CN113316040A

CN113316040A - Loudspeaker module and electronic device with same

Info

Publication number: CN113316040A
Application number: CN202010121173.4A
Authority: CN
Inventors: 张恺容
Original assignee: Qisda Optronics Suzhou Co Ltd; Qisda Corp
Current assignee: Qisda Optronics Suzhou Co Ltd; Qisda Corp
Priority date: 2020-02-26
Filing date: 2020-02-26
Publication date: 2021-08-27
Anticipated expiration: 2040-02-26
Also published as: CN113316040B

Abstract

The invention discloses a loudspeaker module and electronic device with loudspeaker module, the loudspeaker module includes device outer casing and loudspeaker, the loudspeaker is set up in the device outer casing, characterized by that, the loudspeaker module also includes: an annular retaining wall disposed around a sound-emitting side of the speaker; the fixing structure comprises a first fixing piece and a second fixing piece, the first fixing piece is arranged on the device shell, the second fixing piece is fixedly connected with the loudspeaker, and the loudspeaker is fixed on the device shell through the fixing structure; and the buffer piece is arranged between the first fixing piece and the second fixing piece, and is connected between the device shell and the loudspeaker. The structure of the invention can lead the sound of the loudspeaker to be concentrated and can avoid the vibration of the loudspeaker from being transmitted to the shell of the device.

Description

Loudspeaker module and electronic device with same

Technical Field

The present disclosure relates to electronic devices, and particularly to a speaker module and an electronic device having the same.

Background

A typical electronic device can emit sound through a speaker. With the progress of science and technology, consumers nowadays increasingly attach importance to the quality and enjoyment of life, and the requirement for the sound quality of speakers is also increasingly high. However, most of the existing built-in sound boxes of consumer electronics are designed in a way of prepressing foam or silicone (rubber) between the sound box and the system housing in order to ensure sound concentration. The built-in sound box usually transmits the vibration generated along with the action of the loudspeaker to the whole system, and the vibration is transmitted to the whole system through the foam or the silica gel in a prepressing mode between the sound box and the finished product shell, so that the problem of sound concentration can be solved, and the side effect of system resonance can be generated. This can affect not only the quality of the sound, but even the operation of the remaining components.

Disclosure of Invention

Therefore, one of the objectives of the present invention is to provide a speaker module and an electronic device having the same, which can concentrate the sound emitted from the speaker and prevent the vibration of the speaker from being transmitted to the device housing.

To achieve the above object, the present invention provides a speaker module, which includes a device housing and a speaker, wherein the speaker is disposed in the device housing, and the speaker module further includes: an annular retaining wall disposed around a sound-emitting side of the speaker; the fixing structure comprises a first fixing piece and a second fixing piece, the first fixing piece is arranged on the device shell, the second fixing piece is fixedly connected with the loudspeaker, and the loudspeaker is fixed on the device shell through the fixing structure; and the buffer piece is arranged between the first fixing piece and the second fixing piece, and is connected between the device shell and the loudspeaker.

As an optional technical solution, the annular retaining wall is fixedly arranged on the device housing, and the annular retaining wall is arranged around the sound outlet side of the speaker without contact; or the annular retaining wall is fixedly arranged on the device shell, and the annular retaining wall is provided with an elastic arm end which is abutted against the sound outlet side of the loudspeaker.

As an optional technical scheme, the annular retaining wall and the device shell are of an integrally formed structure.

As an optional technical solution, the annular retaining wall is a silica gel sleeve, the silica gel sleeve is clamped between the device housing and the speaker, and a front edge of the silica gel sleeve, which is located on the sound emitting side of the speaker, protrudes out of the device housing.

As an optional technical solution, the silicone sleeve further extends from the sound emitting side of the speaker to a direction opposite to the sound emitting side to cover the speaker.

As an optional technical solution, the second fixing member and the buffer member are integrally formed, and the second fixing member is formed by extending from the silicone sleeve.

As an optional technical solution, the fixing structure further includes a third fixing member, the second fixing member is further provided with a first opening, the buffer member is further provided with a first through hole, the buffer member is disposed in the first opening, the third fixing member penetrates through the first through hole and the first fixing member to fix the speaker on the device housing, and the buffer member is not in contact with the third fixing member and the first fixing member.

As an optional technical solution, the buffer member includes a first buffer portion, a body and a second buffer portion connected in sequence, the body has an annular gap, the body is disposed in the first opening through the annular gap, and in an axial direction of the first opening, a length of the annular gap is greater than or equal to a depth of the opening.

As an optional technical scheme, the buffer is made of silica gel or foam.

The invention also provides an electronic device which is provided with the loudspeaker module.

Compared with the prior art, the invention utilizes the annular retaining wall arranged on the sound outlet side of the loudspeaker to concentrate the sound outlet, and utilizes the buffer part to absorb the vibration quantity, and the buffer part is not tightly matched with the fixed structure in all directions but leaves a gap, so that the gap can prolong the transmission path of the vibration and reduce the probability of transmitting the vibration quantity to the device shell.

The advantages and spirit of the present invention can be further understood by the following detailed description of the invention and the accompanying drawings.

Drawings

Fig. 1 is a schematic view of a first embodiment of a speaker module according to the present invention;

fig. 2 is a schematic view of another angle of the speaker module shown in fig. 1;

FIG. 3 is an enlarged schematic view of portion A of FIG. 2;

FIG. 4 is a schematic view of a speaker module according to the present invention;

FIG. 5 is an exploded view of the speaker module of FIG. 4;

fig. 6 is a schematic view of a second embodiment of a speaker module according to the present invention;

fig. 7 is a schematic view of a third embodiment of a speaker module according to the present invention;

FIG. 8 is a schematic view of another angle of the speaker module shown in FIG. 7;

fig. 9 is an enlarged schematic view of a portion B in fig. 8.

Detailed Description

The invention provides an electronic device, which is provided with a loudspeaker module as described below, and a device shell as described below is a shell of the electronic device. The electronic device can be, but not limited to, a personal computer, a notebook computer, a stereo, a projector, a display, etc. and can emit sound through the speaker module. The number of the loudspeaker modules arranged in the electronic device can be set according to actual use requirements.

Referring to fig. 1-4, fig. 1 is a schematic diagram of a speaker module according to a first embodiment of the present invention; fig. 2 is a schematic view of another angle of the speaker module shown in fig. 1; FIG. 3 is an enlarged schematic view of portion A of FIG. 2; fig. 4 is a schematic combination diagram of the speaker module according to the present invention. The invention provides a loudspeaker module, the loudspeaker module 1 includes the apparatus outer casing 2 and loudspeaker 3, the loudspeaker 3 is set up in the apparatus outer casing 2, the loudspeaker module 1 also includes the annular barricade 4, fixed structure and bolster 7. Moreover, preferably, in order to achieve the buffering effect, the buffering piece is made of silica gel or foam. As shown in fig. 5, the speaker 3 includes a speaker body 300 and a speaker fixing frame 301, and the speaker body 300 is disposed in the speaker fixing frame 301.

The annular retaining wall 4 is disposed around the sound emitting side 31 of the speaker 3, and the sound emitting side 31 of the speaker 3 can be surrounded by the annular retaining wall, so that the sound emitted from the speaker 3 is concentrated. The fixing structure comprises a first fixing piece 5 and a second fixing piece 6, the first fixing piece 5 is arranged on the device shell 2, the second fixing piece 6 is fixedly connected with the loudspeaker 3, and the loudspeaker 3 is fixed on the device shell 2 through the fixing structure. In the embodiment, the first fixing element 5 is a convex pillar structure extending from the device housing 2, but the invention is not limited thereto. Moreover, in order to ensure the stability of fixing the speaker 3, a plurality of fixing structures may be provided, and preferably, the fixing structures are symmetrically arranged on opposite sides of the speaker 3, as shown in fig. 1, in this embodiment, one fixing structure is provided on each of opposite sides of the speaker 3. The cushion member 7 is disposed between the first fixing member 5 and the second fixing member 6, and the cushion member 7 is connected between the device case 2 and the speaker 3.

Referring to fig. 1, in the present embodiment, the annular retaining wall 4 is fixedly disposed on the device housing 2, and the annular retaining wall 4 is disposed around the sound emitting side 31 of the speaker 3 without contact. The annular retaining wall 4 can be fixed on the device housing 2 by various fixing methods, but the invention is not limited thereto, for example, in the embodiment, the annular retaining wall 4 and the device housing 2 are integrally formed, that is, the annular retaining wall 4 is formed by extending from the device housing 2.

In addition, in this embodiment, the fixing structure further includes a third fixing element 8, the second fixing element 6 is further provided with a first opening 61, the buffer element 7 is further provided with a first through hole 71, the buffer element 7 is disposed in the first opening 61, the third fixing element 8 passes through the first through hole 71 to be combined with the first fixing element 5 to fix the speaker 3 on the device housing 2, and the buffer element 7, the third fixing element 8 and the first fixing element 5 are all contactless, for example, a gap 101 is formed between the buffer element 7 and the third fixing element 8, and

gaps

102 and 100 are formed between the buffer element 7 and the first fixing element 5, that is, the speaker 3 is suspended and fixed, so that the vibration can be prevented from being transmitted to the whole system of the electronic device through the buffer element, the fixing structure and the device housing.

Further, the buffer member 7 includes a first buffer portion 72, a body 73 and a second buffer portion 74 connected in sequence, the body has an annular gap 75, the body 73 is disposed in the first opening 61 through the annular gap 75, and in the axial direction of the first opening 61, the length of the annular gap 73 is greater than or equal to the depth of the first opening 61. The first buffer portion 72 and the second buffer portion 74 can be deformed to reduce the vibration amount and directly transmit the vibration amount to the device housing 2 through the speaker 3 or the first fixing member 5.

In the present embodiment, the end of the first fixing member 5 has a protrusion inserted into the first opening 61, but the present invention is not limited thereto as long as the fixing object of the present invention can be achieved.

As shown in fig. 6, fig. 6 is a schematic diagram of a second embodiment of a speaker module according to the present invention. In this embodiment, the speaker module is similar in structure to the speaker module of the first embodiment, except that the annular wall 14 is fixedly disposed on the device housing 2, and the annular wall 14 has a spring arm end 141, and the spring arm end 141 abuts against the sound emitting side 31 of the speaker 3. The annular retaining wall 14 is formed integrally with the device housing 2. In this embodiment, the annular wall may surround the sound output side 31 of the speaker 3 to concentrate the sound output of the speaker 3, and the arm 141 may absorb the vibration when the speaker vibrates, thereby avoiding the system resonance.

Referring to fig. 7-9, fig. 7 is a schematic view of a speaker module according to a third embodiment of the present invention, and fig. 8 is a schematic view of another angle of the speaker module shown in fig. 7; fig. 9 is an enlarged schematic view of a portion B in fig. 8. In this embodiment, the annular retaining wall 24 is a silicone sleeve, the silicone sleeve is sandwiched between the device housing 2 and the speaker 3, and a front edge 241 of the silicone sleeve 24 located on the sound output side 31 of the speaker 3 protrudes out of the device housing 2.

In the present embodiment, the silicone rubber cover 24 also extends from the sound output side 31 of the speaker 3 in the direction opposite to the sound output side 31 to cover the speaker 2, and can absorb vibration more effectively.

In the present embodiment, the second fixing element 16 and the buffer element 17 are integrally formed, and the second fixing element 16 is formed by extending from the silicone sleeve 24, that is, the second fixing element 16 and the buffer element 17 are formed by extending from the silicone sleeve 24. As shown in fig. 9, the second fixing member 16 and the buffering member 17 can be regarded as one element, and the dashed lines L1, L2, and L3 are not actually present, and the notation in the present invention is for convenience of description, that is, in the present embodiment, the same can be understood as: the buffer 17 includes a first buffer 172, a body 173 and a second buffer 174 connected in sequence, and the body 173 has an annular gap. The corresponding second fixing member 16 has a first opening, the body is disposed through the first opening by an annular gap, and the length of the annular gap is greater than or equal to the depth of the first opening in the axial direction of the first opening.

In the present embodiment, the gap 201 is provided between the buffer member 17 and the third fixing member 8, and the

gaps

202 and 200 are provided between the buffer member 17 and the first fixing member 5, that is, the speaker 3 is also suspended and fixed, so that the vibration can be prevented from being transmitted to the entire system of the electronic device through the buffer member, the fixing structure, and the device case.

In summary, the present invention utilizes the ring-shaped retaining wall disposed on the sound-emitting side of the speaker to concentrate the sound emitted from the speaker, and utilizes the buffer member to absorb the vibration amount, and the buffer member is not tightly fitted to the fixing structure in all directions, but has a gap, which can extend the transmission path of the vibration and reduce the probability of the vibration amount being transmitted to the device housing.

The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims. The scope of the claims to be accorded the invention is therefore to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is known in the art.

Claims

1. The utility model provides a speaker module, this speaker module includes device shell and speaker, and this speaker sets up in this device shell, its characterized in that, this speaker module still includes:

an annular retaining wall disposed around a sound-emitting side of the speaker;

the fixing structure comprises a first fixing piece and a second fixing piece, the first fixing piece is arranged on the device shell, the second fixing piece is fixedly connected with the loudspeaker, and the loudspeaker is fixed on the device shell through the fixing structure; and

and the buffer piece is arranged between the first fixing piece and the second fixing piece and connected between the device shell and the loudspeaker.

2. The speaker module as claimed in claim 1, wherein the annular wall is fixedly disposed on the device housing, and the annular wall is disposed around the sound-emitting side of the speaker without contact; or the annular retaining wall is fixedly arranged on the device shell, and the annular retaining wall is provided with an elastic arm end which is abutted against the sound outlet side of the loudspeaker.

3. The speaker module as claimed in claim 2, wherein the annular wall is integrally formed with the device housing.

4. The speaker module as claimed in claim 1, wherein the annular wall is a silicone sleeve, the silicone sleeve is sandwiched between the device housing and the speaker, and a front edge of the silicone sleeve on the sound-emitting side of the speaker protrudes from the device housing.

5. The speaker module as claimed in claim 4, wherein the silicone sleeve further extends from the sound-emitting side of the speaker to cover the speaker in a direction opposite to the sound-emitting side.

6. The speaker module as claimed in claim 5, wherein the second fixing member and the buffer member are integrally formed, and the second fixing member is formed by extending from the silicone sleeve.

7. The speaker module as claimed in claim 1, wherein the fixing structure further comprises a third fixing member, the second fixing member further has a first opening, the buffer member further has a first through hole, the buffer member is disposed in the first opening, the third fixing member passes through the first through hole and the first fixing member to fix the speaker to the device housing, and there is no contact between the buffer member and the third fixing member as well as between the buffer member and the first fixing member.

8. The speaker module as claimed in claim 7, wherein the buffer member comprises a first buffer portion, a body and a second buffer portion connected in sequence, the body has an annular gap, the body is disposed in the first opening through the annular gap, and the length of the annular gap is greater than or equal to the depth of the opening in the axial direction of the first opening.

9. The speaker module as claimed in claim 1, wherein the buffer is made of silicone or foam.

10. An electronic device, characterized in that the electronic device is provided with a loudspeaker module according to any one of claims 1-9.