TWI816213B - Lens module and electronics - Google Patents

Lens module and electronics Download PDF

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Publication number
TWI816213B
TWI816213B TW110140464A TW110140464A TWI816213B TW I816213 B TWI816213 B TW I816213B TW 110140464 A TW110140464 A TW 110140464A TW 110140464 A TW110140464 A TW 110140464A TW I816213 B TWI816213 B TW I816213B
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Taiwan
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lens module
bearing
lens
bearing part
circuit board
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TW110140464A
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Chinese (zh)
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TW202318057A (en
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李宇帥
黃丁男
李靜偉
宋建超
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新煒科技有限公司
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/006Filter holders
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Prostheses (AREA)

Abstract

The invention provides a lens module. The lens module comprises a bearing seat. The bearing seat comprises a first bearing part and a second bearing part located outside the first bearing part. The material of the first bearing part is plastic. The material of the second bearing part is metal. The bearing seat is provided with a slot. The lens module also includes a colloid. The colloid is located in the groove to connect the first bearing part and the second bearing part. The lens module provided by the invention has smaller dimensions in the direction of length and width. The invention also provides an electronic device comprising the lens module.

Description

鏡頭模組及電子裝置 Lens modules and electronic devices

本發明涉及電子及光學器件領域,尤其涉及一種鏡頭模組及電子裝置。 The present invention relates to the field of electronic and optical devices, and in particular, to a lens module and an electronic device.

隨著科技的發展,電子裝置(如鏡頭模組)向小型化方向發展。鏡頭模組通常包括鏡頭、濾光片、塑膠承載座、感光晶片、電路板以及位於電路板上的電子組件。為了滿足塑膠承載座強度的要求,目前塑膠承載座的厚度最薄也有0.3mm。另外,考慮到電子組件避讓以及塑膠承載座成型的問題,也使得塑膠承載座在長度與寬度方向上會預留一定的尺寸,從而無法滿足鏡頭模組小型化的要求。 With the development of technology, electronic devices (such as lens modules) are developing towards miniaturization. Lens modules usually include lenses, filters, plastic holders, photosensitive chips, circuit boards, and electronic components on the circuit boards. In order to meet the strength requirements of the plastic bearing seat, the current thinnest thickness of the plastic bearing seat is 0.3mm. In addition, considering the problems of electronic component avoidance and plastic bearing molding, the plastic bearing will reserve a certain size in the length and width directions, which cannot meet the requirements of miniaturization of the lens module.

有鑒於此,本發明提供一種在長度和寬度方向上尺寸較小的鏡頭模組。 In view of this, the present invention provides a lens module with smaller dimensions in the length and width directions.

另,還有必要提供一種包括該鏡頭模組的電子裝置。 In addition, it is also necessary to provide an electronic device including the lens module.

本發明一實施例提供一種鏡頭模組,包括承載座,所述承載座包括第一承載部以及位於所述第一承載部外側的第二承載部,所述第一承載部的材質為塑膠,所述第二承載部的材質為金屬,所述承載座中設有開槽,所述鏡頭模組還包括膠體,所述膠體位於所述開槽中以連接所述第一承載部以及所述第二承載部。 One embodiment of the present invention provides a lens module, including a bearing base. The bearing base includes a first bearing part and a second bearing part located outside the first bearing part. The first bearing part is made of plastic. The second bearing part is made of metal, and a slot is provided in the bearing seat. The lens module also includes colloid, and the gel is located in the slot to connect the first bearing part and the The second carrying part.

本發明一實施例還提供一種包括所述鏡頭模組的電子裝置。 An embodiment of the present invention also provides an electronic device including the lens module.

本發明中的所述承載座包括第一承載部以及位於所述第一承載部外側的第二承載部,所述第二承載部為所述承載座的外側壁,由於所述第二承 載部的材質為金屬,具有較高的強度,相比現有技術中的塑膠承載座,本發明能夠降低所述承載座的厚度,即降低所述承載座在長度和寬度方向上的尺寸,從而降低了所述鏡頭模組的尺寸,以滿足所述鏡頭模組小型化的要求。另外,本發明還在所述承載座上開設所述開槽,並在所述開槽中填充所述膠體,以連接所述第一承載部和所述第二承載部,提高了所述承載座的強度及穩定性,從而提高了所述鏡頭模組的強度及穩定性。同時,由於本發明將所述膠體填充在所述開槽中,無需考慮電子組件避讓以及塑膠成型的問題,從而有利於所述鏡頭模組的小型化以及穩定性。 The bearing seat in the present invention includes a first bearing part and a second bearing part located outside the first bearing part. The second bearing part is the outer wall of the bearing seat. Since the second bearing The material of the carrier part is metal, which has high strength. Compared with the plastic carrier seat in the prior art, the present invention can reduce the thickness of the carrier seat, that is, reduce the size of the carrier seat in the length and width directions, thereby The size of the lens module is reduced to meet the requirement of miniaturization of the lens module. In addition, the present invention also provides the slot on the load-bearing seat, and fills the colloid in the slot to connect the first load-bearing part and the second load-bearing part, thereby improving the load-bearing capacity. The strength and stability of the base are thereby improved, thereby improving the strength and stability of the lens module. At the same time, since the present invention fills the colloid in the slot, there is no need to consider the problems of electronic component avoidance and plastic molding, which is beneficial to the miniaturization and stability of the lens module.

100:鏡頭模組 100: Lens module

10:電路板 10:Circuit board

101:第一硬板部 101:The first hard board department

102:第二硬板部 102: The second hard board department

103:軟板部 103:Soft board department

11:電子組件 11: Electronic components

12:電學連接部 12: Electrical connection part

13:補強板 13: Reinforcement board

20:感光晶片 20: Photosensitive chip

21:導線 21:Wire

30:承載座 30: Bearing seat

301:第一承載部 301: The first bearing part

302:第二承載部 302: The second bearing part

31:通孔 31:Through hole

32:凹槽 32: Groove

33:開槽 33: Grooving

40:膠體 40: Colloid

50:濾光片 50: Filter

60:鏡座 60:Mirror holder

61:容置孔 61: Accommodation hole

70:鏡頭 70: Lens

701:第一透鏡部 701: First lens part

702:第二透鏡部 702: Second lens unit

703:第三透鏡部 703:Third lens part

200:電子裝置 200:Electronic devices

圖1為本發明一實施例提供的鏡頭模組的結構示意圖。 Figure 1 is a schematic structural diagram of a lens module provided by an embodiment of the present invention.

圖2為圖1所示的鏡頭模組的爆炸圖。 Figure 2 is an exploded view of the lens module shown in Figure 1.

圖3為圖1所示的鏡頭模組的部分結構示意圖。 FIG. 3 is a partial structural diagram of the lens module shown in FIG. 1 .

圖4為圖1所示的鏡頭模組的另一角度的爆炸圖。 FIG. 4 is an exploded view of the lens module shown in FIG. 1 from another angle.

圖5為圖1所示的鏡頭模組沿V-V方向的剖面示意圖。 FIG. 5 is a schematic cross-sectional view of the lens module shown in FIG. 1 along the V-V direction.

圖6為本發明一實施例提供的鏡頭模組的電子裝置的立體示意圖。 FIG. 6 is a three-dimensional schematic diagram of the electronic device of the lens module provided by an embodiment of the present invention.

下面將結合本發明實施例中的附圖,對本發明實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅僅為本發明一部分實施例,而不為全部的實施例。基於本發明中的實施例,本領域具有通常知識者在沒有作出創造性勞動前提下所獲得的所有其他實施例,都屬於本發明保護的範圍。 The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those with ordinary skill in the art without making creative efforts shall fall within the scope of protection of the present invention.

需要說明,當組件被稱為“固定於”另一個組件,它可以直接在另一個組件上或者也可以存在居中的組件。當一個組件被認為“連接”另一個組件,它可以為直接連接到另一個組件或者可能同時存在居中組件。當一個組件被認為“設置於”另一個組件,它可以為直接設置在另一個組件上或者可能同時存在居中組件。 It should be noted that when a component is said to be "anchored" to another component, it can be directly on the other component or there can also be an intermediate component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may also be an intervening component present. When a component is said to be "set on" another component, it can be directly set on the other component or there may be a centered component at the same time.

除非另有定義,本文所使用的所有的技術和科學術語與屬於本發明技術領域的具有通常知識者通常理解的含義相同。本文中在本發明的說明書中所使用的術語只為了描述具體的實施例的目的,不旨在於限制本發明。 Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the invention is for the purpose of describing specific embodiments only and is not intended to limit the invention.

為能進一步闡述本發明達成預定目的所採取的技術手段及功效,以下結合附圖及較佳實施方式,對本發明作出如下詳細說明。 In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose, the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.

請參閱圖1和圖2,本發明一實施例提供一種鏡頭模組100,所述鏡頭模組100包括電路板10、感光晶片20、承載座30、膠體40、濾光片50、鏡座60以及鏡頭70。 Please refer to Figures 1 and 2. An embodiment of the present invention provides a lens module 100. The lens module 100 includes a circuit board 10, a photosensitive chip 20, a bearing 30, a colloid 40, a filter 50, and a lens holder 60. and lens 70.

在本實施例中,所述電路板10為軟板、硬板或軟硬結合板。優選地,所述電路板10為軟硬結合板,包括第一硬板部101、第二硬板部102以及位於所述第一硬板部101與所述第二硬板部102之間的軟板部103。 In this embodiment, the circuit board 10 is a soft board, a hard board, or a combination of soft and hard boards. Preferably, the circuit board 10 is a soft-hard board, including a first hard board part 101, a second hard board part 102, and a circuit board located between the first hard board part 101 and the second hard board part 102. Soft board part 103.

請一併參閱圖3和圖4,所述第一硬板部101的其中一表面上安裝有多個電子組件11。其中,所述電子組件11可以為電阻、電容、二極管、三極管、繼電器、帶電可擦可編程只讀存儲器(EEPROM)等被動組件。所述第二硬板部102的其中一表面安裝有電學連接部12,且所述電學連接部12與所述電子組件11位於所述電路板10的同一表面。所述電學連接部12用於實現所述鏡頭模組100與電子裝置(圖未示)之間的信號傳輸。所述電學連接部12可以為連接器或者金手指。所述第二硬板部102的另一表面安裝有補強板13。其中,所述補強板13的材質為金屬(如:不銹鋼)。所述補強板13用於增強所述第二硬板部102的機械強度,以增強所述電路板10的機械強度。 Please refer to FIGS. 3 and 4 together. A plurality of electronic components 11 are mounted on one surface of the first hard board part 101 . The electronic components 11 may be passive components such as resistors, capacitors, diodes, transistors, relays, and electrically erasable programmable read-only memory (EEPROM). An electrical connection part 12 is mounted on one surface of the second hard board part 102 , and the electrical connection part 12 and the electronic component 11 are located on the same surface of the circuit board 10 . The electrical connection part 12 is used to realize signal transmission between the lens module 100 and an electronic device (not shown). The electrical connection part 12 may be a connector or a gold finger. A reinforcing plate 13 is installed on the other surface of the second hard plate portion 102 . Wherein, the reinforcing plate 13 is made of metal (such as stainless steel). The reinforcing plate 13 is used to enhance the mechanical strength of the second hard plate portion 102 to enhance the mechanical strength of the circuit board 10 .

所述感光晶片20位於所述電路板10具有所述電子組件11的表面。其中,所述感光晶片20藉由導線21(參圖5)與所述電子組件11電性連接,以使所述感光晶片20與所述電路板10電性連接。 The photosensitive chip 20 is located on the surface of the circuit board 10 with the electronic component 11 . The photosensitive chip 20 is electrically connected to the electronic component 11 through wires 21 (see FIG. 5 ), so that the photosensitive chip 20 is electrically connected to the circuit board 10 .

所述承載座30位於所述電路板10的所述第一硬板部101的其中一表面上,且與所述感光晶片20、所述電子組件11以及所述電學連接部12位於所述電路板10的同一表面。在本實施例中,所述承載座30大致為中空矩形結構。 所述承載座30中開設有通孔31,且所述通孔31貫穿所述承載座30。所述承載座30遠離所述電路板10的表面在臨近所述通孔31的區域向內凹陷形成凹槽32。 The carrier 30 is located on one surface of the first hard plate portion 101 of the circuit board 10 and is located on the circuit with the photosensitive chip 20 , the electronic component 11 and the electrical connection portion 12 . the same surface of plate 10. In this embodiment, the bearing base 30 is generally a hollow rectangular structure. A through hole 31 is opened in the bearing base 30 , and the through hole 31 penetrates the bearing base 30 . The surface of the bearing base 30 away from the circuit board 10 is recessed inward to form a groove 32 in an area adjacent to the through hole 31 .

請參閱圖3和圖5,所述承載座30包括第一承載部301以及位於所述第一承載部301外側的第二承載部302。即所述第二承載部302為所述承載座30的外側壁,所述第一承載部301內嵌於所述第二承載部302中。其中,所述第一承載部301的材質為塑膠,所述第二承載部302的材質為金屬。具體地,所述第二承載部302的材質可為不銹鋼。所述承載座30中設有開槽33,且所述開槽33貫穿所述第一承載部301以及所述第二承載部302。如圖2所示,僅僅示出了四個開槽33,且其中兩個所述開槽33和另外兩個所述開槽33相對。其中,所述開槽33的數量和位置可根據需要進行變更。 Referring to FIGS. 3 and 5 , the bearing seat 30 includes a first bearing part 301 and a second bearing part 302 located outside the first bearing part 301 . That is, the second bearing part 302 is the outer wall of the bearing seat 30 , and the first bearing part 301 is embedded in the second bearing part 302 . The material of the first carrying part 301 is plastic, and the material of the second carrying part 302 is metal. Specifically, the second bearing part 302 may be made of stainless steel. A slot 33 is provided in the bearing seat 30 , and the slot 33 penetrates the first bearing part 301 and the second bearing part 302 . As shown in FIG. 2 , only four slots 33 are shown, and two of the slots 33 are opposite to the other two slots 33 . The number and position of the slots 33 can be changed as needed.

所述膠體40位於所述開槽33中,以連接所述第一承載部301以及所述第二承載部302,從而提高所述第一承載部301和所述第二承載部302之間的結合力,從而提高所述承載座30的強度及穩定性。可以理解,所述膠體40的數量和所述開槽33的數量相等。在本實施例中,所述膠體40的數量為四個。 The colloid 40 is located in the slot 33 to connect the first bearing part 301 and the second bearing part 302 , thereby improving the distance between the first bearing part 301 and the second bearing part 302 . The binding force thereby improves the strength and stability of the bearing base 30 . It can be understood that the number of colloids 40 is equal to the number of slots 33 . In this embodiment, the number of colloids 40 is four.

所述濾光片50位於所述承載座30的所述凹槽32中,且與所述感光晶片20相隔設置。在本實施例中,所述濾光片50為矩形。 The optical filter 50 is located in the groove 32 of the carrier 30 and is spaced apart from the photosensitive wafer 20 . In this embodiment, the optical filter 50 is rectangular.

所述鏡座60安裝在所述承載座30遠離所述電路板10的表面上。在本實施例中,所述鏡座60大致為矩形結構。其中,所述鏡座60中開設有容置孔61,且所述容置孔61貫穿所述鏡座60。所述鏡座60的材質為金屬或塑膠。優選地,所述鏡座60的材質為塑膠。 The mirror base 60 is installed on the surface of the carrying base 30 away from the circuit board 10 . In this embodiment, the lens holder 60 has a substantially rectangular structure. Wherein, an accommodating hole 61 is opened in the mirror holder 60 , and the accommodating hole 61 penetrates the mirror holder 60 . The lens holder 60 is made of metal or plastic. Preferably, the lens base 60 is made of plastic.

請再次參閱圖5,在本實施例中,所述鏡頭70部分收容於所述鏡座60的所述容置孔61中。所述鏡頭70與所述鏡座60為組裝成型或一體成型。在本實施例中,所述鏡頭70與所述鏡座60為一體成型。所述鏡頭70包括依次連接的第一透鏡部701、第二透鏡部702以及第三透鏡部703。其中,所述第一透鏡部701的直徑、所述第二透鏡部702的直徑以及所述第三透鏡部703的直徑 依次增大。所述鏡頭70為組裝成型(即,所述第一透鏡部701、所述第二透鏡部702和所述第三透鏡部703相互組裝的方式)或一體成型。優選地,所述第一透鏡部701、所述第二透鏡部702和所述第三透鏡部703藉由一體成型形成所述鏡頭70。在本實施例中,所述第一透鏡部701和所述第二透鏡部702均完全位於所述容置孔61外,所述第三透鏡部703的其中一部分位於所述容置孔61外,另一部分收容於所述容置孔61中。 Please refer to FIG. 5 again. In this embodiment, the lens 70 is partially received in the accommodating hole 61 of the lens holder 60 . The lens 70 and the lens holder 60 are assembled or integrally formed. In this embodiment, the lens 70 and the lens holder 60 are integrally formed. The lens 70 includes a first lens part 701, a second lens part 702, and a third lens part 703 connected in sequence. Wherein, the diameter of the first lens part 701 , the diameter of the second lens part 702 and the diameter of the third lens part 703 increase in sequence. The lens 70 is assembled (that is, the first lens part 701 , the second lens part 702 and the third lens part 703 are assembled with each other) or integrally molded. Preferably, the first lens part 701 , the second lens part 702 and the third lens part 703 form the lens 70 by integral molding. In this embodiment, the first lens part 701 and the second lens part 702 are completely located outside the accommodating hole 61 , and a part of the third lens part 703 is located outside the accommodating hole 61 , and the other part is received in the receiving hole 61 .

請參閱圖6,本發明還提供一種電子裝置200,包括所述鏡頭模組100。其中,所述電子裝置200可為手機、可穿戴設備、電腦設備、交通工具以及監控裝置等。在本實施例中,所述電子裝置200為手機。 Referring to FIG. 6 , the present invention also provides an electronic device 200 including the lens module 100 . The electronic device 200 may be a mobile phone, a wearable device, a computer device, a vehicle, a monitoring device, etc. In this embodiment, the electronic device 200 is a mobile phone.

本發明中的所述承載座30包括第一承載部301以及位於所述第一承載部301外側的第二承載部302,所述第二承載部302為所述承載座30的外側壁,由於所述第二承載部302的材質為金屬,具有較高的強度,相比現有技術中的塑膠承載座,本發明能夠降低所述承載座30的厚度,即降低所述承載座30在長度和寬度方向上的尺寸,從而降低了所述鏡頭模組100的尺寸,以滿足所述鏡頭模組100小型化的要求。 The bearing seat 30 in the present invention includes a first bearing part 301 and a second bearing part 302 located outside the first bearing part 301. The second bearing part 302 is the outer wall of the bearing seat 30. Since The second bearing part 302 is made of metal and has high strength. Compared with the plastic bearing seat in the prior art, the present invention can reduce the thickness of the bearing seat 30, that is, the length and length of the bearing seat 30 can be reduced. The size in the width direction thereby reduces the size of the lens module 100 to meet the requirement of miniaturization of the lens module 100 .

另外,本發明還在所述承載座30上開設所述開槽33,並在所述開槽33中填充所述膠體40,以連接所述第一承載部301和所述第二承載部302,提高了所述承載座30的強度及穩定性,從而提高了所述鏡頭模組100的強度及穩定性。同時,由於本發明將所述膠體40填充在所述開槽33中,無需考慮電子組件避讓以及塑膠成型的問題,從而有利於所述鏡頭模組100的小型化以及穩定性。 In addition, the present invention also provides the slot 33 on the bearing base 30 and fills the colloid 40 in the slot 33 to connect the first bearing part 301 and the second bearing part 302 , improving the strength and stability of the bearing base 30, thereby improving the strength and stability of the lens module 100. At the same time, since the colloid 40 is filled in the slot 33 in the present invention, there is no need to consider the problems of electronic component avoidance and plastic molding, which is beneficial to the miniaturization and stability of the lens module 100 .

以上說明僅僅為對該發明一種優化的具體實施方式,但在實際的應用過程中不能僅僅局限於這種實施方式。對本領域具有通常知識者來說,根據本發明的技術構思做出的其他變形和改變,都應該屬於本發明的保護範圍。 The above description is only an optimized specific implementation of the invention, but the actual application process cannot be limited to this implementation. For those with ordinary knowledge in the art, other modifications and changes made based on the technical concept of the present invention should fall within the protection scope of the present invention.

100:鏡頭模組 100: Lens module

10:電路板 10:Circuit board

11:電子組件 11: Electronic components

20:感光晶片 20: Photosensitive chip

21:導線 21:Wire

301:第一承載部 301: The first bearing part

302:第二承載部 302: The second bearing part

40:膠體 40: Colloid

50:濾光片 50: Filter

701:第一透鏡部 701: First lens part

702:第二透鏡部 702: Second lens unit

703:第三透鏡部 703:Third lens part

Claims (9)

一種鏡頭模組,包括承載座,其改良在於,所述承載座包括第一承載部以及位於所述第一承載部外側的第二承載部,所述第一承載部內嵌於所述第二承載部中,所述第一承載部的材質為塑膠,所述第二承載部的材質為金屬,所述承載座中設有開槽,所述開槽貫穿所述第一承載部以及所述第二承載部,所述鏡頭模組還包括膠體,所述膠體位於所述開槽中以連接所述第一承載部以及所述第二承載部。 A lens module includes a bearing base, the improvement of which is that the bearing base includes a first bearing part and a second bearing part located outside the first bearing part, and the first bearing part is embedded in the second bearing part. In the bearing part, the first bearing part is made of plastic, and the second bearing part is made of metal. A slot is provided in the bearing seat, and the slot penetrates the first bearing part and the The second carrying part, the lens module further includes a colloid, the colloid is located in the slot to connect the first carrying part and the second carrying part. 如請求項1所述的鏡頭模組,其中,所述鏡頭模組還包括電路板,所述電路板上設有電子組件,所述承載座位於所述電路板具有所述電子組件的表面。 The lens module according to claim 1, wherein the lens module further includes a circuit board, the circuit board is provided with electronic components, and the bearing seat is located on the surface of the circuit board with the electronic components. 如請求項2所述的鏡頭模組,其中,所述電路板為軟硬結合板,包括第一硬板部、第二硬板部以及位於所述第一硬板部與所述第二硬板部之間的軟板部,所述第二硬板部的其中一表面安裝有電學連接部,所述第二硬板部的另一表面安裝有補強板。 The lens module according to claim 2, wherein the circuit board is a combination of soft and hard boards, including a first hard board part, a second hard board part, and a first hard board part and a second hard board part located between the first hard board part and the second hard board part. In the soft board part between the board parts, an electrical connection part is installed on one surface of the second hard board part, and a reinforcing plate is installed on the other surface of the second hard board part. 如請求項3所述的鏡頭模組,其中,所述鏡頭模組還包括感光晶片,所述感光晶片位於所述電路板具有所述電子組件的表面。 The lens module according to claim 3, wherein the lens module further includes a photosensitive chip, and the photosensitive chip is located on the surface of the circuit board with the electronic component. 如請求項4所述的鏡頭模組,其中,所述鏡頭模組還包括濾光片,所述承載座遠離所述電路板的表面凹陷形成凹槽,所述濾光片固定於所述凹槽中,所述濾光片和所述感光晶片相對。 The lens module according to claim 4, wherein the lens module further includes an optical filter, the surface of the bearing seat away from the circuit board is recessed to form a groove, and the optical filter is fixed in the recess. In the groove, the optical filter and the photosensitive wafer are opposite to each other. 如請求項2所述的鏡頭模組,其中,所述鏡頭模組還包括鏡座以及鏡頭,所述鏡座安裝在所述承載座遠離所述電路板的表面上,所述鏡頭安裝於所述鏡座中。 The lens module according to claim 2, wherein the lens module further includes a lens holder and a lens, the lens holder is installed on the surface of the bearing seat away from the circuit board, and the lens is installed on the In the mirror holder. 如請求項6所述的鏡頭模組,其中,所述鏡座為矩形結構,所述鏡座中開設有容置孔,所述鏡頭部分收容於所述容置孔中。 The lens module according to claim 6, wherein the lens holder has a rectangular structure, a receiving hole is opened in the lens holder, and the lens part is received in the accommodating hole. 如請求項1所述的鏡頭模組,其中,所述第二承載部的材質為不銹鋼。 The lens module according to claim 1, wherein the second bearing part is made of stainless steel. 一種電子裝置,其改良在於,包括如請求項1至8中任一項所述的鏡頭模組。 An electronic device, improved in that it includes the lens module according to any one of claims 1 to 8.
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US10812641B2 (en) * 2018-04-26 2020-10-20 Guangdong Oppo Mobile Telecommunications Corp., Ltd Terminal display assembly and mobile terminal
TW202033986A (en) * 2019-03-05 2020-09-16 大陸商三贏科技(深圳)有限公司 Lens module and electronic device

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