TWI818692B - Driving backplane - Google Patents

Abstract

A driving backplane includes a substrate, a light-shielding pattern layer, a first insulating layer, a first conductive pattern layer, a second insulating layer and a second conductive pattern layer. The substrate has a front side, wherein the front side includes a bonding area. The light-shielding pattern layer is disposed on the front surface of the substrate. The first insulating layer is disposed on the light-shielding pattern layer. The first conductive pattern layer is disposed on the first insulating layer. The second insulating layer is disposed on the first conductive pattern layer. The second conductive pattern layer is disposed on the second insulating layer. In a top view of the driving backplane, in the bonding area, the first conductive pattern layer and the second conductive pattern layer have a common opening area, and the light shielding pattern layer completely shields the common opening area.

Description

Driver backplane

The invention relates to a driving backplane.

The light-emitting diode display panel includes a driving backplane and a plurality of light-emitting diode elements transferred on the driving backplane. Inheriting the characteristics of light-emitting diodes, light-emitting diode display panels have the advantages of power saving, high efficiency, high brightness and fast response time. In addition, compared with organic light-emitting diode display panels, light-emitting diode display panels also have the advantages of easy color adjustment, long luminous life, and no image imprinting. Therefore, light-emitting diode display panels are regarded as the next generation of display technology. However, the light passes through multiple film layers on the front side of the driving backplane and is transmitted to the backside circuits on the back side of the driving backplane. Light will be reflected by the circuits on the back, allowing users to see the circuits on the back, affecting the visual effect of the LED display panel.

The invention provides a driving backplane with good visual effects.

The driving backplane of the present invention includes a substrate, a light-shielding pattern layer, a first insulating layer, a first conductive pattern layer, a second insulating layer and a second conductive pattern layer. The substrate has The front side includes the joint area. The light-shielding pattern layer is disposed on the front side of the substrate. The first insulation layer is disposed on the light-shielding pattern layer. The first conductive pattern layer is disposed on the first insulation layer. The second insulation layer is disposed on the first conductive pattern layer. The second conductive pattern layer is disposed on the second insulation layer. In the top view of the driving backplane, in the joint area, the first conductive pattern layer and the second conductive pattern layer have a common opening area, and the light-shielding pattern layer completely blocks the common opening area.

10:Drive backplane

110:Substrate

112:front

112a:Joint area

112a-1: First boundary

112a-2: Second boundary

112a-3: Third boundary

112a-4: Fourth boundary

114:Back

120:Light-shielding pattern layer

130:Buffer layer

140: Gate insulation layer

150: Interlayer dielectric layer

160: First insulation layer

170: First conductive pattern layer

170a: First opening

171, 191, 211: first conductive block

172, 192, 212: Second conductive block

180: Second insulation layer

190: Second conductive pattern layer

190a:Second opening

200:Third insulation layer

210: The third conductive pattern layer

210a: Third opening

211a, 212a: pad

220:Transparent conductive pattern layer

221, 222: Transparent conductive pattern

230:Fourth insulation layer

231, 231a, 232, 232a: through hole

240:Back line

A1, A2, A3, A4: distance

O: Common opening area

W, Wx, Wy: Width

x: first direction

y: second direction

I-I’: section line

FIG. 1 is a schematic cross-sectional view of a driving backplane 10 according to an embodiment of the present invention.

FIG. 2 is a schematic top view of the driving backplane 10 according to an embodiment of the present invention.

FIG. 3 is a schematic top view of the light-shielding pattern layer 120 of the driving backplane 10 according to an embodiment of the present invention.

FIG. 4 is a schematic top view of the first conductive pattern layer 170 of the driving backplane 10 according to an embodiment of the present invention.

FIG. 5 is a schematic top view of the second conductive pattern layer 190 of the driving backplane 10 according to an embodiment of the present invention.

FIG. 6 is a schematic top view of the third conductive pattern layer 210 of the driving backplane 10 according to an embodiment of the present invention.

FIG. 7 is a schematic top view of the transparent conductive pattern layer 220 and the fourth insulating layer 230 of the driving backplane 10 according to an embodiment of the present invention.

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or similar parts.

It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, "electrical connection" or "coupling" may mean the presence of other components between two components.

As used herein, "about," "approximately," or "substantially" includes the stated value and the average within an acceptable range of deviations from the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the A specific amount of error associated with a measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the terms "about", "approximately" or "substantially" used herein may be used to select a more acceptable deviation range or standard deviation based on optical properties, etching properties or other properties, and one standard deviation may not apply to all properties. .

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed to have the same meaning as they have in the context of the relevant technology and the present invention. Consistent meaning and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

FIG. 1 is a schematic cross-sectional view of a driving backplane 10 according to an embodiment of the present invention. FIG. 2 is a schematic top view of the driving backplane 10 according to an embodiment of the present invention. FIG. 3 is a schematic top view of the light-shielding pattern layer 120 of the driving backplane 10 according to an embodiment of the present invention. FIG. 4 is a schematic top view of the first conductive pattern layer 170 of the driving backplane 10 according to an embodiment of the present invention. FIG. 5 is a schematic top view of the second conductive pattern layer 190 of the driving backplane 10 according to an embodiment of the present invention. FIG. 6 is a schematic top view of the third conductive pattern layer 210 of the driving backplane 10 according to an embodiment of the present invention. FIG. 7 is a schematic top view of the transparent conductive pattern layer 220 and the fourth insulating layer 230 of the driving backplane 10 according to an embodiment of the present invention. Figure 1 corresponds to the cross-section line I-I' of Figures 2 to 7.

Referring to FIGS. 1 and 2 , the driving backplane 10 includes a substrate 110 having a front surface 112 and a back surface 114 opposite to the front surface 112 . Front surface 112 of substrate 110 includes bonding area 112a. In this embodiment, the substrate 110 is light-transmissive. For example, in this embodiment, the material of the substrate 110 may be glass, quartz, organic polymer, or other applicable materials.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , the driving backplane 10 further includes a light-shielding pattern layer 120 disposed on the front surface 112 of the substrate 110 . In this embodiment, the material of the light-shielding pattern layer 120 is, for example, metal, but the invention is not limited thereto. In this embodiment, the light-shielding pattern layer 120 can be selectively floating, but the invention is not limited thereto.

Please refer to Figure 1, the driving backplane 10 also includes a first insulating layer 160, configured on the light-shielding pattern layer 120 . The first insulating layer 160 may be composed of a single film layer or multiple stacked film layers. In this embodiment, the driving backplane 10 may further include a buffer layer 130 disposed on the light-shielding pattern layer 120, a semiconductor pattern layer (not shown) disposed on the buffer layer 130, and a semiconductor pattern layer disposed on the semiconductor pattern layer. The gate insulating layer 140, a first metal layer (not shown) disposed on the gate insulating layer 140, an interlayer dielectric layer 150 disposed on the first metal layer, and a second interlayer dielectric layer 150 disposed on the gate insulating layer 140. A metal layer (not shown), wherein the semiconductor pattern layer may include a channel of a thin film transistor, the first metal layer may include a gate of the thin film transistor, and the second metal layer may include the thin film For the source and drain of the transistor, the first insulating layer 160 can be disposed on the interlayer dielectric layer 150 and cover the second metal layer, but the invention is not limited thereto.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , the driving backplane 10 further includes a first conductive pattern layer 170 disposed on the first insulating layer 160 . The first conductive pattern layer 170 can block light. In this embodiment, the material of the first conductive pattern layer 170 can be metal, and the first conductive pattern layer 170 can also be called a third metal layer, but the invention is not limited thereto. Please refer to FIGS. 1 and 4 . In this embodiment, the first conductive pattern layer 170 may include a first conductive block 171 and a second conductive block 172 , wherein the first conductive block 171 of the first conductive pattern layer 170 There is a first opening 170a between the second conductive block 172 and the second conductive block 172 . In this embodiment, the first conductive block 171 and the second conductive block 172 extend substantially in the same direction (ie, the second direction y) and are spaced apart from each other to define the strip-shaped first opening 170a. In this embodiment, the first conductive pattern layer 170 may include at least part of a pulse width modulation (Pulse Width Modulation) circuit, The pulse width modulation circuit can control the current switching time to determine the gray-scale brightness, but the invention is not limited to this.

Please refer to FIG. 1 , the driving backplane 10 further includes a second insulating layer 180 disposed on the first conductive pattern layer 170 . The second insulating layer 180 may be composed of a single film layer or multiple stacked film layers.

Referring to FIG. 1 , FIG. 2 and FIG. 5 , the driving backplane 10 further includes a second conductive pattern layer 190 disposed on the second insulating layer 180 . The second conductive pattern layer 190 can block light. In this embodiment, the material of the second conductive pattern layer 190 can be metal, and the second conductive pattern layer 190 can also be called a fourth metal layer, but the invention is not limited thereto.

Please refer to FIGS. 1 and 5 . In this embodiment, the second conductive pattern layer 190 may include a first conductive block 191 and a second conductive block 192 , wherein the first conductive block 191 of the second conductive pattern layer 190 There is a second opening 190a between the second conductive block 192 and the second opening 190a. In this embodiment, the first conductive block 191 may surround the second conductive block 192, and the first conductive block 191 and the second conductive block 192 are spaced apart from each other to define an annular second opening 190a. In this embodiment, the second conductive pattern layer 190 may include at least part of a pulse amplitude modulation (Pulse Amplitude Modulation) circuit, wherein the pulse amplitude modulation circuit may control the current amplitude to determine the gray-scale brightness.

Please refer to FIG. 1 . In this embodiment, the driving backplane 10 may further include a third insulating layer 200 disposed on the second conductive pattern layer 190 . The third insulating layer 200 may be composed of a single film layer or multiple stacked film layers.

Please refer to Figure 1, Figure 2 and Figure 6. In this embodiment, the driving backplane 10 It may also include a third conductive pattern layer 210 disposed on the third insulating layer 200 . The third conductive pattern layer 210 can block light. In this embodiment, the material of the third conductive pattern layer 210 can be metal, and the third conductive pattern layer 210 can also be called a fifth metal layer, but the invention is not limited thereto.

Please refer to FIGS. 1 and 6 . In this embodiment, the third conductive pattern layer 210 may include a first conductive block 211 and a second conductive block 212 , wherein the first conductive block 211 of the third conductive pattern layer 210 There is a third opening 210a between the third conductive pattern layer 210 and the second conductive block 212 . In this embodiment, the first conductive block 211 of the third conductive pattern layer 210 surrounds the second conductive block 212 of the third conductive pattern layer 210, and the first conductive block 211 of the third conductive pattern layer 210 is connected to the third conductive block 211 of the third conductive pattern layer 210. The second conductive areas 212 of the conductive pattern layer 210 are spaced apart from each other to define the third opening 210a. The third conductive pattern layer 210 has a plurality of contact pads 211a and 212a. Each pad 212a may be an island-shaped second conductive block 212. Each pad 211a may be a part of the first conductive block 211 protruding next to the second conductive block 212. For example, in this embodiment, the pad 212a can be used to be electrically connected to the anode of the light-emitting diode element (not shown), and the other pad 211a can have a ground potential and be used to be electrically connected to the light-emitting diode element. The cathode is electrically connected.

Please refer to FIGS. 1 , 2 , 6 and 7 . In this embodiment, the driving backplane 10 may further include a transparent conductive pattern layer 220 disposed on the third conductive pattern layer 210 . Please refer to FIGS. 1 , 6 and 7 . In this embodiment, the transparent conductive pattern layer 220 can be directly disposed on the third conductive pattern layer 210 and be electrically connected to the third conductive pattern layer 210 . In detail, in this embodiment, the transparent conductive pattern layer 220 There are a plurality of transparent conductive patterns 221 and 222, wherein the plurality of transparent conductive patterns 221 and 222 are respectively disposed on the plurality of pads 211a and 212a of the third conductive pattern layer 210 and are respectively connected to the plurality of contacts of the third conductive pattern layer 210. Pads 211a and 212a are electrically connected. For example, in this embodiment, the transparent conductive pattern layer 220 may include metal oxides, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium germanium zinc oxide, and others. A suitable oxide, or a stacked layer of at least two of the above, but the present invention is not limited thereto.

Please refer to Figures 1, 2, 6 and 7. In this embodiment, the driving backplane 10 may further include a fourth insulating layer 230, which is disposed on the transparent conductive pattern layer 220 and has a plurality of through holes 231. 232, wherein the plurality of through holes 231 and 232 of the fourth insulating layer 230 overlap with the plurality of transparent conductive patterns 221 and 222 respectively. The plurality of transparent conductive patterns 221 and 222 exposed by the plurality of through holes 231 and 232 of the fourth insulating layer 230 and the plurality of contact pads 211a and 212a under the plurality of transparent conductive patterns 221 and 222 are used to communicate with the light emitting diodes. Body components (not shown) are joined to form a display device.

Please refer to FIG. 1 . In this embodiment, the driving backplane 10 further includes a backside circuit 240 disposed on the backside 114 of the substrate 110 . The backside circuit 240 can be connected to the third circuit breaker provided on the front surface 112 of the substrate 110 through side traces provided on the sidewalls (not shown) of the substrate 110 , conductive vias (not shown) penetrating the substrate 110 or other conductive elements. A conductive pattern layer 170, a second conductive pattern layer 190 and/or a third conductive pattern layer 210 are electrically connected. In this embodiment, the backside traces 240 are reflective. For example, in this embodiment, the material of the backside circuit 240 may be metal, but the invention is not limited thereto.

Please refer to FIG. 1, FIG. 2, FIG. 3 and FIG. 4. In the top view of the driving backplane 10, in the joint area 112a, the first conductive pattern layer 170 and the second conductive pattern layer 190 have a common opening area O, and the common opening is The area O is where the first opening 170a of the first conductive pattern layer 170 and the second opening 190a of the second conductive pattern layer 190 overlap, and the light-shielding pattern layer 120 completely blocks the common opening area O.

In this embodiment, the common opening area O of the first conductive pattern layer 170 and the second conductive pattern layer 190 overlaps a part of the light-shielding pattern layer 120 and the backside circuit 240 . That is to say, the light-shielding pattern layer 120 blocks the parts of the backside circuit 240 that are not blocked by the first conductive pattern layer 170 and the second conductive pattern layer 190 . Thereby, the light beam (not shown) is not easily transmitted from the front surface 112 to the back circuit 240 and is reflected by the back circuit 240 . In this way, the user cannot easily see the rear circuit 240 from the front 112 , thereby improving the visual effect of the display device including the driving backplane 10 .

Please refer to FIGS. 1 , 3 , 4 and 5 . In this embodiment, the first opening 170 a of the first conductive pattern layer 170 and the second opening 190 a of the second conductive pattern layer 190 are interlaced with each other to define the first opening 170 a of the second conductive pattern layer 190 . The common opening area O of the conductive pattern layer 170 and the second conductive pattern layer 190 . Specifically, in this embodiment, the first opening 170a of the first conductive pattern layer 170 is in a strip shape and extends substantially in the second direction y, and the second opening 190a of the second conductive pattern layer 190 is in a ring shape. One section of the annular second opening 190a extends in the first direction x, and the first opening 170a of the strip-shaped first conductive pattern layer 170 and the second opening 190a of the annular second conductive pattern layer 190 are One section is staggered to define a common opening area O, but the invention is not limited thereto.

Please refer to Figures 1, 3, 4, 5 and 6. In this embodiment, in the top view of the driving backplane 10, in the joint area 112a, the first conductive pattern layer 170 and the second conductive pattern layer 190 and the third conductive pattern layer 210 have a common opening area O. The third openings 210a of the third conductive pattern layer 210 intersect with the first openings 170a of the first conductive pattern layer 170 and overlap with the second openings 190a of the second conductive pattern layer 190 to define the first conductive pattern layer 170, The common opening area O of the two conductive pattern layers 190 and the third conductive pattern layer 210.

A1

0.75W，0.25W

A2

0.75W，0.35W

A3

0.85W，且0.35W

A4

0.85W。舉例而言，在本實施例中，寬度W、距離A1、距離A2、距離A3及距離A2可分別為85μm、50μm、50μm、55μm及60μm，但本發明不以此為限。另外，在本實施例中，接合區112a在第一方向x上的寬度Wx及在第二方向y上的寬度Wy可分別為400μm及200μm；但本發明不以此為限。 Please refer to Figure 7. In this embodiment, the joint area 112a has a first boundary 112a-1, a second boundary 112a-2, a third boundary 112a-3 and a fourth boundary 112a-4. The first boundary 112a-1 is opposite to At the second boundary 112a-2, the third boundary 112a-3 is connected between the first boundary 112a-1 and the second boundary 112a-2, and the fourth boundary 112a-4 is relative to the third boundary 112a-3 and connected to Between the first boundary 112a-1 and the second boundary 112a-2; the plurality of through-holes 231, 232 of the fourth insulating layer 230 are located in the joint area 112a; the plurality of through-holes 231, 232 include areas respectively close to the first boundary 112a- 1 and the first through hole 232a and the second through hole 231a of the second boundary 112a-2; the plurality of through holes 231 and 232 are arranged in the first direction x, and each of the plurality of through holes 231 and 232 is in contact with the A direction x is substantially vertical and a second direction y has a width W. The first through hole 232a and the first boundary 112a-1 of the joint area 112a have a distance A1 in the first direction x. The second through hole 231a and the joint area 112a have a width W. The second boundary 112a-2 of 112a has a distance A2 in the first direction x. The first through hole 232a and the third boundary 112a-3 of the joint area 112a have a distance A3 in the second direction y. The fourth boundary 112a-4 of the bonding area 112a has a distance A4, 0.25W in the second direction y

A1

0.75W, 0.25W

A2

0.75W, 0.35W

A3

0.85W, and 0.35W

A4

0.85W. For example, in this embodiment, the width W, distance A1, distance A2, distance A3 and distance A2 may be 85 μm, 50 μm, 50 μm, 55 μm and 60 μm respectively, but the invention is not limited thereto. In addition, in this embodiment, the width Wx of the bonding area 112a in the first direction x and the width Wy in the second direction y may be 400 μm and 200 μm respectively; however, the invention is not limited thereto.

10:Drive backplane

110:Substrate

112:front

114:Back

120:Light-shielding pattern layer

130:Buffer layer

140: Gate insulation layer

150: Interlayer dielectric layer

160: First insulation layer

170: First conductive pattern layer

170a: First opening

171, 191, 211: first conductive block

172: Second conductive block

180: Second insulation layer

190: Second conductive pattern layer

190a:Second opening

200:Third insulation layer

210: The third conductive pattern layer

210a: Third opening

230:Fourth insulation layer

240:Back line

O: Common opening area

I-I’: section line

Claims (10)

A driving backplane includes: A substrate having a front side, wherein the front side includes a bonding area; A light-shielding pattern layer is provided on the front side of the substrate; a first insulating layer disposed on the light-shielding pattern layer; a first conductive pattern layer disposed on the first insulating layer; a second insulating layer disposed on the first conductive pattern layer; and a second conductive pattern layer disposed on the second insulating layer; In the top view of the driving backplane, in the bonding area, the first conductive pattern layer and the second conductive pattern layer have a common opening area, and the light-shielding pattern layer completely blocks the common opening area. The driving backplane as claimed in claim 1, wherein the substrate further has a back side relative to the front side, and the driving backplane further includes: A backside circuit is provided on the backside of the substrate; Wherein, the common opening area of the first conductive pattern layer and the second conductive pattern layer overlaps a part of the light-shielding pattern layer and the backside circuit. The drive backplane as described in claim 1, wherein, The first conductive pattern layer includes: a first conductive block; and a second conductive block, wherein a first opening exists between the first conductive block of the first conductive pattern layer and the second conductive block of the first conductive pattern layer; The second conductive pattern layer includes: a first conductive block; and a second conductive block, wherein a second opening exists between the first conductive block of the second conductive pattern layer and the second conductive block of the second conductive pattern layer; The first opening of the first conductive pattern layer and the second opening of the second conductive pattern layer are interleaved with each other to define the common opening area of the first conductive pattern layer and the second conductive pattern layer. The driving backplane of claim 3, wherein the first conductive block of the first conductive pattern layer and the second conductive block of the first conductive pattern layer extend substantially in the same direction and are spaced apart from each other. , to define the strip-shaped first opening; the first conductive block of the second conductive pattern layer surrounds the second conductive block of the second conductive pattern layer, and the first conductive block of the second conductive pattern layer The conductive block and the second conductive block of the second conductive pattern layer are spaced apart from each other to define the annular second opening. The driver backplane as described in request item 3 further includes: a third insulating layer disposed on the second conductive pattern layer; and A third conductive pattern layer is provided on the third insulating layer; In the top view of the driving backplane, in the bonding area, the first conductive pattern layer, the second conductive pattern layer and the third conductive pattern layer have the common opening area. The drive backplane as described in claim 5, wherein, The third conductive pattern layer includes: a first conductive block; and a second conductive block, wherein a third opening exists between the first conductive block of the third conductive pattern layer and the second conductive block of the third conductive pattern layer; The third opening of the third conductive pattern layer intersects with the first opening of the first conductive pattern layer and overlaps with the second opening of the second conductive pattern layer to define the first conductive pattern layer, the The common opening area of the second conductive pattern layer and the third conductive pattern layer. The driving backplane of claim 6, wherein the first conductive block of the third conductive pattern layer surrounds the second conductive block of the third conductive pattern layer, and the first conductive block of the third conductive pattern layer The conductive block and the second conductive block of the third conductive pattern layer are spaced apart from each other to define the third opening. The driver backplane as described in request item 1 further includes: a third insulating layer disposed on the second conductive pattern layer; A third conductive pattern layer is provided on the third insulating layer and has a plurality of contact pads; A transparent conductive pattern layer is disposed on the third conductive pattern layer and has a plurality of transparent conductive patterns, wherein the transparent conductive patterns are respectively disposed on the pads of the third conductive pattern layer and are respectively connected with the third conductive pattern layer. The pads of the conductive pattern layer are electrically connected; and A fourth insulating layer is provided on the transparent conductive pattern layer and has a plurality of through holes, wherein the through holes of the fourth insulating layer overlap with the transparent conductive patterns respectively; The joint area has a first boundary, a second boundary, a third boundary and a fourth boundary. The first boundary is relative to the second boundary. The third boundary is connected to the first boundary and the second boundary. between, and the fourth boundary is relative to the third boundary and connected between the first boundary and the second boundary; The through holes of the fourth insulating layer are located in the joint area, and the through holes include a first through hole and a second through hole respectively close to the first boundary and the second boundary; The through holes are arranged in a first direction, each of the through holes has a width (W) in a second direction that is substantially perpendicular to the first direction, and the first through hole is connected to the The first boundary of the area has a distance (A1) in the first direction, the second through hole and the second boundary of the joint area have a distance (A2) in the first direction, and the first through hole has a distance (A2) in the first direction. There is a distance (A3) between the hole and the third boundary of the joint area in the second direction, and there is a distance (A4) between the first through hole and the fourth boundary of the joint area in the second direction, 0.25W≤A1≤0.75W, 0.25W≤A2≤0.75W, 0.35W≤A3≤0.85W, and 0.35W≤A4≤0.85W. The driving backplane of claim 1, wherein the first conductive pattern layer includes at least part of a pulse width modulation circuit. The driving backplane of claim 1, wherein the second conductive pattern layer includes at least part of a pulse amplitude modulation circuit.