TWI819121B - 硬化膜的製造方法、硬化膜、積層體的製造方法及半導體元件的製造方法 - Google Patents

硬化膜的製造方法、硬化膜、積層體的製造方法及半導體元件的製造方法 Download PDF

Info

Publication number
TWI819121B
TWI819121B TW108137102A TW108137102A TWI819121B TW I819121 B TWI819121 B TW I819121B TW 108137102 A TW108137102 A TW 108137102A TW 108137102 A TW108137102 A TW 108137102A TW I819121 B TWI819121 B TW I819121B
Authority
TW
Taiwan
Prior art keywords
group
cured film
manufacturing
compounds
resin composition
Prior art date
Application number
TW108137102A
Other languages
English (en)
Chinese (zh)
Other versions
TW202043295A (zh
Inventor
福原慶
山﨑健太
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202043295A publication Critical patent/TW202043295A/zh
Application granted granted Critical
Publication of TWI819121B publication Critical patent/TWI819121B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Formation Of Insulating Films (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW108137102A 2018-10-19 2019-10-15 硬化膜的製造方法、硬化膜、積層體的製造方法及半導體元件的製造方法 TWI819121B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018197584 2018-10-19
JP2018-197584 2018-10-19

Publications (2)

Publication Number Publication Date
TW202043295A TW202043295A (zh) 2020-12-01
TWI819121B true TWI819121B (zh) 2023-10-21

Family

ID=70284638

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108137102A TWI819121B (zh) 2018-10-19 2019-10-15 硬化膜的製造方法、硬化膜、積層體的製造方法及半導體元件的製造方法

Country Status (5)

Country Link
JP (2) JP7137631B2 (ja)
KR (1) KR102637283B1 (ja)
CN (1) CN112888714B (ja)
TW (1) TWI819121B (ja)
WO (1) WO2020080216A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202206500A (zh) * 2020-07-22 2022-02-16 日商富士軟片股份有限公司 樹脂組成物、膜、濾光器、固體攝像元件、圖像顯示裝置及樹脂
US20240045326A1 (en) * 2021-02-12 2024-02-08 Sumitomo Bakelite Co., Ltd. Photosensitive resin composition
WO2024203915A1 (ja) * 2023-03-29 2024-10-03 富士フイルム株式会社 樹脂組成物、再配線層用層間絶縁膜の製造方法、及び樹脂

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201533157A (zh) * 2014-02-10 2015-09-01 Hitachi Chem Dupont Microsys 樹脂組成物、硬化膜及其製造方法、圖案硬化膜及其製造方法、以及電子零件
CN107709408A (zh) * 2015-06-30 2018-02-16 富士胶片株式会社 前驱体组合物、感光性树脂组合物、前驱体组合物的制造方法、固化膜、固化膜的制造方法及半导体器件

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06242613A (ja) * 1993-02-18 1994-09-02 Toray Ind Inc ポリイミドパターンの形成方法
JPH11282155A (ja) * 1998-03-27 1999-10-15 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたソルダーレジストの製造法
JP4798851B2 (ja) * 2001-01-23 2011-10-19 旭化成イーマテリアルズ株式会社 アルコキシシラン化合物及びその組成物
JP2003345012A (ja) * 2002-05-28 2003-12-03 Hitachi Chemical Dupont Microsystems Ltd 感光性組成物、及びこれを用いた電子部品
JP2004031564A (ja) 2002-06-25 2004-01-29 Toray Ind Inc 樹脂膜の熱処理方法
JP2007233319A (ja) * 2006-01-31 2007-09-13 Kaneka Corp 感光性樹脂組成物およびその利用
JP4876851B2 (ja) * 2006-10-23 2012-02-15 東レ株式会社 耐熱樹脂前駆体組成物およびそれを用いた半導体装置
JP5062109B2 (ja) * 2007-10-09 2012-10-31 Ｊｎｃ株式会社 液晶配向剤、液晶配向膜および液晶表示素子
JP2010054451A (ja) 2008-08-29 2010-03-11 Yamanaka Semiconductor Kk 微小分析装置及びその製造方法、並びにその製造装置
JP5444833B2 (ja) * 2009-05-18 2014-03-19 日立化成株式会社 感光性樹脂組成物、リブパターンの形成方法及び電子部品
KR101413824B1 (ko) * 2009-12-24 2014-07-01 닛토덴코 가부시키가이샤 광대역 콜레스테릭 액정 필름의 제조 방법
JP5153762B2 (ja) * 2009-12-25 2013-02-27 日東電工株式会社 広帯域コレステリック液晶フィルムの製造方法
EP2565037B1 (en) * 2011-08-31 2014-10-01 Fujifilm Corporation Process for producing flexographic printing plate precursor for laser engraving, and process for making flexographic printing plate
KR20140087645A (ko) * 2012-12-31 2014-07-09 제일모직주식회사 포지티브형 감광성 수지 조성물
JP6390165B2 (ja) * 2014-05-21 2018-09-19 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
TW201710390A (zh) * 2015-08-31 2017-03-16 Fujifilm Corp 組成物、硬化膜、硬化膜的製造方法、半導體元件的製造方法及半導體元件
CN108885399B (zh) 2016-03-18 2022-03-15 东丽株式会社 负型感光性树脂组合物、固化膜、具备固化膜的显示装置、及其制造方法
CN109313397B (zh) * 2016-06-02 2023-04-11 富士胶片株式会社 层叠体的制造方法、半导体元件的制造方法及层叠体
TWI751190B (zh) * 2016-08-31 2022-01-01 日商富士軟片股份有限公司 感光性樹脂組成物及其應用
CN110392864B (zh) 2017-03-29 2023-05-23 东丽株式会社 负型感光性树脂组合物、固化膜、具备固化膜的元件及有机el显示器、以及其制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201533157A (zh) * 2014-02-10 2015-09-01 Hitachi Chem Dupont Microsys 樹脂組成物、硬化膜及其製造方法、圖案硬化膜及其製造方法、以及電子零件
CN107709408A (zh) * 2015-06-30 2018-02-16 富士胶片株式会社 前驱体组合物、感光性树脂组合物、前驱体组合物的制造方法、固化膜、固化膜的制造方法及半导体器件

Also Published As

Publication number Publication date
JP2023003421A (ja) 2023-01-11
KR102637283B1 (ko) 2024-02-16
WO2020080216A1 (ja) 2020-04-23
JP7137631B2 (ja) 2022-09-14
JPWO2020080216A1 (ja) 2021-09-02
CN112888714B (zh) 2023-02-28
KR20210057104A (ko) 2021-05-20
CN112888714A (zh) 2021-06-01
TW202043295A (zh) 2020-12-01

Similar Documents

Publication Publication Date Title
TWI758415B (zh) 感光性樹脂組成物、含雜環聚合物前體、硬化膜、積層體、硬化膜的製造方法及半導體裝置
TWI819088B (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體裝置
TWI728137B (zh) 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體裝置、積層體的製造方法、半導體裝置的製造方法及聚醯亞胺前驅物
TWI742285B (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體裝置
TWI785264B (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體元件及熱鹼產生劑
TWI732893B (zh) 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體元件、積層體的製造方法、半導體元件的製造方法及聚醯亞胺前驅物
TWI802640B (zh) 感光性樹脂組成物、樹脂、硬化膜、積層體、硬化膜之製造方法、半導體元件
JP7333383B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7281533B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
TWI819121B (zh) 硬化膜的製造方法、硬化膜、積層體的製造方法及半導體元件的製造方法
JP2020154205A (ja) パターン形成方法、硬化性樹脂組成物、膜、硬化膜、積層体、及び、半導体デバイス
JP7477579B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリマー前駆体
WO2020255859A1 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリイミド、又は、ポリイミド前駆体
JP7023379B2 (ja) 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、および半導体デバイス
TWI824035B (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
WO2020170997A1 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、熱塩基発生剤
TWI819043B (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體元件及熱鹼產生劑
TWI855040B (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及聚合物前驅物