TWI817834B - Memory architecture and data processing method - Google Patents
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本發明係關於一種晶片結構,尤指一種記憶體架構及其資料處理方法。 The invention relates to a chip structure, and in particular to a memory structure and a data processing method thereof.
目前透過晶圓堆疊(Wafer On Wafer,WOW)製程所形成之一晶圓堆疊結構,該晶圓堆疊結構包含一基底、一邏輯電路層以及一記憶體晶體層,該基底、該邏輯電路層以及該記憶體晶體層彼此之間具有複數個容置腔體,該等容置腔體分別與該基底、該邏輯電路層以及該記憶體晶體層對應構成複數個晶片,且透過該等容置腔體設置一金屬層,以使該基底、該邏輯電路層以及該記憶體晶體層彼此之間電性連接,透過該晶圓堆疊製程,使得同時可製造出該等晶片(Integrated Circuit,IC),接著,將該等晶片彼此之間進行分割,以形成一晶片。 A wafer stack structure is currently formed through a Wafer On Wafer (WOW) process. The wafer stack structure includes a substrate, a logic circuit layer and a memory crystal layer. The substrate, the logic circuit layer and The memory crystal layer has a plurality of accommodating cavities between each other. The accommodating cavities respectively form a plurality of chips corresponding to the substrate, the logic circuit layer and the memory crystal layer, and through the accommodating cavities A metal layer is provided on the body so that the substrate, the logic circuit layer and the memory crystal layer are electrically connected to each other, and through the wafer stacking process, the chips (Integrated Circuit, IC) can be manufactured at the same time, Then, the wafers are divided from each other to form a wafer.
為了將該等晶片精準的分割,在該邏輯電路層以及該記憶體晶體層各自設置一密封環(Sealing Ring),透過該密封環,使該等容置腔體各自獨立不連通,以沿著該密封環對該等晶片進行分割成該晶片。 In order to accurately separate the wafers, a sealing ring is provided on the logic circuit layer and the memory crystal layer. Through the sealing ring, the accommodation cavities are independent and not connected to each other, so that they can be separated along the The sealing ring separates the wafers into wafers.
然而,現有技術透過該密封環將各容置腔體進行獨立不連通,致使該晶片之間無法傳遞電訊號,導致後續對該晶片分割後,僅能使用各個晶 片所形成之該邏輯電路層以及該記憶體晶體層,無法因應用戶需求,將各晶片整合使用,使得用戶在使用上有所受限。 However, in the existing technology, each accommodation cavity is independently disconnected through the sealing ring, so that electrical signals cannot be transmitted between the chips. As a result, after the chips are subsequently divided, only each chip can be used. The logic circuit layer and the memory crystal layer formed by the chip cannot be integrated and used according to the user's needs, which limits the user's use.
因此,現有技術確實有待進一步提供更佳改良方案的必要性。 Therefore, it is necessary to further provide better improvement solutions in the existing technology.
有鑑於上述現有技術之不足,本發明主要目的在於提供一種記憶體架構及其資料處理方法,在該記憶體架構內利用分時多工(Time-Division Multiplexing,TDM)技術,以使各晶片之間可進行資料傳輸,可提升各晶片之間的使用彈性。 In view of the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a memory architecture and a data processing method thereof, using time-division multiplexing (TDM) technology in the memory architecture to enable the processing of each chip. Data can be transferred between chips, which can improve the flexibility of use between chips.
為達成上述目的本發明所採取的主要技術手段,主要係令前述記憶體架構的資料處理方法,應用於該記憶體架構具有一第一處理模組,並由該第一處理模組執行以下步驟:提供一分時多工的排程資訊;根據該分時多工的排程資訊,取得一時序資訊;根據該時序資訊,對應預設一晶片的位址;取得一定址封包資訊;以及根據該時序資訊對應預設該晶片的位址及該定址封包資訊,將一傳輸資料傳送至指定的該晶片的位址。 To achieve the above objectives, the main technical means adopted by the present invention are mainly to apply the data processing method of the aforementioned memory architecture to the memory architecture with a first processing module, and the first processing module performs the following steps : Provide a time-sharing multiplexing scheduling information; obtain a timing information based on the time-sharing multiplexing scheduling information; based on the timing information, correspondingly preset the address of a chip; obtain a certain address packet information; and based on the timing information The timing information corresponds to the preset address of the chip and the addressing packet information, and transmits a transmission data to the specified address of the chip.
透過上述方法,該第一處理模組可根據該分時多工的排程資訊以及該定址封包資訊,將分時多工的排程資訊以及該定址封包資訊,將該傳輸資料傳送至指定的該晶片的位址;藉此整合各晶片的資源,以因應不同用戶需求,達到提升各晶片之間的使用彈性之目的。 Through the above method, the first processing module can send the transmission data to the designated destination based on the time-sharing scheduling information and the addressing packet information. The address of the chip; thereby integrating the resources of each chip to respond to different user needs and achieve the purpose of improving the flexibility of use between each chip.
為達成上述目的本發明所採取的又一主要技術手段,主要係令前述記憶體架構包括: 一第一晶片;一第二晶片;以及一第一處理模組,其提供一分時多工的排程資訊,並根據該分時多工的排程資訊取得一時序資訊,且取得一定址封包資訊;其中,該第一處理模組根據該時序資訊對應預設一第一晶片的位址以及一第二晶片的位址以及該定址封包資訊,將一傳輸資料傳送至指定的該第一晶片或該第二晶片的位址。 Another main technical means adopted by the present invention to achieve the above object is to make the aforementioned memory architecture include: a first chip; a second chip; and a first processing module that provides time-sharing multiplexing scheduling information, obtains timing information based on the time-sharing multiplexing scheduling information, and obtains a certain address Packet information; wherein the first processing module correspondingly presets an address of a first chip and an address of a second chip according to the timing information and the addressing packet information, and sends a transmission data to the designated first The address of the wafer or the second wafer.
透過上述構造,該第一處理模組可根據該分時多工的排程資訊以及該定址封包資訊,可使該傳輸資料在該第一晶片或該第二晶片之間進行傳送,尤其是可由該第一晶片指定該傳輸資料係發送至該第二晶片的位址,或者由該第二晶片指定該傳輸資料係發送至該第一晶片的位址;藉此構造能夠整合各晶片的資源,以因應不同用戶需求,達到提升各晶片之間的使用彈性之目的。 Through the above structure, the first processing module can transmit the transmission data between the first chip or the second chip according to the time-sharing scheduling information and the addressing packet information, especially by The first chip specifies that the transmission data is sent to the address of the second chip, or the second chip specifies that the transmission data is sent to the address of the first chip; thereby the structure can integrate the resources of each chip, In order to respond to different user needs and achieve the purpose of improving the flexibility of use between various chips.
10:記憶體架構 10:Memory architecture
11:第一晶片 11:First chip
12:第二晶片 12:Second chip
13:第一處理模組 13:First processing module
13’:第二處理模組 13’: Second processing module
14:第一記憶體 14:First memory
140:第一叢集位址 140:First cluster address
141:第二叢集位址 141:Second cluster address
14’:第二記憶體 14’: Second memory
15:第一輸入/輸出介面位址 15:First input/output interface address
15’:第二輸入/輸出介面位址 15’: Second input/output interface address
30:發送晶片位址 30:Send chip address
31:發送叢集位址 31: Send cluster address
32:接收晶片位址 32:Receive chip address
33:接收叢集位址 33:Receive cluster address
34:有效載荷 34: Payload
圖1 係本發明一較佳實施例記憶體架構之系統方塊圖;圖2 係本發明之較佳實施例記憶體架構又一系統方塊圖;圖3 係本發明之較佳實施例再一系統方塊圖;圖4A 係本發明之較佳實施例定址封包資訊的傳輸排程示意圖;圖4B 係本發明之較佳實施例的傳輸路徑示意圖;圖5係本發明之較佳實施例定址封包資訊的定址封包傳輸格式示意圖;圖6係本發明之記憶體架構的資料處理方法流程圖;圖7係本發明之記憶體架構的又一資料處理方法流程圖;圖8係本發明之記憶體架構的再一資料處理方法流程圖; 圖9係本發明之記憶體架構的另一資料處理流程圖;以及圖10係本發明之記憶體架構的又一資料處理流程圖。 Figure 1 is a system block diagram of a memory architecture according to a preferred embodiment of the present invention; Figure 2 is a system block diagram of a memory architecture according to a preferred embodiment of the present invention; Figure 3 is a system block diagram of a memory architecture according to a preferred embodiment of the present invention; Block diagram; Figure 4A is a schematic diagram of the transmission schedule of the addressed packet information in the preferred embodiment of the present invention; Figure 4B is a schematic diagram of the transmission path in the preferred embodiment of the present invention; Figure 5 is a schematic diagram of the addressed packet information in the preferred embodiment of the present invention. A schematic diagram of the addressed packet transmission format; Figure 6 is a flow chart of the data processing method of the memory architecture of the present invention; Figure 7 is a flow chart of another data processing method of the memory architecture of the present invention; Figure 8 is the memory architecture of the present invention. Another data processing method flow chart; FIG. 9 is another data processing flow chart of the memory architecture of the present invention; and FIG. 10 is another data processing flow chart of the memory architecture of the present invention.
關於本發明的記憶體架構10之較佳實施例,主要係在該記憶體架構10內部應用分時多工(Time-Division Multiplexing,TDM)技術將一傳送資料進行排程處理,如圖1以及圖2所示,其中該記憶體架構10包括一第一晶片11以及一第二晶片12,該第一晶片11包括一第一處理模組13以及一第一記憶體14,而該第二晶片12包括一第二處理模組13’以及一第二記憶體14’。
Regarding the preferred embodiment of the
具體來說,該第一處理模組13根據一分時多工的排程資訊(Time Division Multiplexing,TDM)以及一定址封包資訊,將該傳輸資料傳送至指定的一第一晶片或該第二晶片的位址,以使該第一晶片11以及該第二晶片12之間可互相傳輸資料,使得該第一晶片11以及該第二晶片12可被同時使用,達到整合該第一晶片11以及該第二晶片12之目的。在本實施例中,該第二處理模組13’所執行的資料處理方法與該第一處理模組13大致相同,於此不再贅述。
Specifically, the
在本實施例中,該分時多工的排程資訊包括一時序資訊,且該時序資訊對應預設該第一晶片以及該第二晶片的位址。 In this embodiment, the time-sharing multiplexing scheduling information includes timing information, and the timing information corresponds to preset addresses of the first chip and the second chip.
在本實施例中,如圖3所示,該第一記憶體14具有一第一叢集位址140以及一第一輸入/輸出介面位址15,該第一處理模組13根據該時序資訊中的一第一時序以及一第二時序對應預設該第一叢集位址140以及該第一輸入/輸出介面位址15,該第二記憶體14’具有一第二叢集位址141以及一第二輸入/輸出介面位址15’,該第一處理模組13根據該時序資訊中的一第三時序以及一第四時序對應預設該第二叢集位址141以及該第二輸入/輸出介面位址15’。
In this embodiment, as shown in FIG. 3 , the
在本實施例中,如圖4A以及圖4B所示,該分時多工的排程資訊包括一第一列是記載該時序資訊,該時序資訊具有該第一時序、該第二時序、
一第三時序以及一第四時序,而該分時多工的排程資訊包括一第二列至第五列是記載該晶片的位址,以第二列為例,該第一處理模組13根據該分時多工的排程資訊以及該定址封包傳輸格式,為方便說明,請參圖4A中的箭號方向,該箭號方向表示該傳輸資料的傳送方向,依序將該第一叢集位址140內的該傳輸資料傳送到該第一輸入/輸出介面位址15,該第一輸入/輸出介面位址15內的該傳輸資料傳送到該第二輸入/輸出介面位址15’,該第二輸入/輸出介面位址15’內的該傳輸資料傳送到該第二叢集位址141,而該第一叢集位址140內的該傳輸資料是接收該第二叢位址141內的該傳輸資料。
In this embodiment, as shown in FIG. 4A and FIG. 4B , the time-sharing multiplexing scheduling information includes a first column recording the timing information, and the timing information has the first timing, the second timing,
A third timing sequence and a fourth timing sequence, and the time-sharing multiplexing schedule information includes a second to fifth column that record the address of the chip. Taking the second column as an example, the
進一步,以第三例為例,該第一處理模組13根據該分時多工的排程資訊以及該定址封包傳輸格式,依序將該第一輸入/輸出介面位址15內的該傳輸資料傳送到該第二輸入/輸出介面位址15’,該第二輸入/輸出介面位址15’內的該傳輸資料傳送到該第二叢集位址141,該第二叢集位址141內的該傳輸資料傳輸到該第一叢集位址140,該第一輸入/輸出介面位址15內的該傳輸資料是接收該第一叢集位址140內的該傳輸資料。如此一來,使得該第一叢集位址140、該第二叢集位址141、該第一輸入/輸出介面位址15以及該第二輸入/輸出介面位址15’之間形成循環傳輸。
Further, taking the third example as an example, the
在本實施例中,如圖5所示,根據該定址封包資訊以及該傳輸資料產生一定址封包傳輸格式,該定址封包傳輸格式具有一發送晶片位址30、一發送叢集位址31、一接收晶片位址32、一接收叢集位址33以及一有效載荷(Payload)34,該有效載荷用以承載該傳輸資料。
In this embodiment, as shown in Figure 5, an addressed packet transmission format is generated based on the addressed packet information and the transmission data. The addressed packet transmission format has a
在本實施例中,該第一處理模組13根據該第一時序對應預設的該第一叢集位址140,設定該發送晶片位址及該發送叢集位址,並根據該第二時序對應預設的該第一輸入/輸出介面位址15,設定該接收晶片位址以及該接收
叢集位址,且根據該發送晶片位址、該發送叢集位址、該接收晶片位址以及該接收叢集位址,將該傳輸資料傳送至該接收晶片位址以及該接收叢集位址。
In this embodiment, the
在本實施例中,該第一處理模組13根據該第二時序對應預設的該第一輸入/輸出介面位址15,設定該發送晶片位址及該發送叢集位址,並根據該第三時序對應預設的該第二輸入/輸出介面位址15’,設定該接收晶片位址以及該接收叢集位址,且根據該發送晶片位址、該發送叢集位址、該接收晶片位址以及該接收叢集位址,將該傳輸資料傳送至該接收晶片位址以及該接收叢集位址。
In this embodiment, the
在本實施例中,該第一處理模組13根據該第三時序對應預設的該第二輸入/輸出介面位址15’,設定該發送晶片位址及該發送叢集位址,並根據該第四時序對應預設的該第二叢集位址141,設定該接收晶片位址以及該接收叢集位址,且根據該發送晶片位址、該發送叢集位址、該接收晶片位址以及該接收叢集位址,將該傳輸資料傳送至該接收晶片位址以及該接收叢集位址。
In this embodiment, the
上述實施例中,該第一記憶體14更進一步包括一第三叢集位址(圖未繪示),而該第二記憶體14’也可進一步包括一第四叢集位址(圖未繪示),而該時序資訊亦將有所增加,以調整該分時多工的排程資訊,可使該第一處理模組13根據調整後的該分時多工的排程資訊,將該第一叢集位址140內的該傳輸資料傳送到該第三叢集位址,接著,再由該第三叢集位址內的該傳輸資料傳輸到該第一輸入/輸出介面位址15,並進一步,將該第一輸入/輸出介面位址15內的該傳輸資料傳送至該第二輸入/輸出介面位址15’,接著,該第二輸入/輸出介面位址15’內的該傳輸資料傳送至該第二叢集位址141,最後,該第二叢集位址141內的該傳輸資料傳送到該第四叢集位址。
In the above embodiment, the
關於本發明又一記憶體架構的資料處理方法,如圖6所示,應用於該記憶體架構具有一第一處理模組,並由該第一處理模組執行以下步驟: 提供一分時多工的排程資訊(S10);取得一定址封包資訊(S20);以及根據該分時多工的排程資訊及該定址封包資訊,將一傳輸資料傳送至指定的一晶片的位址(S30)。 As for the data processing method of another memory architecture of the present invention, as shown in Figure 6, the memory architecture has a first processing module, and the first processing module performs the following steps: Provide a time-sharing multiplexing schedule information (S10); obtain a certain address packet information (S20); and transmit a transmission data to a designated chip based on the time-sharing multiplexing schedule information and the address packet information address (S30).
在本實施例中,如圖7所示,當前述方法執行到「提供一分時多工的排程資訊(S10)」的步驟,進一步執行以下子步驟:根據該分時多工的排程資訊,取得一時序資訊(S11);以及根據該時序資訊,對應預設該晶片的位址(S12)。 In this embodiment, as shown in Figure 7, when the above method is executed to the step of "providing a time-sharing multiplexing schedule information (S10)", the following sub-steps are further performed: according to the time-sharing multiplexing schedule information, obtain timing information (S11); and correspondingly preset the address of the chip based on the timing information (S12).
在本實施例中,如圖8所示,當前述方法執行到「根據該時序資訊,對應預設該晶片的位址(S12)」的步驟,更包括以下子步驟:取得該晶片的一第一叢集位址以及一第一輸入/輸出介面位址(S120);以及根據該時序資訊中的一第一時序以及一第二時序,對應預設該第一叢集位址以及該第一輸入/輸出介面位址(S121)。 In this embodiment, as shown in Figure 8, when the above method is executed to the step of "according to the timing information, correspondingly preset the address of the chip (S12)", it further includes the following sub-steps: Obtaining a first address of the chip A cluster address and a first input/output interface address (S120); and correspondingly presetting the first cluster address and the first input according to a first timing and a second timing in the timing information /Output interface address (S121).
在本實施例中,如圖9所示,當前述方法執行到「取得一定址封包資訊(S20)」的步驟,包括以下子步驟:根據該定址封包資訊以及該傳輸資料,產生一定址封包傳輸格式(S21);以及其中,該定址封包傳輸格式具有一發送晶片位址、一發送叢集位址、一接收晶片位址、一接收叢集位址以及該傳輸資料。 In this embodiment, as shown in Figure 9, when the above method is executed to the step of "obtaining certain-addressed packet information (S20)", it includes the following sub-steps: generating certain-addressed packet transmission according to the certain-addressed packet information and the transmission data. Format (S21); and wherein, the addressed packet transmission format has a transmitting chip address, a transmitting cluster address, a receiving chip address, a receiving cluster address and the transmission data.
在本實施例中,如圖10所示,當前述方法執行到「根據該分時多工的排程資訊及該定址封包資訊,將一傳輸資料傳送至指定的一晶片的位址(S30)」的步驟,包括以下子步驟: 取得該第一時序以及該第二時序,對應預設該第一叢集位址以及該第一輸入/輸出介面位址(S31);根據該第一時序對應預設的該第一叢集位址,設定該發送晶片位址及該發送叢集位址(S32);根據該第二時序對應預設的該第一輸入/輸出介面位址,設定該接收晶片位址以及該接收叢集位址(S33);以及根據該發送晶片位址、該發送叢集位址、該接收晶片位址以及該接收叢集位址,將該傳輸資料傳送至該接收晶片位址以及該接收叢集位址(S34)。 In this embodiment, as shown in Figure 10, when the above method is executed to "according to the time-division multiplexing scheduling information and the addressing packet information, a transmission data is sent to the address of a designated chip (S30) ” steps, including the following sub-steps: Obtain the first timing and the second timing, corresponding to the preset first cluster address and the first input/output interface address (S31); correspond to the preset first cluster bit according to the first timing address, set the sending chip address and the sending cluster address (S32); set the receiving chip address and the receiving cluster address corresponding to the preset first input/output interface address according to the second timing (S32) S33); and transmit the transmission data to the receiving chip address and the receiving cluster address according to the sending chip address, the sending cluster address, the receiving chip address and the receiving cluster address (S34).
綜上所述,該第一處理模組可根據該分時多工的排程資訊以及該定址封包資訊,將該傳輸資料傳送至指定的該晶片的位址,如此一來,可整合各晶片的資源,以因應不同用戶需求,達到提升各晶片之間的使用彈性。 To sum up, the first processing module can transmit the transmission data to the designated address of the chip based on the time-sharing scheduling information and the addressing packet information. In this way, each chip can be integrated resources to respond to different user needs and improve the flexibility of use between chips.
10:記憶體架構 10:Memory architecture
11:第一晶片 11:First chip
12:第二晶片 12:Second chip
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