TWI821986B - Display assembly, display device including the same and manufacturing method of display device - Google Patents

Abstract

A display assembly includes a substrate, plural conductive structures, plural light-emitting elements and an encapsulation layer. The plural conductive structures pass through the substrate respectively. Each light-emitting element has a first electrode and a second electrode, wherein the first electrodes of the plural light-emitting elements are electrically connected to the same conductive structure among the plural conductive structures, and the second electrodes of the plural light-emitting elements are electrically connected to different conductive structures among the plural conductive structures. The encapsulation layer covers the plural light-emitting elements. A display device including the display assembly and a manufacturing method of the display device are also provided.

Description

Display component, display device including same and manufacturing method of display device

The present invention relates to a display component, a display device including the same, and a manufacturing method of the display device.

Micro light-emitting diodes (μLEDs) are suitable for constructing the pixel structure of μLED display devices due to their low power consumption, high brightness, high resolution and high color saturation. The existing COB (Chip on Board) packaging technology fixes the μLED bare chip on the printed circuit board (PCB) with conductive glue or insulating glue. However, since the line width of the PCB cannot be reduced, even if the size of the μLED die has been significantly reduced, the resolution of the μLED display device cannot be improved. Furthermore, the basic PCB base plate thickness is at least 0.5mm, and it still has a certain height and weight after packaging. In addition, PCB has many layers and is expensive.

The present invention provides a display assembly with reduced thickness and weight.

The present invention provides a display device with improved resolution.

The present invention provides a manufacturing method of a display device with reduced manufacturing cost.

One embodiment of the present invention provides a display component, including: a substrate; a plurality of conductive structures, respectively penetrating the substrate; a plurality of light-emitting elements, each light-emitting element has a first electrode and a second electrode, wherein the first of the plurality of light-emitting elements The electrodes are electrically connected to the same conductive structure among the plurality of conductive structures, and the second electrodes of the plurality of light-emitting elements are electrically connected to different conductive structures among the plurality of conductive structures; and the encapsulation layer covers the plurality of light-emitting elements.

In an embodiment of the present invention, the above-mentioned plurality of light-emitting elements emit light of the same color or different colors.

In an embodiment of the present invention, the above-mentioned display component further includes a color conversion layer located between the encapsulation layer and part of the light-emitting elements.

In an embodiment of the present invention, the above-mentioned display component further includes a light modulation layer located between the encapsulation layer and the color conversion layer.

In an embodiment of the present invention, the above-mentioned display component further includes an isolation structure surrounding the color conversion layer.

In an embodiment of the present invention, the above-mentioned display component further includes a light-shielding layer, and the orthographic projection of the light-shielding layer on the substrate is outside the orthographic projection of the plurality of conductive structures on the substrate.

In an embodiment of the present invention, each of the above-mentioned conductive structures includes a connection portion located on the first surface of the substrate and a through-hole portion located in the through hole of the substrate, and the connection portion is The connecting portion is electrically connected to the light-emitting element and the through-hole portion.

In an embodiment of the present invention, the minimum spacing between the connecting portions of the plurality of conductive structures is within the range of ±50% of the spacing between the first electrode and the second electrode of the light-emitting element.

In an embodiment of the present invention, the minimum spacing between the connecting portions of the plurality of conductive structures is between 1 μm and 10 μm.

One embodiment of the present invention provides a display device, including: a backplane with a plurality of contact pads provided on its surface; and a plurality of the above-mentioned display components, each of which is electrically connected to the plurality of contact pads.

In an embodiment of the present invention, the conductive structure of the above-mentioned display component is electrically connected to the pad and the light-emitting element.

One embodiment of the present invention provides a manufacturing method of a display device, including: forming a plurality of conductive structures on a substrate; disposing a plurality of light-emitting elements on the plurality of conductive structures, and each light-emitting element has a first electrode and a second electrode, Wherein, the first electrodes of the plurality of light-emitting elements are electrically connected to the same conductive structure among the plurality of conductive structures, and the second electrodes of the plurality of light-emitting elements are electrically connected to different conductive structures among the plurality of conductive structures; an encapsulation layer is formed on on a plurality of light-emitting elements and a substrate; and cutting the packaging layer and the substrate between the plurality of light-emitting elements to form a plurality of display components.

In one embodiment of the present invention, before forming the plurality of conductive structures on the substrate, the method further includes: forming a release layer on the carrier; forming a metal layer on the release layer; and forming the substrate on the metal layer.

In an embodiment of the present invention, the above-mentioned forming of multiple conductive structures is based on the The board includes: forming a plurality of through holes through the substrate; and forming a plurality of conductive structures in the plurality of through holes.

In an embodiment of the present invention, before or after arranging the plurality of light-emitting elements on the plurality of conductive structures, the method further includes: forming a light-shielding layer on the substrate.

In an embodiment of the present invention, the above-mentioned light-shielding layer surrounds a plurality of conductive structures.

In an embodiment of the present invention, after the above-mentioned arranging the plurality of light-emitting elements on the plurality of conductive structures, the method further includes: forming a color conversion layer on a part of the light-emitting elements.

In one embodiment of the present invention, the above-mentioned forming the color conversion layer includes: forming an isolation structure surrounding a plurality of light-emitting elements respectively; forming a color conversion layer on a portion of the light-emitting elements; and forming an optical layer, and the optical layer covers another Part of the light-emitting element, color conversion layer and isolation structure.

In an embodiment of the present invention, before cutting the packaging layer and the substrate between the plurality of light-emitting elements, the method further includes: separating the release layer and the metal layer; removing a part of the metal layer and leaving another part of the metal layer. one part; and electroplating another part of the metal layer.

In an embodiment of the present invention, after the above-mentioned cutting of the packaging layer and the substrate between the plurality of light-emitting elements, the method further includes: providing a backplane with a plurality of contact pads on the surface; and arranging a plurality of display components on the backplane. on multiple pads.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings.

10:Display device

100, 200, 300: display components

110:Substrate

111: First surface

112: Second surface

120, 220, 220A, 220B: conductive structure

121, 221A, 221B: Connection part

122, 222A, 222B: Perforated part

130, 230, 230A, 230B, 230C: light-emitting components

131: Luminous body

132:First electrode

133:Second electrode

140: Encapsulation layer

320A, 320B, 320C, 320D: conductive structure

321A, 321B, 321C, 321D: Connection part

322A, 322B, 322C, 322D: Perforated part

A-A’, B-B’: hatching line

BK: isolation structure

BM: light shielding layer

BP: back panel

CA: carrier board

CP, CP1, CP2, CPa, CPb, CPc, CPd: pad

CT, CTa, CTc: color conversion layer

D1: minimum spacing

D2: Spacing

DP: pad

LS: laser beam

ML: metal layer

O1, O2: Open

OC: optical layer

P1: flat part

P2, P21, P22: Pad part

RL: release layer

VA, VA1, VA2, VA3, VA4: through hole

YL, YLa, YLc: dimming layer

1A to 1M are schematic cross-sectional views of the steps of a manufacturing method of the display device 10 according to an embodiment of the present invention.

FIG. 2A is a schematic top view of a display assembly 200 according to an embodiment of the present invention.

Figure 2B is a schematic cross-sectional view taken along section line A-A' in Figure 2A.

Figure 2C is a schematic cross-sectional view taken along section line B-B' of Figure 2A.

FIG. 3A is a schematic top view of a display assembly 300 according to an embodiment of the present invention.

FIG. 3B is a schematic bottom view of the display assembly 300 of FIG. 3A.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout this specification, the same reference numbers refer to the same elements. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrical connection" or "coupling" can mean the presence of other components between two components.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers and/or sections, It is these elements, components, regions, layers and/or sections that should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first "element", "component", "region", "layer" or "section" discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms including "at least one" or "and/or" unless the content clearly dictates otherwise. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will also be understood that when used in this specification, the terms "comprising" and/or "including" designate the presence of stated features, regions, integers, steps, operations, elements and/or parts, but do not exclude the presence of one or more The presence or addition of other features, regions, integers, steps, operations, elements, parts and/or combinations thereof.

Additionally, relative terms, such as "lower" or "bottom" and "upper" or "top," may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation illustrated in the figures. For example, if the device in one of the figures is turned over, elements described as "below" other elements would then be oriented "above" the other elements. Thus, the exemplary term "lower" may include both "lower" and "upper" orientations, depending on the particular orientation of the drawing. Similarly, if the device in the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented relative to the other elements. piece "above". Thus, the exemplary terms "lower" or "lower" may include both upper and lower orientations.

As used herein, "about," "approximately," or "substantially" includes the stated value and those within ordinary skill in the art, given the specific amount of error associated with the measurement in question (i.e., the limitations of the measurement system). An average within a range of acceptable deviations for a specific value determined by a person. For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the terms "approximately", "approximately", or "substantially" used in this article can be used to select a more acceptable deviation range or standard deviation based on optical properties, etching properties, or other properties, and one standard deviation does not apply to all. nature.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed to have meanings consistent with their meanings in the context of the relevant technology and the present invention, and are not to be construed as idealistic or excessive Formal meaning, unless expressly defined as such herein.

Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Accordingly, variations in the shape of the illustrations, for example as a result of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments described herein should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, regions shown or described as flat may typically have rough and/or non-linear characteristics. Additionally, the acute angles shown may be rounded. Therefore, as shown in the figure The regions are schematic in nature and their shapes are not intended to illustrate the precise shape of the regions and are not intended to limit the scope of the claims.

1A to 1M are schematic cross-sectional views of the steps of a manufacturing method of the display device 10 according to an embodiment of the present invention. The following describes the implementation of each step of the manufacturing method of the display device 10 with reference to the drawings, but the present invention is not limited thereto.

Referring to FIG. 1A , first, a carrier CA is provided. The carrier CA is, for example, a temporary carrier used to carry film layers formed in subsequent process steps. The material of the carrier CA may be glass or other applicable materials.

Next, a release layer RL is formed on the carrier CA, and the carrier CA can be separated from the film layer (eg, metal layer ML) formed in subsequent process steps by the release layer RL. The release layer RL is formed on the carrier CA by coating, for example. The material of the release layer RL may include polyimide resin, diethylformamide, N-methylpyrrolidone, metal or an oxide of the metal, wherein the metal is, for example, titanium (Ti), copper (Cu ), aluminum (Al), silver (Ag), iron (Fe), nickel (Ni), molybdenum (Mo), tungsten (W), etc., but are not limited to this.

Next, a metal layer ML is formed on the release layer RL. The metal layer ML may include a flat portion P1 and a plurality of pad portions P2, and the plurality of pad portions P2 are located on the flat portion P1. In this embodiment, the metal layer ML may be formed using a physical vapor deposition method (such as sputtering), a photolithography process, and an etching process, but is not limited thereto. The material of the metal layer ML may include metals or alloys with good conductivity, such as aluminum, molybdenum, titanium, copper, nickel, gold, tin, silver and other metals, alloys thereof, or combinations thereof. In some embodiments, the metal layer ML may be a multi-layer structure, for example, including successively stacked titanium layers and aluminum layers. and titanium layer, but not limited to this.

Next, please refer to FIG. 1B , a substrate 110 having a plurality of through holes VA is formed on the metal layer ML, and the through holes VA can expose the pad portion P2 of the metal layer ML. In other words, the through hole VA may completely overlap the pad portion P2 of the metal layer ML. The material of the substrate 110 may be polyimide (PI), polycarbonate (PC), polyester (PET), cyclic olefin copolymer (COC), or metal chromium compound. The material is metallocene-based cyclic olefin copolymer (mCOC) or other suitable materials, but is not limited to this. In addition, the substrate 110 may also have a single-layer structure or a multi-layer structure. The multi-layer structure may be a stack of two or more layers of any of the above materials, which may be combined and changed as needed. The substrate 110 is formed on the metal layer ML by coating, for example, and a photolithography process and an etching process can be used to form the through hole VA, but is not limited thereto.

Next, referring to FIG. 1C , a plurality of conductive structures 120 are formed in the through holes VA of the substrate 110 and on the substrate 110 . Specifically, the conductive structure 120 may include a connection part 121 located on the first surface 111 of the substrate 110 and a through hole part 122 located in the through hole VA of the substrate 110, and the through hole part 122 may electrically connect the connection part 121 and the metal layer. ML's pad P2. In this embodiment, the conductive structure 120 may be formed using a physical vapor deposition method (such as sputtering), a photolithography process, and an etching process. The material of the conductive structure 120 may include metals or alloys with good conductivity, such as aluminum, molybdenum, titanium, copper, nickel, gold, tin, silver and other metals, alloys thereof, or combinations thereof. For example, in some embodiments, the through-hole portion 122 of the conductive structure 120 may include a copper layer, and the connection portion 121 may include successively stacked copper layers, nickel layers, and gold layers, but Not limited to this.

Next, please refer to FIG. 1D to form a light-shielding layer BM on the substrate 110 . . The light shielding layer BM is formed on the substrate 110 through a coating process and a development process, for example, but is not limited thereto. The light shielding layer BM can surround multiple conductive structures 120 without overlapping the conductive structures 120, and the number of conductive structures 120 surrounded by the light shielding layer BM can be determined as needed. The light-shielding layer BM can shield the metal traces on the substrate 110 from reflecting ambient light, thereby reducing dark-state brightness and improving contrast. In addition, the light-shielding layer BM can have multiple openings O1, and the orthographic projection of the opening O1 on the substrate 110 can overlap the orthographic projection of the surrounding conductive structure 120 on the substrate 110, so as not to affect the subsequent arrangement of the light-emitting elements. The material of the light-shielding layer BM may include black resin or light-shielding metal (such as chromium) and other materials with low reflectivity and light transmittance.

Then, a plurality of light-emitting elements 130 are disposed on the conductive structure 120 . In some embodiments, multiple light-emitting elements 130 can also be disposed on the conductive structure 120 first, and then the light-shielding layer BM is formed on the substrate 110, and the orthographic projection of the light-shielding layer BM on the substrate 110 can be on the light-emitting element 130 on the substrate 110. outside the orthographic projection. The light-emitting element 130 may include a light-emitting body 131, a first electrode 132 and a second electrode 133, and the first electrode 132 and the second electrode 133 are respectively electrically connected to the connection portions 121 of different conductive structures 120. In some embodiments, other conductive materials or conductive glue may also be included between the first electrode 132 and the connection part 121 and between the second electrode 133 and the connection part 121 .

The light-emitting element 130 can be manufactured on the growth substrate and then transferred to the substrate 110 through a mass transfer process, and the first electrode 132 can serve as or electrically connect the light-emitting element 130 to the substrate 110 . The anode of the light element 130 and the second electrode 133 may serve as or be electrically connected to the cathode of the light emitting element 130 . The light-emitting body 131 may include, for example, a stack of doped and undoped semiconductor materials. The materials of the first electrode 132 and the second electrode 133 may include, for example, alloys, nitrides of metal materials, Oxides of metal materials, oxynitrides of metal materials or other suitable materials, or stacked layers of metal materials and other conductive materials, or other low resistance materials. In this embodiment, the first electrode 132 and the second electrode 133 of the light-emitting element 130 are disposed on the same side of the light-emitting body 131 . For example, the light-emitting element 130 may be a horizontal micro-light-emitting diode, but is not limited thereto. In some embodiments, the light emitting element 130 may be a vertical micro light emitting diode.

Next, please refer to FIG. 1E to form an isolation structure BK surrounding the light-emitting element 130. In other words, the isolation structure BK can have multiple openings O2, and the orthographic projection of each opening O2 on the substrate 110 can overlap one light-emitting element 130 on the substrate 110. orthographic projection. The isolation structure BK is formed on the substrate 110 through a coating process and a development process, for example. The material of the isolation structure BK, such as white photoresist, is used to isolate the color conversion materials used for different color conversions. It can also avoid lateral light mixing of the light-emitting element 130 and refract the lateral light of the light-emitting element 130 to the front viewing angle. Add light field type. In this embodiment, the isolation structure BK may partially overlap the conductive structure 120, but is not limited to this. In some embodiments, the isolation structure BK may not overlap the conductive structure 120 at all. For example, the isolation structure BK may be disposed between the conductive structure 120 and the light-shielding layer BM.

Next, please refer to Figure 1F, filling the color conversion material in the isolation structure BK and on the light-emitting element 130 to form a color conversion layer CT on the light-emitting element 130 . The color conversion layer CT may include phosphor or similar wavelength conversion materials, for example, to convert the blue light emitted by the light-emitting element 130 into red light or green light, thereby achieving a full-color display effect. Therefore, the color conversion layer CT can be formed only on part of the light-emitting elements 130, and it is not necessary to form the color conversion layer CT on all the light-emitting elements 130.

Next, please refer to FIG. 1G , the optical layer OC can be formed by coating, and the optical layer OC can cover the color conversion layer CT and the isolation structure BK. The material of the optical layer OC is, for example, transparent photoresist, but is not limited thereto. The optical layer OC can form a flat upper surface to facilitate subsequent processes.

Next, referring to FIG. 1H , the light modulating layer YL can be formed on the optical layer OC through a coating process and a developing process. In some embodiments, the light-modulating layer YL may be formed first on the color conversion layer CT and the isolation structure BK, and then the optical layer OC covering the light-modulating layer YL and the isolation structure BK may be formed. The material of the light modulating layer YL is, for example, yellow photoresist, but is not limited thereto.

Next, please refer to FIG. 1I , the encapsulation layer 140 can be formed by coating, and the encapsulation layer 140 can cover the light modulation layer YL, the optical layer OC and the light-shielding layer BM to provide light-emitting element 130 and its surrounding components. protect. The material of the encapsulation layer 140 may include polymer materials, such as epoxy resin, but is not limited thereto.

Next, please refer to FIG. 1J to separate the release layer RL and the metal layer ML to remove the carrier CA and expose the metal layer ML. In this embodiment, the above separation is performed by heat treatment, but it is not limited to this. In some embodiments, the above separation can be performed by laser.

Next, please refer to FIG. 1K , the flat portion P1 of the metal layer ML is removed, and the pad portion P2 is left. The metal layer ML may be removed by a dry etching process or an anisotropic etching process, but is not limited thereto.

Next, please refer to FIG. 1L, the pad portion P2 of the metal layer ML is electroplated to form a contact pad CP on the outer surface of the pad portion P2, and the contact pad CP can be located on the second surface 112 of the substrate 110. In this embodiment, the contact pad CP may be a nickel layer and/or a gold layer formed by chemical plating, but is not limited thereto.

Next, the encapsulation layer 140 and the substrate 110 between the light-emitting elements 130 are cut to form the display component 100 . In this embodiment, the laser beam LS can be used to perform the above-mentioned cutting, but it is not limited to this. In other embodiments, the above-mentioned cutting can also be performed along the predetermined cutting line using, for example, a knife or other suitable tool.

Next, please refer to FIG. 1M to provide a backplane BP with a plurality of contact pads DP on the surface, and then dispose multiple display components 100 on the multiple contact pads DP of the backplane BP, so that the two contacts of each display component 100 The pad CP can be electrically connected to the two pads DP on the backplane BP respectively to form the display device 10 . In some embodiments, the pad CP and the pad DP can also be electrically connected through conductive glue or other solders.

In this embodiment, the display device 10 may include: a backplane BP with a plurality of pads DP disposed on the surface; and a plurality of display components 100 electrically connected to the plurality of pads DP respectively. For example, the two pads CP of each display component 100 can be physically connected to the two pads DP on the backplane BP respectively, or the pads CP of each display component 100 and the contact pads DP on the backplane BP can be physically connected to each other. can also include other conductive materials or conductors Glue to make electrical connections. In this way, the light-emitting element 130 of the display assembly 100 can be electrically connected to the pad DP through the conductive structure 120, the pad portion P2 of the metal layer ML, and the pad CP. In addition, since there is no need to use a printed circuit board in the manufacturing process of the display device 10, the manufacturing cost of the display device 10 can be reduced.

In the following, other embodiments of the present invention will be continued to be described using FIGS. 2A to 3B , and the component numbers and related content of the embodiment of FIGS. 1A to 1M will be used, where the same numbers are used to represent the same or similar elements, and Explanations of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the embodiments of FIGS. 1A to 1M , which will not be repeated in the following description.

FIG. 2A is a schematic top view of a display assembly 200 according to an embodiment of the present invention. Figure 2B is a schematic cross-sectional view taken along section line A-A' in Figure 2A. Figure 2C is a schematic cross-sectional view taken along section line B-B' of Figure 2A. In order to simplify the expression of the diagram, FIG. 2A omits the substrate 110, the packaging layer 140, the isolation structure BK, the light modulation layers YLa and YLc, the optical layer OC and the contact pads CP1 and CP2.

Please refer to FIGS. 2A to 2C at the same time. The display component 200 includes: a substrate 110; a plurality of conductive structures 220 penetrating the substrate 110; a plurality of light-emitting elements 230 disposed on the plurality of conductive structures 220. Each light-emitting element 230 includes a light-emitting body 131. , the first electrode 132 and the second electrode 133; and the encapsulation layer 140 covering the plurality of light-emitting elements 230.

In this embodiment, the conductive structure 220 of the display assembly 200 may include one conductive structure 220A and three conductive structures 220B, but is not limited thereto. The number of the conductive structures 220A and 220B can be determined as needed, for example, it can depend on the number of the light-emitting elements 230 . In other embodiments, display component 200 may To include more conductive structures 220A and 220B. In addition, the conductive structure 220A may include a connection part 221A located on the first surface 111 of the substrate 110 and a through hole part 222A located in the through hole VA of the substrate 110, and the connection part 221A may electrically connect the light emitting element 230 and the through hole part 222A, The perforated portion 222A can electrically connect the connecting portion 221A and the pad portion P21. Similarly, the conductive structure 220B may include a connection part 221B located on the first surface 111 of the substrate 110 and a through hole part 222B located in the through hole VA of the substrate 110, and the connection part 221B may electrically connect the light emitting element 230 and the through hole part 222B. , the perforated portion 222B can electrically connect the connecting portion 221B and the pad portion P22.

In this embodiment, the light-emitting element 230 of the display assembly 200 may include light-emitting elements 230A, 230B, and 230C, where each light-emitting element 230A, 230B, and 230C includes a light-emitting body 131, a first electrode 132, and a second electrode 133. The first electrodes 132 of the light-emitting elements 230A, 230B, and 230C are all electrically connected to the conductive structure 220A, and the second electrodes 133 of the light-emitting elements 230A, 230B, and 230C are respectively electrically connected to a plurality of separate conductive structures 220B. In other words, the conductive structure 220A may serve as a part of the common electrode of the display assembly 200 . Although the display assembly 200 shown in FIGS. 2A and 2C includes one light-emitting element 230A, 230B, and 230C, it is not limited thereto. In some embodiments, display assembly 200 may include any or both of light emitting elements 230A, 230B, 230C. In other embodiments, the display assembly 200 may include more or a different number of light-emitting elements 230A, 230B, and 230C. For example, the display assembly 200 may include two or three light-emitting elements 230A, 230B, and 230C, respectively. Assembly 200 may include two light emitting elements 230A And one light-emitting element 230B, 230C each.

In this embodiment, the light-emitting elements 230A, 230B, and 230C can emit the same color light. For example, the light-emitting elements 230A, 230B, and 230C can all emit blue light, and a color conversion layer CTa can be disposed above the light-emitting element 230A. For example, the color conversion layer CTa can be located between the packaging layer 140 and the light-emitting element 230A, and the color conversion layer CTa can be placed above the light-emitting element 230C. The color conversion layer CTc is provided. For example, the color conversion layer CTc may be located between the encapsulation layer 140 and the light-emitting element 230C, and the color conversion layer may not be provided on the light-emitting element 230B. In this way, the light-emitting element 230A can convert blue light into, for example, red light through the color conversion layer CTa, and the light-emitting element 230C can convert blue light into, for example, green light through the color conversion layer CTc, so that the display component 200 can achieve full color. optimized display effect.

In some embodiments, at least two of the light-emitting elements 230A, 230B, and 230C can emit different colors of light. For example, the light-emitting element 230A can emit red light, the light-emitting element 230B and the light-emitting element 230C can both emit blue light, and no color conversion layer can be provided on the light-emitting element 230A and the light-emitting element 230B, and a color conversion layer CTc can be provided above the light-emitting element 230C. to convert blue light to green light to achieve full color.

In some embodiments, the display assembly 200 may further include light modulation layers YLa and YLc, where the light modulation layer YLa may be located between the encapsulation layer 140 and the color conversion layer CTa, and the light modulation layer YLc may be located between the encapsulation layer 140 and the color conversion layer CTa. between layers CTc. When the color conversion layers CTa and CTc cannot completely convert the blue light emitted by the light-emitting elements 230A and 230C, the light modulation layers YLa and YLc can respectively filter out the blue light that passes through the color conversion layers CTa and CTc.

In some embodiments, the display assembly 200 may also include an optical layer OC, The optical layer OC may be located between the encapsulation layer 140 and the light emitting elements 230A, 230B, and 230C. For example, when the light-emitting element 230B does not need to be provided with a color conversion layer, the optical layer OC can be located between the encapsulation layer 140 and the light-emitting element 230B. When the color conversion layers CTa and CTc and the light modulation layers YLa and YLc are provided on the light emitting elements 230A and 230C, the optical layer OC may be located between the encapsulation layer 140 or the light modulation layers YLa and YLc and the color conversion layers CTa and CTc. In some embodiments, the light modulation layers YLa and YLc may be respectively disposed between the optical layer OC and the color conversion layers CTa and CTc. By appropriately selecting the refractive index of the optical layer OC, the optical layer OC can prevent total reflection from occurring, thereby improving the light extraction efficiency of the light-emitting elements 230A, 230B, and 230C.

In some embodiments, the display component 200 may further include an isolation structure BK. The isolation structure BK may surround the color conversion layer CTa and the color conversion layer CTc respectively, and in a direction parallel to the first surface 111 of the substrate 110 , the isolation structure BK It can be located between the color conversion layers CTa, CTc and the optical layer OC.

In some embodiments, the display assembly 200 may further include a light-shielding layer BM. The light-shielding layer BM may be disposed around the optical layer OC, and the light-shielding layer BM can shield the areas around the light-emitting elements 230A, 230B, and 230C that are not covered by the optical layer OC. Metal traces to avoid light leakage caused by scattering of these metal traces. For example, in a direction perpendicular to the first surface 111 of the substrate 110, the light shielding layer BM may be located between the encapsulation layer 140 and the substrate 110, and in a direction parallel to the first surface 111 of the substrate 110, the light shielding layer BM It may be located between the encapsulation layer 140 and the optical layer OC.

In some embodiments, the display assembly 200 may further include pads CP1, CP2, the contact pads CP1 and CP2 may be located on the second surface 112 of the substrate 110, wherein the contact pad CP1 is located on the surface of the pad portion P21 opposite to the conductive structure 220A, and the contact pad CP2 is located on the pad portion P22 and the conductive structure 220B. relatively superficially. The pads CP1 and CP2 can be formed by chemical plating, and the material of the pads CP1 and CP2 can include nickel and/or gold, but is not limited thereto. Since the display assembly 200 uses the substrate 110 and the conductive structures 220A, 220B instead of the printed circuit board, the display assembly 200 can have reduced thickness and weight, and can also avoid the expensive cost of the printed circuit board.

FIG. 3A is a schematic top view of a display assembly 300 according to an embodiment of the present invention. FIG. 3B is a schematic bottom view of the display assembly 300 of FIG. 3A. The display assembly 300 may include: a substrate 110, a plurality of conductive structures 320A, 320B, 320C, 320D, a plurality of light emitting elements 230A, 230B, 230C, and contact pads CPa, CPb, CPc, CPd located on the second surface 112 of the substrate 110. and encapsulation layer 140.

Compared with the display component 200 shown in FIGS. 2A to 2C , the display component 300 shown in FIGS. 3A to 3B is different in that the conductive structures 320A, 320B, 320C, and 320D of the display component 300 have different circuits. layout. For example, in this embodiment, the conductive structure 320A may include a connection part 321A located on the first surface 111 of the substrate 110 and a through hole part 322A located in the through hole VA1 of the substrate 110, and the connection part 321A may be electrically connected. The first electrode 132 of the light-emitting elements 230A, 230B, and 230C and the through-hole portion 322A can electrically connect the connection portion 321A and the pad CPa. The conductive structure 320B may include a connection portion 321B located on the first surface 111 of the substrate 110 and a through hole VA2 located in the substrate 110 . The hole portion 322B, and the connecting portion 321B can electrically connect the second electrode 133 of the light-emitting element 230A and the through-hole portion 322B, and the through-hole portion 322B can electrically connect the connecting portion 321B and the pad CPb. The conductive structure 320C may include a connection part 321C located on the first surface 111 of the substrate 110 and a through hole part 322C located in the through hole VA3 of the substrate 110, and the connection part 321C may electrically connect the second electrode 133 of the light emitting element 230B and the through hole. The through-hole portion 322C can electrically connect the connecting portion 321C and the pad CPc. The conductive structure 320D may include a connection part 321D located on the first surface 111 of the substrate 110 and a through hole part 322D located in the through hole VA4 of the substrate 110, and the connection part 321D may electrically connect the second electrode 133 of the light emitting element 230C and the through hole. The through-hole portion 322D can electrically connect the connecting portion 321D and the pad CPd. It is worth noting that in this embodiment, the minimum distance D1 between the connecting portion 321A and any one of the connecting portions 321B, 321C, and 321D can be equal to, substantially equal to, approximately, or only slightly larger or smaller than the light-emitting element 230A. The distance D2 between the first electrode 132 and the second electrode 133 of 230B and 230C. For example, the minimum distance D1 can be approximately within the range of the distance D2 ±50%. In this way, it can meet the luminescence requirements when the distance D2 is less than 10 μm. The first electrode 132 and the second electrode 133 of the elements 230A, 230B, and 230C respectively have a minimum spacing required for electrical connection with the connection portions 321A, 321B, 321C, and 321D. In some embodiments, the minimum distance D1 may be between 1 μm and 10 μm, for example, the minimum distance D1 may be 2.5 μm, 3 μm, or 6 μm. Compared with the traditional wiring spacing of 30 μm to 40 μm for packaging a chip on a printed circuit board through Chip On Board (COB) technology, the minimum wiring spacing D1 of the display component 300 of this embodiment can be less than 10 μm. , in this way, it can be reduced The overall size of the display assembly 300 enables a display device made of the display assembly 300 to have a higher resolution.

In summary, the manufacturing method of the display device of the present invention does not require the use of printed circuit boards to manufacture display components and display devices. Therefore, it can not only avoid the expensive costs caused by using printed circuit boards, but also reduce the size of the display components. The thickness and weight of the display device can be reduced, and the overall size of the display component can be reduced, thereby improving the resolution of the display device.

Although the present invention has been disclosed above through embodiments, they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the appended patent application scope.

300: Display component

110:Substrate

111: First surface

230A, 230B, 230C: Light-emitting components

132:First electrode

133:Second electrode

140: Encapsulation layer

320A, 320B, 320C, 320D: conductive structure

321A, 321B, 321C, 321D: Connection part

322A, 322B, 322C, 322D: Perforated part

BM: light shielding layer

D1: minimum spacing

D2: Spacing

VA1, VA2, VA3, VA4: through hole

Claims (19)

A display component includes: a substrate; a plurality of conductive structures respectively penetrating the substrate; a plurality of light-emitting elements, each of the light-emitting elements has a first electrode and a second electrode, wherein the third of the plurality of light-emitting elements An electrode is electrically connected to the same conductive structure among the plurality of conductive structures, and the second electrodes of the plurality of light-emitting elements are electrically connected to different conductive structures among the plurality of conductive structures; an encapsulation layer covering the plurality of light-emitting elements; and an optical layer located between the plurality of light-emitting elements and the encapsulation layer, wherein the optical layer simultaneously covers the upper surface and side surface of each of the light-emitting elements, wherein Each of the conductive structures includes: a connection portion located on the first surface of the substrate; a through hole portion located in a through hole of the substrate; and a pad portion from a second portion of the substrate opposite to the first surface. The surface is embedded in the substrate, and the perforated portion is electrically connected to the pad portion and the connecting portion; and a first pad is located on a surface of the pad portion exposed from the second surface, and the The formation method of the first contact pad is different from the formation method of the pad portion. The display component according to claim 1, wherein the plurality of light-emitting elements emit light of the same color or different colors. The display component according to claim 1, further comprising a color conversion layer located between the encapsulation layer and part of the light-emitting elements. The display component according to claim 3, further comprising a light modulation layer located between the encapsulation layer and the color conversion layer. The display component of claim 1, wherein the encapsulation layer covers the upper surface of the plurality of light-emitting elements and the side surfaces of the plurality of light-emitting elements. The display component according to claim 1, further comprising a light-shielding layer, and the orthographic projection of the light-shielding layer on the substrate is outside the orthographic projection of the plurality of conductive structures on the substrate. The display component of claim 1, wherein the connecting portion is electrically connected to the light-emitting element and the first pad. The display assembly according to claim 1, wherein the minimum spacing between the connecting portions of the plurality of conductive structures is ±50°C from the spacing between the first electrode and the second electrode of the light-emitting element. within the range of %. The display component of claim 1, wherein a minimum spacing between the connection portions of the plurality of conductive structures is between 1 μm and 10 μm. A display device includes: a backplane with a plurality of second pads provided on its surface; and a plurality of display components as described in claim 1, respectively electrically connected to the plurality of second pads. The display device of claim 10, wherein the conductive structure of the display component is electrically connected to the second pad and the light-emitting element. A method of manufacturing a display device, including: forming a plurality of conductive structures on a substrate; disposing a plurality of light-emitting elements on the plurality of conductive structures, and each of the light-emitting elements has a first electrode and a second electrode, wherein the The first electrodes of the plurality of light-emitting elements are electrically connected to the same conductive structure among the plurality of conductive structures, and the second electrodes of the plurality of light-emitting elements are electrically connected to the plurality of conductive structures. Different conductive structures in the structure; forming an optical layer on the plurality of light-emitting elements and the substrate, and the optical layer simultaneously covers the upper surface and side surface of each of the light-emitting elements; forming an encapsulation layer on the on the optical layer and the substrate; and cutting the packaging layer and the substrate between the plurality of light-emitting elements to form a plurality of display components, wherein before forming a plurality of conductive structures on the substrate It also includes: forming a release layer on the carrier; forming a metal layer on the release layer; and forming the substrate on the metal layer. The manufacturing method of a display device according to claim 12, wherein forming a plurality of conductive structures on the substrate includes: forming a plurality of through holes penetrating the substrate; and forming the plurality of conductive structures on the substrate. in multiple vias. The manufacturing method of a display device according to claim 12, further comprising: forming a light-shielding layer on the substrate before or after arranging the plurality of light-emitting elements on the plurality of conductive structures. The manufacturing method of a display device according to claim 14, wherein the light-shielding layer surrounds the plurality of conductive structures. The manufacturing method of a display device according to claim 12, wherein after arranging a plurality of light-emitting elements on the plurality of conductive structures, the method further includes: forming a color conversion layer on a portion of the light-emitting elements. The manufacturing method of a display device according to claim 16, wherein said forming a color conversion layer includes: forming isolation structures respectively surrounding said plurality of light-emitting elements; forming said color conversion layer on said portion of said light-emitting elements superior. The manufacturing method of a display device according to claim 12, wherein before cutting the encapsulation layer and the substrate between the plurality of light-emitting elements, it further includes: separating the release layer and the metal layer ; removing a portion of the metal layer and leaving another portion of the metal layer; and electroplating the other portion of the metal layer. The manufacturing method of a display device according to claim 12, wherein after cutting the encapsulation layer and the substrate between the plurality of light-emitting elements, the method further includes: providing a backplane with a plurality of contact pads on the surface. ; And disposing the plurality of display components on the plurality of pads of the backplane.

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