TWI816980B - Drying room for gas replacement - Google Patents
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- TWI816980B TWI816980B TW109105125A TW109105125A TWI816980B TW I816980 B TWI816980 B TW I816980B TW 109105125 A TW109105125 A TW 109105125A TW 109105125 A TW109105125 A TW 109105125A TW I816980 B TWI816980 B TW I816980B
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- 238000001035 drying Methods 0.000 title claims abstract description 26
- 239000007789 gas Substances 0.000 claims abstract description 113
- 239000011261 inert gas Substances 0.000 claims abstract description 61
- 238000000746 purification Methods 0.000 claims abstract description 37
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 149
- 229910052757 nitrogen Inorganic materials 0.000 claims description 68
- 239000003054 catalyst Substances 0.000 claims description 46
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 39
- 239000001301 oxygen Substances 0.000 claims description 39
- 229910052760 oxygen Inorganic materials 0.000 claims description 39
- 239000002274 desiccant Substances 0.000 claims description 30
- 230000008929 regeneration Effects 0.000 claims description 29
- 238000011069 regeneration method Methods 0.000 claims description 29
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 21
- 238000012545 processing Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 230000035515 penetration Effects 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 230000003134 recirculating effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 27
- 238000012423 maintenance Methods 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 8
- 238000011403 purification operation Methods 0.000 description 7
- 238000011084 recovery Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000004887 air purification Methods 0.000 description 5
- 238000007791 dehumidification Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 230000018109 developmental process Effects 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012827 research and development Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000002808 molecular sieve Substances 0.000 description 3
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 239000003657 drainage water Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000001172 regenerating effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/261—Drying gases or vapours by adsorption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/28—Selection of materials for use as drying agents
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/10—Single element gases other than halogens
- B01D2257/104—Oxygen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/80—Water
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2259/00—Type of treatment
- B01D2259/45—Gas separation or purification devices adapted for specific applications
- B01D2259/4525—Gas separation or purification devices adapted for specific applications for storage and dispensing systems
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Drying Of Gases (AREA)
- Drying Of Solid Materials (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
[課題] 本發明提供一種氣體置換系統,其在儲存製造裝置之為惰性氣體濃度的乾燥室中,能夠在較短時間內進行大氣環境或者低露點、惰性氣體環境的切換。 [解決手段] 一種需要以低露點、惰性氣體濃度保持室的內部清潔之氣體置換用系統,在該氣體置換用系統中,藉由在進行維修或保養等期間,設成以單向的方式向室內引入乾燥空氣而將濕氣向裝置外排出,並且惰性氣體循環管線均被閥等封閉而獨立地進行循環運轉,即使在具有複數個室之情況下亦能夠大幅縮短基於大氣置換之停止時間。藉由連接低露點氣體供給裝置與惰性氣體純化裝置而形成一體之型式,變得省空間並且低成本。[Problem] The present invention provides a gas replacement system that can switch between an atmospheric environment or a low dew point and inert gas environment in a relatively short period of time in a drying chamber that stores an inert gas concentration in a manufacturing device. [Solution] A gas replacement system that requires a low dew point and an inert gas concentration to keep the interior of the chamber clean. In this gas replacement system, the gas replacement system is configured to provide a one-way flow of gas during maintenance or maintenance. Dry air is introduced into the room and moisture is discharged to the outside of the device. In addition, the inert gas circulation lines are closed by valves, etc. and circulate independently. Even when there are multiple chambers, the downtime due to atmospheric replacement can be greatly shortened. By connecting the low dew point gas supply device and the inert gas purification device to form an integrated model, it becomes space-saving and low-cost.
Description
本發明有關一種氣體置換系統,其包括在設置有有機EL顯示器製造裝置之室等惰性氣體(以下,將使活性氣體濃度盡可能接近0ppm之氣體的情況稱為“惰性氣體”)濃度的乾燥室、腔室、室中,為了進行製造裝置的維修或調整等而能夠在較短時間內切換成低露點(以下,將露點溫度為0度以下的情況稱為“低露點”)的環境之除濕裝置及氣體純化機。The present invention relates to a gas replacement system including a drying chamber with an inert gas concentration (hereinafter, a gas having an active gas concentration as close as possible to 0 ppm will be referred to as "inert gas") in a room in which an organic EL display manufacturing device is installed. Dehumidification in chambers and chambers that can be switched to a low dew point (hereinafter, a dew point temperature below 0 degrees is referred to as "low dew point") environment in a short period of time for maintenance or adjustment of manufacturing equipment, etc. Devices and gas purifiers.
以往,用於作為代替液晶顯示裝置之新一代平板顯示器而被期待之有機EL顯示裝置等中之有機EL元件作為固體發光型的廉價的大面積全彩顯示元件或寫入光源陣列的用途係富有前景,從而進行積極的研發。但是,用於有機EL元件之有機發光材料等的有機物質或電極等對水分的抵抗力較弱,因空氣中的水分而性能或特性急劇劣化。因此,在進行伴隨該種開發之實驗時,亦需要在利用露點極低之空氣或使液態氮氣化而成之氮氣等惰性氣體來淨化空氣的室中進行製造或實驗。Conventionally, organic EL elements used in organic EL display devices, etc., which are expected to be next-generation flat panel displays to replace liquid crystal display devices, have been widely used as solid-state light-emitting type inexpensive large-area full-color display elements or writing light source arrays. prospects, thereby conducting active research and development. However, organic substances and electrodes such as organic light-emitting materials used in organic EL elements have weak resistance to moisture, and their performance or characteristics are rapidly deteriorated by moisture in the air. Therefore, when conducting experiments related to such development, it is also necessary to perform manufacturing or experiments in a chamber that purifies the air using air with an extremely low dew point or an inert gas such as nitrogen obtained by vaporizing liquid nitrogen.
並且,目前在有機EL顯示器(OLED)的製造中,正在進行利用噴墨技術等的印刷技術,將液狀的有機EL用材料在基板上製成均勻的薄膜來製作提高生產效率或性能之元件之技術開發。為了該種製造技術的開發而以氮氣等惰性氣體填滿室內,以便將製造裝置的周圍環境設成水分1ppm以下、氧氣1ppm以下等低露點且為惰性氣體濃度。但是,在室內進行製造裝置的維修或調整等之情況下,需要使低露點的惰性氣體環境返回到大氣環境(以下,稱為“大氣置換”)。In addition, in the current manufacturing of organic EL displays (OLEDs), printing technologies such as inkjet technology are used to form a uniform thin film of liquid organic EL materials on a substrate to produce elements that improve production efficiency or performance. technology development. For the development of this manufacturing technology, the room is filled with inert gases such as nitrogen so that the surrounding environment of the manufacturing equipment has a low dew point such as 1 ppm or less of moisture and 1 ppm or less of oxygen and an inert gas concentration. However, when maintenance or adjustment of manufacturing equipment is performed indoors, it is necessary to return the low dew point inert gas environment to the atmospheric environment (hereinafter referred to as "atmosphere replacement").
此時,若以通常的大氣置換惰性氣體環境,則位於內部之裝置的各種構件吸附水分而當再次返回到惰性氣體環境時,脫附構件所吸附之水分會非常耗費時間。At this time, if the inert gas environment is replaced with normal atmosphere, various components of the device located inside will absorb moisture. When returning to the inert gas environment again, the moisture adsorbed by the desorption components will be very time-consuming.
存在作為如下技術而記載於專利文獻1中者,亦即,為了使用於從進行大氣置換之大氣環境再次返回到惰性氣體環境的惰性氣體量最小化且使裝置的停止時間最小限化,使氣體圍體構件的內部容積最小限化。There is a technique described in Patent Document 1 as a technique for minimizing the amount of inert gas required to return to the inert gas environment from the atmospheric environment where the atmosphere is replaced and minimizing the downtime of the device. The internal volume of the enclosure members is minimized.
在專利文獻2中,揭示有帶惰性氣體循環純化裝置手套箱。據此,為了將手套箱內的惰性氣體的氣氛保持為恆定且有效去除氧氣和水分,構成為藉由由填充去除氣體中的氧氣之金屬觸媒之金屬觸媒填充部及填充吸附去除氣體中的水分之分子篩(molecular sieve)的乾燥劑之乾燥劑填充部構成之吸附塔,供給去除氧氣和水分之循環氣體,且將手套箱內的氣體利用循環泵吸出並在通過吸附塔內時去除氧氣和水分之後再次返回到手套箱,從而進行氣體循環。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本專利第6153539號 [專利文獻2]日本專利第5676521號 [專利文獻3]日本專利公開第2019-52835號[Patent Document 1] Japanese Patent No. 6153539 [Patent Document 2] Japanese Patent No. 5676521 [Patent Document 3] Japanese Patent Publication No. 2019-52835
在專利文獻1中所揭示者為如下者,藉由使氣體圍體框架化且使內部容積最小化,以最小的氣體圍體內的惰性氣體量使基於保養等之停止時間最小限化,並且能夠使工作空間最佳化以便適用於各種OLED製造裝置的設置面積中。但是,伴隨裝置的停止,亦停止同時進行惰性氣體純化和水分去除之氣體純化系統,因此存在過多耗費用於使室內再次返回到低濕度且惰性氣體環境的時間等問題。並且,還存在如下課題:氣體純化裝置及除濕裝置位於同一機構內,氧氣和水分之純化速度不同,與去除氧氣相比去除水分會非常耗費時間,因此難以進行同時去除。What is disclosed in Patent Document 1 is that by framing the gas enclosure and minimizing the internal volume, the downtime for maintenance and the like can be minimized with the smallest amount of inert gas in the gas enclosure, and can The work space is optimized to fit within the installation area of various OLED manufacturing equipment. However, as the device is stopped, the gas purification system that simultaneously performs inert gas purification and moisture removal is also stopped. Therefore, there is a problem that excessive time is spent to return the room to a low humidity and inert gas environment again. In addition, there is the following problem: the gas purification device and the dehumidification device are located in the same mechanism, and the purification speeds of oxygen and moisture are different. Removing moisture is very time-consuming compared with removing oxygen, so it is difficult to remove them at the same time.
在如專利文獻2那樣之以往系統中,亦以串列管柱進行氧氣去除和水分去除,因此進行水分去除能力定速下之機器選擇。如此,以往技術中大氣置換後返回到惰性氣體環境為止的恢復時間變長,與此同時,啟動製造裝置的管線亦會耗費時間。In a conventional system such as
因此,如專利文獻3,開發如下之氣體置換用乾燥室,亦即,藉由使用乾燥劑轉子去除水分而供給低露點氣體,大幅縮短達到預定的水分濃度的時間。與專利文獻2中用於去除水分之顆粒狀分子篩相比,使用乾燥劑轉子來去除水分之優點為如下,亦即,因為係蜂窩狀而表面積大且壓力損失低,並且蜂窩的壁非常薄而吸附水分的擴散速度快,因此在蜂窩元件整體中瞬間進行吸附和脫附。Therefore, as in Patent Document 3, a drying chamber for gas replacement is developed that uses a desiccant rotor to remove moisture and supply low dew point gas, thereby significantly shortening the time to reach a predetermined moisture concentration. Compared with the granular molecular sieve used for removing moisture in
在專利文獻3的氣體置換用乾燥室,設成在使來自乾燥空氣供給裝置之乾燥空氣循環之乾燥室的內部設置氣密容器,並向該氣密容器內供給惰性氣體及低露點氣體,該氣密容器儲存用於OLED的製造或研發之製造裝置。並且,設成在氣密容器的循環路徑上串列配置惰性氣體純化裝置和低露點氣體供給裝置,與該循環路徑分開而另外設置循環路徑,並相互獨立地進行控制,因此能夠單獨調整水分去除性能和氧氣去除性能。進而,藉由使大氣置換中另外設置之循環路徑循環,能夠大幅縮短氣密容器在大氣置換後從大氣環境返回到惰性氣體環境之恢復時間。能夠在停止惰性氣體的供給之狀態下維持低露點氣體的供給,因此即使在大氣置換之後氣密室內的露點亦迅速達到較低之狀態。In the gas replacement drying chamber of Patent Document 3, an airtight container is provided inside the drying chamber that circulates dry air from a dry air supply device, and an inert gas and a low dew point gas are supplied into the airtight container. Airtight containers store manufacturing equipment used for OLED manufacturing or research and development. In addition, the inert gas purification device and the low dew point gas supply device are arranged in series on the circulation path of the airtight container, and a circulation path is provided separately from the circulation path and controlled independently of each other. Therefore, the moisture removal can be adjusted independently. performance and oxygen removal performance. Furthermore, by circulating the circulation path provided separately in the atmosphere replacement, the recovery time of the airtight container from the atmospheric environment to the inert gas environment after the atmosphere replacement can be greatly shortened. Since the supply of low dew point gas can be maintained even when the supply of inert gas is stopped, the dew point in the airtight chamber quickly reaches a low state even after the atmosphere is replaced.
本發明為省略專利文獻3中記載之包覆氣密容器之乾燥室及用於使乾燥空氣在乾燥室內部進行供給循環的乾燥空氣供給裝置、並連接低露點氣體純化裝置及惰性氣體純化裝置而構成為一體之型式者,與專利文獻3的氣體置換用乾燥室相比,其目的在於,裝置的簡便化、省空間化及運轉方法的簡化。The present invention omits the drying chamber covering the airtight container described in Patent Document 3 and the dry air supply device for supplying and circulating dry air inside the drying chamber, and connects a low dew point gas purification device and an inert gas purification device. Compared with the gas replacement drying chamber of Patent Document 3, the integrated type is intended to simplify the device, save space, and simplify the operation method.
為了解決如以上那樣之課題,本發明設置儲存在OLED的製造或研發中所使用之製造裝置之氣密室,設成向前述氣密室供給低露點氣體及惰性氣體,連接惰性氣體純化裝置與低露點氣體供給裝置而使其一體化,依據需要設置切換機構使通過低露點氣體供給裝置之氣體通過旁通路徑而不通過惰性氣體純化裝置,因此在由於大氣置換中進行調整等而人進入到氣密室內部之情況下,能夠一邊向氣密室供給乾燥空氣,一邊分開惰性氣體向氣密室的供給而維持閉環循環,從而能夠大幅縮短基於大氣置換之停止時間。或者,不進行閉環循環而在大氣置換中運轉低露點氣體供給裝置,藉此能夠減小乾燥空氣的供給量。水的分子為極性物質,若將大氣直接導入到需要維持在低露點之氣密室內,則水分子附著於氣密室的壁面或過濾器內部。為了排出如此附著之水分子,需要長時間供給低露點空氣,但是在本發明之情況下,在停止惰性氣體的供給之狀態下供給乾燥空氣,因此即使在大氣置換之後亦能夠使氣密室內的露點迅速達到較低之狀態。In order to solve the above problems, the present invention provides an airtight chamber that stores a manufacturing device used in the production or development of OLED, supplies a low dew point gas and an inert gas to the airtight chamber, and connects the inert gas purification device and the low dew point gas. The gas supply device is integrated, and a switching mechanism is provided as necessary so that the gas passing through the low dew point gas supply device passes through the bypass path and does not pass through the inert gas purification device. Therefore, people enter the airtight chamber during adjustments due to atmospheric replacement, etc. In the internal case, dry air can be supplied to the airtight chamber while the supply of inert gas to the airtight chamber can be divided to maintain a closed loop, thereby significantly shortening the downtime due to atmospheric replacement. Alternatively, the supply amount of dry air can be reduced by operating the low dew point gas supply device during atmospheric replacement without performing a closed loop cycle. Water molecules are polar substances. If the atmosphere is directly introduced into an airtight room that needs to be maintained at a low dew point, water molecules will adhere to the walls of the airtight room or inside the filter. In order to discharge the water molecules adhered in this way, it is necessary to supply low dew point air for a long time. However, in the case of the present invention, dry air is supplied in a state where the supply of inert gas is stopped. Therefore, even after the atmosphere is replaced, the air in the airtight chamber can be maintained. The dew point quickly reaches a lower state.
並且,不管是作為惰性氣體進入瓶之氮氣,還是使液化氮氣氣化而成之氮氣,或者是藉由低溫分離或變壓吸附(PSA:pressure swing adsorption)、膜分開方式等而從空氣去除氧氣之氮氣,其氣體的價格高,若不縮短大氣置換的時間或大氣置換後返回到惰性氣體環境之恢復時間,則成本會增加。另一方面,利用乾燥劑轉子製作低露點氣體,藉由一邊維持低露點氣體的供給一邊停止惰性氣體的供給而進行維修等,能夠減少費用。Furthermore, whether it is nitrogen entering the bottle as an inert gas, nitrogen gas produced by vaporizing liquefied nitrogen, or removing oxygen from the air through low-temperature separation, pressure swing adsorption (PSA: pressure swing adsorption), membrane separation, etc. Nitrogen is expensive. If the time for atmospheric replacement or the recovery time for returning to an inert gas environment after atmospheric replacement is not shortened, the cost will increase. On the other hand, the desiccant rotor is used to produce low dew point gas, and by maintaining the supply of low dew point gas while stopping the supply of inert gas for maintenance, etc., costs can be reduced.
利用乾燥劑除濕機進行水分去除來大幅縮短水分去除時間,同時將低露點氣體的一部分導入到惰性氣體純化裝置中來進行氧氣去除,因此藉由調整利用乾燥劑除濕機進行處理之氣體量及導入到惰性氣體純化裝置中之氣體量,能夠在最佳的運轉條件下製作為惰性氣體濃度的乾燥室。 [發明效果]The desiccant dehumidifier is used to remove moisture to greatly shorten the moisture removal time. At the same time, a part of the low dew point gas is introduced into the inert gas purification device to remove oxygen. Therefore, by adjusting the amount and introduction of the gas processed by the desiccant dehumidifier The amount of gas sent to the inert gas purification device can be used to create a drying chamber with an inert gas concentration under optimal operating conditions. [Effects of the invention]
本發明的氣體置換用乾燥室如前述構成,因此即使在大氣置換中亦從設置於容器內的上部之高效微粒子空氣(HEPA,High-Efficiency Particulate Air)過濾器或超低穿透空氣(ULPA,Ultra Low Penetration Air)過濾器等空氣淨化過濾器在一方向(以下,稱為“單向”)上供給乾燥空氣而不使其循環,藉此設成最容易保持水分之過濾器不保持水分,從而實施維修或保養、設置變更等。並且,在乾燥劑除濕機之後連接惰性氣體純化裝置而使其一體化,在大氣置換中使另外設置之循環路徑循環,藉此設成循環空氣不會靠近大氣環境。藉由如此進行,能夠大幅縮短從氣密室的大氣置換後的大氣環境返回到低露點、且為惰性氣體環境之恢復時間。進而,藉由調整從該除濕裝置流向惰性氣體純化裝置之氣體的流量,能夠設為如下乾燥室,亦即,能夠容易地在短時間內最佳化成低露點、且為惰性氣體環境。The drying chamber for gas replacement of the present invention is configured as described above. Therefore, even during air replacement, the air is replaced by a high-efficiency particulate air (HEPA) filter or an ultra-low penetration air (ULPA) installed in the upper part of the container. Air purification filters such as Ultra Low Penetration Air filters supply dry air in one direction (hereinafter referred to as "one-way") without circulating it, thereby making it easier for the filter to retain moisture. This enables repairs or maintenance, configuration changes, etc. to be carried out. Furthermore, an inert gas purification device is connected and integrated after the desiccant dehumidifier, and a separately provided circulation path is circulated during atmospheric replacement, so that the circulating air does not come close to the atmospheric environment. By doing this, the recovery time from the atmospheric environment of the airtight chamber to a low dew point and inert gas environment can be significantly shortened. Furthermore, by adjusting the flow rate of the gas flowing from the dehumidification device to the inert gas purification device, it is possible to provide a drying chamber that can be easily optimized to a low dew point and inert gas environment in a short time.
以下利用圖式對用於實施本發明的形態進行說明。另外,本發明並不限定於以下實施例。Modes for implementing the present invention will be described below using the drawings. In addition, the present invention is not limited to the following examples.
本實施形態中,作為需要以低露點、惰性氣體保持內部清潔之容器的氣體置換除濕裝置及氣體置換方法,以利用噴墨技術等印刷技術之有機EL顯示器(OLED)的製造或研發裝置的室為例進行說明。另外,本發明並不限於OLED的製造或者研發裝置,亦能夠對需要以低露點、惰性氣體環境保持保管空間內清潔之用於鋰離子電池材料或半導體領域的開發之手套箱等收納容器或者封閉空間進行使用。 [實施例1]In this embodiment, as a gas replacement dehumidification device and a gas replacement method of a container that requires low dew point and inert gas to keep the interior clean, it is used as a room for manufacturing or developing equipment for organic EL displays (OLED) using printing technology such as inkjet technology. Take an example to illustrate. In addition, the present invention is not limited to OLED manufacturing or R&D equipment. It can also be used for storage containers or closures such as glove boxes used in the development of lithium-ion battery materials or semiconductor fields that require a low dew point and inert gas environment to keep the storage space clean. space for use. [Example 1]
以下,依據圖1對本發明的氣體置換用乾燥室的實施例1進行詳細說明。氣密室1以低露點、惰性氣體保持內部清潔。氣密室1可以為手套箱或乾燥室等。在氣密室1內儲存有用於OLED的製造或研發之製造裝置2,在要求清潔度之情況下,設為在氣密室1內之上部的供氣部分具有高效微粒子空氣過濾器或超低穿透空氣過濾器等空氣淨化過濾器3之構成。另外,關於空氣淨化過濾器3,亦可以設為複數個風扇過濾器單元。在氣密室1中通過配管a供給有作為公用設施(utility)的氮氣或乾燥空氣。Hereinafter, Example 1 of the gas replacement drying chamber of the present invention will be described in detail based on FIG. 1 . Airtight chamber 1 uses low dew point and inert gas to keep the interior clean. The airtight room 1 can be a glove box or a drying room. The airtight chamber 1
在乾燥劑除濕機16中,蜂窩轉子5被分割為處理區域6、淨化區域7及再生區域8。關於蜂窩轉子5,能夠一邊藉由馬達減速機(Geared motor)等轉子驅動馬達9進行旋轉一邊連續地吸附和脫附水分。被處理氣體通過送風機10並藉由預冷器11冷却供給到蜂窩轉子5的處理區域6中。被處理氣體的一部分在處理區域6之前被分歧而通過淨化區域7之後,利用再生加熱器14進行加熱並被送到再生區域8中。通過再生區域8之氣體利用冷却器15進行冷却,且從蜂窩脫附之再生氣體中的濕氣凝縮而成之水作為排水而被去除,並返回到送風機10之前。在處理區域6中通過蜂窩之被處理氣體依據需要利用後加熱器12進行加熱,並作為供氣SA供給到氣密室1中。本實施例中,使用具有淨化區域7之蜂窩轉子5,但是並不限定於此,亦可以設為使用分割為處理區域及再生區域這兩個區域之蜂窩轉子之結構。In the
在氮氣純化機23中,氮氣純化用的觸媒容器18、19收納有銅觸媒或白金觸媒等金屬觸媒,且構成為雙塔。若觸媒失效,則一邊使氮氣和氫氣流動一邊利用加熱器20、21提高溫度來再生觸媒。另外,本實施例中,並不限定於銅觸媒或白金觸媒等,可以設為使用以銅和/或白金為主成分之觸媒或用於去除氧氣之用途中之其他金屬觸媒之結構。金屬觸媒除了顆粒狀以外亦可以使用粒狀、粉狀者及負載於載體上者等。本實施例中,將觸媒容器設為雙塔式,但是並不限定於此,可以為單塔式或者設置複數個塔。In the
亦可以構成為,當氮氣供給設備中還有餘力時,將乾燥劑除濕機及氮氣純化機設置於具有氣密性之屋子內,並設成向該屋子供給氮氣,從而抑制來自乾燥劑除濕機16的活性氣體侵入。It can also be configured so that when there is still enough capacity in the nitrogen supply equipment, the desiccant dehumidifier and the nitrogen purifier are installed in an airtight room and nitrogen is supplied to the room, thereby suppressing the flow of nitrogen from the desiccant dehumidifier. 16 reactive gas intrusion.
參照以上結構的本發明的氣體置換用乾燥室的動作,對用於進行氣密室1的維修、設置變更及調整等的大氣置換進行說明。With reference to the operation of the gas replacement drying chamber of the present invention configured as above, the atmosphere replacement for performing maintenance, installation change, adjustment, etc. of the airtight chamber 1 will be described.
(大氣置換)
藉由關閉閥26、29、30並打開閥27、28將來自乾燥空氣供給裝置(未圖示)等之乾燥空氣經配管a從氣密室1的上部導入,從而將氮氣置換成乾燥空氣。藉由設成低露點的乾燥空氣從氣密室1的上部以單向的方式被供給,能夠安全地一次性供給大量的空氣,因此能夠大幅縮短氮氣與空氣的置換速度。藉由從氣密室1中最容易保持濕氣之空氣淨化過濾器3的上部以單向的方式供給乾燥空氣而不使其在氣密室1內部循環,即使人在內部進行工作,濕氣亦不會殘留於氣密室1內而向外排出。(atmospheric replacement)
By closing the
大氣置換中存在以下(1)、(2)的情況。The following situations (1) and (2) exist in atmospheric replacement.
(1)另一方面,惰性氣體循環管線中,在大氣置換期間閥29、30為關閉狀態,因此惰性氣體循環於乾燥劑除濕機16及氮氣純化機23中。此時,藉由操作閥來改變在各個裝置中流動之氣體的流量或循環次數,從而能夠調整最佳的運轉環境。另外,關於閥,並不限定於此,可以使用節風門或VAV(Variable Air Volume:可變風量)等風量調整裝置。
(1) On the other hand, in the inert gas circulation line, since the
(2)並且,如圖1,在具有一個氣密室之情況下,亦能夠在大氣置換中藉由乾燥劑除濕機16對氣密室1內進行除濕。在此情況下,打開閥29、30、31並關閉閥33、34。來自氣密室1之還氣RA通過配管b與來自乾燥劑除濕機16的再生區域8之返回氣體進行混合,經由送風機10利用預冷器11進行冷却並作為被處理氣體供給到蜂窩轉子5的處理區域6中。並且,被處理氣體的一部分在處理區域6之前被分歧而通過淨化區域7之後,利用再生加熱器14進行加熱並被送到再生區域8中。通過處理區域6之低露點氣體作為供氣SA通過配管c供給到氣密室1中。如此,藉由循環運轉,維持氣密室1的低露點環境,並且能夠減少作為公用設施的乾燥空氣的供給量。
(2) Furthermore, as shown in FIG. 1 , when there is one airtight chamber, the airtight chamber 1 can also be dehumidified by the
接著,對氣密室1的氮氣置換及循環運轉進行說明。 Next, the nitrogen replacement and circulation operation of the airtight chamber 1 will be described.
(氮氣置換運轉) (Nitrogen replacement operation)
在大氣置換後,將氣密室1內置換成氮氣,並將氧氣濃度設成100ppm以下等規定的濃度以下。依據大氣置換的情況(1)、(2),氮氣置換運轉成為如下。 After the atmosphere is replaced, the inside of the airtight chamber 1 is replaced with nitrogen, and the oxygen concentration is set to a predetermined concentration such as 100 ppm or less. Depending on the conditions (1) and (2) of atmospheric replacement, the nitrogen replacement operation is as follows.
(1)首先,關閉閥27並打開閥26。通過配管a,將來自氮氣瓶或氮氣供給裝置(未圖示)等之氮氣供給到氣密室1中。打開閥28,將來自氣密室1之還氣RA經由配管b進行排氣(EA)。藉由設成氮氣從氣密室1的上部以單向的方式被供給,能夠一次性供給大量的氣體,因此將殘存於氣密室之空氣迅速置換成氮氣,能夠大幅縮短氮氣與空氣的置換速度。持續進行至氣密室1內的氧氣濃度降低到100ppm為止。
(1) First, the
(2)進行與(1)相同的操作。供給到氣密室1內之氮氣通過閥28被排氣(EA),但是殘留的氣體通過蜂窩轉子5的再生區域8而與藉由冷却器15被冷却之氣體進行混合,並作為被處理氣體導入到蜂窩轉子5的處理區域6中。被處理氣體的一部分在處理區域6之前被分歧而通過淨化區域7之後,利用再生加熱器14進行加熱並被送到再生區域8中。另外,此時,閥31為打開狀態且閥33、34為關閉狀態,因此氧氣等活性氣體不會流入到氮氣純化機23中。在處理區域6中通過蜂窩之被處理氣體依據需要利用後加熱器12進行加熱,並作為供氣SA通過配管c供給到氣密室1中。如此,供給氮氣來置換氣密室1內的氣體,並且對大氣置換後滯留在氣密室1內之水分進行除濕,藉此緩慢降低氣密室1內的水分濃度及氧氣濃度。進行該循環運轉直至氣密室1內的氧氣濃度成為100ppm以下,並將氣密室1內置換成氮氣。(2) Perform the same operation as (1). The nitrogen gas supplied into the airtight chamber 1 is exhausted (EA) through the
(氧氣去除·氮氣純化運轉)
氣密室1內的氧氣濃度降低到100ppm以下等規定的濃度之後,關閉閥28、31並打開閥33、34、35、36。此時,設成氮氣純化機23的其他閥保持關閉狀態。藉此,向氮氣純化機23的觸媒容器18導入通過蜂窩轉子5的淨化區域7之氣體,並藉由觸媒容器18內的金屬觸媒開始進行氧氣去除。並且,藉由將閥26變窄來減小通過配管a之氮氣的供給流量並供給氮氣,並且保持氣密室1內的正壓。來自氣密室1之還氣RA作為被處理氣體通過配管b供給到蜂窩轉子5中。(Oxygen removal and nitrogen purification operation)
After the oxygen concentration in the airtight chamber 1 drops to a predetermined concentration such as 100 ppm or less, the
乾燥劑除濕機16中之氣體的流動為如前述。通過淨化區域7之氣體藉由蜂窩的吸附熱而升溫。另一方面,金屬觸媒在較高之溫度條件下容易與氧氣進行反應,因此將通過淨化區域之溫度高之氣體供給到觸媒容器中為較佳。若設為在金屬觸媒中例如包含銅,則如下述式,銅與氧氣進行反應而被氧化,藉由成為氧化銅來去除氧氣。
2Cu+O2
→2CuOThe flow of gas in the
通過氮氣純化機23之氣體利用再生加熱器14進行加熱,並導入到蜂窩轉子5的再生區域8中。通過再生區域8之氣體再次通過處理區域6而作為供氣SA供給到氣密室1中。藉由如此進行循環運轉來緩慢降低氧氣濃度和/或水分濃度。例如,進行循環運轉直至成為水分濃度為10ppm且氧氣濃度為1ppm以下等規定的濃度。之後,開始進行製造裝置2的運轉,並開始進行用於OLED的製造或研發的實驗等。另外,本實施例中,設為使氣體在觸媒容器18中流動之結構,但是亦可以設為如氣體在觸媒容器19中流動之結構。亦即,並列設置兩個觸媒容器(雙塔式),在再生一台觸媒容器之觸媒期間,利用另一台觸媒容器進行氮氣純化處理。另外,並不限於此,亦可以由一個或者複數個觸媒容器而成之一個或者複數個氮氣純化機構成。
The gas passing through the
實施例1中,設成將通過淨化區域之氣體送到氮氣純化機中,但是亦可以設成將通過處理區域之氣體或者通過淨化區域之氣體與通過處理區域之氣體進行混合來進行供給。或者,亦可以設為如下結構,亦即,連接供給氮氣置換時所使用之氮氣之公用設施與氮氣純化機來將氮氣供給到氣密室。另外,利用蜂窩轉子進行除濕之低露點氣體在觸媒容器中流通,因此水分難以滯留。 In Embodiment 1, the gas passing through the purification area is sent to the nitrogen purifier, but the gas passing through the treatment area or the gas passing through the purification area and the gas passing through the treatment area may be mixed and supplied. Alternatively, a structure may be adopted in which a utility supplying nitrogen gas used in nitrogen replacement is connected to a nitrogen purifier to supply nitrogen gas to the airtight chamber. In addition, the low dew point gas dehumidified by the honeycomb rotor circulates in the catalyst container, so moisture is difficult to retain.
(觸媒再生運轉) (catalyst regeneration operation)
在觸媒失效而通過觸媒容器之氣體超過例如氧氣濃度1ppm等規定的濃度之情況下,開始進行觸媒的再生運轉。例如,在觸媒容器18內的觸媒失效之情況下,切換成關閉閥35、36並打開閥37、38來設成通過淨化區域7之氣體流入到觸媒容器19中。接著,打開閥39、40、43、44,從含有氫氣之氮氣之供給裝置或氮氣之供給裝置(未圖示)等,將含有已調整為預定的濃度之氫氣之氮氣供給到觸媒容器18中。同時,利用加熱器20進行加熱。例如,在金屬觸媒中例如包含銅之情況下,如下述式,氧化銅與氫進行反應而被還原,藉由成為銅來去除氧氣,觸媒被再生,藉由真空泵22進行真空抽取並排氣(EA)。
When the catalyst fails and the gas passing through the catalyst container exceeds a predetermined concentration such as oxygen concentration 1 ppm, the catalyst regeneration operation is started. For example, when the catalyst in the
CuO+H2→Cu+H2O CuO+H 2 →Cu+H 2 O
另外,藉由打開閥46,將進行反應而排出之水作為排水排出。 In addition, by opening the valve 46, the water reacted and discharged is discharged as drainage water.
藉由以上結構,能夠設為省空間之氣體置換系統,並能夠抑制配管或設置工事等中花費之生產成本。 With the above structure, a space-saving gas replacement system can be set up, and production costs incurred in piping and installation work can be suppressed.
[實施例2] [Example 2]
圖2中示出本發明的乾燥室的實施例2中之流路圖。實施例1中,使用一個氣密室,但是實施例2中由複數個氣密室構成。另外,圖2中,設成由1A、1B、1C這三個氣密室構成之結構,但是並不限於此,可以設置兩個或者四個以上。實施例2的裝置結構與實施例1幾乎相同,因此省略重複說明。
FIG. 2 shows a flow path diagram in Example 2 of the drying chamber of the present invention. In Example 1, one airtight chamber is used, but in Example 2, a plurality of airtight chambers are used. In addition, in FIG. 2 , the structure is configured to include three
在氣密室存在複數個之情況下,即使一部分的氣密室在大氣置換中,亦能夠在另一氣密室中使惰性氣體循環而維持氧氣去除.氮氣純化運轉。因此,能夠大幅縮短從大氣置換後的大氣環境返回到低露點且為惰性氣體濃度的環境之恢復時間。並且,能夠利用一台乾燥劑除濕機及氮氣純化機提供各氣密室的氣體供給,因此能夠抑制成本。本發明的系統具有如下特點,亦即,管線規模越大,成本優點越大等。 When there are a plurality of airtight chambers, even if a part of the airtight chamber is being replaced by the atmosphere, inert gas can be circulated in another airtight chamber to maintain oxygen removal. Nitrogen purification operation. Therefore, the recovery time from the atmospheric environment after atmospheric replacement to an environment with a low dew point and an inert gas concentration can be significantly shortened. In addition, one desiccant dehumidifier and nitrogen purifier can be used to supply gas to each airtight chamber, so costs can be suppressed. The system of the present invention has the following characteristics, that is, the larger the pipeline scale, the greater the cost advantage.
另外,實施例2中,構成為利用一台乾燥劑除濕機及氮氣純化機供給惰性氣體,但是亦可以構成為利用複數台乾燥劑除濕機和/或氮氣純化機向氣密室供給惰性氣體。 In addition, in Example 2, one desiccant dehumidifier and a nitrogen purifier are used to supply the inert gas. However, a plurality of desiccant dehumidifiers and/or nitrogen purifiers may be used to supply the inert gas to the airtight chamber.
在以下實施例2的說明中,氣密室1A設為從惰性氣體環境進行大氣置換,進而在大氣置換後從大氣環境返回到低露點.、惰性氣體環境並進行氧氣去除、氮氣純化運轉。在此期間,氣密室1B、1C設為繼續進行氧氣去除、氮氣純化運轉。
In the following description of Example 2, the
(大氣置換) (atmospheric replacement)
對氣密室1A藉由大氣置換而返回到大氣環境之情況進行說明。藉由關閉閥26、47B、47C、48A、51A並打開閥27、47A、50A而通過配管a從氣密室1A的上部導入乾燥空氣,將氮氣置換成乾燥空氣。藉由設成低露點的乾燥空氣從氣密室1A的上部以單向的方式被供給,能夠安全地一次性供給大量的空氣,因此能夠大幅縮短氮氣與空氣的置換速度。另外,在所有的氣密室中,在成為大氣置換之情況下,藉由關閉所有閥48且打開閥49而與氣密室獨立地使乾燥劑除濕機及氮氣純化機進行循環運轉,從而能夠維持惰性氣體,因此從大氣置換到惰性氣體循環運轉的恢復時間變短。The case where the
(氮氣置換運轉)
在大氣置換後,將氣密室1A內置換成氮氣,並將氧氣濃度設成預定的濃度以下。首先,關閉閥27並打開閥26、閥47A,通過配管a將氮氣供給到氣密室1A中。在各氣密室中通過配管a供給氮氣之情況下,藉由流量計24及閥47,能夠分別調整供給之氣體的流量。來自氣密室之還氣RA打開閥50A來進行排出。如此,以單向的方式進行氮氣置換運轉直至氣密室1內的氧氣濃度成為規定的濃度以下,並將氣密室1內置換成氮氣。另一方面,氣密室1B、1C在氧氣去除、氮氣純化運轉中,閥50B、50C為關閉狀態且閥51B、51C為打開狀態,因此還氣RA經由配管b而惰性氣體被導入到乾燥劑除濕機16中。其中,閥48A為關閉狀態,因此氧氣流入到乾燥劑除濕機16及氮氣純化機23中而不會造成影響。並且,能夠藉由打開閥49並通過配管d進行旁通運轉來調整流量。(Nitrogen replacement operation)
After the atmosphere is replaced, the inside of the
混合來自氣密室1B、1C之還氣RA與通過配管d進行旁通運轉之惰性氣體,進而混合通過蜂窩轉子5的再生區域8之氣體,並作為被處理氣體導入到蜂窩轉子5的處理區域6中。其中,閥31為關閉狀態,且與實施例1相同地,通過淨化區域7之氣體被導入到氮氣純化機23中來進行氧氣去除、氮氣純化運轉。The return gas RA from the
另外,在所有的氣密室從大氣置換的狀態進行氮氣置換運轉時,設成打開閥31並關閉閥33、34而活性氣體不會流入到氮氣純化機23中之狀態,並以與實施例1相同的方式進行運轉。In addition, when all the airtight chambers are replaced with nitrogen from the atmosphere, the
(氧氣去除、氮氣純化運轉)
氣密室1A內的氧氣濃度降低到規定的濃度以下之後,關閉閥50A並打開閥51A。並且,將閥26變窄來減小通過配管a之氮氣的供給流量,供給氮氣,並且保持氣密室1內的正壓。來自氣密室1之還氣RA作為被處理氣體通過配管b供給到蜂窩轉子5中。通過蜂窩轉子5的淨化區域7之氣體藉由送風機17被導入到氮氣純化機23中。
通過氮氣純化機23之惰性氣體利用再生加熱器14進行加熱,並導入到蜂窩轉子5的再生區域8中。通過再生區域8之氣體再次通過處理區域6而作為供氣SA供給到氣密室1中。藉由如此進行循環運轉來進一步逐漸緩慢降低氧氣濃度和/或水分濃度。達到規定的濃度之後,開始進行製造裝置2的運轉,並開始進行用於OLED的製造或研發的實驗等。另外,在圖2中,將觸媒容器設為雙塔式,但是與實施例1相同地,並不限於此。(Oxygen removal, nitrogen purification operation)
After the oxygen concentration in the
藉由連接乾燥劑除濕機與氮氣純化機而形成一體之型式的裝置,與專利文獻3相比,能夠設為省空間的氣體置換系統,並且能夠抑制配管或設置工事等中所花費之生產成本。By connecting a desiccant dehumidifier and a nitrogen purifier to form an integrated device, compared to Patent Document 3, a space-saving gas replacement system can be set up, and production costs such as piping and installation work can be suppressed. .
藉由以上,能夠將從氣密室1的大氣置換後的大氣環境返回到使內部以低露點、惰性氣體清潔之環境為止的恢復時間縮短成以往技術的1/5~1/10。並且,能夠實現如下氣體置換系統,亦即,能夠容易使氣密室1內最佳化成低露點且惰性氣體環境。 [產業上之可利用性]By the above, the recovery time until the atmospheric environment of the airtight chamber 1 is returned to an environment where the inside is cleaned with low dew point and inert gas can be shortened to 1/5 to 1/10 of the conventional technology. Furthermore, a gas replacement system can be realized in which the inside of the airtight chamber 1 can be easily optimized to a low dew point and inert gas environment. [Industrial availability]
本發明亦能夠對需要以低露點、惰性氣體濃度保持保管空間內清潔之用於開發鋰離子電池材料等之手套箱等收納容器或乾燥室進行使用。The present invention can also be used in storage containers such as glove boxes or drying rooms for developing lithium-ion battery materials that require low dew point and inert gas concentration to keep the storage space clean.
1,1A,1B,1C:氣密室
2,2A,2B,2C:製造裝置
3,3A,3B,3C:空氣淨化過濾器
4:氣體循環路徑
5:蜂窩轉子
6:處理區域
7:淨化區域
8:再生區域
9:轉子驅動馬達
10,17:送風機
11:預冷器
12:後加熱器
13:空氣過濾器
14:再生加熱器
15:冷卻器
16:乾燥劑除濕機
18,19:觸媒容器
20,21:加熱器
22:泵
23:氮氣純化機
24,24A,24B,24C,25,25A,25B,25C:流量計
26,27,28,29,30,31,32,33,34,35,36,37,38,39,40,41,42,43,44,45,46,47,47A,47B,47C,48,48A,48B,48C,49,50,50A,50B,50C,51,51A,51B,51C:閥
a:配管
b:配管
c:配管
d:配管1,1A,1B,1C:
圖1係本發明的乾燥室的實施例1中之流路圖。 圖2係本發明的乾燥室的實施例2中之流路圖。Figure 1 is a flow path diagram in Embodiment 1 of the drying chamber of the present invention. Figure 2 is a flow path diagram in Example 2 of the drying chamber of the present invention.
1:氣密室 1: Airtight room
2:製造裝置 2: Manufacturing device
3:空氣淨化過濾器 3: Air purification filter
4:氣體循環路 4: Gas circulation path
5:蜂窩轉子 5: Honeycomb rotor
6:處理區域 6: Processing area
7:淨化區域 7:Purification area
8:再生區域 8: Regeneration area
9:轉子驅動馬達 9: Rotor drive motor
10:送風機 10: Blower
11:預冷器 11: Precooler
12:後加熱器 12:Rear heater
13:空氣過濾器 13:Air filter
14:再生加熱器 14: Regenerative heater
15:冷卻器 15:Cooler
16:乾燥劑除濕機 16: Desiccant dehumidifier
17:送風機 17: Blower
18:觸媒容器 18:Catalyst container
19:觸媒容器 19:Catalyst container
20:加熱器 20:Heater
21:加熱器 21:Heater
22:泵 22:Pump
23:氮氣純化機 23:Nitrogen purifier
24:流量計 24:Flow meter
25:流量計 25:Flowmeter
26,27,28,29,30,31,32,33,34,35,36,37,38,39,40,41,42,43,44,45,46:閥 26,27,28,29,30,31,32,33,34,35,36,37,38,39,40,41,42,43,44,45,46: valve
a:配管 a:Piping
b:配管 b:Piping
c:配管 c:Piping
RA:還氣 RA: Be angry
SA:供氣 SA: air supply
Claims (6)
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TW201836039A (en) * | 2013-12-13 | 2018-10-01 | 日商昕芙旎雅股份有限公司 | Efem |
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JP5631011B2 (en) | 2010-01-25 | 2014-11-26 | 高砂熱学工業株式会社 | Clean room system and operation method thereof |
JP5676521B2 (en) | 2012-05-18 | 2015-02-25 | 万善工機株式会社 | Glove box with inert gas circulation purification device |
KR20150001953U (en) * | 2013-11-14 | 2015-05-22 | (주)제이원텍 | Nitrogen furification apparatus for oled encapsulation process |
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CN108607351A (en) * | 2018-06-25 | 2018-10-02 | 宜春赣锋锂业有限公司 | A kind of gas purge system of lithium metal glove box |
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TW201343948A (en) * | 2011-12-22 | 2013-11-01 | Kateeva Inc | Gas enclosure assembly and system |
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