TWI818473B - Cushion - Google Patents

Abstract

A cushion applied to a bottom board and a speaker in an electronic device is provided in the present disclosure. The cushion includes a body, a plurality of first bumps, a plurality of the second bumps and an outer ring structure. The body surrounds a positioning column on the bottom board. The first bumps are on a bottom surface of the body and in contact with the bottom board. The second bumps are on the bottom surface of the body, and thickness of the second bumps is less than a thickness of the first bumps. The outer ring structure surrounds a periphery of the body, and the outer ring structure is configured to clamp the speaker to fix the speaker at the positioning column.

Description

Buffer

Some embodiments of the present disclosure relate to a buffer member, which is particularly suitable for a buffer member of a speaker.

In today's trend, electronic products (such as notebook computers) are becoming thinner and lighter, so that the space used by electronic products to accommodate components is becoming smaller and smaller. While the size of electronic products has become smaller, the performance and specifications of components in electronic products, such as speakers, have remained at a certain level. As a result, when using a speaker in an electronic product, because the accommodation space of the electronic product becomes smaller, the resonance rate of the speaker to the casing or other components of the electronic product will increase, thereby causing interference to the user.

Some embodiments of the present disclosure provide a buffer member that is applied to the base plate and speaker of an electronic device. The buffer component includes a body, a plurality of first bumps, a plurality of second bumps and an outer ring structure. The body surrounds the positioning posts on the bottom plate. A plurality of first bumps are located on the bottom surface of the body and contact the base plate. A plurality of second bumps are located on the bottom surface of the body, wherein the thickness of the second bumps is smaller than the thickness of the first bumps. The outer ring structure surrounds the periphery of the body, wherein the outer ring structure is configured to clamp the speaker to fix the speaker on the positioning post.

In some embodiments, the buffer further includes a plurality of protrusions located on the inner periphery of the body, the protrusions contact the positioning posts, and a plurality of cavities are jointly defined between the protrusions, the body and the positioning posts.

In some embodiments, a portion of the protrusion is adjacent the first bump.

In some embodiments, a portion of the protrusion is adjacent the second bump.

In some embodiments, the outer ring structure has grooves to accommodate portions of the speakers.

In some embodiments, the first bumps and the second bumps are alternately arranged.

In some embodiments, the first bump is closer to the inner periphery of the body than to the outer periphery of the body.

In some embodiments, the buffering member further includes a plurality of third bumps located on the top surface of the body.

In some embodiments, when the screw is locked on the positioning post, the screw contacts the third protrusion.

In some embodiments, a portion of the third bump is located directly above the first bump.

In summary, the buffer members in some embodiments of the present disclosure may have bumps and protrusions to absorb vibrations from the speakers. In this way, the noise and vibration produced by speakers using electronic devices can be reduced.

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, the following description where a first feature is formed on or on a second feature may include embodiments in which the first feature and the second feature are formed in direct contact, and may also include embodiments in which additional features may be Embodiments are formed between a first feature and a second feature such that the first feature and the second feature may not be in direct contact. Additionally, the present disclosure may repeat reference symbols and/or letters in various instances. This repetition is for simplicity and clarity and does not in itself represent a relationship between the various embodiments and/or configurations discussed.

In addition, for simplicity of description, spatially relative terms such as "below", "below", "lower", "above", "upper" and similar terms may be used herein. Describe the relationship of one element or feature to another (additional) element or feature as illustrated in the figures. These spatially relative terms are intended to encompass different orientations of elements in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

As used herein, "about," "approximately," "approximately" or "substantially" generally means falling within twenty percent, within ten percent, or within one hundred percent of a given value or range. Out of five. Numerical quantities given herein are approximations, meaning that terms such as "about," "approximately," "approximately" or "substantially" may be inferred when not expressly stated otherwise.

Some embodiments of the present disclosure relate to a buffer applied to a base plate and a speaker of an electronic device. The buffer member may have bumps and protrusions for absorbing vibrations from the speaker. In this way, the noise and vibration produced by the speaker of the electronic device can be reduced, and the resonance effect of the speaker on the internal components and chassis of the electronic device can also be reduced.

FIG. 1 illustrates an internal structure diagram of an electronic device 100 according to some embodiments of the present disclosure. The electronic device 100 may be a laptop computer or other suitable electronic device. The electronic device 100 may include a chassis 102, a component area 104, a bottom panel 112, a speaker 120 and a buffer 130. The chassis 102 is used to accommodate the component area 104, the bottom panel 112 and the speaker 120. The component area 104 may be located on an upper portion of the electronic device 100 . The component area 104 may include fans, hard disks, memory, circuit boards, or other suitable electronic components. The base plate 112 is adjacent to the component area 104 . The base plate 112 can be a base plate connected to a keyboard or a flat plate installed on the chassis 102 . In some embodiments, the base plate 112 may also be a circuit board. The bottom plate 112 may be provided with positioning posts 114, and screws and other parts (shown in Figure 4) may be used to lock the speaker 120 to the positioning posts 114 to fix the speaker 120 on both sides of the bottom plate 112. The buffer member 130 can be used to clamp the speaker 120 to reduce the vibration transmitted from the speaker 120 to the base plate 112 . Buffers 130 may be located at both ends of the speaker 120 . Each speaker 120 may be secured to the base plate 112 by any number of bumpers 130 . For example, the speaker 120 can be fixed on the base plate 112 by two buffer members 130, but the number of the buffer members 130 is not limited to two.

Figure 2 shows an enlarged view of the speaker 120 and the buffer 130 in Figure 1 . Figure 2 shows the speaker 120 and buffer 130 on the right side of Figure 1 . The speaker 120 may include a speaker element 122 and a support plate 124 . The support plate 124 may have a hole in the middle to accommodate the speaker element 122 , so that the speaker element 122 can be embedded in the support plate 124 . Both ends of the support plate 124 may also have holes, so that the buffer members 130 can be installed on both ends of the support plate 124 . In other words, the buffers 130 may be located on opposite sides of the speaker element 122 . In some embodiments, in the same speaker 120, the distance between the buffer 130 and the speaker element 122 is not fixed. For example, in Figure 2, the upper buffer member 130 is closer to the speaker element 122, while the lower buffer member 130 is farther from the speaker element 122. However, FIG. 2 is only an illustration and does not limit the distance between the buffer member 130 and the speaker element 122 . The buffer member 130 can be used to reduce vibration caused by the speaker 120 . In some embodiments, the buffer member 130 is made of a shock-absorbing material such as rubber. The details of the speaker 120 and the buffer 130 on the left side of FIG. 1 may be similar to the speaker 120 and the buffer 130 shown in FIG. 2 . The difference is that the shape of the support plate 124 may be changed to accommodate it in the chassis 102 . For example, the support plates 124 of the left and right speakers 120 may be symmetrical to each other.

Figure 3 shows a bottom view of the buffer member 130 and the positioning post 114 in Figure 1 . FIG. 4 illustrates a cross-sectional view along line A-A in FIG. 1 , and illustrates a cross-sectional view of the buffer member 130 fixed to the positioning post 114 . Referring to FIGS. 3 and 4 , the buffer member 130 includes a body 132 , a plurality of first protrusions 134 , a plurality of second protrusions 136 and a plurality of protrusions 138 . The body 132 has an annular structure, so the body 132 of the buffer member 130 forms a hollow space. The body 132 has a bottom surface 132B close to the bottom plate 112 and a top surface 132T away from the bottom plate 112 . The first bumps 134 are located on the bottom surface 132B of the body 132 and contact the bottom plate 112 , and each first bump 134 has the same thickness. The bumper 130 may include any suitable number of first bumps 134 . For example, the buffer 130 may include three first bumps 134 . When the buffer member 130 includes three first bumps 134, the three first bumps 134 can form a smooth plane. Even if the thickness of the first bumps 134 has a slight deviation due to manufacturing tolerances, all the first bumps 134 can form a smooth plane. 134 can still contact the base plate 112. The buffer member 130 only contacts the base plate 112 through the first bump 134 , that is, the buffer member 130 does not completely contact the base plate 112 . Therefore, the vibration of the speaker 120 can be offset by the buffer member 130 , and all the vibrations caused by the speaker 120 will not be transmitted to the base plate 112 through the buffer member 130 . Therefore, the noise and vibration of the electronic device 100 caused by the speaker 120 can be effectively reduced. Therefore, when the buffer member 130 according to some embodiments of the present disclosure is used, the use of additional consumables attached to the speaker 120 for absorbing shock can be reduced, thereby reducing manufacturing costs. In some embodiments, the resonance of the electronic device 100 caused by the speaker 120 can be tested by software verification test procedures (SVTP). When the buffer 130 of some embodiments of the present disclosure is provided, the electronic device 100 can be found through the SVTP test that the resonance of the electronic device 100 caused by the speaker 120 is within an acceptable range.

The second bumps 136 are located on the bottom surface 132B of the body 132 and each second bump 136 has the same thickness. The thickness of the second bump 136 is smaller than the thickness of the first bump 134 . Therefore, the second bump 136 does not contact the bottom plate 112 , so that there is a gap between the second bump 136 and the bottom plate 112 . In some embodiments, the thickness of the second bump 136 is about 0.05 mm to about 0.15 mm smaller than the thickness of the first bump 134 . Since the thickness of the second bump 136 is smaller than that of the first bump 134 , the second bump 136 will not affect the plane caused by the contact between the first bump 134 and the bottom plate 112 . That is to say, the presence of the second bump 136 will not cause the buffer member 130 to be unstablely fixed on the base plate 112 . The second bump 136 can also assist the first bump 134 to further reduce noise and resonance caused by the speaker 120 . In some embodiments, when the buffer 130 has the second bump 136, more optimized SVTP data can be obtained, that is, the noise and resonance caused by the speaker 120 can be further reduced.

The first bumps 134 and the second bumps 136 may be alternately arranged around the center of the body 132 . In some embodiments, the number of second bumps 136 may be three. In FIG. 3 , the first bump 134 and the second bump 136 are both spherical, but the shapes of the first bump 134 and the second bump 136 can be changed arbitrarily. In addition, compared to the periphery of the body 132 of the buffer member 130 , the first protrusion 134 and the second protrusion 136 are closer to the inner periphery of the body 132 . In other words, the first bump 134 and the second bump 136 do not contact the periphery of the body 132 , and the lowest points of the first bump 134 and the second bump 136 are closer to the inner periphery of the body 132 .

The protrusion 138 is located on the inner periphery of the body 132 . The protrusion 138 contacts the positioning post 114 . In some embodiments, the outer diameter of positioning post 114 is in the range of about 3 mm to about 5 mm. The protrusion 138 is adjacent to the first protrusion 134 and the second protrusion 136 and protrudes toward the center of the body 132 . As a result, the inner periphery of the body 132 is not a smooth circle, and a plurality of cavities V are jointly defined between the protruding portion 138 , the body 132 and the positioning post 114 . In other words, the inner periphery of the body 132 of the buffer member 130 does not completely contact the positioning post 114 . Since the inner periphery of the body 132 does not completely contact the positioning post 114, all the vibrations caused by the speaker 120 will not be transmitted to the positioning post 114 and the bottom plate 112 through the buffer member 130. Therefore, the electronic device caused by the speaker 120 can be effectively reduced. 100% noise and vibration. The outer ring structure 140 surrounds the periphery of the body 132 . In some embodiments, the distance between the inner periphery of the body 132 of the buffer member 130 and the positioning post 114 ranges from about 0.55 mm to about 0.65 mm. The outer ring structure 140 is configured to clamp the speaker 120 to fix the speaker 120 on the positioning post 114 . The outer ring structure 140 has a groove R to accommodate part of the speaker 120 . In some embodiments, groove R is annular. Therefore, the buffer member 130 can be fixed to the support plate 124 of the speaker 120 through the groove R.

In FIG. 4 , the body 132 of the buffer member 130 surrounds the positioning post 114 . The positioning post 114 has a screw hole in the middle, so the buffer member 130 can be fixed on the positioning post 114 through the screw 150 . In some embodiments, the buffer member 130 may further include third bumps 142 and fourth bumps 144 . The third bump 142 and the fourth bump 144 are located on the top surface 132T of the body 132 of the buffer member 130 . The third bump 142 and the fourth bump 144 may have the same thickness and position as the first bump 134 and the second bump 136 respectively. In other words, the top view of the buffer member 130 (ie, the view showing the top surface 132T) may be the same as the bottom view of the buffer member 130 , and the third bump 142 may be directly above the first bump 134 , and the fourth bump 142 may be directly above the first bump 134 . The bump 144 may be directly above the second bump 136 . Since the thickness of the fourth protrusion 144 is smaller than that of the third protrusion 142 , when the screw 150 is locked on the positioning post 114 , the screw 150 contacts the third protrusion 142 but does not contact the fourth protrusion 144 . In other words, at a specific position, the buffer member 130 can simultaneously contact the bottom plate 112 and the screw 150 through the first protrusion 134 and the third protrusion 142 respectively. The third bump 142 can be used to reduce the noise and vibration of the electronic device 100 caused by the speaker 120 , and the fourth bump 144 can assist the third bump 142 to further reduce the noise and resonance caused by the speaker 120 .

To sum up, the buffer member used to clamp the speaker may include a first bump on the bottom surface, a third bump on the top surface and a protrusion on the inner periphery of the body, and the buffer member passes through the first bump , the third bump and the protruding portion partially contact the base plate, screws and positioning posts. Since the first bump, the third bump and the protruding portion are in slight contact with the base plate, screws and positioning posts respectively, all vibrations caused by the speaker will not be transmitted to the base plate, screws and positioning posts through the buffer. Therefore, the noise and vibration of the electronic device caused by the speaker can be effectively reduced. In addition, when using buffers such as some embodiments of the present disclosure, the use of additional consumables attached to the speaker for absorbing vibrations can be reduced, thereby reducing manufacturing costs.

The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent structures do not depart from the spirit and scope of the disclosure, and they can make various changes, substitutions and substitutions herein without departing from the spirit and scope of the disclosure.

100: Electronic devices 102: Chassis 104: Component area 112: Bottom plate 114: Positioning column 120: Speaker 122: Speaker component 124: Support plate 130: buffer parts 132: Ontology 132B: Bottom surface 132T: Top surface 134: First bump 136: Second bump 138: Protrusion 140: Outer ring structure 142: Third bump 144: Fourth bump 150: screw R: Groove V: cavity

Aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying figures. It should be noted that in accordance with standard industry practice, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. FIG. 1 illustrates an internal structure diagram of an electronic device according to some embodiments of the present disclosure. Figure 2 shows an enlarged view of the speaker and buffer in Figure 1 . Figure 3 shows the bottom view of the buffer member and positioning post in Figure 1 . Figure 4 shows a cross-sectional view along line A-A in Figure 1 .

114: Positioning column 130: buffer parts 132: Ontology 134: First bump 136: Second bump 138: Protrusion V: cavity

Claims (10)

A buffer member, applied to a base plate of an electronic device and a speaker, the buffer member includes: a body, the body is hollow annular, surrounding a positioning post set on the base plate; a plurality of first bumps, Located on a bottom surface of the body and contacting the base plate; a plurality of second bumps located on the bottom surface of the body, wherein the thickness of the second bumps is smaller than the thickness of the first bumps; and an outer ring A structure surrounds the periphery of the body, wherein the outer ring structure is configured to clamp the speaker to fix the speaker on the positioning post. The buffer member according to claim 1, further comprising: a plurality of protrusions located on the inner periphery of the body, these protrusions contact the positioning post, and the protrusions, the body and the positioning post are jointly defined. Plural cavities. The buffer member according to claim 2, wherein some of the protrusions are adjacent to the first bumps. The buffer member according to claim 2, wherein some of the protrusions are adjacent to the second protrusions. The buffer member as claimed in claim 1, wherein the outer ring structure A groove is provided to accommodate part of the speaker. The buffer member according to claim 1, wherein the first protrusions and the second protrusions are arranged alternately. The buffer member of claim 1, wherein the first protrusions are closer to an inner periphery of the body than to the periphery of the body. The buffer member as described in claim 1 further includes: a plurality of third bumps located on a top surface of the body. The buffer member according to claim 8, wherein when a screw is locked on the positioning post, the screw contacts the third protrusions. The buffer member according to claim 8, wherein some of the third bumps are located directly above the first bumps.

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