TWI816963B - polycarbonate resin film - Google Patents
polycarbonate resin film Download PDFInfo
- Publication number
- TWI816963B TWI816963B TW108148359A TW108148359A TWI816963B TW I816963 B TWI816963 B TW I816963B TW 108148359 A TW108148359 A TW 108148359A TW 108148359 A TW108148359 A TW 108148359A TW I816963 B TWI816963 B TW I816963B
- Authority
- TW
- Taiwan
- Prior art keywords
- polycarbonate resin
- resin film
- thermal shrinkage
- less
- heat treatment
- Prior art date
Links
- 239000004431 polycarbonate resin Substances 0.000 title claims abstract description 76
- 229920005668 polycarbonate resin Polymers 0.000 title claims abstract description 76
- 238000010438 heat treatment Methods 0.000 claims abstract description 28
- 230000009477 glass transition Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 23
- 230000000873 masking effect Effects 0.000 abstract description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229920004142 LEXAN™ Polymers 0.000 description 2
- 239000004418 Lexan Substances 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- -1 polyethylene naphthalate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
聚碳酸酯樹脂膜在140℃加熱處理90分鐘後之長度方向及寬度方向上的熱收縮率都在0.10%以下。目的在於提供一種聚碳酸酯樹脂膜,係在熱處理步驟中,可抑制基材與遮膜的積層體發生翹曲等變形。After the polycarbonate resin film is heated at 140°C for 90 minutes, the thermal shrinkage rate in both the length and width directions is less than 0.10%. The object is to provide a polycarbonate resin film that can suppress deformation such as warping of a laminate of a base material and a masking film during a heat treatment step.
Description
本發明係關於聚碳酸酯樹脂膜。The present invention relates to a polycarbonate resin film.
用於液晶顯示器或有機EL(electroluminescence;電致發光)顯示器之觸控面板用基材係使用環烯烴聚合物等樹脂所構成的膜,但近年來要求顯示器的薄型化或可撓性化等,故要求上述基材於高溫下具有尺寸穩定性或低雙折射性等特性。
又,製造使用如此基材之液晶顯示器或有機EL顯示裝置時,其外觀適用非常嚴格的基準,故使用基材保護用膜(遮膜)(例如參照專利文獻1至專利文獻2)。The base material for touch panels used in liquid crystal displays or organic EL (electroluminescence) displays uses films made of resins such as cycloolefin polymers. However, in recent years, there have been demands for thinner or more flexible displays. Therefore, the above-mentioned substrates are required to have properties such as dimensional stability or low birefringence at high temperatures.
In addition, when manufacturing a liquid crystal display or an organic EL display device using such a base material, very strict standards are applied to its appearance, so a base material protective film (mask) is used (see, for example,
[先前技術文獻] [專利文獻][Prior technical literature] [Patent Document]
專利文獻1:日本特開2003-170535號公報。 專利文獻2:日本特開2004-059860號公報。Patent Document 1: Japanese Patent Application Publication No. 2003-170535. Patent Document 2: Japanese Patent Application Publication No. 2004-059860.
[發明所欲解決之課題][Problem to be solved by the invention]
在此,例如在觸控面板所使用透明導電膜之製造步驟中,需要高溫(例如130℃至170℃)之熱處理步驟,是在上述遮膜已貼合於基材之狀態下進行該熱處理步驟。基材可使用具150℃以上耐熱性之聚萘二甲酸乙二酯樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、及環烯烴聚合物樹脂等,使用與形成上述基材之材料相異種類之材料所構成的遮膜時,在熱處理步驟中,會存在基材與遮膜的積層體(以下稱為「積層體」)產生變形(大的翹曲)之問題。 因此,本發明係鑑於上述問題而研究者,目的在於提供一種聚碳酸酯樹脂膜,即使在遮膜貼合於基材之狀態下進行熱處理步驟時,亦可抑制積層體產生翹曲等變形。 [用以解決課題之技術手段]Here, for example, in the manufacturing process of a transparent conductive film used in a touch panel, a heat treatment step that requires a high temperature (for example, 130°C to 170°C) is performed in a state where the above-mentioned mask film has been bonded to the base material. . As the base material, polyethylene naphthalate resin, polyimide resin, polycarbonate resin, and cycloolefin polymer resin with heat resistance of 150°C or above can be used. The materials used are different from those used to form the above base material. In the case of a mask made of other materials, there is a problem that the laminate of the base material and the mask (hereinafter referred to as "laminated body") is deformed (large warpage) during the heat treatment step. Therefore, the present invention was made in view of the above-mentioned problems, and its object is to provide a polycarbonate resin film that can suppress deformation such as warping of the laminate even when the heat treatment step is performed with the mask bonded to the base material. [Technical means used to solve problems]
為達成上述目的,本發明之聚碳酸酯樹脂膜在140℃加熱處理90分鐘後,在長度方向及寬度方向上的熱收縮率都在0.10%以下。 [發明功效]In order to achieve the above object, the polycarbonate resin film of the present invention has a thermal shrinkage rate of less than 0.10% in both the length direction and the width direction after heat treatment at 140°C for 90 minutes. [Invention effect]
根據本發明,熱處理步驟中,可抑制積層體產生翹曲等變形。According to the present invention, it is possible to suppress deformation such as warping of the laminated body during the heat treatment step.
以下說明本發明之適合實施形態。Suitable embodiments of the present invention will be described below.
>聚碳酸酯樹脂>
構成本發明之聚碳酸酯樹脂膜之聚碳酸酯樹脂種類並無特別限定,例如為二羥基化合物與光氣或碳酸二苯酯反應能夠得到之熱塑性樹脂。
又,二羥基化合物可使用例如2,2-雙(4-羥基苯基)丙烷(「雙酚A」)、氫醌、四甲基雙酚A、間苯二酚、及4,4-二羥基二苯基等。又,可使用以下化學式(1)所示N-苯基酚酞(熔點:293℃)、以下化學式(2)所示雙酚TMC(熔點:208℃)、及以下化學式(3)所示雙甲酚茀(熔點218℃至219℃)。
[化學式1]
>聚碳酸酯樹脂膜>
本實施形態之聚碳酸酯樹脂膜之製造方法係具備:使用熔融擠出法加熱膜形成材料即聚碳酸酯樹脂的加熱步驟、將已加熱過之聚碳酸酯樹脂擠出為膜狀之擠出步驟。
圖1為表示用以製造本實施形態之聚碳酸酯樹脂膜之裝置之概略圖。
如圖1所示,在擠出機1中,將加熱熔融之聚碳酸酯樹脂從擠出機1擠出為膜狀,以接觸輥(Touch Roll)2、鑄輥(Cast Roll)3、4夾壓後,在直線狀配列之複數移送輥9上使膜慢慢冷卻。接著,藉由收膜輥5拉取該膜,藉此可得殘留應力較少之聚碳酸酯樹脂膜。
又,擠出機1的模頭例如T型模頭或衣架型模頭。
又,接觸輥2、鑄輥3、4、及收膜輥5可使用金屬輥或橡膠輥。
擠出機1中的聚碳酸酯樹脂之熔融溫度係考慮上述玻璃轉移溫度(Tg),較佳為在(Tg+100)℃以上且(Tg+200)℃以下。其理由如下:熔融溫度未滿(Tg+100)℃時,會產生出現未熔融部分的不良現象;大於(Tg+200)℃時,會產生樹脂燒焦使外觀降低的不良現象。
又,鑄輥3、4之溫度較佳為在(Tg-15)℃以上且(Tg+5)℃以下。其理由如下:鑄輥3、4之溫度未滿(Tg-15)℃時,膜會急冷並產生容易留下殘留應力的不良現象;大於(Tg+5)℃時,會產生膜相對於鑄輥3、4之剝離性降低的不良現象。
又,下式(1)所示時間(聚碳酸酯樹脂從擠出機1之出口1a擠出至到達接觸輥2與鑄輥3之接點S的時間)T較佳為在0.26秒以上且0.65秒以下。
時間T[秒] =(從出口1a到接點S的距離E[cm])/(從聚碳酸酯樹脂之出口1a到接點S的速度[cm/s] ) 式(1)
其理由如下:時間未滿0.26秒時,會產生生產性降低的不良現象;大於0.65秒時,會產生容易留下流動方向殘留應力的不良現象。
又,聚碳酸酯樹脂膜之厚度並無特別限定,較佳為在100μm以上且130μm以下。
本實施形態之聚碳酸酯樹脂膜係作為裝設於有機EL顯示裝置所使用觸控面板用基材等被著體的遮膜使用,或作為半導體成型製程步驟等高溫處理步驟中使用的膜等使用。
在此,如上述,以往的遮膜中,使用與形成基材之材料相異種類之材料所構成的遮膜時,在熱處理步驟中有積層體產生變形(大的翹曲)的問題。
又,遮膜並不用於最終製品,故較佳為使用較便宜者。
又,如上述,在觸控面板所使用透明導電膜之製造步驟中,需要高溫(例如130℃至170℃)之熱處理步驟。
因此,本申請發明人等著眼於該點,降低比以往所使用環烯烴聚合物膜更便宜之聚碳酸酯樹脂膜的熱收縮率,而抑制熱處理步驟中的熱收縮所造成影響,藉此發現抑制積層體產生翹曲等變形之條件。
更具體而言,聚碳酸酯樹脂膜的特徵在於:在140℃加熱處理90分鐘後之熱收縮率在膜之機械軸(長度)方向(以下稱為「MD方向」)及與其直交(寬度)方向(以下稱為「TD方向」)上都在0.10%以下。
接著,藉由將熱收縮率設定為該範圍,對於與聚碳酸酯樹脂相異種類之材料(例如環烯烴聚合物)所構成的基材,將本發明之聚碳酸酯樹脂膜作為遮膜而貼合並進行熱處理進行時,亦可抑制聚碳酸酯樹脂膜的熱收縮。因此,在熱處理步驟中,可抑制基材(亦即基材與聚碳酸酯樹脂膜的積層體)產生翹曲等變形。
又,在此所述「熱收縮率」為以後述實施例所記載方法測定之熱收縮率。
又,本發明之聚碳酸酯樹脂膜在MD方向上的熱收縮率與TD方向上的熱收縮率之差的絕對值較佳為在0.02%以下,更佳為在0.01%以下。藉由如此構成,在熱處理步驟中,聚碳酸酯樹脂的熱收縮會成為等向性,故可有效抑制積層體產生翹曲等變形。
又,以進一步有效抑制積層體產生翹曲等變形的觀點來看,在140℃加熱處理90分鐘後之聚碳酸酯樹脂膜在MD方向上的熱收縮率與基材在MD方向上的熱收縮率之差的絕對值較佳為在0.03%以下,更佳為在0.02%以下,特佳為在0.01%以下。在140℃加熱處理90分鐘後之聚碳酸酯樹脂膜在TD方向上的熱收縮率與基材在TD方向上的熱收縮率之差的絕對值較佳為在0.03%以下,更佳為在0.02%以下,特佳為在0.01%以下。
更具體而言,較佳為:設在140℃加熱處理90分鐘後之聚碳酸酯樹脂膜在MD方向上的熱收縮率為H1
,基材之熱收縮率為h1
時,熱收縮率H1
與熱收縮率h1
之差(亦即H1
-h1
)的絕對值在0.03%以下;設在140℃加熱處理90分鐘後之聚碳酸酯樹脂膜在TD方向上之熱收縮率為H2
,基材之熱收縮率為h2
時,熱收縮率H2
與熱收縮率h2
之差(亦即H2
-h2
)的絕對值在0.03%以下。>Polycarbonate resin film> The method for manufacturing a polycarbonate resin film according to this embodiment includes a heating step of using a melt extrusion method to heat polycarbonate resin, which is a film forming material, and extruding the heated polycarbonate resin. The film-like extrusion step is performed. FIG. 1 is a schematic diagram showing an apparatus for manufacturing the polycarbonate resin film of this embodiment. As shown in Figure 1, in the
(實施例) 以下根據實施例說明本發明。又,本發明並不限定於該等實施例,可根據本發明主旨對該等實施例進行變形、變更,該等亦包括於本發明之範圍內。(Example) The present invention will be described below based on examples. In addition, the present invention is not limited to these embodiments, and these embodiments can be deformed and changed based on the gist of the present invention, and these are also included in the scope of the present invention.
(實施例1)
>玻璃轉移溫度之測定>
根據JIS K7121測定聚碳酸酯樹脂(SABIC製商品名:LEXAN HXT3143T)之玻璃轉移溫度。更具體而言,使用熱機械分析裝置(Rigaku股份有限公司製商品名:TMA8310),在以5℃/分鐘的的升溫速度從室溫升高至200℃之條件下測定DSC(Differential Scanning Calorimeter;示差掃描熱分析儀)曲線。接著,以第二次升溫時所測定且從DSC曲線所求之中間點玻璃轉移溫度作為聚碳酸酯樹脂之玻璃轉移溫度。以上結果示於表1。
>聚碳酸酯樹脂膜之製造方法>
接著使用上述圖1所示裝置製作聚碳酸酯樹脂膜。更具體而言,首先,將上述聚碳酸酯樹脂之粒狀物從設定於280℃之擠出機1以擠出量220kg/小時擠出,藉由接觸輥2、鑄輥3、4夾壓後,在複數移送輥9上使膜慢慢冷卻。接著,藉由收膜輥5拉取該膜,藉此獲得厚度為100μm之聚碳酸酯樹脂膜。
>熱收縮率之測定>
接著,對所製作聚碳酸酯樹脂膜測定在140℃加熱處理90分鐘後在MD方向及TD方向上的熱收縮率。更具體而言,準備聚碳酸酯樹脂膜之樣品(長度:100mm,寬度:100mm,厚度:100μm),使用尺寸自動長度測量裝置(中央電機計器製作所(製),商品名:GS-3025N),在三處分別測定了MD方向及TD方向上的距離,以其平均值作為各處的熱處理前之尺寸S0
。
接著,將該樣品在保溫於140℃之烘箱內加熱90分鐘後取出,在室溫中冷卻30分鐘後,再次使用尺寸自動長度測量裝置(中央電機計器製作所(製),商品名:GS-3025N),在三處測定了MD方向及TD方向上的距離,以其平均值作為各處的熱處理後之尺寸S1
。
接著使用以下式(2)計算出了MD方向及TD方向上的熱收縮率。以上結果示於表1。
熱收縮率[%]={(S0
-S1
)/S0
}×100 (2)
又,準備被著體即環烯烴聚合物膜(日本ZEON製商品名:ZEONOR ZF-16)之樣品(長度:100mm,寬度:100mm,厚度:40μm),以與聚碳酸酯樹脂膜時相同方式計算出了MD方向及TD方向上的熱收縮率。以上結果示於表1。
>翹曲評價>
接著,將所製作聚碳酸酯樹脂膜(長度:100mm,寬度:100mm,厚度:100μm)透過黏著層即丙烯系膜(日榮化工製商品名:H915,長度:100mm,寬度:100mm,厚度:15μm)貼合於被著體即環烯烴聚合物膜(日本ZEON製商品名:ZEONOR ZF-16,長度:100mm,寬度:100mm,厚度:40μm),如圖2所示,製作透過黏著層11積層聚碳酸酯樹脂膜12與環烯烴聚合物膜13之積層體10。
接著,將該積層體10於保溫於145℃之烘箱內加熱70分鐘後取出,載置於平滑板上並在室溫中冷卻30分鐘。其後,如圖2所示,如圖3至圖4所示,測定了積層體之四個角部A至D從平滑板15之表面15a到積層體10的距離X,以角部A至D從平滑板15之表面15a到積層體10的距離X之最大值作為翹曲值(捲曲值)。
又,如圖3所示,針對積層體10,以使聚碳酸酯樹脂膜12側朝向板15側成為凸狀態時之距離X作為正值(例如圖3中的距離X為5mm時為+5mm),如圖4所示,以使環烯烴聚合物膜13側朝向板15側成為凸狀態時之距離X為負值(例如圖4中的距離X為5mm時為-5mm)。
接著根據以下評價基準而評價積層體10之翹曲。
-10mm≦翹曲值≦+10mm:○
翹曲值>-10mm、或10mm>翹曲值:×(Example 1) >Measurement of glass transition temperature> The glass transition temperature of polycarbonate resin (trade name: LEXAN HXT3143T manufactured by SABIC) was measured based on JIS K7121. More specifically, a thermomechanical analysis device (trade name: TMA8310 manufactured by Rigaku Co., Ltd.) was used to measure DSC (Differential Scanning Calorimeter) under the condition of raising the temperature from room temperature to 200°C at a temperature increase rate of 5°C/min; Differential scanning thermal analyzer) curve. Next, the midpoint glass transition temperature measured during the second temperature rise and calculated from the DSC curve was used as the glass transition temperature of the polycarbonate resin. The above results are shown in Table 1. >Manufacturing method of polycarbonate resin film> Next, the apparatus shown in Figure 1 is used to produce a polycarbonate resin film. More specifically, first, the polycarbonate resin granules were extruded from the
(實施例2至實施例3,比較例1至比較例3)
除了將聚碳酸酯樹脂之厚度、MD方向上的熱收縮率及TD方向上的熱收縮率中的至少一者變更為表1所示內容以外,以與實施例1相同方式製作積層體10並進行翹曲評價。以上結果示於表1。
又,取代實施例2、3、及比較例1、3中的聚碳酸酯樹脂(SABIC製商品名:LEXAN HXT3143T),使用了其他聚碳酸酯樹脂(住化聚碳酸酯股份有限公司製商品名:301-15)。(Example 2 to Example 3, Comparative Example 1 to Comparative Example 3)
The
[表1]
[產業可利用性] 總上所述,本發明對裝設於環烯烴聚合物膜等被著體之聚碳酸酯樹脂膜尤其有用。[Industrial Availability] As described above, the present invention is particularly useful for polycarbonate resin films installed on substrates such as cyclic olefin polymer films.
1:擠出機
2:接觸輥
3、4:鑄輥
5:收膜輥
9:移送輥
10積層體
11:黏著層
12:聚碳酸酯樹脂膜
13:環烯烴聚合物膜(被著體)
15:板
1:Extruder
2:
圖1係表示用以製造本發明之實施形態之聚碳酸酯樹脂膜之裝置之概略圖。 圖2係用以說明實施例之翹曲評價所使用積層體之立體圖。 圖3係用以說明實施例之翹曲評價所使用積層體的翹曲值測定方法之概略圖。 圖4係用以說明實施例之翹曲評價所使用積層體的翹曲值測定方法之概略圖。FIG. 1 is a schematic diagram showing an apparatus for manufacturing a polycarbonate resin film according to an embodiment of the present invention. FIG. 2 is a perspective view of a laminated body used for illustrating warpage evaluation in Examples. FIG. 3 is a schematic diagram illustrating a method for measuring the warpage value of a laminated body used for warpage evaluation in Examples. FIG. 4 is a schematic diagram illustrating a method for measuring the warpage value of a laminated body used for warpage evaluation in Examples.
無。 without.
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019003640A JP7249152B2 (en) | 2019-01-11 | 2019-01-11 | Polycarbonate resin film |
JP2019-003640 | 2019-01-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202026344A TW202026344A (en) | 2020-07-16 |
TWI816963B true TWI816963B (en) | 2023-10-01 |
Family
ID=71580941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108148359A TWI816963B (en) | 2019-01-11 | 2019-12-30 | polycarbonate resin film |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7249152B2 (en) |
KR (1) | KR20200087709A (en) |
CN (1) | CN111434717B (en) |
TW (1) | TWI816963B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004099754A (en) * | 2002-09-10 | 2004-04-02 | Teijin Ltd | Optical film |
TW200745224A (en) * | 2006-06-05 | 2007-12-16 | Teijin Chemicals Ltd | Polycarbonate resin film and method thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003170535A (en) | 2001-12-05 | 2003-06-17 | Nitto Denko Corp | Surface protecting film for transparent conducting film |
KR20040059860A (en) | 2002-12-30 | 2004-07-06 | 동부전자 주식회사 | Method for manufacturing mim capacitor in a semiconductor stack structure |
JP4243157B2 (en) | 2003-09-10 | 2009-03-25 | 帝人化成株式会社 | Polycarbonate resin sheet with excellent dimensional stability |
JP5495328B2 (en) | 2010-11-24 | 2014-05-21 | 帝人株式会社 | Manufacturing method of injection molded product by insert molding |
JP2014149964A (en) * | 2013-01-31 | 2014-08-21 | Nitto Denko Corp | Transparent conductive film |
JP6495635B2 (en) | 2014-12-05 | 2019-04-03 | 日東電工株式会社 | Transparent conductive film laminate, touch panel obtained using the same, and method for producing transparent conductive film |
-
2019
- 2019-01-11 JP JP2019003640A patent/JP7249152B2/en active Active
- 2019-12-24 CN CN201911345676.3A patent/CN111434717B/en active Active
- 2019-12-30 TW TW108148359A patent/TWI816963B/en active
-
2020
- 2020-01-09 KR KR1020200003316A patent/KR20200087709A/en not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004099754A (en) * | 2002-09-10 | 2004-04-02 | Teijin Ltd | Optical film |
TW200745224A (en) * | 2006-06-05 | 2007-12-16 | Teijin Chemicals Ltd | Polycarbonate resin film and method thereof |
Also Published As
Publication number | Publication date |
---|---|
JP7249152B2 (en) | 2023-03-30 |
JP2020111676A (en) | 2020-07-27 |
CN111434717A (en) | 2020-07-21 |
KR20200087709A (en) | 2020-07-21 |
CN111434717B (en) | 2023-07-14 |
TW202026344A (en) | 2020-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI477464B (en) | Glass - Resin composite manufacturing method | |
JP5343862B2 (en) | Method for producing glass resin composite | |
US10464253B2 (en) | Biaxially stretched film and method of manufacturing the same, polarizer protective film, decorative film, and layered film | |
US20170217815A1 (en) | Method and apparatus for reforming ultra-thin glass sheets | |
TW200838721A (en) | Production process of embossed resin sheet material | |
KR20170038718A (en) | Method for producing laminate with polyimide layer and method for producing polyimide film | |
JP6126446B2 (en) | Release film and method for producing LED element sealing body | |
JPWO2020013106A1 (en) | Thermoplastic liquid crystal polymer film, its manufacturing method and flexible copper-clad laminate | |
TWI746943B (en) | Release film | |
TWI816963B (en) | polycarbonate resin film | |
US20210130653A1 (en) | Multilayer film and heat-resistant adhesive tape | |
WO2014203872A1 (en) | Mold release film | |
TWI624374B (en) | Polyester multilayer film and manufacturing method thereof | |
TW201144047A (en) | Manufacturing method of surface shape transfer printing resin sheet | |
JP7182747B2 (en) | METHOD FOR MANUFACTURING METAL-CLAD LAMINATED BODY | |
JP2010214750A (en) | Film for fine shape transfer, fine shape transfer film, and method for manufacturing the same | |
JPH10217313A (en) | Optical polycarbonate sheet and manufacture thereof | |
JP6529754B2 (en) | Method for producing poly (meth) acrylimide resin film | |
JP2020104346A (en) | Method for producing polycarbonate resin film | |
JP5050544B2 (en) | Annealing treatment method for film substrate and amorphous resin film | |
JP2008229901A (en) | Manufacturing method of optical resin film |