TWI822288B - Packaging method - Google Patents
Packaging method Download PDFInfo
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- TWI822288B TWI822288B TW111133038A TW111133038A TWI822288B TW I822288 B TWI822288 B TW I822288B TW 111133038 A TW111133038 A TW 111133038A TW 111133038 A TW111133038 A TW 111133038A TW I822288 B TWI822288 B TW I822288B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 105
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000002274 desiccant Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 238000012856 packing Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 24
- 238000001514 detection method Methods 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000002372 labelling Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Supplying Of Containers To The Packaging Station (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Container Filling Or Packaging Operations (AREA)
Abstract
Description
本發明與如何將一物品包裝於一包裝袋的方法有關,例如如何將一晶圓盒包裝於一專用包裝袋的方法。 The present invention relates to a method of packaging an item in a packaging bag, such as a method of packaging a wafer box in a special packaging bag.
半導體產業經常利用晶圓盒來裝載晶圓,例如前開式通用晶圓盒(front opening unified pod;FOUP)可以在廠內運輸時保護晶圓,前開式晶圓運輸盒(front opening shipping box;FOSB)裝載晶圓可以在廠與廠之間運輸時保護晶圓。每一晶圓盒在運輸的過程中為了避免外部環境的微塵進入內部造成汙染而影響到良率,通常會將它包裝在一專用包裝袋內,以形成一包裝體。目前,該專用包裝袋有鋁袋、抗靜電袋、塑膠袋……等多種選擇,特性各有不同,可視需求決定。然而,如何安排一晶圓盒包裝於該專用包裝袋的流程以供遵循,仍待提出。 The semiconductor industry often uses wafer boxes to load wafers. For example, front opening unified pods (FOUP) can protect wafers during transportation within the factory, and front opening shipping boxes (FOSB) ) loading wafers protects the wafers during transportation between fabs. During the transportation process, each wafer box is usually packed in a special packaging bag to form a packaging body in order to prevent dust from the external environment from entering the interior and causing contamination and affecting the yield. At present, the special packaging bags include aluminum bags, anti-static bags, plastic bags, etc., with different characteristics and can be determined according to the needs. However, how to arrange the process of packaging a wafer cassette in the special packaging bag to be followed remains to be proposed.
本發明提供一種將一物品包裝於一包裝袋的包裝方法,其包括:將該包裝袋及該物品送到一包裝區,在該包裝區中,該包裝袋的一袋口與該物品的一第一側面(例如該物品後側面或底面)係相正對;將該包裝袋的一上袋片及一下袋片相對分開一預定距離,以使該包裝袋的該上、下袋片及兩側袋片展開形成足以容納該物品的一個容納空間;推該物品的一第二側面(例如前側面或頂面),用以將該物品推進該包裝袋的該容納空間內;對兩該側袋片 靠近該袋口的一前段進行一向內摺疊作業,以使該上袋片及該下袋片靠近該袋口的一前段相對靠攏且夾住已被向內摺疊的該兩該側袋片的該前段;及對已相對靠攏的該上袋片及該下袋片的該前段的進行一熱壓封口作業。 The invention provides a packaging method for packaging an item in a packaging bag, which includes: sending the packaging bag and the item to a packaging area, in which a mouth of the packaging bag and a mouth of the item are connected. The first side (for example, the rear side or the bottom surface of the article) is opposite; an upper bag piece and a lower bag piece of the packaging bag are relatively separated by a predetermined distance, so that the upper and lower bag pieces of the packaging bag and the two The side bag pieces are unfolded to form a storage space sufficient to accommodate the item; push a second side (such as the front side or top surface) of the item to push the item into the storage space of the packaging bag; pair the two sides bag piece A front section close to the bag mouth performs an inward folding operation, so that the front section of the upper bag piece and the lower bag piece close to the bag mouth is relatively close and clamps the two side bag pieces that have been folded inward. The front section; and perform a heat-pressing sealing operation on the front section of the upper bag piece and the lower bag piece that are relatively close together.
a~e:步驟 a~e: steps
1:包裝袋 1: Packing bag
10:物品 10:Items
101:第一側面 101:First side
102:第二側面 102: Second side
103:頂面 103:Top surface
11:袋底 11:Bag bottom
111:門板 111:Door panel
12:袋口 12: Bag mouth
120:容納空間 120: Accommodation space
13:袋體 13: Bag body
131:上袋片 131: Bagging piece
132:下袋片 132:Lower bag piece
133、134:側袋片 133, 134: Side pockets
135:膠帶 135:Tape
3:乾燥劑 3: Desiccant
圖1顯示本發明之包裝方法的一個較佳實施例的流程示意圖。 Figure 1 shows a schematic flow chart of a preferred embodiment of the packaging method of the present invention.
圖2顯示待包裝的一物品10及用於包裝該物品10的一包裝袋1的外觀示意圖。
FIG. 2 shows a schematic view of the appearance of an
圖3顯示該包裝袋1展開到足以容納該物品10的大小。
FIG. 3 shows that the packaging bag 1 is expanded to a size sufficient to accommodate the
圖4顯示該物品10已被推入該包裝袋1的情形。
FIG. 4 shows the situation that the
圖5顯示該較佳實施例的一向內摺疊作業的動作示意圖。 Figure 5 shows a schematic diagram of an inward folding operation of the preferred embodiment.
圖6顯示該較佳實施例的一熱壓封口業的動作示意圖。 Figure 6 shows a schematic diagram of the operation of a hot-press sealing industry in this preferred embodiment.
圖7顯示該包裝袋1的一前段被向下彎折且被黏住的情形。 Figure 7 shows a situation in which a front section of the packaging bag 1 is bent downward and stuck.
圖1顯示本發明之包裝方法的一個較佳實施例的流程示意圖,圖2顯示待包裝的一物品10及用於包裝該物品10的一包裝袋1。該包裝方法係用於將該物品10包裝於該包裝袋1內。該物品10可為用於放置多片晶圓(圖中未示)的一晶圓盒,例如一前開式通用晶圓盒(FOUP),或是一前開式晶圓運輸盒(FOSB),但也可以是其它物品。至於該包裝袋1則可為用於包裝上述晶圓盒的上述專用包裝袋,但不以此為限。
Figure 1 shows a schematic flow chart of a preferred embodiment of the packaging method of the present invention. Figure 2 shows an
如圖2所示,作為示範的該包裝袋1包括已密封的一袋底11、未密封的該袋口12及位於該袋底11與該袋口12之間的一袋體13。該包裝袋1一開始是處於呈扁平狀的一未展開狀態,其袋體13的一上袋片131及一下袋片132係重疊在一起,且該袋口12
呈一閉合狀態。如圖3所示,該袋體13還包括位於該上袋片131與該下袋片132之間且相正對的兩側袋片133與134。兩該側袋片133與134在該包裝袋1處於該未展開狀態時,係分別被向內摺疊且被夾在重疊的該上袋片131及該下袋片132之間,故在圖2中無法看到它們。
As shown in FIG. 2 , the exemplary packaging bag 1 includes a sealed
在圖1所示的實施例中,本發明之包裝方法包括步驟a至e,茲說明如下:該步驟a包括:如圖2所示,將該包裝袋1及該物品10送到一包裝區。在該包裝區中,該包裝袋1的一袋口12與該物品10的一第一側面101係相正對。該物品10的該第一側面101位於該物品10的一第二側面102的對面。在此實施例中,該物品10的該第一側面101係為該晶圓盒的一後側面,該第二側面102係為該晶圓盒的一前側面。然而,在該包裝區中的晶圓盒的哪一個側面應正對該袋口12,視該晶圓盒的款式而定,不以前述為限。
In the embodiment shown in Figure 1, the packaging method of the present invention includes steps a to e, which are described as follows: Step a includes: as shown in Figure 2, sending the packaging bag 1 and the
該步驟b包括:如圖3所示,將該包裝袋1的該上袋片131及該下袋片132相對分開一預定距離A,以使該上袋片131、該下袋片132及兩該側袋片133、134展開形成足以容納該物品10的一個容納空間120。在此施實例中,該包裝袋1的該下袋片132是由一平台上(圖中未示)的一或多個真空吸嘴吸住,該上袋片131則由位於該平台上方且可昇降的一吸附裝置(圖中未示)的一或多個真空吸嘴吸住,然後,該吸附裝置帶著該上袋片131上移,該平台保持不動,以使該上袋片131及該下袋片132相對分開。然而,也可以將該吸附裝置改配置成不動,及將該平台配置成可昇降,然後,由該平台帶著該下袋片132下移。或是,將該吸附裝置及該平台都改配置成可昇降,然後,由該吸附裝置帶著該上袋片131上移,同時,該平台帶著該下袋片132下移。
This step b includes: as shown in Figure 3, relatively separating the
該步驟c包括:推該物品10的該第二側面102,用以將該物品10推進該包裝袋1的該容納空間120內,一如圖4所示。
Step c includes: pushing the
該步驟d包括:對兩該側袋片133、134靠近該袋口
12的一前段進行一向內摺疊作業,如圖5所示,隨著該向內摺疊作業的進行,該上袋片131及該下袋片132靠近該袋口12的一前段逐漸相對靠近,最後,該上袋片131及該下袋片132的該前段靠攏在一起且夾住已被向內摺疊的該兩該側袋片133、134的該前段。
This step d includes: placing the two
如圖6所示,該步驟e包括:對已相對靠攏的該上袋片及該下袋片131、132的該前段的進行一熱壓封口作業。其中,該熱壓封口作業較佳是由一對熱壓頭2來進行的。
As shown in FIG. 6 , step e includes: performing a heat-pressing sealing operation on the front sections of the upper bag piece and the
較佳地,本發明上述包裝方法可再包括:在完成該向內摺疊作業之後、進行該熱壓封口作業之前,進行一抽氣作業,用以將該包裝袋1內的空氣抽出,以使該包裝袋1內部形成想要的一真空狀態。然而,此一步驟並非必要,且可視需求決定要抽出多少空氣或抽多久的空氣,被抽出的空氣愈多,該真空狀態的真空度就愈高,反之愈低。 Preferably, the above-mentioned packaging method of the present invention may further include: after completing the inward folding operation and before performing the hot-pressing sealing operation, performing an air extraction operation to extract the air in the packaging bag 1 so that A desired vacuum state is formed inside the packaging bag 1 . However, this step is not necessary, and how much air or how long the air needs to be extracted depends on the demand. The more air is extracted, the higher the vacuum degree of the vacuum state, and vice versa.
較佳地,本發明上述包裝方法可再包括:在完成進行該熱壓封口作業之後,如圖7所示,將該上袋片131及該下袋片132的該前段往下彎折予以黏住,以使該上袋片131及該下袋片132的該前段貼近該物品10的該第二側面102。然而,此一步驟並非必要,且在此實施例中,是使用一或多個膠帶135來黏住該上袋片131及該下袋片132的該前段。
Preferably, the above-mentioned packaging method of the present invention may further include: after completing the hot-pressing sealing operation, as shown in FIG. 7 , bending the front sections of the
較佳地,本發明上述包裝方法還可再包括:在將該物品10送到該包裝區之前,如圖2所示,將一或多包乾燥劑3放置於該物品10上。通常是將前述乾燥劑3放置於該物品10的一頂面103,然而,亦有可能將前述乾燥劑3放置於該物品10的其它表面,例如將前述乾燥劑3黏貼於該物品10的該第一側面101(後側面)或該第二側面102(前側面)。更進一步地,本發明上述包裝方法更包括在將該物品10推進該包裝袋1的該容納空間120之前,檢測該物品10上是否有無前述乾燥劑3,例如選用一影像檢測方式來進行前述檢測,確保該包裝袋1內有前述乾燥劑3來吸收水氣。
Preferably, the above-mentioned packaging method of the present invention may further include: before sending the
在其它的實施例中,本發明上述包裝方法可包括以
下一或多個步驟:一濕度指示卡放置步驟:其包括在將該物品10推進該包裝袋1的該容納空間120之前,將一或多張濕度指示卡(Humidity indcator Card,HIC)放置在該物品10上。
In other embodiments, the above packaging method of the present invention may include
Next or multiple steps: a humidity indicator card placement step: it includes placing one or more humidity indicator cards (Humidity Indcator Card, HIC) in the receiving
一包裝袋貼標步驟:其包括在將該包裝袋1送到該包裝區之前,將一或多個標籤(圖中未示)貼在該包裝袋1的該上袋片131上。
A packaging bag labeling step: it includes affixing one or more labels (not shown in the figure) to the
一識別標籤讀取步驟:其包括在將該物品10送到該包裝區之前,較佳是放置上述乾燥劑3之前,讀取該物品10上的一或多個識別標籤(圖中未示),例如條碼標籤或射頻識別標籤。
An identification tag reading step: it includes reading one or more identification tags (not shown in the figure) on the
一物品貼標步驟:其包括在將該物品10送到該包裝區之前,將一或多個標籤(圖中未示)貼在該物品10上。例如貼在該物品10的該頂面103,及/或該第一側面101(後側面),及/或該第二側面102(前側面)。
An article labeling step: it includes affixing one or more labels (not shown in the figure) to the
一資訊墊拆除步驟:其包括在將該一或多個標籤貼在該物品10之後,拆除該物品10上的一或多個資訊墊(Info-pad,圖中未示),及將該拆除下來的該一或多個資訊墊送至一儲存槽(圖中未示)內。
An information pad removal step: it includes, after affixing the one or more labels to the
一氮氣充填步驟:其包括在將該物品10送到該包裝區之前,將氮氣充填於該物品10內,藉以排除或降低該物品10內的濕氣及氧氣。
A nitrogen filling step: it includes filling the
一物品內部狀態檢測步驟:其包括在將該物品10送到該包裝區之前,檢測該物品10內的濕度及氧氣濃度。例如可在該氮氣充填步驟執行之前及/或之後,進行前述濕度及氧氣濃度的檢測。
An article internal state detection step: it includes detecting the humidity and oxygen concentration in the
一物品內部置放槽檢測步驟:其包括在將該物品10送到該包裝區之前,檢測該物品10內的多個置放槽(圖中未示)的狀態,舉例而言,當該物品10為上述晶圓盒時,該晶圓盒內的每一置放槽理想上都應該正確地插入一片晶圓。在該晶圓盒的該第一側
面101(後側面)對應該些置放槽的區域是透光或透明的情況下,可利用一CCD拍攝裝置(圖中未示)拍攝該第一側面101,然後,利用一影像檢測方式檢測是否有置放槽沒有插入晶圓的情形、及/或是否有晶圓斜插於置放槽的情形、及或是否有晶圓插錯置放槽的情形。
An item internal placement slot detection step: it includes detecting the status of multiple placement slots (not shown in the figure) in the
一門板檢測步驟:其包括在將該物品10推進該包裝袋1的該容納空間120之前,檢測該物品10的一門板111(參見圖2),例如檢測該門板111的方向,以判斷該門板111是否裝反,及/或檢測該門板111上的鑰匙孔(圖中未示)的方向,以判斷該門板111是否已上鎖。較佳是選用一影像檢測方式來進行前述檢測。
A door panel detection step: it includes detecting a door panel 111 (see Figure 2) of the
此外,在上述檢測過程中所拍攝取得的影像或相片都可儲存起來以供應用。 In addition, the images or photos taken during the above-mentioned inspection process can be stored for use.
a~e:步驟 a~e: steps
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0632323A (en) * | 1992-07-06 | 1994-02-08 | Bridgestone Bekaert Steel Code Kk | Packing method |
CN102556532A (en) * | 2010-12-30 | 2012-07-11 | 北大方正集团有限公司 | Circuit board packaging structure and packaging method |
TWM610157U (en) * | 2020-09-16 | 2021-04-11 | 鴻績工業股份有限公司 | Bagging mechanism |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0632323A (en) * | 1992-07-06 | 1994-02-08 | Bridgestone Bekaert Steel Code Kk | Packing method |
CN102556532A (en) * | 2010-12-30 | 2012-07-11 | 北大方正集团有限公司 | Circuit board packaging structure and packaging method |
TWM610157U (en) * | 2020-09-16 | 2021-04-11 | 鴻績工業股份有限公司 | Bagging mechanism |
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