CN115020394A

CN115020394A - Display assembly, display device comprising same and manufacturing method of display device

Info

Publication number: CN115020394A
Application number: CN202210818781.XA
Authority: CN
Inventors: 王友志; 孙硕阳; 陈忠宏; 吴宗典
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2021-08-30
Filing date: 2022-07-13
Publication date: 2022-09-06

Abstract

The invention discloses a display assembly, comprising: the light-emitting device comprises a substrate, a plurality of conductive structures, a plurality of light-emitting elements and an encapsulation layer. The conductive structures penetrate through the substrate respectively. Each light-emitting element is provided with a first electrode and a second electrode, wherein the first electrodes of the light-emitting elements are electrically connected with the same conductive structure in the conductive structures, and the second electrodes of the light-emitting elements are electrically connected with different conductive structures in the conductive structures. The packaging layer covers the plurality of light emitting elements. In addition, a display device comprising the display assembly and a manufacturing method of the display device are also provided.

Description

Display assembly, display device comprising same and manufacturing method of display device

Technical Field

The invention relates to a display assembly, a display device comprising the same and a manufacturing method of the display device.

Background

Micro light emitting diodes (μ LEDs) are suitable for constructing pixel structures of μ LED display devices because of their low power consumption, high brightness, high resolution, and high color saturation. The conventional cob (chip on board) packaging technology fixes the μ LED bare chip on a Printed Circuit Board (PCB) with a conductive adhesive or an insulating adhesive. However, since the line width of the PCB cannot be scaled down, even though the size of the μ LED die is greatly reduced, the resolution of the μ LED display device cannot be improved. Furthermore, the PCB basic bottom plate has a thickness of at least 0.5mm, and has certain height and weight after being packaged. In addition, the PCB has many layers and is expensive.

Disclosure of Invention

The present invention provides a display assembly having reduced thickness and weight.

The invention provides a display device with improved resolution.

The invention provides a manufacturing method of a display device, which has reduced manufacturing cost.

One embodiment of the present invention provides a display assembly, including: a substrate; a plurality of conductive structures respectively penetrating through the substrate; the light-emitting elements are provided with first electrodes and second electrodes, wherein the first electrodes of the light-emitting elements are electrically connected with the same conductive structure in the conductive structures, and the second electrodes of the light-emitting elements are electrically connected with different conductive structures in the conductive structures; and an encapsulation layer covering the plurality of light emitting elements.

In an embodiment of the invention, the light emitting elements emit light of the same color or different colors.

In an embodiment of the invention, the display device further includes a color conversion layer located between the encapsulation layer and a portion of the light emitting elements.

In an embodiment of the invention, the display module further includes a dimming layer located between the encapsulation layer and the color conversion layer.

In an embodiment of the invention, the display device further includes an isolation structure surrounding the color conversion layer.

In an embodiment of the invention, the display device further includes a light-shielding layer, and an orthogonal projection of the light-shielding layer on the substrate is outside an orthogonal projection of the plurality of conductive structures on the substrate.

In an embodiment of the invention, each of the conductive structures includes a connection portion located on the first surface of the substrate and a through hole portion located in the through hole of the substrate, and the connection portion electrically connects the light emitting element and the through hole portion.

In an embodiment of the invention, a minimum distance between the connection portions of the plurality of conductive structures is within ± 50% of a distance between the first electrode and the second electrode of the light emitting element.

In an embodiment of the invention, a minimum pitch between the connection portions of the conductive structures is between 1 μm and 10 μm.

One embodiment of the present invention provides a display device including: a back plate, the surface of which is provided with a plurality of connecting pads; and the display components are respectively and electrically connected with the connecting pads.

In an embodiment of the invention, the conductive structure of the display module is electrically connected to the pad and the light emitting device.

One embodiment of the present invention provides a method of manufacturing a display device, including: forming a plurality of conductive structures on a substrate; arranging a plurality of light-emitting elements on the plurality of conductive structures, wherein each light-emitting element is provided with a first electrode and a second electrode, the first electrodes of the plurality of light-emitting elements are electrically connected with the same conductive structure in the plurality of conductive structures, and the second electrodes of the plurality of light-emitting elements are electrically connected with different conductive structures in the plurality of conductive structures; forming a packaging layer on the plurality of light-emitting elements and the substrate; and cutting the packaging layer and the substrate among the plurality of light-emitting elements to form a plurality of display components.

In an embodiment of the invention, before forming the plurality of conductive structures on the substrate, the method further includes: forming a release layer on the carrier plate; forming a metal layer on the release layer; and forming a substrate on the metal layer.

In an embodiment of the invention, the forming the plurality of conductive structures on the substrate includes: forming a plurality of through holes penetrating through the substrate; and forming a plurality of conductive structures in the plurality of through holes.

In an embodiment of the invention, before or after the disposing the plurality of light emitting elements on the plurality of conductive structures, the method further includes: forming a light shielding layer on the substrate.

In an embodiment of the invention, the light shielding layer surrounds the plurality of conductive structures.

In an embodiment of the invention, after the disposing the plurality of light emitting elements on the plurality of conductive structures, the method further includes: a color conversion layer is formed on a portion of the light emitting element.

In an embodiment of the invention, the forming the color conversion layer includes: forming isolation structures respectively surrounding the plurality of light emitting elements; forming a color conversion layer on a portion of the light emitting elements; and forming an optical layer which covers the other part of the light-emitting element, the color conversion layer and the isolation structure.

In an embodiment of the invention, before the cutting the package layer and the substrate between the plurality of light emitting elements, the method further includes: separating the release layer from the metal layer; removing a portion of the metal layer and leaving another portion of the metal layer; and electroplating another portion of the metal layer.

In an embodiment of the invention, after the cutting the package layer and the substrate between the plurality of light emitting elements, the method further includes: providing a back plate with a plurality of connecting pads on the surface; and arranging a plurality of display components on a plurality of connecting pads of the back plate.

The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.

Drawings

Fig. 1A to 1M are schematic cross-sectional views illustrating a process flow of a method for manufacturing a display device according to an embodiment of the invention.

Fig. 2A is a schematic top view of a display module according to an embodiment of the invention.

FIG. 2B is a schematic cross-sectional view taken along section line A-A' of FIG. 2A.

FIG. 2C is a schematic cross-sectional view taken along section line B-B' of FIG. 2A.

FIG. 3A is a schematic top view of a display assembly according to an embodiment of the invention.

Fig. 3B is a schematic bottom view of the display assembly of fig. 3A.

Wherein the reference numerals

10: display device

100. 200 and 300: display assembly

110: substrate board

111: first surface

112: second surface

120. 220, 220A, 220B: conductive structure

121. 221A, 221B: connecting part

122. 222A, 222B: piercing section

130. 230, 230A, 230B, 230C: light emitting element

131: luminous body

132: a first electrode

133: second electrode

140: encapsulation layer

320A, 320B, 320C, 320D: conductive structure

321A, 321B, 321C, 321D: connecting part

322A, 322B, 322C, 322D: perforation part

A-A ', B-B': section line

BK: isolation structure

BM: light shielding layer

BP: back plate

CA: support plate

CP, CP1, CP2, CPa, CPb, CPc, CPd: connecting pad

CT, CTa, CTc: color conversion layer

D1: minimum pitch

D2: distance between

DP: connecting pad

LS: laser beam

ML: metal layer

O1, O2: opening of the container

OC: optical layer

P1: flat part

P2, P21, P22: cushion part

RL: release layer

VA, VA1, VA2, VA3, VA 4: through hole

YL, YLa, YLc: light modulation layer

Detailed Description

The following detailed description of the embodiments of the present invention with reference to the drawings and specific examples is provided for further understanding the objects, aspects and effects of the present invention, but not for limiting the scope of the appended claims.

In the drawings, the thickness of layers, films, panels, regions, etc. have been exaggerated for clarity. Like reference numerals refer to like elements throughout the specification. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Further, an "electrical connection" or "coupling" may be the presence of other elements between the two elements.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first "element," "component," "region," "layer" or "portion" discussed below could be termed a second element, component, region, layer or portion without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, including "at least one" or mean "and/or" unless the content clearly indicates otherwise. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and/or groups thereof.

Furthermore, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element, as illustrated. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" can include both an orientation of "lower" and "upper," depending on the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "beneath" may include both an orientation of above and below.

As used herein, "about," "approximately," or "substantially" includes mean values of the stated value and the specified value within an acceptable range of deviation as determined by one of ordinary skill in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ± 30%, ± 20%, ± 10%, ± 5%. Further, as used herein, "about", "approximately", or "substantially" may be selected based on optical properties, etching properties, or other properties to select a more acceptable range of deviation or standard deviation, and not to apply one standard deviation to all properties.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to cross-sectional views that are schematic illustrations of idealized embodiments. Thus, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region shown or described as flat may generally have rough and/or nonlinear features. Further, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.

Fig. 1A to 1M are schematic cross-sectional views illustrating a process flow of a method for manufacturing a display device 10 according to an embodiment of the invention. Hereinafter, embodiments of the steps of the method for manufacturing the display device 10 will be described with reference to the drawings, but the present invention is not limited thereto.

Referring to fig. 1A, a carrier CA is provided, for example, a temporary carrier for carrying a film formed in a subsequent process step. The material of the carrier CA may be glass or other applicable materials.

Then, a release layer RL is formed on the carrier CA, and the carrier CA can be separated from a film layer (e.g., the metal layer ML) formed in a subsequent process step by the release layer RL. The release layer RL is formed on the carrier CA by coating, for example. The material of the release layer RL may include polyimide resin, diethylformamide, N-methylpyrrolidone, a metal such as titanium (Ti), copper (Cu), aluminum (Al), silver (Ag), iron (Fe), nickel (Ni), molybdenum (Mo), tungsten (W), or an oxide of the metal, but is not limited thereto.

Then, a metal layer ML is formed on the release layer RL. The metal layer ML may include a flat portion P1 and a plurality of pad portions P2, and the plurality of pad portions P2 are located on the flat portion P1. In the present embodiment, the metal layer ML may be formed by a physical vapor deposition (e.g., sputtering) process, a photolithography process, and an etching process, but not limited thereto. The material of the metal layer ML may include a metal or an alloy having good conductivity, such as aluminum, molybdenum, titanium, copper, nickel, gold, tin, silver, or other metals, alloys thereof, or combinations thereof. In some embodiments, the metal layer ML may be a multi-layer structure, for example, including a titanium layer, an aluminum layer, and a titanium layer stacked in sequence, but not limited thereto.

Next, referring to fig. 1B, a substrate 110 having a plurality of through holes VA is formed on the metal layer ML, and the through holes VA can expose the pad portions P2 of the metal layer ML. In other words, the via VA may completely overlap the pad portion P2 of the metal layer ML. The substrate 110 may be made of Polyimide (PI), Polycarbonate (PC), Polyester (PET), Cyclic Olefin Copolymer (COC), metal-chromium matrix-cyclic olefin copolymer (mCOC), or other suitable materials, but is not limited thereto. In addition, the substrate 110 may have a single-layer structure or a multi-layer structure, and a multi-layer structure such as a stack of any two or more layers of the above materials may be combined and varied as necessary. The substrate 110 is formed on the metal layer ML by coating, for example, and the via VA can be formed by photolithography and etching processes, but not limited thereto.

Next, referring to fig. 1C, a plurality of conductive structures 120 are formed in the through holes VA of the substrate 110 and on the substrate 110. Specifically, the conductive structure 120 may include a connection portion 121 located on the first surface 111 of the substrate 110 and a through hole portion 122 located in the through hole VA of the substrate 110, and the through hole portion 122 may electrically connect the connection portion 121 and the pad portion P2 of the metal layer ML. In the present embodiment, the conductive structure 120 may be formed by a physical vapor deposition (e.g., sputtering) process, a photolithography process, and an etching process. The material of the conductive structure 120 may include a metal or an alloy with good conductivity, such as aluminum, molybdenum, titanium, copper, nickel, gold, tin, silver, and other metals, alloys thereof, or combinations thereof. For example, in some embodiments, the through hole portion 122 of the conductive structure 120 may include a copper layer, and the connection portion 121 may include a copper layer, a nickel layer, and a gold layer stacked in sequence, but not limited thereto.

Next, referring to fig. 1D, a light-shielding layer BM is formed on the substrate 110. The light-shielding layer BM is formed on the substrate 110 by, for example, but not limited to, a coating process and a developing process. The light-shielding layer BM may surround the plurality of conductive structures 120 without overlapping the conductive structures 120, and the number of the conductive structures 120 surrounded by the light-shielding layer BM may be determined as required. The light-shielding layer BM can shield the metal traces on the substrate 110 from reflecting the ambient light, thereby reducing the dark-state brightness and improving the contrast. In addition, the light-shielding layer BM may have a plurality of openings O1, and the orthographic projection of the opening O1 on the substrate 110 may overlap the orthographic projection of the surrounded conductive structure 120 on the substrate 110, so as to avoid affecting the arrangement of the subsequent light-emitting devices. The material of the light-shielding layer BM may include a material having low reflectivity and light transmittance, such as black resin or light-shielding metal (e.g., chrome).

Next, a plurality of light emitting elements 130 are disposed on the conductive structure 120. In some embodiments, a plurality of light emitting elements 130 may be disposed on the conductive structure 120, and then the light shielding layer BM is formed on the substrate 110, and the orthographic projection of the light shielding layer BM on the substrate 110 may be outside the orthographic projection of the light emitting elements 130 on the substrate 110. The light emitting element 130 may include a light emitting body 131, a first electrode 132 and a second electrode 133, and the first electrode 132 and the second electrode 133 are respectively electrically connected to the connecting portions 121 of the different conductive structures 120. In some embodiments, other conductive materials or conductive adhesives may be further included between the first electrode 132 and the connection portion 121 and between the second electrode 133 and the connection portion 121.

The light emitting device 130 can be fabricated on a growth substrate and then transferred to the substrate 110 by a bulk transfer process, and the first electrode 132 can serve as or be electrically connected to an anode of the light emitting device 130, and the second electrode 133 can serve as or be electrically connected to a cathode of the light emitting device 130. The light emitting body 131 may include, for example, a stack of doped and undoped semiconductor materials, and the materials of the first electrode 132 and the second electrode 133 may include, for example, an alloy, a nitride of a metal material, an oxide of a metal material, an oxynitride of a metal material, or other suitable materials, or a stack of a metal material and other conductive materials, or other low-resistance materials. In the present embodiment, the first electrode 132 and the second electrode 133 of the light emitting element 130 are disposed on the same side of the light emitting body 131. For example, the light emitting device 130 can be a horizontal micro light emitting diode, but is not limited thereto. In some embodiments, the light emitting device 130 can be a vertical micro light emitting diode.

Next, referring to fig. 1E, an isolation structure BK surrounding the light emitting device 130 is formed, in other words, the isolation structure BK may have a plurality of openings O2, and an orthogonal projection of each opening O2 on the substrate 110 may overlap an orthogonal projection of the light emitting device 130 on the substrate 110. The isolation structure BK is formed on the substrate 110 by, for example, a coating process and a developing process. The isolation structure BK is made of a material such as a white photoresist, so as to isolate color conversion materials for converting different colors, prevent lateral light mixing of the light emitting device 130, and refract the lateral light of the light emitting device 130 to a normal viewing angle for increasing the light emitting field type. In the present embodiment, the isolation structure BK may partially overlap the conductive structure 120, but is not limited thereto. In some embodiments, the isolation structure BK may not overlap the conductive structure 120 at all, for example, the isolation structure BK may be disposed between the conductive structure 120 and the light shielding layer BM.

Next, referring to fig. 1F, a color conversion material is filled in the isolation structure BK and on the light emitting device 130 to form a color conversion layer CT on the light emitting device 130. The color conversion layer CT may include phosphor powder or wavelength conversion material with similar properties, for example, to convert the blue light emitted from the light emitting element 130 into red light or green light, so as to achieve full-color display effect. Therefore, the color conversion layer CT can be formed on only a portion of the light emitting devices 130, and the color conversion layer CT does not need to be formed on all the light emitting devices 130.

Next, referring to fig. 1G, an optical layer OC may be formed by coating, and the optical layer OC may cover the color conversion layer CT and the isolation structure BK. The material of the optical layer OC is, for example, but not limited to, transparent photoresist. The optical layer OC can form a flat upper surface for subsequent processes.

Next, referring to fig. 1H, a dimming layer YL may be formed on the optical layer OC through a coating process and a developing process. In some embodiments, the light modulation layer YL may be formed on the color conversion layer CT and the isolation structure BK, and then the optical layer OC covering the light modulation layer YL and the isolation structure BK is formed. The material of the light modulation layer YL is, for example, a yellow photoresist, but is not limited thereto.

Next, referring to fig. 1I, the package layer 140 may be formed by coating, and the package layer 140 may cover the dimming layer YL, the optical layer OC and the light shielding layer BM to protect the light emitting element 130 and the surrounding components. The material of the encapsulation layer 140 may include a polymer material, such as epoxy resin, but is not limited thereto.

Next, referring to fig. 1J, the release layer RL is separated from the metal layer ML, so as to remove the carrier CA and expose the metal layer ML. In the present embodiment, the separation is performed by a heat treatment, but the separation is not limited thereto. In some embodiments, the separation may be performed by laser.

Next, referring to fig. 1K, the flat portion P1 of the metal layer ML is removed, and the pad portion P2 is left. The metal layer ML may be removed by a dry etching process or an anisotropic etching process, but is not limited thereto.

Next, referring to fig. 1L, the pad portion P2 of the metal layer ML is electroplated to form a pad CP on the outer surface of the pad portion P2, and the pad CP may be located on the second surface 112 of the substrate 110. In the present embodiment, the pad CP may be a nickel layer and/or a gold layer formed by electroless plating, but is not limited thereto.

Then, the package layer 140 and the substrate 110 between the light emitting devices 130 are cut to form the display assembly 100. In this embodiment, the cutting can be performed by using the laser beam LS, but not limited thereto. In other embodiments, the cutting may also be performed along a predetermined cutting line, for example, using a knife or other suitable tool.

Next, referring to fig. 1M, a back plate BP having a plurality of pads DP disposed on a surface thereof is provided, and then a plurality of display elements 100 are disposed on the plurality of pads DP of the back plate BP, such that the two pads CP of each display element 100 can be electrically connected to the two pads DP on the back plate BP, respectively, to form the display device 10. In some embodiments, the pad CP and the pad DP may be electrically connected by a conductive adhesive or other solder.

In the present embodiment, the display device 10 may include: a back plate BP, the surface of which is provided with a plurality of connecting pads DP; and a plurality of display elements 100 electrically connected to the pads DP, respectively. For example, the two pads CP of each display device 100 may be physically connected to the two pads DP on the back plate BP, or the pads CP of each display device 100 and the pads DP on the back plate BP may further include other conductive materials or conductive adhesives for electrical connection. As such, the light emitting device 130 of the display device 100 can be electrically connected to the pad DP through the conductive structure 120, the pad portion P2 of the metal layer ML, and the pad CP. In addition, since a printed circuit board is not required in the manufacturing process of the display device 10, the manufacturing cost of the display device 10 can be reduced.

In the following, other embodiments of the present invention will be described with reference to fig. 2A to 3B, and the reference numbers and related contents of the elements of the embodiments of fig. 1A to 1M are used, wherein the same reference numbers are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted portions, reference may be made to the embodiments of fig. 1A to 1M, which will not be repeated in the following description.

Fig. 2A is a schematic top view of a display assembly 200 according to an embodiment of the invention. FIG. 2B is a schematic cross-sectional view taken along section line A-A' of FIG. 2A. FIG. 2C is a schematic cross-sectional view taken along section line B-B' of FIG. 2A. In order to simplify the illustration, the substrate 110, the package layer 140, the isolation structure BK, the dimming layers YLa and YLc, the optical layer OC, and the pads CP1 and CP2 are omitted in fig. 2A.

Referring to fig. 2A to 2C, the display device 200 includes: a substrate 110; a plurality of conductive structures 220 penetrating the substrate 110; a plurality of light emitting elements 230 disposed on the plurality of conductive structures 220, each light emitting element 230 including a light emitting body 131, a first electrode 132, and a second electrode 133; and an encapsulation layer 140 covering the plurality of light emitting elements 230.

In the present embodiment, the conductive structures 220 of the display assembly 200 may include one conductive structure 220A and three conductive structures 220B, but are not limited thereto. The number of the

conductive structures

220A and 220B may be determined as needed, and may depend on the number of the light emitting elements 230. In other embodiments, the display assembly 200 may include more

conductive structures

220A and 220B. In addition, the conductive structure 220A may include a connection portion 221A located on the first surface 111 of the substrate 110 and a through hole portion 222A located in the through hole VA of the substrate 110, wherein the connection portion 221A may electrically connect the light emitting element 230 and the through hole portion 222A, and the through hole portion 222A may electrically connect the connection portion 221A and the pad portion P21. Similarly, the conductive structure 220B may include a connection portion 221B on the first surface 111 of the substrate 110 and a through hole portion 222B in the through hole VA of the substrate 110, wherein the connection portion 221B may electrically connect the light emitting element 230 and the through hole portion 222B, and the through hole portion 222B may electrically connect the connection portion 221B and the pad portion P22.

In the present embodiment, the light emitting devices 230 of the display assembly 200 may include light emitting

devices

230A, 230B, 230C, wherein each of the

light emitting devices

230A, 230B, 230C includes a light emitting body 131, a first electrode 132 and a second electrode 133, the first electrodes 132 of the

light emitting devices

230A, 230B, 230C are electrically connected to the conductive structure 220A, and the second electrodes 133 of the

light emitting devices

230A, 230B, 230C are electrically connected to the plurality of separated conductive structures 220B, respectively. In other words, the conductive structure 220A may be a part of the common electrode of the display device 200. Although the display module 200 shown in fig. 2A and 2C includes one

light emitting element

230A, 230B, and 230C, the disclosure is not limited thereto. In some embodiments, the display assembly 200 may include any one or any two of the

light emitting elements

230A, 230B, 230C. In other embodiments, the display assembly 200 may include more or different numbers of

light emitting elements

230A, 230B, 230C, for example, the display assembly 200 may include two or three

light emitting elements

230A, 230B, 230C each, or the display assembly 200 may include two light emitting elements 230A and one

light emitting element

230B, 230C each.

In this embodiment, the

light emitting elements

230A, 230B, 230C may emit the same color light. For example, the

light emitting devices

230A, 230B, and 230C can all emit blue light, and a color conversion layer CTa can be disposed over the light emitting device 230A, for example, the color conversion layer CTa can be located between the package layer 140 and the light emitting device 230A, and a color conversion layer CTc can be disposed over the light emitting device 230C, for example, the color conversion layer CTc can be located between the package layer 140 and the light emitting device 230C, and no color conversion layer can be disposed over the light emitting device 230B. In this way, the light emitting element 230A can convert the blue light into, for example, the red light through the color conversion layer CTa, and the light emitting element 230C can convert the blue light into, for example, the green light through the color conversion layer CTc, so that the display assembly 200 can achieve full-color display effect.

In some embodiments, at least two of the

light emitting elements

230A, 230B, 230C may emit different colored light. For example, the light emitting device 230A may emit red light, the light emitting device 230B and the light emitting device 230C may both emit blue light, and the light emitting device 230A and the light emitting device 230B may not have a color conversion layer thereon, and the light emitting device 230C may have a color conversion layer CTc thereon to convert the blue light into green light to realize full color.

In some embodiments, the display assembly 200 may further include a dimming layer YLa, YLc, wherein the dimming layer YLa may be located between the encapsulation layer 140 and the color conversion layer CTa, and the dimming layer YLc may be located between the encapsulation layer 140 and the color conversion layer CTc. When the color conversion layers CTa and CTc cannot completely convert the blue light emitted from the

light emitting elements

230A and 230C, the dimming layers YLa and YLc can filter the blue light passing through the color conversion layers CTa and CTc, respectively.

In some embodiments, the display assembly 200 may further include an optical layer OC, which may be located between the encapsulation layer 140 and the

light emitting elements

230A, 230B, 230C. For example, in the case that the light emitting device 230B does not need to be provided with a color conversion layer, the optical layer OC can be located between the package layer 140 and the light emitting device 230B. In the case where the color conversion layers CTa and CTc and the dimming layers YLa and YLc are provided on the

light emitting elements

230A and 230C, the optical layer OC may be located between the encapsulation layer 140 or the dimming layers YLa and YLc and the color conversion layers CTa and CTc. In some embodiments, the dimming layers YLa, YLc may be disposed between the optical layer OC and the color conversion layers CTa, CTc, respectively. By properly selecting the refractive index of the optical layer OC, the optical layer OC can prevent total reflection from occurring, thereby improving the light extraction efficiency of the

light emitting elements

230A, 230B, 230C.

In some embodiments, the display assembly 200 may further include an isolation structure BK, the isolation structure BK may surround the color conversion layers CTa and CTc, respectively, and the isolation structure BK may be located between the color conversion layers CTa, CTc and the optical layer OC in a direction parallel to the first surface 111 of the substrate 110.

In some embodiments, the display device 200 may further include a light shielding layer BM, the light shielding layer BM may be disposed around the optical layer OC, and the light shielding layer BM may shield the metal traces on the regions around the

light emitting elements

230A, 230B, and 230C that are not covered by the optical layer OC, so as to avoid the light leakage phenomenon caused by scattering of the metal traces. For example, the light-shielding layer BM may be located between the encapsulation layer 140 and the substrate 110 in a direction perpendicular to the first surface 111 of the substrate 110, and the light-shielding layer BM may be located between the encapsulation layer 140 and the optical layer OC in a direction parallel to the first surface 111 of the substrate 110.

In some embodiments, the display device 200 may further include pads CP1, CP2, and the pads CP1, CP2 may be located on the second surface 112 of the substrate 110, wherein the pad CP1 is located on the surface of the pad portion P21 opposite to the conductive structure 220A, and the pad CP2 is located on the surface of the pad portion P22 opposite to the conductive structure 220B. The pads CP1 and CP2 may be formed by electroless plating, and the materials of the pads CP1 and CP2 may include nickel and/or gold, but are not limited thereto. Since the display assembly 200 uses the substrate 110 and the

conductive structures

220A and 220B instead of a printed circuit board, the display assembly 200 can have a reduced thickness and weight and can also eliminate the expensive cost of the printed circuit board.

Fig. 3A is a schematic top view of a display assembly 300 according to an embodiment of the invention. Fig. 3B is a bottom view of the display assembly 300 of fig. 3A. The display assembly 300 may include: the package structure includes a substrate 110, a plurality of

conductive structures

320A, 320B, 320C, 320D, a plurality of light emitting

devices

230A, 230B, 230C, pads CPa, CPb, CPc, CPd on a second surface 112 of the substrate 110, and an encapsulation layer 140.

The display assembly 300 shown in fig. 3A to 3B differs from the display assembly 200 shown in fig. 2A to 2C in that: the

conductive structures

320A, 320B, 320C, 320D of the display assembly 300 have different circuit layouts. For example, in the embodiment, the conductive structure 320A may include a connection portion 321A located on the first surface 111 of the substrate 110 and a through hole portion 322A located in the through hole VA1 of the substrate 110, the connection portion 321A may electrically connect the first electrodes 132 of the

light emitting devices

230A, 230B, 230C and the through hole portion 322A, and the through hole portion 322A may electrically connect the connection portion 321A and the pad CPa. The conductive structure 320B may include a connection portion 321B on the first surface 111 of the substrate 110 and a through hole 322B in the through hole VA2 of the substrate 110, the connection portion 321B may electrically connect the second electrode 133 of the light emitting device 230A and the through hole 322B, and the through hole 322B may electrically connect the connection portion 321B and the pad CPb. The conductive structure 320C may include a connection portion 321C on the first surface 111 of the substrate 110 and a through hole 322C in the through hole VA3 of the substrate 110, the connection portion 321C may electrically connect the second electrode 133 of the light emitting device 230B and the through hole 322C, and the through hole 322C may electrically connect the connection portion 321C and the pad CPc. The conductive structure 320D may include a connection portion 321D located on the first surface 111 of the substrate 110 and a through hole 322D located in the through hole VA4 of the substrate 110, the connection portion 321D may electrically connect the second electrode 133 of the light emitting device 230C and the through hole 322D, and the through hole 322D may electrically connect the connection portion 321D and the pad CPd. It is noted that in the present embodiment, the minimum distance D1 between the connection portion 321A and any one of the

connection portions

321B, 321C and 321D may be equal to, substantially equal to, similar to or only slightly greater than or less than the distance D2 between the first electrode 132 and the second electrode 133 of the

light emitting elements

230A, 230B and 230C, for example, the minimum distance D1 may be within a range of about 2 ± 50%, so as to meet the minimum distance required for electrically connecting the first electrode 132 and the second electrode 133 of the

light emitting elements

230A, 230B and 230C with the

connection portions

321A, 321B, 321C and 321D, respectively, wherein the distance D2 is less than 10 μm. In some embodiments, the minimum separation D1 may be between 1 μm to 10 μm, for example the minimum separation D1 may be 2.5 μm, 3 μm, or 6 μm. Compared with the conventional Chip On Board (COB) technology, in which the trace pitch of the Chip packaged On the pcb is 30 μm to 40 μm, the trace minimum pitch D1 of the display module 300 of the present embodiment can be smaller than 10 μm, so that the overall size of the display module 300 can be reduced, and the display device manufactured by the display module 300 can have a higher resolution.

In summary, the method for manufacturing a display device of the present invention does not need to use a printed circuit board to manufacture the display module and the display device, so that the expensive cost caused by using the printed circuit board can be eliminated, the thickness and weight of the display module can be reduced, the overall size of the display module can be reduced, and the resolution of the display device can be improved.

The present invention is capable of other embodiments, and various changes and modifications can be made by one skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A display assembly, comprising:

a substrate;

a plurality of conductive structures respectively penetrating through the substrate;

a plurality of light emitting elements, each of the light emitting elements having a first electrode and a second electrode, wherein the first electrodes of the light emitting elements are electrically connected to the same one of the plurality of conductive structures, and the second electrodes of the light emitting elements are electrically connected to different ones of the plurality of conductive structures; and

and an encapsulation layer covering the plurality of light emitting elements.

2. The display assembly of claim 1, wherein the plurality of light emitting elements emit the same color of light or different colors of light.

3. The display assembly of claim 1, further comprising a color conversion layer between the encapsulation layer and a portion of the light emitting elements.

4. The display assembly of claim 3, further comprising a dimming layer between the encapsulation layer and the color conversion layer.

5. The display assembly of claim 3, further comprising an isolation structure surrounding the color conversion layer.

6. The display assembly of claim 1, further comprising a light-shielding layer, wherein an orthographic projection of the light-shielding layer on the substrate is outside an orthographic projection of the plurality of conductive structures on the substrate.

7. The display assembly of claim 1, wherein each of the conductive structures comprises a connection portion on the first surface of the substrate and a through hole portion in the through hole of the substrate, and the connection portion electrically connects the light emitting element and the through hole portion.

8. The display assembly of claim 7, wherein a minimum pitch between the connection portions of the plurality of conductive structures is within ± 50% of a pitch between the first electrode and the second electrode of the light emitting element.

9. The display assembly of claim 7, wherein a minimum pitch between the connecting portions of the plurality of conductive structures is between 1 μ ι η and 10 μ ι η.

10. A display device, comprising:

a back plate, the surface of which is provided with a plurality of connecting pads; and

the display device as claimed in claim 1, wherein the plurality of pads are electrically connected to the display device.

11. The display device according to claim 10, wherein the conductive structure of the display element electrically connects the pad and the light emitting element.

12. A method of manufacturing a display device, comprising:

forming a plurality of conductive structures on the substrate;

disposing a plurality of light-emitting elements on the plurality of conductive structures, each of the light-emitting elements having a first electrode and a second electrode, wherein the first electrodes of the plurality of light-emitting elements are electrically connected to a same one of the plurality of conductive structures, and the second electrodes of the plurality of light-emitting elements are electrically connected to different ones of the plurality of conductive structures;

forming an encapsulation layer on the plurality of light emitting elements and the substrate; and

and cutting the packaging layer and the substrate among the plurality of light-emitting elements to form a plurality of display components.

13. The method of claim 12, further comprising, prior to the forming the plurality of conductive structures on the substrate:

forming a release layer on the carrier plate;

forming a metal layer on the release layer; and

and forming the substrate on the metal layer.

14. The method of claim 12, wherein the forming a plurality of conductive structures on the substrate comprises:

forming a plurality of through holes penetrating through the substrate; and

forming the plurality of conductive structures in the plurality of through holes.

15. The method of claim 12, further comprising, before or after the disposing the plurality of light emitting elements on the plurality of conductive structures:

and forming a light shielding layer on the substrate.

16. The method for manufacturing a display device according to claim 15, wherein the light shielding layer surrounds the plurality of conductive structures.

17. The method of claim 12, further comprising, after the disposing the plurality of light emitting elements on the plurality of conductive structures:

and forming a color conversion layer on a part of the light-emitting elements.

18. The method of manufacturing a display device according to claim 17, wherein the forming the color conversion layer comprises:

forming isolation structures respectively surrounding the plurality of light emitting elements;

forming the color conversion layer on the part of the light emitting elements; and

and forming an optical layer, wherein the optical layer covers the other part of the light-emitting element, the color conversion layer and the isolation structure.

19. The method of manufacturing a display device according to claim 13, further comprising, before the cutting the encapsulation layer and the substrate between the plurality of light emitting elements:

separating the release layer from the metal layer;

removing a portion of the metal layer and leaving another portion of the metal layer; and

electroplating the other portion of the metal layer.

20. The method of manufacturing a display device according to claim 12, further comprising, after the cutting the encapsulation layer and the substrate between the plurality of light emitting elements:

providing a back plate with a plurality of connecting pads on the surface; and

disposing the plurality of display components on the plurality of pads of the backplane.