單體、具有含氮原子之環之單體、具有丁二醯亞胺骨架之單體、順丁烯二醯亞胺類、伊康醯亞胺類、(甲基)丙烯酸胺基烷基酯類、(甲基)丙烯酸烷氧基烷基酯類、乙烯酯類、乙烯醚類、芳香族乙烯系化合物、烯烴類、具有脂環式烴基之(甲基)丙烯酸酯、具有芳香族烴基之(甲基)丙烯酸酯,此外可列舉:(甲基)丙烯酸四氫呋喃甲酯等含雜環之(甲基)丙烯酸酯、含氯乙烯或氟原子之(甲基)丙烯酸酯等含鹵素原子之(甲基)丙烯酸酯、聚矽氧(甲基)丙烯酸酯等含矽原子之(甲基)丙烯酸酯、由萜烯化合物衍生物醇獲得之(甲基)丙烯酸酯等。Non-limiting specific examples of copolymerizable monomers include carboxyl group-containing monomers, acid anhydride group-containing monomers, hydroxyl group-containing monomers, sulfonic acid group- or phosphate group-containing monomers, epoxy group-containing monomers, Cyano monomers, isocyanate-containing monomers, amide-containing monomers, monomers with nitrogen-containing rings, monomers with succinimide skeleton, maleimides, Ikonium imines, (meth)acrylic acid aminoalkyl esters, (meth)acrylic acid alkoxyalkyl esters, vinyl esters, vinyl ethers, aromatic vinyl compounds, olefins, etc. (Meth)acrylates with alicyclic hydrocarbon groups, (meth)acrylates with aromatic hydrocarbon groups, and heterocyclic (meth)acrylates such as (meth)acrylic acid tetrahydrofuran methyl ester, chlorine-containing (meth)acrylates containing halogen atoms such as ethylene or fluorine atom-containing (meth)acrylates, (meth)acrylates containing silicon atoms such as polysiloxy (meth)acrylates, derivatives of terpene compounds (meth)acrylate obtained from alcohol.
作為含羧基單體,例如可列舉:丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸、異丁烯酸等; 作為含酸酐基單體,例如可列舉:順丁烯二酸酐、伊康酸酐; 作為含羥基單體,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)甲酯等(甲基)丙烯酸羥基烷基酯等; 作為含磺酸基或磷酸基之單體,例如可列舉:苯乙烯磺酸、烯丙基磺酸、乙烯基磺酸鈉、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙基酯、(甲基)丙烯醯氧基萘磺酸、磷酸2-羥基乙基丙烯醯基酯等; 作為含環氧基單體,例如可列舉:(甲基)丙烯酸縮水甘油酯或(甲基)丙烯酸-2-乙基縮水甘油醚等含環氧基之丙烯酸酯、烯丙基縮水甘油醚、(甲基)丙烯酸縮水甘油醚等; 作為含氰基單體,例如可列舉:丙烯腈、甲基丙烯腈等; 作為含異氰酸基單體,例如可列舉:(甲基)丙烯酸2-異氰酸基乙酯等; 作為含醯胺基單體,例如可列舉:(甲基)丙烯醯胺;N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二丙基(甲基)丙烯醯胺、N,N-二異丙基(甲基)丙烯醯胺、N,N-二(正丁基)(甲基)丙烯醯胺、N,N-二(第三丁基)(甲基)丙烯醯胺等N,N-二烷基(甲基)丙烯醯胺;N-乙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-正丁基(甲基)丙烯醯胺等N-烷基(甲基)丙烯醯胺;N-乙烯基乙醯胺等N-乙烯基羧醯胺類;此外可列舉:N,N-二甲基胺基丙基(甲基)丙烯醯胺、羥基乙基丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥乙基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-甲氧基乙基(甲基)丙烯醯胺、N-丁氧甲基(甲基)丙烯醯胺、N-(甲基)丙烯醯基𠰌啉等; 作為具有含氮原子之環之單體,例如可列舉:N-乙烯基-2-吡咯啶酮、N-甲基乙烯基吡咯啶酮、N-乙烯基吡啶、N-乙烯基哌啶酮、N-乙烯基嘧啶、N-乙烯基哌𠯤、N-乙烯基吡𠯤、N-乙烯基吡咯、N-乙烯基咪唑、N-乙烯基㗁唑、N-(甲基)丙烯醯基-2-吡咯啶酮、N-(甲基)丙烯醯基哌啶、N-(甲基)丙烯醯基吡咯啶、N-乙烯基𠰌啉、N-乙烯基-3-𠰌啉酮、N-乙烯基-2-己內醯胺、N-乙烯基-1,3-㗁𠯤-2-酮、N-乙烯基-3,5-𠰌啉二酮、N-乙烯基吡唑、N-乙烯基異㗁唑、N-乙烯基噻唑、N-乙烯基異噻唑、N-乙烯基嗒𠯤等(例如,N-乙烯基-2-己內醯胺等內醯胺類); 作為具有丁二醯亞胺骨架之單體,例如可列舉:N-(甲基)丙烯醯氧基亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-8-氧基六亞甲基丁二醯亞胺等; 作為順丁烯二醯亞胺類,例如可列舉:N-環己基順丁烯二醯亞胺、N-異丙基順丁烯二醯亞胺、N-月桂基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺等; 作為伊康醯亞胺類,例如可列舉:N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-環己基伊康醯亞胺、N-月桂基伊康醯亞胺等; 作為(甲基)丙烯酸胺基烷基酯類,例如可列舉:(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸N,N-二乙基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯; 作為(甲基)丙烯酸烷氧基烷基酯類,例如可列舉:(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙基、(甲基)丙烯酸丙氧基乙酯、(甲基)丙烯酸丁氧基乙酯、(甲基)丙烯酸乙氧基丙酯等; 作為乙烯酯類,例如可列舉:乙酸乙烯酯、丙酸乙烯酯等; 作為乙烯醚類,例如可列舉:甲基乙烯醚或乙基乙烯醚等乙烯基烷基醚; 作為芳香族乙烯系化合物,例如可列舉:苯乙烯、α-甲基苯乙烯、乙烯基甲苯等; 作為烯烴類,例如可列舉:乙烯、丁二烯、異戊二烯、異丁烯等; 作為具有脂環式烴基之(甲基)丙烯酸酯,例如可列舉:(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸雙環戊酯等; 作為具有芳香族烴基之(甲基)丙烯酸酯,例如可列舉:(甲基)丙烯酸苯基酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苄酯等。Examples of carboxyl group-containing monomers include: acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, methacrylic acid, etc.; Examples of the acid anhydride group-containing monomer include maleic anhydride and itaconic anhydride; Examples of the hydroxyl group-containing monomer include: (meth)acrylic acid 2-hydroxyethyl, (meth)acrylic acid 2-hydroxyl Propyl ester, 2-hydroxybutyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, (meth)acrylate ) 8-hydroxyoctyl acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate, etc. (methyl )Hydroxyalkyl acrylate, etc.; As a monomer containing a sulfonic acid group or a phosphate group, examples include: styrene sulfonic acid, allyl sulfonic acid, sodium vinyl sulfonate, 2-(meth)acrylamide -2-Methylpropanesulfonic acid, (meth)acrylamidepropanesulfonic acid, (meth)sulfopropyl acrylate, (meth)acryloxynaphthalenesulfonic acid, 2-hydroxyethylacrylylphosphate esters, etc.; As the epoxy group-containing monomer, for example, epoxy group-containing acrylates such as (meth)glycidyl acrylate or (meth)acrylic acid-2-ethyl glycidyl ether, allyl Glycidyl ether, (meth)acrylic acid glycidyl ether, etc.; Examples of the cyano group-containing monomer include: acrylonitrile, methacrylonitrile, etc.; Examples of the isocyanate group-containing monomer include: (methyl ) 2-isocyanatoethyl acrylate, etc.; Examples of the amide group-containing monomer include: (meth)acrylamide; N,N-dimethyl(meth)acrylamide, N,N -Diethyl(meth)acrylamide, N,N-dipropyl(meth)acrylamide, N,N-diisopropyl(meth)acrylamide, N,N-bis(n- Butyl)(meth)acrylamide, N,N-di(tert-butyl)(meth)acrylamide and other N,N-dialkyl(meth)acrylamide; N-ethyl( N-alkyl (meth)acrylamide, N-isopropyl(meth)acrylamide, N-butyl(meth)acrylamide, N-n-butyl(meth)acrylamide, etc. Meth)acrylamide; N-vinylcarboxamides such as N-vinylacetamide; in addition, N,N-dimethylaminopropyl (meth)acrylamide, hydroxyethyl Acrylamide, N-hydroxymethyl(meth)acrylamide, N-hydroxyethyl(meth)acrylamide, N-hydroxymethylpropane(meth)acrylamide, N-methoxymethane (meth)acrylamide, N-methoxyethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, N-(meth)acrylamide, etc. ; As a monomer having a ring containing a nitrogen atom, for example, N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine, N-vinylpiperidone , N-vinyl pyrimidine, N-vinyl piperazine, N-vinyl pyrrole, N-vinyl pyrrole, N-vinylimidazole, N-vinyl 㗁azole, N-(meth)acrylyl- 2-pyrrolidinone, N-(meth)acrylylpiperidine, N-(meth)acrylylpyrrolidine, N-vinyl𠰌line, N-vinyl-3-𠰌linone, N- Vinyl-2-caprolactam, N-vinyl-1,3-㗁𠯤-2-one, N-vinyl-3,5-𠰌lindione, N-vinylpyrazole, N-ethylene Isothiazole, N-vinyl thiazole, N-vinyl isothiazole, N-vinyl thiazole, etc. (for example, lactams such as N-vinyl-2-caprolactam); Examples of monomers with an imine skeleton include: N-(meth)acryloxymethylenesuccinimide, N-(meth)acrylyl-6-oxyhexamethylenebutane Diamine, N-(meth)acryl-8-oxyhexamethylenesuccinimine, etc.; Examples of maleimines include: N-cyclohexylmaleimine Endedimide, N-isopropylmaleimide, N-laurylmaleimide, N-phenylmaleimide, etc.; as econimide Classes, for example, include: N-methyliconimide, N-ethyl itonimide, N-butyl itonimide, N-octyl itonimide, N-2- Ethylhexyl itaconidimide, N-cyclohexyl itaconidimide, N-lauryl itaconidimide, etc.; Examples of (meth)acrylic acid aminoalkyl esters include: (meth) )Aminoethyl acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-diethylaminoethyl (meth)acrylate, tert-butyl (meth)acrylate Aminoethyl ester; Examples of (meth)acrylic acid alkoxyalkyl esters include: (meth)acrylic acid methoxyethyl, (meth)acrylic acid ethoxyethyl, (meth)acrylic acid Propoxyethyl ester, (meth)butoxyethyl acrylate, (meth)ethoxypropyl acrylate, etc.; As vinyl esters, examples include: vinyl acetate, vinyl propionate, etc.; As ethylene Examples of ethers include vinyl alkyl ethers such as methyl vinyl ether and ethyl vinyl ether; examples of aromatic vinyl compounds include styrene, α-methylstyrene, vinyltoluene, etc.; Examples of olefins include: ethylene, butadiene, isoprene, isobutylene, etc. Examples of (meth)acrylate having an alicyclic hydrocarbon group include: (meth)cyclopentyl acrylate, (meth)acrylate base) cyclohexyl acrylate, (meth)isoacrylate, dicyclopentyl (meth)acrylate, etc.; Examples of (meth)acrylate having an aromatic hydrocarbon group include: (meth)benzene acrylate ester, phenoxyethyl (meth)acrylate, benzyl (meth)acrylate, etc.
於使用此種共聚性單體之情形時,其使用量並無特別限定,通常適宜設為單體成分總量之0.01重量%以上。就更好地發揮使用共聚性單體所獲得之效果之觀點而言,可將共聚性單體之使用量設為單體成分總量之0.1重量%以上,亦可設為1重量%以上。又,共聚性單體之使用量可設為單體成分總量之50重量%以下,較佳為設為40重量%以下。藉此,能夠防止黏著劑之凝聚力過高,能夠提高常溫(25℃)下之觸黏感。When such a copolymerizable monomer is used, the usage amount is not particularly limited, but is usually preferably 0.01% by weight or more of the total amount of monomer components. From the viewpoint of better exerting the effect obtained by using the copolymerizable monomer, the usage amount of the copolymerizable monomer may be 0.1% by weight or more of the total amount of the monomer components, or may be 1% by weight or more. In addition, the usage amount of the copolymerizable monomer can be 50% by weight or less of the total amount of monomer components, preferably 40% by weight or less. This can prevent the cohesion of the adhesive from being too high and improve the tackiness at normal temperature (25°C).
於本發明之一實施形態中,(甲基)丙烯酸系聚合物除了包含作為主成分之(甲基)丙烯酸烷基酯以外,還可視需要包含如上所述之含羥基單體(典型為含羥基之(甲基)丙烯酸系單體)作為單體單元。作為含羥基單體,如上所述,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)甲酯等(甲基)丙烯酸羥基烷基酯等,可較佳地使用(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯等。其中,作為較佳之例,可列舉:丙烯酸2-羥基乙酯(HEA)、丙烯酸4-羥基丁酯(4HBA)。藉由使用含羥基單體,能夠調整黏著劑之凝聚力或極性,從而提高加熱後黏著力。又,含羥基單體藉由提高黏著劑層之親水性,亦可有益於抑制因濕氣所導致之透明性下降。於含有含羥基單體之情形時,含羥基單體之使用量並無特別限制,通常以用以製備(甲基)丙烯酸系聚合物之單體單元總量為基準,例如可設為0.01重量%以上、0.1重量%以上、0.5重量%以上等。In one embodiment of the present invention, in addition to the alkyl (meth)acrylate as the main component, the (meth)acrylic polymer may also optionally contain the above-mentioned hydroxyl-containing monomer (typically a hydroxyl-containing monomer). (meth)acrylic monomer) as the monomer unit. Examples of the hydroxyl-containing monomer include: (meth)acrylic acid 2-hydroxyethyl ester, (meth)acrylic acid 2-hydroxypropyl ester, (meth)acrylic acid 2-hydroxybutyl ester, (meth)acrylic acid 2-hydroxybutyl ester, (meth)acrylic acid 2-hydroxybutyl ester, (meth)acrylic acid 2-hydroxybutyl ester )3-hydroxypropyl acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate esters, (meth)acrylic acid hydroxyalkyl esters such as 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate, etc., (meth) can be preferably used 2-hydroxyethyl acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, etc. Among them, preferred examples include 2-hydroxyethyl acrylate (HEA) and 4-hydroxybutyl acrylate (4HBA). By using hydroxyl-containing monomers, the cohesion or polarity of the adhesive can be adjusted, thereby improving the adhesion after heating. In addition, the hydroxyl-containing monomer can also be beneficial in suppressing the decrease in transparency caused by moisture by improving the hydrophilicity of the adhesive layer. When a hydroxyl-containing monomer is included, the usage amount of the hydroxyl-containing monomer is not particularly limited. It is usually based on the total amount of monomer units used to prepare the (meth)acrylic polymer, for example, it can be set to 0.01 weight. % or more, 0.1 wt% or more, 0.5 wt% or more, etc.
又,於本發明之一實施形態中,(甲基)丙烯酸系聚合物除了含有作為主成分之(甲基)丙烯酸烷基酯以外,亦可視需要含有多官能性單體以進行黏著劑層之凝聚力調整等。作為多官能性單體,例如可列舉:乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、烯丙基(甲基)丙烯酸酯、(甲基)丙烯酸乙烯酯、二乙烯苯、環氧丙烯酸酯、聚酯丙烯酸酯、胺基甲酸酯丙烯酸酯、丁二醇(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯等。其中,可較佳地使用三羥甲基丙烷三(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯。多官能性單體可單獨使用1種,或將2種以上組合使用。多官能性單體之使用量根據其分子量或官能基數等而不同,通常相對於用以製備(甲基)丙烯酸烷基酯(A)之單體成分總量,適宜設為0.01重量%~3.0重量%之範圍,可設為0.02重量%~2.0重量%,亦可設為0.03重量%~1.0重量%。Furthermore, in one embodiment of the present invention, the (meth)acrylic polymer contains, in addition to the alkyl (meth)acrylate as the main component, a multifunctional monomer if necessary to form an adhesive layer. Cohesion adjustment, etc. Examples of the polyfunctional monomer include ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and polypropylene glycol di(meth)acrylate. Acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, ethylene glycol di(meth)acrylate ) Acrylate, 1,6-hexanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetrakis Hydroxymethylmethane tri(meth)acrylate, allyl(meth)acrylate, vinyl(meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate Ester, butylene glycol (meth)acrylate, hexylene glycol di(meth)acrylate, etc. Among them, trimethylolpropane tri(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and dipentaerythritol hexa(meth)acrylate can be preferably used. A polyfunctional monomer can be used individually by 1 type, or in combination of 2 or more types. The usage amount of the polyfunctional monomer varies depending on its molecular weight, the number of functional groups, etc., but is usually preferably 0.01% by weight to 3.0% based on the total amount of monomer components used to prepare alkyl (meth)acrylate (A). The range of weight % can be 0.02 weight % to 2.0 weight %, or 0.03 weight % to 1.0 weight %.
(2)極性單體(B) 於本發明之一實施形態中,基礎聚合物可進而包含選自由含羧基單體(b1)及含氮單體(b2)所組成之群中之至少1種極性單體(B)作為共聚性單體單元。(2) Polar monomer (B) In one embodiment of the present invention, the base polymer may further include at least one selected from the group consisting of carboxyl group-containing monomer (b1) and nitrogen-containing monomer (b2) The polar monomer (B) serves as a copolymerizable monomer unit.
於本發明之一實施形態中,上述極性單體(B)以基礎聚合物之重量為基準可包含0~20重量%。極性單體(B)以基礎聚合物之重量為基準,較佳為0.1~17.5重量%,更佳為1~15重量%。In one embodiment of the present invention, the above-mentioned polar monomer (B) may contain 0 to 20% by weight based on the weight of the base polymer. The polar monomer (B) is preferably 0.1 to 17.5% by weight, more preferably 1 to 15% by weight, based on the weight of the base polymer.
(2-1)含羧基單體(b1) 於本發明中,基礎聚合物可含有含羧基單體(b1)作為共聚性單體單元。作為含羧基單體(b1),例如可列舉:丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸、異丁烯酸等,但並不限定於該等。於本發明之較佳之實施形態中,含羧基單體(b1)可為丙烯酸、甲基丙烯酸。於本發明之更佳之實施形態中,含羧基單體(b1)可為丙烯酸(AA)。(2-1) Carboxyl group-containing monomer (b1) In the present invention, the base polymer may contain carboxyl group-containing monomer (b1) as a copolymerizable monomer unit. Examples of the carboxyl group-containing monomer (b1) include acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isobutylene. acid, etc., but is not limited to these. In a preferred embodiment of the present invention, the carboxyl group-containing monomer (b1) can be acrylic acid or methacrylic acid. In a more preferred embodiment of the present invention, the carboxyl group-containing monomer (b1) can be acrylic acid (AA).
(2-2)含氮單體(b2) 於本發明中,基礎聚合物可含有含氮單體(b2)作為共聚性單體單元。作為含氮單體(b2),例如可列舉:具有內醯胺環之乙烯系單體(例如,N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮等乙烯基吡咯啶酮系單體、以及具有β-內醯胺環、δ-內醯胺環、及ε-內醯胺環等內醯胺環之乙烯基內醯胺系單體等);順丁烯二醯亞胺、N-環己基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺等順丁烯二醯亞胺系單體;(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-己基(甲基)丙烯醯胺、N-甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺等(N-取代)醯胺系單體;(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸胺基丙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯、(甲基)丙烯酸3-(3-吡啶基)丙酯等(甲基)丙烯酸胺基烷基酯系單體;N-(甲基)丙烯醯氧基亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基丁二醯亞胺等丁二醯亞胺系單體;丙烯腈、甲基丙烯腈等氰基(甲基)丙烯酸酯系單體;乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌𠯤、乙烯基吡𠯤、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯基𠰌啉、N-乙烯基羧醯胺類等;但並不限定於該等。於本發明之較佳之實施形態中,含氮單體(b2)可為N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、N,N-二甲基(甲基)丙烯醯胺。於本發明之更佳之實施形態中,含氮單體(b2)可為N-乙烯基吡咯啶酮。(2-2) Nitrogen-containing monomer (b2) In the present invention, the base polymer may contain nitrogen-containing monomer (b2) as a copolymerizable monomer unit. Examples of the nitrogen-containing monomer (b2) include vinyl monomers having a lactam ring (for example, vinylpyrrolidone monomers such as N-vinylpyrrolidone and methylvinylpyrrolidone). , and vinyl lactam monomers having lactam rings such as β-lactam ring, δ-lactam ring, and ε-lactam ring, etc.); Maleic imine, N -Maleimide-based monomers such as cyclohexylmaleimide and N-phenylmaleimide; (meth)acrylamide, N,N-dimethyl( Meth)acrylamide, N,N-diethyl(meth)acrylamide, N-hexyl(meth)acrylamide, N-methyl(meth)acrylamide, N-butyl( Meth)acrylamide, N-butyl(meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N-hydroxymethylpropane(meth)acrylamide, etc. (N-substituted )amide monomer; (meth)acrylic acid aminoethyl ester, (meth)acrylic acid aminopropyl ester, (meth)acrylic acid N,N-dimethylaminoethyl ester, (meth)acrylic acid third (Meth)acrylic acid aminoalkyl ester monomers such as tributyl aminoethyl ester and 3-(3-pyridyl)propyl (meth)acrylate; N-(meth)acryloxymethylene Succinimide, N-(meth)acryl-6-oxyhexamethylenesuccinimide, N-(meth)acryl-8-oxyoctamethylenebutane Succinimide monomers such as diimide; cyano (meth)acrylate monomers such as acrylonitrile and methacrylonitrile; vinyl pyridine, vinyl piperidone, vinyl pyrimidine, vinyl Pipepan, vinyl pyrrole, vinyl pyrrole, vinyl imidazole, vinyl ytazole, vinyl pyridine, N-vinyl carboxamides, etc.; but are not limited to these. In a preferred embodiment of the present invention, the nitrogen-containing monomer (b2) can be N-vinylpyrrolidone, methylvinylpyrrolidone, or N,N-dimethyl(meth)acrylamide. In a more preferred embodiment of the present invention, the nitrogen-containing monomer (b2) may be N-vinylpyrrolidone.
可獲得(甲基)丙烯酸系聚合物之方法並無特別限定,可適當採用溶液聚合法、乳液聚合法、塊體聚合法、懸浮聚合法、光聚合法等作為丙烯酸系聚合物之合成方法而周知之各種聚合方法。於若干態樣中,可較佳地採用溶液聚合法。進行溶液聚合時之聚合溫度可根據所使用之單體及溶劑之種類、聚合起始劑之種類等適當選擇,例如可設為20℃~170℃左右(典型為40℃~140℃左右)。The method for obtaining the (meth)acrylic polymer is not particularly limited. Solution polymerization, emulsion polymerization, block polymerization, suspension polymerization, photopolymerization, etc. can be appropriately used as the synthesis method of the acrylic polymer. Various polymerization methods are well known. In some aspects, solution polymerization may be preferred. The polymerization temperature during solution polymerization can be appropriately selected depending on the types of monomers and solvents used, the types of polymerization initiators, etc., and can be, for example, about 20°C to 170°C (typically about 40°C to 140°C).
用於聚合之起始劑可根據聚合方法自以往已知之熱聚合起始劑或光聚合起始劑等中適當選擇。聚合起始劑可單獨使用1種,或將2種以上組合使用。The initiator used for polymerization can be appropriately selected from conventionally known thermal polymerization initiators, photopolymerization initiators, and the like according to the polymerization method. A polymerization initiator can be used individually by 1 type, or in combination of 2 or more types.
作為熱聚合起始劑,例如可列舉:偶氮系聚合起始劑(例如,2,2'-偶氮二異丁腈、2,2'-偶氮雙-2-甲基丁腈、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙-4-氰基戊酸、偶氮二異戊腈、2,2'-偶氮雙(2-脒基丙烷)二鹽酸鹽、2,2'-偶氮雙[2-(5-甲基-2-咪唑啉-2-基)丙烷]二鹽酸鹽、2,2'-偶氮雙(2-甲基丙脒)二硫酸鹽、2,2'-偶氮雙(N,N'-二亞甲基異丁基脒)二鹽酸鹽等);過硫酸鉀等過硫酸鹽;過氧化物系聚合起始劑(例如,過氧化二苯甲醯、過氧化順丁烯二酸第三丁酯、過氧化月桂醯等);氧化還原系聚合起始劑等。熱聚合起始劑之使用量並無特別限制,例如相對於用以製備丙烯酸系聚合物之單體成分100重量份,可設為0.01重量份~5重量份,較佳為0.05重量份~3重量份之範圍內之量。Examples of thermal polymerization initiators include azo polymerization initiators (for example, 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, 2 ,2'-azobis(2-methylpropionate)dimethyl ester, 4,4'-azobis-4-cyanovaleric acid, azobisisovaleronitrile, 2,2'-azobis (2-amidinopropane) dihydrochloride, 2,2'-azobis[2-(5-methyl-2-imidazolin-2-yl)propane] dihydrochloride, 2,2'- Azobis (2-methylpropionamidine) disulfate, 2,2'-azobis (N,N'-dimethyleneisobutylamidine) dihydrochloride, etc.); potassium persulfate, etc. Sulfate; peroxide-based polymerization initiator (for example, dibenzoyl peroxide, tert-butyl peroxymaleate, lauryl peroxide, etc.); redox-based polymerization initiator, etc. The usage amount of the thermal polymerization initiator is not particularly limited. For example, it can be 0.01 to 5 parts by weight, preferably 0.05 to 3 parts by weight based on 100 parts by weight of the monomer components used to prepare the acrylic polymer. Amount within the range of parts by weight.
作為光聚合起始劑,並無特別限制,例如可使用:安息香醚系光聚合起始劑、苯乙酮系光聚合起始劑、α-酮醇系光聚合起始劑、芳香族磺醯氯系光聚合起始劑、光活性肟系光聚合起始劑、安息香系光聚合起始劑、聯苯醯(benzil)系光聚合起始劑、二苯甲酮系光聚合起始劑、縮酮系光聚合起始劑、9-氧硫𠮿系光聚合起始劑、醯基氧化膦系光聚合起始劑等。光聚合起始劑之使用量並無特別限制,例如相對於用以製備丙烯酸系聚合物之單體成分100重量份,可設為0.01重量份~5重量份,較佳為0.05重量份~3重量份之範圍內之量。The photopolymerization initiator is not particularly limited. For example, benzoin ether photopolymerization initiators, acetophenone photopolymerization initiators, α-ketool photopolymerization initiators, and aromatic sulfonyl initiators can be used. Chlorine-based photopolymerization initiator, photoactive oxime-based photopolymerization initiator, benzoin-based photopolymerization initiator, benzil-based photopolymerization initiator, benzophenone-based photopolymerization initiator, Ketal photopolymerization initiator, 9-oxosulfide𠮿 It is a photopolymerization initiator, a phosphine oxide photopolymerization initiator, etc. The usage amount of the photopolymerization initiator is not particularly limited. For example, it can be 0.01 to 5 parts by weight, preferably 0.05 to 3 parts by weight relative to 100 parts by weight of the monomer component used to prepare the acrylic polymer. Amount within the range of parts by weight.
於本發明之一實施形態中,關於(甲基)丙烯酸系聚合物,可於在如上所述之單體成分中調配有聚合起始劑之混合物中,例如使用乙酸乙酯、甲苯等作為聚合溶劑,藉由溶液聚合而獲得(甲基)丙烯酸系聚合物。作為溶液聚合例,反應係於氮氣等惰性氣體氣流下添加聚合起始劑,通常於50~70℃左右、5~30小時左右之反應條件下進行。本說明書中揭示之黏著劑層例如可使用包含上述(甲基)丙烯酸系聚合物、下述聚矽氧低聚物Ps、及其他添加劑之黏著劑組合物形成。In one embodiment of the present invention, the (meth)acrylic polymer can be polymerized in a mixture in which a polymerization initiator is blended with the monomer components as described above. For example, ethyl acetate, toluene, etc. can be used as the polymerization agent. Solvent to obtain (meth)acrylic polymer through solution polymerization. As an example of solution polymerization, a polymerization initiator is added under a flow of inert gas such as nitrogen, and the reaction is usually carried out under reaction conditions of about 50 to 70° C. for about 5 to 30 hours. The adhesive layer disclosed in this specification can be formed, for example, using an adhesive composition containing the above-mentioned (meth)acrylic polymer, the following polysiloxane oligomer Ps, and other additives.
於本發明中,上述基礎聚合物之重量平均分子量Mw可為50萬~250萬。於本發明之一實施形態中,基礎聚合物之重量平均分子量Mw較佳可為70萬~270萬,更佳可為80萬~250萬。In the present invention, the weight average molecular weight Mw of the above-mentioned base polymer may be 500,000 to 2.5 million. In one embodiment of the present invention, the weight average molecular weight Mw of the base polymer is preferably 700,000 to 2.7 million, more preferably 800,000 to 2.5 million.
<聚矽氧低聚物Ps> 於本發明中,黏著劑層包含聚矽氧低聚物Ps。聚矽氧低聚物Ps藉由矽氧烷結構之低極性及移動性,可作為有助於抑制初始黏著力並提高黏著力上升比之黏著力上升延遲劑而發揮功能。作為聚矽氧低聚物Ps,可較佳地使用於側鏈具有矽氧烷結構之聚合物。<Polysilicone oligomer Ps> In the present invention, the adhesive layer contains polysilicone oligomer Ps. Due to the low polarity and mobility of the siloxane structure, the polysiloxane oligomer Ps can function as an adhesion rise delaying agent that helps suppress the initial adhesion and increase the adhesion rise ratio. As the polysiloxane oligomer Ps, a polymer having a siloxane structure in the side chain can be suitably used.
本發明中所使用之聚矽氧低聚物Ps之玻璃轉移溫度(Tg)為-50℃以上100℃以下之範圍。於本發明之一實施形態中,聚矽氧低聚物Ps之Tg較佳為-30℃以上70℃以下,更佳可為-20℃以上60℃以下。若聚矽氧低聚物Ps之Tg為上述範圍內,則能以高水準兼備初始之低黏著性與使用時之黏著力上升(強黏著性)。The glass transition temperature (Tg) of the polysiloxane oligomer Ps used in the present invention is in the range of -50°C or more and 100°C or less. In one embodiment of the present invention, the Tg of the polysiloxane oligomer Ps is preferably -30°C or more and 70°C or less, more preferably -20°C or more and 60°C or less. If the Tg of the polysiloxane oligomer Ps is within the above range, it can achieve both initial low adhesion and increased adhesion during use (strong adhesion) at a high level.
本發明中所使用之聚矽氧低聚物Ps之重量平均分子量Mw為10000以上300000以下之範圍。於本發明之一實施形態中,聚矽氧低聚物Ps之重量平均分子量Mw較佳為12500以上2500000以下,更佳可為15000以上2000000以下。若聚矽氧低聚物Ps之重量平均分子量Mw為上述範圍內,則容易將於黏著劑層內之相容性或移動性調節至適度之範圍,從而容易實現以高水準兼備初始之低黏著性與使用時之強黏著性之黏著片。The weight average molecular weight Mw of the polysiloxy oligomer Ps used in the present invention is in the range of 10,000 to 300,000. In one embodiment of the present invention, the weight average molecular weight Mw of the polysiloxy oligomer Ps is preferably from 12,500 to 2,500,000, and more preferably from 15,000 to 2,000,000. If the weight average molecular weight Mw of the polysiloxane oligomer Ps is within the above range, it is easy to adjust the compatibility or mobility within the adhesive layer to an appropriate range, and thus it is easy to achieve a high level of initial low adhesion. Adhesive sheet with strong adhesiveness during use.
於本發明之較佳之實施形態中,聚矽氧低聚物Ps之Tg為-70℃以上30℃以下,側鏈之聚矽氧官能基當量為1000~20000 g/mol,重量平均分子量Mw可為10000以上300000以下。In a preferred embodiment of the present invention, the Tg of the polysiloxy oligomer Ps is -70°C or above and below 30°C, the polysiloxy functional group equivalent of the side chain is 1000-20000 g/mol, and the weight average molecular weight Mw can be It is above 10,000 and below 300,000.
於本發明之一實施形態中,聚矽氧低聚物Ps可包含具有聚有機矽氧烷骨架之單體S1、及均聚物之玻璃轉移溫度為-70℃以上180℃以下之單體作為單體單元。In one embodiment of the present invention, the polysiloxane oligomer Ps may include monomer S1 having a polyorganosiloxane skeleton and a monomer having a homopolymer with a glass transition temperature of -70°C or more and 180°C or less. Single unit.
(1)具有聚有機矽氧烷骨架之單體S1 可用於本發明之聚矽氧低聚物Ps之具有聚有機矽氧烷骨架之單體S1並無特別限定,可使用具有聚有機矽氧烷骨架之任意單體。作為聚有機矽氧烷骨架,例如可列舉:三甲基矽氧烷(TM)、二甲基矽氧烷(DM)、聚氧乙基甲基矽氧烷(EOM)等,但並不限定於該等。(1) Monomer S1 having a polyorganosiloxane skeleton. The monomer S1 having a polyorganosiloxane skeleton that can be used in the polysiloxane oligomer Ps of the present invention is not particularly limited. Polyorganosiloxane monomer S1 can be used. Any monomer of an alkane skeleton. Examples of the polyorganosiloxane skeleton include: trimethylsiloxane (TM), dimethylsiloxane (DM), polyoxyethylmethylsiloxane (EOM), etc., but are not limited thereto. to such.
作為具有聚有機矽氧烷骨架之單體S1,例如可使用由下述通式(1)或(2)所表示之化合物。更具體而言,作為信越化學工業股份有限公司製造之單末端反應性聚矽氧油,可列舉:X-22-174ASX、X-22-2426、X-22-2475、KF-2012、X-22-174BX、X-22-2404等。具有聚有機矽氧烷骨架之單體S1可單獨使用1種,或將2種以上組合使用。 [化1][化2]其中,上述通式(1)、(2)中之R3 為氫或甲基,R4 為甲基或1價有機基,m及n為0以上之整數。As the monomer S1 having a polyorganosiloxane skeleton, for example, a compound represented by the following general formula (1) or (2) can be used. More specifically, the single-end reactive polysiloxane oil manufactured by Shin-Etsu Chemical Industry Co., Ltd. includes: X-22-174ASX, X-22-2426, X-22-2475, KF-2012, X- 22-174BX, X-22-2404, etc. The monomer S1 having a polyorganosiloxane skeleton can be used alone or in combination of two or more types. [Chemical 1] [Chemicalization 2] Wherein, R 3 in the above general formulas (1) and (2) is hydrogen or methyl group, R 4 is methyl group or monovalent organic group, m and n are integers above 0.
本發明中所使用之聚矽氧低聚物Ps之側鏈之聚矽氧官能基當量為1000~20000 g/mol。於本發明之一實施形態中,聚矽氧低聚物Ps之側鏈之聚矽氧官能基當量較佳為1200~18000 g/mol,更佳可為1500~15000 g/mol。若聚矽氧低聚物Ps之側鏈之聚矽氧官能基當量為上述範圍內,則容易將於黏著劑層內之相容性(例如與基礎聚合物之相容性)或移動性調節至適度之範圍,從而容易實現以高水準兼備初始之低黏著性與使用時之強黏著性之黏著片。The polysiloxy functional group equivalent of the side chain of the polysiloxy oligomer Ps used in the present invention is 1,000 to 20,000 g/mol. In one embodiment of the present invention, the polysiloxy functional group equivalent of the side chain of the polysiloxy oligomer Ps is preferably 1200 to 18000 g/mol, and more preferably 1500 to 15000 g/mol. If the polysiloxane functional group equivalent of the side chain of the polysiloxane oligomer Ps is within the above range, the compatibility (such as the compatibility with the base polymer) or mobility in the adhesive layer can be easily adjusted. to a moderate range, making it easy to realize an adhesive sheet that has a high level of initial low adhesion and strong adhesion during use.
此處,「官能基當量」係指與每一個官能基鍵結之主骨架(例如聚二甲基矽氧烷)之重量。關於標記單位g/mol,換算為官能基1 mol。具有聚有機矽氧烷骨架之單體S1之官能基當量例如可由基於核磁共振(NMR)之1 H-NMR(質子NMR)之光譜強度算出。基於1 H-NMR之光譜強度進行之具有聚有機矽氧烷骨架之單體S1的官能基當量(g/mol)之算出可基於1 H-NMR光譜解析之一般結構解析方法進行,視需要可參照日本專利第5951153號公報之記載進行。Here, "functional group equivalent" refers to the weight of the main skeleton (for example, polydimethylsiloxane) bonded to each functional group. Regarding the labeling unit g/mol, it is converted into 1 mol of functional group. The functional group equivalent of monomer S1 having a polyorganosiloxane skeleton can be calculated, for example, from the spectral intensity of 1 H-NMR (proton NMR) based on nuclear magnetic resonance (NMR). Calculation of the functional group equivalent (g/mol) of the monomer S1 with a polyorganosiloxane skeleton based on the spectral intensity of 1 H-NMR can be based on the general structural analysis method of 1 H - NMR spectral analysis, as needed. This was performed with reference to the description of Japanese Patent No. 5951153.
再者,於使用官能基當量不同之2種以上之單體作為具有聚有機矽氧烷骨架之單體S1的情形時,作為單體S1之官能基當量,可使用算術平均值。即,包含官能基當量不同之n種單體(單體S11 、單體S12 …單體S1n )之單體S1之官能基當量可藉由下述式計算。 單體S1之官能基當量(g/mol)=(單體S11 之官能基當量×單體S11 之調配量+單體S12 之官能基當量×單體S12 之調配量+…+單體S1n 之官能基當量×單體S1n 之調配量)/(單體S11 之調配量+單體S12 之調配量+…+單體S1n 之調配量)Furthermore, when two or more types of monomers with different functional group equivalents are used as the monomer S1 having a polyorganosiloxane skeleton, the arithmetic mean value can be used as the functional group equivalent of the monomer S1. That is, the functional group equivalent of monomer S1 including n types of monomers (monomer S1 1 , monomer S1 2 . . . monomer S1 n ) with different functional group equivalents can be calculated by the following formula. The functional group equivalent of monomer S1 (g/mol) = (the functional group equivalent of monomer S1 1 × the blending amount of monomer S1 1 + the functional group equivalent of monomer S1 2 × the blending amount of monomer S1 2 +...+ Functional group equivalent of monomer S1 n
具有聚有機矽氧烷骨架之單體S1之含量相對於用以製備聚矽氧低聚物Ps之所有單體成分,例如可為5重量%以上,就更好地發揮作為黏著力上升延遲劑之效果之觀點而言,較佳為設為10重量%以上,亦可設為15重量%以上。於若干態樣中,上述單體S1之含量例如亦可為20重量%以上。又,具有聚有機矽氧烷骨架之單體S1之含量就聚合反應性或相容性之觀點而言,相對於用以製備聚矽氧低聚物Ps之所有單體成分,適宜設為60重量%以下,可設為50重量%以下,可設為40重量%以下,亦可設為30重量%以下。若具有聚有機矽氧烷骨架之單體S1之含量為上述範圍內,則容易實現以高水準兼備初始之低黏著性與使用時之黏著力上升(強黏著性)的黏著片。The content of the monomer S1 having a polyorganosiloxane skeleton relative to all the monomer components used to prepare the polysiloxane oligomer Ps can be, for example, 5% by weight or more, so that it can better function as an adhesion increase retardant. From the viewpoint of the effect, the content is preferably 10% by weight or more, and may be 15% by weight or more. In some aspects, the content of the above-mentioned monomer S1 may also be, for example, 20% by weight or more. In addition, from the viewpoint of polymerization reactivity or compatibility, the content of monomer S1 having a polyorganosiloxane skeleton is suitably set to 60% relative to all monomer components used to prepare the polysiloxane oligomer Ps. It may be 50% by weight or less, 40% by weight or less, or 30% by weight or less. If the content of the monomer S1 having a polyorganosiloxane skeleton is within the above range, it is easy to realize an adhesive sheet that has a high level of initial low adhesiveness and increased adhesive force during use (strong adhesiveness).
(2)均聚物之玻璃轉移溫度為-70℃以上180℃以下之單體 本發明之聚矽氧低聚物Ps包含可與上述具有聚有機矽氧烷骨架之單體S1共聚之(甲基)丙烯酸系單體或其他共聚性單體。作為能夠用於本發明之聚矽氧低聚物Ps之可共聚之(甲基)丙烯酸系單體或其他共聚性單體,可使用均聚物之玻璃轉移溫度為-70℃以上180℃以下之單體,例如可列舉:(甲基)丙烯酸烷基酯、具有脂環式烴基之(甲基)丙烯酸酯,但並不限定於該等。作為(甲基)丙烯酸烷基酯,可列舉:甲基丙烯酸甲酯(MMA)、甲基丙烯酸丁酯(BMA)、甲基丙烯酸2-乙基己酯(2-EHMA)、丙烯酸丁酯(BA)、丙烯酸酯2-乙基己酯(2-EHA),作為具有脂環式烴基之(甲基)丙烯酸酯,可列舉:甲基丙烯酸2-((3-羥基甲基)-金剛烷-1-基)甲氧基-2-側氧乙基酯(2EHAMA)、(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸雙環戊酯、(甲基)丙烯酸1-金剛烷基酯等,但並不限定於該等。於本發明之一實施形態中,可含有選自甲基丙烯酸2-((3-羥基甲基)-金剛烷-1-基)甲氧基-2-側氧乙基酯(2EHAMA)、及甲基丙烯酸異𦯉基酯(IBXMA)中之至少1種作為單體單元。於本發明之另一實施形態中,可含有選自甲基丙烯酸雙環戊酯、甲基丙烯酸異𦯉基酯及甲基丙烯酸環己酯中之至少1種作為單體單元。該等單體可單獨使用1種,或將2種以上組合使用。(2) Monomers with a homopolymer with a glass transition temperature of above -70°C and below 180°C. The polysiloxane oligomer Ps of the present invention includes (methane) which can be copolymerized with the above-mentioned monomer S1 having a polyorganosiloxane skeleton. base) acrylic monomer or other copolymerizable monomer. As the copolymerizable (meth)acrylic monomer or other copolymerizable monomer that can be used in the polysiloxy oligomer Ps of the present invention, a homopolymer with a glass transition temperature of -70°C or more and 180°C or less can be used. Examples of the monomer include (meth)acrylic acid alkyl ester and (meth)acrylic acid ester having an alicyclic hydrocarbon group, but are not limited thereto. Examples of (meth)acrylic acid alkyl esters include methyl methacrylate (MMA), butyl methacrylate (BMA), 2-ethylhexyl methacrylate (2-EHMA), butyl acrylate ( BA), 2-ethylhexyl acrylate (2-EHA), examples of (meth)acrylates having an alicyclic hydrocarbon group include: 2-((3-hydroxymethyl)-adamantane methacrylate) -1-yl)methoxy-2-pentoxyethyl ester (2EHAMA), cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, isopropyl (meth)acrylate, (meth)acrylate (meth)acrylate, 1-adamantyl (meth)acrylate, etc., but are not limited to these. In one embodiment of the present invention, it may contain 2-((3-hydroxymethyl)-adamant-1-yl)methoxy-2-pentoxyethyl methacrylate (2EHAMA), and At least one kind of isobiyl methacrylate (IBXMA) is used as a monomer unit. In another embodiment of the present invention, at least one selected from the group consisting of dicyclopentyl methacrylate, isobiyl methacrylate, and cyclohexyl methacrylate can be included as a monomer unit. These monomers can be used individually by 1 type, or in combination of 2 or more types.
上述(甲基)丙烯酸烷基酯及上述具有脂環式烴基之(甲基)丙烯酸酯之使用量相對於用以製備聚矽氧低聚物Ps之所有單體成分,例如可為10重量%以上95重量%以下,可為20重量%以上95重量%以下,可為30重量%以上90重量%以下,可為40重量%以上90重量%以下,亦可為50重量%以上85重量%以下。The usage amount of the above-mentioned alkyl (meth)acrylate and the above-mentioned (meth)acrylate having an alicyclic hydrocarbon group may be, for example, 10% by weight relative to all monomer components used to prepare the polysiloxy oligomer Ps. It may be more than 95% by weight and not more than 20% by weight and not more than 95% by weight, it may be not less than 30% by weight and not more than 90% by weight, it may be not less than 40% by weight and not more than 90% by weight, or it may be not less than 50% by weight and not more than 85% by weight. .
關於可與單體S1一同作為構成聚矽氧低聚物Ps之單體單元被包含之單體之另一例,可列舉:上述中作為可用於(甲基)丙烯酸烷基酯(A)之單體而例示之含羧基單體、含酸酐基單體、含羥基單體、含環氧基單體、含氰基單體、含異氰酸基單體、含醯胺基單體、具有含氮原子之環之單體、具有丁二醯亞胺骨架之單體、順丁烯二醯亞胺類、伊康醯亞胺類、(甲基)丙烯酸胺基烷基酯類、乙烯酯類、乙烯醚類、烯烴類、具有芳香族烴基之(甲基)丙烯酸酯、含雜環之(甲基)丙烯酸酯、含鹵素原子之(甲基)丙烯酸酯、由萜烯化合物衍生物醇獲得之(甲基)丙烯酸酯等。As another example of the monomer that can be included together with the monomer S1 as a monomer unit constituting the polysiloxy oligomer Ps, the above-mentioned monomer that can be used for the (meth)acrylic acid alkyl ester (A) can be cited. Specifically, carboxyl group-containing monomers, acid anhydride group-containing monomers, hydroxyl group-containing monomers, epoxy group-containing monomers, cyano group-containing monomers, isocyanato group-containing monomers, amide group-containing monomers, and Nitrogen atom ring monomers, monomers with succinimide skeleton, maleic imines, icosimines, (meth)acrylic acid aminoalkyl esters, vinyl esters , vinyl ethers, olefins, (meth)acrylates with aromatic hydrocarbon groups, (meth)acrylates containing heterocyclic rings, (meth)acrylates containing halogen atoms, obtained from terpene compound derivative alcohols (meth)acrylate, etc.
關於可與單體S1一同作為構成聚矽氧低聚物Ps之單體單元被包含之單體之又一例,可列舉:乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯等氧伸烷基二(甲基)丙烯酸酯;於具有聚氧伸烷基骨架之單體,例如聚乙二醇或聚丙二醇等之聚氧伸烷基鏈之末端具有(甲基)丙烯醯基、乙烯基、烯丙基等聚合性官能基,且於另一末端具有醚結構(烷基醚、芳基醚、芳烷基醚等)之聚合性聚氧伸烷基醚;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸丙氧基乙酯、(甲基)丙烯酸丁氧基乙酯、(甲基)丙烯酸乙氧基丙酯等(甲基)丙烯酸烷氧基烷基酯;(甲基)丙烯酸鹼金屬鹽等鹽;三羥甲基丙烷三(甲基)丙烯酸酯等多元(甲基)丙烯酸酯;偏二氯乙烯、(甲基)丙烯酸-2-氯乙酯等鹵化乙烯系化合物;2-乙烯基-2-㗁唑啉、2-乙烯基-5-甲基-2-㗁唑啉、2-異丙烯基-2-㗁唑啉等含㗁唑啉基單體;(甲基)丙烯醯基氮丙啶、(甲基)丙烯酸-2-氮丙啶基乙酯等含氮丙啶基單體;(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、內酯類與(甲基)丙烯酸-2-羥基乙酯之加成物等含羥基之乙烯基單體;氟取代(甲基)丙烯酸烷基酯等含氟乙烯基單體;2-氯乙基乙烯醚、單氯乙酸乙烯酯等反應性含鹵素之乙烯基單體;乙烯基三甲氧基矽烷、γ-(甲基)丙烯醯氧基丙基三甲氧基矽烷、烯丙基三甲氧基矽烷、三甲氧基矽烷基丙基烯丙基胺、2-甲氧基乙氧基三甲氧基矽烷之類的含有機矽之乙烯基單體;此外還可列舉於將乙烯基聚合而成之單體末端具有自由基聚合性乙烯基之巨單體類等。該等可單獨1種與單體S1共聚,或者組合與單體S1共聚。As another example of the monomer that can be included together with the monomer S1 as a monomer unit constituting the polysiloxane oligomer Ps, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, acrylate, triethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol Oxyalkylene di(meth)acrylate such as di(meth)acrylate; at the end of the polyoxyalkylene chain of a monomer with a polyoxyalkylene skeleton, such as polyethylene glycol or polypropylene glycol. It is a polymerizable polyoxyethylene extension having polymerizable functional groups such as (meth)acrylyl group, vinyl group, and allyl group, and having an ether structure (alkyl ether, aryl ether, aralkyl ether, etc.) at the other end. Alkyl ether; methoxyethyl (meth)acrylate, ethoxyethyl (meth)acrylate, propoxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, (meth)acrylate (meth)acrylic acid alkoxyalkyl esters such as ethoxypropyl acrylate; (meth)acrylic acid alkali metal salts and other salts; trimethylolpropane tri(meth)acrylate and other poly(meth)acrylates Acrylates; vinylidene chloride, 2-chloroethyl (meth)acrylate and other halogenated vinyl compounds; 2-vinyl-2-ethyl azoline, 2-vinyl-5-methyl-2-ethyl azolate oxazoline-containing monomers such as phosphine and 2-isopropenyl-2-ethazoline; nitrogen-containing monomers such as (meth)acrylaziridine and (meth)acrylic acid-2-aziridinylethyl ester. Propidyl monomer; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, adducts of lactones and 2-hydroxyethyl (meth)acrylate, etc. Hydroxyl-containing vinyl monomers; fluorine-containing vinyl monomers such as fluorine-substituted alkyl (meth)acrylate; reactive halogen-containing vinyl monomers such as 2-chloroethylvinyl ether, vinyl monochloroacetate; Vinyltrimethoxysilane, γ-(meth)acryloxypropyltrimethoxysilane, allyltrimethoxysilane, trimethoxysilylpropylallylamine, 2-methoxyethyl Silicone-containing vinyl monomers such as oxytrimethoxysilane; and macromonomers having radically polymerizable vinyl groups at the terminal ends of monomers obtained by polymerizing vinyl groups. These can be copolymerized with monomer S1 singly or in combination with monomer S1.
於用以製備聚矽氧低聚物Ps之單體成分包含單體S1及(甲基)丙烯酸系單體之態樣中,單體S1與(甲基)丙烯酸系單體於上述單體成分總體中所占的合計量例如可為50重量%以上,可為70重量%以上,可為85重量%以上,可為90重量%以上,可為95重量%以上,亦可實質上為100重量%。In the aspect where the monomer component used to prepare the polysiloxy oligomer Ps includes monomer S1 and a (meth)acrylic acid monomer, the monomer S1 and the (meth)acrylic acid monomer are in the above monomer components. The total amount in the whole may be, for example, 50% by weight or more, 70% by weight or more, 85% by weight or more, 90% by weight or more, 95% by weight or more, or substantially 100% by weight. %.
上述單體成分中所包含之(甲基)丙烯酸系單體之組成例如能以如下方式設定,即基於該(甲基)丙烯酸系單體之組成之玻璃轉移溫度Tm1 高於0℃。此處,基於(甲基)丙烯酸系單體之組成之玻璃轉移溫度Tm1 係指僅基於用以製備聚矽氧低聚物Ps之單體成分中的(甲基)丙烯酸系單體之組成,利用Fox之式求出之Tg。Tm1 可僅將用以製備聚矽氧低聚物Ps之單體成分中之(甲基)丙烯酸系單體作為對象,應用上述Fox之式,由各(甲基)丙烯酸系單體之均聚物之玻璃轉移溫度與各(甲基)丙烯酸系單體於該(甲基)丙烯酸系單體之合計量中所占的重量分率算出。若利用玻璃轉移溫度Tm1 高於0℃之聚矽氧低聚物Ps,則容易抑制初始黏著力。又,藉由使用玻璃轉移溫度Tm1 高於0℃之聚矽氧低聚物Ps,而容易獲得黏著力上升比較大之黏著片。The composition of the (meth)acrylic monomer included in the monomer component can be set such that the glass transition temperature T m1 based on the composition of the (meth)acrylic monomer is higher than 0° C., for example. Here, the glass transition temperature T m1 based on the composition of the (meth)acrylic monomer refers to the composition based only on the (meth)acrylic monomer among the monomer components used to prepare the polysiloxy oligomer Ps. , use Fox's formula to find Tg. T m1 can only take the (meth)acrylic acid-based monomers among the monomer components used to prepare the polysiloxy oligomer Ps as the target, and apply the above-mentioned Fox formula to obtain the average value of each (meth)acrylic acid-based monomer. The glass transition temperature of the polymer and the weight fraction of each (meth)acrylic monomer in the total amount of the (meth)acrylic monomer were calculated. If polysiloxane oligomer Ps whose glass transition temperature T m1 is higher than 0°C is used, the initial adhesion force will be easily suppressed. In addition, by using the polysiloxane oligomer Ps whose glass transition temperature T m1 is higher than 0°C, it is easy to obtain an adhesive sheet with a relatively large increase in adhesive force.
於若干態樣中,Tm1 可為-20℃以上,可為-10℃以上,可為0℃以上,亦可為10℃以上。若Tm1 變高,則存在貼附初始之黏著力大體更好地得到抑制之傾向。又,Tm1 例如可為90℃以下,可為80℃以下,亦可為70℃以下或未達70℃。若Tm1 變低,則存在容易因加熱而導致黏著力上升之傾向。本文所揭示之技術可使用Tm1 例如處於-20℃~90℃或-10℃~80℃、或0℃~70℃之範圍內之聚矽氧低聚物Ps較佳地實施。In some aspects, T m1 can be above -20°C, above -10°C, above 0°C, or above 10°C. As T m1 becomes higher, the adhesive force at the initial stage of adhesion tends to be better suppressed. Moreover, T m1 may be, for example, 90°C or lower, 80°C or lower, or 70°C or lower or less than 70°C. If T m1 becomes low, the adhesive force tends to increase easily due to heating. The technology disclosed herein can be preferably implemented using polysiloxane oligomer Ps with T m1 in the range of, for example, -20°C to 90°C, or -10°C to 80°C, or 0°C to 70°C.
聚矽氧低聚物Ps例如可藉由利用溶液聚合法、乳液聚合法、塊體聚合法、懸浮聚合法、光聚合法等已知之方法使上述單體聚合而製作。The polysiloxane oligomer Ps can be produced by polymerizing the above-mentioned monomer using known methods such as solution polymerization, emulsion polymerization, block polymerization, suspension polymerization, and photopolymerization.
為了調整聚矽氧低聚物Ps之分子量,可使用鏈轉移劑。作為所使用之鏈轉移劑之例,可列舉:辛硫醇、月桂硫醇、第三壬硫醇、第三-十二硫醇、巰基乙醇、α-硫甘油等具有巰基之化合物;巰基乙酸、巰基乙酸甲酯、巰基乙酸乙酯、巰基乙酸丙酯、巰基乙酸丁酯、巰基乙酸第三丁酯、巰基乙酸2-乙基己酯、巰基乙酸辛酯、巰基乙酸異辛酯、巰基乙酸癸酯、巰基乙酸十二烷基酯、乙二醇之巰基乙酸酯、新戊二醇之巰基乙酸酯、季戊四醇之巰基乙酸酯等巰基乙酸酯類;α-甲基苯乙烯二聚物等。In order to adjust the molecular weight of the polysiloxane oligomer Ps, a chain transfer agent can be used. Examples of chain transfer agents used include compounds having mercapto groups such as octyl mercaptan, lauryl mercaptan, tertiary nonyl mercaptan, tertiary dodecyl mercaptan, mercaptoethanol, α-thioglycerol, etc.; thioglycolic acid , methyl thioglycolate, ethyl thioglycolate, propyl thioglycolate, butyl thioglycolate, tert-butyl thioglycolate, 2-ethylhexyl thioglycolate, octyl thioglycolate, isooctyl thioglycolate, thioglycolic acid Decyl ester, lauryl thioglycolate, ethylene glycol thioglycolate, neopentyl glycol thioglycolate, pentaerythritol thioglycolate and other thioglycolic acid esters; α-methylstyrene dimer Things etc.
作為鏈轉移劑之使用量,並無特別限制,通常相對於單體100重量份,含有鏈轉移劑0.05重量份~20重量份,較佳為0.1重量份~15重量份,進而較佳為0.2重量份~10重量份。藉由如此調整鏈轉移劑之添加量,能夠獲得分子量適宜之聚矽氧低聚物Ps。再者,鏈轉移劑可單獨使用1種,或將2種以上組合使用。There is no particular restriction on the amount of chain transfer agent used. It is usually 0.05 to 20 parts by weight, preferably 0.1 to 15 parts by weight, and further preferably 0.2 parts by weight relative to 100 parts by weight of the monomer. Parts by weight ~ 10 parts by weight. By adjusting the amount of chain transfer agent added in this way, polysiloxane oligomer Ps with suitable molecular weight can be obtained. In addition, a chain transfer agent can be used individually by 1 type, or in combination of 2 or more types.
於本發明之一實施形態中,聚矽氧低聚物Ps相對於上述(甲基)丙烯酸系聚合物100重量份可包含0.1~20重量份。於本發明之實施形態中,聚矽氧低聚物Ps相對於上述(甲基)丙烯酸系聚合物100重量份,較佳為可包含0.25~10重量份,更佳為可包含0.5~5重量份。若黏著劑層中所包含之聚矽氧低聚物Ps之含量為上述範圍內,則能夠抑制初始黏著力,能夠獲得更高之加熱後黏著力。In one embodiment of the present invention, the polysiloxane oligomer Ps may contain 0.1 to 20 parts by weight relative to 100 parts by weight of the (meth)acrylic polymer. In the embodiment of the present invention, the polysiloxane oligomer Ps is preferably included in an amount of 0.25 to 10 parts by weight, more preferably 0.5 to 5 parts by weight based on 100 parts by weight of the (meth)acrylic polymer. share. If the content of the polysiloxane oligomer Ps contained in the adhesive layer is within the above range, the initial adhesive force can be suppressed and higher post-heating adhesive force can be obtained.
再者,如上所述之聚矽氧低聚物Ps藉由調配於黏著劑層,可作為黏著力上升延遲劑而較佳地發揮功能。本文所揭示之黏著片可由如下態樣較佳地實施,即,構成黏著劑層之黏著劑包含基礎聚合物及黏著力上升延遲劑,且該黏著力上升延遲劑包含聚矽氧低聚物Ps。此處認為,聚矽氧低聚物Ps作為黏著力上升延遲劑而發揮功能之原因在於:於貼附於被黏著體之前至貼附初始之黏著片中,利用存在於黏著劑層之表面之聚矽氧低聚物Ps抑制初始黏著力,黏著劑藉由貼附後之經時或加熱等而流動,藉此黏著劑層表面中之聚矽氧低聚物Ps之存在量減少,聚矽氧低聚物Ps與黏著劑相容,黏著力上升。因此,作為本文所揭示之技術中之上述黏著力上升延遲劑,可使用能夠發揮同種功能之其他材料來代替聚矽氧低聚物Ps,或者與聚矽氧低聚物Ps組合。作為此種材料之非限定性之例,可列舉於分子內具有聚氧伸烷基結構之聚合物(以下,亦稱為「聚合物Po」)。聚合物Po例如可為包含來自具有聚氧伸烷基骨架之單體之單體單元之聚合物。作為具體例,可使用如上所述之具有聚氧伸烷基骨架之單體之任一種單獨聚合物或2種以上之共聚物、具有聚氧伸烷基骨架之單體之1種或2種以上與其他單體(例如(甲基)丙烯酸系單體)之共聚物等作為聚合物Po。具有聚氧伸烷基骨架之單體之使用量並無特別限定,例如亦可將上述聚矽氧低聚物Ps中之單體S1之使用量應用於聚合物Po中之具有聚氧伸烷基骨架之單體的使用量。又,黏著劑層中之聚合物Po之使用量並無特別限定,例如亦可將上述聚矽氧低聚物Ps相對於基礎聚合物之使用量應用於聚合物Po相對於基礎聚合物之使用量。或者亦可將上述聚矽氧低聚物Ps相對於基礎聚合物之使用量中之一部分(例如,聚矽氧低聚物Ps之總使用量中之5重量%~95重量%左右、或15重量%~85重量%左右、或30重量%~70重量%左右)替換為聚合物Po。Furthermore, by being formulated in the adhesive layer, the polysiloxane oligomer Ps as mentioned above can function better as an adhesive force increase retardant. The adhesive sheet disclosed herein can be preferably implemented in the following aspect: the adhesive constituting the adhesive layer includes a base polymer and an adhesion increase delaying agent, and the adhesion increase delaying agent includes polysiloxane oligomer Ps . Here, it is believed that the reason why the polysiloxane oligomer Ps functions as an adhesive force increase delaying agent is that the adhesive sheet that exists on the surface of the adhesive layer is used from before it is attached to the adherend to the initial stage of attachment. The polysilicone oligomer Ps suppresses the initial adhesion, and the adhesive flows due to time or heating after attachment, thereby reducing the amount of the polysilicone oligomer Ps on the surface of the adhesive layer, and the polysilicone oligomer Ps The oxygen oligomer Ps is compatible with the adhesive, and the adhesive force increases. Therefore, as the above-mentioned adhesion rise retardant in the technology disclosed herein, other materials that can perform the same function can be used to replace the polysiloxane oligomer Ps, or be combined with the polysiloxane oligomer Ps. Non-limiting examples of such materials include polymers having a polyoxyalkylene structure in the molecule (hereinafter also referred to as "polymer Po"). The polymer Po may, for example, be a polymer containing monomer units derived from monomers having a polyoxyalkylene skeleton. As a specific example, any single polymer or a copolymer of two or more types of monomers having a polyoxyalkylene skeleton as described above, or one or two types of monomers having a polyoxyalkylene skeleton can be used. Copolymers of the above and other monomers (such as (meth)acrylic monomers) are used as polymer Po. The usage amount of the monomer having a polyoxyalkylene skeleton is not particularly limited. For example, the usage amount of the monomer S1 in the polysiloxy oligomer Ps can also be applied to the polyoxyalkylene skeleton in the polymer Po. The amount of monomer used in the basic skeleton. In addition, the usage amount of the polymer Po in the adhesive layer is not particularly limited. For example, the usage amount of the polysiloxane oligomer Ps relative to the base polymer can also be applied to the usage of the polymer Po relative to the base polymer. quantity. Alternatively, the above-mentioned polysilicone oligomer Ps may be used as part of the usage amount of the base polymer (for example, about 5% to 95% by weight, or 15% by weight of the total usage amount of the polysiloxane oligomer Ps). About 85% by weight or about 30% by weight to 70% by weight) is replaced by polymer Po.
於本發明之一實施形態中,聚矽氧低聚物Ps之熔融溫度可為-20~120℃。於本發明之另一實施形態中,聚矽氧低聚物Ps之熔融溫度可為-10~90℃、0~80℃。In one embodiment of the present invention, the melting temperature of the polysiloxane oligomer Ps may be -20°C to 120°C. In another embodiment of the present invention, the melting temperature of the polysiloxane oligomer Ps can be -10°C to 90°C, or 0°C to 80°C.
<其他成分> (交聯劑) 對於本說明書中揭示之黏著劑層,為了進行凝聚力之調整等,可使用交聯劑。交聯劑可使用通常使用之交聯劑,例如可列舉:環氧系交聯劑、異氰酸酯系交聯劑、聚矽氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、矽烷系交聯劑、烷基醚化三聚氰胺系交聯劑、金屬螯合物系交聯劑等。尤其是可較佳地使用異氰酸酯系交聯劑、環氧系交聯劑、金屬螯合物系交聯劑。交聯劑可單獨使用1種,或將2種以上組合使用。<Other ingredients> (Cross-linking agent) For the adhesive layer disclosed in this manual, a cross-linking agent can be used to adjust the cohesive force. As the cross-linking agent, commonly used cross-linking agents can be used. For example, epoxy cross-linking agents, isocyanate cross-linking agents, polysiloxy cross-linking agents, tetrazoline cross-linking agents, and aziridine cross-linking agents can be used. Linking agents, silane-based cross-linking agents, alkyl etherified melamine-based cross-linking agents, metal chelate-based cross-linking agents, etc. In particular, isocyanate-based cross-linking agents, epoxy-based cross-linking agents, and metal chelate-based cross-linking agents can be preferably used. A cross-linking agent can be used individually by 1 type, or in combination of 2 or more types.
具體而言,作為異氰酸酯系交聯劑之例,可列舉:甲苯二異氰酸酯、六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、苯二甲基二異氰酸酯、氫化苯二甲基二異氰酸酯、二苯基甲烷二異氰酸酯、氫化二苯基甲烷二異氰酸酯、四甲基苯二甲基二異氰酸酯、萘二異氰酸酯、三苯基甲烷三異氰酸酯、聚亞甲基聚苯異氰酸酯、及該等與三羥甲基丙烷等多元醇之加成物。或者於1分子中具有至少1個以上之異氰酸基與1個以上之不飽和鍵之化合物,具體而言,(甲基)丙烯酸2-異氰酸基乙酯等亦可用作異氰酸酯系交聯劑。該等可單獨使用1種,或將2種以上組合使用。Specifically, examples of isocyanate-based crosslinking agents include toluene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, and diisocyanate. Phenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, tetramethylxylylene diisocyanate, naphthalene diisocyanate, triphenylmethane triisocyanate, polymethylene polyphenylene isocyanate, and those related to trimethylol Adducts of polyhydric alcohols such as propane. Or a compound having at least one isocyanate group and one or more unsaturated bonds in one molecule. Specifically, 2-isocyanatoethyl (meth)acrylate, etc. can also be used as the isocyanate system. Cross-linking agent. These can be used individually by 1 type, or in combination of 2 or more types.
作為環氧系交聯劑,可列舉:雙酚A、表氯醇型環氧系樹脂、乙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、甘油二縮水甘油醚、甘油三縮水甘油醚、1,6-己二醇縮水甘油醚、三羥甲基丙烷三縮水甘油醚、二縮水甘油基苯胺、二胺縮水甘油基胺、N,N,N',N'-四縮水甘油基-間苯二甲胺及1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷等。該等可單獨使用1種,或將2種以上組合使用。Examples of epoxy cross-linking agents include bisphenol A, epichlorohydrin-type epoxy resin, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerol diglycidyl ether, and glyceryl triglycidyl ether. Glyceryl ether, 1,6-hexanediol glycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl aniline, diamine glycidylamine, N,N,N',N'-tetraglycidyl -m-xylylenediamine and 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, etc. These can be used individually by 1 type, or in combination of 2 or more types.
關於金屬螯合物化合物,作為金屬成分,可列舉:鋁、鐵、錫、鈦、鎳等,作為螯合物成分,可列舉:乙炔、乙醯乙酸甲酯、乳酸乙酯等。該等可單獨使用1種,或將2種以上組合使用。Regarding the metal chelate compound, examples of the metal component include aluminum, iron, tin, titanium, nickel, etc., and examples of the chelate compound include acetylene, methyl acetyl acetate, ethyl lactate, and the like. These can be used individually by 1 type, or in combination of 2 or more types.
交聯劑之使用量相對於基礎聚合物100重量份,例如可設為0.01重量份以上,較佳為設為0.05重量份以上。藉由增大交聯劑之使用量,有獲得更高之凝聚力之傾向。於若干態樣中,交聯劑相對於基礎聚合物100重量份之使用量可為0.1重量份以上,可為0.5重量份以上,亦可為1重量份以上。另一方面,就避免因過度提高凝聚力而導致觸黏下降之觀點而言,交聯劑相對於基礎聚合物100重量份之使用量通常適宜設為15重量份以下,可設為10重量份以下,亦可設為5重量份以下。於包含聚矽氧低聚物Ps或其他黏著力上升延遲劑之組成之黏著劑中,交聯劑之使用量不過多就利用黏著劑之流動性更好地展現黏著力上升延遲劑之使用效果的觀點而言,亦可有利。The usage amount of the cross-linking agent can be, for example, 0.01 parts by weight or more, preferably 0.05 parts by weight or more, based on 100 parts by weight of the base polymer. By increasing the amount of cross-linking agent used, there is a tendency to obtain higher cohesion. In some aspects, the usage amount of the cross-linking agent relative to 100 parts by weight of the base polymer may be more than 0.1 parts by weight, may be more than 0.5 parts by weight, or may be more than 1 part by weight. On the other hand, from the perspective of avoiding a decrease in touch tack due to an excessive increase in cohesive force, the usage amount of the cross-linking agent relative to 100 parts by weight of the base polymer is usually 15 parts by weight or less, and may be 10 parts by weight or less. , it can also be set to 5 parts by weight or less. In adhesives containing polysiloxane oligomer Ps or other adhesion rise delay agents, the cross-linking agent is not used in too much and the fluidity of the adhesive is used to better demonstrate the use effect of the adhesion rise delay agent. From the point of view, it can also be beneficial.
本說明書中揭示之技術可由至少使用異氰酸酯系交聯劑作為交聯劑之態樣較佳地實施。就容易實現加熱後凝聚力較高,且黏著力上升比較大之黏著片之觀點而言,於若干態樣中,異氰酸酯系交聯劑相對於基礎聚合物100重量份之使用量例如可設為5重量份以下,可設為3重量份以下,可設為1重量份以下,可設為0.7重量份以下,亦可設為0.5重量份以下。The technology disclosed in this specification can be preferably implemented by using at least an isocyanate-based cross-linking agent as a cross-linking agent. From the perspective of easily realizing an adhesive sheet with higher cohesion after heating and a relatively large increase in adhesive force, in some aspects, the usage amount of the isocyanate cross-linking agent relative to 100 parts by weight of the base polymer can be set to 5, for example. It may be 3 parts by weight or less, it may be 1 part by weight or less, it may be 0.7 parts by weight or less, or it may be 0.5 parts by weight or less.
為了更有效地進行上述任一交聯反應,亦可使用交聯觸媒。作為交聯觸媒,例如可較佳地使用錫系觸媒(尤其是二月桂酸二辛基錫)。交聯觸媒之使用量並無特別限制,例如相對於基礎聚合物100重量份,可設為大致0.0001重量份~1重量份。In order to carry out any of the above cross-linking reactions more efficiently, a cross-linking catalyst can also be used. As the cross-linking catalyst, for example, a tin-based catalyst (especially dioctyltin dilaurate) can be preferably used. The usage amount of the cross-linking catalyst is not particularly limited. For example, it can be approximately 0.0001 to 1 part by weight relative to 100 parts by weight of the base polymer.
(矽烷偶合劑) 於本說明書中揭示之黏著劑層中,可進而含有矽烷偶合劑。藉由使用矽烷偶合劑,可提高耐久性。作為矽烷偶合劑,可使用具有任意之適當官能基者。具體而言,作為官能基,例如可列舉:乙烯基、環氧基、胺基、巰基、(甲基)丙烯醯氧基、乙醯乙醯基、異氰酸基、苯乙烯基、多硫基等。具體而言,例如可列舉:乙烯基三乙氧基矽烷、乙烯基三丙氧基矽烷、乙烯基三異丙氧基矽烷、乙烯基三丁氧基矽烷等含乙烯基之矽烷偶合劑;γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷等含環氧基之矽烷偶合劑;γ-胺基丙基三甲氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基甲基二甲氧基矽烷、N-(2-胺基乙基)3-胺基丙基甲基二甲氧基矽烷、γ-三乙氧基矽烷基-N-(1,3-二甲基亞丁基)丙基胺、N-苯基-γ-胺基丙基三甲氧基矽烷等含胺基之矽烷偶合劑;γ-巰基丙基甲基二甲氧基矽烷等含巰基之矽烷偶合劑;對苯乙烯基三甲氧基矽烷等含苯乙烯基之矽烷偶合劑;γ-丙烯醯氧基丙基三甲氧基矽烷、γ-甲基丙烯醯基氧丙基三乙氧基矽烷等含(甲基)丙烯醯基之矽烷偶合劑;3-異氰酸基丙基三乙氧基矽烷等含異氰酸基之矽烷偶合劑;雙(三乙氧基矽烷基丙基)四硫化物等含多硫基之矽烷偶合劑等。矽烷偶合劑例如可較佳地使用γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、γ-巰基丙基甲基二甲氧基矽烷。(Silane coupling agent) The adhesive layer disclosed in this specification may further contain a silane coupling agent. By using silane coupling agent, durability can be improved. As the silane coupling agent, one having any appropriate functional group can be used. Specifically, examples of the functional group include a vinyl group, an epoxy group, an amino group, a mercapto group, a (meth)acryloxy group, an acetyl acetyl group, an isocyanato group, a styryl group, and a polysulfide group. Key et al. Specific examples include vinyl-containing silane coupling agents such as vinyltriethoxysilane, vinyltripropoxysilane, vinyltriisopropoxysilane, and vinyltributoxysilane; γ -glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-cyclo Silane coupling agents containing epoxy groups such as oxycyclohexyl)ethyltrimethoxysilane; γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropylmethyl Dimethoxysilane, N-(2-aminoethyl)3-aminopropylmethyldimethoxysilane, γ-triethoxysilyl-N-(1,3-dimethylbutylene amine group-containing silane coupling agents such as N-phenyl-γ-aminopropyltrimethoxysilane; γ-mercaptopropylmethyldimethoxysilane and other mercapto-group-containing silane coupling agents; Silane coupling agents containing styrene groups such as p-styryltrimethoxysilane; γ-acryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, etc. containing (methyl silane coupling agents containing isocyanate groups; silane coupling agents containing isocyanate groups such as 3-isocyanatopropyltriethoxysilane; bis(triethoxysilylpropyl)tetrasulfide, etc. Polysulfide-based silane coupling agents, etc. As the silane coupling agent, preferably γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltriethoxysilane -Mercaptopropylmethyldimethoxysilane.
上述矽烷偶合劑可單獨使用,又,亦可將2種以上混合使用,作為整體之含量相對於基礎聚合物100重量份,較佳為上述矽烷偶合劑0.001~5重量份,進而較佳為0.01~1重量份,進而更佳為0.02~1重量份,進而較佳為0.05~0.6重量份。The above-mentioned silane coupling agent can be used alone, or two or more kinds can be mixed and used. The total content is preferably 0.001 to 5 parts by weight of the above-mentioned silane coupling agent based on 100 parts by weight of the base polymer, and more preferably 0.01 ~1 part by weight, more preferably 0.02-1 part by weight, more preferably 0.05-0.6 part by weight.
此外,本文所揭示之技術中之黏著劑層亦可於不明顯妨礙本發明之效果之範圍內,視需要包含黏著賦予劑、整平劑、可塑劑、軟化劑、著色劑(染料、顏料等)、填充劑、抗靜電劑、抗老化劑、紫外線吸收劑、抗氧化劑、光穩定劑、防腐劑等可用於黏著劑之公知之添加劑。In addition, the adhesive layer in the technology disclosed herein may also contain adhesion-imparting agents, leveling agents, plasticizers, softeners, colorants (dyes, pigments, etc.) as necessary within the scope that does not significantly hinder the effects of the present invention. ), fillers, antistatic agents, anti-aging agents, ultraviolet absorbers, antioxidants, light stabilizers, preservatives and other well-known additives that can be used in adhesives.
(黏著劑層之形成) 作為形成黏著劑層之方法,例如可藉由以下方法等製作:將上述黏著劑組合物塗佈於經剝離處理之隔片等,並將聚合溶劑等乾燥去除而形成黏著劑層,之後轉印於偏光膜;或者將上述黏著劑組合物塗佈於偏光膜,將聚合溶劑等乾燥去除而使黏著劑層形成於偏光膜。再者,當塗佈黏著劑時,亦可適當重新添加聚合溶劑以外之一種以上之溶劑。(Formation of the adhesive layer) As a method of forming the adhesive layer, for example, it can be produced by the following method: applying the above-mentioned adhesive composition to a peeled separator, etc., and drying and removing the polymerization solvent, etc. to form The adhesive layer is then transferred to the polarizing film; or the above-mentioned adhesive composition is applied to the polarizing film, and the polymerization solvent is dried and removed to form an adhesive layer on the polarizing film. Furthermore, when applying the adhesive, one or more solvents other than the polymerization solvent may be added appropriately.
作為經剝離處理之隔片,較佳地使用聚矽氧剝離襯墊。於將本發明之接著劑組合物塗佈於此種襯墊上並使其乾燥而形成黏著劑層之步驟中,作為使黏著劑乾燥之方法,可根據目的適當採用恰當之方法。較佳為使用對上述塗佈膜進行加熱乾燥之方法。加熱乾燥溫度較佳為40℃~200℃,進而較佳為50℃~180℃,尤佳為70℃~170℃。藉由將加熱溫度設為上述範圍,可獲得具有優異之黏著特性之黏著劑。As the release-treated separator, a silicone release liner is preferably used. In the step of applying the adhesive composition of the present invention on such a liner and drying it to form an adhesive layer, an appropriate method can be appropriately used according to the purpose as a method for drying the adhesive. It is preferable to use a method of heating and drying the above-mentioned coating film. The heating and drying temperature is preferably 40°C to 200°C, more preferably 50°C to 180°C, and particularly preferably 70°C to 170°C. By setting the heating temperature within the above range, an adhesive having excellent adhesive properties can be obtained.
乾燥時間可適當採用恰當之時間。上述乾燥時間較佳為5秒~20分鐘,進而較佳為5秒~10分鐘,尤佳為10秒~5分鐘。The drying time can be appropriately adjusted. The drying time is preferably from 5 seconds to 20 minutes, more preferably from 5 seconds to 10 minutes, and particularly preferably from 10 seconds to 5 minutes.
又,可於偏光膜之表面形成錨定層,或者於實施電暈處理、電漿處理等各種易接著處理之後形成黏著劑層。又,亦可對黏著劑層之表面進行易接著處理。In addition, an anchor layer can be formed on the surface of the polarizing film, or an adhesive layer can be formed after performing various easy-adhesion treatments such as corona treatment and plasma treatment. In addition, the surface of the adhesive layer may be treated to facilitate adhesion.
作為黏著劑層之形成方法,可使用各種方法。具體而言,例如可列舉:輥塗、接觸輥式塗佈、凹版塗佈、反向塗佈、輥式刷塗、噴塗、浸漬輥塗佈、棒式塗佈、刮塗、氣刀塗佈、淋幕式塗佈、模唇塗佈、利用模嘴塗佈機等之擠壓塗佈法等方法。As a method of forming the adhesive layer, various methods can be used. Specific examples include roller coating, contact roll coating, gravure coating, reverse coating, roller brush coating, spray coating, dip roll coating, rod coating, blade coating, and air knife coating. , curtain coating, die lip coating, extrusion coating method using die nozzle coating machine, etc.
黏著劑層之厚度並無特別限制,例如為1~100 μm左右。較佳為2~50 μm,更佳為2~40 μm,進而較佳為5~35 μm。The thickness of the adhesive layer is not particularly limited, but is, for example, about 1 to 100 μm. Preferably it is 2-50 micrometers, More preferably, it is 2-40 micrometers, Still more preferably, it is 5-35 micrometers.
於上述黏著劑層露出之情形時,亦可利用經剝離處理之片(隔片)保護黏著劑層直至實際使用為止。When the above-mentioned adhesive layer is exposed, a peeled sheet (spacer) can also be used to protect the adhesive layer until actual use.
作為隔片之構成材料,例如可列舉:聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、聚酯膜等塑膠膜、紙、布、不織布等多孔質材料、網狀物、發泡片、金屬箔、及其等之層壓體等適當之薄片體等,就表面平滑性優異之方面而言,適宜使用塑膠膜。Examples of materials constituting the separator include plastic films such as polyethylene, polypropylene, polyethylene terephthalate, and polyester films, porous materials such as paper, cloth, and nonwoven fabrics, mesh materials, and foam sheets. , metal foils, and laminates thereof, etc., plastic films are suitable for use in terms of excellent surface smoothness.
作為該塑膠膜,只要為能夠保護上述黏著劑層之膜,則並無特別限定,例如可列舉:聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚胺酯膜、乙烯-乙酸乙烯酯共聚物膜等。The plastic film is not particularly limited as long as it can protect the adhesive layer. Examples include polyethylene film, polypropylene film, polybutylene film, polybutadiene film, and polymethylpentene. Film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate copolymer film, etc.
上述隔片之厚度通常為5~200 μm,較佳為5~100 μm左右。針對上述隔片,亦可視需要進行利用聚矽氧系、氟系、長鏈烷基系或脂肪酸醯胺系之脫模劑、氧化矽粉等進行之脫模及防汚處理;或者塗佈型、混練型、蒸鍍型等抗靜電處理。尤其是藉由對上述隔片之表面適當進行聚矽氧處理、長鏈烷基處理、氟處理等剝離處理,能夠進一步提高自上述黏著劑層之剝離性。The thickness of the above-mentioned spacer is usually 5 to 200 μm, preferably about 5 to 100 μm. For the above-mentioned separators, mold release and antifouling treatment using polysilicone-based, fluorine-based, long-chain alkyl-based or fatty acid amide-based release agents, silica powder, etc. can also be carried out if necessary; or coating type , kneading type, evaporation type and other antistatic treatments. In particular, peelability from the adhesive layer can be further improved by appropriately performing peeling treatments such as silicone treatment, long-chain alkyl treatment, and fluorine treatment on the surface of the separator.
再者,製作上述附黏著劑層之偏光膜時使用之經剝離處理之片可直接用作附黏著劑層之偏光膜的隔片,從而能夠簡化步驟。 [實施例]Furthermore, the peeled sheet used in making the polarizing film with the adhesive layer can be directly used as a spacer for the polarizing film with the adhesive layer, thereby simplifying the steps. [Example]
以下,列舉實施例對本發明進行說明,但本發明並不受以下所示之實施例限制。再者,各例中之份及%均為重量基準。以下無特別規定之室溫放置條件均為23℃65%RH。The present invention will be described below with reference to examples, but the present invention is not limited to the examples shown below. Furthermore, parts and % in each example are based on weight. The following room temperature storage conditions without special regulations are all 23℃65%RH.
再者,下述各聚合物之重量平均分子量Mw係使用GPC(Gel Permeation Chromatograph,凝膠滲透層析)裝置(Tosoh公司製造、HLC-8220GPC)於下述條件下進行測定,並藉由聚苯乙烯換算求出。 ・樣本濃度:0.2 wt%(四氫呋喃(THF)溶液) ・樣本注入量:10 μl ・溶離液:THF・流速:0.6 ml/min ・測定溫度:40℃In addition, the weight average molecular weight Mw of each of the following polymers was measured using a GPC (Gel Permeation Chromatograph, gel permeation chromatography) device (manufactured by Tosoh Corporation, HLC-8220GPC) under the following conditions, and was measured by polyphenylene glycol Calculate the ethylene conversion.・Sample concentration: 0.2 wt% (tetrahydrofuran (THF) solution) ・Sample injection volume: 10 μl ・Eluent: THF ・Flow rate: 0.6 ml/min ・Measurement temperature: 40℃
<偏光元件之製作> 將平均聚合度2400、皂化度99.9莫耳%之厚度75 μm之聚乙烯醇膜浸漬於30℃之溫水中60秒使其膨潤。然後,將其浸漬於碘/碘化鉀(重量比=0.5/8)之濃度0.3%之水溶液中,使其延伸至3.5倍並將膜染色。其後,於65℃之硼酸酯水溶液中,以合計延伸倍率成為6倍之方式進行延伸。延伸後,於40℃之烘箱中乾燥3分鐘,從而獲得PVA(polyvinyl alcohol,聚乙烯醇)系偏光元件(SP值32.8、厚度23 μm)。含水率為14重量%。<Preparation of polarizing element> Dip a 75 μm thick polyvinyl alcohol film with an average degree of polymerization of 2400 and a saponification degree of 99.9 mol% into warm water at 30°C for 60 seconds to swell. Then, it was immersed in an aqueous solution with a concentration of 0.3% of iodine/potassium iodide (weight ratio = 0.5/8), extended to 3.5 times, and the membrane was stained. Thereafter, the film was stretched in a borate ester aqueous solution at 65° C. so that the total stretching ratio became 6 times. After stretching, it was dried in an oven at 40° C. for 3 minutes to obtain a PVA (polyvinyl alcohol) polarizing element (SP value 32.8, thickness 23 μm). The moisture content is 14% by weight.
<透明保護膜之製作> 對厚度40 μm、透濕度60 g/m2 /24 h之丙烯酸系樹脂膜(SP值22.2)之易接著處理面實施電暈處理而使用。<Preparation of transparent protective film> Corona treatment is applied to the easy-adhesion surface of an acrylic resin film (SP value 22.2) with a thickness of 40 μm and a moisture permeability of 60 g/m 2 /24 h.
<活性能量線> 作為活性能量線,使用: ・紫外線照射裝置(封入鎵之金屬鹵化物燈):Fusion UV Systems, Inc公司製造之Light HAMMER10; ・燈泡:V燈泡; ・峰值照度:1600 mW/cm2 ; ・累計照射量1000/mJ/cm2 (波長380~440 nm)。再者,紫外線之照度係使用Solatell公司製造之Sola-Check系統進行測定。<Active energy rays> As active energy rays, use: ・Ultraviolet irradiation device (gallium-encapsulated metal halide lamp): Light HAMMER10 manufactured by Fusion UV Systems, Inc. ・Lamp: V bulb; ・Peak illuminance: 1600 mW/ cm 2 ; ・Cumulative irradiation dose 1000/mJ/cm 2 (wavelength 380~440 nm). In addition, the illuminance of ultraviolet rays was measured using the Sola-Check system manufactured by Solatell.
<活性能量線硬化型接著劑之製備> 將作為自由基聚合性化合物(A)之N-羥基乙基丙烯醯胺(SP值29.6、均聚物之Tg 123℃、興人公司製造)38.3份、作為自由基聚合性化合物(B)之三丙二醇二丙烯酸酯(商品名:ARONIX M-220、SP值19.0、均聚物之Tg 69℃、東亞合成公司製造)19.1份、作為自由基聚合性化合物(C)之丙烯醯基𠰌啉(SP值22.9、均聚物之Tg 150℃、興人公司製造)38.3份、及光聚合起始劑(商品名:KAYACURE DETX-S、二乙基9-氧硫、日本化藥公司製造)1.4份混合,並於50℃下攪拌1小時,從而獲得活性能量線硬化型接著劑。<Preparation of active energy ray curable adhesive> 38.3 parts of N-hydroxyethylacrylamide (SP value 29.6, homopolymer Tg 123°C, manufactured by Kojin Co., Ltd.) as the radical polymerizable compound (A) 19.1 parts of tripropylene glycol diacrylate (trade name: ARONIX M-220, SP value 19.0, homopolymer Tg 69°C, manufactured by Toagosei Co., Ltd.) as the radically polymerizable compound (B), as the radically polymerizable compound (B) Compound (C): 38.3 parts of acrylamide (SP value 22.9, Tg of homopolymer 150°C, manufactured by Kojin Co., Ltd.), and photopolymerization initiator (trade name: KAYACURE DETX-S, diethyl 9 -oxygen sulfur , manufactured by Nippon Kayaku Co., Ltd.), mix 1.4 parts and stir at 50°C for 1 hour to obtain an active energy ray-hardening adhesive.
<偏光膜A之製作> 於上述丙烯酸系樹脂膜上形成厚度0.5 μm之胺基甲酸酯系易接著劑層之後,使用MCD塗佈機(富士機械公司製造)(單元形狀:蜂窩狀;凹版輥線數:1000根/inch、旋轉速度140%/相對線速度),將上述活性能量線硬化型接著劑以接著劑層之厚度成為0.5 μm之方式塗佈於該易接著劑層。然後,將上述丙烯酸系樹脂膜作為視認側及面板側之透明保護膜利用滾壓機經由上述接著劑貼合於上述偏光元件之兩面。其後,使用IR加熱器自貼合後之丙烯酸系樹脂膜之兩側加熱至50℃,並對兩面照射上述紫外線,使活性能量線硬化型接著劑硬化。進而,於70℃下熱風乾燥3分鐘,從而獲得於偏光元件之兩面具有透明保護膜之偏光膜A(表1)。於貼合之線速度為25 m/min下進行。 [表1]
<黏著劑之製備> (聚合物溶液A之製備) 將丙烯酸丁酯100份、丙烯酸5份、丙烯酸2-羥基乙酯0.075份及2,2'-偶氮二異丁腈0.3份與乙酸乙酯一同添加至具備冷卻管、氮氣導入管、溫度計及攪拌裝置之反應容器中,而製備溶液。然後,一面向該溶液吹入氮氣一面進行攪拌,並於60℃下使其反應4小時,從而獲得含有重量平均Mw為220萬之丙烯酸系聚合物之溶液。進而向該含有丙烯酸系聚合物之溶液中添加乙酸乙酯,從而獲得將固形物成分濃度調整至30%之丙烯酸系聚合物溶液A。<Preparation of adhesive> (Preparation of polymer solution A) Mix 100 parts of butyl acrylate, 5 parts of acrylic acid, 0.075 parts of 2-hydroxyethyl acrylate and 0.3 parts of 2,2'-azobisisobutyronitrile with ethyl acetate The ester is added together to a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer and a stirring device to prepare a solution. Then, the solution was stirred while blowing nitrogen gas into it, and reacted at 60° C. for 4 hours to obtain a solution containing an acrylic polymer with a weight average Mw of 2.2 million. Further, ethyl acetate was added to the solution containing the acrylic polymer to obtain an acrylic polymer solution A in which the solid content concentration was adjusted to 30%.
相對於上述丙烯酸系聚合物溶液A之固形物成分100份,依序調配作為交聯劑之0.6份之以具有異氰酸基之化合物為主成分之交聯劑(日本聚胺酯(股)製造、商品名「Coronate L」)、及作為矽烷偶合劑之0.075份之γ-縮水甘油氧基丙基三甲氧基矽烷(信越化學工業(股)製造、商品名「KBM-403」),從而製備黏著劑聚合物溶液A。To 100 parts of the solid content of the acrylic polymer solution A, 0.6 parts of a cross-linking agent containing a compound having an isocyanate group as a main component (manufactured by Nippon Polyurethane Co., Ltd., Trade name "Coronate L"), and 0.075 parts of γ-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name "KBM-403") as a silane coupling agent to prepare an adhesive Agent polymer solution A.
(聚合物溶液B之製備) 將丙烯酸2-乙基己酯(2EHA)94份、丙烯酸6份及2,2'-偶氮二異丁腈0.3份與乙酸乙酯一同添加至具有冷卻管、氮氣導入管、溫度計及攪拌裝置之反應容器中,從而製備溶液。然後,一面向該溶液中吹入氮氣一面進行攪拌,並於60℃下使其反應4小時,從而獲得含有重量平均分子量Mw為220萬之丙烯酸系聚合物之溶液。進而,向該含有丙烯酸系聚合物之溶液中添加乙酸乙酯,從而獲得將固形物成分濃度調整至30%之丙烯酸系聚合物溶液(B)。(Preparation of polymer solution B) Add 94 parts of 2-ethylhexyl acrylate (2EHA), 6 parts of acrylic acid and 0.3 parts of 2,2'-azobisisobutyronitrile together with ethyl acetate into a cooling tube. Nitrogen gas is introduced into the reaction vessel of the tube, thermometer and stirring device to prepare the solution. Then, the solution was stirred while blowing nitrogen gas into it, and reacted at 60° C. for 4 hours to obtain a solution containing an acrylic polymer with a weight average molecular weight Mw of 2.2 million. Furthermore, ethyl acetate was added to the solution containing the acrylic polymer to obtain an acrylic polymer solution (B) in which the solid content concentration was adjusted to 30%.
相對於上述丙烯酸系聚合物溶液(B)之固形物成分100份,依序調配作為交聯劑之0.6份之以具有異氰酸基之化合物為主成分之交聯劑(日本聚胺酯(股)製造、商品名「Coronate L」)、及作為矽烷偶合劑之0.075份之γ-縮水甘油氧基丙基三甲氧基矽烷(信越化學工業(股)製造、商品名「KBM-403」),從而製備黏著劑聚合物溶液B。To 100 parts of the solid content of the acrylic polymer solution (B), 0.6 parts of a cross-linking agent containing a compound having an isocyanate group as a main component (Japan Polyurethane Co., Ltd.) was prepared as a cross-linking agent. Manufactured, trade name "Coronate L"), and 0.075 parts of γ-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name "KBM-403") as a silane coupling agent, thereby Prepare adhesive polymer solution B.
將丙烯酸系聚合物溶液(A)(聚合物A)及丙烯酸系聚合物溶液(B)(聚合物B)之組成示於下述表2。 [表2]
(聚矽氧低聚物A之製備) 向具備攪拌翼、溫度計、氮氣導入管、冷卻器、滴液漏斗之四口燒瓶中放入乙酸乙酯100份、MMA40份、正甲基丙烯酸丁酯(BMA)20份、甲基丙烯酸2-乙基己酯(2EHMA)20份、官能基當量為900 g/mol之含聚有機矽氧烷骨架之甲基丙烯酸酯單體(商品名:X-22-174ASX、信越化學工業股份有限公司製造)8.7份、官能基當量為4600 g/mol之含聚有機矽氧烷骨架之甲基丙烯酸酯單體(商品名:KF-2012、信越化學工業股份有限公司製造)11.3份及作為鏈轉移劑之巰基乙酸甲酯0.2份。然後,以70℃於氮氣氛圍下攪拌1小時後,放入作為熱聚合起始劑之2,2'-偶氮二異丁腈0.2份,於70℃下使其反應2小時,之後放入作為熱聚合起始劑之2,2'-偶氮二異丁腈0.1份,繼而於80℃下使其反應3小時。如此獲得聚矽氧低聚物之溶液。該聚矽氧低聚物之重量平均分子量Mw為18000。(Preparation of polysilicone oligomer A) Put 100 parts of ethyl acetate, 40 parts of MMA, and n-butyl methacrylate into a four-necked flask equipped with a stirring wing, a thermometer, a nitrogen introduction tube, a cooler, and a dropping funnel. (BMA) 20 parts, 2-ethylhexyl methacrylate (2EHMA) 20 parts, a methacrylate monomer containing a polyorganosiloxane skeleton with a functional group equivalent of 900 g/mol (trade name: X- 22-174ASX, manufactured by Shin-Etsu Chemical Industry Co., Ltd.) 8.7 parts of methacrylate monomer containing polyorganosiloxane skeleton with a functional group equivalent of 4600 g/mol (trade name: KF-2012, Shin-Etsu Chemical Industry Co., Ltd. Co., Ltd.) and 0.2 parts of methyl thioglycolate as a chain transfer agent. Then, after stirring for 1 hour at 70°C in a nitrogen atmosphere, 0.2 part of 2,2'-azobisisobutyronitrile as a thermal polymerization initiator was added, and the reaction was carried out at 70°C for 2 hours, and then added 0.1 part of 2,2'-azobisisobutyronitrile was used as a thermal polymerization initiator, and then reacted at 80° C. for 3 hours. A solution of polysiloxane oligomer is thus obtained. The weight average molecular weight Mw of the polysiloxy oligomer is 18,000.
(其他聚矽氧低聚物B~F之製備) 關於聚矽氧低聚物B~F,將單體組成及質量份變更為表3中記載之構成成分,除此以外,以與聚矽氧低聚物A相同之方式進行製作。(Preparation of other polysilicone oligomers B to F) Regarding polysilicone oligomers B to F, the monomer composition and mass parts were changed to the structural components described in Table 3. Otherwise, the same as polysilicone oligomers B to F. Oxygen oligomer A was prepared in the same manner.
[表3]
(黏著劑溶液之製備) 向上述製備之黏著劑聚合物溶液A中調配1份之聚矽氧低聚物A而製備實施例1中使用之丙烯酸系黏著劑溶液。以相同之方式使用下述表4中記載之黏著劑聚合物溶液及聚矽氧低聚物而製備實施例2~19中使用之丙烯酸系黏著劑溶液。(Preparation of adhesive solution) 1 part of polysiloxane oligomer A was prepared into the adhesive polymer solution A prepared above to prepare the acrylic adhesive solution used in Example 1. The acrylic adhesive solutions used in Examples 2 to 19 were prepared in the same manner using the adhesive polymer solution and polysiloxane oligomer described in Table 4 below.
(附黏著劑層之偏光膜之製作) [實施例1]~[實施例19] 然後,將上述丙烯酸系黏著劑溶液均勻地塗佈於利用聚矽氧系剝離劑處理後之聚對苯二甲酸乙二酯膜(隔片膜)之表面,於155℃之空氣循環式恆溫烘箱中將其乾燥2分鐘,從而於隔片膜之表面形成厚度20 μm之黏著劑層。使形成有黏著劑層之隔片移著於上述偏光膜之單面,而製作附黏著劑層之偏光膜。(Preparation of polarizing film with adhesive layer) [Example 1] ~ [Example 19] Then, the above-mentioned acrylic adhesive solution was evenly coated on the polyterephthalate treated with a polysiloxy release agent. The surface of the ethylene formate film (separator film) was dried in an air circulation constant temperature oven at 155°C for 2 minutes to form an adhesive layer with a thickness of 20 μm on the surface of the separator film. The separator formed with the adhesive layer is moved to one side of the above-mentioned polarizing film to prepare a polarizing film with an adhesive layer.
[比較例1] 於比較例1中,除去聚矽氧低聚物A,除此以外,以與實施例1相同之方式製作附黏著劑層之偏光膜。[Comparative Example 1] In Comparative Example 1, except that the polysiloxane oligomer A was removed, a polarizing film with an adhesive layer was produced in the same manner as in Example 1.
[比較例2]~[比較例5] 於比較例2~5中,使用含醚基之聚矽氧烷(信越化學工業股份有限公司製造、商品名「改性聚矽氧油KF-353」)來代替聚矽氧低聚物A,並如表4所示般變更調配量,除此以外,以與實施例1相同之方式製作附黏著劑層之偏光膜。[Comparative Example 2] ~ [Comparative Example 5] In Comparative Examples 2 to 5, ether group-containing polysiloxane (manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name "modified polysiloxane KF-353") was used ) instead of polysiloxane oligomer A, and except that the compounding amount was changed as shown in Table 4, a polarizing film with an adhesive layer was produced in the same manner as in Example 1.
[參照例1] 於參照例1中,使用另一再加工提高劑(Kaneka公司製造、商品名「SAT10」)來代替聚矽氧低聚物A,並如圖4所示般變更調配量,除此以外,以與實施例1相同之方式製作附黏著劑層之偏光膜。[Reference Example 1] In Reference Example 1, another reprocessing enhancer (trade name "SAT10" manufactured by Kaneka Co., Ltd.) was used instead of polysiloxane oligomer A, and the blending amount was changed as shown in Figure 4, except that Otherwise, a polarizing film with an adhesive layer was produced in the same manner as in Example 1.
對上述實施例1~19、比較例1~5、及參照例1中所獲得之附黏著劑層之偏光膜進行下述評價。將結果示於表4。The polarizing films with adhesive layers obtained in Examples 1 to 19, Comparative Examples 1 to 5, and Reference Example 1 were evaluated as follows. The results are shown in Table 4.
<耐久性之評價> 將附黏著劑層之偏光膜(37英吋)之隔片膜剝下,使用貼合機將其貼合於厚度0.7 mm之無鹼玻璃(Corning公司製造、EG-XG)。然後,於50℃、0.5 MPa下,進行15分鐘之高壓釜處理,使上述偏光膜完全密接於無鹼玻璃。然後,將其分別放入至80℃之加熱烘箱(加熱)條件下,按下述基準對500小時後有無偏光板之剝落進行評價。 A:完全未觀察到剝落。 B:觀察到無法目視確認之程度之發泡。 C:觀察到無法目視確認之程度之剝落。 D:觀察到可目視確認之較小之發泡或剝落。 E:觀察到明顯之發泡或剝落。<Evaluation of durability> Peel off the separator film of the polarizing film (37 inches) with the adhesive layer, and use a laminating machine to laminate it to alkali-free glass with a thickness of 0.7 mm (made by Corning Co., Ltd., EG-XG ). Then, perform an autoclave treatment at 50°C and 0.5 MPa for 15 minutes to completely adhere the polarizing film to the alkali-free glass. Then, each was placed in a heating oven (heating) at 80°C, and the presence or absence of peeling of the polarizing plate after 500 hours was evaluated according to the following criteria. A: No peeling was observed at all. B: Foaming is observed to a degree that cannot be visually confirmed. C: Peeling is observed to a degree that cannot be visually confirmed. D: Minor bubbling or peeling that can be visually confirmed is observed. E: Obvious foaming or peeling is observed.
<黏著力之評價> (1)初始黏著力之測定 於23℃、50% RH之標準環境下,將製作之附黏著劑層之偏光膜裁斷成縱120 mm×橫25 mm,將所得者作為樣本。使2 kg之輥往返1次將該樣本壓接於厚度0.7 mm之無鹼玻璃板(Corning公司製造、EG-XG)之後,測定該樣本之黏著力。黏著力係藉由對利用拉伸試驗機(Autograph SHIMAZU AG-1 10KN)將該樣本以剝離角度90°、剝離速度300 mm/min剝離時之黏著力(N/25 mm、測定長度80 mm)進行測定而求出。測定係以1次/0.5 s之間隔取樣200次,將其平均值作為測定值。於檢體數為3個檢體下進行。將其等之平均值作為初始黏著力而示於表4之「2 kg輥」之欄。並且,根據黏著力之水準按下述基準判斷再加工性。 A:4 N/25 mm以下,再加工成功90%。 B:超過4 N/25 mm且5 N/25 mm以下,再加工成功80%以上。 C:超過5 N/25 mm且6 N/25 mm以下,再加工成功70%以上。 D:超過6 N/25 mm且7 N/25 mm以下,再加工成功60%以上。 E:超過7 N/25 mm,再加工失敗多於40%。<Evaluation of Adhesion> (1) Measurement of Initial Adhesion Under the standard environment of 23℃ and 50% RH, cut the produced polarizing film with adhesive layer into a length of 120 mm×width 25 mm, and use the result as sample. The sample was pressure-bonded to an alkali-free glass plate (manufactured by Corning Co., Ltd., EG-XG) with a thickness of 0.7 mm by making a 2 kg roller reciprocate once, and then the adhesion force of the sample was measured. The adhesion force is measured by using a tensile testing machine (Autograph SHIMAZU AG-1 10KN) to peel off the sample at a peeling angle of 90° and a peeling speed of 300 mm/min (N/25 mm, measuring length 80 mm). Find it by measuring it. The measurement system samples 200 times at intervals of 1 time/0.5 s, and the average value is used as the measured value. It was carried out when the number of specimens was 3 specimens. The average value is shown in the "2 kg roller" column of Table 4 as the initial adhesive force. Furthermore, the reworkability is judged based on the level of adhesion according to the following criteria. A: Below 4 N/25 mm, reprocessing is 90% successful. B: More than 4 N/25 mm and less than 5 N/25 mm, reprocessing success is over 80%. C: More than 5 N/25 mm and less than 6 N/25 mm, reprocessing success is over 70%. D: More than 6 N/25 mm and less than 7 N/25 mm, reprocessing success is over 60%. E: More than 7 N/25 mm, more than 40% of reprocessing failures.
(2)加熱後黏著力之測定 將製作之附黏著劑層之偏光膜裁斷成縱120 mm×橫25 mm,將所得者作為樣本。使用貼合機將該樣本貼附於厚度0.7 mm之無鹼玻璃板(Corning公司製造、EG-XG),然後,於50℃、5 atm下進行高壓釜處理15分鐘使其完全密接後,測定該樣本之黏著力。黏著力係藉由對利用拉伸試驗機(Autograph SHIMAZU AG-1 10KN)將該樣本以剝離角度90°、剝離速度300 mm/min剝離時之黏著力(N/25 mm、測定長度80 mm)進行測定而求出。測定係以1次/0.5 s之間隔取樣200次,將其平均值作為測定值。於檢體數為3個檢體下進行。表4中,「60℃×2 h」及「60℃×24 h」表示於60℃下分別放置2小時及24小時之後的黏著力。(2) Measurement of adhesion after heating: Cut the produced polarizing film with adhesive layer into 120 mm length × 25 mm width, and use the result as a sample. The sample was attached to a 0.7 mm thick alkali-free glass plate (EG-XG manufactured by Corning Corporation) using a laminating machine, and then autoclaved at 50°C and 5 atm for 15 minutes to achieve complete adhesion, and then measured. The adhesion of this sample. The adhesion force is measured by using a tensile testing machine (Autograph SHIMAZU AG-1 10KN) to peel off the sample at a peeling angle of 90° and a peeling speed of 300 mm/min (N/25 mm, measuring length 80 mm). Find it by measuring it. The measurement system samples 200 times at intervals of 1 time/0.5 s, and the average value is used as the measured value. It was carried out when the number of specimens was 3 specimens. In Table 4, "60℃×2 h" and "60℃×24 h" represent the adhesion after being placed at 60℃ for 2 hours and 24 hours respectively.
[表4]
如上所述,根據本發明,能夠提供一種兼備高耐久性與再加工性之附黏著劑層之偏光膜。As described above, according to the present invention, it is possible to provide a polarizing film with an adhesive layer that has both high durability and reworkability.
1:偏光元件 2:保護膜 2':保護膜 3:偏光膜 4:黏著劑層 5:隔片 10:附黏著劑層之偏光膜1:Polarizing element 2: Protective film 2':Protective film 3:Polarizing film 4: Adhesive layer 5: spacer 10: Polarizing film with adhesive layer
圖1係本發明之附黏著劑層之偏光膜之概略剖視圖的一例。FIG. 1 is an example of a schematic cross-sectional view of a polarizing film with an adhesive layer according to the present invention.
1:偏光元件 1:Polarizing element
2:保護膜 2: Protective film
2':保護膜 2':Protective film
3:偏光膜 3:Polarizing film
4:黏著劑層 4: Adhesive layer
5:隔片 5: spacer
10:附黏著劑層之偏光膜 10: Polarizing film with adhesive layer
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